Microsemi AFS600-1PQG256Y Fusion family of mixed signal fpgas Datasheet

Revision 4
Fusion Family of Mixed Signal FPGAs
Features and Benefits
In-System Programming (ISP) and Security
• ISP with 128-Bit AES via JTAG
• FlashLock® Designed to Protect FPGA Contents
High-Performance Reprogrammable Flash Technology
•
•
•
•
Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
Nonvolatile, Retains Program when Powered Off
Instant On Single-Chip Solution
350 MHz System Performance
Advanced Digital I/O
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages – Up to 5 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V /1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, M-LVDS
– Built-In I/O Registers
– 700 Mbps DDR Operation
• Hot-Swappable I/Os
• Programmable Output Slew Rate, Drive Strength, and Weak
Pull-Up/Down Resistor
• Pin-Compatible Packages across the Fusion® Family
Embedded Flash Memory
• User Flash Memory – 2 Mbits to 8 Mbits
– Configurable 8-, 16-, or 32-Bit Datapath
– 10 ns Access in Read-Ahead Mode
• 1 Kbit of Additional FlashROM
Integrated A/D Converter (ADC) and Analog I/O
•
•
•
•
•
•
Up to 12-Bit Resolution and up to 600 Ksps
Internal 2.56 V or External Reference Voltage
ADC: Up to 30 Scalable Analog Input Channels
High-Voltage Input Tolerance: –10.5 V to +12 V
Current Monitor and Temperature Monitor Blocks
Up to 10 MOSFET Gate Driver Outputs
– P- and N-Channel Power MOSFET Support
– Programmable 1, 3, 10, 30 µA, and 20 mA Drive Strengths
• ADC Accuracy is Better than 1%
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• Programmable Embedded FIFO Control Logic
Soft ARM Cortex-M1 Fusion Devices (M1)
• ARM® Cortex-™M1–Enabled
On-Chip Clocking Support
•
•
•
•
Internal 100 MHz RC Oscillator (accurate to 1%)
Crystal Oscillator Support (32 KHz to 20 MHz)
Programmable Real-Time Counter (RTC)
6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated PLLs
– Phase Shift, Multiply/Divide, and Delay Capabilities
– Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz
Pigeon Point ATCA IP Support (P1)
• Targeted to Pigeon Point® Board Management Reference
(BMR) Starter Kits
• Designed in Partnership with Pigeon Point Systems
• ARM Cortex-M1 Enabled
MicroBlade Advanced Mezzanine Card Support (U1)
Low Power Consumption
• Targeted to Advanced Mezzanine Card (AdvancedMC™ Designs)
• Designed in Partnership with MicroBlade
• 8051-Based Module Management Controller (MMC)
• Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
• Sleep and Standby Low-Power Modes
Table 1 • Fusion Family
Fusion Devices
AFS090
ARM Cortex-M1* Devices
AFS250
AFS600
AFS1500
M1AFS250
M1AFS600
M1AFS1500
P1AFS600
P1AFS1500
U1AFS250
U1AFS600
U1AFS1500
Pigeon Point Devices
MicroBlade Devices
General
Information
System Gates
90,000
250,000
600,000
1,500,000
Tiles (D-flip-flops)
2,304
6,144
13,824
38,400
Secure (AES) ISP
Yes
Yes
Yes
Yes
PLLs
1
1
2
2
Globals
18
18
18
18
Flash Memory Blocks (2 Mbits)
1
1
2
4
Total Flash Memory Bits
Memory
Analog and I/Os
2M
2M
4M
8M
1,024
1,024
1,024
1,024
RAM Blocks (4,608 bits)
6
8
24
60
RAM kbits
27
36
108
270
Analog Quads
5
6
10
10
Analog Input Channels
15
18
30
30
Gate Driver Outputs
5
6
10
10
I/O Banks (+ JTAG)
4
4
5
5
Maximum Digital I/Os
75
114
172
252
Analog I/Os
20
24
40
40
FlashROM Bits
Note: *Refer to the Cortex-M1 product brief for more information.
January 2013
© 2013 Microsemi Corporation
I
Fusion Family of Mixed Signal FPGAs
Fusion Device Architecture Overview
Bank 0
Bank 1
CCC
SRAM Block
4,608-Bit Dual-Port SRAM
or FIFO Block
OSC
I/Os
CCC/PLL
Bank 2
Bank 4
VersaTile
ISP AES
Decryption
User Nonvolatile
FlashROM
Flash Memory Blocks
Analog
Quad
Analog
Quad
Analog
Quad
Analog
Quad
CCC
Figure 1 •
Charge Pumps
ADC
Analog
Quad
SRAM Block
4,608-Bit Dual-Port SRAM
or FIFO Block
Flash Memory Blocks
Analog
Quad
Analog
Quad
Analog
Quad
Analog
Quad
Analog
Quad
Bank 3
Fusion Device Architecture Overview (AFS600)
Package I/Os: Single-/Double-Ended (Analog)
Fusion Devices
AFS090
ARM Cortex-M1 Devices
AFS250
AFS600
AFS1500
M1AFS250
M1AFS600
M1AFS1500
P1AFS600 1
P1AFS1500 1
2
U1AFS1500 2
Pigeon Point Devices
MicroBlade Devices
U1AFS250
QN108
37/9 (16)
QN180
60/16 (20)
PQ208 3
FG256
2
65/15 (24)
93/26 (24)
75/22 (20)
U1AFS600
114/37 (24)
FG484
FG676
95/46 (40)
119/58 (40)
119/58 (40)
172/86 (40)
223/109 (40)
252/126 (40)
Notes:
1. Pigeon Point devices are only offered in FG484 and FG256.
2. MicroBlade devices are only offered in FG256.
3. Fusion devices in the same package are pin compatible with the exception of the PQ208 package (AFS250 and AFS600).
II
R ev i si o n 4
Fusion Family of Mixed Signal FPGAs
Product Ordering Codes
M1AFS600
_
FG
1
G
256
Y
I
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
I = Industrial (–40 to +100°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
Security Feature
Y = Device Includes License to Implement IP Based on
the Cryptography Research, Inc. (CRI) Patent Portfolio
Blank = Device Does Not Include License to Implement IP Based
on the Cryptography Research, Inc. (CRI) Patent Portfolio
Package Lead Count
Lead-Free Packaging Options
Blank = Standard Packaging
G = RoHS-Compliant (green) Packaging
Package Type
1
QN = Quad Flat No Lead (0.5 mm pitch)
=
PQ
Plastic Quad Flat Pack (0.5 mm pitch)
2
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Part Number
Fusion Devices
AFS090 =
AFS250 =
AFS600 =
AFS1500 =
90,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
ARM-Enabled Fusion Devices
M1AFS250 = 250,000 System Gates
M1AFS600 = 600,000 System Gates
M1AFS1500 = 1,500,000 System Gates
Pigeon Point Devices
P1AFS600 = 600,000 System Gates
P1AFS1500 = 1,500,000 System Gates
MicroBlade Devices
U1AFS250 = 250,000 System Gates
U1AFS600 = 600,000 System Gates
U1AFS1500 = 1,500,000 System Gates
Notes:
1. For Fusion devices, Quad Flat No Lead packages are only offered as RoHS compliant, QNG packages.
2. MicroBlade and Pigeon Point devices only support FG packages.
Fusion Device Status
Fusion
Status
Cortex-M1
Status
AFS090
Production
AFS250
Pigeon Point
Production
M1AFS250
Production
AFS600
Production
M1AFS600
Production
P1AFS600
AFS1500
Production
M1AFS1500
Production
P1AFS1500
R e visi on 4
Status
MicroBlade
Status
U1AFS250
Production
Production
U1AFS600
Production
Production
U1AFS1500
Production
III
Fusion Family of Mixed Signal FPGAs
Temperature Grade Offerings
Fusion Devices
AFS090
ARM Cortex-M1 Devices
AFS250
AFS600
M1AFS250
M1AFS600
M1AFS1500
3
P1AFS1500 3
U1AFS250 4
U1AFS600 4
U1AFS1500 4
Pigeon Point Devices
P1AFS600
MicroBlade Devices
AFS1500
QN108
C, I
–
–
–
QN180
C, I
C, I
–
–
PQ208
–
C, I
C, I
–
FG256
C, I
C, I
C, I
C, I
FG484
–
–
C, I
C, I
FG676
–
–
–
C, I
Notes:
1. C = Commercial Temperature Range: 0°C to 85°C Junction
2. I = Industrial Temperature Range: –40°C to 100°C Junction
3. Pigeon Point devices are only offered in FG484 and FG256.
4. MicroBlade devices are only offered in FG256.
Speed Grade and Temperature Grade Matrix
Std.1
–1
–22
C3
3
3
3
I4
3
3
3
Notes:
1. MicroBlade devices are only offered in standard speed grade.
2. Pigeon Point devices are only offered in –2 speed grade.
3. C = Commercial Temperature Range: 0°C to 85°C Junction
4. I = Industrial Temperature Range: –40°C to 100°C Junction
Contact your local Microsemi SoC Products Group representative for device availability:
http://www.microsemi.com/soc/contact/offices/index.html.
Cortex-M1, Pigeon Point, and MicroBlade Fusion Device Information
This datasheet provides information for all Fusion (AFS), Cortex-M1 (M1), Pigeon Point (P1), and MicroBlade (U1) devices. The
remainder of the document will only list the Fusion (AFS) devices. Please apply relevant information to M1, P1, and U1 devices
when appropriate. Please note the following:
IV
•
Cortex-M1 devices are offered in the same speed grades and packages as basic Fusion devices.
•
Pigeon Point devices are only offered in –2 speed grade and FG484 and FG256 packages.
•
MicroBlade devices are only offered in standard speed grade and the FG256 package.
R ev i si o n 4
Fusion Family of Mixed Signal FPGAs
Table of Contents
Fusion Device Family Overview
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Unprecedented Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Device Architecture
Fusion Stack Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Core Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Clocking Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-19
Real-Time Counter System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-33
Embedded Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-41
Analog Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-79
Analog Configuration MUX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-129
User I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-135
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-226
Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-231
DC and Power Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32
Package Pin Assignments
QN108
QN180
PQ208
FG256
FG484
FG676
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
Revision 4
V
1 – Fusion Device Family Overview
Introduction
The Fusion mixed signal FPGA satisfies the demand from system architects for a device that simplifies
design and unleashes their creativity. As the world’s first mixed signal programmable logic family, Fusion
integrates mixed signal analog, flash memory, and FPGA fabric in a monolithic device. Fusion devices
enable designers to quickly move from concept to completed design and then deliver feature-rich
systems to market. This new technology takes advantage of the unique properties of Microsemi flashbased FPGAs, including a high-isolation, triple-well process and the ability to support high-voltage
transistors to meet the demanding requirements of mixed signal system design.
Fusion mixed signal FPGAs bring the benefits of programmable logic to many application areas,
including power management, smart battery charging, clock generation and management, and motor
control. Until now, these applications have only been implemented with costly and space-consuming
discrete analog components or mixed signal ASIC solutions. Fusion mixed signal FPGAs present new
capabilities for system development by allowing designers to integrate a wide range of functionality into a
single device, while at the same time offering the flexibility of upgrades late in the manufacturing process
or after the device is in the field. Fusion devices provide an excellent alternative to costly and timeconsuming mixed signal ASIC designs. In addition, when used in conjunction with the ARM Cortex-M1
processor, Fusion technology represents the definitive mixed signal FPGA platform.
Flash-based Fusion devices are Instant On. As soon as system power is applied and within normal
operating specifications, Fusion devices are working. Fusion devices have a 128-bit flash-based lock and
industry-leading AES decryption, used to secure programmed intellectual property (IP) and configuration
data. Fusion devices are the most comprehensive single-chip analog and digital programmable logic
solution available today.
To support this new ground-breaking technology, Microsemi has developed a series of major tool
innovations to help maximize designer productivity. Implemented as extensions to the popular Microsemi
Libero® System-on-Chip (SoC) software, these new tools allow designers to easily instantiate and
configure peripherals within a design, establish links between peripherals, create or import building
blocks or reference designs, and perform hardware verification. This tool suite will also add
comprehensive hardware/software debug capability as well as a suite of utilities to simplify development
of embedded soft-processor-based solutions.
General Description
The Fusion family, based on the highly successful ProASIC®3 and ProASIC3E flash FPGA architecture,
has been designed as a high-performance, programmable, mixed signal platform. By combining an
advanced flash FPGA core with flash memory blocks and analog peripherals, Fusion devices
dramatically simplify system design and, as a result, dramatically reduce overall system cost and board
space.
The state-of-the-art flash memory technology offers high-density integrated flash memory blocks,
enabling savings in cost, power, and board area relative to external flash solutions, while providing
increased flexibility and performance. The flash memory blocks and integrated analog peripherals enable
true mixed-mode programmable logic designs. Two examples are using an on-chip soft processor to
implement a fully functional flash MCU and using high-speed FPGA logic to offer system and power
supervisory capabilities. Instant On, and capable of operating from a single 3.3 V supply, the Fusion
family is ideally suited for system management and control applications.
The devices in the Fusion family are categorized by FPGA core density. Each family member contains
many peripherals, including flash memory blocks, an analog-to-digital-converter (ADC), high-drive
outputs, both RC and crystal oscillators, and a real-time counter (RTC). This provides the user with a
high level of flexibility and integration to support a wide variety of mixed signal applications. The flash
memory block capacity ranges from 2 Mbits to 8 Mbits. The integrated 12-bit ADC supports up to 30
independently configurable input channels.
Revision 4
1 -1
Fusion Device Family Overview
The on-chip crystal and RC oscillators work in conjunction with the integrated phase-locked loops (PLLs)
to provide clocking support to the FPGA array and on-chip resources. In addition to supporting typical
RTC uses such as watchdog timer, the Fusion RTC can control the on-chip voltage regulator to power
down the device (FPGA fabric, flash memory block, and ADC), enabling a low power standby mode.
The Fusion family offers revolutionary features, never before available in an FPGA. The nonvolatile flash
technology gives the Fusion solution the advantage of being a highly secure, low power, single-chip
solution that is Instant On. Fusion is reprogrammable and offers time-to-market benefits at an ASIC-level
unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA
design flows and tools.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, high performance, and ease of use. Flashbased Fusion devices are Instant On and do not need to be loaded from an external boot PROM. Onboard security mechanisms prevent access to the programming information and enable remote updates
of the FPGA logic that are protected with high level security. Designers can perform remote in-system
reprogramming to support future design iterations and field upgrades, with confidence that valuable IP is
highly unlikely to be compromised or copied. ISP can be performed using the industry-standard AES
algorithm with MAC data authentication on the device. The Fusion family device architecture mitigates
the need for ASIC migration at higher user volumes. This makes the Fusion family a cost-effective ASIC
replacement solution for applications in the consumer, networking and communications, computing, and
avionics markets.
Security
As the nonvolatile, flash-based Fusion family requires no boot PROM, there is no vulnerable external
bitstream. Fusion devices incorporate FlashLock, which provides a unique combination of
reprogrammability and design security without external overhead, advantages that only an FPGA with
nonvolatile flash programming can offer.
Fusion devices utilize a 128-bit flash-based key lock and a separate AES key to provide the highest level
of protection in the FPGA industry for programmed IP and configuration data. The FlashROM data in
Fusion devices can also be encrypted prior to loading. Additionally, the flash memory blocks can be
programmed during runtime using the industry-leading AES-128 block cipher encryption standard (FIPS
Publication 192). The AES standard was adopted by the National Institute of Standards and Technology
(NIST) in 2000 and replaces the DES standard, which was adopted in 1977. Fusion devices have a builtin AES decryption engine and a flash-based AES key that make Fusion devices the most comprehensive
programmable logic device security solution available today. Fusion devices with AES-based security
provide a high level of protection for remote field updates over public networks, such as the Internet, and
are designed to ensure that valuable IP remains out of the hands of system overbuilders, system cloners,
and IP thieves. As an additional security measure, the FPGA configuration data of a programmed Fusion
device cannot be read back, although secure design verification is possible. During design, the user
controls and defines both internal and external access to the flash memory blocks.
Security, built into the FPGA fabric, is an inherent component of the Fusion family. The flash cells are
located beneath seven metal layers, and many device design and layout techniques have been used to
make invasive attacks extremely difficult. Fusion with FlashLock and AES security is unique in being
highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected with industrystandard security, making remote ISP possible. A Fusion device provides the best available security for
programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the
configuration data is an inherent part of the FPGA structure, and no external configuration data needs to
be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based Fusion FPGAs do
not require system configuration components such as EEPROMs or microcontrollers to load device
configuration data. This reduces bill-of-materials costs and PCB area, and increases security and system
reliability.
1-2
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Instant On
Flash-based Fusion devices are Level 0 Instant On. Instant On Fusion devices greatly simplify total
system design and reduce total system cost by eliminating the need for CPLDs. The Fusion Instant On
clocking (PLLs) replaces off-chip clocking resources. The Fusion mix of Instant On clocking and analog
resources makes these devices an excellent choice for both system supervisor and system management
functions. Instant On from a single 3.3 V source enables Fusion devices to initiate, control, and monitor
multiple voltage supplies while also providing system clocks. In addition, glitches and brownouts in
system power will not corrupt the Fusion device flash configuration. Unlike SRAM-based FPGAs, the
device will not have to be reloaded when system power is restored. This enables reduction or complete
removal of expensive voltage monitor and brownout detection devices from the PCB design. Flashbased Fusion devices simplify total system design and reduce cost and design risk, while increasing
system reliability.
Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere, strike
a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way. Another
source of radiation-induced firm errors is alpha particles. For an alpha to cause a soft or firm error, its
source must be in very close proximity to the affected circuit. The alpha source must be in the package
molding compound or in the die itself. While low-alpha molding compounds are being used increasingly,
this helps reduce but does not entirely eliminate alpha-induced firm errors.
Firm errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be a
complete system failure. Firm errors do not occur in Fusion flash-based FPGAs. Once it is programmed,
the flash cell configuration element of Fusion FPGAs cannot be altered by high-energy neutrons and is
therefore immune to errors from them.
Recoverable (or soft) errors occur in the user data SRAMs of all FPGA devices. These can easily be
mitigated by using error detection and correction (EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based Fusion devices exhibit power characteristics similar to those of an ASIC, making them an
ideal choice for power-sensitive applications. With Fusion devices, there is no power-on current surge
and no high current transition, both of which occur on many FPGAs.
Fusion devices also have low dynamic power consumption and support both low power standby mode
and very low power sleep mode, offering further power savings.
Advanced Flash Technology
The Fusion family offers many benefits, including nonvolatility and reprogrammability through an
advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS design
techniques are used to implement logic and control functions. The combination of fine granularity,
enhanced flexible routing resources, and abundant flash switches allows very high logic utilization (much
higher than competing SRAM technologies) without compromising device routability or performance.
Logic functions within the device are interconnected through a four-level routing hierarchy.
Advanced Architecture
The proprietary Fusion architecture provides granularity comparable to standard-cell ASICs. The Fusion
device consists of several distinct and programmable architectural features, including the following
(Figure 1-1 on page 1-5):
•
•
Embedded memories
–
Flash memory blocks
–
FlashROM
–
SRAM and FIFO
Clocking resources
–
PLL and CCC
Revision 4
1 -3
Fusion Device Family Overview
–
RC oscillator
– Crystal oscillator
–
No-Glitch MUX (NGMUX)
•
Digital I/Os with advanced I/O standards
•
FPGA VersaTiles
•
Analog components
–
ADC
–
Analog I/Os supporting voltage, current, and temperature monitoring
– 1.5 V on-board voltage regulator
–
Real-time counter
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input logic
lookup table (LUT) equivalent or a D-flip-flop or latch (with or without enable) by programming the
appropriate flash switch interconnections. This versatility allows efficient use of the FPGA fabric. The
VersaTile capability is unique to the Microsemi families of flash-based FPGAs. VersaTiles and larger
functions are connected with any of the four levels of routing hierarchy. Flash switches are distributed
throughout the device to provide nonvolatile, reconfigurable interconnect programming. Maximum core
utilization is possible for virtually any design.
In addition, extensive on-chip programming circuitry allows for rapid (3.3 V) single-voltage programming
of Fusion devices via an IEEE 1532 JTAG interface.
Unprecedented Integration
Integrated Analog Blocks and Analog I/Os
Fusion devices offer robust and flexible analog mixed signal capability in addition to the highperformance flash FPGA fabric and flash memory block. The many built-in analog peripherals include a
configurable 32:1 input analog MUX, up to 10 independent MOSFET gate driver outputs, and a
configurable ADC. The ADC supports 8-, 10-, and 12-bit modes of operation with a cumulative sample
rate up to 600 k samples per second (Ksps), differential nonlinearity (DNL) < 1.0 LSB, and Total
Unadjusted Error (TUE) of 0.72 LSB in 10-bit mode. The TUE is used for characterization of the
conversion error and includes errors from all sources, such as offset and linearity. Internal bandgap
circuitry offers 1% voltage reference accuracy with the flexibility of utilizing an external reference voltage.
The ADC channel sampling sequence and sampling rate are programmable and implemented in the
FPGA logic using Designer and Libero SoC software tool support.
Two channels of the 32-channel ADCMUX are dedicated. Channel 0 is connected internally to VCC and
can be used to monitor core power supply. Channel 31 is connected to an internal temperature diode
which can be used to monitor device temperature. The 30 remaining channels can be connected to
external analog signals. The exact number of I/Os available for external connection signals is devicedependent (refer to the "Fusion Family" table on page I for details).
With Fusion, Microsemi also introduces the Analog Quad I/O structure (Figure 1-1 on page 1-5). Each
quad consists of three analog inputs and one gate driver. Each quad can be configured in various built-in
circuit combinations, such as three prescaler circuits, three digital input circuits, a current monitor circuit,
or a temperature monitor circuit. Each prescaler has multiple scaling factors programmed by FPGA
signals to support a large range of analog inputs with positive or negative polarity. When the current
monitor circuit is selected, two adjacent analog inputs measure the voltage drop across a small external
sense resistor. For more information, refer to the "Analog System Characteristics" section on
page 2-120. Built-in operational amplifiers amplify small voltage signals for accurate current
measurement. One analog input in each quad can be connected to an external temperature monitor
diode. In addition to the external temperature monitor diode(s), a Fusion device can monitor an internal
temperature diode using dedicated channel 31 of the ADCMUX.
Figure 1-1 on page 1-5 illustrates a typical use of the Analog Quad I/O structure. The Analog Quad
shown is configured to monitor and control an external power supply. The AV pad measures the source
of the power supply. The AC pad measures the voltage drop across an external sense resistor to
1-4
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
calculate current. The AG MOSFET gate driver pad turns the external MOSFET on and off. The AT pad
measures the load-side voltage level.
Power
Line Side
Load Side
Off-Chip
Rpullup
AV
Pads
AC
Voltage
Monitor Block
AG
Gate
Driver
Current
Monitor Block
On-Chip
AT
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor/Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Figure 1-1 •
Temperature
Monitor Block
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Analog Quad
Embedded Memories
Flash Memory Blocks
The flash memory available in each Fusion device is composed of one to four flash blocks, each 2 Mbits
in density. Each block operates independently with a dedicated flash controller and interface. Fusion
flash memory blocks combine fast access times (60 ns random access and 10 ns access in Read-Ahead
mode) with a configurable 8-, 16-, or 32-bit datapath, enabling high-speed flash operation without wait
states. The memory block is organized in pages and sectors. Each page has 128 bytes, with 33 pages
comprising one sector and 64 sectors per block. The flash block can support multiple partitions. The only
constraint on size is that partition boundaries must coincide with page boundaries. The flexibility and
granularity enable many use models and allow added granularity in programming updates.
Fusion devices support two methods of external access to the flash memory blocks. The first method is a
serial interface that features a built-in JTAG-compliant port, which allows in-system programmability
during user or monitor/test modes. This serial interface supports programming of an AES-encrypted
stream. Data protected with security measures can be passed through the JTAG interface, decrypted,
and then programmed in the flash block. The second method is a soft parallel interface.
FPGA logic or an on-chip soft microprocessor can access flash memory through the parallel interface.
Since the flash parallel interface is implemented in the FPGA fabric, it can potentially be customized to
meet special user requirements. For more information, refer to the CoreCFI Handbook. The flash
memory parallel interface provides configurable byte-wide (×8), word-wide (×16), or dual-word-wide
Revision 4
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Fusion Device Family Overview
(×32) data-port options. Through the programmable flash parallel interface, the on-chip and off-chip
memories can be cascaded for wider or deeper configurations.
The flash memory has built-in security. The user can configure either the entire flash block or the small
blocks to protect against unintentional or intrusive attempts to change or destroy the storage contents.
Each on-chip flash memory block has a dedicated controller, enabling each block to operate
independently.
The flash block logic consists of the following sub-blocks:
•
Flash block – Contains all stored data. The flash block contains 64 sectors and each sector
contains 33 pages of data.
•
Page Buffer – Contains the contents of the current page being modified. A page contains 8 blocks
of data.
•
Block Buffer – Contains the contents of the last block accessed. A block contains 128 data bits.
•
ECC Logic – The flash memory stores error correction information with each block to perform
single-bit error correction and double-bit error detection on all data blocks.
User Nonvolatile FlashROM
In addition to the flash blocks, Fusion devices have 1 Kbit of user-accessible, nonvolatile FlashROM onchip. The FlashROM is organized as 8×128-bit pages. The FlashROM can be used in diverse system
applications:
•
Internet protocol addressing (wireless or fixed)
•
System calibration settings
•
Device serialization and/or inventory control
•
Subscription-based business models (for example, set-top boxes)
•
Secure key storage for communications algorithms protected by security
•
Asset management/tracking
•
Date stamping
•
Version management
The FlashROM is written using the standard IEEE 1532 JTAG programming interface. Pages can be
individually programmed (erased and written). On-chip AES decryption can be used selectively over
public networks to load data such as security keys stored in the FlashROM for a user design.
The FlashROM can be programmed (erased and written) via the JTAG programming interface, and its
contents can be read back either through the JTAG programming interface or via direct FPGA core
addressing.
The FlashPoint tool in the Fusion development software solutions, Libero SoC and Designer, has
extensive support for flash memory blocks and FlashROM. One such feature is auto-generation of
sequential programming files for applications requiring a unique serial number in each part. Another
feature allows the inclusion of static data for system version control. Data for the FlashROM can be
generated quickly and easily using the Libero SoC and Designer software tools. Comprehensive
programming file support is also included to allow for easy programming of large numbers of parts with
differing FlashROM contents.
SRAM and FIFO
Fusion devices have embedded SRAM blocks along the north and south sides of the device. Each
variable-aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18,
512×9, 1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent read and write ports that can
be configured with different bit widths on each port. For example, data can be written through a 4-bit port
and read as a single bitstream. The SRAM blocks can be initialized from the flash memory blocks or via
the device JTAG port (ROM emulation mode), using the UJTAG macro.
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM
block to be configured as a synchronous FIFO without using additional core VersaTiles. The FIFO width
and depth are programmable. The FIFO also features programmable Almost Empty (AEMPTY) and
Almost Full (AFULL) flags in addition to the normal EMPTY and FULL flags. The embedded FIFO control
unit contains the counters necessary for the generation of the read and write address pointers. The
SRAM/FIFO blocks can be cascaded to create larger configurations.
1-6
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Clock Resources
PLLs and Clock Conditioning Circuits (CCCs)
Fusion devices provide designers with very flexible clock conditioning capabilities. Each member of the
Fusion family contains six CCCs. In the two larger family members, two of these CCCs also include a
PLL; the smaller devices support one PLL.
The inputs of the CCC blocks are accessible from the FPGA core or from one of several inputs with
dedicated CCC block connections.
The CCC block has the following key features:
•
Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz
•
Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz
•
Clock phase adjustment via programmable and fixed delays from –6.275 ns to +8.75 ns
•
Clock skew minimization (PLL)
•
Clock frequency synthesis (PLL)
•
On-chip analog clocking resources usable as inputs:
–
100 MHz on-chip RC oscillator
–
Crystal oscillator
Additional CCC specifications:
•
Internal phase shift = 0°, 90°, 180°, and 270°
•
Output duty cycle = 50% ± 1.5%
•
Low output jitter. Samples of peak-to-peak period jitter when a single global network is used:
–
70 ps at 350 MHz
–
90 ps at 100 MHz
–
180 ps at 24 MHz
–
Worst case < 2.5% × clock period
•
Maximum acquisition time = 150 µs
•
Low power consumption of 5 mW
Global Clocking
Fusion devices have extensive support for multiple clocking domains. In addition to the CCC and PLL
support described above, there are on-chip oscillators as well as a comprehensive global clock
distribution network.
The integrated RC oscillator generates a 100 MHz clock. It is used internally to provide a known clock
source to the flash memory read and write control. It can also be used as a source for the PLLs.
The crystal oscillator supports the following operating modes:
•
Crystal (32.768 KHz to 20 MHz)
•
Ceramic (500 KHz to 8 MHz)
•
RC (32.768 KHz to 4 MHz)
Each VersaTile input and output port has access to nine VersaNets: six main and three quadrant global
networks. The VersaNets can be driven by the CCC or directly accessed from the core via MUXes. The
VersaNets can be used to distribute low-skew clock signals or for rapid distribution of high-fanout nets.
Digital I/Os with Advanced I/O Standards
The Fusion family of FPGAs features a flexible digital I/O structure, supporting a range of voltages (1.5 V,
1.8 V, 2.5 V, and 3.3 V). Fusion FPGAs support many different digital I/O standards, both single-ended
and differential.
The I/Os are organized into banks, with four or five banks per device. The configuration of these banks
determines the I/O standards supported. The banks along the east and west sides of the device support
the full range of I/O standards (single-ended and differential). The south bank supports the Analog Quads
(analog I/O). In the family's two smaller devices, the north bank supports multiple single-ended digital I/O
Revision 4
1 -7
Fusion Device Family Overview
standards. In the family’s larger devices, the north bank is divided into two banks of digital Pro I/Os,
supporting a wide variety of single-ended, differential, and voltage-referenced I/O standards.
Each I/O module contains several input, output, and enable registers. These registers allow the
implementation of the following applications:
•
Single-Data-Rate (SDR) applications
•
Double-Data-Rate (DDR) applications—DDR LVDS I/O for chip-to-chip communications
•
Fusion banks support LVPECL, LVDS, BLVDS, and M-LVDS with 20 multi-drop points.
VersaTiles
The Fusion core consists of VersaTiles, which are also used in the successful ProASIC3 family. The
Fusion VersaTile supports the following:
•
All 3-input logic functions—LUT-3 equivalent
•
Latch with clear or set
•
D-flip-flop with clear or set and optional enable
Refer to Figure 1-2 for the VersaTile configuration arrangement.
LUT-3 Equivalent
X1
X2
X3
LUT-3
Y
D-Flip-Flop with Clear or Set
Data
CLK
CLR
Enable D-Flip-Flop with Clear or Set
Y
D-FF
Data
CLK
Enable
D-FFE
Y
CLR
Figure 1-2 • VersaTile Configurations
Specifying I/O States During Programming
You can modify the I/O states during programming in FlashPro. In FlashPro, this feature is supported for
PDB files generated from Designer v8.5 or greater. See the FlashPro User’s Guide for more information.
Note: PDB files generated from Designer v8.1 to Designer v8.4 (including all service packs) have
limited display of Pin Numbers only.
The I/Os are controlled by the JTAG Boundary Scan register during programming, except for the analog
pins (AC, AT and AV). The Boundary Scan register of the AG pin can be used to enable/disable the gate
driver in software v9.0.
1. Load a PDB from the FlashPro GUI. You must have a PDB loaded to modify the I/O states during
programming.
2. From the FlashPro GUI, click PDB Configuration. A FlashPoint – Programming File Generator
window appears.
3. Click the Specify I/O States During Programming button to display the Specify I/O States
During Programming dialog box.
4. Sort the pins as desired by clicking any of the column headers to sort the entries by that header.
Select the I/Os you wish to modify (Figure 1-3 on page 1-9).
5. Set the I/O Output State. You can set Basic I/O settings if you want to use the default I/O settings
for your pins, or use Custom I/O settings to customize the settings for each pin. Basic I/O state
settings:
1 – I/O is set to drive out logic High
0 – I/O is set to drive out logic Low
Last Known State – I/O is set to the last value that was driven out prior to entering the
programming mode, and then held at that value during programming
Z -Tri-State: I/O is tristated
1-8
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Figure 1-3 •
I/O States During Programming Window
6. Click OK to return to the FlashPoint – Programming File Generator window.
I/O States During programming are saved to the ADB and resulting programming files after completing
programming file generation.
Revision 4
1 -9
Fusion Device Family Overview
Related Documents
Datasheet
Core8051
www.microsemi.com/soc/ipdocs/Core8051_DS.pdf
Application Notes
Fusion FlashROM
http://www.microsemi.com/soc/documents/Fusion_FROM_AN.pdf
Fusion SRAM/FIFO Blocks
http://www.microsemi.com/soc/documents/Fusion_RAM_FIFO_AN.pdf
Using DDR in Fusion Devices
http://www.microsemi.com/soc/documents/Fusion_DDR_AN.pdf
Fusion Security
http://www.microsemi.com/soc/documents/Fusion_Security_AN.pdf
Using Fusion RAM as Multipliers
http://www.microsemi.com/soc/documents/Fusion_Multipliers_AN.pdf
Handbook
Cortex-M1 Handbook
www.microsemi.com/soc/documents/CortexM1_HB.pdf
User’s Guides
Designer User's Guide
http://www.microsemi.com/soc/documents/designer_UG.pdf
Fusion FPGA Fabric User’s Guide
http://www.microsemi.com/soc/documents/Fusion_UG.pdf
IGLOO, ProASIC3, SmartFusion and Fusion Macro Library Guide
http://www.microsemi.com/soc/documents/pa3_libguide_ug.pdf
SmartGen, FlashROM, Flash Memory System Builder, and Analog System Builder User's Guide
http://www.microsemi.com/soc/documents/genguide_ug.pdf
White Papers
Fusion Technology
http://www.microsemi.com/soc/documents/Fusion_Tech_WP.pdf
1- 10
R e visio n 4
2 – Device Architecture
Fusion Stack Architecture
To manage the unprecedented level of integration in Fusion devices, Microsemi developed the Fusion
technology stack (Figure 2-1). This layered model offers a flexible design environment, enabling design
at very high and very low levels of abstraction. Fusion peripherals include hard analog IP and hard and
soft digital IP. Peripherals communicate across the FPGA fabric via a layer of soft gates—the Fusion
backbone. Much more than a common bus interface, this Fusion backbone integrates a micro-sequencer
within the FPGA fabric and configures the individual peripherals and supports low-level processing of
peripheral data. Fusion applets are application building blocks that can control and respond to
peripherals and other system signals. Applets can be rapidly combined to create large applications. The
technology is scalable across devices, families, design types, and user expertise, and supports a welldefined interface for external IP and tool integration.
At the lowest level, Level 0, are Fusion peripherals. These are configurable functional blocks that can be
hardwired structures such as a PLL or analog input channel, or soft (FPGA gate) blocks such as a UART
or two-wire serial interface. The Fusion peripherals are configurable and support a standard interface to
facilitate communication and implementation.
Connecting and controlling access to the peripherals is the Fusion backbone, Level 1. The backbone is a
soft-gate structure, scalable to any number of peripherals. The backbone is a bus and much more; it
manages peripheral configuration to ensure proper operation. Leveraging the common peripheral
interface and a low-level state machine, the backbone efficiently offloads peripheral management from
the system design. The backbone can set and clear flags based upon peripheral behavior and can define
performance criteria. The flexibility of the stack enables a designer to configure the silicon, directly
bypassing the backbone if that level of control is desired.
One step up from the backbone is the Fusion applet, Level 2. The applet is an application building block
that implements a specific function in FPGA gates. It can react to stimuli and board-level events coming
through the backbone or from other sources, and responds to these stimuli by accessing and
manipulating peripherals via the backbone or initiating some other action. An applet controls or responds
to the peripheral(s). Applets can be easily imported or exported from the design environment. The applet
structure is open and well-defined, enabling users to import applets from Microsemi, system developers,
third parties, and user groups.
Optional ARM or 8051 Processor
Flash
Memory
User Applications
Level 3
Fusion Applets
Level 2
Fusion Smart Backbone
Level 1
Analog
Analog
Smart
Smart
Peripheral 1 Peripheral 2
Smart Peripherals
Analog
in FPGA
Smart
Fabric
Peripheral n (e.g., Logic, PLL, FIFO)
Level 0
Note: Levels 1, 2, and 3 are implemented in FPGA logic gates.
Figure 2-1 • Fusion Architecture Stack
Revision 4
2 -1
Device Architecture
The system application, Level 3, is the larger user application that utilizes one or more applets. Designing
at the highest level of abstraction supported by the Fusion technology stack, the application can be easily
created in FPGA gates by importing and configuring multiple applets.
In fact, in some cases an entire FPGA system design can be created without any HDL coding.
An optional MCU enables a combination of software and HDL-based design methodologies. The MCU
can be on-chip or off-chip as system requirements dictate. System portioning is very flexible, allowing the
MCU to reside above the applets or to absorb applets, or applets and backbone, if desired.
The Fusion technology stack enables a very flexible design environment. Users can engage in design
across a continuum of abstraction from very low to very high.
Core Architecture
VersaTile
Based upon successful ProASIC3/E logic architecture, Fusion devices provide granularity comparable to
gate arrays. The Fusion device core consists of a sea-of-VersaTiles architecture.
As illustrated in Figure 2-2, there are four inputs in a logic VersaTile cell, and each VersaTile can be
configured using the appropriate flash switch connections:
•
Any 3-input logic function
•
Latch with clear or set
•
D-flip-flop with clear or set
•
Enable D-flip-flop with clear or set (on a 4th input)
VersaTiles can flexibly map the logic and sequential gates of a design. The inputs of the VersaTile can be
inverted (allowing bubble pushing), and the output of the tile can connect to high-speed, very-long-line
routing resources. VersaTiles and larger functions are connected with any of the four levels of routing
hierarchy.
When the VersaTile is used as an enable D-flip-flop, the SET/CLR signal is supported by a fourth input,
which can only be routed to the core cell over the VersaNet (global) network.
The output of the VersaTile is F2 when the connection is to the ultra-fast local lines, or YL when the
connection is to the efficient long-line or very-long-line resources (Figure 2-2).
0
1
Data
X3
0
1
0
1
Y
Pin 1
F2
YL
CLK
X2
0
1
CLR/
Enable
X1
CLR
XC*
Legend:
Via (hard connection)
Switch (flash connection)
Note: *This input can only be connected to the global clock distribution network.
Figure 2-2 • Fusion Core VersaTile
2-2
R e vi s i o n 4
Ground
Fusion Family of Mixed Signal FPGAs
VersaTile Characteristics
Sample VersaTile Specifications—Combinatorial Module
The Fusion library offers all combinations of LUT-3 combinatorial functions. In this section, timing
characteristics are presented for a sample of the library (Figure 2-3). For more details, refer to the
IGLOO, ProASIC3, SmartFusion and Fusion Macro Library Guide.
A
A
A
OR2
B
Y
AND2
NOR2
B
A
A
Y
NAND2
B
Y
Y
B
A
XOR2
B
A
B
C
Y
A
A
B
C
Y
INV
NAND3
A
MAJ3
B
Y
XOR3
0
MUX2
B
Y
Y
1
C
S
Figure 2-3 •
Sample of Combinatorial Cells
Revision 4
2 -3
Device Architecture
tPD
A
NAND2 or
Any Combinatorial
Logic
B
Y
tPD = MAX(tPD(RR), tPD(RF), tPD(FF), tPD(FR))
where edges are applicable for the
particular combinatorial cell
VCCA
50%
50%
A, B, C
GND
VCCA
50%
50%
OUT
GND
VCCA
tPD
tPD
(FF)
(RR)
OUT
tPD
(FR)
50%
tPD
(RF)
Figure 2-4 •
2-4
GND
Combinatorial Timing Model and Waveforms
R e vi s i o n 4
50%
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-1 • Combinatorial Cell Propagation Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Combinatorial Cell
Equation
Parameter
–2
–1
Std.
Units
Y = !A
tPD
0.40
0.46
0.54
ns
Y=A·B
tPD
0.47
0.54
0.63
ns
Y = !(A · B)
tPD
0.47
0.54
0.63
ns
Y=A+B
tPD
0.49
0.55
0.65
ns
NOR2
Y = !(A + B)
tPD
0.49
0.55
0.65
ns
XOR2
Y = A B
tPD
0.74
0.84
0.99
ns
MAJ3
Y = MAJ(A, B, C)
tPD
0.70
0.79
0.93
ns
XOR3
Y = A  B C
tPD
0.87
1.00
1.17
ns
MUX2
Y = A !S + B S
tPD
0.51
0.58
0.68
ns
AND3
Y=A·B·C
tPD
0.56
0.64
0.75
ns
INV
AND2
NAND2
OR2
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Sample VersaTile Specifications—Sequential Module
The Fusion library offers a wide variety of sequential cells, including flip-flops and latches. Each has a
data input and optional enable, clear, or preset. In this section, timing characteristics are presented for a
representative sample from the library (Figure 2-5). For more details, refer to the IGLOO, ProASIC3,
SmartFusion and Fusion Macro Library Guide.
