Vishay G2SB2-E3/45 Glass passivated single-phase bridge rectifier Datasheet

G2SB20, G2SB60, G2SB80
www.vishay.com
Vishay General Semiconductor
Glass Passivated Single-Phase Bridge Rectifier
FEATURES
• UL recognition file number E54214
• Ideal for printed circuit boards
• High surge current capability
• Typical IR less than 0.1 μA
~
~
• High case dielectric strength
~
~
• Solder dip 275 °C max. 10 s, per JESD 22-B106
Case Type GBL
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
General purpose use in AC/DC bridge full wave rectification
for monitor, TV, printer, SMPS, adapter, audio equipment,
and home appliances application.
PRIMARY CHARACTERISTICS
Package
GBL
IF(AV)
1.5 A
VRRM
200 V, 600 V, 800 V
IFSM
80 A
IR
5 μA
VF at IF = 0.75 V
1.0 V
TJ max.
150 °C
Diode variations
In-Line
MECHANICAL DATA
Case: GBL
Molding compound meets UL 94 V-0 flammability rating
Base P/N-E3 - RoHS-compliant, commercial grade
Terminals: Matte tin plated leads, solderable
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 1A whisker test
per
Polarity: As marked on body
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
G2SB20
G2SB60
G2SB80
UNIT
Maximum repetitive peak reverse voltage
VRRM
200
600
800
V
Maximum RMS voltage
VRMS
140
420
560
V
Maximum DC blocking voltage
VDC
200
600
800
V
Maximum average forward rectified output current
at TA = 25 °C
IF(AV)
1.5
A
Peak forward surge current single sine-wave
superimposed on rated load
IFSM
80
A
I2t
27
A2s
TJ, TSTG
- 55 to + 150
°C
Rating for fusing (t < 8.3 ms)
Operating junction and storage temperature range
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
Maximum instantaneous forward
voltage drop per diode
Maximum DC reverse current at
rated DC blocking voltage per diode
Revision: 16-Aug-13
TEST CONDITIONS
0.75 A
TA = 25 °C
TA = 125 °C
SYMBOL
VF
IR
G2SB20
G2SB60
1.00
5.0
300
G2SB80
UNIT
V
μA
Document Number: 88603
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
G2SB20, G2SB60, G2SB80
www.vishay.com
Vishay General Semiconductor
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Typical thermal resistance
G2SB20
G2SB60
RJA
40
RJC
12
G2SB80
UNIT
°C/W
Note
• Unit mounted on PCB with 0.5" x 0.5" (12 mm x 12 mm) copper pads and 0.375" (9.5 mm) lead length
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
G2SB60-E3/45
2.045
45
20
Tube
G2SB60-E3/51
2.045
51
400
Anti-static PVC tray
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
100
Instantaneous Forward Current (A)
Average Forward Output (IF(AV))
2.0
PCB Mounting, TA
1.5
1.0
0.5
0
0
25
50
75
100
125
1
0.1
0.01
0.6
150
1.0
1.4
1.8
2.2
2.6
3.0
3.4
Temperature (°C)
Instantaneous Forward Voltage (V)
Fig. 1 - Derating Curve Output Rectified Current
Fig. 3 - Typical Forward Characteristics Per Diode
100
Instantaneous Reverse Current (µA)
100
Peak Forward Surge Current (A)
10
80
60
40
20
1.0 Cycle
TA = 125 °C
10
1
0.1
TA = 25 °C
0.01
0
1
10
100
0
20
40
60
80
100
Number of Cycles at 60 Hz
Percent of Rated Peak Reverse Voltage (%)
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge
Current Per Diode
Fig. 4 - Typical Reverse Characteristics Per Diode
Revision: 16-Aug-13
Document Number: 88603
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
G2SB20, G2SB60, G2SB80
www.vishay.com
Vishay General Semiconductor
100
Transient Thermal Impedance (°C/W)
Junction Capacitance (pF)
100
10
1
0.1
1
10
10
1
0.1
0.01
0.01
100
0.1
1
10
100
Reverse Voltage (V)
t - Heating Time (s)
Fig. 5 - Typical Junction Capacitance Per Diode
Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
Case Type GBL
0.125 (3.17) x 45°
Chamfer
0.825 (20.9)
0.815 (20.7)
0.421 (10.7)
0.411 (10.4)
0.080 (2.03)
0.060 (1.50)
0.098 (2.5)
0.075 (1.9)
0.718 (18.2)
0.682 (17.3)
Lead Depth
0.022 (0.56)
0.018 (0.46)
0.095 (2.41)
0.080 (2.03)
0.098 (2.5)
0.075 (1.9)
0.050 (1.27)
0.040 (1.02)
0.210 (5.3)
0.190 (4.8)
0.040 (1.02)
0.030 (0.76)
0.022 (0.56)
0.018 (0.46)
0.140 (3.56)
0.128 (3.25)
Polarity shown on front side of case, positive lead beveled corner
Revision: 16-Aug-13
Document Number: 88603
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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(EEE) - recast, unless otherwise specified as non-compliant.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000
Mouser Electronics
Authorized Distributor
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