Chip EMIFIL®Chip 3-terminal Capacitor for Automotive NFM21HC471R1H3_ (0805, 470pF, DC50V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor used for Automotive Electronic equipment. 2.MURATA Part NO. System (Ex.) NFM 21 (1)L/W Dimensions HC (2)Features 471 R (3)Nominal Capacitance 1H (4)Temperature (5)DC Rated Characteristics Voltage 3 (6)Electrode D (7)Packaging Code 3. Type & Dimensions a)Equivalent Circuit (1)-1 L (1)-2 W i j 2.0±0.2 1.25±0.1 0.6±0.2 0.2+0.2/-0.1 T e 0.85±0.1 0.3±0.2 (Unit:mm) g 0.2 min. 4.Rated value (3) Nominal Capacitance Capacitance Tolerance 470 pF ±20 % (5) DC Rated Voltage Rated Current (mA) DC 50 V 1A(DC) DC Resistance Insulation Resistance 300mΩmax.1000MΩmin. Specifications and Test Methods (Operating /Storage Temp. Range) -55 to 125 °C / -55 to 125 °C 5.Package mark (7) Packaging Packaging Unit D f180mm Reel PAPER W8P4 4000 pcs./Reel Product specifications in this catalog are as of Mar.3,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. NFM21HC471R1H3-01 1 ■AEC-Q200 Murata Standard Specification and Test Methods Electrical Performance No Item 1 Capacitance (Cap.) Specification Shown in Rated value. Test Method Frequency 22 to 100pF : 1±0.1MHz 220pF to 1uF : 1±0.1kHz Voltage : 1±0.2V(rms) 2 Insulation Resistance(I.R.) Voltage : Rated Voltage Time : 2 minutes max. 3 DC Resistance (Rdc1,2) Measured with 100mA max. Rdc1 : between signal terminals Rdc2 : between ground terminals Rdc2 Rdc1 Rdc1 Rdc2 4 Withstanding Voltage Products shall not be damaged. Test Voltage : Rated Voltage X 300% Time : 1 to 5 s Charge Current : 50 mA max. 5 Operating Temperature 6 Storage Temperature Shown in Rated value. Includes self-heating Standard Testing Condition < Unless otherwise specified > Temperature : Ordinary Temp. / 15 °C to 35 °C Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) JEMCPS-03093 2 < In case of doubt > Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa ■AEC-Q200 Murata Standard Specification and Test Methods Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors) AEC-Q200 Rev.C issued June 17. 2005 AEC-Q200 No. Stress Test Method 3 High Temperature Unpowered Exposure 1000 hours @ T=150C (Ceramics) Measurement at 24+/-2 hours after test 4 Temperature Cycling 1000cycles (-55C to +125C) Measurement at 24+/-2 hours after test 6 Moisture Resistance t=24 hours/cycle. Note: Steps 7a & 7b not required. Unpowered. 7 Biased Humidity 1000hours 85C/85%RH. Note: Ceramics only Specified conditions: Rated Voltage and 1.3 to 1.5 volts. Add 100Kohm resister. Tantalums-Rated Voltage only. Measurement at 24+/-2 hours after test 8 Operational Life Condition D Steady State TA=125C Full rated ceramic caps Measurement at 24+/-2 hours after test conclusion. 9 External Visual Visual inspection 10 Physical Dimension Within the specified dimensions. 12 Resistance to Solvents Per MIL-STD-202 Method 215 13 Mechanical Shock Figure 1 of Method 213. SMD:Condition F Leaded:Condition C 14 Vibration 5g's for 20 minutes, 12cycles each of 3 oritentations Use 8"X5" PCB, .031"thick. 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000Hz. 15 Resistance to Note: Condition B No pre-heat of samples. Soldering Heat Note:Single Wave Solder-Procedure 2 for SMD. Procedure 1 for Leaded with solder within 1.5mm of device body. 16 Thermal Shock 17 ESD 18 Solderability -55C/+125C Note: Number of cycles required-300, Maximum transfer time-20 s, Dwell time-15 minuites. Air-Air. Per AEC-Q200-002 Per J-STD-002 Summary to show Min, Max, Mean and 19 Electrical Characterization Standard deviation at room as well as Min and Max operating temperatures. JEMCPS-03093 3 Pressure jig R340 F Deflection 45 Murata Specification / Deviation Meet Table D after testing. Meet Table A after testing. Meet Table D after testing. Meet Table D after testing. Meet Table D after testing. No abnormalities No defects Not Applicable Meet Table C after testing. Meet Table C after testing. Meet Table A after testing. Deviation for AEC-Q200; Testing condition Flux: Ethanol solution of rosin, 25(wt)% Pre-heating: 150C+/-10C, 60 to 90s Solder: Sn-3.0Ag-0.5Cu Solder Temperature: 270C+/-5C Immesion Time: 10s+/-1s Immesion and emersion rates: 25mm/s Then measured after exposure in the room Meet Table A after testing. Component Classification:Meet Table E 95% of the terminations is to be soldered. Method B : Not Applicable Deviation for AEC-Q200; Shown in Rated value. 45 Product ■AEC-Q200 Murata Standard Specification and Test Methods Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors) AEC-Q200 Rev.C issued June 17. 2005 AEC-Q200 No. Stress Test Method 21 Board Flex Appendix 2. Note:2mm(min) for all except 3mm for class 1. Murata Specification / Deviation Meet Table B after testing. Deviation for AEC-Q200; It shall be soldered on the Glass-epoxy substrate (t = 1mm). • Deflection : 2mm • Keeping Time : 30s Pressure jig R230 F Deflection 45 22 Terminal Strength Per AEC-Q200-006 A force of 1.8 kg for 60 s 45 Product The electrode should show no failure after testing. Deviation for AEC-Q200; It shall be soldered on the substrate. • Applying Force : 17.6N • Applying Time : 60s 1.0 0.8 0.6 23 Beam Load Test Per AEC-Q200-003 1.6 The chip endure 20N. Deviation for AEC-Q200 Place the capacitor in the beam load fixture as below figure. Pressure Jig: R0.5 Iron Board Speed supplied the Stress Load: 0.5mm/s. JEMCPS-03093 4 ■AEC-Q200 Murata Standard Specification and Test Methods Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors) AEC-Q200 Rev.C issued June 17. 