Revision 4
2 -5
Device Architecture
Data
D
Out
Q
Data
D
En
DFN1
CLK
Out
Q
DFN1E1
CLK
PRE
Data
Q
D
Out
Data
D
En
DFN1C1
Q
Out
DFI1E1P1
CLK
CLK
CLR
Figure 2-5 •
Sample of Sequential Cells
tCKMPWH tCKMPWL
CLK
50%
50%
50%
50%
50%
50%
50%
tHD
tSUD
50%
Data
EN
50%
tWPRE
50%
tHE
PRE
0
50%
tSUE
tRECPRE
tREMPRE
50%
50%
tRECCLR
tWCLR
50%
CLR
50%
tPRE2Q
50%
Out
tCLR2Q
50%
50%
tCLKQ
Figure 2-6 •
2-6
Sequential Timing Model and Waveforms
R e vi s i o n 4
tREMCLR
50%
Fusion Family of Mixed Signal FPGAs
Sequential Timing Characteristics
Table 2-2 • Register Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tCLKQ
Clock-to-Q of the Core Register
0.55
0.63
0.74
ns
tSUD
Data Setup Time for the Core Register
0.43
0.49
0.57
ns
tHD
Data Hold Time for the Core Register
0.00
0.00
0.00
ns
tSUE
Enable Setup Time for the Core Register
0.45
0.52
0.61
ns
tHE
Enable Hold Time for the Core Register
0.00
0.00
0.00
ns
tCLR2Q
Asynchronous Clear-to-Q of the Core Register
0.40
0.45
0.53
ns
tPRE2Q
Asynchronous Preset-to-Q of the Core Register
0.40
0.45
0.53
ns
tREMCLR
Asynchronous Clear Removal Time for the Core Register
0.00
0.00
0.00
ns
tRECCLR
Asynchronous Clear Recovery Time for the Core Register
0.22
0.25
0.30
ns
tREMPRE
Asynchronous Preset Removal Time for the Core Register
0.00
0.00
0.00
ns
tRECPRE
Asynchronous Preset Recovery Time for the Core Register
0.22
0.25
0.30
ns
tWCLR
Asynchronous Clear Minimum Pulse Width for the Core Register
0.22
0.25
0.30
ns
tWPRE
Asynchronous Preset Minimum Pulse Width for the Core Register
0.22
0.25
0.30
ns
tCKMPWH
Clock Minimum Pulse Width High for the Core Register
0.32
0.37
0.43
ns
tCKMPWL
Clock Minimum Pulse Width Low for the Core Register
0.36
0.41
0.48
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2 -7
Device Architecture
Array Coordinates
During many place-and-route operations in the Microsemi Designer software tool, it is possible to set
constraints that require array coordinates. Table 2-3 is provided as a reference. The array coordinates
are measured from the lower left (0, 0). They can be used in region constraints for specific logic
groups/blocks, designated by a wildcard, and can contain core cells, memories, and I/Os.
Table 2-3 provides array coordinates of core cells and memory blocks.
I/O and cell coordinates are used for placement constraints. Two coordinate systems are needed
because there is not a one-to-one correspondence between I/O cells and edge core cells. In addition, the
I/O coordinate system changes depending on the die/package combination. It is not listed in Table 2-3.
The Designer ChipPlanner tool provides array coordinates of all I/O locations. I/O and cell coordinates
are used for placement constraints. However, I/O placement is easier by package pin assignment.
Figure 2-7 illustrates the array coordinates of an AFS600 device. For more information on how to use
array coordinates for region/placement constraints, see the Designer User's Guide or online help
(available in the software) for Fusion software tools.
Table 2-3 • Array Coordinates
Device
VersaTiles
Min.
Memory Rows
Max.
x
y
All
Bottom
Top
Min.
Max.
(x, y)
(x, y)
(x, y)
(x, y)
x
y
AFS090
3
2
98
25
None
(3, 26)
(0, 0)
(101, 29)
AFS250
3
2
130
49
None
(3, 50)
(0, 0)
(133, 53)
AFS600
3
4
194
75
(3, 2)
(3, 76)
(0, 0)
(197, 79)
AFS1500
3
4
322
123
(3, 2)
(3, 124)
(0, 0)
(325, 129)
I/O Tile
(0, 79)
Top Row (7, 79) to (189, 79)
Bottom Row (5, 78) to (192, 78)
(197, 79)
Memory (3, 77)
Blocks (3, 76)
(194, 77) Memory
(194, 76) Blocks
VersaTile (Core)
(3, 75)
(194, 75)
VersaTile (Core)
(194, 4)
VersaTile(Core)
VersaTile (Core)
(3, 4)
(194, 3) Memory
(194, 2) Blocks
Memory (3, 3)
Blocks (3, 2)
(197, 1)
(0, 0)
UJTAG FlashROM
I/O Tile to Analog Block
Top Row (5, 1) to (168, 1)
Bottom Row (7, 0) to (165, 0)
(197, 0)
Top Row (169, 1) to (192, 1)
Note: The vertical I/O tile coordinates are not shown. West side coordinates are {(0, 2) to (2, 2)} to {(0, 77) to (2, 77)};
east side coordinates are {(195, 2) to (197, 2)} to {(195, 77) to (197, 77)}.
Figure 2-7 • Array Coordinates for AFS600
2-8
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Routing Architecture
The routing structure of Fusion devices is designed to provide high performance through a flexible fourlevel hierarchy of routing resources: ultra-fast local resources; efficient long-line resources; high-speed
very-long-line resources; and the high-performance VersaNet networks.
The ultra-fast local resources are dedicated lines that allow the output of each VersaTile to connect
directly to every input of the eight surrounding VersaTiles (Figure 2-8). The exception to this is that the
SET/CLR input of a VersaTile configured as a D-flip-flop is driven only by the VersaNet global network.
The efficient long-line resources provide routing for longer distances and higher-fanout connections.
These resources vary in length (spanning one, two, or four VersaTiles), run both vertically and
horizontally, and cover the entire Fusion device (Figure 2-9 on page 2-10). Each VersaTile can drive
signals onto the efficient long-line resources, which can access every input of every VersaTile. Active
buffers are inserted automatically by routing software to limit loading effects.
The high-speed very-long-line resources, which span the entire device with minimal delay, are used to
route very long or high-fanout nets: length ±12 VersaTiles in the vertical direction and length ±16 in the
horizontal direction from a given core VersaTile (Figure 2-10 on page 2-11). Very long lines in Fusion
devices, like those in ProASIC3 devices, have been enhanced. This provides a significant performance
boost for long-reach signals.
The high-performance VersaNet global networks are low-skew, high-fanout nets that are accessible from
external pins or from internal logic (Figure 2-11 on page 2-12). These nets are typically used to distribute
clocks, reset signals, and other high-fanout nets requiring minimum skew. The VersaNet networks are
implemented as clock trees, and signals can be introduced at any junction. These can be employed
hierarchically, with signals accessing every input on all VersaTiles.
Long Lines
L
Inputs
L
L
L
Ultra-Fast Local Lines
(connects a VersaTile to the
adjacent VersaTile, I/O buffer,
or memory block)
Output
L
L
L
L
L
Note: Input to the core cell for the D-flip-flop set and reset is only available via the VersaNet global network connection.
Figure 2-8 • Ultra-Fast Local Lines Connected to the Eight Nearest Neighbors
Revision 4
2 -9
Device Architecture
Spans Four VersaTiles
Spans Two VersaTiles
Spans One VersaTile
VersaTile
Figure 2-9 •
2- 10
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
Efficient Long-Line Resources
R e visio n 4
Spans One VersaTile
Spans Two VersaTiles
Spans Four VersaTiles
Fusion Family of Mixed Signal FPGAs
High-Speed, Very-Long-Line Resources
Pad Ring
SRAM
I/O Ring
Pad Ring
I/O Ring
16×12 Block of VersaTiles
Figure 2-10 • Very-Long-Line Resources
Revision 4
2- 11
Device Architecture
Global Resources (VersaNets)
Fusion devices offer powerful and flexible control of circuit timing through the use of analog circuitry.
Each chip has six CCCs. The west CCC also contains a PLL core. In the two larger devices (AFS600 and
AFS1500), the west and the east CCCs each contain a PLL. The PLLs include delay lines, a phase
shifter (0°, 90°, 180°, 270°), and clock multipliers/dividers. Each CCC has all the circuitry needed for the
selection and interconnection of inputs to the VersaNet global network. The east and west CCCs each
have access to three VersaNet global lines on each side of the chip (six lines total). The CCCs at the four
corners each have access to three quadrant global lines on each quadrant of the chip.
Advantages of the VersaNet Approach
One of the architectural benefits of Fusion is the set of powerful and low-delay VersaNet global networks.
Fusion offers six chip (main) global networks that are distributed from the center of the FPGA array
(Figure 2-11). In addition, Fusion devices have three regional globals (quadrant globals) in each of the
four chip quadrants. Each core VersaTile has access to nine global network resources: three quadrant
and six chip (main) global networks. There are a total of 18 global networks on the device. Each of these
networks contains spines and ribs that reach all VersaTiles in all quadrants (Figure 2-12 on page 2-13).
This flexible VersaNet global network architecture allows users to map up to 180 different
internal/external clocks in a Fusion device. Details on the VersaNet networks are given in Table 2-4 on
page 2-13. The flexibility of the Fusion VersaNet global network allows the designer to address several
design requirements. User applications that are clock-resource-intensive can easily route external or
gated internal clocks using VersaNet global routing networks. Designers can also drastically reduce
delay penalties and minimize resource usage by mapping critical, high-fanout nets to the VersaNet global
network.
Quadrant Global Pads
High-Performance
VersaNet Global Network
I/O Ring
Top Spine
Pad Ring
Pad Ring
Main (chip)
Global Network
Global
Pads
Chip (main)
Global Pads
Global Spine
Global Ribs
Spine-Selection
Tree MUX
I/O Ring
Bottom Spine
Figure 2-11 • Overview of Fusion VersaNet Global Network
2- 12
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Northwest Quadrant Global Network
Quadrant Global Spine
CCC
CCC
3
3
3
3
3
Chip (main)
Global
Network
6
6
6
6
3
CCC
6
Global Spine
6
6
3
3
CCC
6
3
3
CCC
CCC
Southeast Quadrant Global Network
Figure 2-12 • Global Network Architecture
Table 2-4 • Globals/Spines/Rows by Device
AFS090
AFS250
AFS600
AFS1500
Global VersaNets (trees)*
9
9
9
9
VersaNet Spines/Tree
4
8
12
20
Total Spines
36
72
108
180
VersaTiles in Each Top or Bottom Spine
384
768
1,152
1,920
2,304
6,144
13,824
38,400
Total VersaTiles
Note: *There are six chip (main) globals and three globals per quadrant.
Revision 4
2- 13
Device Architecture
VersaNet Global Networks and Spine Access
The Fusion architecture contains a total of 18 segmented global networks that can access the
VersaTiles, SRAM, and I/O tiles on the Fusion device. There are 6 chip (main) global networks that
access the entire device and 12 quadrant networks (3 in each quadrant). Each device has a total of 18
globals. These VersaNet global networks offer fast, low-skew routing resources for high-fanout nets,
including clock signals. In addition, these highly segmented global networks offer users the flexibility to
create low-skew local networks using spines for up to 180 internal/external clocks (in an AFS1500
device) or other high-fanout nets in Fusion devices. Optimal usage of these low-skew networks can
result in significant improvement in design performance on Fusion devices.
The nine spines available in a vertical column reside in global networks with two separate regions of
scope: the quadrant global network, which has three spines, and the chip (main) global network, which
has six spines. Note that there are three quadrant spines in each quadrant of the device. There are four
quadrant global network regions per device (Figure 2-12 on page 2-13).
The spines are the vertical branches of the global network tree, shown in Figure 2-11 on page 2-12. Each
spine in a vertical column of a chip (main) global network is further divided into two equal-length spine
segments: one in the top and one in the bottom half of the die.
Each spine and its associated ribs cover a certain area of the Fusion device (the "scope" of the spine;
see Figure 2-11 on page 2-12). Each spine is accessed by the dedicated global network MUX tree
architecture, which defines how a particular spine is driven—either by the signal on the global network
from a CCC, for example, or another net defined by the user (Figure 2-13). Quadrant spines can be
driven from user I/Os on the north and south sides of the die, via analog I/Os configured as direct digital
inputs. The ability to drive spines in the quadrant global networks can have a significant effect on system
performance for high-fanout inputs to a design.
Details of the chip (main) global network spine-selection MUX are presented in Figure 2-13. The spine
drivers for each spine are located in the middle of the die.
Quadrant spines are driven from a north or south rib. Access to the top and bottom ribs is from the corner
CCC or from the I/Os on the north and south sides of the device. For details on using spines in Fusion
devices, see the application note Using Global Resources in Actel Fusion Devices.
Internal/External
Signals
Internal/External
Signals
Tree Node MUX
Tree Node MUX
Internal/External
Signal
Tree Node MUX
Global Rib
Internal/External
Signal
Global Driver MUX
Spine
Figure 2-13 • Spine-Selection MUX of Global Tree
2- 14
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Clock Aggregation
Clock aggregation allows for multi-spine clock domains. A MUX tree provides the necessary flexibility to
allow long lines or I/Os to access domains of one, two, or four global spines. Signal access to the clock
aggregation system is achieved through long-line resources in the central rib, and also through local
resources in the north and south ribs, allowing I/Os to feed directly into the clock system. As Figure 2-14
indicates, this access system is contiguous.
There is no break in the middle of the chip for north and south I/O VersaNet access. This is different from
the quadrant clocks, located in these ribs, which only reach the middle of the rib. Refer to the Using
Global Resources in Actel Fusion Devices application note.
Global Spine
Global Rib
Global Driver and MUX
Tree Node MUX
I/O Access
Internal Signal Access
Global Signal Access
I/O Tiles
Figure 2-14 • Clock Aggregation Tree Architecture
Revision 4
2- 15
Device Architecture
Global Resource Characteristics
AFS600 VersaNet Topology
Clock delays are device-specific. Figure 2-15 is an example of a global tree used for clock routing. The
global tree presented in Figure 2-15 is driven by a CCC located on the west side of the AFS600 device. It
is used to drive all D-flip-flops in the device.
Central
Global Rib
CCC
VersaTile
Rows
Global Spine
Figure 2-15 • Example of Global Tree Use in an AFS600 Device for Clock Routing
2- 16
R e visio n 4
Fusion Family of Mixed Signal FPGAs
VersaNet Timing Characteristics
Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not
include I/O input buffer clock delays, as these are dependent upon I/O standard, and the clock may be
driven and conditioned internally by the CCC module. Table 2-5, Table 2-6, Table 2-7, and Table 2-8 on
page 2-18 present minimum and maximum global clock delays within the device Minimum and maximum
delays are measured with minimum and maximum loading, respectively.
Timing Characteristics
Table 2-5 • AFS1500 Global Resource Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
–2
Parameter
Description
–1
Min.1
Max.
2
1
Std.
Min.
Max.
2
Min.
1
Max.2
Units
tRCKL
Input Low Delay for Global Clock
1.53
1.75
1.74
1.99
2.05
2.34
ns
tRCKH
Input High Delay for Global Clock
1.53
1.79
1.75
2.04
2.05
2.40
ns
tRCKMPWH
Minimum Pulse Width High for Global Clock
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
ns
tRCKSW
Maximum Skew for Global Clock
0.26
0.29
0.34
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element located in a
fully loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
Table 2-6 • AFS600 Global Resource Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
–2
Parameter
Description
–1
Std.
Min.1
Max.2
Min.1
Max.2
Min.1
Max.2
Units
tRCKL
Input Low Delay for Global Clock
1.27
1.49
1.44
1.70
1.69
2.00
ns
tRCKH
Input High Delay for Global Clock
1.26
1.54
1.44
1.75
1.69
2.06
ns
tRCKMPWH
Minimum Pulse Width High for Global Clock
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
ns
tRCKSW
Maximum Skew for Global Clock
0.27
0.31
0.36
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element located in a
fully loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
Revision 4
2- 17
Device Architecture
Table 2-7 • AFS250 Global Resource Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
–2
Parameter
Description
1
–1
Min.
Max.
2
1
Std.
2
1
Min.
Max.
Min.
Max.2 Units
tRCKL
Input Low Delay for Global Clock
0.89
1.12
1.02
1.27
1.20
1.50
ns
tRCKH
Input High Delay for Global Clock
0.88
1.14
1.00
1.30
1.17
1.53
ns
tRCKMPWH
Minimum Pulse Width High for Global Clock
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
ns
tRCKSW
Maximum Skew for Global Clock
0.26
0.30
0.35
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
Table 2-8 • AFS090 Global Resource Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
–2
Parameter
Description
–1
Std.
Min.1
Max.2
Min.1
Max.2
Min.1
Max.2
Units
tRCKL
Input Low Delay for Global Clock
0.84
1.07
0.96
1.21
1.13
1.43
ns
tRCKH
Input High Delay for Global Clock
0.83
1.10
0.95
1.25
1.12
1.47
ns
tRCKMPWH
Minimum Pulse Width High for Global Clock
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
ns
tRCKSW
Maximum Skew for Global Clock
0.27
0.30
0.36
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
2- 18
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Clocking Resources
The Fusion family has a robust collection of clocking peripherals, as shown in the block diagram in
Figure 2-16. These on-chip resources enable the creation, manipulation, and distribution of many clock
signals. The Fusion integrated RC oscillator produces a 100 MHz clock source with no external
components. For systems requiring more precise clock signals, the Fusion family supports an on-chip
crystal oscillator circuit. The integrated PLLs in each Fusion device can use the RC oscillator, crystal
oscillator, or another on-chip clock signal as a source. These PLLs offer a variety of capabilities to modify
the clock source (multiply, divide, synchronize, advance, or delay). Utilizing the CCC found in the popular
ProASIC3 family, Fusion incorporates six CCC blocks. The CCCs allow access to Fusion global and local
clock distribution nets, as described in the "Global Resources (VersaNets)" section on page 2-12.
Off-Chip
On-Chip
100 MHz
RC Oscillator
GNDOSC
VCCOSC
Clock Out to FPGA Core through CCC
XTAL1
XTAL2
GLINT
Crystal Oscillator
Xtal Clock
External
External
Crystal or
RC
Clock I/Os
PLL/
CCC
GLA
GLC
NGMUX
To Core
CLKOUT
From FPGA Core
Figure 2-16 • Fusion Clocking Options
Revision 4
2- 19
Device Architecture
RC Oscillator
The RC oscillator is an on-chip free-running clock source generating a 100 MHz clock. It can be used as
a source clock for both on-chip and off-chip resources. When used in conjunction with the Fusion PLL
and CCC circuits, the RC oscillator clock source can be used to generate clocks of varying frequency
and phase.
The Fusion RC oscillator is very accurate at ±1% over commercial temperature ranges and and ±3%
over industrial temperature ranges. It is an automated clock, requiring no setup or configuration by the
user. It requires only that the power and GNDOSC pins be connected; no external components are
required. The RC oscillator can be used to drive either a PLL or another internal signal.
RC Oscillator Characteristics
Table 2-9 • Electrical Characteristics of RC Oscillator
Parameter
FRC
Description
Conditions
Operating
Frequency
Min.
Typ.
Max.
Units
100
MHz
1
%
3
%
Period Jitter (at 5 k cycles)
100
ps
Cycle–Cycle Jitter (at 5 k cycles)
100
ps
Period Jitter (at 5 k cycles) with
1 KHz / 300 mV peak-to-peak noise
on power supply
150
ps
Cycle–Cycle Jitter (at 5 k cycles) with
1 KHz / 300 mV peak-to-peak noise
on power supply
150
ps
Output Duty Cycle
50
%
Operating Current
1
mA
Accuracy
Temperature: 0°C to 85°C
Voltage: 3.3 V ± 5%
Temperature: –40°C to 125°C
Voltage: 3.3 V ± 5%
Output Jitter
IDYNRC
2- 20
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Crystal Oscillator
The Crystal Oscillator (XTLOSC) is source that generates the clock from an external crystal. The output
of XTLOSC CLKOUT signal can be selected as an input to the PLL. Refer to the "Clock Conditioning
Circuits" section for more details. The XTLOSC can operate in normal operations and Standby mode
(RTC is running and 1.5 V is not present).
In normal operation, the internal FPGA_EN signal is '1' as long as 1.5 V is present for VCC. As such,
the internal enable signal, XTL_EN, for Crystal Oscillator is enabled since FPGA_EN is asserted. The
XTL_MODE has the option of using MODE or RTC_MODE, depending on SELMODE.
During Standby, 1.5 V is not available, as such, and FPGA_EN is '0'. SELMODE must be asserted in
order for XTL_EN to be enabled; hence XTL_MODE relies on RTC_MODE. SELMODE and RTC_MODE
must be connected to RTCXTLSEL and RTCXTLMODE from the AB respectively for correct operation
during Standby (refer to the "Real-Time Counter System" section on page 2-33 for a detailed
description).
The Crystal Oscillator can be configured in one of four modes:
•
RC network, 32 KHz to 4 MHz
•
Low gain, 32 to 200 KHz
•
Medium gain, 0.20 to 2.0 MHz
•
High gain, 2.0 to 20.0 MHz
In RC network mode, the XTAL1 pin is connected to an RC circuit, as shown in Figure 2-16 on
page 2-19. The XTAL2 pin should be left floating. The RC value can be chosen based on Figure 2-18 for
any desired frequency between 32 KHz and 4 MHz. The RC network mode can also accommodate an
external clock source on XTAL1 instead of an RC circuit.
In Low gain, Medium gain, and High gain, an external crystal component or ceramic resonator can be
added onto XTAL1 and XTAL2, as shown in Figure 2-16 on page 2-19. In the case where the Crystal
Oscillator block is not used, the XTAL1 pin should be connected to GND and the XTAL2 pin should be left
floating.
XT LOSC
FPGA_EN*
XTL_EN*
SELMODE
C LKOU T
MODE[1:0]
0
RTC_MODE[1:0]
1
XTL_MODE*
XT L
Note: *Internal signal—does not exist in macro.
Figure 2-17 • XTLOSC Macro
Revision 4
2- 21
Device Architecture
RC Time Constant Values vs. Frequency
RC Time Constant (sec)
1.00E-0.3
1.00E-0.4
1.00E-0.5
1.00E-0.6
1.00E-0.7
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Frequency (MHz)
Figure 2-18 • Crystal Oscillator: RC Time Constant Values vs. Frequency (typical)
Table 2-10 • XTLOSC Signals Descriptions
Signal Name
Width
Direction
Function
XTL_EN*
1
Enables the crystal. Active high.
XTL_MODE*
2
Settings for the crystal clock for different frequency.
Value
SELMODE
1
IN
Modes
Frequency Range
b'00
RC network
32 KHz to 4 MHz
b'01
Low gain
32 to 200 KHz
b'10
Medium gain
0.20 to 2.0 MHz
b'11
High gain
2.0 to 20.0 MHz
Selects the source of XTL_MODE and also enables the
XTL_EN. Connect from RTCXTLSEL from AB.
0
For normal operation or sleep mode, XTL_EN
depends on FPGA_EN, XTL_MODE depends on
MODE
1
For Standby mode, XTL_EN is
XTL_MODE depends on RTC_MODE
RTC_MODE[1:0]
2
IN
Settings for the crystal clock for different frequency ranges.
XTL_MODE uses RTC_MODE when SELMODE is '1'.
MODE[1:0]
2
IN
Settings for the crystal clock for different frequency ranges.
XTL_MODE uses MODE when SELMODE is '0'. In Standby,
MODE inputs will be 0's.
FPGA_EN*
1
IN
0 when 1.5 V is not present for VCC 1 when 1.5 V is present
for VCC
XTL
1
IN
Crystal Clock source
CLKOUT
1
OUT
Crystal Clock output
Note: *Internal signal—does not exist in macro.
2- 22
enabled,
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Clock Conditioning Circuits
In Fusion devices, the CCCs are used to implement frequency division, frequency multiplication, phase
shifting, and delay operations.
The CCCs are available in six chip locations—each of the four chip corners and the middle of the east
and west chip sides.
Each CCC can implement up to three independent global buffers (with or without programmable delay),
or a PLL function (programmable frequency division/multiplication, phase shift, and delays) with up to three
global outputs. Unused global outputs of a PLL can be used to implement independent global buffers, up
to a maximum of three global outputs for a given CCC.
A global buffer can be placed in any of the three global locations (CLKA-GLA, CLKB-GLB, and CLKCGLC) of a given CCC.
A PLL macro uses the CLKA CCC input to drive its reference clock. It uses the GLA and, optionally, the
GLB and GLC global outputs to drive the global networks. A PLL macro can also drive the YB and YC
regular core outputs. The GLB (or GLC) global output cannot be reused if the YB (or YC) output is used
(Figure 2-19). Refer to the "PLL Macro" section on page 2-29 for more information.
Each global buffer, as well as the PLL reference clock, can be driven from one of the following:
•
3 dedicated single-ended I/Os using a hardwired connection
•
2 dedicated differential I/Os using a hardwired connection
•
The FPGA core
The CCC block is fully configurable, either via flash configuration bits set in the programming bitstream or
through an asynchronous interface. This asynchronous interface is dynamically accessible from inside
the Fusion device to permit changes of parameters (such as divide ratios) during device operation. To
increase the versatility and flexibility of the clock conditioning system, the CCC configuration is
determined either by the user during the design process, with configuration data being stored in flash
memory as part of the device programming procedure, or by writing data into a dedicated shift register
during normal device operation. This latter mode allows the user to dynamically reconfigure the CCC
without the need for core programming. The shift register is accessed through a simple serial interface.
Refer to the "UJTAG Applications in Microsemi’s Low-Power Flash Devices" chapter of the Fusion FPGA
Fabric User’s Guide and the "CCC and PLL Characteristics" section on page 2-30 for more information.
Revision 4
2- 23
Device Architecture
Clock Source
Clock Conditioning
Input LVDS/LVPECL Macro
CLKA
GLA
EXTFB
LOCK
POWERDOWN
PADN
GLB
YB
GLC
YC
Y
PADP
INBUF2 Macro
Y
PAD
OADIVRST
OADIVHALF
OADIV[4:0]
OAMUX[2:0]
DLYGLA[4:0]
OBDIV[4:0]
OBMUX[2:0]
DLYYB[4:0]
DLYGLB[4:0]
OCDIV[4:0]
OCMUX[2:0]
DLYYC[4:0]
DLYGLC[4:0]
FINDIV[6:0]
FBDIV[6:0]
FBDLY[4:0]
FBSEL[1:0]
XDLYSEL
VCOSEL[2:0]
Output
GLA
or
GLA and (GLB or YB)
or
GLA and (GLC or YC)
or
GLA and (GLB or YB) and
(GLC or YC)
Notes:
1. Visit the Microsemi SoC Products Group website for application notes concerning dynamic PLL reconfiguration. Refer to
the "PLL Macro" section on page 2-29 for signal descriptions.
2. Many specific INBUF macros support the wide variety of single-ended and differential I/O standards for the Fusion family.
3. Refer to the IGLOO, ProASIC3, SmartFusion and Fusion Macro Library Guide for more information.
Figure 2-19 • Fusion CCC Options: Global Buffers with the PLL Macro
Table 2-11 • Available Selections of I/O Standards within CLKBUF and CLKBUF_LVDS/LVPECL Macros
CLKBUF Macros
CLKBUF_LVCMOS5
CLKBUF_LVCMOS331
CLKBUF_LVCMOS18
CLKBUF_LVCMOS15
CLKBUF_PCI
CLKBUF_LVDS2
CLKBUF_LVPECL
Notes:
1. This is the default macro. For more details, refer to the IGLOO, ProASIC3, SmartFusion and Fusion Macro Library
Guide.
2. The B-LVDS and M-LVDS standards are supported with CLKBUF_LVDS.
2- 24
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Global Buffers with No Programmable Delays
The CLKBUF and CLKBUF_LVPECL/LVDS macros are composite macros that include an I/O macro
driving a global buffer, hardwired together (Figure 2-20).
The CLKINT macro provides a global buffer function driven by the FPGA core.
The CLKBUF, CLKBUF_LVPECL/LVDS, and CLKINT macros are pass-through clock sources and do not
use the PLL or provide any programmable delay functionality.
Many specific CLKBUF macros support the wide variety of single-ended and differential I/O standards
supported by Fusion devices. The available CLKBUF macros are described in the IGLOO, ProASIC3,
SmartFusion and Fusion Macro Library Guide.
Clock Source
Clock Conditioning
Output
GLA
CLKBUF_LVDS/LVPECL Macro
CLKBUF Macro
CLKINT Macro
PADP
or
None
PADN
Y
PAD
Y
A
Y
GLB
or
GLC
Figure 2-20 • Global Buffers with No Programmable Delay
Revision 4
2- 25
Device Architecture
Global Buffers with Programmable Delay
The CLKDLY macro is a pass-through clock source that does not use the PLL, but provides the ability to
delay the clock input using a programmable delay (Figure 2-21). The CLKDLY macro takes the selected
clock input and adds a user-defined delay element. This macro generates an output clock phase shift
from the input clock.
The CLKDLY macro can be driven by an INBUF macro to create a composite macro, where the I/O
macro drives the global buffer (with programmable delay) using a hardwired connection. In this case, the
I/O must be placed in one of the dedicated global I/O locations.
Many specific INBUF macros support the wide variety of single-ended and differential I/O standards
supported by the Fusion family. The available INBUF macros are described in the IGLOO, ProASIC3,
SmartFusion and Fusion Macro Library Guide.
The CLKDLY macro can be driven directly from the FPGA core.
The CLKDLY macro can also be driven from an I/O that is routed through the FPGA regular routing
fabric. In this case, users must instantiate a special macro, PLLINT, to differentiate from the hardwired
I/O connection described earlier.
The visual CLKDLY configuration in the SmartGen part of the Libero SoC and Designer tools allows the
user to select the desired amount of delay and configures the delay elements appropriately. SmartGen
also allows the user to select the input clock source. SmartGen will automatically instantiate the special
macro, PLLINT, when needed.
Clock Source
Clock Conditioning
Output
GLA
Input LVDS/LVPECL Macro
CLK
PADN
GL
Y
GLB
PADP
or
DLYGL[4:0]
INBUF* Macro
Y
PAD
Figure 2-21 • Fusion CCC Options: Global Buffers with Programmable Delay
2- 26
or
R e visio n 4
GLC
Fusion Family of Mixed Signal FPGAs
Global Input Selections
Each global buffer, as well as the PLL reference clock, can be driven from one of the following (Figure 222):
•
3 dedicated single-ended I/Os using a hardwired connection
•
2 dedicated differential I/Os using a hardwired connection
•
The FPGA core
Each shaded box represents an
input buffer called out by the
appropriate name: INBUF or
INBUF_LVDS/LVPECL.
To Core
Sample Pin Names
1
GAA0
GAA1
1
+
Source for CCC
(CLKA or CLKB or CLKC)
GAA2
1
Routed Clock
2
(from FPGA core)
+
GAA[0:2]: GA represents global in the northwest corner
of the device. A[0:2]: designates specific A clock source.
Notes:
1. Represents the global input pins. Globals have direct access to the clock conditioning block and are not
routed via the FPGA fabric. Refer to the "User I/O Naming Convention" section on page 2-161 for more
information.
2. Instantiate the routed clock source input as follows:
a) Connect the output of a logic element to the clock input of the PLL, CLKDLY, or CLKINT macro.
b) Do not place a clock source I/O (INBUF or INBUF_LVPECL/LVDS) in a relevant global pin location.
3. LVDS-based clock sources are available in the east and west banks on all Fusion devices.
Figure 2-22 • Clock Input Sources Including CLKBUF, CLKBUF_LVDS/LVPECL, and CLKINT
Revision 4
2- 27
Device Architecture
CCC Physical Implementation
The CCC circuit is composed of the following (Figure 2-23):
•
PLL core
•
3 phase selectors
•
6 programmable delays and 1 fixed delay
•
5 programmable frequency dividers that provide frequency multiplication/division (not shown in
Figure 2-23 because they are automatically configured based on the user's required frequencies)
•
1 dynamic shift register that provides CCC dynamic reconfiguration capability (not shown)
CCC Programming
The CCC block is fully configurable. It is configured via static flash configuration bits in the array, set by
the user in the programming bitstream, or configured through an asynchronous dedicated shift register,
dynamically accessible from inside the Fusion device. The dedicated shift register permits changes of
parameters such as PLL divide ratios and delays during device operation. This latter mode allows the
user to dynamically reconfigure the PLL without the need for core programming. The register file is
accessed through a simple serial interface.
CLKA
Four-Phase Output
PLL Core
Fixed Delay
Phase
Select
Programmable
Delay Type 2
GLA
Programmable
Delay Type 2
GLB
Programmable
Delay Type 1
YB
Programmable
Delay Type 2
GLC
Programmable
Delay Type 1
YC
Programmable
Delay Type 1
Phase
Select
Phase
Select
Note: Clock divider and multiplier blocks are not shown in this figure or in SmartGen. They are
automatically configured based on the user's required frequencies.
Figure 2-23 • PLL Block
2- 28
R e visio n 4
Fusion Family of Mixed Signal FPGAs
PLL Macro
The PLL functionality of the clock conditioning block is supported by the PLL macro. Note that the PLL
macro reference clock uses the CLKA input of the CCC block, which is only accessible from the global
A[2:0] package pins. Refer to Figure 2-22 on page 2-27 for more information.
The PLL macro provides five derived clocks (three independent) from a single reference clock. The PLL
feedback loop can be driven either internally or externally. The PLL macro also provides power-down
input and lock output signals. During power-up, POWERDOWN should be asserted Low until VCC is up.
See Figure 2-19 on page 2-24 for more information.
Inputs:
•
CLKA: selected clock input
•
POWERDOWN (active low): disables PLLs. The default state is power-down on (active low).
Outputs:
•
LOCK (active high): indicates that PLL output has locked on the input reference signal
•
GLA, GLB, GLC: outputs to respective global networks
•
YB, YC: allows output from the CCC to be routed back to the FPGA core
As previously described, the PLL allows up to five flexible and independently configurable clock outputs.
Figure 2-23 on page 2-28 illustrates the various clock output options and delay elements.
As illustrated, the PLL supports three distinct output frequencies from a given input clock. Two of these
(GLB and GLC) can be routed to the B and C global networks, respectively, and/or routed to the device
core (YB and YC).
There are five delay elements to support phase control on all five outputs (GLA, GLB, GLC, YB, and YC).
There is also a delay element in the feedback loop that can be used to advance the clock relative to the
reference clock.
The PLL macro reference clock can be driven by an INBUF macro to create a composite macro, where
the I/O macro drives the global buffer (with programmable delay) using a hardwired connection. In this
case, the I/O must be placed in one of the dedicated global I/O locations.
The PLL macro reference clock can be driven directly from the FPGA core.
The PLL macro reference clock can also be driven from an I/O routed through the FPGA regular routing
fabric. In this case, users must instantiate a special macro, PLLINT, to differentiate it from the hardwired
I/O connection described earlier.
The visual PLL configuration in SmartGen, available with the Libero SoC and Designer tools, will derive
the necessary internal divider ratios based on the input frequency and desired output frequencies
selected by the user. SmartGen allows the user to select the various delays and phase shift values
necessary to adjust the phases between the reference clock (CLKA) and the derived clocks (GLA, GLB,
GLC, YB, and YC). SmartGen also allows the user to select where the input clock is coming from.
SmartGen automatically instantiates the special macro, PLLINT, when needed.
Revision 4
2- 29
Device Architecture
CCC and PLL Characteristics
Timing Characteristics
Table 2-12 • Fusion CCC/PLL Specification
Parameter
Min.
Typ.
Max.
Unit
Clock Conditioning Circuitry Input Frequency fIN_CCC
1.5
350
MHz
Clock Conditioning Circuitry Output Frequency fOUT_CCC
0.75
350
MHz
Delay Increments in Programmable Delay Blocks1, 2
1603
ps
Number of Programmable Values in Each Programmable
Delay Block
32
Input Period Jitter
1.5
CCC Output Peak-to-Peak Period Jitter FCCC_OUT
Max Peak-to-Peak Period Jitter
1 Global
Network
Used
3 Global
Networks
Used
0.75 MHz to 24 MHz
1.00%
1.00%
24 MHz to 100 MHz
1.50%
1.50%
100 MHz to 250 MHz
2.25%
2.25%
250 MHz to 350 MHz
3.50%
3.50%
Acquisition Time
Tracking Jitter4
LockControl = 0
300
µs
LockControl = 1
6.0
ms
LockControl = 0
1.6
ns
LockControl = 1
0.8
ns
48.5
51.5
%
0.6
5.56
ns
0.025
5.56
ns
Output Duty Cycle
Delay Range in Block: Programmable Delay 1
1, 2
Delay Range in Block: Programmable Delay 2 1, 2
Delay Range in Block: Fixed Delay
ns
1, 2
2.2
ns
Notes:
1. This delay is a function of voltage and temperature. See Table 3-7 on page 3-9 for deratings.
2. TJ = 25°C, VCC = 1.5 V
3. When the CCC/PLL core is generated by Microsemi core generator software, not all delay values of the specified delay
increments are available. Refer to the Libero SoC Online Help associated with the core for more information.
4. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to PLL input clock edge.
Tracking jitter does not measure the variation in PLL output period, which is covered by period jitter parameter.
2- 30
R e visio n 4
Fusion Family of Mixed Signal FPGAs
No-Glitch MUX (NGMUX)
Positioned downstream from the PLL/CCC blocks, the NGMUX provides a special switching sequence
between two asynchronous clock domains that prevents generating any unwanted narrow clock pulses.
The NGMUX is used to switch the source of a global between three different clock sources. Allowable
inputs are either two PLL/CCC outputs or a PLL/CCC output and a regular net, as shown in Figure 2-24.
The GLMUXCFG[1:0] configuration bits determine the source of the CLK inputs (i.e., internal signal or
GLC). These are set by SmartGen during design but can also be changed by dynamically reconfiguring
the PLL. The GLMUXSEL[1:0] bits control which clock source is passed through the NGMUX to the global
network (GL). See Table 2-13.
Crystal Oscillator
RC Oscillator
W I/O Ring
GLMUXCFG[1:0]
CCC/PLL
GLINT
PLL/
CCC
Clock I/Os
GLA
NGMUX
GLC
To Clock Rib Driver
GL
From FPGA Core
PWR UP
GLMUXSEL[1:0]
Figure 2-24 • NGMUX
Table 2-13 • NGMUX Configuration and Selection Table
GLMUXCFG[1:0]
00
01
GLMUXSEL[1:0]
Selected Input
Signal
MUX Type
2-to-1 GLMUX
X
0
GLA
X
1
GLC
X
0
GLA
X
1
GLINT
Revision 4
2-to-1 GLMUX
2- 31
Device Architecture
The NGMUX macro is simplified to show the two clock options that have been selected by the
GLMUXCFG[1:0] bits. Figure 2-25 illustrates the NGMUX macro. During design, the two clock sources
are connected to CLK0 and CLK1 and are controlled by GLMUXSEL[1:0] to determine which signal is to
be passed through the MUX.
CLK0
GL
CLK1
GLMUXSEL[1:0]
Figure 2-25 • NGMUX Macro
The sequence of switching between two clock sources (from CLK0 to CLK1) is as follows (Figure 2-26):
•
GLMUXSEL[1:0] transitions to initiate a switch.
•
GL drives one last complete CLK0 positive pulse (i.e., one rising edge followed by one falling
edge).
•
From that point, GL stays Low until the second rising edge of CLK1 occurs.
•
At the second CLK1 rising edge, GL will begin to continuously deliver the CLK1 signal.
•
Minimum tsw = 0.05 ns at 25°C (typical conditions)
For examples of NGMUX operation, refer to the Fusion FPGA Fabric User’s Guide.
tSW
CLK0
CLK1
GLMUXSEL[1:0]
GL
Figure 2-26 • NGMUX Waveform
2- 32
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Real-Time Counter System
The RTC system enables Fusion devices to support standby and sleep modes of operation to reduce
power consumption in many applications.
•
Sleep mode, typical 10 µA
•
Standby mode (RTC running), typical 3 mA with 20 MHz
The RTC system is composed of five cores:
•
RTC sub-block inside Analog Block (AB)
•
Voltage Regulator and Power System Monitor (VRPSM)
•
Crystal oscillator (XTLOSC); refer to the "Crystal Oscillator" section in the Fusion Clock
Resources chapter of the Fusion FPGA Fabric User’s Guide for more detail.
•
Crystal clock; does not require instantiation in RTL
•
1.5 V voltage regulator; does not require instantiation in RTL
All cores are powered by 3.3 V supplies, so the RTC system is operational without a 1.5 V supply during
standby mode. Figure 2-27 shows their connection.
3.3 V
AB
VRPSM
Real-Time Counter
RTCMATCH
1.5 Voltage Regulator
VRPU
FPGAGOOD
VRINITSTATE
RTCPSMMATCH
PTBASE1
PUCORE
RTCPSMMATCH
VREN1
VREN1
External
Pass
Transistor
2N2222
PTEM1
1.5 V
RTCCLK
PUB
TRST1
RTCXTLMODE[1:0]
RTCXTLSEL
XTLOSC
SELMODE
RTC_MODE[1:0]
MODE[1:0]
CLKOUT
FPGA_EN1
Can Be Route
to PLL
XTL
Crystal Clock
XTL1
XTAL1
Power-Up/-Down
Toggle Control
Switch
External Pin
Internal Pin
XTAL2
Cores do not require any
RTL instantiation
Cores require RTL instantiation2
Sub-block in cores does not
require additional RTL instantiation
Notes:
1. Signals are hardwired internally and do not exist in the macro core.
2. User is only required to instantiate the VRPSM macro if the user wishes to specify PUPO behavior of the voltage regulator
to be different from the default, or employ user logic to shut the voltage regulator off.
Figure 2-27 • Real-Time Counter System (not all the signals are shown for the AB macro)
Revision 4
2- 33
Device Architecture
Modes of Operation
Standby Mode
Standby mode allows periodic power-up and power-down of the FPGA fabric. In standby mode, the realtime counter and crystal block are ON. The FPGA is not powered by disabling the 1.5 V voltage
regulator. The 1.5 V voltage regulator can be enabled when the preset count is matched. Refer to the
"Real-Time Counter (part of AB macro)" section for details. To enter standby mode, the RTC must be first
configured and enabled. Then VRPSM is shut off by deasserting the VRPU signal. The 1.5 V voltage
regulator is then disabled, and shuts off the 1.5 V output.
Sleep Mode
In sleep mode, the real-time counter and crystal blocks are OFF. The 1.5 V voltage regulator inside the
VRPSM can only be enabled by the PUB or TRST pin. Refer to the "Voltage Regulator and Power
System Monitor (VRPSM)" section on page 2-37 for details on power-up and power-down of the 1.5 V
voltage regulator.
Standby and Sleep Mode Circuit Implementation
For extra power savings, VJTAG and VPUMP should be at the same voltage as VCC, floated or ground,
during standby and sleep modes. Note that when VJTAG is not powered, the 1.5 V voltage regulator
cannot be enabled through TRST.
VPUMP and VJTAG can be controlled through an external switch. Microsemi recommends ADG839,
ADG849, or ADG841 as possible switches. Figure 2-28 shows the implementation for controlling
VPUMP. The IN signal of the switch can be connected to PTBASE of the Fusion device. VJTAG can be
controlled in same manner.
