Chip EMIFIL®Chip 3-terminal Capacitor for Large Current for General NFM41PC155B1H3_ (1806, 1.5uF, DC50V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor for Large Current used for General Electronic equipment. 2.MURATA Part NO. System (Ex.) NFM 41 (1)L/W Dimensions PC (2)Features 155 (3)Nominal Capacitance B 1H (4) Characteristics (5)DC Rated Voltage 3 (6)Electrode L (7)Packaging Code 3. Type & Dimensions a)Equivalent Circuit (1)-1 L (1)-2 W i j 4.5±0.3 1.6±0.3 1.5±0.3 0.3+0.3/-0.2 T e 1.0±0.2 0.4±0.3 (Unit:mm) g 0.7 min. 4.Rated value (3) Nominal Capacitance Capacitance Tolerance 1.5 uF ±20 % (5) DC Rated Voltage Rated Current (mA) DC Resistance DC 50 V 6A(DC) 9mΩmax. 100MΩmin. Insulation Resistance Specifications and Test Methods (Operating /Storage Temp. Range) -55 to 85 °C / -55 to 85 °C 5.Package mark (7) Packaging Packaging Unit L f180mm Reel EMBOSSED W12P4 4000 pcs./Reel Product specifications in this catalog are as of Feb.9,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. NFM41PC155B1H3-01 1 ■SPECIFICATIONS AND TEST METHODS Electrical Performance No Item 1 Capacitance (Cap.) Specification Shown in Rated value. Test Method Frequency : 1.0±0.1KHz Voltage : 1±0.2V(rms) 2 Insulation Resistance(I.R.) Voltage : Rated Voltage Time : 2 minutes max. 3 DC Resistance (Rdc1,2) Measured with 100mA max. Rdc1 : between signal terminals Rdc2 : between ground terminals Rdc2 Rdc1 Rdc1 Rdc2 4 Withstanding Voltage Products shall not be damaged. Test Voltage : Rated voltage x 250% Time : 1 to 5 s Charge Current : 50 mA max. 5 Operating Temperature 6 Storage Temperature Shown in Rated value. Includes self-heating Standard Testing Condition < Unless otherwise specified > Temperature : Ordinary Temp. / 15 °C to 35 °C Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) JEMCPS-02221C 2 < In case of doubt > Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa ■SPECIFICATIONS AND TEST METHODS Mechanical Performance No Item 1 Appearance and Dimensions Specification Appearance:No defects or abnormalities. Dimensions:Within the specified dimensions. Test Method Appearance:Visual inspection. Dimensions:Using calipers. 2 Solderability Electrodes shall be at least 95% covered with new solder coating. Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3°C Immersion Time : 3±1 s Immersion and emersion rates : 25mm / s 3 Resistance to soldering heat Meet Table 1. Table 1 Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 10 ± 1 s Immersion and emersion rates : 25mm / s Initial values : measured after heat treatment (150+0/-10 °C,1hour) and exposure in the room condition for 24±2 hours. Then measured after exposure in the room condition for 24±2 hours. Appearance Cap. Change I.R. Rdc Change 4 Bending Strength Rdc1 Rdc2 No damaged Within ±7.5% Meet the initial rated value. Within ±20% Within ±40% Meet Table 2. Table 2 Appearance Cap. Change Rdc Rdc1 Change Rdc2 It shall be soldered on the glass-epoxy substrate(t = 1.0mm). Deflection : 2 mm Keeping Time : 30 s Pressure jig No damaged Within ±12.5% Within ±20% Within ±40% R340 F Deflection 45 45 Product 5 Drop Products shall be no failure after tested. It shall be dropped on concrete or steel board. Method : Free fall Height : 1m The Number of Time : Total 10 times 6 Bonding Strength The electrodes shall be no failure after tested. It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8 N Applying Time : 30 s (in mm) 1.0 1.2 1.0 7 Vibration Meet Table 3. Table 3 Appearance Cap. Rdc Change JEMCPS-02221C Rdc1 Rdc2 No damaged Meet the initial rated value. Within ±20% Within ±40% 3 1.6 (in mm) It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude : 1.5 mm or Acceleration amplitude 196m/s² whichever is smaller. Time: 4 hours of the 3 directions for each. Initial values :measured after heat treatment (150+0 / -10 °C,1hour）and exposure in the room condition for 24±2hours. ■SPECIFICATIONS AND TEST METHODS Environment Performance It shall be soldered on the glass-epoxy substrate. No Item Specification 1 Temperature Cycling Meet Table 4. Table 4 Appearance Cap. Change I.R. Rdc Rdc1 Change Rdc2 Test Method 1 Cycle 1 step : -55+0/-3℃ / 30+3/-0 min 2 step : Room Temperature / within 3 min 3 step : +85+3/-0℃ / 30+3/-0 min 4 step : Room Temperature / within 3 min Total of 10 cycles Initial values : measured after heat treatment(150+0/-10° C,1hour) and exposure in the room condition for 24±2 hours. Then measured after exposure in the room condition for 24±2 hours. No damaged Within ±12.5% 30Mmin Within ±20% Within ±40% 2 Humidity 3 Humidity Life Temperature : 70±2°C Humidity : 90 to 95%(RH) Time : 1000+48/-0 hours Then measured after exposure in the room condition for 24±2 hours. Meet Table 5. Table 5 Appearance Cap. Change I.R. Rdc Rdc1 Change Rdc2 Temperature : 70±2°C Humidity : 90 to 95%(RH) Time : 500+24/-0 hours Test Voltage : Rated Voltage Test Current : Rated Current Then measured after exposure in the room condition for 24±2 hours. No damaged Within ±12.5% 15Mmin Within ±20% Within ±40% 4 Heat life Meet Table 4. Temperature : -85±2°C Time : 1000+48/-0 hours Test Voltage : Rated Voltagex200% Test Current : Rated Current Change Current : 50ｍA Initial values : measured after voltage treatment(85±2° C,Rated Voltagex200%,1hour) and exposure in the room condition for 24±2 hours. Then measured after exposure in the room condition for 24±2 hours. 