2005 Table A Appearance Capacitance Change I.R. DC Resistance(Rdc1,2) Tabe B Appearance Capacitance Change DC Resistance(Rdc1,2) Table C Appearance Capacitance DC Resistance(Rdc1,2) Table D Appearance Capacitance Change I.R. DC Resistance(Rdc1,2) No damage Within +/-7.5% at 20C 1000MΩ min. (22pF-470000pF) 500MΩ min. (1000000pF) 0.5Ω max (22pF-2200pF) 0.05Ω max (22000pF-1000000pF) No damage Within +/-12.5% at 20C 0.5Ωmax (22pF-2200pF) 0.05Ω max (22000pF-1000000pF) No damage Meet initial value (Shown in Rated value.) 0.5Ωmax (22pF-2200pF) 0.05Ω max (22000pF-1000000pF) No damage Within +/-12.5% at 20C 1000MΩ min. (22pF-470000pF) 500M Ω min. (1000000pF) 0.5Ωmax (22pF-2200pF) 0.05Ω max (22000pF-1000000pF) Table E Murata PN NFM21HC220U1H3D NFM21HC470U1H3D NFM21HC101U1H3D NFM21HC221R1H3D NFM21HC471R1H3D NFM21HC102R1H3D NFM21HC222R1H3D NFM21HC223R1H3D NFM21HC104R1A3D NFM21HC224R1A3D NFM21HC474R1A3D NFM21HC105R1C3D JEMCPS-03093 DC Resistance (Rdc 1,2) Value After Testing (ohm) max. 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.05 0.05 0.05 0.05 0.05 5 ESD Component Classification 1C: 1kV(DC) to＜2kV(DC) 1C 1C 1C 1C 1C 1C 1C 1C 1C 1C 1C 1C PACKAGING NFM21 Type 1. Appearance and Dimensions (8mm-wide paper tape) (in mm) 2. Specification of Taping (1) Packing quantity (standard quantity) 4000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Base tape and Top tape The base tape and top tape have no spliced point. (5) Cavity There shall not be burr in the cavity. (6) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 3. Pull Strength of Top Tape and Bottom Tape 5N min. 4. Peeling off force of top tape 0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min Top tape 165 to 180 degree F Bottom tape Base tape 5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. Leader Trailer 2.0±0.5 160 min. Label 190 min. 210 min. Empty tape Top tape f 13.0±0.2 1 f 60± 0 f 21.0±0.8 9± 10 Direction of feed 13±1.4 (in mm) 0 f 180± 3 JEMCPP-02232A 6 ! Caution 1.Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where dust rises. 2. Caution (Rating) Do not use products beyond the Operating Temperature Range, Rated Voltage and Rated Current. 3. Attention regarding product's lay out < Attention regarding the heat generated by other products > Please provide special attention when mounting products in close proximity to other products that radiate heat. 4. Attention regarding chip mounting An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. Please set the suction nozzle's bottom dead point on the upper surface of the board, after the board is adjusted flat. The chip received force (static loading) from the suction nozzle's should be 1N to 3N. 5. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. JEMCPC-02249A 7 ! Caution 6. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] a Products shall be located in the sideways direction (Length:a<b) to the mechanical stress. b 〈Poor example〉 〈Good example〉 (2) Products location on P.C.B. near seam for separation. Seam b Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A >C >B≒D. C B D A Slit Length:a b a 7. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. 1.9 0.8 0.6 8. Reflow Soldering • Standard printing pattern of solder paste. 1) Soldering paste printing for reflow • Standard thickness of solder paste: 100µm to 150µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. 0.6 (in mm) 1.4 2) Soldering Conditions 2.6 Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. 260°C (°C) 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C ~ 180°C , 90s ± 30s Heating above 220°C , 30s ~ 60s above 230°C , 60s max. Peak temperature 245°C ± 3°C 260°C , 10s Cycle of reflow 2 times 2 times 9. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. • Pre-heating : 150°C, 1 min • Soldering iron output : 30W max. • Tip temperature : 350°C max. • Tip diameter : φ3mm max. • Soldering time : 3(+1,-0) s • Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. JEMCPC-02249A 8 ! Caution 10. Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Upper Limit Recommendable Recommendable t 1/3T t T(T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 11.Resin coating The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 12. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or partial dispersion when the product is used. 13.Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 14.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above JEMCPC-02249A 9 Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 1. Flux and Solder Flux Solder Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Other flux (except above) Please contact us for details, then use. Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. 2. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA)) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 3. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. 2.3 1.9 0.6 diameter thru hole f 0.4 0.8 < Standard land dimensions for reflow > ･Side on which chips are mounted Small 0.6 Resist 1.4 Copper foil pattern 2.6 No pattern 4.Storage and Delivery condition (in mm) (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition ・Products should be stored in the warehouse on the following conditions. Temperature: -10 to +40°C Humidity: 15 to 85% relative humidity No rapid change on temperature and humidity ・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. JEMCPC-02249A 10 ! NOTE (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. Therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. JEMCPC-02249A 11