3.3 V
VPUMP (or JTAG) Supply
ADG841
Fusion
S
IN
PTBASE
External
Pass
Transistor
2N2222
PTEM
1.5 V
Figure 2-28 • Implementation to Control VPUMP
2- 34
R e visio n 4
VPUMP (or JTAG)
Pin of Fusion
Fusion Family of Mixed Signal FPGAs
Real-Time Counter (part of AB macro)
The RTC is a 40-bit loadable counter and used as the primary timekeeping element (Figure 2-29). The
clock source, RTCCLK, must come from the CLKOUT signal of the crystal oscillator. The RTC can be
configured to reset itself when a count value reaches the match value set in the Match Register.
The RTC is part of the Analog Block (AB) macro. The RTC is configured by the analog configuration
MUX (ACM). Each address contains one byte of data. The circuitry in the RTC is powered by VCC33A,
so the RTC can be used in standby mode when the 1.5 V supply is not present.
Real-Time Counter
xt_mode[1:0]
Control Status
xtal_en
RTCXTLMODE[1:0]
RTCXTLSEL
MatchBits Reg
1.5 V to
3.3 V
Level
Shifter
ACM
Registers
Match Reg
RTCMATCH
Counter
Read-Hold Reg
RTCPSMMATCH
Counter Reg
RTCCLK
Crystal Prescaler
FRTCCLK Divide by 128
40-Bit Counter
Figure 2-29 • RTC Block Diagram
Table 2-14 • RTC Signal Description
Signal Name
Width Direction
Function
RTCCLK
1
In
RTCXTLMODE[1:0]
2
Out
Controlled by xt_mode in CTRL_STAT. Signal must connect to
the RTC_MODE signal in XTLOSC, as shown in Figure 2-27.
Must come from CLKOUT of XTLOSC.
RTCXTLSEL
1
Out
Controlled by xtal_en from CTRL_STAT register. Signal must
connect to RTC_MODE signal in XTLOSC in Figure 2-27.
RTCMATCH
1
Out
Match signal for FPGA
0 – Counter value does not equal the Match Register value.
1 – Counter value equals the Match Register value.
RTCPSMMATCH
1
Out
Same signal as RTCMATCH. Signal must connect to
RTCPSMMATCH in VRPSM, as shown in Figure 2-27.
The 40-bit counter can be preloaded with an initial value as a starting point by the Counter Register. The
count from the 40-bit counter can be read through the same set of address space. The count comes from
a Read-Hold Register to avoid data changing during read.
When the counter value equals the Match Register value, all Match Bits Register values will be
0xFFFFFFFFFF. The RTCMATCH and RTCPSMMATCH signals will assert. The 40-bit counter can be
configured to automatically reset to 0x0000000000 when the counter value equals the Match Register
value. The automatic reset does not apply if the Match Register value is 0x0000000000.
The RTCCLK has a prescaler to divide the clock by 128 before it is used for the 40-bit counter. Below is
an example of how to calculate the OFF time.
Revision 4
2- 35
Device Architecture
Example: Calculation for Match Count
To put the Fusion device on standby for one hour using an external crystal of 32.768 KHz:
The period of the crystal oscillator is Tcrystal:
Tcrystal = 1 / 32.768 KHz = 30.518 µs
The period of the counter is Tcounter:
Tcounter = 30.518 us X 128 = 3.90625 ms
The Match Count for 1 hour is tmatch:
tmatch / Tcounter = (1 hr X 60 min/hr X 60 sec/min) / 3.90625 ms = 921600 or 0xE1000
Using a 32.768 KHz crystal, the maximum standby time of the 40-bit counter is 4,294,967,296 seconds,
which is 136 years.
Table 2-16 • RTC Control/Status Register
Bit
Name
7
rtc_rst
Description
Default
Value
RTC Reset
1 – Resets the RTC
0 – Deassert reset on after two ACM_CLK cycle.
6
cntr_en
Counter Enable
0
1 – Enables the counter; rtc_rst must be deasserted as well. First
counter increments after 64 RTCCLK positive edges.
0 – Disables the crystal prescaler but does not reset the counter
value. Counter value can only be updated when the counter is
disabled.
5
vr_en_mat
Voltage Regulator Enable on Match
0
1 – Enables RTCMATCH and RTCPSMMATCH to output 1 when the
counter value equals the Match Register value. This enables the 1.5 V
voltage regulator when RTCPSMMATCH connects to the
RTCPSMMATCH signal in VRPSM.
0 – RTCMATCH and RTCPSMMATCH output 0 at all times.
4:3
xt_mode[1:0]
Crystal Mode
00
Controls RTCXTLMODE[1:0]. Connects to RTC_MODE signal in
XTLOSC. XTL_MODE uses this value when xtal_en is 1. See the
"Crystal Oscillator" section on page 2-21 for mode configuration.
2
rst_cnt_omat
Reset Counter on Match
0
1 – Enables the sync clear of the counter when the counter value
equals the Match Register value. The counter clears on the rising
edge of the clock. If all the Match Registers are set to 0, the clear is
disabled.
0 – Counter increments indefinitely
1
rstb_cnt
Counter Reset, active Low
0
0 - Resets the 40-bit counter value
0
xtal_en
0
Crystal Enable
Controls RTCXTLSEL. Connects to SELMODE signal in XTLOSC.
0 – XTLOSC enables control by FPGA_EN; xt_mode is not used.
Sleep mode requires this bit to equal 0.
1 – Enables XTLOSC, XTL_MODE control by xt_mode
Standby mode requires this bit to be set to 1.
See the "Crystal Oscillator" section on page 2-21 for further details on
SELMODE configuration.
2- 36
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-15 • Memory Map for RTC in ACM Register and Description
ACMADDR
Register Name
Description
Default
Value
Use
0x40
COUNTER0
Counter bits 7:0
Used to preload the counter to
a specified start point.
0x41
COUNTER1
Counter bits 15:8
0x00
0x42
COUNTER2
Counter bits 23:16
0x00
0x43
COUNTER3
Counter bits 31:24
0x00
0x44
COUNTER4
Counter bits 39:32
0x00
0x48
MATCHREG0
Match register bits 7:0
0x49
MATCHREG1
Match register bits 15:8
0x00
0x4A
MATCHREG2
Match register bits 23:16
0x00
0x4B
MATCHREG3
Match register bits 31:24
0x00
0x4C
MATCHREG4
Match register bits 39:32
0x00
0x50
MATCHBIT0
Individual match bits 7:0
The RTC comparison bits
0x00
0x00
The output of the XNOR gates
0x00
0 – Not matched
1 – Matched
0x51
MATCHBIT1
Individual match bits 15:8
0x00
0x52
MATCHBIT2
Individual match bits 23:16
0x00
0x53
MATCHBIT3
Individual match bits 31:24
0x00
0x54
MATCHBIT4
Individual match bits 29:32
0x00
0x58
CTRL_STAT
Control (write/read) / Status Refer to Table 2-16
(read only) register bits
page 2-36 for details.
on
0x00
Voltage Regulator and Power System Monitor (VRPSM)
The VRPSM macro controls the power-up state of the FPGA. The power-up bar (PUB) pin can turn on
the voltage regulator when set to 0. TRST can enable the voltage regulator when deasserted, allowing
the FPGA to power-up when user want access to JTAG ports. The inputs VRINITSTATE and
RTCPSMMATCH come from the flash bits and RTC, and can also power up the FPGA.
VRPSM
FPGAGOOD
VRPU
VRINITSTATE
PUCORE
RTCPSMMATCH
VREN*
PUB
TRST*
Note: *Signals are hardwired internally and do not exist in the macro core.
Figure 2-30 • VRPSM Macro
Revision 4
2- 37
Device Architecture
Table 2-17 • VRPSM Signal Descriptions
Signal Name
VRPU
Width Dir.
1
In Voltage Regulator Power-Up
Function
0 – Voltage regulator disabled. PUB must be floated or pulled up, and
the TRST pin must be grounded to disable the voltage regulator.
VRINITSTATE
1
In
1 – Voltage regulator enabled
Voltage Regulator Initial State
Defines the voltage Regulator status upon power-up of the 3.3 V. The
signal is configured by Libero SoC when the VRPSM macro is
generated.
Tie off to 1 – Voltage regulator enables when 3.3 V is powered.
RTCPSMMATCH
1
In
Tie off to 0 – Voltage regulator disables when 3.3 V is powered.
RTC Power System Management Match
Connect from RTCPSMATCH signal from RTC in AB
PUB
1
In
0 transition to 1 turns on the voltage regulator
External pin, built-in weak pull-up
Power-Up Bar
TRST*
1
FPGAGOOD
1
In
0 – Enables voltage regulator at all times
External pin, JTAG Test Reset
1 – Enables voltage regulator at all times
Out Indicator that the FPGA is powered and functional
No need to connect if it is not used.
1 – Indicates that the FPGA is powered up and functional.
PUCORE
1
0 – Not possible to read by FPGA since it has already powered off.
Out Power-Up Core
VREN*
1
Inverted signal of PUB. No need to connect if it is not used.
Out Voltage Regulator Enable
Connected to 1.5 V voltage regulator in Fusion device internally.
0 – Voltage regulator disables
1 – Voltage regulator enables
Note: *Signals are hardwired internally and do not exist in the macro core.
2- 38
R e visio n 4
Fusion Family of Mixed Signal FPGAs
3.3 V OFF
3.3 V Power Supply ON/OFF
VINITSTATE = 0
And PUB = 1
And TRST = 0
OFF State
3.3 V Off,
PUB Pull-Up,
TRST Pull-Down,
VREN Disabled
VRINITSTATE = 1
or PUB = 0
or TRST = 1
3.3 V ON
Standby Mode
3.3 V On,
RTC Enabled
VREN Disabled
Sleep Mode
3.3 V On,
VREN Disabled
*RTCPSMMATCH = 1
Or PUB = 0
PUB = 0
Or TRST = 1
or TRST = 1
VRPU = 0
And PUB = 1
And TRST = 0
Normal Operation
3.3 V on,
VREN Enable
VRPU = 0
And PUB = 1
And TRST = 0
And *RTC: CTRL_STAT:
xtal_en = 1
3.3 V ON, 1.5 V ON (VR on)
Note: * To enter and exit standby mode without any external stimulus on PUB or TRST, the vr_en_mat in the
CTRL_STAT register must also be set to 1, so that RTCPSMMATCH will assert when a match occurs; hence the
device exits standby mode.
Figure 2-31 • State Diagram for All Different Power Modes
When TRST is 1 or PUB is 0, the 1.5 V voltage regulator is always ON, putting the Fusion device in
normal operation at all times. Therefore, when the JTAG port is not in reset, the Fusion device cannot
enter sleep mode or standby mode.
To enter standby mode, the Fusion device must first power-up into normal operation. The RTC is enabled
through the RTC Control/Status Register described in the "Real-Time Counter (part of AB macro)"
section on page 2-35. A match value corresponding to the wake-up time is loaded into the Match
Register. The 1.5 V voltage regulator is disabled by setting VRPU to 0 to allow the Fusion device to enter
standby mode, when the 1.5 V supply is off but the RTC remains on.
Revision 4
2- 39
Device Architecture
1.5 V Voltage Regulator
The 1.5 V voltage regulator uses an external pass transistor to generate 1.5 V from a 3.3 V supply. The
base of the pass transistor is tied to PTBASE, the collector is tied to 3.3 V, and an emitter is tied to
PTBASE and the 1.5 V supplies of the Fusion device. Figure 2-27 on page 2-33 shows the hook-up of
the 1.5 V voltage regulator to an external pass transistor.
Microsemi recommends using a PN2222A or 2N2222A transistor. The gain of such a transistor is
approximately 25, with a maximum base current of 20 mA. The maximum current that can be supported
is 0.5 A. Transistors with different gain can also be used for different current requirements.
Table 2-18 • Electrical Characteristics
VCC33A = 3.3 V
Symbol
VOUT
ICC33A
Parameter
Condition
Min
Typical
Max
Units
Output Voltage
Tj = 25ºC
1.425
1.5
1.575
V
Operation Current
Tj = 25ºC
ILOAD = 0.5 A
11
11
30
mA
mA
mA
90
mV
10.6
mV/V
12.1
mV/V
10.6
mV/V
0.63
0.84
1.35
V
V
V
48
736
12
µA
µA
mA
ILOAD = 1 mA
ILOAD = 100 mA
VOUT
Load Regulation
Tj = 25ºC
ILOAD = 1 mA to 0.5 A
VOUT
Line Regulation
Tj = 25ºC
VCC33A = 2.97 V to 3.63 V
ILOAD = 1 mA
VCC33A = 2.97 V to 3.63 V
ILOAD = 100 mA
VCC33A = 2.97 V to 3.63 V
ILOAD = 500 mA
Dropout Voltage*
Tj = 25ºC
ILOAD = 1 mA
ILOAD = 100 mA
ILOAD = 0.5 A
IPTBAS
E
PTBase Current
Tj = 25ºC
ILOAD = 1 mA
ILOAD = 100 mA
ILOAD = 0.5 A
Note: *Data collected with 2N2222A.
2- 40
R e visio n 4
20
Fusion Family of Mixed Signal FPGAs
Embedded Memories
Fusion devices include four types of embedded memory: flash block, FlashROM, SRAM, and FIFO.
Flash Memory Block
Fusion is the first FPGA that offers a flash memory block (FB). Each FB block stores 2 Mbits of data. The
flash memory block macro is illustrated in Figure 2-32. The port pin name and descriptions are detailed
on Table 2-19 on page 2-42. All flash memory block signals are active high, except for CLK and active
low RESET. All flash memory operations are synchronous to the rising edge of CLK.
ADDR[17:0]
RD[31:0]
BUSY
WD[31:0]
DATAWIDTH[1:0]
STATUS[1:0]
REN
READNEXT
PAGESTATUS
WEN
ERASEPAGE
PROGRAM
SPAREPAGE
AUXBLOCK
UNPROTECTPAGE
OVERWRITEPAGE
DISCARDPAGE
OVERWRITEPROTECT
PAGELOSSPROTECT
PIPE
LOCKREQUEST
CLK
RESET
Figure 2-32 • Flash Memory Block
Revision 4
2- 41
Device Architecture
Flash Memory Block Pin Names
Table 2-19 • Flash Memory Block Pin Names
Interface Name
Width Direction
Description
ADDR[17:0]
18
In
Byte offset into the FB. Byte-based address.
AUXBLOCK
1
In
When asserted, the page addressed is used to access the auxiliary
block within that page.
BUSY
1
Out
CLK
1
In
User interface clock. All operations and status are synchronous to the
rising edge of this clock.
DATAWIDTH[1:0]
2
In
Data width
When asserted, indicates that the FB is performing an operation.
00 = 1 byte in RD/WD[7:0]
01 = 2 bytes in RD/WD[15:0]
1x = 4 bytes in RD/WD[31:0]
DISCARDPAGE
1
In
When asserted, the contents of the Page Buffer are discarded so that
a new page write can be started.
ERASEPAGE
1
In
When asserted, the address page is to be programmed with all zeros.
ERASEPAGE must transition synchronously with the rising edge of
CLK.
LOCKREQUEST
1
In
When asserted, indicates to the JTAG controller that the FPGA
interface is accessing the FB.
OVERWRITEPAGE
1
In
When asserted, the page addressed is overwritten with the contents of
the Page Buffer if the page is writable.
OVERWRITEPROTECT
1
In
When asserted, all program operations will set the overwrite protect bit
of the page being programmed.
PAGESTATUS
1
In
When asserted with REN, initiates a read page status operation.
PAGELOSSPROTECT
1
In
When asserted, a modified Page Buffer must be programmed or
discarded before accessing a new page.
PIPE
1
In
Adds a pipeline stage to the output for operation above 50 MHz.
PROGRAM
1
In
When asserted, writes the contents of the Page Buffer into the FB
page addressed.
RD[31:0]
32
Out
Read data; data will be valid from the first non-busy cycle (BUSY = 0)
after REN has been asserted.
READNEXT
1
In
When asserted with REN, initiates a read-next operation.
REN
1
In
When asserted, initiates a read operation.
RESET
1
In
When asserted, resets the state of the FB (active low).
SPAREPAGE
1
In
When asserted, the sector addressed is used to access the spare
page within that sector.
2- 42
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-19 • Flash Memory Block Pin Names (continued)
Interface Name
STATUS[1:0]
Width Direction
2
Out
Description
Status of the last operation completed:
00: Successful completion
01: Read-/Unprotect-Page: single error detected and corrected
Write: operation addressed a write-protected page
Erase-Page: protection violation
Program: Page Buffer is unmodified
Protection violation
10: Read-/Unprotect-Page: two or more errors detected
11: Write: attempt to write to another page before programming
current page
Erase-Page/Program: page write count has exceeded the 10-year
retention threshold
UNPROTECTPAGE
1
In
When asserted, the page addressed is copied into the Page Buffer
and the Page Buffer is made writable.
WD[31:0]
32
In
Write data
WEN
1
In
When asserted, stores WD in the page buffer.
All flash memory block input signals are active high, except for RESET.
Revision 4
2- 43
Device Architecture
Flash Memory Block Diagram
A simplified diagram of the flash memory block is shown in Figure 2-33.
ECC
Logic
Output
MUX
RD[31:0]
Page Buffer = 8 Blocks
Plus AUX Block
Flash Array = 64 Sectors
Block Buffer
(128 bits)
WD[31 :0]
ADDDR[17:0]
DATAWIDTH[1:0]
REN
READNEXT
PAGESTATUS
WEN
ERASEPAGE
PROGRAM
SPAREPAGE
AUXBLOCK
UNPROTECTPAGE
Control
Logic
OVERWRITEPAGE
DISCARDPAGE
OVERWRITEPROTECT
PAGELOSSPROTECT
PIPE
LOCKREQUEST
CLK
RESET
STATUS[1:0]
BUSY
Figure 2-33 • Flash Memory Block Diagram
The logic consists of the following sub-blocks:
•
Flash Array
Contains all stored data. The flash array contains 64 sectors, and each sector contains 33 pages
of data.
•
Page Buffer
A page-wide volatile register. A page contains 8 blocks of data and an AUX block.
•
Block Buffer
Contains the contents of the last block accessed. A block contains 128 data bits.
•
ECC Logic
The FB stores error correction information with each block to perform single-bit error correction and
double-bit error detection on all data blocks.
2- 44
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Flash Memory Block Addressing
Figure 2-34 shows a graphical representation of the flash memory block.
Spare Page
Page 31
P
33
es
ag
..
..
rn
c to
e
S
Page 3
Page 2
Page 1
....
Page 0
....
r1
c to
Se
r0
c to
Se
1190
Block
0
1
2
3
4
5
6
Aux
Block
140
7
Notes:
1 block = 128 bits
1 page = 8 blocks plus the AUX block
1 sector = 33 pages
1 Flash array = 64 sectors
User Data
(32 bits)
Byte 15
Byte 14
Byte 3
Byte 2
Byte 1
Byte 0
Block Organization
Figure 2-34 • Flash Memory Block Organization
Each FB is partitioned into sectors, pages, blocks, and bytes. There are 64 sectors in an FB, and each
sector contains 32 pages and 1 spare page. Each page contains 8 data blocks and 1 auxiliary block.
Each data block contains 16 bytes of user data, and the auxiliary block contains 4 bytes of user data.
Addressing for the FB is shown in Table 2-20.
Table 2-20 • FB Address Bit Allocation ADDR[17:0]
17
12
Sector
11
7
6
Page
4
3
Block
0
Byte
When the spare page of a sector is addressed (SPAREPAGE active), ADDR[11:7] are ignored.
When the Auxiliary block is addressed (AUXBLOCK active), ADDR[6:2] are ignored.
Note: The spare page of sector 0 is unavailable for any user data. Writes to this page will return an error,
and reads will return all zeroes.
Revision 4
2- 45
Device Architecture
Data operations are performed in widths of 1 to 4 bytes. A write to a location in a page that is not already
in the Page Buffer will cause the page to be read from the FB Array and stored in the Page Buffer. The
block that was addressed during the write will be put into the Block Buffer, and the data written by WD will
overwrite the data in the Block Buffer. After the data is written to the Block Buffer, the Block Buffer is then
written to the Page Buffer to keep both buffers in sync. Subsequent writes to the same block will
overwrite the Block Buffer and the Page Buffer. A write to another block in the page will cause the
addressed block to be loaded from the Page Buffer, and the write will be performed as described
previously.
The data width can be selected dynamically via the DATAWIDTH input bus. The truth table for the data
width settings is detailed in Table 2-21. The minimum resolvable address is one 8-bit byte. For data
widths greater than 8 bits, the corresponding address bits are ignored—when DATAWIDTH = 0 (2 bytes),
ADDR[0] is ignored, and when DATAWIDTH = '10' or '11' (4 bytes), ADDR[1:0] are ignored. Data pins are
LSB-oriented and unused WD data pins must be grounded.
Table 2-21 • Data Width Settings
DATAWIDTH[1:0]
Data Width
00
1 byte [7:0]
01
2 byte [15:0]
10, 11
4 bytes [31:0]
Flash Memory Block Protection
Page Loss Protection
When the PAGELOSSPROTECT pin is set to logic 1, it prevents writes to any page other than the
current page in the Page Buffer until the page is either discarded or programmed.
A write to another page while the current page is Page Loss Protected will return a STATUS of '11'.
Overwrite Protection
Any page that is Overwrite Protected will result in the STATUS being set to '01' when an attempt is made
to either write, program, or erase it. To set the Overwrite Protection state for a page, set the
OVERWRITEPROTECT pin when a Program operation is undertaken. To clear the Overwrite Protect
state for a given page, an Unprotect Page operation must be performed on the page, and then the page
must be programmed with the OVERWRITEPROTECT pin cleared to save the new page.
LOCKREQUEST
The LOCKREQUEST signal is used to give the user interface control over simultaneous access of the FB
from both the User and JTAG interfaces. When LOCKREQUEST is asserted, the JTAG interface will hold
off any access attempts until LOCKREQUEST is deasserted.
Flash Memory Block Operations
FB Operation Priority
The FB provides for priority of operations when multiple actions are requested simultaneously.
Table 2-22 shows the priority order (priority 0 is the highest).
Table 2-22 • FB Operation Priority
Operation
2- 46
Priority
System Initialization
0
FB Reset
1
Read
2
Write
3
Erase Page
4
Program
5
Unprotect Page
6
Discard Page
7
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Access to the FB is controlled by the BUSY signal. The BUSY output is synchronous to the CLK signal.
FB operations are only accepted in cycles where BUSY is logic 0.
Write Operation
Write operations are initiated with the assertion of the WEN signal. Figure 2-35 on page 2-47 illustrates
the multiple Write operations.
CLK
WEN
ADDR[17:0]
A0
A1
A2
A3
A4
A5
A6
WD[31:0]
D0
D1
D2
D3
D4
D5
D6
DATAWIDTH[1:0]
PAGELOSSPROTECT
BUSY
STATUS[1:0]
S0
S1
S2
S3
S4
S5
S6
Figure 2-35 • FB Write Waveform
When a Write operation is initiated to a page that is currently not in the Page Buffer, the FB control logic
will issue a BUSY signal to the user interface while the page is loaded from the FB Array into the Page
Buffer. A Copy Page operation takes no less than 55 cycles and could take more if a Write or Unprotect
Page operation is started while the NVM is busy pre-fetching a block. The basic operation is to read a
block from the array into the block register (5 cycles) and then write the block register to the page buffer
(1 cycle) and if necessary, when the copy is complete, reading the block being written from the page
buffer into the block buffer (1 cycle). A page contains 9 blocks, so 9 blocks multiplied by 6 cycles to
read/write each block, plus 1 is 55 cycles total. Subsequent writes to the same block of the page will incur
no busy cycles. A write to another block in the page will assert BUSY for four cycles (five cycles when
PIPE is asserted), to allow the data to be written to the Page Buffer and have the current block loaded
into the Block Buffer.
Write operations are considered successful as long as the STATUS output is '00'. A non-zero STATUS
indicates that an error was detected during the operation and the write was not performed. Note that the
STATUS output is "sticky"; it is unchanged until another operation is started.
Only one word can be written at a time. Write word width is controlled by the DATAWIDTH bus. Users are
responsible for keeping track of the contents of the Page Buffer and when to program it to the array. Just
like a regular RAM, writing to random addresses is possible. Users can write into the Page Buffer in any
order but will incur additional BUSY cycles. It is not necessary to modify the entire Page Buffer before
saving it to nonvolatile memory.
Write errors include the following:
1. Attempting to write a page that is Overwrite Protected (STATUS = '01'). The write is not
performed.
2. Attempting to write to a page that is not in the Page Buffer when Page Loss Protection is enabled
(STATUS = '11'). The write is not performed.
Revision 4
2- 47
Device Architecture
Program Operation
A Program operation is initiated by asserting the PROGRAM signal on the interface. Program operations
save the contents of the Page Buffer to the FB Array. Due to the technologies inherent in the FB, a
program operation is a time consuming operation (~8 ms). While the FB is writing the data to the array,
the BUSY signal will be asserted.
During a Program operation, the sector and page addresses on ADDR are compared with the stored
address for the page (and sector) in the Page Buffer. If there is a mismatch between the two addresses,
the Program operation will be aborted and an error will be reported on the STATUS output.
It is possible to write the Page Buffer to a different page in memory. When asserting the PROGRAM pin,
if OVERWRITEPAGE is asserted as well, the FB will write the contents of the Page Buffer to the sector
and page designated on the ADDR inputs if the destination page is not Overwrite Protected.
A Program operation can be utilized to either modify the contents of the page in the flash memory block or
change the protections for the page. Setting the OVERWRITEPROTECT bit on the interface while
asserting the PROGRAM pin will put the page addressed into Overwrite Protect Mode. Overwrite Protect
Mode safeguards a page from being inadvertently overwritten during subsequent Program or Erase
operations.
Program operations that result in a STATUS value of '01' do not modify the addressed page. For all other
values of STATUS, the addressed page is modified.
Program errors include the following:
1. Attempting to program a page that is Overwrite Protected (STATUS = '01')
2. Attempting to program a page that is not in the Page Buffer when the Page Buffer has entered
Page Loss Protection Mode (STATUS = '01')
3. Attempting to perform a program with OVERWRITEPAGE set when the page addressed has
been Overwrite Protected (STATUS = '01')
4. The Write Count of the page programmed exceeding the Write Threshold defined in the part
specification (STATUS = '11')
5. The ECC Logic determining that there is an uncorrectable error within the programmed page
(STATUS = '10')
6. Attempting to program a page that is not in the Page Buffer when OVERWRITEPAGE is not set
and the page in the Page Buffer is modified (STATUS = '01')
7. Attempting to program the page in the Page Buffer when the Page Buffer is not modified
The waveform for a Program operation is shown in Figure 2-36.
CLK
PROGRAM
Page
ADDR[17:0]
OVERWRITEPAGE
OVERWRITEPROTECT
PAGELOSSPROTECT
BUSY
STATUS[1:0]
0
Valid
Figure 2-36 • FB Program Waveform
Note: OVERWRITEPAGE is only sampled when the PROGRAM or ERASEPAGE pins are asserted.
OVERWRITEPAGE is ignored in all other operations.
2- 48
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Erase Page Operation
The Erase Page operation is initiated when the ERASEPAGE pin is asserted. The Erase Page operation
allows the user to erase (set user data to zero) any page within the FB.
The use of the OVERWRITEPAGE and PAGELOSSPROTECT pins is the same for erase as for a
Program Page operation.
As with the Program Page operation, a STATUS of '01' indicates that the addressed page is not erased.
A waveform for an Erase Page operation is shown in Figure 2-37.
Erase errors include the following:
1. Attempting to erase a page that is Overwrite Protected (STATUS = '01')
2. Attempting to erase a page that is not in the Page Buffer when the Page Buffer has entered Page
Loss Protection mode (STATUS = '01')
3. The Write Count of the erased page exceeding the Write Threshold defined in the part
specification (STATUS = '11')
4. The ECC Logic determining that there is an uncorrectable error within the erased page (STATUS
= '10')
CLK
ERASE
ADDR[17:0]
Page
OVERWRITEPROTECT
PAGELOSSPROTECT
BUSY
STATUS[1:0]
Valid
Figure 2-37 • FB Erase Page Waveform
Revision 4
2- 49
Device Architecture
Read Operation
Read operations are designed to read data from the FB Array, Page Buffer, Block Buffer, or status
registers. Read operations support a normal read and a read-ahead mode (done by asserting
READNEXT). Also, the timing for Read operations is dependent on the setting of PIPE.
The following diagrams illustrate representative timing for Non-Pipe Mode (Figure 2-38) and Pipe Mode
(Figure 2-39) reads of the flash memory block interface.
CLK
REN
ADDR[17:0]
A0
A1
A2
A3
A4
DATAWIDTH[1:0]
BUSY
STATUS[1:0]
0
S0
S1
S2
S3
0
RD[31:0]
0
D0
D1
D2
D3
0
S4
D4
0
Figure 2-38 • Read Waveform (Non-Pipe Mode, 32-bit access)
CLK
REN
ADDR[17:0]
A0
A1
A2
A3
A4
DATAWIDTH[1:0]
BUSY
STATUS[1:0]
0
S0
S1
S2
S3
0
RD[31:0]
0
D0
D1
D2
D3
0
Figure 2-39 • Read Waveform (Pipe Mode, 32-bit access)
2- 50
R e visio n 4
S4
X
D4
0
Fusion Family of Mixed Signal FPGAs
The following error indications are possible for Read operations:
1. STATUS = '01' when a single-bit data error was detected and corrected within the block
addressed.
2. STATUS = '10' when a double-bit error was detected in the block addressed (note that the error is
uncorrected).
In addition to data reads, users can read the status of any page in the FB by asserting PAGESTATUS
along with REN. The format of the data returned by a page status read is shown in Table 2-23, and the
definition of the page status bits is shown in Table 2-24.
Table 2-23 • Page Status Read Data Format
31
8
Write Count
7
4
3
Reserved Over Threshold
2
1
0
Read Protected
Write Protected
Overwrite Protected
Table 2-24 • Page Status Bit Definition
Page Status
Bit(s)
Definition
31–8
The number of times the page addressed has been programmed/erased
7–4
Reserved; read as 0
3
Over Threshold indicator (see the"Program Operation" section on page 2-48)
2
Read Protected; read protect bit for page, which is set via the JTAG interface and
only affects JTAG operations. This bit can be overridden by using the correct user
key value.
1
Write Protected; write protect bit for page, which is set via the JTAG interface and
only affects JTAG operations. This bit can be overridden by using the correct user
key value.
0
Overwrite Protected; designates that the user has set the OVERWRITEPROTECT
bit on the interface while doing a Program operation. The page cannot be written
without first performing an Unprotect Page operation.
Revision 4
2- 51
Device Architecture
Read Next Operation
The Read Next operation is a feature by which the next block relative to the block in the Block Buffer is
read from the FB Array while performing reads from the Block Buffer. The goal is to minimize wait states
during consecutive sequential Read operations.
The Read Next operation is performed in a predetermined manner because it does look-ahead reads.
The general look-ahead function is as follows:
•
Within a page, the next block fetched will be the next in linear address.
•
When reading the last data block of a page, it will fetch the first block of the next page.
•
When reading spare pages, it will read the first block of the next sector's spare page.
•
Reads of the last sector will wrap around to sector 0.
•
Reads of Auxiliary blocks will read the next linear page's Auxiliary block.
When an address on the ADDR input does not agree with the predetermined look-ahead address, there
is a time penalty for this access. The FB will be busy finishing the current look-ahead read before it can
start the next read. The worst case is a total of nine BUSY cycles before data is delivered.
The Non-Pipe Mode and Pipe Mode waveforms for Read Next operations are illustrated in Figure 2-40
and Figure 2-41.
CLK
REN
READNEXT
ADDR[17:0]
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
DATAWIDTH[1:0]
BUSY
STATUS[1:0]
0
S0
S1
S2
S3
0
S4
S5
S6
S7
0
S8
S9
RD[31:0]
0
D0
D1
D2
D3
0
D4
D5
D6
D7
0
D8
D9
A6
A7
Figure 2-40 • Read Next Waveform (Non-Pipe Mode, 32-bit access)
CLK
REN
READNEXT
A0
ADDR[17:0]
A1
A2
A3
A4
A5
A8
BUSY
STATUS[1:0]
RD[31:0]
0
S0
S1
S2
S3
0
S4
S5
S6
S7
0
D0
D1
D2
D3
0
D4
D5
D6
D7
0
Figure 2-41 • Read Next WaveForm (Pipe Mode, 32-bit access)
2- 52
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Unprotect Page Operation
An Unprotect Page operation will clear the protection for a page addressed on the ADDR input. It is
initiated by setting the UNPROTECTPAGE signal on the interface along with the page address on
ADDR.
If the page is not in the Page Buffer, the Unprotect Page operation will copy the page into the Page
Buffer. The Copy Page operation occurs only if the current page in the Page Buffer is not Page Loss
Protected.
The waveform for an Unprotect Page operation is shown in Figure 2-42.
CLK
UNPROTECTPAGE
ADDR[17:0]
Page
BUSY
STATUS[1:0]
Valid
Figure 2-42 • FB Unprotected Page Waveform
The Unprotect Page operation can incur the following error conditions:
1. If the copy of the page to the Page Buffer determines that the page has a single-bit correctable
error in the data, it will report a STATUS = '01'.
2. If the address on ADDR does not match the address of the Page Buffer, PAGELOSSPROTECT is
asserted, and the Page Buffer has been modified, then STATUS = '11' and the addressed page is
not loaded into the Page Buffer.
3. If the copy of the page to the Page Buffer determines that at least one block in the page has a
double-bit uncorrectable error, STATUS = '10' and the Page Buffer will contain the corrupted data.
Discard Page Operation
If the contents of the modified Page Buffer have to be discarded, the DISCARDPAGE signal should be
asserted. This command results in the Page Buffer being marked as unmodified.
The timing for the operation is shown in Figure 2-43. The BUSY signal will remain asserted until the
operation has completed.
CLK
DISCARDPAGE
BUSY
Figure 2-43 • FB Discard Page Waveform
Revision 4
2- 53
Device Architecture
Flash Memory Block Characteristics
CLK
RESET
Active Low, Asynchronous
BUSY
Figure 2-44 • Reset Timing Diagram
Table 2-25 • Flash Memory Block Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
Clock-to-Q in 5-cycle read mode of the Read Data
7.99
9.10
10.70
ns
Clock-to-Q in 6-cycle read mode of the Read Data
5.03
5.73
6.74
ns
Clock-to-Q in 5-cycle read mode of BUSY
4.95
5.63
6.62
ns
Clock-to-Q in 6-cycle read mode of BUSY
4.45
5.07
5.96
ns
Clock-to-Status in 5-cycle read mode
11.24
12.81
15.06
ns
Clock-to-Status in 6-cycle read mode
4.48
5.10
6.00
ns
tDSUNVM
Data Input Setup time for the Control Logic
1.92
2.19
2.57
ns
tDHNVM
Data Input Hold time for the Control Logic
0.00
0.00
0.00
ns
tASUNVM
Address Input Setup time for the Control Logic
2.76
3.14
3.69
ns
tAHNVM
Address Input Hold time for the Control Logic
0.00
0.00
0.00
ns
tSUDWNVM
Data Width Setup time for the Control Logic
1.85
2.11
2.48
ns
tHDDWNVM
Data Width Hold time for the Control Logic
0.00
0.00
0.00
ns
tSURENNVM
Read Enable Setup time for the Control Logic
3.85
4.39
5.16
ns
tHDRENNVM
Read Enable Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUWENNVM
Write Enable Setup time for the Control Logic
2.37
2.69
3.17
ns
tHDWENNVM
Write Enable Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUPROGNVM
Program Setup time for the Control Logic
2.16
2.46
2.89
ns
tHDPROGNVM
Program Hold time for the Control Logic
0.00
0.00
0.00
ns
tSUSPAREPAGE
SparePage Setup time for the Control Logic
3.74
4.26
5.01
ns
tHDSPAREPAGE
SparePage Hold time for the Control Logic
0.00
0.00
0.00
ns
tSUAUXBLK
Auxiliary Block Setup Time for the Control Logic
3.74
4.26
5.00
ns
tHDAUXBLK
Auxiliary Block Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSURDNEXT
ReadNext Setup Time for the Control Logic
2.17
2.47
2.90
ns
tHDRDNEXT
ReadNext Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUERASEPG
Erase Page Setup Time for the Control Logic
3.76
4.28
5.03
ns
tHDERASEPG
Erase Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUUNPROTECTPG
Unprotect Page Setup Time for the Control Logic
2.01
2.29
2.69
ns
tHDUNPROTECTPG
Unprotect Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUDISCARDPG
Discard Page Setup Time for the Control Logic
1.88
2.14
2.52
ns
tHDDISCARDPG
Discard Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUOVERWRPRO
Overwrite Protect Setup Time for the Control Logic
1.64
1.86
2.19
ns
tHDOVERWRPRO
Overwrite Protect Hold Time for the Control Logic
0.00
0.00
0.00
ns
tCLK2RD
tCLK2BUSY
tCLK2STATUS
2- 54
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-25 • Flash Memory Block Timing (continued)
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tSUPGLOSSPRO
Page Loss Protect Setup Time for the Control Logic
1.69
1.93
2.27
ns
tHDPGLOSSPRO
Page Loss Protect Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUPGSTAT
Page Status Setup Time for the Control Logic
2.49
2.83
3.33
ns
tHDPGSTAT
Page Status Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSUOVERWRPG
Over Write Page Setup Time for the Control Logic
1.88
2.14
2.52
ns
tHDOVERWRPG
Over Write Page Hold Time for the Control Logic
0.00
0.00
0.00
ns
tSULOCKREQUEST
Lock Request Setup Time for the Control Logic
0.87
0.99
1.16
ns
tHDLOCKREQUEST
Lock Request Hold Time for the Control Logic
0.00
0.00
0.00
ns
tRECARNVM
Reset Recovery Time
0.94
1.07
1.25
ns
tREMARNVM
Reset Removal Time
0.00
0.00
0.00
ns
tMPWARNVM
Asynchronous Reset Minimum Pulse Width for the
Control Logic
10.00
12.50
12.50
ns
tMPWCLKNVM
Clock Minimum Pulse Width for the Control Logic
4.00
5.00
5.00
ns
tFMAXCLKNVM
Maximum Frequency for Clock for the Control Logic – for
AFS1500/AFS600
80.00
80.00
80.00
MHz
Maximum Frequency for Clock for the Control Logic – for
AFS250/AFS090
100.00
80.00
80.00
MHz
Revision 4
2- 55
Device Architecture
FlashROM
Fusion devices have 1 kbit of on-chip nonvolatile flash memory that can be read from the FPGA core
fabric. The FlashROM is arranged in eight banks of 128 bits during programming. The 128 bits in each
bank are addressable as 16 bytes during the read-back of the FlashROM from the FPGA core (Figure 245).
The FlashROM can only be programmed via the IEEE 1532 JTAG port. It cannot be programmed directly
from the FPGA core. When programming, each of the eight 128-bit banks can be selectively
reprogrammed. The FlashROM can only be reprogrammed on a bank boundary. Programming involves
an automatic, on-chip bank erase prior to reprogramming the bank. The FlashROM supports a
synchronous read and can be read on byte boundaries. The upper three bits of the FlashROM address
from the FPGA core define the bank that is being accessed. The lower four bits of the FlashROM
address from the FPGA core define which of the 16 bytes in the bank is being accessed.
The maximum FlashROM access clock is given in Table 2-26 on page 2-57. Figure 2-46 shows the
timing behavior of the FlashROM access cycle—the address has to be set up on the rising edge of the
clock for DOUT to be valid on the next falling edge of the clock.
If the address is unchanged for two cycles:
•
D0 becomes invalid tCK2Q ns after the second rising edge of the clock.
•
D0 becomes valid again tCK2Q ns after the second falling edge.
If the address unchanged for three cycles:
•
D0 becomes invalid tCK2Q ns after the second rising edge of the clock.
•
D0 becomes valid again tCK2Q ns after the second falling edge.
•
D0 becomes invalid tCK2Q ns after the third rising edge of the clock.
•
D0 becomes valid again tCK2Q ns after the third falling edge.
Byte Number in Bank
15 14 13
12
4 LSB of ADDR (READ)
11 10
9
8
Bank Number
3 MSB of ADDR (READ)
7
6
5
4
3
2
1
0
Figure 2-45 • FlashROM Architecture
2- 56
R e visio n 4
7
6
5
4
3
2
1
0
Fusion Family of Mixed Signal FPGAs
FlashROM Characteristics
Address
tSU
tSU
tSU
tHOLD
tHOLD
tHOLD
A1
A0
tCK2Q
tCK2Q
tCK2Q
D0
D0
D1
Figure 2-46 • FlashROM Timing Diagram
Table 2-26 • FlashROM Access Time
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tSU
Address Setup Time
0.53
0.61
0.71
ns
tHOLD
Address Hold Time
0.00
0.00
0.00
ns
tCK2Q
Clock to Out
21.42
24.40
28.68
ns
FMAX
Maximum Clock frequency
15.00
15.00
15.00
MHz
Revision 4
2- 57
Device Architecture
SRAM and FIFO
All Fusion devices have SRAM blocks along the north side of the device. Additionally, AFS600 and
AFS1500 devices have an SRAM block on the south side of the device. To meet the needs of highperformance designs, the memory blocks operate strictly in synchronous mode for both read and write
operations. The read and write clocks are completely independent, and each may operate at any desired
frequency less than or equal to 350 MHz. The following configurations are available:
•
4k×1, 2k×2, 1k×4, 512×9 (dual-port RAM—two read, two write or one read, one write)
•
512×9, 256×18 (two-port RAM—one read and one write)
•
Sync write, sync pipelined/nonpipelined read
The Fusion SRAM memory block includes dedicated FIFO control logic to generate internal addresses
and external flag logic (FULL, EMPTY, AFULL, AEMPTY).
During RAM operation, addresses are sourced by the user logic, and the FIFO controller is ignored. In
FIFO mode, the internal addresses are generated by the FIFO controller and routed to the RAM array by
internal MUXes. Refer to Figure 2-47 for more information about the implementation of the embedded
FIFO controller.
The Fusion architecture enables the read and write sizes of RAMs to be organized independently,
allowing for bus conversion. This is done with the WW (write width) and RW (read width) pins. The
different D×W configurations are 256×18, 512×9, 1k×4, 2k×2, and 4k×1. For example, the write size can
be set to 256×18 and the read size to 512×9.
Both the write and read widths for the RAM blocks can be specified independently with the WW (write
width) and RW (read width) pins. The different D×W configurations are 256×18, 512×9, 1k×4, 2k×2, and
4k×1.