5 Cold Resistance Meet Table 5. Temperature : -55±2°C Time : 500+24/-0 hours Then measured after exposure in the room condition for 24±2 hours. JEMCPS-02221C 4 1. Appearance and Dimensions (12mm-wide plastic tape) 4.0±0.1 f 1.5± 0.1 0 Embossed Cavity 0.3±0.05 12.0±0.3 4.8±0.1 5.5±0.05 Sprocket Hole 1.75±0.1 PACKAGING NFM41 Type Dimension of the Cavity is measured at the bottom side. (in mm) 4.0±0.1 1.8±0.1 2.0±0.05 1.10±0.1 Direction of feed 2. Specification of Taping (1) Packing quantity (standard quantity) 4000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of plastic tape and sealed cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4)Cover tape Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous. The specified quantity per reel is kept. 3. Pull Strength of Plastic Tape and Cover Tape Plastic Tape Cover Tape 5N min. 10N min. 4. Peeling off force of cover tape 0.2N to 0.7N (minimum value is typical) Speed of Peeling off : 300 mm / min 165 to 180 degree F Cover tape Plastic tape 5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Leader Trailer 160 min. 190 min. Label Empty tape 210 min. Cover tape f 13.0±0.2 1 f 60± 0 f 21.0±0.8 13± 10 Direction of feed 17±1.4 (in mm) 0 f 180± 3 JEMCPP-02234A 5 ! Caution 1. Mounting density Add special attention to radiating heat of products when mounting this product near the products with heating. The excessive heat by other products may cause deterioration of insulation resistance and excessive heat at this product, resulting in a fire. 2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above JEMCPC-02256A 6 Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 1. Flux and Solder Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Other flux (except above) Please contact us for details, then use. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. 2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] a Products shall be located in the sideways direction (Length:a<b) to the mechanical stress. b 〈Poor example〉 〈Good example〉 (2) Products location on P.C.B. near seam for separation. b A C B Seam Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Length:a b Because they may be subjected the mechanical stress in order of A>C>B≒D. D Slit a 4. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. 1.5 3.5 5.5 1.0 2.6 0.6 5. Reflow Soldering • Standard printing pattern of solder paste. 1) Soldering paste printing for reflow • Standard thickness of solder paste: 100µm to 200µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile JEMCPC-02256A Limit Profile Pre-heating 150°C ~ 180°C , 90s ± 30s Heating above 220°C , 30s ~ 60s above 230°C , 60s max. Peak temperature 245°C ± 3°C 260°C , 10s Cycle of reflow 2 times 2 times 7 (in mm) Notice 6. Flow Soldering 1).Printing of Adhesive Adhesive amount shall be about 0.10mg per chip to obtain enough adhesive strength. The adhesive position is as follows. Adhesive Position of adhesive 2).Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (°C) 265°C±3°C 250°C Limit Profile 150 Heating Time Standard Profile Time.(s) 60s min. Standard Profile Pre-heating Limit Profile 150°C, 60s min. Heating 250°C, 4s ~ 6s 265°C ± 3°C, 5s max. Cycle of reflow 2 times 2 times 7. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. ・Pre-heating : 150°C, 1 minute ・Soldering iron output : 30W max. ・Tip temperature : 350°C max. ・Tip diameter : φ3mm max. ・Soldering time : 3(+1,-0) s ・Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 8. Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Upper Limit Recommendable Recommendable t 1/3T t T(T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA)) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. JEMCPC-02256A 8 Notice 10. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 11. Resin coating The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 12. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 13. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. < Standard land dimensions for reflow > •Side on which chips are mounted < Standard land dimensions for flow > •Side on which chips are mounted 3.0 2.6 1.2 0.6 2.6 Small diameter thru hole f 0.4 3.0 0.6 1.2 Small diameter thru hole f 0.4 1.5 1.5 2.0 Resist 3.5 Copper foil pattern 3.5 6.0 No pattern 6.0 2.0 14. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition ・Products should be stored in the warehouse on the following conditions. Temperature: -10 to +40°C Humidity: 15 to 85% relative humidity No rapid change on temperature and humidity ・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. JEMCPC-02256A 9 ! NOTE (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. Therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. JEMCPC-02256A 10