Refer to the allowable RW and WW values supported for each of the RAM macro types in Table 2-27 on
page 2-61.
When a width of one, two, or four is selected, the ninth bit is unused. For example, when writing 9-bit
values and reading 4-bit values, only the first four bits and the second four bits of each 9-bit value are
addressable for read operations. The ninth bit is not accessible.
2- 58
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Conversely, when writing 4-bit values and reading 9-bit values, the ninth bit of a read operation will be
undefined. The RAM blocks employ little-endian byte order for read and write operations.
RD[17:0]
RD
WD[17:0]
WD
RCLK
RCLK
WCLK
WCLK
RAM
RADD[J:0]
RBLK
REN
REN
WEN
FWEN
RW[2:0]
WW[2:0]
FREN
RPIPE
WADD[J:0]
CNT 12
E
=
ESTOP
FULL
AFVAL
AFULL
WBLK
WEN
CNT 12
SUB 12
AEVAL
AEMPTY
E
=
FSTOP
EMPTY
Reset
Figure 2-47 • Fusion RAM Block with Embedded FIFO Controller
Revision 4
2- 59
Device Architecture
RAM4K9 Description
RAM4K9
ADDRA11 DOUTA8
ADDRA10 DOUTA7
ADDRA0
DINA8
DINA7
DOUTA0
DINA0
WIDTHA1
WIDTHA0
PIPEA
WMODEA
BLKA
WENA
CLKA
ADDRB11
ADDRB10
DOUTB8
DOUTB7
ADDRB0
DOUTB0
DINB8
DINB7
DINB0
WIDTHB1
WIDTHB0
PIPEB
WMODEB
BLKB
WENB
CLKB
RESET
Figure 2-48 • RAM4K9
2- 60
R e visio n 4
Fusion Family of Mixed Signal FPGAs
The following signals are used to configure the RAM4K9 memory element:
WIDTHA and WIDTHB
These signals enable the RAM to be configured in one of four allowable aspect ratios (Table 2-27).
Table 2-27 • Allowable Aspect Ratio Settings for WIDTHA[1:0]
WIDTHA1, WIDTHA0
WIDTHB1, WIDTHB0
D×W
00
00
4k×1
01
01
2k×2
10
10
1k×4
11
11
512×9
Note: The aspect ratio settings are constant and cannot be changed on the fly.
BLKA and BLKB
These signals are active low and will enable the respective ports when asserted. When a BLKx signal is
deasserted, the corresponding port’s outputs hold the previous value.
WENA and WENB
These signals switch the RAM between read and write mode for the respective ports. A Low on these
signals indicates a write operation, and a High indicates a read.
CLKA and CLKB
These are the clock signals for the synchronous read and write operations. These can be driven
independently or with the same driver.
PIPEA and PIPEB
These signals are used to specify pipelined read on the output. A Low on PIPEA or PIPEB indicates a
nonpipelined read, and the data appears on the corresponding output in the same clock cycle. A High
indicates a pipelined, read and data appears on the corresponding output in the next clock cycle.
WMODEA and WMODEB
These signals are used to configure the behavior of the output when the RAM is in write mode. A Low on
these signals makes the output retain data from the previous read. A High indicates pass-through
behavior, wherein the data being written will appear immediately on the output. This signal is overridden
when the RAM is being read.
RESET
This active low signal resets the output to zero, disables reads and writes from the SRAM block, and
clears the data hold registers when asserted. It does not reset the contents of the memory.
ADDRA and ADDRB
These are used as read or write addresses, and they are 12 bits wide. When a depth of less than 4 k is
specified, the unused high-order bits must be grounded (Table 2-28).
Table 2-28 • Address Pins Unused/Used for Various Supported Bus Widths
ADDRx
D×W
Unused
Used
4k×1
None
[11:0]
2k×2
[11]
[10:0]
1k×4
[11:10]
[9:0]
512×9
[11:9]
[8:0]
Note: The "x" in ADDRx implies A or B.
Revision 4
2- 61
Device Architecture
DINA and DINB
These are the input data signals, and they are nine bits wide. Not all nine bits are valid in all
configurations. When a data width less than nine is specified, unused high-order signals must be
grounded (Table 2-29).
DOUTA and DOUTB
These are the nine-bit output data signals. Not all nine bits are valid in all configurations. As with DINA
and DINB, high-order bits may not be used (Table 2-29). The output data on unused pins is undefined.
Table 2-29 • Unused/Used Input and Output Data Pins for Various Supported Bus Widths
DINx/DOUTx
D×W
Unused
Used
4k×1
[8:1]
[0]
2k×2
[8:2]
[1:0]
1k×4
[8:4]
[3:0]
512×9
None
[8:0]
Note: The "x" in DINx and DOUTx implies A or B.
2- 62
R e visio n 4
Fusion Family of Mixed Signal FPGAs
RAM512X18 Description
RAM512X18
RADDR8
RADDR7
RD17
RD16
RADDR0
RD0
RW1
RW0
PIPE
REN
RCLK
WADDR8
WADDR7
WADDR0
WD17
WD16
WD0
WW1
WW0
WEN
WCLK
RESET
Figure 2-49 • RAM512X18
Revision 4
2- 63
Device Architecture
RAM512X18 exhibits slightly different behavior from RAM4K9, as it has dedicated read and write ports.
WW and RW
These signals enable the RAM to be configured in one of the two allowable aspect ratios (Table 2-30).
Table 2-30 • Aspect Ratio Settings for WW[1:0]
WW[1:0]
RW[1:0]
D×W
01
01
512×9
10
10
256×18
00, 11
Reserved
00, 11
WD and RD
These are the input and output data signals, and they are 18 bits wide. When a 512×9 aspect ratio is
used for write, WD[17:9] are unused and must be grounded. If this aspect ratio is used for read, then
RD[17:9] are undefined.
WADDR and RADDR
These are read and write addresses, and they are nine bits wide. When the 256×18 aspect ratio is used
for write or read, WADDR[8] or RADDR[8] are unused and must be grounded.
WCLK and RCLK
These signals are the write and read clocks, respectively. They are both active high.
WEN and REN
These signals are the write and read enables, respectively. They are both active low by default. These
signals can be configured as active high.
RESET
This active low signal resets the output to zero, disables reads and/or writes from the SRAM block, and
clears the data hold registers when asserted. It does not reset the contents of the memory.
PIPE
This signal is used to specify pipelined read on the output. A Low on PIPE indicates a nonpipelined read,
and the data appears on the output in the same clock cycle. A High indicates a pipelined read, and data
appears on the output in the next clock cycle.
Clocking
The dual-port SRAM blocks are only clocked on the rising edge. SmartGen allows falling-edge-triggered
clocks by adding inverters to the netlist, hence achieving dual-port SRAM blocks that are clocked on
either edge (rising or falling). For dual-port SRAM, each port can be clocked on either edge or by
separate clocks, by port.
Fusion devices support inversion (bubble pushing) throughout the FPGA architecture, including the clock
input to the SRAM modules. Inversions added to the SRAM clock pin on the design schematic or in the
HDL code will be automatically accounted for during design compile without incurring additional delay in
the clock path.
The two-port SRAM can be clocked on the rising edge or falling edge of WCLK and RCLK.
If negative-edge RAM and FIFO clocking is selected for memory macros, clock edge inversion
management (bubble pushing) is automatically used within the Fusion development tools, without
performance penalty.
2- 64
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Modes of Operation
There are two read modes and one write mode:
•
Read Nonpipelined (synchronous—1 clock edge): In the standard read mode, new data is driven
onto the RD bus in the same clock cycle following RA and REN valid. The read address is
registered on the read port clock active edge, and data appears at RD after the RAM access time.
Setting PIPE to OFF enables this mode.
•
Read Pipelined (synchronous—2 clock edges): The pipelined mode incurs an additional clock
delay from the address to the data but enables operation at a much higher frequency. The read
address is registered on the read port active clock edge, and the read data is registered and
appears at RD after the second read clock edge. Setting PIPE to ON enables this mode.
•
Write (synchronous—1 clock edge): On the write clock active edge, the write data is written into
the SRAM at the write address when WEN is High. The setup times of the write address, write
enables, and write data are minimal with respect to the write clock. Write and read transfers are
described with timing requirements in the "SRAM Characteristics" section on page 2-66 and the
"FIFO Characteristics" section on page 2-75.
RAM Initialization
Each SRAM block can be individually initialized on power-up by means of the JTAG port using the
UJTAG mechanism (refer to the "JTAG IEEE 1532" section on page 2-232 and the Fusion SRAM/FIFO
Blocks application note). The shift register for a target block can be selected and loaded with the proper
bit configuration to enable serial loading. The 4,608 bits of data can be loaded in a single operation.
Revision 4
2- 65
Device Architecture
SRAM Characteristics
Timing Waveforms
tCYC
tCKH
tCKL
CLK
tAS
tAH
A1
A0
[R|W]ADDR
A2
tBKS
tBKH
BLK
tENS
tENH
WEN
tCKQ1
DOUT|RD
Dn
D0
D1
D2
tDOH1
Figure 2-50 • RAM Read for Flow-Through Output. Applicable to both RAM4K9 and RAM512x18.
tCYC
tCKH
tCKL
CLK
tAS
tAH
A1
A0
[R|W]ADDR
A2
tBKS
tBKH
BLK
tENS
tENH
WEN
tCKQ2
DOUT|RD
Dn
D0
D1
tDOH2
Figure 2-51 • RAM Read for Pipelined Output. Applicable to both RAM4K9 and RAM512x18.
2- 66
R e visio n 4
Fusion Family of Mixed Signal FPGAs
tCYC
tCKH
tCKL
CLK
tAS
tAH
A0
[R|W]ADDR
A1
A2
tBKS
tBKH
BLK
tENS
tENH
WEN
tDS
DI0
DIN|WD
tDH
DI1
Dn
DOUT|RD
D2
Figure 2-52 • RAM Write, Output Retained. Applicable to both RAM4K9 and RAM512x18.
tCYC
tCKH
tCKL
CLK
tAS
tAH
A0
ADDR
A1
A2
tBKS
tBKH
BLK
tENS
WEN
tDS
DOUT
(flow-through)
DOUT
(pipelined)
DI1
D0
DIN
tDH
DI2
DI0
Dn
DI1
DI0
Dn
DI1
Figure 2-53 • RAM Write, Output as Write Data (WMODE = 1). Applicable to RAM4K9 Only.
Revision 4
2- 67
Device Architecture
CLK1
tAS
tAH
A0
ADDR1
tDS
A3
D2
D3
tDH
D0
DIN1
A2
tWRO
CLK2
tAS
A0
ADDR2
tAH
A1
A4
tCKQ1
DOUT2
(flow-through)
Dn
D0
D1
tCKQ2
DOUT2
(Pipelined)
Dn
D0
Figure 2-54 • One Port Write / Other Port Read Same
tCYC
tCKH
tCKL
CLK
RESET
tRSTBQ
DOUT|RD
Dm
Dn
Figure 2-55 • RAM Reset. Applicable to both RAM4K9 and RAM512x18.
2- 68
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-31 • RAM4K9
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tAS
Address setup time
0.25 0.28
0.33
ns
tAH
Address hold time
0.00 0.00
0.00
ns
tENS
REN, WEN setup time
0.14 0.16
0.19
ns
tENH
REN, WEN hold time
0.10 0.11
0.13
ns
tBKS
BLK setup time
0.23 0.27
0.31
ns
tBKH
BL hold time
0.02 0.02
0.02
ns
tDS
Input data (DIN) setup time
0.18 0.21
0.25
ns
tDH
Input data (DIN) hold time
0.00 0.00
0.00
ns
tCKQ1
Clock High to new data valid on DOUT (output retained, WMODE = 0)
1.79 2.03
2.39
ns
Clock High to new data valid on DOUT (flow-through, WMODE = 1)
2.36 2.68
3.15
ns
tCKQ2
Clock High to new data valid on DOUT (pipelined)
0.89 1.02
1.20
ns
tC2CWWH1
Address collision clk-to-clk delay for reliable write after write on same 0.30 0.26
address—Applicable to Rising Edge
0.23
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on 0.45 0.38
same address—Applicable to Opening Edge
0.34
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on 0.49 0.42
same address— Applicable to Opening Edge
0.37
ns
tRSTBQ
RESET Low to data out Low on DOUT (flow-through)
0.92 1.05
1.23
ns
RESET Low to Data Out Low on DOUT (pipelined)
0.92 1.05
1.23
ns
tREMRSTB
RESET removal
0.29 0.33
0.38
ns
tRECRSTB
RESET recovery
1.50 1.71
2.01
ns
tMPWRSTB
RESET minimum pulse width
0.21 0.24
0.29
ns
tCYC
Clock cycle time
3.23 3.68
4.32
ns
FMAX
Maximum frequency
310
231
MHz
272
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for FlashBased cSoCs and FPGAs.
2. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
Revision 4
2- 69
Device Architecture
Table 2-32 • RAM512X18
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tAS
Address setup time
0.25 0.28
0.33
ns
tAH
Address hold time
0.00 0.00
0.00
ns
tENS
REN, WEN setup time
0.09 0.10
0.12
ns
tENH
REN, WEN hold time
0.06 0.07
0.08
ns
tDS
Input data (WD) setup time
0.18 0.21
0.25
ns
tDH
Input data (WD) hold time
0.00 0.00
0.00
ns
tCKQ1
Clock High to new data valid on RD (output retained)
2.16 2.46
2.89
ns
Clock High to new data valid on RD (pipelined)
0.90 1.02
1.20
ns
1
Address collision clk-to-clk delay for reliable read access after write on 0.50 0.43
same address—Applicable to Opening Edge
0.38
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on 0.59 0.50
same address— Applicable to Opening Edge
0.44
ns
tRSTBQ1
RESET Low to data out Low on RD (flow-through)
0.92 1.05
1.23
ns
RESET Low to data out Low on RD (pipelined)
0.92 1.05
1.23
ns
tREMRSTB
RESET removal
0.29 0.33
0.38
ns
tRECRSTB
RESET recovery
1.50 1.71
2.01
ns
tMPWRSTB
RESET minimum pulse width
0.21 0.24
0.29
ns
tCYC
Clock cycle time
3.23 3.68
4.32
ns
FMAX
Maximum frequency
310
231
MHz
tCKQ2
tC2CRWH
272
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for FlashBased cSoCs and FPGAs.
2. For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
2- 70
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FIFO4K18 Description
FIFO4K18
RD17
RD16
RW2
RW1
RW0
WW2
WW1
WW0
ESTOP
FSTOP
RD0
FULL
AFULL
EMPTY
AEMPTY
AEVAL11
AEVAL10
AEVAL0
AFVAL11
AFVAL10
AFVAL0
REN
RBLK
RCLK
WD17
WD16
WD0
WEN
WBLK
WCLK
RPIPE
RESET
Figure 2-56 • FIFO4KX18
Revision 4
2- 71
Device Architecture
The following signals are used to configure the FIFO4K18 memory element:
WW and RW
These signals enable the FIFO to be configured in one of the five allowable aspect ratios (Table 2-33).
Table 2-33 • Aspect Ratio Settings for WW[2:0]
RW2, RW1, RW0
D×W
000
000
4k×1
001
001
2k×2
010
010
1k×4
011
011
512×9
100
100
256×18
101, 110, 111
Reserved
WW2, WW1, WW0
101, 110, 111
WBLK and RBLK
These signals are active low and will enable the respective ports when Low. When the RBLK signal is
High, the corresponding port’s outputs hold the previous value.
WEN and REN
Read and write enables. WEN is active low and REN is active high by default. These signals can be
configured as active high or low.
WCLK and RCLK
These are the clock signals for the synchronous read and write operations. These can be driven
independently or with the same driver.
RPIPE
This signal is used to specify pipelined read on the output. A Low on RPIPE indicates a nonpipelined
read, and the data appears on the output in the same clock cycle. A High indicates a pipelined read, and
data appears on the output in the next clock cycle.
RESET
This active low signal resets the output to zero when asserted. It resets the FIFO counters. It also sets all
the RD pins Low, the FULL and AFULL pins Low, and the EMPTY and AEMPTY pins High (Table 2-34).
Table 2-34 • Input Data Signal Usage for Different Aspect Ratios
D×W
WD/RD Unused
4k×1
WD[17:1], RD[17:1]
2k×2
WD[17:2], RD[17:2]
1k×4
WD[17:4], RD[17:4]
512×9
WD[17:9], RD[17:9]
256×18
–
WD
This is the input data bus and is 18 bits wide. Not all 18 bits are valid in all configurations. When a data
width less than 18 is specified, unused higher-order signals must be grounded (Table 2-34).
RD
This is the output data bus and is 18 bits wide. Not all 18 bits are valid in all configurations. Like the WD
bus, high-order bits become unusable if the data width is less than 18. The output data on unused pins is
undefined (Table 2-34).
ESTOP, FSTOP
ESTOP is used to stop the FIFO read counter from further counting once the FIFO is empty (i.e., the
EMPTY flag goes High). A High on this signal inhibits the counting.
2- 72
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FSTOP is used to stop the FIFO write counter from further counting once the FIFO is full (i.e., the FULL
flag goes High). A High on this signal inhibits the counting.
For more information on these signals, refer to the "ESTOP and FSTOP Usage" section on page 2-73.
FULL, EMPTY
When the FIFO is full and no more data can be written, the FULL flag asserts High. The FULL flag is
synchronous to WCLK to inhibit writing immediately upon detection of a full condition and to prevent
overflows. Since the write address is compared to a resynchronized (and thus time-delayed) version of
the read address, the FULL flag will remain asserted until two WCLK active edges after a read operation
eliminates the full condition.
When the FIFO is empty and no more data can be read, the EMPTY flag asserts High. The EMPTY flag
is synchronous to RCLK to inhibit reading immediately upon detection of an empty condition and to
prevent underflows. Since the read address is compared to a resynchronized (and thus time-delayed)
version of the write address, the EMPTY flag will remain asserted until two RCLK active edges after a
write operation removes the empty condition.
For more information on these signals, refer to the "FIFO Flag Usage Considerations" section on
page 2-74.
AFULL, AEMPTY
These are programmable flags and will be asserted on the threshold specified by AFVAL and AEVAL,
respectively.
When the number of words stored in the FIFO reaches the amount specified by AEVAL while reading,
the AEMPTY output will go High. Likewise, when the number of words stored in the FIFO reaches the
amount specified by AFVAL while writing, the AFULL output will go High.
AFVAL, AEVAL
The AEVAL and AFVAL pins are used to specify the almost-empty and almost-full threshold values,
respectively. They are 12-bit signals. For more information on these signals, refer to "FIFO Flag
Usage Considerations" section.
ESTOP and FSTOP Usage
The ESTOP pin is used to stop the read counter from counting any further once the FIFO is empty (i.e.,
the EMPTY flag goes High). Likewise, the FSTOP pin is used to stop the write counter from counting any
further once the FIFO is full (i.e., the FULL flag goes High).
The FIFO counters in the Fusion device start the count at 0, reach the maximum depth for the
configuration (e.g., 511 for a 512×9 configuration), and then restart at 0. An example application for the
ESTOP, where the read counter keeps counting, would be writing to the FIFO once and reading the same
content over and over without doing another write.
Revision 4
2- 73
Device Architecture
FIFO Flag Usage Considerations
The AEVAL and AFVAL pins are used to specify the 12-bit AEMPTY and AFULL threshold values,
respectively. The FIFO contains separate 12-bit write address (WADDR) and read address (RADDR)
counters. WADDR is incremented every time a write operation is performed, and RADDR is incremented
every time a read operation is performed. Whenever the difference between WADDR and RADDR is
greater than or equal to AFVAL, the AFULL output is asserted. Likewise, whenever the difference
between WADDR and RADDR is less than or equal to AEVAL, the AEMPTY output is asserted. To
handle different read and write aspect ratios, AFVAL and AEVAL are expressed in terms of total data bits
instead of total data words. When users specify AFVAL and AEVAL in terms of read or write words, the
SmartGen tool translates them into bit addresses and configures these signals automatically. SmartGen
configures the AFULL flag to assert when the write address exceeds the read address by at least a
predefined value. In a 2k×8 FIFO, for example, a value of 1,500 for AFVAL means that the AFULL flag
will be asserted after a write when the difference between the write address and the read address
reaches 1,500 (there have been at least 1500 more writes than reads). It will stay asserted until the
difference between the write and read addresses drops below 1,500.
The AEMPTY flag is asserted when the difference between the write address and the read address is
less than a predefined value. In the example above, a value of 200 for AEVAL means that the AEMPTY
flag will be asserted when a read causes the difference between the write address and the read address
to drop to 200. It will stay asserted until that difference rises above 200. Note that the FIFO can be
configured with different read and write widths; in this case, the AFVAL setting is based on the number of
write data entries and the AEVAL setting is based on the number of read data entries. For aspect ratios of
512×9 and 256×18, only 4,096 bits can be addressed by the 12 bits of AFVAL and AEVAL. The number
of words must be multiplied by 8 and 16, instead of 9 and 18. The SmartGen tool automatically uses the
proper values. To avoid halfwords being written or read, which could happen if different read and write
aspect ratios are specified, the FIFO will assert FULL or EMPTY as soon as at least a minimum of one
word cannot be written or read. For example, if a two-bit word is written and a four-bit word is being read,
the FIFO will remain in the empty state when the first word is written. This occurs even if the FIFO is not
completely empty, because in this case, a complete word cannot be read. The same is applicable in the
full state. If a four-bit word is written and a two-bit word is read, the FIFO is full and one word is read. The
FULL flag will remain asserted because a complete word cannot be written at this point.
2- 74
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FIFO Characteristics
Timing Waveforms
tCYC
RCLK
tENH
tENS
REN
tBKH
tBKS
RBLK
tCKQ1
RD
(flow-through)
Dn
D0
D1
D2
D0
D1
tCKQ2
RD
(pipelined)
Dn
Figure 2-57 • FIFO Read
tCYC
WCLK
tENS
tENH
WEN
WBLK
tBKS
tBKH
tDS
WD
DI0
tDH
DI1
Figure 2-58 • FIFO Write
Revision 4
2- 75
Device Architecture
RCLK/
WCLK
tMPWRSTB
tRSTCK
RESET
tRSTFG
EF
tRSTAF
AEF
tRSTFG
FF
tRSTAF
AFF
WA/RA
(Address Counter)
MATCH (A0)
Figure 2-59 • FIFO Reset
tCYC
RCLK
tRCKEF
EF
tCKAF
AEF
WA/RA
(Address Counter)
NO MATCH
NO MATCH
Figure 2-60 • FIFO EMPTY Flag and AEMPTY Flag Assertion
2- 76
R e visio n 4
Dist = AEF_TH
MATCH (EMPTY)
Fusion Family of Mixed Signal FPGAs
t CYC
WCLK
t WCKFF
FF
t CKAF
AFF
WA/RA
(Address Counter) NO MATCH
Dist = AFF_TH
NO MATCH
MATCH (FULL)
Figure 2-61 • FIFO FULL and AFULL Flag Assertion
WCLK
WA/RA MATCH
(Address Counter) (EMPTY)
RCLK
NO MATCH
1st rising
edge
after 1st
write
NO MATCH
NO MATCH
NO MATCH
Dist = AEF_TH + 1
2nd rising
edge
after 1st
write
tRCKEF
EF
tCKAF
AEF
Figure 2-62 • FIFO EMPTY Flag and AEMPTY Flag Deassertion
RCLK
WA/RA
(Address Counter) MATCH (FULL)
NO MATCH
1st Rising
Edge
After 1st
Read
WCLK
NO MATCH
NO MATCH
NO MATCH
Dist = AFF_TH – 1
1st Rising
Edge
After 2nd
Read
tWCKF
FF
tCKAF
AFF
Figure 2-63 • FIFO FULL Flag and AFULL Flag Deassertion
Revision 4
2- 77
Device Architecture
Timing Characteristics
Table 2-35 • FIFO
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tENS
REN, WEN Setup time
1.34
1.52
1.79
ns
tENH
REN, WEN Hold time
0.00
0.00
0.00
ns
tBKS
BLK Setup time
0.19
0.22
0.26
ns
tBKH
BLK Hold time
0.00
0.00
0.00
ns
tDS
Input data (WD) Setup time
0.18
0.21
0.25
ns
tDH
Input data (WD) Hold time
0.00
0.00
0.00
ns
tCKQ1
Clock High to New Data Valid on RD (flow-through)
2.17
2.47
2.90
ns
tCKQ2
Clock High to New Data Valid on RD (pipelined)
0.94
1.07
1.26
ns
tRCKEF
RCLK High to Empty Flag Valid
1.72
1.96
2.30
ns
tWCKFF
WCLK High to Full Flag Valid
1.63
1.86
2.18
ns
tCKAF
Clock High to Almost Empty/Full Flag Valid
6.19
7.05
8.29
ns
tRSTFG
RESET Low to Empty/Full Flag Valid
1.69
1.93
2.27
ns
tRSTAF
RESET Low to Almost-Empty/Full Flag Valid
6.13
6.98
8.20
ns
tRSTBQ
RESET Low to Data out Low on RD (flow-through)
0.92
1.05
1.23
ns
RESET Low to Data out Low on RD (pipelined)
0.92
1.05
1.23
ns
tREMRSTB
RESET Removal
0.29
0.33
0.38
ns
tRECRSTB
RESET Recovery
1.50
1.71
2.01
ns
tMPWRSTB
RESET Minimum Pulse Width
0.21
0.24
0.29
ns
tCYC
Clock Cycle time
3.23
3.68
4.32
ns
FMAX
Maximum Frequency for FIFO
310
272
231
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 78
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Analog Block
With the Fusion family, Microsemi has introduced the world's first mixed-mode FPGA solution.
Supporting a robust analog peripheral mix, Fusion devices will support a wide variety of applications. It is
this Analog Block that separates Fusion from all other FPGA solutions on the market today.
By combining both flash and high-speed CMOS processes in a single chip, these devices offer the best
of both worlds. The high-performance CMOS is used for building RAM resources. These highperformance structures support device operation up to 350 MHz. Additionally, the advanced Microsemi
0.13 µm flash process incorporates high-voltage transistors and a high-isolation, triple-well process. Both
of these are suited for the flash-based programmable logic and nonvolatile memory structures.
High-voltage transistors support the integration of analog technology in several ways. They aid in noise
immunity so that the analog portions of the chip can be better isolated from the digital portions,
increasing analog accuracy. Because they support high voltages, Microsemi flash FPGAs can be
connected directly to high-voltage input signals, eliminating the need for external resistor divider
networks, reducing component count, and increasing accuracy. By supporting higher internal voltages,
the Microsemi advanced flash process enables high dynamic range on analog circuitry, increasing
precision and signal–noise ratio. Microsemi flash FPGAs also drive high-voltage outputs, eliminating the
need for external level shifters and drivers.
The unique triple-well process enables the integration of high-performance analog features with
increased noise immunity and better isolation. By increasing the efficiency of analog design, the triplewell process also enables a smaller overall design size, reducing die size and cost.
The Analog Block consists of the Analog Quad I/O structure, RTC (for details refer to the "Real-Time
Counter System" section on page 2-33), ADC, and ACM. All of these elements are combined in the
single Analog Block macro, with which the user implements this functionality (Figure 2-64).
The Analog Block needs to be reset/reinitialized after the core powers up or the device is programmed.
An external reset/initialize signal, which can come from the internal voltage regulator when it powers up,
must be applied.
Revision 4
2- 79
Device Architecture
VAREF
ADCGNDREF
AV0
AC0
AT0
DAVOUT0
DACOUT0
DATOUT0
AV9
AC9
AT9
ATRETURN01
DAVOUT9
DACOUT9
DATOUT9
AG0
AG1
ATRETURN9
DENAV0
DENAC0
DENAT0
AG9
DENAV0
DENAC0
DENAT0
CMSTB0
CSMTB9
GDON0
GDON9
TMSTB0
TMSTB9
MODE[3:0]
TVC[7:0]
STC[7:0]
CHNUMBER[4:0]
BUSY
CALIBRATE
DATAVALID
SAMPLE
TMSTINT
ADCSTART
VAREFSEL
PWRDWN
ADCRESET
RESULT[11:0]
RTCMATCH
RTCXTLMODE
RTCXTLSEL
RTCPSMMATCH
RTCCLK
SYSCLK
ACMWEN
ACMRESET
ACMWDATA
ACMADDR
ACMCLK
ACMRDATA[7:0]
AB
Figure 2-64 • Analog Block Macro
2- 80
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-36 describes each pin in the Analog Block. Each function within the Analog Block will be
explained in detail in the following sections.
Table 2-36 • Analog Block Pin Description
Signal Name
Number
of Bits
Direction
Function
Input/Output Voltage reference for ADC
Location of
Details
VAREF
1
ADC
ADCGNDREF
1
Input
External ground reference
ADC
MODE[3:0]
4
Input
ADC operating mode
ADC
SYSCLK
1
Input
External system clock
TVC[7:0]
8
Input
Clock divide control
ADC
STC[7:0]
8
Input
Sample time control
ADC
ADCSTART
1
Input
Start of conversion
ADC
PWRDWN
1
Input
ADC comparator power-down if 1.
When asserted, the ADC will stop
functioning, and the digital portion of
the analog block will continue
operating. This may result in invalid
status flags from the analog block.
Therefore,
Microsemi
does
not
recommend asserting the PWRDWN
pin.
ADC
ADCRESET
1
Input
ADC resets and disables Analog Quad
– active high
ADC
BUSY
1
Output
1 – Running conversion
ADC
CALIBRATE
1
Output
1 – Power-up calibration
ADC
DATAVALID
1
Output
1 – Valid conversion result
ADC
RESULT[11:0]
12
Output
Conversion result
ADC
TMSTBINT
1
Input
Internal temp. monitor strobe
ADC
SAMPLE
1
Output
1 – An analog signal is actively being
sampled (stays high during signal
acquisition only)
ADC
0 – No analog signal is being sampled
VAREFSEL
1
Input
0 = Output internal voltage reference
(2.56 V) to VAREF
ADC
1 = Input external voltage reference
from VAREF and ADCGNDREF
CHNUMBER[4:0]
5
Input
Analog input channel select
ACMCLK
1
Input
ACM clock
ACM
ACMWEN
1
Input
ACM write enable – active high
ACM
ACMRESET
1
Input
ACM reset – active low
ACM
ACMWDATA[7:0]
8
Input
ACM write data
ACM
ACMRDATA[7:0]
8
Output
ACM read data
ACM
ACMADDR[7:0]
8
Input
ACM address
ACM
CMSTB0 to CMSTB9
10
Input
Current monitor strobe – 1 per quad, Analog Quad
active high
Revision 4
Input
multiplexer
2- 81
Device Architecture
Table 2-36 • Analog Block Pin Description (continued)
Number
of Bits
Direction
GDON0 to GDON9
10
Input
Control to power MOS – 1 per quad
TMSTB0 to TMSTB9
10
Input
Temperature monitor strobe – 1 per Analog Quad
quad; active high
DAVOUT0, DACOUT0, DATOUT0
to
DAVOUT9, DACOUT9, DATOUT9
30
Output
DENAV0, DENAC0, DENAT0 to
DENAV9, DENAC9, DENAT9
30
AV0
Signal Name
Function
Location of
Details
Analog Quad
Digital outputs – 3 per quad
Analog Quad
Input
Digital input enables – 3 per quad
Analog Quad
1
Input
Analog Quad 0
Analog Quad
AC0
1
Input
Analog Quad
AG0
1
Output
Analog Quad
AT0
1
Input
Analog Quad
ATRETURN01
1
Input
Temperature monitor return shared by Analog Quad
Analog Quads 0 and 1
AV1
1
Input
Analog Quad 1
AC1
1
Input
Analog Quad
AG1
1
Output
Analog Quad
AT1
1
Input
Analog Quad
AV2
1
Input
AC2
1
Input
Analog Quad
AG2
1
Output
Analog Quad
AT2
1
Input
Analog Quad
ATRETURN23
1
Input
Temperature monitor return shared by Analog Quad
Analog Quads 2 and 3
AV3
1
Input
Analog Quad 3
AC3
1
Input
Analog Quad
AG3
1
Output
Analog Quad
AT3
1
Input
Analog Quad
AV4
1
Input
AC4
1
Input
Analog Quad
AG4
1
Output
Analog Quad
AT4
1
Input
Analog Quad
ATRETURN45
1
Input
Temperature monitor return shared by Analog Quad
Analog Quads 4 and 5
AV5
1
Input
Analog Quad 5
AC5
1
Input
Analog Quad
AG5
1
Output
Analog Quad
AT5
1
Input
Analog Quad
AV6
1
Input
AC6
1
Input
2- 82
Analog Quad 2
Analog Quad 4
Analog Quad 6
Analog Quad
Analog Quad
Analog Quad
Analog Quad
Analog Quad
Analog Quad
Analog Quad
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-36 • Analog Block Pin Description (continued)
Number
of Bits
Direction
AG6
1
Output
Analog Quad
AT6
1
Input
Analog Quad
ATRETURN67
1
Input
Temperature monitor return shared by Analog Quad
Analog Quads 6 and 7
AV7
1
Input
Analog Quad 7
AC7
1
Input
Analog Quad
AG7
1
Output
Analog Quad
AT7
1
Input
Analog Quad
AV8
1
Input
AC8
1
Input
Analog Quad
AG8
1
Output
Analog Quad
AT8
1
Input
Analog Quad
ATRETURN89
1
Input
Temperature monitor return shared by Analog Quad
Analog Quads 8 and 9
AV9
1
Input
Analog Quad 9
AC9
1
Input
Analog Quad
AG9
1
Output
Analog Quad
AT9
1
Input
Analog Quad
RTCMATCH
1
Output
MATCH
RTC
RTCPSMMATCH
1
Output
MATCH connected to VRPSM
RTC
RTCXTLMODE[1:0]
2
Output
Drives XTLOSC RTCMODE[1:0] pins
RTC
RTCXTLSEL
1
Output
Drives XTLOSC MODESEL pin
RTC
RTCCLK
1
Input
RTC clock input
RTC
Signal Name
Function
Analog Quad 8
Location of
Details
Analog Quad
Analog Quad
Analog Quad
Analog Quad
With the Fusion family, Microsemi introduces the Analog Quad, shown in Figure 2-65 on page 2-84, as
the basic analog I/O structure. The Analog Quad is a four-channel system used to precondition a set of
analog signals before sending it to the ADC for conversion into a digital signal. To maximize the
usefulness of the Analog Quad, the analog input signals can also be configured as LVTTL digital input
signals. The Analog Quad is divided into four sections.
The first section is called the Voltage Monitor Block, and its input pin is named AV. It contains a twochannel analog multiplexer that allows an incoming analog signal to be routed directly to the ADC or
allows the signal to be routed to a prescaler circuit before being sent to the ADC. The prescaler can be
configured to accept analog signals between –12 V and 0 or between 0 and +12 V. The prescaler circuit
scales the voltage applied to the ADC input pad such that it is compatible with the ADC input voltage
range. The AV pin can also be used as a digital input pin.
The second section of the Analog Quad is called the Current Monitor Block. Its input pin is named AC.
The Current Monitor Block contains all the same functions as the Voltage Monitor Block with one
addition, which is a current monitoring function. A small external current sensing resistor (typically less
than 1 ) is connected between the AV and AC pins and is in series with a power source. The Current
Monitor Block contains a current monitor circuit that converts the current through the external resistor to
a voltage that can then be read using the ADC.
Revision 4
2- 83
Device Architecture
The third part of the Analog Quad is called the Gate Driver Block, and its output pin is named AG. This
section is used to drive an external FET. There are two modes available: a High Current Drive mode and
a Current Source Control mode. Both negative and positive voltage polarities are available, and in the
current source control mode, four different current levels are available.
The fourth section of the Analog Quad is called the Temperature Monitor Block, and its input pin name is
AT. This block is similar to the Voltage Monitor Block, except that it has an additional function: it can be
used to monitor the temperature of an external diode-connected transistor. It has a modified prescaler
and is limited to positive voltages only.
The Analog Quad can be configured during design time by Libero SoC; however, the ACM can be used
to change the parameters of any of these I/Os during runtime. This type of change is referred to as a
context switch. The Analog Quad is a modular structure that is replicated to generate the analog I/O
resources. Each Fusion device supports between 5 and 10 Analog Quads.
The analog pads are numbered to clearly identify both the type of pad (voltage, current, gate driver, or
temperature pad) and its corresponding Analog Quad (AV0, AC0, AG0, AT0, AV1, …, AC9, AG9, and
AT9). There are three types of input pads (AVx, ACx, and ATx) and one type of analog output pad (AGx).
Since there can be up to 10 Analog Quads on a device, there can be a maximum of 30 analog input pads
and 10 analog output pads.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor/Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
Figure 2-65 • Analog Quad
2- 84
Digital
Input
R e visio n 4
To FPGA
(DATOUTx)
To Analog MUX
Fusion Family of Mixed Signal FPGAs
Voltage Monitor
The Fusion Analog Quad offers a robust set of voltage-monitoring capabilities unique in the FPGA
industry. The Analog Quad comprises three analog input pads— Analog Voltage (AV), Analog Current
(AC), and Analog Temperature (AT)—and a single gate driver output pad, Analog Gate (AG). There are
many common characteristics among the analog input pads. Each analog input can be configured to
connect directly to the input MUX of the ADC. When configured in this manner (Figure 2-66), there will be
no prescaling of the input signal. Care must be taken in this mode not to drive the ADC into saturation by
applying an input voltage greater than the reference voltage. The internal reference voltage of the ADC is
2.56 V. Optionally, an external reference can be supplied by the user. The external reference can be a
maximum of 3.3 V DC.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-66 • Analog Quad Direct Connect
Revision 4
2- 85
Device Architecture
The Analog Quad offers a wide variety of prescaling options to enable the ADC to resolve the input
signals. Figure 2-67 shows the path through the Analog Quad for a signal that is to be prescaled prior to
conversion. The ADC internal reference voltage and the prescaler factors were selected to make both
prescaling and postscaling of the signals easy binary calculations (refer to Table 2-57 on page 2-133 for
details). When an analog input pad is configured with a prescaler, there will be a 1 M resistor to ground.
This occurs even when the device is in power-down mode. In low power standby or sleep mode (VCC is
OFF, VCC33A is ON, VCCI is ON) or when the resource is not used, analog inputs are pulled down to
ground through a 1 M resistor. The gate driver output is floating (or tristated), and there is no extra
current on VCC33A.
These scaling factors hold true whether the particular pad is configured to accept a positive or negative
voltage. Note that whereas the AV and AC pads support the same prescaling factors, the AT pad
supports a reduced set of prescaling factors and supports positive voltages only.
Typical scaling factors are given in Table 2-57 on page 2-133, and the gain error (which contributes to the
minimum and maximum) is in Table 2-49 on page 2-120.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
Figure 2-67 • Analog Quad Prescaler Input Configuration
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Digital
Input
R e visio n 4
To FPGA
(DATOUTx)
To Analog MUX
Fusion Family of Mixed Signal FPGAs
Terminology
BW – Bandwidth
BW is a range of frequencies that a Channel can handle.
Channel
A channel is define as an analog input configured as one of the Prescaler range shown in Table 2-57 on
page 2-133. The channel includes the Prescaler circuit and the ADC.
Channel Gain
Channel Gain is a measured of the deviation of the actual slope from the ideal slope. The slope is
measured from the 20% and 80% point.
Gain actual
Gain = ------------------------Gain ideal
EQ 1
Channel Gain Error
Channel Gain Error is a deviation from the ideal slope of the transfer function. The Prescaler Gain Error
is expressed as the percent difference between the actual and ideal, as shown in EQ 2.
Error Gain = (1-Gain)  100%
EQ 2
Channel Input Offset Error
Channel Offset error is measured as the input voltage that causes the transition from zero to a count of
one. An Ideal Prescaler will have offset equal to ½ of LSB voltage. Offset error is a positive or negative
when the first transition point is higher or lower than ideal. Offset error is expressed in LSB or input
voltage.
Total Channel Error
Total Channel Error is defined as the total error measured compared to the ideal value. Total Channel
Error is the sum of gain error and offset error combined. Figure 2-68 shows how Total Channel Error is
measured.
al
O
ut
pu
t
ADC Output Code
Total Channel Error is defined as the difference between the actual ADC output and ideal ADC output. In
the example shown in Figure 2-68, the Total Channel Error would be a negative number.
C hannel G ain
Id
e
Actual Output
T otal C hannel Er r or
}
Channel Input
Offset Error
Input Voltage to Prescaler
Figure 2-68 • Total Channel Error Example
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Device Architecture
Direct Digital Input
The AV, AC, and AT pads can also be configured as high-voltage digital inputs (Figure 2-69). As these
pads are 12 V–tolerant, the digital input can also be up to 12 V. However, the frequency at which these
pads can operate is limited to 10 MHz.
To enable one of these analog input pads to operate as a digital input, its corresponding Digital Input
Enable (DENAxy) pin on the Analog Block must be pulled High, where x is either V, C, or T (for AV, AC,
or AT pads, respectively) and y is in the range 0 to 9, corresponding to the appropriate Analog Quad.
When the pad is configured as a digital input, the signal will come out of the Analog Block macro on the
appropriate DAxOUTy pin, where x represents the pad type (V for AV pad, C for AC pad, or T for AT pad)
and y represents the appropriate Analog Quad number. Example: If the AT pad in Analog Quad 5 is
configured as a digital input, it will come out on the DATOUT5 pin of the Analog Block macro.
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
Current
Monitor Block
AT
Gate
Driver
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
Figure 2-69 • Analog Quad Direct Digital Input Configuration
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Digital
Input
R e visio n 4
To FPGA
(DATOUTx)
To Analog MUX
Fusion Family of Mixed Signal FPGAs
Current Monitor
The Fusion Analog Quad is an excellent element for voltage- and current-monitoring applications. In
addition to supporting the same functionality offered by the AV pad, the AC pad can be configured to
monitor current across an external sense resistor (Figure 2-70). To support this current monitor function,
a differential amplifier with 10x gain passes the amplified voltage drop between the AV and AC pads to
the ADC. The amplifier enables the user to use very small resistor values, thereby limiting any impact on
the circuit. This function of the AC pad does not limit AV pad operation. The AV pad can still be
configured for use as a direct voltage input or scaled through the AV prescaler independently of it’s use
as an input to the AC pad’s differential amplifier.
Power
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-70 • Analog Quad Current Monitor Configuration
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Device Architecture
To initiate a current measurement, the appropriate Current Monitor Strobe (CMSTB) signal on the AB
macro must be asserted low for at least tCMSLO in order to discharge the previous measurement. Then
CMSTB must be asserted high for at least tCMSET prior to asserting the ADCSTART signal. The CMSTB
must remain high until after the SAMPLE signal is de-asserted by the AB macro. Note that the minimum
sample time cannot be less than tCMSHI. Figure 2-71 shows the timing diagram of CMSTB in relationship
with the ADC control signals.
tCMSHI
CMSTBx
tCMSLO
tCMSET
VADC
ADCSTART can be asserted
after this point to start ADC
sampling.
ADCSTART
Figure 2-71 • Timing Diagram for Current Monitor Strobe
Figure 2-72 illustrates positive current monitor operation. The differential voltage between AV and AC
goes into the 10× amplifier and is then converted by the ADC. For example, a current of 1.5 A is drawn
from a 10 V supply and is measured by the voltage drop across a 0.050  sense resistor, The voltage
drop is amplified by ten times by the amplifier and then measured by the ADC. The 1.5 A current creates
a differential voltage across the sense resistor of 75 mV. This becomes 750 mV after amplification. Thus,
the ADC measures a current of 1.5 A as 750 mV. Using an ADC with 8-bit resolution and VAREF of 2.56
V, the ADC result is decimal 75. EQ 3 shows how to compute the current from the ADC result.
N
I =  ADC  V AREF    10  2  R sense 
EQ 3
where
I is the current flowing through the sense resistor
ADC is the result from the ADC
VAREF is the Reference voltage
N is the number of bits
Rsense is the resistance of the sense resistor
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R e visio n 4
Fusion Family of Mixed Signal FPGAs
0-12 V
AVx
I
RSENSE
ACx
CMSTBx
10 X
VADC to Analog MUX
(refer Table 2-36
for MUX channel
number)
Current Monitor
Figure 2-72 • Positive Current Monitor
Care must be taken when choosing the right resistor for current measurement application. Note that
because of the 10× amplification, the maximum measurable difference between the AV and AC pads is
VAREF / 10. A larger AV-to-AC voltage drop will result in ADC saturation; that is, the digital code put out by
the ADC will stay fixed at the full scale value. Therefore, the user must select the external sense resistor
appropriately. Table 2-38 shows recommended resistor values for different current measurement ranges.
When choosing resistor values for a system, there is a trade-off between measurement accuracy and
power consumption. Choosing a large resistor will increase the voltage drop and hence increase
accuracy of the measurement; however the larger voltage drop dissipates more power (P = I2 × R).
The Current Monitor is a unipolar system, meaning that the differential voltage swing must be from 0 V to
VAREF /10. Therefore, the Current Monitor only supports differential voltage where |VAV-VAC| is greater
than 0 V. This results in the requirement that the potential of the AV pad must be larger than the potential
of the AC pad. This is straightforward for positive voltage systems. For a negative voltage system, it
means that the AV pad must be "more negative" than the AC pad. This is shown in Figure 2-73.
In this case, both the AV pad and the AC pad are configured for negative operations and the output of the
differential amplifier still falls between 0 V and VAREF as required.
Revision 4
2- 91
Device Architecture
Table 2-37 • Recommended Resistor for Different Current Range Measurement
Current Range
Recommended Minimum Resistor Value (Ohms)
> 5 mA – 10 mA
10 – 20
> 10 mA – 20 mA
5 – 10
> 20 mA – 50 mA
2.5 – 5
> 50 mA – 100 mA
1–2
> 100 mA – 200 mA
0.5 – 1
> 200 mA – 500 mA
0.3 – 0.5
> 500 mA – 1 A
0.1 – 0.2
>1A–2A
0.05 – 0.1
>2A–4A
0.025 – 0.05
>4A–8A
0.0125 – 0.025
> 8 A – 12 A
0.00625 – 0.02
RSENSE
0 to
–10.5 V
AVx
I
ACx
CMSTBx
10 X
VADC
to Analog MUX
(see Table 2-36
for MUXchannel
number)
Current Monitor
Figure 2-73 • Negative Current Monitor
Terminology
Accuracy
The accuracy of Fusion Current Monitor is ±2 mV minimum plus 5% of the differential voltage at the
input. The input accuracy can be translated to error at the ADC output by using EQ 4. The 10 V/V gain is
the gain of the Current Monitor Circuit, as described in the "Current Monitor" section on page 2-89. For 8bit mode, N = 8, VAREF= 2.56 V, zero differential voltage between AV and AC, the Error (EADC) is equal to
2 LSBs.
N
2
E ADC =  2mV + 0.05 V AV – V AC    10V   V  ----------------V AREF
EQ 4
where
N is the number of bits
VAREF is the Reference voltage
VAV is the voltage at AV pad
VAC is the voltage at AC pad
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R e visio n 4
Fusion Family of Mixed Signal FPGAs
Gate Driver
The Fusion Analog Quad includes a Gate Driver connected to the Quad's AG pin (Figure 2-74).
Designed to work with external p- or n-channel MOSFETs, the Gate driver is a configurable current sink
or source and requires an external pull-up or pull-down resistor. The AG supports 4 selectable gate drive
levels: 1 µA, 3 µA, 10 µA, and 30 µA (Figure 2-75 on page 2-94). The AG also supports a High Current
Drive mode in which it can sink 20 mA; in this mode the switching rate is approximately 1.3 MHz with
100 ns turn-on time and 600 ns turn-off time. Modeled on an open-drain-style output, it does not output a
voltage level without an appropriate pull-up or pull-down resistor. If 1 V is forced on the drain, the current
sinking/sourcing will exceed the ability of the transistor, and the device could be damaged.
The AG pad is turned on via the corresponding GDONx pin in the Analog Block macro, where x is the
number of the corresponding Analog Quad for the AG pad to be enabled (GDON0 to GDON9).
Power
Line Side
Load Side
Off-Chip
Rpullup
AV
Pads
AC
Voltage
Monitor Block
AG
AT
Gate
Driver
Current
Monitor Block
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Digital
Input
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-74 • Gate Driver
The gate-to-source voltage (Vgs) of the external MOSFET is limited to the programmable drive current
times the external pull-up or pull-down resistor value (EQ 5).
Vgs  Ig × (Rpullup or Rpulldown)
EQ 5
The rate at which the gate voltage of the external MOSFET slews is determined by the current, Ig,
sourced or sunk by the AG pin and the gate-to-source capacitance, CGS, of the external MOSFET. As an
approximation, the slew rate is given by EQ 6.
dv/dt = Ig / CGS
EQ 6
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Device Architecture
CGS is not a fixed capacitance but, depending on the circuitry connected to its drain terminal, can vary
significantly during the course of a turn-on or turn-off transient. Thus, EQ 6 on page 2-93 can only be
used for a first-order estimate of the switching speed of the external MOSFET.
High
Current
1 μA
3 μA
10 μA
30 μA
AG
High
Current
1 μA
3 μA
10 μA
Figure 2-75 • Gate Driver Example
2- 94
R e visio n 4
30 μA
Fusion Family of Mixed Signal FPGAs
Temperature Monitor
The final pin in the Analog Quad is the Analog Temperature (AT) pin. The AT pin is used to implement an
accurate temperature monitor in conjunction with an external diode-connected bipolar transistor
(Figure 2-76). For improved temperature measurement accuracy, it is important to use the ATRTN pin for
the return path of the current sourced by the AT pin. Each ATRTN pin is shared between two adjacent
Analog Quads. Additionally, if not used for temperature monitoring, the AT pin can provide functionality
similar to that of the AV pad. However, in this mode only positive voltages can be applied to the AT pin,
and only two prescaler factors are available (16 V and 4 V ranges—refer to Table 2-57 on page 2-133).
Discrete
Bipolar
Transistor
Off-Chip
AV
Pads
AC
Voltage
Monitor Block
AG
Gate
Driver
Current
Monitor Block
ATRTN
AT
Temperature
Monitor Block
On-Chip
Analog Quad
Prescaler
Prescaler
Prescaler
Power
MOSFET
Gate Driver
Digital
Input
Digital
Input
Current
Monitor / Instr
Amplifier
To FPGA
(DAVOUTx)
To Analog MUX
Digital
Input
Temperature
Monitor
To FPGA
(DACOUTx)
From FPGA
(GDONx)
To Analog MUX
To FPGA
(DATOUTx)
To Analog MUX
Figure 2-76 • Temperature Monitor Quad
Revision 4
2- 95
Device Architecture
Fusion uses a remote diode as a temperature sensor. The Fusion Temperature Monitor uses a
differential input; the AT pin and ATRTN (AT Return) pin are the differential inputs to the Temperature
Monitor. There is one Temperature Monitor in each Quad. A simplified block diagram is shown in
Figure 2-77.
VDD33A
10 μA
100 μA
TMSTBx
+
ATx
+
VADC
12.5 X
∆V
–
–
to Analog MUX
(refer Table 2-36
for MUX Channel
Number)
ATRTNxy
Figure 2-77 • Block Diagram for Temperature Monitor Circuit
The Fusion approach to measuring temperature is forcing two different currents through the diode with a
ratio of 10:1. The switch that controls the different currents is controlled by the Temperature Monitor
Strobe signal, TMSTB. Setting TMSTB to '1' will initiate a Temperature reading. The TMSTB should
remain '1' until the ADC finishes sampling the voltage from the Temperature Monitor. The minimum
sample time for the Temperature Monitor cannot be less than the minimum strobe high time minus the
setup time. Figure 2-78 shows the timing diagram.
tTMSHI
TMSTBx
tTMSLO
tTMSSET
VADC
ADC should start
sampling at this point
ADCSTART
Figure 2-78 • Timing Diagram for the Temperature Monitor Strobe Signal
Note: When the IEEE 1149.1 Boundary Scan EXTEST instruction is executed, the AG pad drive
strength ceases and becomes a 1 µA sink into the Fusion device.
2- 96
R e visio n 4
Fusion Family of Mixed Signal FPGAs
The diode’s voltage is measured at each current level and the temperature is calculated based on EQ 7.
kT I TMSLO
V TMSLO – V TMSHI = n -------  ln -----------------
q  I TMSHI 
EQ 7
where
ITMSLO is the current when the Temperature Strobe is Low, typically 100 µA
ITMSHI is the current when the Temperature Strobe is High, typically 10 µA
VTMSLO is diode voltage while Temperature Strobe is Low
VTMSHI is diode voltage while Temperature Strobe is High
n is the non-ideality factor of the diode-connected transistor. It is typically 1.004 for the Microsemirecommended transistor type 2N3904.
K = 1.3806 x 10-23 J/K is the Boltzman constant
Q = 1.602 x 10-19 C is the charge of a proton
When ITMSLO / ITMSHI = 10, the equation can be simplified as shown in EQ 8.
–4
V = V TMSLO – V TMSHI = 1.986  10 nT
EQ 8
In the Fusion TMB, the ideality factor n for 2N3904 is 1.004 and V is amplified 12.5 times by an internal
amplifier; hence the voltage before entering the ADC is as given in EQ 9.
V ADC = V  12.5 = 2.5 mV   K  T 
EQ 9
This means the temperature to voltage relationship is 2.5 mV per degree Kelvin. The unique design of
Fusion has made the Temperature Monitor System simple for the user. When the 10-bit mode ADC is
used, each LSB represents 1 degree Kelvin, as shown in EQ 10. That is, e. 25°C is equal to 293°K and is
represented by decimal 293 counts from the ADC.
10
2
1K = 2.5 mV  ----------------- = 1 LSB
2.56 V
EQ 10
If 8-bit mode is used for the ADC resolution, each LSB represents 4 degrees Kelvin; however, the
resolution remains as 1 degree Kelvin per LSB, even for 12-bit mode, due to the Temperature Monitor
design. An example of the temperature data format for 10-bit mode is shown in Table 2-38.
Table 2-38 • Temperature Data Format
Temperature (K)
Digital Output
(ADC 10-bit mode)
–40°C
233
00 1110 1001
–20°C
253
00 1111 1101
0°C
273
01 0001 0001
1°C
274
01 0001 0010
10 °C
283
01 0001 1011
25°C
298
01 0010 1010
50 °C
323
01 0100 0011
85 °C
358
01 0110 0110
Temperature
Revision 4
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Device Architecture
Terminology
Resolution
Resolution defines the smallest temperature change Fusion Temperature Monitor can resolve. For ADC
configured as 8-bit mode, each LSB represents 4°C, and 1°C per LSB for 10-bit mode. With 12-bit mode,
the Temperature Monitor can still only resolve 1°C due to Temperature Monitor design.
Offset
The Fusion Temperature Monitor has a systematic offset (Table 2-49 on page 2-120), excluding error due
to board resistance and ideality factor of the external diode. Microsemi provides an IP block (CalibIP) that
is required in order to mitigate the systematic temperature offset. For further details on CalibIP, refer to
the "Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion
FPGA Fabric User's Guide.
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R e visio n 4
Fusion Family of Mixed Signal FPGAs
Analog-to-Digital Converter Block
At the heart of the Fusion analog system is a programmable Successive Approximation Register (SAR)
ADC. The ADC can support 8-, 10-, or 12-bit modes of operation. In 12-bit mode, the ADC can resolve
500 ksps. All results are MSB-justified in the ADC. The input to the ADC is a large 32:1 analog input
multiplexer. A simplified block diagram of the Analog Quads, analog input multiplexer, and ADC is shown
in Figure 2-79. The ADC offers multiple self-calibrating modes to ensure consistent high performance
both at power-up and during runtime.
VCC (1.5 V)
0
Pads
AV0
AC0
AG0
AT0
ATRETURN01
AV1
AC1
AG1
AT1
AV2
AC2
AG2
AT2
ATRETURN23
AV3
AC3
AG3
AT3
AV4
AC4
AG4
AT4
ATRETURN45
AV5
AC5
AG5
AT5
AV6
AC6
AG6
AT6
ATRETURN67
AV7
AC7
AG7
AT7
AV8
AC8
AG8
AT8
ATRETURN89
AV9
AC9
AG9
AT9
1
Analog
Quad 0
These are hardwired
connections within
Analog Quad.
Analog
Quad 1
Analog
Quad 2
Analog
Quad 3
Analog
Quad 4
Analog MUX
(32 to 1)
Analog
Quad 5
12
ADC
Digital Output to FPGA
Analog
Quad 6
Analog
Quad 7
Analog
Quad 8
Analog
Quad 9
31
Temperature
Monitor
CHNUMBER[4:0]
Internal Diode
Figure 2-79 • ADC Block Diagram
Revision 4
2- 99
Device Architecture
ADC Description
The Fusion ADC is a 12-bit SAR ADC. It offers a wide variety of features for different use models.
Figure 2-80 shows a block diagram of the Fusion ADC.
•
Configurable resolution: 8-bit, 10-bit, and 12-bit mode
•
DNL: 0.6 LSB for 10-bit mode
•
INL: 0.4 LSB for 10-bit mode
•
No missing code
•
Internal VAREF = 2.56 V
•
Maximum Sample Rate = 600 Ksps
•
Power-up calibration and dynamic calibration after every sample to compensate for temperature
drift over time
CALIBRATE
SAMPLE
BUSY
DATAVALID
VAREF
Analog
MUX
Signals from
Analog Quads
STATUS
32
12
SAR ADC
CHNUMBER
STC
SYSCLK
TVC
RESULT
MODE
ADCCLK
Figure 2-80 • ADC Simplified Block Diagram
ADC Theory of Operation
An analog-to-digital converter is used to capture discrete samples of a continuous analog voltage and
provide a discrete binary representation of the signal. Analog-to-digital converters are generally
characterized in three ways:
•
Input voltage range
•
Resolution
•
Bandwidth or conversion rate
The input voltage range of an ADC is determined by its reference voltage (VREF). Fusion devices
include an internal 2.56 V reference, or the user can supply an external reference of up to 3.3 V. The
following examples use the internal 2.56 V reference, so the full-scale input range of the ADC is 0 to
2.56 V.
The resolution (LSB) of the ADC is a function of the number of binary bits in the converter. The ADC
approximates the value of the input voltage using 2n steps, where n is the number of bits in the converter.
Each step therefore represents VREF÷ 2n volts. In the case of the Fusion ADC configured for 12-bit
operation, the LSB is 2.56 V / 4096 = 0.625 mV.
Finally, bandwidth is an indication of the maximum number of conversions the ADC can perform each
second. The bandwidth of an ADC is constrained by its architecture and several key performance
characteristics.
2- 10 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
There are several popular ADC architectures, each with advantages and limitations. The analog-to-digital
converter in Fusion devices is a switched-capacitor Successive Approximation Register (SAR) ADC. It
supports 8-, 10-, and 12-bit modes of operation with a cumulative sample rate up to 600 k samples per
second (ksps). Built-in bandgap circuitry offers 1% internal voltage reference accuracy or an external
reference voltage can be used.
As shown in Figure 2-81, a SAR ADC contains N capacitors with binary-weighted values.
Comparator
C
C/2
VIN
VREF
C / 2N–2
C/4
C / 2N–1
Figure 2-81 • Example SAR ADC Architecture
To begin a conversion, all of the capacitors are quickly discharged. Then VIN is applied to all the
capacitors for a period of time (acquisition time) during which the capacitors are charged to a value very
close to VIN. Then all of the capacitors are switched to ground, and thus –VIN is applied across the
comparator. Now the conversion process begins. First, C is switched to VREF. Because of the binary
weighting of the capacitors, the voltage at the input of the comparator is then shown by EQ 11.
Voltage at input of comparator = –VIN + VREF / 2
EQ 11
If VIN is greater than VREF / 2, the output of the comparator is 1; otherwise, the comparator output is 0.
A register is clocked to retain this value as the MSB of the result. Next, if the MSB is 0, C is switched
back to ground; otherwise, it remains connected to VREF, and C / 2 is connected to VREF. The result at
the comparator input is now either –VIN + VREF / 4 or –VIN + 3 VREF / 4 (depending on the state of the
MSB), and the comparator output now indicates the value of the next most significant bit. This bit is
likewise registered, and the process continues for each subsequent bit until a conversion is completed.
The conversion process requires some acquisition time plus N + 1 ADC clock cycles to complete.
Revision 4
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Device Architecture
This process results in a binary approximation of VIN. Generally, there is a fixed interval T, the sampling
period, between the samples. The inverse of the sampling period is often referred to as the sampling
frequency fS = 1 / T. The combined effect is illustrated in Figure 2-82.
L SB
T
Figure 2-82 • Conversion Example
Figure 2-82 demonstrates that if the signal changes faster than the sampling rate can accommodate, or if
the actual value of VIN falls between counts in the result, this information is lost during the conversion.
There are several techniques that can be used to address these issues.
First, the sampling rate must be chosen to provide enough samples to adequately represent the input
signal. Based on the Nyquist-Shannon Sampling Theorem, the minimum sampling rate must be at least
twice the frequency of the highest frequency component in the target signal (Nyquist Frequency). For
example, to recreate the frequency content of an audio signal with up to 22 KHz bandwidth, the user
must sample it at a minimum of 44 ksps. However, as shown in Figure 2-82, significant post-processing
of the data is required to interpolate the value of the waveform during the time between each sample.
Similarly, to re-create the amplitude variation of a signal, the signal must be sampled with adequate
resolution. Continuing with the audio example, the dynamic range of the human ear (the ratio of the
amplitude of the threshold of hearing to the threshold of pain) is generally accepted to be 135 dB, and the
dynamic range of a typical symphony orchestra performance is around 85 dB. Most commercial
recording media provide about 96 dB of dynamic range using 16-bit sample resolution. But 16-bit fidelity
does not necessarily mean that you need a 16-bit ADC. As long as the input is sampled at or above the
Nyquist Frequency, post-processing techniques can be used to interpolate intermediate values and
reconstruct the original input signal to within desired tolerances.
If sophisticated digital signal processing (DSP) capabilities are available, the best results are obtained by
implementing a reconstruction filter, which is used to interpolate many intermediate values with higher
resolution than the original data. Interpolating many intermediate values increases the effective number
of samples, and higher resolution increases the effective number of bits in the sample. In many cases,
however, it is not cost-effective or necessary to implement such a sophisticated reconstruction algorithm.
For applications that do not require extremely fine reproduction of the input signal, alternative methods
can enhance digital sampling results with relatively simple post-processing. The details of such
techniques are out of the scope of this chapter; refer to the Improving ADC Results through
Oversampling and Post-Processing of Data white paper for more information.
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Fusion Family of Mixed Signal FPGAs
ADC Terminology
Conversion Time
Conversion time is the interval between the release of the hold state (imposed by the input circuitry of a
track-and-hold) and the instant at which the voltage on the sampling capacitor settles to within one LSB
of a new input value.
DNL – Differential Non-Linearity
For an ideal ADC, the analog-input levels that trigger any two successive output codes should differ by
one LSB (DNL = 0). Any deviation from one LSB in defined as DNL (Figure 2-83).
ADC Output Code
Ideal Output
Actual Output
Error = –0.5 LSB
Error = +1 LSB
Input Voltage to Prescaler
Figure 2-83 • Differential Non-Linearity (DNL)
ENOB – Effective Number of Bits
ENOB specifies the dynamic performance of an ADC at a specific input frequency and sampling rate. An
ideal ADC’s error consists only of quantization of noise. As the input frequency increases, the overall
noise (particularly in the distortion components) also increases, thereby reducing the ENOB and SINAD
(also see “Signal-to-Noise and Distortion Ratio (SINAD)”.) ENOB for a full-scale, sinusoidal input
waveform is computed using EQ 12.
SINAD – 1.76
ENOB = ------------------------------------6.02
EQ 12
FS Error – Full-Scale Error
Full-scale error is the difference between the actual value that triggers that transition to full-scale and the
ideal analog full-scale transition value. Full-scale error equals offset error plus gain error.
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Device Architecture
Gain Error
The gain error of an ADC indicates how well the slope of an actual transfer function matches the slope of
the ideal transfer function. Gain error is usually expressed in LSB or as a percent of full-scale (%FSR).
Gain error is the full-scale error minus the offset error (Figure 2-84).
Gain = 2 LSB
1...11
ADC Output Code
Ideal Output
Actual Output
FS
Voltage
0...00
Input Voltage to Prescaler
Figure 2-84 • Gain Error
Gain Error Drift
Gain-error drift is the variation in gain error due to a change in ambient temperature, typically expressed
in ppm/°C.
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Fusion Family of Mixed Signal FPGAs
INL – Integral Non-Linearity
INL is the deviation of an actual transfer function from a straight line. After nullifying offset and gain
errors, the straight line is either a best-fit straight line or a line drawn between the end points of the
transfer function (Figure 2-85).
INL = +0.5 LSB
ADC Output Code
Ideal Output
Actual Output
INL = +1 LSB
Input Voltage to Prescaler
Figure 2-85 • Integral Non-Linearity (INL)
LSB – Least Significant Bit
In a binary number, the LSB is the least weighted bit in the group. Typically, the LSB is the furthest right
bit. For an ADC, the weight of an LSB equals the full-scale voltage range of the converter divided by 2N,
where N is the converter’s resolution.
EQ 13 shows the calculation for a 10-bit ADC with a unipolar full-scale voltage of 2.56 V:
1 LSB = (2.56 V / 210) = 2.5 mV
EQ 13
No Missing Codes
An ADC has no missing codes if it produces all possible digital codes in response to a ramp signal
applied to the analog input.
Offset Error
Offset error indicates how well the actual transfer function matches the ideal transfer function at a single
point. For an ideal ADC, the first transition occurs at 0.5 LSB above zero. The offset voltage is measured
by applying an analog input such that the ADC outputs all zeroes and increases until the first transition
occurs (Figure 2-86 on page 2-106).
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Device Architecture
ADC Output Code
Ideal Output
Actual Output
0...01
Offset Error = 1.5 LSB
0...00
Input Voltage to Prescaler
Figure 2-86 • Offset Error
Resolution
ADC resolution is the number of bits used to represent an analog input signal. To more accurately
replicate the analog signal, resolution needs to be increased.
Sampling Rate
Sampling rate or sample frequency, specified in samples per second (sps), is the rate at which an ADC
acquires (samples) the analog input.
SNR – Signal-to-Noise Ratio
SNR is the ratio of the amplitude of the desired signal to the amplitude of the noise signals at a given
point in time. For a waveform perfectly reconstructed from digital samples, the theoretical maximum SNR
(EQ 14) is the ratio of the full-scale analog input (RMS value) to the RMS quantization error (residual
error). The ideal, theoretical minimum ADC noise is caused by quantization error only and results directly
from the ADC’s resolution (N bits):
SNR dB[MAX] = 6.02 dB  N + 1.76 dB
EQ 14
SINAD – Signal-to-Noise and Distortion
SINAD is the ratio of the rms amplitude to the mean value of the root-sum-square of the all other spectral
components, including harmonics, but excluding DC. SINAD is a good indication of the overall dynamic
performance of an ADC because it includes all components which make up noise and distortion.
Total Harmonic Distortion
THD measures the distortion content of a signal, and is specified in decibels relative to the carrier (dBc).
THD is the ratio of the RMS sum of the selected harmonics of the input signal to the fundamental itself.
Only harmonics within the Nyquist limit are included in the measurement.
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Fusion Family of Mixed Signal FPGAs
TUE – Total Unadjusted Error
TUE is a comprehensive specification that includes linearity errors, gain error, and offset error. It is the
worst-case deviation from the ideal device performance. TUE is a static specification (Figure 2-87).
ADC Output Code
TUE = ±0.5 LSB
IDEAL OUTPUT
Input Voltage to Prescaler
Figure 2-87 • Total Unadjusted Error (TUE)
ADC Operation
Once the ADC has powered up and been released from reset, ADCRESET, the ADC will initiate a
calibration routine designed to provide optimal ADC performance. The Fusion ADC offers a robust
calibration scheme to reduce integrated offset and linearity errors. The offset and linearity errors of the
main capacitor array are compensated for with an 8-bit calibration capacitor array. The offset/linearity
error calibration is carried out in two ways. First, a power-up calibration is carried out when the ADC
comes out of reset. This is initiated by the CALIBRATE output of the Analog Block macro and is a fixed
number of ADC_CLK cycles (3,840 cycles), as shown in Figure 2-89 on page 2-114. In this mode, the
linearity and offset errors of the capacitors are calibrated.
To further compensate for drift and temperature-dependent effects, every conversion is followed by postcalibration of either the offset or a bit of the main capacitor array. The post-calibration ensures that, over
time and with temperature, the ADC remains consistent.
After both calibration and the setting of the appropriate configurations, as explained above, the ADC is
ready for operation. Setting the ADCSTART signal high for one clock period will initiate the sample and
conversion of the analog signal on the channel as configured by CHNUMBER[4:0]. The status signals
SAMPLE and BUSY will show when the ADC is sampling and converting (Figure 2-91 on page 2-115).
Both SAMPLE and BUSY will initially go high. After the ADC has sampled and held the analog signal,
SAMPLE will go low. After the entire operation has completed and the analog signal is converted, BUSY
will go low and DATAVALID will go high. This indicates that the digital result is available on the
RESULT[11:0] pins.
DATAVALID will remain high until a subsequent ADC_START is issued. The DATAVALID goes low on the
rising edge of SYSCLK as shown in Figure 2-90 on page 2-114. The RESULT signals will be kept
constant until the ADC finishes the subsequent sample. The next sampled RESULT will be available
when DATAVALID goes high again. It is ideal to read the RESULT when DATAVALID is '1'. The RESULT
is latched and remains unchanged until the next DATAVLAID rising edge.
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Device Architecture
ADC Input Multiplexer
At the input to the Fusion ADC is a 32:1 multiplexer. Of the 32 input channels, up to 30 are user
definable. Two of these channels are hardwired internally. Channel 31 connects to an internal
temperature diode so the temperature of the Fusion device itself can be monitored. Channel 0 is wired to
the FPGA’s 1.5 V VCC supply, enabling the Fusion device to monitor its own power supply. Doing this
internally makes it unnecessary to use an analog I/O to support these functions. The balance of the MUX
inputs are connected to Analog Quads (see the "Analog Quad" section on page 2-83). Table 2-40 defines
which Analog Quad inputs are associated with which specific analog MUX channels. The number of
Analog Quads present is device-dependent; refer to the family list in the "Fusion Family" table on page I
of this datasheet for the number of quads per device. Regardless of the number of quads populated in a
device, the internal connections to both VCC and the internal temperature diode remain on Channels 0
and 31, respectively. To sample the internal temperature monitor, it must be strobed (similar to the AT
pads). The TMSTBINT pin on the Analog Block macro is the control for strobing the internal temperature
measurement diode.
To determine which channel is selected for conversion, there is a five-pin interface on the Analog Block,
CHNUMBER[4:0], defined in Table 2-39.
Table 2-39 • Channel Selection
Channel Number
CHNUMBER[4:0]
0
00000
1
00001
2
00010
3
00011
.
.
.
.
.
.
30
11110
31
11111
Table 2-40 shows the correlation between the analog MUX input channels and the analog input pins.
Table 2-40 • Analog MUX Channels
Analog MUX Channel
0
2- 10 8
Signal
Analog Quad Number
Vcc_analog
1
AV0
2
AC0
3
AT0
4
AV1
5
AC1
6
AT1
7
AV2
8
AC2
9
AT2
10
AV3
11
AC3
12
AT3
13
AV4
14
AC4
15
AT4
R e visio n 4
Analog Quad 0
Analog Quad 1
Analog Quad 2
Analog Quad 3
Analog Quad 4
Fusion Family of Mixed Signal FPGAs
Table 2-40 • Analog MUX Channels (continued)
Signal
Analog Quad Number
16
Analog MUX Channel
AV5
Analog Quad 5
17
AC5
18
AT5
19
AV6
20
AC6
Analog Quad 6
21
AT6
22
AV7
23
AC7
24
AT7
Analog Quad 7
25
AV8
26
AC8
Analog Quad 8
27
AT8
28
AV9
29
AC9
30
AT9
31
Internal temperature
monitor
Analog Quad 9
The ADC can be powered down independently of the FPGA core, as an additional control or for powersaving considerations, via the PWRDWN pin of the Analog Block. The PWRDWN pin controls only the
comparators in the ADC.
ADC Modes
The Fusion ADC can be configured to operate in 8-, 10-, or 12-bit modes, power-down after conversion,
and dynamic calibration. This is controlled by MODE[3:0], as defined in Table 2-41 on page 2-109.
The output of the ADC is the RESULT[11:0] signal. In 8-bit mode, the Most Significant 8 Bits
RESULT[11:4] are used as the ADC value and the Least Significant 4 Bits RESULT[3:0] are logical '0's.
In 10-bit mode, RESULT[11:2] are used the ADC value and RESULT[1:0] are logical 0s.
Table 2-41 • Mode Bits Function
Name
Bits
Function
MODE
3
0 – Internal calibration after every conversion; two ADCCLK cycles are used
after the conversion.
1 – No calibration after every conversion
MODE
2
0 – Power-down after conversion
1 – No Power-down after conversion
MODE
1:0
00 – 10-bit
01 – 12-bit
10 – 8-bit
11 – Unused
Integrated Voltage Reference
The Fusion device has an integrated on-chip 2.56 V reference voltage for the ADC. The value of this
reference voltage was chosen to make the prescaling and postscaling factors for the prescaler blocks
change in a binary fashion. However, if desired, an external reference voltage of up to 3.3 V can be
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Device Architecture
connected between the VAREF and ADCGNDREF pins. The VAREFSEL control pin is used to select the
reference voltage.
Table 2-42 • VAREF Bit Function
Name
Bit
VAREF
0
Function
Reference voltage selection
0 – Internal voltage reference selected. VAREF pin outputs 2.56 V.
1 – Input external voltage reference from VAREF and ADCGNDREF
ADC Clock
The speed of the ADC depends on its internal clock, ADCCLK, which is not accessible to users. The
ADCCLK is derived from SYSCLK. Input signal TVC[7:0], Time Divider Control, determines the speed of
the ADCCLK in relationship to SYSCLK, based on EQ 15.
t ADCCLK = 4   1 + TVC   t SYSCLK
EQ 15
TVC: Time Divider Control (0–255)
tADCCLK is the period of ADCCLK, and must be between 0.5 MHz and 10 MHz
tSYSCLK is the period of SYSCLK
Table 2-43 • TVC Bits Function
Name
Bits
Function
TVC
[7:0]
SYSCLK divider control
The frequency of ADCCLK, fADCCLK, must be within 0.5 Hz to 10 MHz.
The inputs to the ADC are synchronized to SYSCLK. A conversion is initiated by asserting the
ADCSTART signal on a rising edge of SYSCLK. Figure 2-90 on page 2-114 and Figure 2-91 on
page 2-115 show the timing diagram for the ADC.
Acquisition Time or Sample Time Control
Acquisition time (tSAMPLE) specifies how long an analog input signal has to charge the internal capacitor
array. Figure 2-88 shows a simplified internal input sampling mechanism of a SAR ADC.
Sample and Hold
Rsource
ZINAD
CINAD
Figure 2-88 • Simplified Sample and Hold Circuitry
The internal impedance (ZINAD), external source resistance (RSOURCE), and sample capacitor (CINAD)
form a simple RC network. As a result, the accuracy of the ADC can be affected if the ADC is given
insufficient time to charge the capacitor. To resolve this problem, you can either reduce the source
resistance or increase the sampling time by changing the acquisition time using the STC signal.
EQ 16 through EQ 18 can be used to calculate the acquisition time required for a given input. The STC
signal gives the number of sample periods in ADCCLK for the acquisition time of the desired signal. If the
actual acquisition time is higher than the STC value, the settling time error can affect the accuracy of the
ADC, because the sampling capacitor is only partially charged within the given sampling cycle. Example
acquisition times are given in Table 2-44 and Table 2-45. When controlling the sample time for the ADC
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Fusion Family of Mixed Signal FPGAs
along with the use of the active bipolar prescaler, current monitor, or temperature monitor, the minimum
sample time(s) for each must be obeyed. EQ 19 can be used to determine the appropriate value of STC.
You can calculate the minimum actual acquisition time by using EQ 16:
VOUT = VIN(1 – e–t/RC)
EQ 16
For 0.5 LSB gain error, VOUT should be replaced with (VIN –(0.5 × LSB Value)):
(VIN – 0.5 × LSB Value) = VIN(1 – e–t/RC)
EQ 17
where VIN is the ADC reference voltage (VREF)
Solving EQ 17:
t = RC x ln (VIN / (0.5 x LSB Value))
EQ 18
where R = ZINAD + RSOURCE and C = CINAD.
Calculate the value of STC by using EQ 19.
tSAMPLE = (2 + STC) x (1 / ADCCLK) or tSAMPLE = (2 + STC) x (ADC Clock Period)
EQ 19
where ADCCLK = ADC clock frequency in MHz.
tSAMPLE = 0.449 µs from bit resolution in Table 2-44.
ADC Clock frequency = 10 MHz or a 100 ns period.
STC = (tSAMPLE / (1 / 10 MHz)) – 2 = 4.49 – 2 = 2.49.
You must round up to 3 to accommodate the minimum sample time.
Table 2-44 • Acquisition Time Example with VAREF = 2.56 V
VIN = 2.56V, R = 4K (RSOURCE ~ 0), C = 18 pF
Resolution
LSB Value (mV)
Min. Sample/Hold Time for 0.5 LSB (µs)
8
10
0.449
10
2.5
0.549
12
0.625
0.649
Table 2-45 • Acquisition Time Example with VAREF = 3.3 V
VIN = 3.3V, R = 4K (RSOURCE ~ 0), C = 18 pF
Resolution
LSB Value (mV)
Min. Sample/Hold time for 0.5 LSB (µs)
8
12.891
0.449
10
3.223
0.549
12
0.806
0.649
Sample Phase
A conversion is performed in three phases. In the first phase, the analog input voltage is sampled on the
input capacitor. This phase is called sample phase. During the sample phase, the output signals BUSY
and SAMPLE change from '0' to '1', indicating the ADC is busy and sampling the analog signal. The
sample time can be controlled by input signals STC[7:0]. The sample time can be calculated by EQ 20.
When controlling the sample time for the ADC along with the use of Prescaler or Current Monitor or
Temperature Monitor, the minimum sample time for each must be obeyed. Refer to Table 2-46 on
page 2-112 and the "Acquisition Time or Sample Time Control" section on page 2-110
t sample =  2 + STC   t ADCCLK
EQ 20
STC: Sample Time Control value (0–255)
tSAMPLE is the sample time
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Device Architecture
Table 2-46 • STC Bits Function
Name
Bits
STC
[7:0]
Function
Sample time control
Sample time is computed based on the period of ADCCLK.
Distribution Phase
The second phase is called the distribution phase. During distribution phase, the ADC computes the
equivalent digital value from the value stored in the input capacitor. In this phase, the output signal
SAMPLE goes back to '0', indicating the sample is completed; but the BUSY signal remains '1', indicating
the ADC is still busy for distribution. The distribution time depends strictly on the number of bits. If the
ADC is configured as a 10-bit ADC, then 10 ADCCLK cycles are needed. EQ 8 describes the distribution
time.
t distrib = N  t ADCCLK
EQ 21
N: Number of bits
Post-Calibration Phase
The last phase is the post-calibration phase. This is an optional phase. The post-calibration phase takes
two ADCCLK cycles. The output BUSY signal will remain '1' until the post-calibration phase is completed.
If the post-calibration phase is skipped, then the BUSY signal goes to '0' after distribution phase. As soon
as BUSY signal goes to '0', the DATAVALID signal goes to '1', indicating the digital result is available on
the RESULT output signals. DATAVAILD will remain '1' until the next ADCSTART is asserted. Microsemi
recommends enabling post-calibration to compensate for drift and temperature-dependent effects. This
ensures that the ADC remains consistent over time and with temperature. The post-calibration phase is
enabled by bit 3 of the Mode register. EQ 9 describes the post-calibration time.
t post-cal = MODE  3    2  t ADCCLK 
EQ 22
MODE[3]: Bit 3 of the Mode register, described in Table 2-41 on page 2-109.
The calculation for the conversion time for the ADC is summarized in EQ 23.
tconv = tsync_read + tsample + tdistrib + tpost-cal + tsync_write
EQ 23
tconv: conversion time
tsync_read: maximum time for a signal to synchronize with SYSCLK. For calculation purposes, the
worst case is a period of SYSCLK, tSYSCLK.
tsample: Sample time
tdistrib: Distribution time
tpost-cal: Post-calibration time
tsync_write: Maximum time for a signal to synchronize with SYSCLK. For calculation purposes, the
worst case is a period of SYSCLK, tSYSCLK.
Intra-Conversion
Performing a conversion during power-up calibration is possible but should be avoided, since the
performance is not guaranteed, as shown in Table 2-49 on page 2-120. This is described as intraconversion. Figure 2-92 on page 2-115 shows intra-conversion (conversion that starts during power-up
calibration).
Injected Conversion
A conversion can be interrupted by another conversion. Before the current conversion is finished, a
second conversion can be started by issuing a pulse on signal ADCSTART. When a second conversion
is issued before the current conversion is completed, the current conversion would be dropped and the
ADC would start the second conversion on the rising edge of the SYSCLK. This is known as injected
conversion. Since the ADC is synchronous, the minimum time to issue a second conversion is two clock
cycles of SYSCLK after the previous one. Figure 2-93 on page 2-116 shows injected conversion
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Fusion Family of Mixed Signal FPGAs
(conversion that starts before a previously started conversion is finished). The total time for
calibration still remains 3,840 ADCCLK cycles.
ADC Example
This example shows how to choose the correct settings to achieve the fastest sample time in 10-bit mode
for a system that runs at 66 MHz. Assume the acquisition times defined in Table 2-44 on page 2-111 for
10-bit mode, which gives 0.549 µs as a minimum hold time.
The period of SYSCLK: tSYSCLK = 1/66 MHz = 0.015 µs
Choosing TVC between 1 and 33 will meet the maximum and minimum period for the ADCCLK
requirement. A higher TVC leads to a higher ADCCLK period.
The minimum TVC is chosen so that tdistrib and tpost-cal can be run faster. The period of ADCCLK with a
TVC of 1 can be computed by EQ 24.
t ADCCLK = 4   1 + TVC   t SYSCLK = 4   1 + 1   0.015 µs = 0.12 µs
EQ 24
The STC value can now be computed by using the minimum sample/hold time from Table 2-44 on
page 2-111, as shown in EQ 25.
t sample
0.549 µs
STC = -------------------- – 2 = ----------------------- – 2 = 4.575 – 2 = 2.575
t ADCCLK
0.12 µs
EQ 25
You must round up to 3 to accommodate the minimum sample time requirement. The actual sample time,
tsample, with an STC of 3, is now equal to 0.6 µs, as shown in EQ 26
t sample =  2 + STC   t ADCCLK =  2 + 3   t ADCCLK = 5  0.12 µs = 0.6 µs
EQ 26
Microsemi recommends post-calibration for temperature drift over time, so post-calibration is enabled.
The post-calibration time, tpost-cal, can be computed by EQ 27. The post-calibration time is 0.24 µs.
t post-cal = 2  t ADCCLK = 0.24 µs
EQ 27
The distribution time, tdistrib, is equal to 1.2 µs and can be computed as shown in EQ 28 (N is number of
bits, referring back to EQ 8 on page 2-97).
t distrib = N  t ADCCLK = 10  0.12 = 1.2 µs
EQ 28
The total conversion time can now be summated, as shown in EQ 29 (referring to EQ 23 on page 2-112).
tsync_read + tsample + tdistrib + tpost-cal + tsync_write = (0.015 + 0.60 + 1.2 + 0.24 + 0.015) µs = 2.07 µs
EQ 29
The optimal setting for the system running at 66 MHz with an ADC for 10-bit mode chosen is shown in
Table 2-47:
Table 2-47 • Optimal Setting at 66 MHz in 10-Bit Mode
TVC[7:0]
=1
= 0x01
STC[7:0]
=3
= 0x03
MODE[3:0]
= b'0100
= 0x4*
Note: No power-down after every conversion is chosen in this case; however, if the application is
power-sensitive, the MODE[2] can be set to '0', as described above, and it will not affect any
performance.
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Device Architecture
Timing Diagrams
tCAL = 3,840 tADCCLK*
SYSCLK
tRECCLR
tREMCLR
ADCRESET
tSUTVC
tHDTVC
TVC[7:0]
tCK2QCAL
tCK2QCAL
CALIBRATE
Note: *Refer to EQ 15 on page 2-110 for the calculation on the period of ADCCLK, tADCCLK.
Figure 2-89 • Power-Up Calibration Status Signal Timing Diagram
tMINSYSCLK
SYSCLK
tSUADCSTART
tHDADCSTART
ADCSTART
tSUMODE
tHDMODE
MODE[3:0]
tSUTVC
tHDTVC
tSUSTC
tHDSTC
TVC[7:0]
STC[7:0]
tSUVAREFSEL
tHDVAREFSEL
VAREF
tSUCHNUM
tHDCHNUM
CHNUMBER[7:0]
Figure 2-90 • Input Setup Time
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R e visio n 4
tMPWSYSCLK
Fusion Family of Mixed Signal FPGAs
Standard Conversion
t SAMPLE1
t DATA2START3
SYSCLK
t SUADCSTART t HDADCSTART
ADCSTART
t CK2QBUSY
BUSY
t CK2QSAMPLE
SAMPLE
t CONV2
t CK2QVAL
t CK2QVAL
DATAVALID
t CLK2RESULT
1 st Sample Result
ADC_RESULT[11:0]
2nd Sample Result
Notes:
1. Refer to EQ 20 on page 2-111 for the calculation on the sample time, tSAMPLE.
2. See EQ 23 on page 2-112 for calculation of the conversion time, tCONV.
3. Minimum time to issue an ADCSTART after DATAVALID is 1 SYSCLK period
Figure 2-91 • Standard Conversion Status Signal Timing Diagram
Intra-Conversion
SYSCLK
ADCRESET
ADCSTART
tCK2QBUSY
BUSY
tCK2QSAMPLE
tCK2QSAMPLE
SAMPLE
tCLR2QVAL
tCONV*
tCK2QVAL
DATAVALID
tCK2QCAL
tCK2QCAL
CALIBRATE
Interrupts Power-Up Calibration
Resumes Power-Up Calibration
Note: *tCONV represents the conversion time of the second conversion. See EQ 23 on page 2-112 for calculation of the
conversion time, tCONV.
Figure 2-92 • Intra-Conversion Timing Diagram
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Device Architecture
Injected Conversion
SYSCLK
1st Start
2nd Start
ADCSTART
tCK2QBUSY
1st Conversion
BUSY
tCK2QSAMPLE
1st Conversion Cancelled,
2nd Conversion
tCK2QSAMPLE
SAMPLE
tCONV*
tCK2QVAL
DATAVALID
Note: *See EQ 23 on page 2-112 for calculation on the conversion time, tCONV.
Figure 2-93 • Injected Conversion Timing Diagram
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tCK2QVAL
Fusion Family of Mixed Signal FPGAs
ADC Interface Timing
Table 2-48 • ADC Interface Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tSUMODE
Mode Pin Setup Time
0.56
0.64
0.75
ns
tHDMODE
Mode Pin Hold Time
0.26
0.29
0.34
ns
tSUTVC
Clock Divide Control (TVC) Setup Time
0.68
0.77
0.90
ns
tHDTVC
Clock Divide Control (TVC) Hold Time
0.32
0.36
0.43
ns
tSUSTC
Sample Time Control (STC) Setup Time
1.58
1.79
2.11
ns
tHDSTC
Sample Time Control (STC) Hold Time
1.27
1.45
1.71
ns
tSUVAREFSEL
Voltage Reference Select (VAREFSEL) Setup Time
0.00
0.00
0.00
ns
tHDVAREFSEL
Voltage Reference Select (VAREFSEL) Hold Time
0.67
0.76
0.89
ns
tSUCHNUM
Channel Select (CHNUMBER) Setup Time
0.90
1.03
1.21
ns
tHDCHNUM
Channel Select (CHNUMBER) Hold Time
0.00
0.00
0.00
ns
tSUADCSTART
Start of Conversion (ADCSTART) Setup Time
0.75
0.85
1.00
ns
tHDADCSTART
Start of Conversion (ADCSTART) Hold Time
0.43
0.49
0.57
ns
tCK2QBUSY
Busy Clock-to-Q
1.33
1.51
1.78
ns
tCK2QCAL
Power-Up Calibration Clock-to-Q
0.63
0.71
0.84
ns
tCK2QVAL
Valid Conversion Result Clock-to-Q
3.12
3.55
4.17
ns
tCK2QSAMPLE
Sample Clock-to-Q
0.22
0.25
0.30
ns
tCK2QRESULT
Conversion Result Clock-to-Q
2.53
2.89
3.39
ns
tCLR2QBUSY
Busy Clear-to-Q
2.06
2.35
2.76
ns
tCLR2QCAL
Power-Up Calibration Clear-to-Q
2.15
2.45
2.88
ns
tCLR2QVAL
Valid Conversion Result Clear-to-Q
2.41
2.74
3.22
ns
tCLR2QSAMPLE
Sample Clear-to-Q
2.17
2.48
2.91
ns
tCLR2QRESULT
Conversion result Clear-to-Q
2.25
2.56
3.01
ns
tRECCLR
Recovery Time of Clear
0.00
0.00
0.00
ns
tREMCLR
Removal Time of Clear
0.63
0.72
0.84
ns
tMPWSYSCLK
Clock Minimum Pulse Width for the ADC
4.00
4.00
4.00
ns
tFMAXSYSCLK
Clock Maximum Frequency for the ADC
100.00
100.00
100.00
MHz
Revision 4
2- 117
Device Architecture
Typical Performance Characteristics
Temperature Error (°C)
Temperature Errror vs. Die Temperature
3.5
3
2.5
2
1.5
1
0.5
0
–40
10
60
110
Temperature (°C)
Figure 2-94 • Temperature Error
Temperature Error vs. Interconnect Capacitance
1
Temperature Error (°C)
0
-1
-2
-3
-4
-5
-6
-7
0
500
1000
Capacitance (pF )
Figure 2-95 • Effect of External Sensor Capacitance
2- 11 8
R e visio n 4
1500
2000
Fusion Family of Mixed Signal FPGAs
Temperature Reading Noise RMS vs. Averaging
12
Noise RMS (°C)
10
8
6
4
2
0
1
10
100
Number of Averages
1000
10000
Figure 2-96 • Temperature Reading Noise When Averaging is Used
Revision 4
2- 119
Device Architecture
Analog System Characteristics
Table 2-49 • Analog Channel Specifications
Commercial Temperature Range Conditions, TJ = 85°C (unless noted otherwise),
Typical: VCC33A = 3.3 V, VCC = 1.5 V
Parameter
Description
Condition
Min.
Typ.
Max.
Units
100
KHz
Voltage Monitor Using Analog Pads AV, AC and AT (using prescaler)
VINAP
Input Voltage
(Prescaler)
Refer to Table 3-2 on page 3-3
Uncalibrated Gain and
Offset Errors
Refer to Table 2-51 on
page 2-125
Calibrated Gain and
Offset Errors
Refer to Table 2-52 on
page 2-126
Bandwidth1
Input Resistance
Refer to Table 3-3 on page 3-4
Scaling Factor
Prescaler modes (Table 2-57 on
page 2-133)
Sample Time
10
µs
Current Monitor Using Analog Pads AV and AC
VRSM1
Maximum Differential
Input Voltage
Resolution
Common Mode
Rejection Ratio
mV
– 10.5 to +12
V
Refer to "Current Monitor"
section
Common Mode Range
CMRR
VAREF / 10
DC – 1 KHz
60
dB
1 KHz - 10 KHz
50
dB
> 10 KHz
30
dB
tCMSHI
Strobe High time
ADC
conv.
time
tCMSHI
Strobe Low time
5
µs
tCMSHI
Settling time
0.02
µs
Accuracy
Input differential voltage > 50 mV
200
–2 –(0.05 x
VRSM) to +2 +
(0.05 x VRSM)
µs
mV
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad. There is no
reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. An averaging of 1,024 samples (LPF setting in Analog System Builder) is required and the maximum capacitance
allowed across the AT pins is 500 pF.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be used, based on
voltage on the pad.
7. When using SmartGen Analog System Builder, CalibIP is required to obtain 0 offset. For further details on CalibIP, refer
to the "Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion FPGA Fabric User’s
Guide.
2- 12 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-49 • Analog Channel Specifications (continued)
Commercial Temperature Range Conditions, TJ = 85°C (unless noted otherwise),
Typical: VCC33A = 3.3 V, VCC = 1.5 V
Parameter
Description
Condition
Min.
Typ.
Max.
Units
Temperature Monitor Using Analog Pad AT
External
Resolution
Temperature
Monitor
(external diode
2N3904,
Systematic Offset5
TJ = 25°C)4
8-bit ADC
4
°C
10-bit ADC
1
°C
12-bit ADC
0.25
°C
5
°C
0
°C
AFS250, AFS600, AFS1500,
uncalibrated7
11
°C
AFS600, AFS1500, calibrated7
0
°C
AFS090
uncalibrated7
AFS090, AFS250,
calibrated7
Accuracy
±3
±5
External Sensor Source High level, TMSTBx = 0
Current
Low level, TMSTBx = 1
10
µA
100
µA
Max Capacitance on AT
pad
Internal
Temperature
Monitor
Resolution
Systematic
1.3
8-bit ADC
Offset5
°C
nF
4
°C
10-bit ADC
1
°C
12-bit ADC
0.25
°C
AFS090
uncalibrated7
5
°C
0
°C
AFS250, AFS600, AFS1500
uncalibrated7
11
°C
AFS600, AFS1500 calibrated7
0
°C
AFS090, AFS250,
calibrated7
Accuracy
±3
±5
°C
105
µs
tTMSHI
Strobe High time
10
tTMSLO
Strobe Low time
5
µs
tTMSSET
Settling time
5
µs
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad. There is no
reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. An averaging of 1,024 samples (LPF setting in Analog System Builder) is required and the maximum capacitance
allowed across the AT pins is 500 pF.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be used, based on
voltage on the pad.
7. When using SmartGen Analog System Builder, CalibIP is required to obtain 0 offset. For further details on CalibIP, refer
to the "Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion FPGA Fabric User’s
Guide.
Revision 4
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Device Architecture
Table 2-49 • Analog Channel Specifications (continued)
Commercial Temperature Range Conditions, TJ = 85°C (unless noted otherwise),
Typical: VCC33A = 3.3 V, VCC = 1.5 V
Parameter
Description
Condition
Min.
Typ.
Max.
Units
Digital Input using Analog Pads AV, AC and AT
VIND2,3
Input Voltage
VHYSDIN
Hysteresis
0.3
V
VIHDIN
Input High
1.2
V
VILDIN
Input Low
0.9
V
VMPWDIN
Minimum Pulse With
FDIN
Maximum Frequency
ISTBDIN
Input Leakage Current
2
µA
IDYNDIN
Dynamic Current
20
µA
tINDIN
Input Delay
10
ns
Refer to Table 3-2 on page 3-3
50
ns
10
MHz
Gate Driver Output Using Analog Pad AG
VG
Voltage Range
Refer to Table 3-2 on page 3-3
IG
Output Current Drive
High Current Mode6 at 1.0 V
IOFFG
FG
±20
mA
Low Current Mode: ±1 µA
0.8
1.0
1.3
µA
Low Current Mode: ±3 µA
2.0
2.7
3.3
µA
Low Current Mode: ± 10 µA
7.4
9.0
11.5
µA
Low Current Mode: ± 30 µA
21.0
27.0
32.0
µA
100
nA
Maximum Off Current
Mode6
Maximum switching rate High Current
k resistive load
at 1.0 V, 1
1.3
MHz
Low Current Mode:
±1 µA, 3 M resistive load
3
KHz
Low Current Mode:
±3 µA, 1 M resistive load
7
KHz
Low Current Mode:
±10 µA, 300 k resistive load
25
KHz
Low Current Mode:
±30 µA, 105 k resistive load
78
KHz
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad. There is no
reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. An averaging of 1,024 samples (LPF setting in Analog System Builder) is required and the maximum capacitance
allowed across the AT pins is 500 pF.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be used, based on
voltage on the pad.
7. When using SmartGen Analog System Builder, CalibIP is required to obtain 0 offset. For further details on CalibIP, refer
to the "Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion FPGA Fabric User’s
Guide.
2- 12 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-50 • ADC Characteristics in Direct Input Mode
Commercial Temperature Range Conditions, TJ = 85°C (unless noted otherwise),
Typical: VCC33A = 3.3 V, VCC = 1.5 V
Parameter
Description
Condition
Min.
Typ.
Max.
Units
Direct Input using Analog Pad AV, AC, AT
VINADC
Input Voltage (Direct Input)
Refer to Table 3-2 on
page 3-3
CINADC
Input Capacitance
Channel not selected
7
pF
Channel selected but not
sampling
8
pF
Channel selected and
sampling
18
pF
8-bit mode
2
k
10-bit mode
2
k
12-bit mode
2
k
ZINADC
Input Impedance
Analog Reference Voltage VAREF
VAREF
Accuracy
TJ = 25°C
2.537
Temperature Drift of
Internal Reference
2.56
2.583
65
External Reference
ppm / °C
2.527
ADC Accuracy (using external reference)
V
VCC33A + 0.05
V
1,2
DC Accuracy
TUE
INL
DNL
Total Unadjusted Error
Integral Non-Linearity
Differential Non-Linearity
(no missing code)
Offset Error
Gain Error
Gain Error
reference)
(with
8-bit mode
0.29
LSB
10-bit mode
0.72
LSB
12-bit mode
1.8
LSB
8-bit mode
0.20
0.25
LSB
10-bit mode
0.32
0.43
LSB
12-bit mode
1.71
1.80
LSB
8-bit mode
0.20
0.24
LSB
10-bit mode
0.60
0.65
LSB
12-bit mode
2.40
2.48
LSB
8-bit mode
0.01
0.17
LSB
10-bit mode
0.05
0.20
LSB
12-bit mode
0.20
0.40
LSB
8-bit mode
0.0004
0.003
LSB
10-bit mode
0.002
0.011
LSB
12-bit mode
0.007
0.044
LSB
internal All modes
2
% FSR
Notes:
1. Accuracy of the external reference is 2.56 V ± 4.6 mV.
2. Data is based on characterization.
3. The sample rate is time-shared among active analog inputs.
Revision 4
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Device Architecture
Table 2-50 • ADC Characteristics in Direct Input Mode (continued)
Commercial Temperature Range Conditions, TJ = 85°C (unless noted otherwise),
Typical: VCC33A = 3.3 V, VCC = 1.5 V
Parameter
Description
Condition
Min.
Typ.
Max.
Units
8-bit mode
48.0
49.5
dB
10-bit mode
58.0
60.0
dB
12-bit mode
62.9
64.5
dB
8-bit mode
47.6
49.5
dB
10-bit mode
57.4
59.8
dB
12-bit mode
62.0
64.2
dB
Dynamic Performance
SNR
SINAD
THD
ENOB
Signal-to-Noise Ratio
Signal-to-Noise Distortion
Total Harmonic
Distortion
Effective Number of Bits
8-bit mode
–74.4
–63.0
dBc
10-bit mode
–78.3
–63.0
dBc
12-bit mode
–77.9
–64.4
dBc
8-bit mode
7.6
7.9
bits
10-bit mode
9.5
9.6
bits
12-bit mode
10.0
10.4
bits
8-bit mode
1.7
µs
10-bit mode
1.8
µs
12-bit mode
2
µs
Conversion Rate
Conversion Time
Sample Rate
8-bit mode
600
Ksps
10-bit mode
550
Ksps
12-bit mode
500
Ksps
Notes:
1. Accuracy of the external reference is 2.56 V ± 4.6 mV.
2. Data is based on characterization.
3. The sample rate is time-shared among active analog inputs.
2- 12 4
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Fusion Family of Mixed Signal FPGAs
Table 2-51 • Uncalibrated Analog Channel Accuracy*
Worst-Case Industrial Conditions, TJ = 85°C
Total Channel
Error (LSB)
Analog Prescaler Neg.
Pos.
Pad
Range (V) Max. Med. Max.
Channel Input Offset
Error (LSB)
Neg
Max
Med.
Positive Range
AV, AC
AT
Channel Gain Error
(%FSR)
Neg.
Max.
Pos.
Max.
Min.
Typ.
Max.
Med.
ADC in 10-Bit Mode
16
–22
–2
12
–11
–2
14
–169
–32
224
3
0
–3
8
–40
–5
17
–11
–5
21
–87
–40
166
2
0
–4
4
–45
–9
24
–16
–11
36
–63
–43
144
2
0
–4
2
–70
–19
33
–33
–20
66
–66
–39
131
2
0
–4
1
–25
–7
5
–11
–3
26
–11
–3
26
3
–1
–3
0.5
–41
–12
8
–12
–7
38
–6
–4
19
3
–1
–3
0.25
–53
–14
19
–20
–14
40
–5
–3
10
5
0
–4
0.125
–89
–29
24
–40
–28
88
–5
–4
11
7
0
–5
16
–3
9
15
–4
0
4
–64
5
64
1
0
–1
4
–10
2
15
–11
–2
11
–44
–8
44
1
0
–1
Negative Range
AV, AC
Pos.
Max.
Channel Input Offset
Error (mV)
ADC in 10-Bit Mode
16
–35
–10
9
–24
–6
9
–383
–96
148
5
–1
–6
8
–65
–19
12
–34
–12
9
–268
–99
75
5
–1
–5
4
–86
–28
21
–64
–24
19
–254
–96
76
5
–1
–6
2
–136
–53
37
–115
–42
39
–230
–83
78
6
–2
–7
1
–98
–35
8
–39
–8
15
–39
–8
15
10
–3
–10
0.5
–121
–46
7
–54
–14
18
–27
–7
9
10
–4
–11
0.25
–149
–49
19
–72
–16
40
–18
–4
10
14
–4
–12
0.125
–188
–67
38
–112
–27
56
–14
–3
7
16
–5
–14
Note: *Channel Accuracy includes prescaler and ADC accuracies. For 12-bit mode, multiply the LSB count by 4. For
8-bit mode, divide the LSB count by 4. Gain remains the same.
Revision 4
2- 125
Device Architecture
Table 2-52 • Calibrated Analog Channel Accuracy 1,2,3
Worst-Case Industrial Conditions, TJ = 85°C
Condition
Analog
Pad
Prescaler Range (V)
Total Channel Error (LSB)
Input Voltage4 (V)
Negative Max.
Positive Range
AV, AC
AT
Positive Max.
ADC in 10-Bit Mode
16
0.300 to 12.0
–6
1
6
8
0.250 to 8.00
–6
0
6
4
0.200 to 4.00
–7
–1
7
2
0.150 to 2.00
–7
0
7
1
0.050 to 1.00
–6
–1
6
16
0.300 to 16.0
–5
0
5
4
0.100 to 4.00
–7
–1
7
Negative Range
AV, AC
Median
ADC in 10-Bit Mode
16
–0.400 to –10.5
–7
1
9
8
–0.350 to –8.00
–7
–1
7
4
–0.300 to –4.00
–7
–2
9
2
–0.250 to –2.00
–7
–2
7
1
–0.050 to –1.00
–16
–1
20
Notes:
1. Channel Accuracy includes prescaler and ADC accuracies. For 12-bit mode, multiply the LSB count by 4. For 8-bit
mode, divide the LSB count by 4. Overall accuracy remains the same.
2. Requires enabling Analog Calibration using SmartGen Analog System Builder. For further details, refer to the
"Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion FPGA Fabric User’s Guide.
3. Calibrated with two-point calibration methodology, using 20% and 80% full-scale points.
4. The lower limit of the input voltage is determined by the prescaler input offset.
2- 12 6
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Fusion Family of Mixed Signal FPGAs
Table 2-53 • Analog Channel Accuracy: Monitoring Standard Positive Voltages
Typical Conditions, TA = 25°C
Direct ADC 2,3
(%FSR)
Calibrated Typical Error per Positive Prescaler Setting 1 (%FSR)
Input Voltage
(V)
16 V (AT)
16 V (12 V)
(AV/AC)
8V
(AV/AC)
4 V (AT)
4V
(AV/AC)
2V
(AV/AC)
1V
(AV/AC)
VAREF = 2.56 V
15
1
14
1
12
1
1
5
2
2
1
3.3
2
2
1
1
1
2.5
3
2
1
1
1
1.8
4
4
1
1
1
1
1
1.5
5
5
2
2
2
1
1
1.2
7
6
2
2
2
1
1
0.9
9
9
4
3
3
1
1
1
1
Notes:
1. Requires enabling Analog Calibration using SmartGen Analog System Builder. For further details, refer to the
"Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion FPGA Fabric User’s Guide.
2. Direct ADC mode using an external VAREF of 2.56V±4.6mV, without Analog Calibration macro.
3. For input greater than 2.56 V, the ADC output will saturate. A higher VAREF or prescaler usage is recommended.
Examples
Calculating Accuracy for an Uncalibrated Analog Channel
Formula
For a given prescaler range, EQ 30 gives the output voltage.
Output Voltage = (Channel Output Offset in V) + (Input Voltage x Channel Gain)
EQ 30
where
Channel Output offset in V = Channel Input offset in LSBs x Equivalent voltage per LSB
Channel Gain Factor = 1+ (% Channel Gain / 100)
Example
Input Voltage = 5 V
Chosen Prescaler range = 8 V range
Refer to Table 2-51 on page 2-125.
Max. Output Voltage = (Max Positive input offset) + (Input Voltage x Max Positive Channel Gain)
Max. Positive input offset = (21 LSB) x (8 mV per LSB in 10-bit mode)
Max. Positive input offset = 166 mV
Max. Positive Gain Error = +3%
Max. Positive Channel Gain = 1 + (+3% / 100)
Max. Positive Channel Gain = 1.03
Max. Output Voltage = (166 mV) + (5 V x 1.03)
Max. Output Voltage = 5.316 V
Revision 4
2- 127
Device Architecture
Similarly,
Min. Output Voltage = (Max. Negative input offset) + (Input Voltage x Max. Negative Channel Gain)
= (–88 mV) + (5 V x 0.96) = 4.712 V
Calculating Accuracy for a Calibrated Analog Channel
Formula
For a given prescaler range, EQ 31 gives the output voltage.
Output Voltage = Channel Error in V + Input Voltage
EQ 31
where
Channel Error in V = Total Channel Error in LSBs x Equivalent voltage per LSB
Example
Input Voltage = 5 V
Chosen Prescaler range = 8 V range
Refer to Table 2-52 on page 2-126.
Max. Output Voltage = Max. Positive Channel Error in V + Input Voltage
Max. Positive Channel Error in V = (6 LSB) × (8 mV per LSB in 10-bit mode) = 48 mV
Max. Output Voltage = 48 mV + 5 V = 5.048 V
Similarly,
Min. Output Voltage = Max. Negative Channel Error in V + Input Voltage = (–48 mV) + 5 V = 4.952 V
Calculating LSBs from a Given Error Budget
Formula
For a given prescaler range,
LSB count = ± (Input Voltage × Required % error) / (Equivalent voltage per LSB)
Example
Input Voltage = 3.3 V
Required error margin= 1%
Refer to Table 2-52 on page 2-126.
Equivalent voltage per LSB = 16 mV for a 16V prescaler, with ADC in 10-bit mode
LSB Count = ± (5.0 V × 1%) / (0.016)
LSB Count = ± 3.125
Equivalent voltage per LSB = 8 mV for an 8 V prescaler, with ADC in 10-bit mode
LSB Count = ± (5.0 V × 1%) / (0.008)
LSB Count = ± 6.25
The 8 V prescaler satisfies the calculated LSB count accuracy requirement (see Table 2-52 on
page 2-126).
2- 12 8
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Fusion Family of Mixed Signal FPGAs
Analog Configuration MUX
The ACM is the interface between the FPGA, the Analog Block configurations, and the real-time counter.
Microsemi Libero SoC will generate IP that will load and configure the Analog Block via the ACM.
However, users are not limited to using the Libero SoC IP. This section provides a detailed description of
the ACM's register map, truth tables for proper configuration of the Analog Block and RTC, as well as
timing waveforms so users can access and control the ACM directly from their designs.
The Analog Block contains four 8-bit latches per Analog Quad that are initialized through the ACM.
These latches act as configuration bits for Analog Quads. The ACM block runs from the core voltage
supply (1.5 V).
Access to the ACM is achieved via 8-bit address and data busses with enables. The pin list is provided in
Table 2-36 on page 2-81. The ACM clock speed is limited to a maximum of 10 MHz, more than sufficient
to handle the low-bandwidth requirements of configuring the Analog Block and the RTC (sub-block of the
Analog Block).
Table 2-54 decodes the ACM address space and maps it to the corresponding Analog Quad and
configuration byte for that quad.
Table 2-54 • ACM Address Decode Table for Analog Quad
ACMADDR [7:0] in
Decimal
Name
Description
Associated
Peripheral
0
–
–
Analog Quad
1
AQ0
Byte 0
Analog Quad
2
AQ0
Byte 1
Analog Quad
3
AQ0
Byte 2
Analog Quad
4
AQ0
Byte 3
Analog Quad
5
AQ1
Byte 0
Analog Quad
.
.
.
.
.
.
.
.
.
Analog Quad
36
AQ8
Byte 3
Analog Quad
37
AQ9
Byte 0
Analog Quad
38
AQ9
Byte 1
Analog Quad
39
AQ9
Byte 2
Analog Quad
40
AQ9
Byte 3
Analog Quad
Undefined
Analog Quad
Undefined
Analog Quad
Undefined
RTC
41
.
.
.
.
.
.
63
64
COUNTER0
Counter bits 7:0
RTC
65
COUNTER1
Counter bits 15:8
RTC
66
COUNTER2
Counter bits 23:16
RTC
67
COUNTER3
Counter bits 31:24
RTC
68
COUNTER4
Counter bits 39:32
RTC
72
MATCHREG0
Match register bits 7:0
RTC
73
MATCHREG1
Match register bits 15:8
RTC
Revision 4
2- 129
Device Architecture
Table 2-54 • ACM Address Decode Table for Analog Quad (continued)
ACMADDR [7:0] in
Decimal
Name
Description
Associated
Peripheral
74
MATCHREG2
Match register bits 23:16
RTC
75
MATCHREG3
Match register bits 31:24
RTC
76
MATCHREG4
Match register bits 39:32
RTC
80
MATCHBITS0
Individual match bits 7:0
RTC
81
MATCHBITS1
Individual match bits 15:8
RTC
82
MATCHBITS2
Individual match bits 23:16
RTC
83
MATCHBITS3
Individual match bits 31:24
RTC
84
MATCHBITS4
Individual match bits 39:32
RTC
88
CTRL_STAT
Control (write) / Status (read) register
bits 7:0
RTC
Note: ACMADDR bytes 1 to 40 pertain to the Analog Quads; bytes 64 to 89 pertain to the RTC.
ACM Characteristics1
ACMCLK
tSUEACM
tHEACM
ACMWEN
tSUDACM
ACMWDATA
tSUAACM
ACMADDRESS
tHDACM
D0
D1
tHAACM
A0
A1
Figure 2-97 • ACM Write Waveform
tMPWCLKACM
ACMCLK
ACMADDRESS
A0
A1
tCLKQACM
ACMRDATA
RD0
RD1
Figure 2-98 • ACM Read Waveform
1. When addressing the RTC addresses (i.e., ACMADDR 64 to 89), there is no timing generator, and the rc_osc, byte_en, and
aq_wen signals have no impact.
2- 13 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-55 • Analog Configuration Multiplexer (ACM) Timing
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tCLKQACM
Clock-to-Q of the ACM
19.73
22.48
26.42
ns
tSUDACM
Data Setup time for the ACM
4.39
5.00
5.88
ns
tHDACM
Data Hold time for the ACM
0.00
0.00
0.00
ns
tSUAACM
Address Setup time for the ACM
4.73
5.38
6.33
ns
tHAACM
Address Hold time for the ACM
0.00
0.00
0.00
ns
tSUEACM
Enable Setup time for the ACM
3.93
4.48
5.27
ns
tHEACM
Enable Hold time for the ACM
0.00
0.00
0.00
ns
tMPWARACM
Asynchronous Reset Minimum Pulse Width for the
ACM
10.00
10.00
10.00
ns
tREMARACM
Asynchronous Reset Removal time for the ACM
12.98
14.79
17.38
ns
tRECARACM
Asynchronous Reset Recovery time for the ACM
12.98
14.79
17.38
ns
tMPWCLKACM
Clock Minimum Pulse Width for the ACM
45.00
45.00
45.00
ns
tFMAXCLKACM
lock Maximum Frequency for the ACM
10.00
10.00
10.00
MHz
Revision 4
2- 131
Device Architecture
Analog Quad ACM Description
Table 2-56 maps out the ACM space associated with configuration of the Analog Quads within the
Analog Block. Table 2-56 shows the byte assignment within each quad and the function of each bit within
each byte. Subsequent tables will explain each bit setting and how it corresponds to a particular
configuration. After 3.3 V and 1.5 V are applied to Fusion, Analog Quad configuration registers are
loaded with default settings until the initialization and configuration state machine changes them to userdefined settings.
Table 2-56 • Analog Quad ACM Byte Assignment
Byte
Bit
Signal (Bx)
Byte 0
0
B0[0]
(AV)
1
B0[1]
2
B0[2]
3
Function
Default Setting
Scaling factor control – prescaler
Highest voltage range
B0[3]
Analog MUX select
Prescaler
4
B0[4]
Current monitor switch
Off
5
B0[5]
Direct analog input switch
Off
6
B0[6]
Selects V-pad polarity
Positive
7
B0[7]
Prescaler op amp mode
Power-down
Byte 1
0
B1[0]
Scaling factor control – prescaler
Highest voltage range
(AC)
1
B1[1]
2
B1[2]
3
B1[3]
Analog MUX select
Prescaler
4
B1[4]
5
B1[5]
Direct analog input switch
Off
6
B1[6]
Selects C-pad polarity
Positive
7
B1[7]
Prescaler op amp mode
Power-down
Byte 2
0
B2[0]
Internal chip temperature monitor * Off
(AG)
1
B2[1]
Spare
–
2
B2[2]
Current drive control
Lowest current
3
B2[3]
4
B2[4]
Spare
–
5
B2[5]
Spare
–
6
B2[6]
Selects G-pad polarity
Positive
7
B2[7]
Selects low/high drive
Low drive
Byte 3
0
B3[0]
Scaling factor control – prescaler
Highest voltage range
(AT)
1
B3[1]
2
B3[2]
3
B3[3]
Analog MUX select
Prescaler
4
B3[4]
5
B3[5]
Direct analog input switch
Off
6
B3[6]
–
–
7
B3[7]
Prescaler op amp mode
Power-down
Note: *For the internal temperature monitor to function, Bit 0 of Byte 2 for all 10 Quads must be set.
2- 13 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-57 details the settings available to control the prescaler values of the AV, AC, and AT pins. Note
that the AT pin has a reduced number of available prescaler values.
Table 2-57 • Prescaler Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Scaling
Factor, Pad to
ADC Input
LSB for an
8-Bit
Conversion1
(mV)
LSB for a
10-Bit
Conversion1
(mV)
LSB for a
12-Bit
Conversion1
(mV)
Full-Scale
Voltage in
10-Bit
Mode2
Range Name
0.15625
64
16
4
16.368 V
16 V
0.3125
32
8
2
8.184 V
8V
0.625
16
4
1
4.092 V
4V
011
1.25
8
2
0.5
2.046 V
2V
100
2.5
4
1
0.25
1.023 V
1V
101
5.0
2
0.5
0.125
0.5115 V
0.5 V
110
10.0
1
0.25
0.0625
0.25575 V
0.25 V
111
20.0
0.5
0.125
0.03125
0.127875 V
0.125 V
Control Lines
Bx[2:0]
000
3
001
010
3
Notes:
1. LSB voltage equivalences assume VAREF = 2.56 V.
2. Full Scale voltage for n-bit mode: ((2^n) - 1) x (LSB for a n-bit Conversion)
3. These are the only valid ranges for the Temperature Monitor Block Prescaler.
Table 2-58 details the settings available to control the MUX within each of the AV, AC, and AT circuits.
This MUX determines whether the signal routed to the ADC is the direct analog input, prescaled signal,
or output of either the Current Monitor Block or the Temperature Monitor Block.
Table 2-58 • Analog Multiplexer Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines Bx[4]
Control Lines Bx[3]
ADC Connected To
0
0
Prescaler
0
1
Direct input
1
0
Current amplifier temperature monitor
1
1
Not valid
Table 2-59 details the settings available to control the Direct Analog Input switch for the AV, AC, and AT
pins.
Table 2-59 • Direct Analog Input Switch Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines Bx[5]
Direct Input Switch
0
Off
1
On
Table 2-60 details the settings available to control the polarity of the signals coming to the AV, AC, and AT
pins. Note that the only valid setting for the AT pin is logic 0 to support positive voltages.
Table 2-60 • Voltage Polarity Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)*
Control Lines Bx[6]
Input Signal Polarity
0
Positive
1
Negative
Note: *The B3[6] signal for the AT pad should be kept at logic 0 to accept only positive voltages.
Revision 4
2- 133
Device Architecture
Table 2-61 details the settings available to either power down or enable the prescaler associated with the
analog inputs AV, AC, and AT.
Table 2-61 • Prescaler Op Amp Power-Down Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3)
Control Lines Bx[7]
Prescaler Op Amp
0
Power-down
1
Operational
Table 2-62 details the settings available to enable the Current Monitor Block associated with the AC pin.
Table 2-62 • Current Monitor Input Switch Control Truth Table—AV (x = 0)
Control Lines B0[4]
Current Monitor Input Switch
0
Off
1
On
Table 2-63 details the settings available to configure the drive strength of the gate drive when not in highdrive mode.
Table 2-63 • Low-Drive Gate Driver Current Truth Table (AG)
Control Lines B2[3]
Control Lines B2[2]
Current (µA)
0
0
1
0
1
3
1
0
10
1
1
30
Table 2-64 details the settings available to set the polarity of the gate driver (either p-channel- or
n-channel-type devices).
Table 2-64 • Gate Driver Polarity Truth Table (AG)
Control Lines B2[6]
Gate Driver Polarity
0
Positive
1
Negative
Table 2-65 details the settings available to turn on the Gate Driver and set whether high-drive mode is on
or off.
Table 2-65 • Gate Driver Control Truth Table (AG)
Control Lines B2[7]
GDON
Gate Driver
0
0
Off
0
1
Low drive on
1
0
Off
1
1
High drive on
Table 2-66 details the settings available to turn on and off the chip internal temperature monitor.
Note: For the internal temperature monitor to function, Bit 0 of Byte 2 for all 10 Quads must be set.
Table 2-66 • Internal Temperature Monitor Control Truth Table
2- 13 4
Control Lines B2[0]
PDTMB
0
0
Off
1
1
On
R e visio n 4
Chip Internal Temperature Monitor
Fusion Family of Mixed Signal FPGAs
User I/Os
Introduction
Fusion devices feature a flexible I/O structure, supporting a range of mixed voltages (1.5 V, 1.8 V, 2.5 V,
and 3.3 V) through a bank-selectable voltage. Table 2-68, Table 2-69, Table 2-70, and Table 2-71 on
page 2-138 show the voltages and the compatible I/O standards. I/Os provide programmable slew rates,
drive strengths, weak pull-up, and weak pull-down circuits. 3.3 V PCI and 3.3 V PCI-X are 5 V–tolerant.
See the "5 V Input Tolerance" section on page 2-147 for possible implementations of 5 V tolerance.
All I/Os are in a known state during power-up, and any power-up sequence is allowed without current
impact. Refer to the "I/O Power-Up and Supply Voltage Thresholds for Power-On Reset (Commercial
and Industrial)" section on page 3-5 for more information. In low power standby or sleep mode (VCC is
OFF, VCC33A is ON, VCCI is ON) or when the resource is not used, digital inputs are tristated, digital
outputs are tristated, and digital bibufs (input/output) are tristated.
I/O Tile
The Fusion I/O tile provides a flexible, programmable structure for implementing a large number of I/O
standards. In addition, the registers available in the I/O tile in selected I/O banks can be used to support
high-performance register inputs and outputs, with register enable if desired (Figure 2-99 on
page 2-136). The registers can also be used to support the JESD-79C DDR standard within the I/O
structure (see the "Double Data Rate (DDR) Support" section on page 2-142 for more information).
As depicted in Figure 2-100 on page 2-141, all I/O registers share one CLR port. The output register and
output enable register share one CLK port. Refer to the "I/O Registers" section on page 2-141 for more
information.
I/O Banks and I/O Standards Compatibility
The digital I/Os are grouped into I/O voltage banks. There are three digital I/O banks on the AFS090 and
AFS250 devices and four digital I/O banks on the AFS600 and AFS1500 devices. Figure 2-113 on
page 2-161 and Figure 2-114 on page 2-162 show the bank configuration by device. The north side of
the I/O in the AFS600 and AFS1500 devices comprises two banks of Pro I/Os. The Pro I/Os support a
wide number of voltage-referenced I/O standards in addition to the multitude of single-ended and
differential I/O standards common throughout all Microsemi digital I/Os. Each I/O voltage bank has
dedicated I/O supply and ground voltages (VCCI/GNDQ for input buffers and VCCI/GND for output
buffers). Because of these dedicated supplies, only I/Os with compatible standards can be assigned to
the same I/O voltage bank. Table 2-69 and Table 2-70 on page 2-137 show the required voltage
compatibility values for each of these voltages.
For more information about I/O and global assignments to I/O banks, refer to the specific pin table of the
device in the "Package Pin Assignments" on page 4-1 and the "User I/O Naming Convention" section on
page 2-161.
Each Pro I/O bank is divided into minibanks. Any user I/O in a VREF minibank (a minibank is the region
of scope of a VREF pin) can be configured as a VREF pin (Figure 2-99 on page 2-136). Only one VREF
pin is needed to control the entire VREF minibank. The location and scope of the VREF minibanks can
be determined by the I/O name. For details, see the "User I/O Naming Convention" section on
page 2-161.
Table 2-70 on page 2-137 shows the I/O standards supported by Fusion devices and the corresponding
voltage levels.
I/O standards are compatible if the following are true:
•
Their VCCI values are identical.
•
If both of the standards need a VREF, their VREF values must be identical (Pro I/O only).
Revision 4
2- 135
Device Architecture
Bank 0
CCC
Bank 1
CCC
Up to five VREF
minibanks within
an I/O bank
CCC
Common VREF
signal for all I/Os
in VREF minibanks
VREF signal scope is
between 8 and 18 I/Os.
I/O
I/O
VCCI
GND
VCC
I/O
I/O
I/O
I/O
VCCI
GND
VCC
I/O
I/O
If needed, the VREF for a given
minibank can be provided by
any I/O within the minibank.
I/O Pad
Figure 2-99 • Fusion Pro I/O Bank Detail Showing VREF Minibanks (north side ofAFS600 and AFS1500)
Table 2-67 • I/O Standards Supported by Bank Type
I/O Bank
Standard I/O
Single-Ended I/O Standards
Differential I/O
Standards
LVTTL/LVCMOS 3.3 V, LVCMOS –
2.5 V / 1.8 V / 1.5 V, LVCMOS
2.5/5.0 V
Voltage-Referenced
–
Advanced I/O LVTTL/LVCMOS 3.3 V, LVCMOS LVPECL
2.5 V / 1.8 V / 1.5 V, LVCMOS
LVDS
2.5/5.0 V, 3.3 V PCI / 3.3 V PCIX
and –
Pro I/O
and GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V,
HSTL Class I and II, SSTL2 Class I
and II, SSTL3 Class I and II
2- 13 6
LVTTL/LVCMOS 3.3 V, LVCMOS LVPECL
2.5 V / 1.8 V / 1.5 V, LVCMOS
LVDS
2.5/5.0 V, 3.3 V PCI / 3.3 V PCIX
R e visio n 4
HotSwap
Yes
–
Yes
Fusion Family of Mixed Signal FPGAs
Table 2-68 • I/O Bank Support by Device
I/O Bank
AFS090
AFS250
AFS600
AFS1500
Standard I/O
N
N
–
–
Advanced I/O
E, W
E, W
E, W
E, W
Pro I/O
–
–
N
N
Analog Quad
S
S
S
S
Note: E = East side of the device
W = West side of the device
N = North side of the device
S = South side of the device
Table 2-69 • Fusion VCCI Voltages and Compatible Standards
VCCI (typical)
Compatible Standards
3.3 V
LVTTL/LVCMOS 3.3, PCI 3.3, SSTL3 (Class I and II),* GTL+ 3.3, GTL 3.3,* LVPECL
2.5 V
LVCMOS 2.5, LVCMOS 2.5/5.0, SSTL2 (Class I and II),* GTL+ 2.5,* GTL 2.5,* LVDS, BLVDS, MLVDS
1.8 V
LVCMOS 1.8
1.5 V
LVCMOS 1.5, HSTL (Class I),* HSTL (Class II)*
Note: *I/O standard supported by Pro I/O banks.
Table 2-70 • Fusion VREF Voltages and Compatible Standards*
VREF (typical)
Compatible Standards
1.5 V
SSTL3 (Class I and II)
1.25 V
SSTL2 (Class I and II)
1.0 V
GTL+ 2.5, GTL+ 3.3
0.8 V
GTL 2.5, GTL 3.3
0.75 V
HSTL (Class I), HSTL (Class II)
Note: *I/O standards supported by Pro I/O banks.
Revision 4
2- 137
3.3 V
2.5 V
2- 13 8
1.8 V
–
1.5 V
–
–
0.80 V
1.00 V
1.50 V
–
0.80 V
1.00 V
1.25 V
0.75 V
Note: White box: Allowable I/O standard combinations
Gray box: Illegal I/O standard combinations
R e visio n 4
LVPECL (3.3 V)
LVDS (2.5 V ± 5%)
SSTL3 Class I and II (3.3 V)
SSTL2 Class I and II (2.5 V)
HSTL Class I and II (1.5 V)
GTL (2.5 V)
GTL (3.3 V)
GTL + (2.5 V)
GTL + (3.3 V)
3.3 V PCI / PCI-X
LVCMOS 1.5 V
LVCMOS 1.8 V
LVCMOS 2.5 V
LVTTL/LVCMOS 3.3 V
Minibank Voltage (typical)
I/O Bank Voltage (typical)
Device Architecture
Table 2-71 • Fusion Standard and Advanced I/O Features
Fusion Family of Mixed Signal FPGAs
Features Supported on Pro I/Os
Table 2-72 lists all features supported by transmitter/receiver for single-ended and differential I/Os.
Table 2-72 • Fusion Pro I/O Features
Feature
Description
Single-ended
and
voltage- •
referenced transmitter
features
•
CMOS-style LVDS,
M-LVDS, or LVPECL
transmitter
Activation of hot insertion (disabling the clamp diode) is selectable by I/Os.
•
Weak pull-up and pull-down
•
Two slew rates
•
Skew between output buffer enable/disable time: 2 ns delay (rising edge) and
0 ns delay (falling edge); see "Selectable Skew between Output Buffer
Enable/Disable Time" on page 2-152 for more information
•
Five drive strengths
•
5 V–tolerant receiver ("5 V Input Tolerance" section on page 2-147)
•
LVTTL/LVCMOS 3.3 V outputs compatible with 5 V TTL inputs ("5 V Output
Tolerance" section on page 2-151)
•
High performance (Table 2-76 on page 2-146)
•
Schmitt trigger option
•
ESD protection
•
Programmable delay: 0 ns if bypassed, 0.625 ns with '000' setting, 6.575 ns
with '111' setting, 0.85-ns intermediate delay increments (at 25°C, 1.5 V)
•
High performance (Table 2-76 on page 2-146)
•
Separate ground planes, GND/GNDQ, for input buffers only to avoid outputinduced noise in the input circuitry
differential •
Programmable Delay: 0 ns if bypassed, 0.625 ns with '000' setting, 6.575 ns
with '111' setting, 0.85-ns intermediate delay increments (at 25°C, 1.5 V)
Single-ended receiver features
Voltage-referenced
receiver features
Hot insertion in every mode except PCI or 5 V input tolerant (these modes use
clamp diodes and do not allow hot insertion)
•
High performance (Table 2-76 on page 2-146)
•
Separate ground planes, GND/GNDQ, for input buffers only to avoid outputinduced noise in the input circuitry
BLVDS, •
Two I/Os and external resistors are used to provide a CMOS-style LVDS,
BLVDS, M-LVDS, or LVPECL transmitter solution.
LVDS/LVPECL differential
receiver features
•
Activation of hot insertion (disabling the clamp diode) is selectable by I/Os.
•
Weak pull-up and pull-down
•
Fast slew rate
•
ESD protection
•
High performance (Table 2-76 on page 2-146)
•
Programmable delay: 0.625 ns with '000' setting, 6.575 ns with '111' setting,
0.85-ns intermediate delay increments (at 25°C, 1.5 V)
•
Separate input buffer ground and power planes to avoid output-induced noise
in the input circuitry
Revision 4
2- 139
Device Architecture
Table 2-73 • Maximum I/O Frequency for Single-Ended, Voltage-Referenced, and Differential I/Os;
All I/O Bank Types (maximum drive strength and high slew selected)
Specification
Performance Up To
LVTTL/LVCMOS 3.3 V
200 MHz
LVCMOS 2.5 V
250 MHz
LVCMOS 1.8 V
200 MHz
LVCMOS 1.5 V
130 MHz
PCI
200 MHz
PCI-X
200 MHz
HSTL-I
300 MHz
HSTL-II
300 MHz
SSTL2-I
300 MHz
SSTL2-II
300 MHz
SSTL3-I
300 MHz
SSTL3-II
300 MHz
GTL+ 3.3 V
300 MHz
GTL+ 2.5 V
300 MHz
GTL 3.3 V
300 MHz
GTL 2.5 V
300 MHz
LVDS
350 MHz
LVPECL
300 MHz
2- 14 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
I/O Registers
Each I/O module contains several input, output, and enable registers. Refer to Figure 2-100 for a
simplified representation of the I/O block.
The number of input registers is selected by a set of switches (not shown in Figure 2-100) between
registers to implement single or differential data transmission to and from the FPGA core. The Designer
software sets these switches for the user.
A common CLR/PRE signal is employed by all I/O registers when I/O register combining is used. Input
register 2 does not have a CLR/PRE pin, as this register is used for DDR implementation. The I/O
register combining must satisfy some rules.
1
Input
Reg
I/O / Q0
2
Input
Reg
Y
CLR/PRE
To FPGA Core
I/O / Q1
ICE
3
Input
Reg
Pull-Up/Down
Resistor Control
PAD
CLR/PRE
I/O / ICLK
Signal Drive Strength
and Slew-Rate Control
A
I/O / D0
E = Enable Pin
4
OCE Output
Reg
From FPGA Core
CLR/PRE
I/O / D1 / ICE
ICE
5
Output
Reg
CLR/PRE
I/O / OCLK
I/O / OE
6
OCE Output
Enable
Reg
CLR/PRE
I/O / CLR or I/O / PRE / OCE
Note: Fusion I/Os have registers to support DDR functionality (see the "Double Data Rate (DDR) Support" section on
page 2-142 for more information).
Figure 2-100 • I/O Block Logical Representation
Revision 4
2- 141
Device Architecture
Double Data Rate (DDR) Support
Fusion Pro I/Os support 350 MHz DDR inputs and outputs. In DDR mode, new data is present on every
transition of the clock signal. Clock and data lines have identical bandwidths and signal integrity
requirements, making it very efficient for implementing very high-speed systems.
DDR interfaces can be implemented using HSTL, SSTL, LVDS, and LVPECL I/O standards. In addition,
high-speed DDR interfaces can be implemented using LVDS I/O.
Input Support for DDR
The basic structure to support a DDR input is shown in Figure 2-101. Three input registers are used to
capture incoming data, which is presented to the core on each rising edge of the I/O register clock.
Each I/O tile on Fusion devices supports DDR inputs.
Output Support for DDR
The basic DDR output structure is shown in Figure 2-102 on page 2-143. New data is presented to the
output every half clock cycle. Note: DDR macros and I/O registers do not require additional routing. The
combiner automatically recognizes the DDR macro and pushes its registers to the I/O register area at the
edge of the chip. The routing delay from the I/O registers to the I/O buffers is already taken into account
in the DDR macro.
Refer to the application note Using DDR for Fusion Devices for more information.
Input DDR
A
D
Data
INBUF
FF1
E
B
CLK
CLKBUF
FF2
C
CLR
INBUF
DDR_IN
Figure 2-101 • DDR Input Register Support in Fusion Devices
2- 14 2
Out_QF
(to core)
R e visio n 4
Out_QR
(to core)
Fusion Family of Mixed Signal FPGAs
A
Data_F
(from core)
FF1
B
CLK
CLKBUF
0
E
C
D
Data_R
Out
(from core)
1
OUTBUF
FF2
B
CLR
INBUF
C
DDR_OUT
Figure 2-102 • DDR Output Support in Fusion Devices
Revision 4
2- 143
Device Architecture
Hot-Swap Support
Hot-swapping (also called hot plugging) is the operation of hot insertion or hot removal of a card in (or
from) a powered-up system. The levels of hot-swap support and examples of related applications are
described in Table 2-74. The I/Os also need to be configured in hot insertion mode if hot plugging
compliance is required.
Table 2-74 • Levels of Hot-Swap Support
Hot
Power
Swapping
Applied
Level
Description to Device Bus State
1
Cold-swap
No
–
2
Hot-swap
while reset
Yes
3
Hot-swap
while bus
idle
4
Hot-swap on
an active
bus
2- 14 4
Device
Example of
Card
Circuitry
Application with
Ground
Connected Cards that Contain Compliance of
Connection to Bus Pins Fusion Devices
Fusion Devices
–
–
System and card with
Microsemi FPGA chip
are powered down,
then card gets
plugged into system,
then power supplies
are turned on for
system but not for
FPGA on card.
Compliant I/Os
can but do not
have to be set to
hot insertion
mode.
Held in
Must be made –
reset state and
maintained for
1 ms before,
during, and
after insertion/
removal
In PCI hot plug
specification, reset
control circuitry
isolates the card
busses until the card
supplies are at their
nominal operating
levels and stable.
Compliant I/Os
can but do not
have to be set to
hot insertion
mode.
Yes
Held idle
Same as
(no ongoing Level 2
I/O
processes
during
insertion/re
moval)
Must remain
glitch-free
during
power-up or
power-down
Board bus shared
with card bus is
"frozen," and there is
no toggling activity on
bus. It is critical that
the logic states set on
the bus signal do not
get disturbed during
card
insertion/removal.
Compliant with
cards with two
levels of staging.
I/Os have to be
set to hot
insertion mode.
Yes
Bus may
Same as
have active Level 2
I/O
processes
ongoing,
but device
being
inserted or
removed
must be
idle.
Same as
Level 3
There is activity on
the system bus, and it
is critical that the logic
states set on the bus
signal do not get
disturbed during card
insertion/removal.
Compliant with
cards with two
levels of staging.
I/Os have to be
set to hot
insertion mode.
R e visio n 4
Fusion Family of Mixed Signal FPGAs
For Fusion devices requiring Level 3 and/or Level 4 compliance, the board drivers connected to Fusion
I/Os need to have 10 k (or lower) output drive resistance at hot insertion, and 1 k (or lower) output
drive resistance at hot removal. This is the resistance of the transmitter sending a signal to the Fusion
I/O, and no additional resistance is needed on the board. If that cannot be assured, three levels of
staging can be used to meet Level 3 and/or Level 4 compliance. Cards with two levels of staging should
have the following sequence:
1. Grounds
2. Powers, I/Os, other pins
Cold-Sparing Support
Cold-sparing means that a subsystem with no power applied (usually a circuit board) is electrically
connected to the system that is in operation. This means that all input buffers of the subsystem must
present very high input impedance with no power applied so as not to disturb the operating portion of the
system.
Pro I/O banks and standard I/O banks fully support cold-sparing.
For Pro I/O banks, standards such as PCI that require I/O clamp diodes, can also achieve cold-sparing
compliance, since clamp diodes get disconnected internally when the supplies are at 0 V.
For Advanced I/O banks, since the I/O clamp diode is always active, cold-sparing can be accomplished
either by employing a bus switch to isolate the device I/Os from the rest of the system or by driving each
advanced I/O pin to 0 V.
If Standard I/O banks are used in applications requiring cold-sparing, a discharge path from the power
supply to ground should be provided. This can be done with a discharge resistor or a switched resistor.
This is necessary because the standard I/O buffers do not have built-in I/O clamp diodes.
If a resistor is chosen, the resistor value must be calculated based on decoupling capacitance on a given
power supply on the board (this decoupling capacitor is in parallel with the resistor). The RC time
constant should ensure full discharge of supplies before cold-sparing functionality is required. The
resistor is necessary to ensure that the power pins are discharged to ground every time there is an
interruption of power to the device.
I/O cold-sparing may add additional current if the pin is configured with either a pull-up or pull down
resistor and driven in the opposite direction. A small static current is induced on each IO pin when the pin
is driven to a voltage opposite to the weak pull resistor. The current is equal to the voltage drop across
the input pin divided by the pull resistor. Please refer to Table 2-95 on page 2-172, Table 2-96 on
page 2-172, and Table 2-97 on page 2-174 for the specific pull resistor value for the corresponding I/O
standard.
For example, assuming an LVTTL 3.3 V input pin is configured with a weak Pull-up resistor, a current will
flow through the pull-up resistor if the input pin is driven low. For an LVTTL 3.3 V, pull-up resistor is ~45
k and the resulting current is equal to 3.3 V / 45 k = 73 µA for the I/O pin. This is true also when a
weak pull-down is chosen and the input pin is driven high. Avoiding this current can be done by driving
the input low when a weak pull-down resistor is used, and driving it high when a weak pull-up resistor is
used.
In Active and Static modes, this current draw can occur in the following cases:
•
Input buffers with pull-up, driven low
•
Input buffers with pull-down, driven high
•
Bidirectional buffers with pull-up, driven low
•
Bidirectional buffers with pull-down, driven high
•
Output buffers with pull-up, driven low
•
Output buffers with pull-down, driven high
•
Tristate buffers with pull-up, driven low
•
Tristate buffers with pull-down, driven high
Revision 4
2- 145
Device Architecture
Electrostatic Discharge (ESD) Protection
Fusion devices are tested per JEDEC Standard JESD22-A114-B.
Fusion devices contain clamp diodes at every I/O, global, and power pad. Clamp diodes protect all
device pads against damage from ESD as well as from excessive voltage transients.
Each I/O has two clamp diodes. One diode has its positive (P) side connected to the pad and its negative
(N) side connected to VCCI. The second diode has its P side connected to GND and its N side
connected to the pad. During operation, these diodes are normally biased in the Off state, except when
transient voltage is significantly above VCCI or below GND levels.
By selecting the appropriate I/O configuration, the diode is turned on or off. Refer to Table 2-75 and
Table 2-76 on page 2-146 for more information about I/O standards and the clamp diode.
The second diode is always connected to the pad, regardless of the I/O configuration selected.
Table 2-75 • Fusion Standard and Advanced I/O – Hot-Swap and 5 V Input Tolerance Capabilities
Clamp Diode
I/O Assignment
Hot Insertion
5 V Input Tolerance 1
Standard Advanced Standard Advanced Standard Advanced
I/O
I/O
I/O
I/O
I/O
I/O
3.3 V LVTTL/LVCMOS
No
3.3 V PCI, 3.3 V PCI-X
Yes
N/A
Yes
LVCMOS 2.5 V
No
LVCMOS 2.5 V / 5.0 V
N/A
LVCMOS 1.8 V
Yes
No
Input
Buffer
Output
Buffer
Yes1
Yes1
Enabled/Disabled
N/A
1
Enabled/Disabled
N/A
No
Yes
Yes
Yes
No
No
No
Enabled/Disabled
Yes
N/A
No
N/A
Yes2
Enabled/Disabled
No
Yes
Yes
No
No
No
Enabled/Disabled
LVCMOS 1.5 V
No
Yes
Yes
No
No
No
Enabled/Disabled
Differential,
LVDS/BLVDS/MLVDS/ LVPECL 3
N/A
Yes
N/A
No
N/A
No
Enabled/Disabled
Notes:
1. Can be implemented with an external IDT bus switch, resistor divider, or Zener with resistor.
2. Can be implemented with an external resistor and an internal clamp diode.
3. Bidirectional LVPECL buffers are not supported. I/Os can be configured as either input buffers or output buffers.
Table 2-76 • Fusion Pro I/O – Hot-Swap and 5 V Input Tolerance Capabilities
Clamp
Diode
I/O Assignment
Hot
Insertion
5 V Input
Tolerance
Input Buffer
Output Buffer
1
Enabled/Disabled
3.3 V LVTTL/LVCMOS
No
Yes
Yes
3.3 V PCI, 3.3 V PCI-X
Yes
No
Yes1
Enabled/Disabled
No
Yes
No
Enabled/Disabled
LVCMOS 2.5 V
3
3
2
Yes
No
Yes
LVCMOS 1.8 V
No
Yes
No
Enabled/Disabled
LVCMOS 1.5 V
No
Yes
No
Enabled/Disabled
No
Yes
No
Enabled/Disabled
No
Yes
No
Enabled/Disabled
LVCMOS 2.5 V / 5.0 V
Voltage-Referenced Input Buffer
Differential, LVDS/BLVDS/M-LVDS/LVPECL
4
Enabled/Disabled
Notes:
1. Can be implemented with an external IDT bus switch, resistor divider, or Zener with resistor.
2. Can be implemented with an external resistor and an internal clamp diode.
3. In the SmartGen, FlashROM, Flash Memory System Builder, and Analog System Builder User's Guide, select the
LVCMOS5 macro for the LVCMOS 2.5 V / 5.0 V I/O standard or the LVCMOS25 macro for the LVCMOS 2.5 V I/O
standard.
4. Bidirectional LVPECL buffers are not supported. I/Os can be configured as either input buffers or output buffers.
2- 14 6
R e visio n 4
Fusion Family of Mixed Signal FPGAs
5 V Input Tolerance
I/Os can support 5 V input tolerance when LVTTL 3.3 V, LVCMOS 3.3 V, LVCMOS 2.5 V / 5 V, and
LVCMOS 2.5 V configurations are used (see Table 2-77 on page 2-150 for more details). There are four
recommended solutions (see Figure 2-103 to Figure 2-106 on page 2-149 for details of board and macro
setups) to achieve 5 V receiver tolerance. All the solutions meet a common requirement of limiting the
voltage at the input to 3.6 V or less. In fact, the I/O absolute maximum voltage rating is 3.6 V, and any
voltage above 3.6 V may cause long-term gate oxide failures.
Solution 1
The board-level design needs to ensure that the reflected waveform at the pad does not exceed the limits
provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.
This scheme will also work for a 3.3 V PCI / PCI-X configuration, but the internal diode should not be
used for clamping, and the voltage must be limited by the two external resistors, as explained below.
Relying on the diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.
The following are some examples of possible resistor values (based on a simplified simulation model
with no line effects and 10  transmitter output resistance, where Rtx_out_high = (VCCI – VOH) / IOH,
Rtx_out_low = VOL / IOL).
Example 1 (high speed, high current):
Rtx_out_high = Rtx_out_low = 10 
R1 = 36  (±5%), P(r1)min = 0.069 
R2 = 82  (±5%), P(r2)min = 0.158 
Imax_tx = 5.5 V / (82 * 0.95 + 36 * 0.95 + 10) = 45.04 mA
tRISE = tFALL = 0.85 ns at C_pad_load = 10 pF (includes up to 25% safety margin)
tRISE = tFALL = 4 ns at C_pad_load = 50 pF (includes up to 25% safety margin)
Example 2 (low–medium speed, medium current):
Rtx_out_high = Rtx_out_low = 10 
R1 = 220  (±5%), P(r1)min = 0.018 
R2 = 390  (±5%), P(r2)min = 0.032 
Imax_tx = 5.5 V / (220 * 0.95 + 390 * 0.95 + 10) = 9.17 mA
tRISE = tFALL = 4 ns at C_pad_load = 10 pF (includes up to 25% safety margin)
tRISE = tFALL = 20 ns at C_pad_load = 50 pF (includes up to 25% safety margin)
Other values of resistors are also allowed as long as the resistors are sized appropriately to limit the
voltage at the receiving end to 2.5 V < Vin(rx) < 3.6 V when the transmitter sends a logic 1. This range of
Vin_dc(rx) must be assured for any combination of transmitter supply (5 V ± 0.5 V), transmitter output
resistance, and board resistor tolerances.
Revision 4
2- 147
Device Architecture
Temporary overshoots are allowed according to Table 3-4 on page 3-4.
Solution 1
Fusion I/O Input
Off-Chip
On-Chip
3.3 V
5.5 V
Rext1
Rext2
Requires two board resistors,
LVCMOS 3.3 V I/Os
Figure 2-103 • Solution 1
Solution 2
The board-level design must ensure that the reflected waveform at the pad does not exceed limits
provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.
This scheme will also work for a 3.3 V PCI/PCI-X configuration, but the internal diode should not be used
for clamping, and the voltage must be limited by the external resistors and Zener, as shown in Figure 2104. Relying on the diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.
Solution 2
Fusion I/O Input
Off-Chip
On-Chip
3.3 V
5.5 V
Rext1
Zener
3.3 V
Requires one board resistor, one
Zener 3.3 V diode, LVCMOS 3.3 V I/Os
Figure 2-104 • Solution 2
2- 14 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Solution 3
The board-level design must ensure that the reflected waveform at the pad does not exceed limits
provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.
This scheme will also work for a 3.3 V PCI/PCIX configuration, but the internal diode should not be used
for clamping, and the voltage must be limited by the bus switch, as shown in Figure 2-105. Relying on the
diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.
Solution 3
Fusion I/O Input
Off-Chip
On-Chip
Bus
Switch
IDTQS32X23
3.3 V
5.5 V
5.5 V
Requires a bus switch on the board,
LVTTL/LVCMOS 3.3 V I/Os.
Figure 2-105 • Solution 3
Solution 4
Solution 4
Fusion I/O Input
Off-Chip
5.5 V
On-Chip
2.5 V On-Chip
Clamp
Diode
2.5 V
Rext1
Requires one board resistor.
Available for LVCMOS 2.5 V / 5.0 V.
Figure 2-106 • Solution 4
Revision 4
2- 149
Device Architecture
Table 2-77 • Comparison Table for 5 V–Compliant Receiver Scheme
Schem
e
Board Components
1
Two resistors
2
Resistor and Zener 3.3 V
3
Bus switch
4
Minimum resistor
Speed
Low to
high1
Medium
High
value2
R = 47  at TJ = 70°C
R = 150  at TJ = 85°C
R = 420  at TJ = 100°C
Medium
Current Limitations
Limited by transmitter's drive strength
Limited by transmitter's drive strength
N/A
Maximum diode current at 100% duty cycle, signal constantly
at '1'
52.7 mA at TJ =70°C / 10-year lifetime
16.5 mA at TJ = 85°C / 10-year lifetime
5.9 mA at TJ = 100°C / 10-year lifetime
For duty cycles other than 100%, the currents can be
increased by a factor = 1 / (duty cycle).
Example: 20% duty cycle at 70°C
Maximum current = (1 / 0.2) * 52.7 mA = 5 * 52.7 mA = 263.5
mA
Notes:
1. Speed and current consumption increase as the board resistance values decrease.
2. Resistor values ensure I/O diode long-term reliability.
2- 15 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
5 V Output Tolerance
Fusion I/Os must be set to 3.3 V LVTTL or 3.3 V LVCMOS mode to reliably drive 5 V TTL receivers. It is
also critical that there be NO external I/O pull-up resistor to 5 V, since this resistor would pull the I/O pad
voltage beyond the 3.6 V absolute maximum value and consequently cause damage to the I/O.
When set to 3.3 V LVTTL or 3.3 V LVCMOS mode, Fusion I/Os can directly drive signals into 5 V TTL
receivers. In fact, VOL = 0.4 V and VOH = 2.4 V in both 3.3 V LVTTL and 3.3 V LVCMOS modes exceed
the VIL = 0.8 V and VIH = 2 V level requirements of 5 V TTL receivers. Therefore, level '1' and level '0'
will be recognized correctly by 5 V TTL receivers.
Simultaneously Switching Outputs and PCB Layout
•
Simultaneously switching outputs (SSOs) can produce signal integrity problems on adjacent
signals that are not part of the SSO bus. Both inductive and capacitive coupling parasitics of bond
wires inside packages and of traces on PCBs will transfer noise from SSO busses onto signals
adjacent to those busses. Additionally, SSOs can produce ground bounce noise and VCCI dip
noise. These two noise types are caused by rapidly changing currents through GND and VCCI
package pin inductances during switching activities:
•
Ground bounce noise voltage = L(GND) * di/dt
•
VCCI dip noise voltage = L(VCCI) * di/dt
Any group of four or more input pins switching on the same clock edge is considered an SSO bus. The
shielding should be done both on the board and inside the package unless otherwise described.
In-package shielding can be achieved in several ways; the required shielding will vary depending on
whether pins next to SSO bus are LVTTL/LVCMOS inputs, LVTTL/LVCMOS outputs, or
GTL/SSTL/HSTL/LVDS/LVPECL inputs and outputs. Board traces in the vicinity of the SSO bus have to
be adequately shielded from mutual coupling and inductive noise that can be generated by the SSO bus.
Also, noise generated by the SSO bus needs to be reduced inside the package.
PCBs perform an important function in feeding stable supply voltages to the IC and, at the same time,
maintaining signal integrity between devices.
Key issues that need to considered are as follows:
•
Power and ground plane design and decoupling network design
•
Transmission line reflections and terminations
Revision 4
2- 151
Device Architecture
Selectable Skew between Output Buffer Enable/Disable Time
The configurable skew block is used to delay the output buffer assertion (enable) without affecting
deassertion (disable) time.
Output Enable
(from FPGA core)
ENABLE (IN)
MUX
ENABLE (OUT)
Skew Circuit
I/O Output
Buffers
Skew Select
Figure 2-107 • Block Diagram of Output Enable Path
ENABLE (IN)
ENABLE (OUT)
Less than
0.1 ns
Less than
0.1 ns
Figure 2-108 • Timing Diagram (option1: bypasses skew circuit)
ENABLE (IN)
ENABLE (OUT)
1.2 ns
(typical)
Less than
0.1 ns
Figure 2-109 • Timing Diagram (option 2: enables skew circuit)
2- 15 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
At the system level, the skew circuit can be used in applications where transmission activities on
bidirectional data lines need to be coordinated. This circuit, when selected, provides a timing margin that
can prevent bus contention and subsequent data loss or transmitter overstress due to transmitter-totransmitter current shorts. Figure 2-110 presents an example of the skew circuit implementation in a
bidirectional communication system. Figure 2-111 shows how bus contention is created, and Figure 2112 on page 2-154 shows how it can be avoided with the skew circuit.
Transmitter
ENABLE/
DISABLE
Transmitter 1: Fusion I/O
Skew or
Bypass
Skew
EN(r1)
Routing
Delay (t1)
ENABLE(t1)
EN(b1)
Transmitter 2: Generic I/O
EN(b2)
Routing
Delay (t2)
ENABLE(t2)
Bidirectional Data Bus
Figure 2-110 • Example of Implementation of Skew Circuits in Bidirectional Transmission Systems Using
Fusion Devices
EN (b1)
EN (b2)
ENABLE (r1)
ENABLE (t1)
Transmitter 1: OFF
Transmitter 1: ON
Transmitter 1: OFF
ENABLE (t2)
Transmitter 2: ON
Transmitter 2: OFF
Bus
Contention
Figure 2-111 • Timing Diagram (bypasses skew circuit)
Revision 4
2- 153
Device Architecture
EN (b1)
EN (b2)
ENABLE (t1)
Transmitter 1: OFF
Transmitter 1: ON
Transmitter 1: OFF
ENABLE (t2)
Transmitter 2: ON
Transmitter 2: OFF
Result: No Bus Contention
Figure 2-112 • Timing Diagram (with skew circuit selected)
Weak Pull-Up and Weak Pull-Down Resistors
Fusion devices support optional weak pull-up and pull-down resistors for each I/O pin. When the I/O is
pulled up, it is connected to the VCCI of its corresponding I/O bank. When it is pulled down, it is
connected to GND. Refer to Table 2-97 on page 2-174 for more information.
Slew Rate Control and Drive Strength
Fusion devices support output slew rate control: high and low. The high slew rate option is recommended
to minimize the propagation delay. This high-speed option may introduce noise into the system if
appropriate signal integrity measures are not adopted. Selecting a low slew rate reduces this kind of
noise but adds some delays in the system. Low slew rate is recommended when bus transients are
expected. Drive strength should also be selected according to the design requirements and noise
immunity of the system.
The output slew rate and multiple drive strength controls are available in LVTTL/LVCMOS 3.3 V,
LVCMOS 2.5 V, LVCMOS 2.5 V / 5.0 V input, LVCMOS 1.8 V, and LVCMOS 1.5 V. All other I/O
standards have a high output slew rate by default.
For Fusion slew rate and drive strength specifications, refer to the appropriate I/O bank table:
•
Fusion Standard I/O (Table 2-78 on page 2-155)
•
Fusion Advanced I/O (Table 2-79 on page 2-155)
•
Fusion Pro I/O (Table 2-80 on page 2-155)
Table 2-83 on page 2-158 lists the default values for the above selectable I/O attributes as well as those
that are preset for each I/O standard.
2- 15 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Refer to Table 2-78, Table 2-79, and Table 2-80 on page 2-155 for SLEW and OUT_DRIVE settings.
Table 2-81 on page 2-156 and Table 2-82 on page 2-157 list the I/O default attributes. Table 2-83 on
page 2-158 lists the voltages for the supported I/O standards.
Table 2-78 • Fusion Standard I/O Standards—OUT_DRIVE Settings
OUT_DRIVE (mA)
I/O Standards
2
4
6
8
Slew
LVTTL/LVCMOS 3.3 V
3
3
3
3
High
Low
LVCMOS 2.5 V
3
3
3
3
High
Low
LVCMOS 1.8 V
3
3
–
–
High
Low
LVCMOS 1.5 V
3
–
–
–
High
Low
Table 2-79 • Fusion Advanced I/O Standards—SLEW and OUT_DRIVE Settings
OUT_DRIVE (mA)
I/O Standards
2
4
6
8
12
16
Slew
LVTTL/LVCMOS 3.3 V
3
3
3
3
3
3
High
Low
LVCMOS 2.5 V
3
3
3
3
3
–
High
Low
LVCMOS 1.8 V
3
3
3
3
–
–
High
Low
LVCMOS 1.5 V
3
3
–
–
–
–
High
Low
Table 2-80 • Fusion Pro I/O Standards—SLEW and OUT_DRIVE Settings
OUT_DRIVE (mA)
I/O Standards
2
4
6
8
12
16
24
LVTTL/LVCMOS 3.3 V
3
3
3
3
3
3
3
High
Low
LVCMOS 2.5 V
3
3
3
3
3
3
3
High
Low
LVCMOS 2.5 V/5.0 V
3
3
3
3
3
3
3
High
Low
LVCMOS 1.8 V
3
3
3
3
3
3
–
High
Low
LVCMOS 1.5 V
3
3
3
3
3
–
–
High
Low
Revision 4
Slew
2- 155
Device Architecture
SKEW (tribuf and bibuf only)
RES_PULL
OUT_LOAD (output only)
COMBINE_REGISTER
IN_DELAY (input only)
IN_DELAY_VAL (input only)
SCHMITT_TRIGGER (input only)
Table 2-81 • Fusion Pro I/O Default Attributes
Off
None
35 pF
–
Off
0
Off
Off
None
35 pF
–
Off
0
Off
Off
None
35 pF
–
Off
0
Off
Off
None
35 pF
–
Off
0
Off
LVCMOS 1.5 V
Off
None
35 pF
–
Off
0
Off
PCI (3.3 V)
Off
None
10 pF
–
Off
0
Off
PCI-X (3.3 V)
Off
None
10 pF
–
Off
0
Off
GTL+ (3.3 V)
Off
None
10 pF
–
Off
0
Off
GTL+ (2.5 V)
Off
None
10 pF
–
Off
0
Off
GTL (3.3 V)
Off
None
10 pF
–
Off
0
Off
GTL (2.5 V)
Off
None
10 pF
–
Off
0
Off
HSTL Class I
Off
None
20 pF
–
Off
0
Off
HSTL Class II
Off
None
20 pF
–
Off
0
Off
SSTL2
Class I and II
Off
None
30 pF
–
Off
0
Off
SSTL3
Class I and II
Off
None
30 pF
–
Off
0
Off
LVDS, BLVDS,
M-LVDS
Off
None
0 pF
–
Off
0
Off
LVPECL
Off
None
0 pF
–
Off
0
Off
I/O Standards
LVTTL/LVCMO
S 3.3 V
LVCMOS 2.5 V
LVCMOS
2.5/5.0 V
LVCMOS 1.8 V
2- 15 6
SLEW
(output only)
OUT_DRIVE
(output only)
Refer to the following
tables for more
information:
Refer to the following
tables for more
information:
Table 2-78 on page 2-155
Table 2-78 on page 2-155
Table 2-79 on page 2-155
Table 2-79 on page 2-155
Table 2-80 on page 2-155
Table 2-80 on page 2-155
R e visio n 4
Fusion Family of Mixed Signal FPGAs
COMBINE_REGISTER
OUT_DRIVE (output only)
OUT_LOAD (output only)
SLEW (output only)
RES_PULL
I/O Standards
SKEW (tribuf and bibuf only)
Table 2-82 • Advanced I/O Default Attributes
Off
None
35 pF
–
Off
None
35 pF
–
Off
None
35 pF
–
Off
None
35 pF
–
Off
None
35 pF
–
PCI (3.3 V)
Off
None
10 pF
–
PCI-X (3.3 V)
Off
None
10 pF
–
LVDS, BLVDS, M-LVDS
Off
None
–
–
LVPECL
Off
None
–
–
LVTTL/LVCMOS 3.3 V
Refer to the following
tables for more
information:
Refer to the following tables
for more information:
LVCMOS 2.5/5.0 V
Table 2-78 on page 2-155
Table 2-79 on page 2-155
LVCMOS 1.8 V
Table 2-79 on page 2-155
Table 2-80 on page 2-155
LVCMOS 1.5 V
Table 2-80 on page 2-155
LVCMOS 2.5 V
Table 2-78 on page 2-155
Revision 4
2- 157
Device Architecture
Table 2-83 • Fusion Pro I/O Supported Standards and Corresponding VREF and VTT Voltages
Input/Output Supply
Voltage (VCCI_TYP)
Input Reference Voltage
(VREF_TYP)
Board Termination Voltage
(VTT_TYP)
LVTTL/LVCMOS 3.3 V
3.30 V
–
–
LVCMOS 2.5 V
2.50 V
–
–
LVCMOS 2.5 V / 5.0 V
Input
2.50 V
–
–
LVCMOS 1.8 V
1.80 V
–
–
LVCMOS 1.5 V
1.50 V
–
–
PCI 3.3 V
3.30 V
–
–
PCI-X 3.3 V
3.30 V
–
–
GTL+ 3.3 V
3.30 V
1.00 V
1.50 V
GTL+ 2.5 V
2.50 V
1.00 V
1.50 V
GTL 3.3 V
3.30 V
0.80 V
1.20 V
GTL 2.5 V
2.50 V
0.80 V
1.20 V
HSTL Class I
1.50 V
0.75 V
0.75 V
HSTL Class II
1.50 V
0.75 V
0.75 V
SSTL3 Class I
3.30 V
1.50 V
1.50 V
SSTL3 Class II
3.30 V
1.50 V
1.50 V
SSTL2 Class I
2.50 V
1.25 V
1.25 V
SSTL2 Class II
2.50 V
1.25 V
1.25 V
LVDS, BLVDS, M-LVDS
2.50 V
–
–
LVPECL
3.30 V
–
–
I/O Standard
2- 15 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
I/O Software Support
In the Fusion development software, default settings have been defined for the various I/O standards
supported. Changes can be made to the default settings via the use of attributes; however, not all I/O
attributes are applicable for all I/O standards. Table 2-84 and Table 2-85 list the valid I/O attributes that
can be manipulated by the user for each I/O standard.
Single-ended I/O standards in Fusion support up to five different drive strengths.
Table 2-84 • Fusion Standard and Advanced I/O Attributes vs. I/O Standard Applications
I/O Standards
SLEW
SKEW
(output OUT_DRIVE (all macros
OUT_LOAD
only)
(output only) with OE)* RES_PULL (output only) COMBINE_REGISTER
LVTTL/LVCMOS 3.3 V
3
3
3
3
3
3
LVCMOS 2.5 V
3
3
3
3
3
3
LVCMOS 2.5/5.0 V
3
3
3
3
3
3
LVCMOS 1.8 V
3
3
3
3
3
3
LVCMOS 1.5 V
3
3
3
3
3
3
3
3
3
3
3
3
PCI (3.3 V)
PCI-X (3.3 V)
LVDS, BLVDS, M-LVDS
3
3
3
3
LVPECL
Note: *This feature does not apply to the standard I/O banks, which are the north I/O banks of AFS090 and AFS250
devices
Revision 4
2- 159
Device Architecture
HOT_SWAPPABLE
SCHMITT_TRIGGER (input only)
IN_DELAY_VAL (input only)
IN_DELAY (input only)
COMBINE_REGISTER
OUT_LOAD (output only)
RES_PULL
OUT_DRIVE (output only)
SLEW (output only)
I/O Standards
SKEW (all macros with OE)
Table 2-85 • Fusion Pro I/O Attributes vs. I/O Standard Applications
LVTTL/LVCMOS 3.3 V
3
3
3
3
3
3
3
3
3
3
LVCMOS 2.5 V
3
3
3
3
3
3
3
3
3
3
LVCMOS 2.5/5.0 V
3
3
3
3
3
3
3
3
3
3
LVCMOS 1.8 V
3
3
3
3
3
3
3
3
3
3
LVCMOS 1.5 V
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
GTL+ (3.3 V)
3
3
3
3
3
3
GTL+ (2.5 V)
3
3
3
3
3
3
GTL (3.3 V)
3
3
3
3
3
3
GTL (2.5 V)
3
3
3
3
3
3
HSTL Class I
3
3
3
3
3
3
HSTL Class II
3
3
3
3
3
3
SSTL2 Class I and II
3
3
3
3
3
3
SSTL3 Class I and II
3
3
3
3
3
3
LVDS, BLVDS, M-LVDS
3
3
3
3
3
3
3
3
3
PCI (3.3 V)
PCI-X (3.3 V)
3
LVPECL
2- 16 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
User I/O Naming Convention
Due to the comprehensive and flexible nature of Fusion device user I/Os, a naming scheme is used to
show the details of the I/O (Figure 2-113 on page 2-161 and Figure 2-114 on page 2-162). The name
identifies to which I/O bank it belongs, as well as the pairing and pin polarity for differential I/Os.
I/O Nomenclature
= Gmn/IOuxwByVz
Gmn is only used for I/Os that also have CCC access—i.e., global pins.
G
= Global
m
= Global pin location associated with each CCC on the device: A (northwest corner), B (northeast corner), C
(east middle), D (southeast corner), E (southwest corner), and F (west middle).
n
= Global input MUX and pin number of the associated Global location m, either A0, A1, A2, B0, B1, B2, C0, C1,
or C2. Figure 2-22 on page 2-27 shows the three input pins per clock source MUX at CCC location m.
u
= I/O pair number in the bank, starting at 00 from the northwest I/O bank and proceeding in a clockwise
direction.
x
= P (Positive) or N (Negative) for differential pairs, or R (Regular – single-ended) for the I/Os that support singleended and voltage-referenced I/O standards only. U (Positive-LVDS only) or V (Negative-LVDS only) restrict
the I/O differential pair from being selected as an LVPECL pair.
w
= D (Differential Pair), P (Pair), or S (Single-Ended). D (Differential Pair) if both members of the pair are bonded
out to adjacent pins or are separated only by one GND or NC pin; P (Pair) if both members of the pair are
bonded out but do not meet the adjacency requirement; or S (Single-Ended) if the I/O pair is not bonded out.
For Differential (D) pairs, adjacency for ball grid packages means only vertical or horizontal. Diagonal
adjacency does not meet the requirements for a true differential pair.
B
= Bank
y
= Bank number (0–3). The Bank number starts at 0 from the northwest I/O bank and proceeds in a clockwise
direction.
V
= Reference voltage
z
= Minibank number
Standard I/O Bank
Bank 0
Bank 3
CCC/PLL
"F"
Bank 1
AFS090
AFS250
Bank 3
CCC
"E"
CCC
"B"
CCC
"C"
Bank 1
Bank 2 (analog)
Advanced I/O Bank
Advanced I/O Bank
CCC
"A"
CCC
"D"
Analog Quads
Figure 2-113 • Naming Conventions of Fusion Devices with Three Digital I/O Banks
Revision 4
2- 161
Device Architecture
Pro I/O Bank
Bank 0
Bank 1
Bank 4
CCC/PLL
"F"
Bank 2
AFS600
AFS1500
Bank 4
CCC
"E"
CCC
"B"
CCC/PLL
"C"
Bank 2
Bank 3 (analog)
CCC
"D"
Analog Quads
Figure 2-114 • Naming Conventions of Fusion Devices with Four I/O Banks
2- 16 2
R e visio n 4
Advnaced I/O Bank
Advanced I/O Bank
CCC
"A"
Fusion Family of Mixed Signal FPGAs
User I/O Characteristics
Timing Model
I/O Module
(Non-Registered)
Combinational Cell
Combinational Cell
Y
Y
tPD = 0.56 ns
tPD = 0.49 ns
LVPECL (Pro IO banks)
tDp = 1.60 ns
I/O Module
(Non-Registered)
Combinational Cell
Y
LVTTL/LVCMOS 3.3 V (Pro I/O banks)
tDP = 2.74 ns Output drive strength = 12 mA
High slew rate
tPD = 0.87 ns
I/O Module
Combinational Cell
(Non-Registered)
Y
I/O Module
(Registered)
LVTTL/LVCMOS 3.3 V (Pro I/O banks)
Output drive strength = 24 mA
tDP = 2.39 ns High slew rate
tPY = 1.22 ns
LVPECL
(Pro IO Banks)
tPD = 0.51 ns
D
Q
Combinational Cell
I/O Module
(Non-Registered)
Y
Input LVTTL/LVCMOS
3.3 V (Pro IO banks)
tICLKQ = 0.24 ns
tISUD = 0.26 ns
tPY = 0.90 ns
Register Cell Combinational Cell
D
D
Q
D
Q
GTL+ 3.3 V
tDP = 1.53 ns
tPD = 0.47 ns
tCLKQ = 0.55 ns
tSUD = 0.43 ns
tPY = 1.36 ns
I/O Module
(Registered)
Register Cell
Y
Q
I/O Module
(Non-Registered)
LVDS,
BLVDS,
M-LVDS (Pro IO Banks)
LVCMOS 1.5 V (Pro IO banks)
Output drive strength = 12 mA
tDP = 3.30 ns High slew
tPD = 0.47 ns
Input LVTTL/LVCMOS
3.3 V (Pro IO banks)
tCLKQ = 0.55 ns
tSUD = 0.43 ns
IInput LVTTL/LVCMOS
3.3 V (Pro IO banks)
tPY = 0.90 ns
tPY = 0.90 ns
tOCLKQ = 0.59 ns
tOSUD = 0.31 ns
Figure 2-115 • Timing Model
Operating Conditions: –2 Speed, Commercial Temperature Range (TJ = 70°C),
Worst-Case VCC = 1.425 V
Revision 4
2- 163
Device Architecture
tPY
tPYS
tDIN
D
PAD
Q
DIN
Y
CLK
tPY = MAX(tPY (R), tPY (F))
tPYs = MAX(tPYS (R), tPYS (F))
tDIN = MAX(tDIN (R), tDIN (F))
To Array
I/O interface
VIH
PAD
Vtrip
Vtrip
VIL
VCC
50%
50%
Y
GND
tPY
(R)
tPY
(F)
tPYS
(R)
tPYS
(F)
VCC
50%
DIN
GND
50%
tDIN
tDIN
(R)
(F)
Figure 2-116 • Input Buffer Timing Model and Delays (example)
2- 16 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
tDOUT
tDP
D Q
D
PAD
DOUT
Std
Load
CLK
From Array
tDP = MAX(tDP(R), tDP(F))
tDOUT = MAX(tDOUT(R), tDOUT(F))
I/O Interface
tDOUT
(R)
D
50%
tDOUT
VCC
(F)
50%
0V
VCC
DOUT
50%
50%
0V
VOH
Vtrip
Vtrip
PAD
tDP
(R)
tDP
(F)
VOL
Figure 2-117 • Output Buffer Model and Delays (example)
Revision 4
2- 165
Device Architecture
tEOUT
D Q
tZL, tZH, tHZ, tLZ, tZLS, tZHS
CLK
E
EOUT
D Q
PAD
DOUT
CLK
D
tEOUT = MAX(tEOUT (R). tEOUT (F))
I/O Interface
VCC
D
VCC
50%
tEOUT (F)
50%
tEOUT (R)
E
EOUT
VCC
50%
tZL
PAD
tHZ
Vtrip
50%
50%
tZH
VCCI
90% VCCI
Vtrip
VOL
VCC
D
VCC
E
50%
EOUT
PAD
tEOUT (R)
50%
VCC
tEOUT (F)
50%
50%
tZLS
VOH
Vtrip
50%
tZHS
Vtrip
VOL
Figure 2-118 • Tristate Output Buffer Timing Model and Delays (example)
2- 16 6
R e visio n 4
50%
tLZ
10% VCCI
Fusion Family of Mixed Signal FPGAs
Overview of I/O Performance
Summary of I/O DC Input and Output Levels – Default I/O Software Settings
Table 2-86 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions
Applicable to Pro I/Os
VIL
I/O Standard
Drive
Slew Min.
Strength Rate
V
VIH
VOL
VOH
IOL IOH
mA mA
Max.
V
Min.
V
Max.
V
Max.
V
Min.
V
3.3 V LVTTL /
3.3 V LVCMOS
12 mA
High –0.3
0.8
2
3.6
0.4
2.4
12
12
2.5 V LVCMOS
12 mA
High –0.3
0.7
1.7
3.6
0.7
1.7
12
12
1.8 V LVCMOS
12 mA
High –0.3
0.35 * VCCI
0.65 * VCCI
3.6
0.45
VCCI – 0.45
12
12
1.5 V LVCMOS
12 mA
High –0.3
0.35 * VCCI
0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI 12
12
3.3 V PCI
Per PCI Specification
3.3 V PCI-X
Per PCI-X Specification
20
mA2
High –0.3 VREF – 0.05 VREF + 0.05
3.6
0.4
–
20
20
2.5 V GTL
20
mA2
High –0.3 VREF – 0.05 VREF + 0.05
3.6
0.4
–
20
20
3.3 V GTL+
35 mA
High –0.3
VREF – 0.1
VREF + 0.1
3.6
0.6
–
35
35
2.5 V GTL+
33 mA
High –0.3
VREF – 0.1
VREF + 0.1
3.6
0.6
–
33
33
HSTL (I)
8 mA
3.3 V GTL
High –0.3
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCI – 0.4
8
8
HSTL (II)
15
mA2
High –0.3
VREF – 0.1
VREF + 0.1
3.6
0.4
VCCI – 0.4
15
15
SSTL2 (I)
15 mA
High –0.3
VREF – 0.2
VREF + 0.2
3.6
0.54
VCCI – 0.62
15
15
SSTL2 (II)
18 mA
High –0.3
VREF – 0.2
VREF + 0.2
3.6
0.35
VCCI – 0.43
18
18
SSTL3 (I)
14 mA
High –0.3
VREF – 0.2
VREF + 0.2
3.6
0.7
VCCI – 1.1
14
14
SSTL3 (II)
21 mA
High –0.3
VREF – 0.2
VREF + 0.2
3.6
0.5
VCCI – 0.9
21
21
Notes:
1. Currents are measured at 85°C junction temperature.
2. Output drive strength is below JEDEC specification.
3. Output slew rate can be extracted by the IBIS models.
Table 2-87 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions
Applicable to Advanced I/Os
VIL
I/O Standard
Drive
Slew
Strength Rate
VIH
VOL
VOH
IOL IOH
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
V
mA
mA
3.3 V LVTTL /
3.3 V LVCMOS
12 mA
High
–0.3
0.8
2
3.6
0.4
2.4
12
12
2.5 V LVCMOS
12 mA
High
–0.3
0.7
1.7
2.7
0.7
1.7
12
12
1.8 V LVCMOS
12 mA
High
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45
VCCI – 0.45
12
12
1.5 V LVCMOS
12 mA
High
–0.3
0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI
12
12
3.3 V PCI
3.3 V PCI-X
Per PCI specifications
Per PCI-X specifications
Note: Currents are measured at 85°C junction temperature.
Revision 4
2- 167
Device Architecture
Table 2-88 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions
Applicable to Standard I/Os
VIL
VIH
VOL
VOH
IOL IOH
mA mA
Drive
Strength
Slew
Rate
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
V
3.3 V LVTTL /
3.3 V LVCMOS
8 mA
High
–0.3
0.8
2
3.6
0.4
2.4
8
8
2.5 V LVCMOS
8 mA
High
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
1.8 V LVCMOS
4 mA
High
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45
VCCI – 0.45
4
4
1.5 V LVCMOS
2 mA
High
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
2
2
I/O Standard
Note: Currents are measured at 85°C junction temperature.
Table 2-89 • Summary of Maximum and Minimum DC Input Levels Applicable to Commercial and Industrial
Conditions
Applicable to All I/O Bank Types
Commercial1
Industrial2
IIL3
IIH4
IIL3
IIH4
DC I/O Standards
µA
µA
µA
µA
3.3 V LVTTL / 3.3 V LVCMOS
10
10
15
15
2.5 V LVCMOS
10
10
15
15
1.8 V LVCMOS
10
10
15
15
1.5 V LVCMOS
10
10
15
15
3.3 V PCI
10
10
15
15
3.3 V PCI-X
10
10
15
15
3.3 V GTL
10
10
15
15
2.5 V GTL
10
10
15
15
3.3 V GTL+
10
10
15
15
2.5 V GTL+
10
10
15
15
HSTL (I)
10
10
15
15
HSTL (II)
10
10
15
15
SSTL2 (I)
10
10
15
15
SSTL2 (II)
10
10
15
15
SSTL3 (I)
10
10
15
15
SSTL3 (II)
10
10
15
15
Notes:
1.
2.
3.
4.
Commercial range (0°C < TJ < 85°C)
Industrial range (–40°C < TJ < 100°C)
IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
2- 16 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Summary of I/O Timing Characteristics – Default I/O Software Settings
Table 2-90 • Summary of AC Measuring Points
Applicable to All I/O Bank Types
Input Reference Voltage
(VREF_TYP)
Board Termination Voltage
(VTT_REF)
Measuring Trip Point
(Vtrip)
3.3 V LVTTL / 3.3 V LVCMOS
–
–
1.4 V
2.5 V LVCMOS
–
–
1.2 V
1.8 V LVCMOS
–
–
0.90 V
1.5 V LVCMOS
–
–
0.75 V
3.3 V PCI
–
–
0.285 * VCCI (RR)
0.615 * VCCI (FF))
3.3 V PCI-X
–
–
0.285 * VCCI (RR)
0.615 * VCCI (FF)
3.3 V GTL
0.8 V
1.2 V
VREF
2.5 V GTL
0.8 V
1.2 V
VREF
3.3 V GTL+
1.0 V
1.5 V
VREF
2.5 V GTL+
1.0 V
1.5 V
VREF
HSTL (I)
0.75 V
0.75 V
VREF
HSTL (II)
0.75 V
0.75 V
VREF
SSTL2 (I)
1.25 V
1.25 V
VREF
SSTL2 (II)
1.25 V
1.25 V
VREF
SSTL3 (I)
1.5 V
1.485 V
VREF
SSTL3 (II)
1.5 V
1.485 V
VREF
LVDS
–
–
Cross point
LVPECL
–
–
Cross point
Standard
Table 2-91 • I/O AC Parameter Definitions
Parameter
Definition
tDP
Data to Pad delay through the Output Buffer
tPY
Pad to Data delay through the Input Buffer with Schmitt trigger disabled
tDOUT
Data to Output Buffer delay through the I/O interface
tEOUT
Enable to Output Buffer Tristate Control delay through the I/O interface
tDIN
Input Buffer to Data delay through the I/O interface
tPYS
Pad to Data delay through the Input Buffer with Schmitt trigger enabled
tHZ
Enable to Pad delay through the Output Buffer—High to Z
tZH
Enable to Pad delay through the Output Buffer—Z to High
tLZ
Enable to Pad delay through the Output Buffer—Low to Z
tZL
Enable to Pad delay through the Output Buffer—Z to Low
tZHS
Enable to Pad delay through the Output Buffer with delayed enable—Z to High
tZLS
Enable to Pad delay through the Output Buffer with delayed enable—Z to Low
Revision 4
2- 169
Device Architecture
Units
tZHS
tZLS
tHZ
tLZ
tZH
tZL
tEOUT
tPYS
tPY
tDIN
tDP
t DOUT
External Resistor (Ohm)
Capacitive Load (pF)
Slew Rate
I/O Standard
Drive Strength (mA)
Table 2-92 • Summary of I/O Timing Characteristics – Software Default Settings
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = I/O Standard Dependent
Applicable to Pro I/Os
3.3 V LVTTL/
12 mA High 35
3.3 V LVCMOS
–
0.49 2.74 0.03 0.90 1.17 0.32 2.79 2.14 2.45 2.70 4.46 3.81 ns
2.5 V LVCMOS 12 mA High 35
–
0.49 2.80 0.03 1.13 1.24 0.32 2.85 2.61 2.51 2.61 4.52 4.28 ns
1.8 V LVCMOS 12 mA High 35
–
0.49 2.83 0.03 1.08 1.42 0.32 2.89 2.31 2.79 3.16 4.56 3.98 ns
1.5 V LVCMOS 12 mA High 35
–
0.49 3.30 0.03 1.27 1.60 0.32 3.36 2.70 2.96 3.27 5.03 4.37 ns
High 10 25 2 0.49 2.09 0.03 0.78 1.25 0.32 2.13 1.49 2.45 2.70 3.80 3.16 ns
3.3 V PCI
Per
PCI
spec
3.3 V PCI-X
Per High 10 25 2 0.49 2.09 0.03 0.77 1.17 0.32 2.13 1.49 2.45 2.70 3.80 3.16 ns
PCI-X
spec
3.3 V GTL
20 mA High 10
25 0.49 1.55 0.03 2.19
–
0.32 1.52 1.55 0.00 0.00 3.19 3.22 ns
2.5 V GTL
20 mA High 10
25 0.49 1.59 0.03 1.83
–
0.32 1.61 1.59 0.00 0.00 3.28 3.26 ns
3.3 V GTL+
35 mA High 10
25 0.49 1.53 0.03 1.19
–
0.32 1.56 1.53 0.00 0.00 3.23 3.20 ns
2.5 V GTL+
33 mA High 10
25 0.49 1.65 0.03 1.13
–
0.32 1.68 1.57 0.00 0.00 3.35 3.24 ns
HSTL (I)
8 mA
High 20
50 0.49 2.37 0.03 1.59
–
0.32 2.42 2.35 0.00 0.00 4.09 4.02 ns
HSTL (II)
15 mA High 20
25 0.49 2.26 0.03 1.59
–
0.32 2.30 2.03 0.00 0.00 3.97 3.70 ns
SSTL2 (I)
17 mA High 30
50 0.49 1.59 0.03 1.00
–
0.32 1.62 1.38 0.00 0.00 3.29 3.05 ns
SSTL2 (II)
21 mA High 30
25 0.49 1.62 0.03 1.00
–
0.32 1.65 1.32 0.00 0.00 3.32 2.99 ns
SSTL3 (I)
16 mA High 30
50 0.49 1.72 0.03 0.93
–
0.32 1.75 1.37 0.00 0.00 3.42 3.04 ns
SSTL3 (II)
24 mA High 30
25 0.49 1.54 0.03 0.93
–
0.32 1.57 1.25 0.00 0.00 3.24 2.92 ns
LVDS
24 mA High
–
–
0.49 1.57 0.03 1.36
–
–
–
–
–
–
–
–
ns
LVPECL
24 mA High
–
–
0.49 1.60 0.03 1.22
–
–
–
–
–
–
–
–
ns
Notes:
1. For specific junction temperature and voltage-supply levels, refer to Table 3-6 on page 3-7 for derating values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-123 on page 2-200
for connectivity. This resistor is not required during normal operation.
2- 17 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Units
tZHS
tZLS
tHZ
tLZ
tZH
tZL
tEOUT
tPY
tDIN
tDP
t DOUT
External Resistor (Ohm)
Capacitive Load (pF)
Slew Rate
I/O Standard
Drive Strength (mA)
Table 2-93 • Summary of I/O Timing Characteristics – Software Default Settings
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = I/O Standard Dependent
Applicable to Advanced I/Os
3.3 V LVTTL/
3.3 V LVCMOS
12 mA
High 35 pF
–
0.49 2.64 0.03 0.90 0.32 2.69 2.11 2.40 2.68 4.36 3.78 ns
2.5 V LVCMOS
12 mA
High 35 pF
–
0.49 2.66 0.03 0.98 0.32 2.71 2.56 2.47 2.57 4.38 4.23 ns
1.8 V LVCMOS
12 mA
High 35 pF
–
0.49 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns
1.5 V LVCMOS
12 mA
High 35 pF
–
0.49 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns
3.3 V PCI
3.3 V PCI-X
Per PCI
spec
High 10 pF 25 2 0.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
Per PCI-X High 10 pF 25 2 0.49 2.00 0.03 0.62 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
spec
LVDS
24 mA
High
–
–
0.49 1.37 0.03 1.20 N/A
N/A
N/A
N/A N/A N/A N/A ns
LVPECL
24 mA
High
–
–
0.49 1.34 0.03 1.05 N/A
N/A
N/A
N/A N/A N/A N/A ns
Notes:
1. For specific junction temperature and voltage-supply levels, refer to Table 3-6 on page 3-7 for derating values.
2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-123 on page 2-200
for connectivity. This resistor is not required during normal operation.
tEOUT
tZL
tZH
tLZ
tHZ
High
35 pF
–
0.49 3.29 0.03
0.75
0.32
3.36
2.80
1.79
2.01
ns
2.5 V LVCMOS 8 mA
High
35pF
–
0.49 3.56 0.03
0.96
0.32
3.40
3.56
1.78
1.91
ns
1.8 V LVCMOS 4 mA
High
35pF
–
0.49 4.74 0.03
0.90
0.32
4.02
4.74
1.80
1.85
ns
1.5 V LVCMOS 2 mA
High
35pF
–
0.49 5.71 0.03
1.06
0.32
4.71
5.71
1.83
1.83
ns
Units
tPY
3.3 V LVTTL/
8 mA
3.3 V LVCMOS
I/O Standard
tDP
tDIN
t DOUT
External Resistor (Ohm)
Capacitive Load (pF)
Slew Rate
Drive Strength (mA)
Table 2-94 • Summary of I/O Timing Characteristics – Software Default Settings
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = I/O Standard Dependent
Applicable to Standard I/Os
Note: For specific junction temperature and voltage-supply levels, refer to Table 3-6 on page 3-7 for derating values.
Revision 4
2- 171
Device Architecture
Detailed I/O DC Characteristics
Table 2-95 • Input Capacitance
Symbol
Definition
Conditions
Min.
Max.
Units
CIN
Input capacitance
VIN = 0, f = 1.0 MHz
8
pF
CINCLK
Input capacitance on the clock pin
VIN = 0, f = 1.0 MHz
8
pF
Table 2-96 • I/O Output Buffer Maximum Resistances 1
Drive Strength
RPULL-DOWN
(ohms) 2
RPULL-UP
(ohms) 3
4 mA
100
300
8 mA
50
150
12 mA
25
75
16 mA
17
50
24 mA
11
33
4 mA
100
200
8 mA
50
100
12 mA
25
50
16 mA
20
40
24 mA
11
22
2 mA
200
225
4 mA
100
112
6 mA
50
56
8 mA
50
56
12 mA
20
22
16 mA
20
22
2 mA
200
224
4 mA
100
112
6 mA
67
75
8 mA
33
37
12 mA
33
37
Per PCI/PCI-X specification
25
75
3.3 V GTL
20 mA
11
–
2.5 V GTL
20 mA
14
–
3.3 V GTL+
35 mA
12
–
2.5 V GTL+
33 mA
15
–
Standard
Applicable to Pro I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI/PCI-X
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance values depend
on VCC, drive strength selection, temperature, and process. For board design considerations and detailed output buffer
resistances, use the corresponding IBIS models located on the Microsemi SoC Products Group website:
http://www.microsemi.com/soc/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = VOLspec / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
2- 17 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-96 • I/O Output Buffer Maximum Resistances 1 (continued)
Standard
Drive Strength
RPULL-DOWN
(ohms) 2
RPULL-UP
(ohms) 3
HSTL (I)
8 mA
50
50
HSTL (II)
15 mA
25
25
SSTL2 (I)
17 mA
27
31
SSTL2 (II)
21 mA
13
15
SSTL3 (I)
16 mA
44
69
SSTL3 (II)
24 mA
18
32
2 mA
100
300
4 mA
100
300
6 mA
50
150
8 mA
50
150
12 mA
25
75
16 mA
17
50
24 mA
11
33
2 mA
100
200
4 mA
100
200
6 mA
50
100
8 mA
50
100
12 mA
25
50
16 mA
20
40
24 mA
11
22
2 mA
200
225
4 mA
100
112
6 mA
50
56
8 mA
50
56
12 mA
20
22
16 mA
20
22
2 mA
200
224
4 mA
100
112
6 mA
67
75
8 mA
33
37
12 mA
33
37
Per PCI/PCI-X specification
25
75
Applicable to Advanced I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI/PCI-X
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance values depend
on VCC, drive strength selection, temperature, and process. For board design considerations and detailed output buffer
resistances, use the corresponding IBIS models located on the Microsemi SoC Products Group website:
http://www.microsemi.com/soc/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = VOLspec / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
Revision 4
2- 173
Device Architecture
Table 2-96 • I/O Output Buffer Maximum Resistances 1 (continued)
Standard
Drive Strength
RPULL-DOWN
(ohms) 2
RPULL-UP
(ohms) 3
2 mA
100
300
4 mA
100
300
6 mA
50
150
8 mA
50
150
2 mA
100
200
4 mA
100
200
6 mA
50
100
8 mA
50
100
2 mA
200
225
4 mA
100
112
2 mA
200
224
Applicable to Standard I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance values depend
on VCC, drive strength selection, temperature, and process. For board design considerations and detailed output buffer
resistances, use the corresponding IBIS models located on the Microsemi SoC Products Group website:
http://www.microsemi.com/soc/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = VOLspec / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
Table 2-97 • I/O Weak Pull-Up/Pull-Down Resistances
Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values
R(WEAK PULL-UP)1
(ohms)
R(WEAK PULL-DOWN)2
(ohms)
VCCI
Min.
Max.
Min.
Max.
3.3 V
10 k
45 k
10 k
45 k
2.5 V
11 k
55 k
12 k
74 k
1.8 V
18 k
70 k
17 k
110 k
1.5 V
19 k
90 k
19 k
140 k
Notes:
1. R(WEAK PULL-UP-MAX) = (VCCImax – VOHspec) / IWEAK PULL-UP-MIN
2. R(WEAK PULL-DOWN-MAX) = VOLspec / IWEAK PULL-DOWN-MIN
2- 17 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-98 • I/O Short Currents IOSH/IOSL
Drive Strength
IOSH (mA)*
IOSL (mA)*
4 mA
25
27
8 mA
51
54
12 mA
103
109
16 mA
132
127
24 mA
268
181
4 mA
16
18
8 mA
32
37
12 mA
65
74
16 mA
83
87
24 mA
169
124
2 mA
9
11
4 mA
17
22
6 mA
35
44
8 mA
45
51
12 mA
91
74
16 mA
91
74
2 mA
13
16
4 mA
25
33
6 mA
32
39
8 mA
66
55
12 mA
66
55
2 mA
25
27
4 mA
25
27
6 mA
51
54
8 mA
51
54
12 mA
103
109
16 mA
132
127
24 mA
268
181
2 mA
25
27
4 mA
25
27
6 mA
51
54
8 mA
51
54
12 mA
103
109
16 mA
132
127
24 mA
268
181
Applicable to Pro I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
Applicable to Advanced I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
3.3 V LVCMOS
Note: *TJ = 100°C
Revision 4
2- 175
Device Architecture
Table 2-98 • I/O Short Currents IOSH/IOSL (continued)
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI/PCI-X
Drive Strength
IOSH (mA)*
IOSL (mA)*
2 mA
16
18
4 mA
16
18
6 mA
32
37
8 mA
32
37
12 mA
65
74
16 mA
83
87
24 mA
169
124
2 mA
9
11
4 mA
17
22
6 mA
35
44
8 mA
45
51
12 mA
91
74
16 mA
91
74
2 mA
13
16
4 mA
25
33
6 mA
32
39
8 mA
66
55
12 mA
66
55
Per PCI/PCI-X
specification
103
109
2 mA
25
27
4 mA
25
27
6 mA
51
54
8 mA
51
54
2 mA
16
18
4 mA
16
18
6 mA
32
37
8 mA
32
37
2 mA
9
11
4 mA
17
22
2 mA
13
16
Applicable to Standard I/O Banks
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
Note: *TJ = 100°C
The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The
reliability data below is based on a 3.3 V, 36 mA I/O setting, which is the worst case for this type of
analysis.
For example, at 100°C, the short current condition would have to be sustained for more than six months
to cause a reliability concern. The I/O design does not contain any short circuit protection, but such
protection would only be needed in extremely prolonged stress conditions.
2- 17 6
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-99 • Short Current Event Duration before Failure
Temperature
Time before Failure
–40°C
>20 years
0°C
>20 years
25°C
>20 years
70°C
5 years
85°C
2 years
100°C
6 months
Table 2-100 • Schmitt Trigger Input Hysteresis
Hysteresis Voltage Value (typ.) for Schmitt Mode Input Buffers
Input Buffer Configuration
Hysteresis Value (typ.)
3.3 V LVTTL/LVCMOS/PCI/PCI-X (Schmitt trigger mode)
240 mV
2.5 V LVCMOS (Schmitt trigger mode)
140 mV
1.8 V LVCMOS (Schmitt trigger mode)
80 mV
1.5 V LVCMOS (Schmitt trigger mode)
60 mV
Table 2-101 • I/O Input Rise Time, Fall Time, and Related I/O Reliability
Input Buffer
Input Rise/Fall Time (min.)
Input Rise/Fall Time (max.)
Reliability
LVTTL/LVCMOS (Schmitt trigger
disabled)
No requirement
10 ns*
20 years (100°C)
LVTTL/LVCMOS (Schmitt trigger
enabled)
No requirement
HSTL/SSTL/GTL
No requirement
10 ns*
10 years (100°C)
LVDS/BLVDS/M-LVDS/LVPECL
No requirement
10 ns*
10 years (100°C)
No requirement, but input
20 years (100°C)
noise voltage cannot exceed
Schmitt hysteresis
Note: *The maximum input rise/fall time is related only to the noise induced into the input buffer trace. If the noise is
low, the rise time and fall time of input buffers, when Schmitt trigger is disabled, can be increased beyond the
maximum value. The longer the rise/fall times, the more susceptible the input signal is to the board noise.
Microsemi recommends signal integrity evaluation/characterization of the system to ensure there is no excessive
noise coupling into input signals.
Revision 4
2- 177
Device Architecture
Single-Ended I/O Characteristics
3.3 V LVTTL / 3.3 V LVCMOS
Low-Voltage Transistor–Transistor Logic is a general-purpose standard (EIA/JESD) for 3.3 V
applications. It uses an LVTTL input buffer and push-pull output buffer. The 3.3 V LVCMOS standard is
supported as part of the 3.3 V LVTTL support.
Table 2-102 • Minimum and Maximum DC Input and Output Levels
3.3 V LVTTL /
3.3 V LVCMOS
VIL
Drive Strength
Min.
V
VIH
Max.
V
VOL
VOH
IOL IOH
IOSL
IOSH
IIL1 IIH2
mA mA
Max.
mA3
Max.
mA3
µA4 µA4
Min.
V
Max.
V
Max.
V
Min.
V
Applicable to Pro I/O Banks
4 mA
–0.3
0.8
2
3.6
0.4
2.4
4
4
27
25
10
10
8 mA
–0.3
0.8
2
3.6
0.4
2.4
8
8
54
51
10
10
12 mA
–0.3
0.8
2
3.6
0.4
2.4
12
12
109
103
10
10
16 mA
–0.3
0.8
2
3.6
0.4
2.4
16
16
127
132
10
10
24 mA
–0.3
0.8
2
3.6
0.4
2.4
24
24
181
268
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.8
2
3.6
0.4
2.4
2
2
27
25
10
10
4 mA
–0.3
0.8
2
3.6
0.4
2.4
4
4
27
25
10
10
6 mA
–0.3
0.8
2
3.6
0.4
2.4
6
6
54
51
10
10
8 mA
–0.3
0.8
2
3.6
0.4
2.4
8
8
54
51
10
10
12 mA
–0.3
0.8
2
3.6
0.4
2.4
12
12
109
103
10
10
16 mA
–0.3
0.8
2
3.6
0.4
2.4
16
16
127
132
10
10
24 mA
–0.3
0.8
2
3.6
0.4
2.4
24
24
181
268
10
10
Applicable to Standard I/O Banks
2 mA
–0.3
0.8
2
3.6
0.4
2.4
2
2
27
25
10
10
4 mA
–0.3
0.8
2
3.6
0.4
2.4
4
4
27
25
10
10
6 mA
–0.3
0.8
2
3.6
0.4
2.4
6
6
54
51
10
10
8 mA
–0.3
0.8
2
3.6
0.4
2.4
8
8
54
51
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
Figure 2-119 • AC Loading
Table 2-103 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
0
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
3.3
1.4
–
35
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
2- 17 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-104 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Spee
Drive
d
Strength Grade tDOUT
4 mA
8 mA
12 mA
16 mA
24 mA
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Std.
0.66
11.01
0.04
1.20
1.57
0.43
11.21
9.05
2.69
2.44
13.45 11.29
tZLS
tZHS
ns
–1
0.56
9.36
0.04
1.02
1.33
0.36
9.54
7.70
2.29
2.08
11.44
ns
9.60
Units
–2
0.49
8.22
0.03
0.90
1.17
0.32
8.37
6.76
2.01
1.82
10.04
8.43
ns
Std.
0.66
7.86
0.04
1.20
1.57
0.43
8.01
6.44
3.04
3.06
10.24
8.68
ns
–1
0.56
6.69
0.04
1.02
1.33
0.36
6.81
5.48
2.58
2.61
8.71
7.38
ns
–2
0.49
5.87
0.03
0.90
1.17
0.32
5.98
4.81
2.27
2.29
7.65
6.48
ns
Std.
0.66
6.03
0.04
1.20
1.57
0.43
6.14
5.02
3.28
3.47
8.37
7.26
ns
–1
0.56
5.13
0.04
1.02
1.33
0.36
5.22
4.27
2.79
2.95
7.12
6.17
ns
–2
0.49
4.50
0.03
0.90
1.17
0.32
4.58
3.75
2.45
2.59
6.25
5.42
ns
Std.
0.66
5.62
0.04
1.20
1.57
0.43
5.72
4.72
3.32
3.58
7.96
6.96
ns
–1
0.56
4.78
0.04
1.02
1.33
0.36
4.87
4.02
2.83
3.04
6.77
5.92
ns
–2
0.49
4.20
0.03
0.90
1.17
0.32
4.27
3.53
2.48
2.67
5.94
5.20
ns
Std.
0.66
5.24
0.04
1.20
1.57
0.43
5.34
4.69
3.39
3.96
7.58
6.93
ns
–1
0.56
4.46
0.04
1.02
1.33
0.36
4.54
3.99
2.88
3.37
6.44
5.89
ns
–2
0.49
3.92
0.03
0.90
1.17
0.32
3.99
3.50
2.53
2.96
5.66
5.17
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 179
Device Architecture
Table 2-105 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Drive
Speed
Strength Grade tDOUT
tDP
tDIN
tPY
tPYS
4 mA
8 mA
12 mA
16 mA
24 mA
tEOU
T
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
7.88
0.04
1.20
1.57
0.43
8.03
6.70
2.69
2.59
10.26
8.94
ns
–1
0.56
6.71
0.04
1.02
1.33
0.36
6.83
5.70
2.29
2.20
8.73
7.60
ns
–2
0.49
5.89
0.03
0.90
1.17
0.32
6.00
5.01
2.01
1.93
7.67
6.67
ns
Std.
0.66
5.08
0.04
1.20
1.57
0.43
5.17
4.14
3.05
3.21
7.41
6.38
ns
–1
0.56
4.32
0.04
1.02
1.33
0.36
4.40
3.52
2.59
2.73
6.30
5.43
ns
–2
0.49
3.79
0.03
0.90
1.17
0.32
3.86
3.09
2.28
2.40
5.53
4.76
ns
Std.
0.66
3.67
0.04
1.20
1.57
0.43
3.74
2.87
3.28
3.61
5.97
5.11
ns
–1
0.56
3.12
0.04
1.02
1.33
0.36
3.18
2.44
2.79
3.07
5.08
4.34
ns
–2
0.49
2.74
0.03
0.90
1.17
0.32
2.79
2.14
2.45
2.70
4.46
3.81
ns
Std.
0.66
3.46
0.04
1.20
1.57
0.43
3.53
2.61
3.33
3.72
5.76
4.84
ns
–1
0.56
2.95
0.04
1.02
1.33
0.36
3.00
2.22
2.83
3.17
4.90
4.12
ns
–2
0.49
2.59
0.03
0.90
1.17
0.32
2.63
1.95
2.49
2.78
4.30
3.62
ns
Std.
0.66
3.21
0.04
1.20
1.57
0.43
3.27
2.16
3.39
4.13
5.50
4.39
ns
–1
0.56
2.73
0.04
1.02
1.33
0.36
2.78
1.83
2.88
3.51
4.68
3.74
ns
–2
0.49
2.39
0.03
0.90
1.17
0.32
2.44
1.61
2.53
3.08
4.11
3.28
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 18 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-106 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
10.26
0.04
1.20
0.43
10.45
8.90
2.64
2.46
12.68
11.13
ns
–1
0.56
8.72
0.04
1.02
0.36
8.89
7.57
2.25
2.09
10.79
9.47
ns
–2
0.49
7.66
0.03
0.90
0.32
7.80
6.64
1.98
1.83
9.47
8.31
ns
Std.
0.66
7.27
0.04
1.20
0.43
7.41
6.28
2.98
3.04
9.65
8.52
ns
–1
0.56
6.19
0.04
1.02
0.36
6.30
5.35
2.54
2.59
8.20
7.25
ns
–2
0.49
5.43
0.03
0.90
0.32
5.53
4.69
2.23
2.27
7.20
6.36
ns
Std.
0.66
5.58
0.04
1.20
0.43
5.68
4.87
3.21
3.42
7.92
7.11
ns
–1
0.56
4.75
0.04
1.02
0.36
4.84
4.14
2.73
2.91
6.74
6.05
ns
–2
0.49
4.17
0.03
0.90
0.32
4.24
3.64
2.39
2.55
5.91
5.31
ns
Std.
0.66
5.21
0.04
1.20
0.43
5.30
4.56
3.26
3.51
7.54
6.80
ns
–1
0.56
4.43
0.04
1.02
0.36
4.51
3.88
2.77
2.99
6.41
5.79
ns
–2
0.49
3.89
0.03
0.90
0.32
3.96
3.41
2.43
2.62
5.63
5.08
ns
Std.
0.66
4.85
0.04
1.20
0.43
4.94
4.54
3.32
3.88
7.18
6.78
ns
–1
0.56
4.13
0.04
1.02
0.36
4.20
3.87
2.82
3.30
6.10
5.77
ns
–2
0.49
3.62
0.03
0.90
0.32
3.69
3.39
2.48
2.90
5.36
5.06
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 181
Device Architecture
Table 2-107 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
Std.
0.66
7.66
–1
0.56
6.51
–2
0.49
Std.
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
0.04
1.20
0.43
7.80
6.59
2.65
2.61
10.03
8.82
ns
0.04
1.02
0.36
6.63
5.60
2.25
2.22
8.54
7.51
ns
5.72
0.03
0.90
0.32
5.82
4.92
1.98
1.95
7.49
6.59
ns
0.66
4.91
0.04
1.20
0.43
5.00
4.07
2.99
3.20
7.23
6.31
ns
–1
0.56
4.17
0.04
1.02
0.36
4.25
3.46
2.54
2.73
6.15
5.36
ns
–2
0.49
3.66
0.03
0.90
0.32
3.73
3.04
2.23
2.39
5.40
4.71
ns
Std.
0.66
3.53
0.04
1.20
0.43
3.60
2.82
3.21
3.58
5.83
5.06
ns
–1
0.56
3.00
0.04
1.02
0.36
3.06
2.40
2.73
3.05
4.96
4.30
ns
–2
0.49
2.64
0.03
0.90
0.32
2.69
2.11
2.40
2.68
4.36
3.78
ns
Std.
0.66
3.33
0.04
1.20
0.43
3.39
2.56
3.26
3.68
5.63
4.80
ns
–1
0.56
2.83
0.04
1.02
0.36
2.89
2.18
2.77
3.13
4.79
4.08
ns
–2
0.49
2.49
0.03
0.90
0.32
2.53
1.91
2.44
2.75
4.20
3.58
ns
Std.
0.66
3.08
0.04
1.20
0.43
3.13
2.12
3.32
4.06
5.37
4.35
ns
–1
0.56
2.62
0.04
1.02
0.36
2.66
1.80
2.83
3.45
4.57
3.70
ns
–2
0.49
2.30
0.03
0.90
0.32
2.34
1.58
2.48
3.03
4.01
3.25
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-108 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
9.46
0.04
1.00
0.43
9.64
8.54
2.07
2.04
ns
–1
0.56
8.05
0.04
0.85
0.36
8.20
7.27
1.76
1.73
ns
–2
0.49
7.07
0.03
0.75
0.32
7.20
6.38
1.55
1.52
ns
Std.
0.66
9.46
0.04
1.00
0.43
9.64
8.54
2.07
2.04
ns
–1
0.56
8.05
0.04
0.85
0.36
8.20
7.27
1.76
1.73
ns
–2
0.49
7.07
0.03
0.75
0.32
7.20
6.38
1.55
1.52
ns
Std.
0.66
6.57
0.04
1.00
0.43
6.69
5.98
2.40
2.57
ns
–1
0.56
5.59
0.04
0.85
0.36
5.69
5.09
2.04
2.19
ns
–2
0.49
4.91
0.03
0.75
0.32
5.00
4.47
1.79
1.92
ns
Std.
0.66
6.57
0.04
1.00
0.43
6.69
5.98
2.40
2.57
ns
–1
0.56
5.59
0.04
0.85
0.36
5.69
5.09
2.04
2.19
ns
–2
0.49
4.91
0.03
0.75
0.32
5.00
4.47
1.79
1.92
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 18 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-109 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Std.
0.66
7.07
0.04
1.00
0.43
7.20
6.23
2.07
2.15
ns
–1
0.56
6.01
0.04
0.85
0.36
6.12
5.30
1.76
1.83
ns
–2 2
0.49
5.28
0.03
0.75
0.32
5.37
4.65
1.55
1.60
ns
Std.
0.66
7.07
0.04
1.00
0.43
7.20
6.23
2.07
2.15
ns
–1
0.56
6.01
0.04
0.85
0.36
6.12
5.30
1.76
1.83
ns
–2
0.49
5.28
0.03
0.75
0.32
5.37
4.65
1.55
1.60
ns
Std.
0.66
4.41
0.04
1.00
0.43
4.49
3.75
2.39
2.69
ns
–1
0.56
3.75
0.04
0.85
0.36
3.82
3.19
2.04
2.29
ns
Units
–2
0.49
3.29
0.03
0.75
0.32
3.36
2.80
1.79
2.01
ns
Std.
0.66
4.41
0.04
1.00
0.43
4.49
3.75
2.39
2.69
ns
–1
0.56
3.75
0.04
0.85
0.36
3.82
3.19
2.04
2.29
ns
–2
0.49
3.29
0.03
0.75
0.32
3.36
2.80
1.79
2.01
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 183
Device Architecture
2.5 V LVCMOS
Low-Voltage CMOS for 2.5 V is an extension of the LVCMOS standard (JESD8-5) used for generalpurpose 2.5 V applications.
Table 2-110 • Minimum and Maximum DC Input and Output Levels
2.5 V
LVCMOS
Drive
Strength
VIL
Min.
V
VIH
Max.
V
VOL
VOH
IOL IOH
IOSL
IOSH
IIL1 IIH2
mA mA
Max.
mA3
Max.
mA3
µA4 µA4
4
18
16
10
10
Min.
V
Max.
V
Max.
V
Min.
V
0.7
1.7
3.6
0.7
1.7
Applicable to Pro I/O Banks
4 mA
–0.3
4
8 mA
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
37
32
10
10
12 mA
–0.3
0.7
1.7
3.6
0.7
1.7
12
12
74
65
10
10
16 mA
–0.3
0.7
1.7
3.6
0.7
1.7
16
16
87
83
10
10
24 mA
–0.3
0.7
1.7
3.6
0.7
1.7
24
24
124
169
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.7
1.7
2.7
0.7
1.7
2
2
18
16
10
10
4 mA
–0.3
0.7
1.7
2.7
0.7
1.7
4
4
18
16
10
10
6 mA
–0.3
0.7
1.7
2.7
0.7
1.7
6
6
37
32
10
10
8 mA
–0.3
0.7
1.7
2.7
0.7
1.7
8
8
37
32
10
10
12 mA
–0.3
0.7
1.7
2.7
0.7
1.7
12
12
74
65
10
10
16 mA
–0.3
0.7
1.7
2.7
0.7
1.7
16
16
87
83
10
10
24 mA
–0.3
0.7
1.7
2.7
0.7
1.7
24
24
124
169
10
10
Applicable to Standard I/O Banks
2 mA
–0.3
0.7
1.7
3.6
0.7
1.7
2
2
18
16
10
10
4 mA
–0.3
0.7
1.7
3.6
0.7
1.7
4
4
18
16
10
10
6 mA
–0.3
0.7
1.7
3.6
0.7
1.7
6
6
37
32
10
10
8 mA
–0.3
0.7
1.7
3.6
0.7
1.7
8
8
37
32
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
Figure 2-120 • AC Loading
Table 2-111 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
0
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
2.5
1.2
–
35
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
2- 18 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-112 • 2.5 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Pro I/Os
Drive
Speed
Strength Grade tDOUT
4 mA
8 mA
12 mA
16 mA
24 mA
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.60
12.00
0.04
1.51
1.66
0.43
12.23 11.61
2.72
2.20
14.46 13.85
ns
–1
0.51
10.21
0.04
1.29
1.41
0.36
10.40
9.88
2.31
1.87
12.30 11.78
ns
–2
0.45
8.96
0.03
1.13
1.24
0.32
9.13
8.67
2.03
1.64
10.80 10.34
ns
Std.
0.60
8.73
0.04
1.51
1.66
0.43
8.89
8.01
3.10
2.93
11.13 10.25
ns
–1
0.51
7.43
0.04
1.29
1.41
0.36
7.57
6.82
2.64
2.49
9.47
8.72
ns
–2
0.45
6.52
0.03
1.13
1.24
0.32
6.64
5.98
2.32
2.19
8.31
7.65
ns
Std.
0.66
6.77
0.04
1.51
1.66
0.43
6.90
6.11
3.37
3.39
9.14
8.34
ns
–1
0.56
5.76
0.04
1.29
1.41
0.36
5.87
5.20
2.86
2.89
7.77
7.10
ns
–2
0.49
5.06
0.03
1.13
1.24
0.32
5.15
4.56
2.51
2.53
6.82
6.23
ns
Std.
0.66
6.31
0.04
1.51
1.66
0.43
6.42
5.73
3.42
3.52
8.66
7.96
ns
–1
0.56
5.37
0.04
1.29
1.41
0.36
5.46
4.87
2.91
3.00
7.37
6.77
ns
–2
0.49
4.71
0.03
1.13
1.24
0.32
4.80
4.28
2.56
2.63
6.47
5.95
ns
Std.
0.66
5.93
0.04
1.51
1.66
0.43
6.04
5.70
3.49
4.00
8.28
7.94
ns
–1
0.56
5.05
0.04
1.29
1.41
0.36
5.14
4.85
2.97
3.40
7.04
6.75
ns
–2
0.49
4.43
0.03
1.13
1.24
0.32
4.51
4.26
2.61
2.99
6.18
5.93
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 185
Device Architecture
Table 2-113 • 2.5 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Pro I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade tDOUT
tDP
tDIN
tPY
tPYS tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.60
8.82
0.04
1.51
1.66
0.43
8.13
8.82
2.72
2.29
10.37 11.05
ns
–1
0.51
7.50
0.04
1.29
1.41
0.36
6.92
7.50
2.31
1.95
8.82
9.40
ns
–2
0.45
6.58
0.03
1.13
1.24
0.32
6.07
6.58
2.03
1.71
7.74
8.25
ns
Std.
0.60
5.27
0.04
1.51
1.66
0.43
5.27
5.27
3.10
3.03
7.50
7.51
ns
–1
0.51
4.48
0.04
1.29
1.41
0.36
4.48
4.48
2.64
2.58
6.38
6.38
ns
–2
0.45
3.94
0.03
1.13
1.24
0.32
3.93
3.94
2.32
2.26
5.60
5.61
ns
Std.
0.66
3.74
0.04
1.51
1.66
0.43
3.81
3.49
3.37
3.49
6.05
5.73
ns
–1
0.56
3.18
0.04
1.29
1.41
0.36
3.24
2.97
2.86
2.97
5.15
4.87
ns
–2
0.49
2.80
0.03
1.13
1.24
0.32
2.85
2.61
2.51
2.61
4.52
4.28
ns
Std.
0.66
3.53
0.04
1.51
1.66
0.43
3.59
3.12
3.42
3.62
5.83
5.35
ns
–1
0.56
3.00
0.04
1.29
1.41
0.36
3.06
2.65
2.91
3.08
4.96
4.55
ns
–2
0.49
2.63
0.03
1.13
1.24
0.32
2.68
2.33
2.56
2.71
4.35
4.00
ns
Std.
0.66
3.26
0.04
1.51
1.66
0.43
3.32
2.48
3.49
4.11
5.56
4.72
ns
–1
0.56
2.77
0.04
1.29
1.41
0.36
2.83
2.11
2.97
3.49
4.73
4.01
ns
–2
0.49
2.44
0.03
1.13
1.24
0.32
2.48
1.85
2.61
3.07
4.15
3.52
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 18 6
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-114 • 2.5 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
11.40
0.04
1.31
0.43
11.22
11.40
2.68
2.20
13.45
13.63
ns
–1
0.56
9.69
0.04
1.11
0.36
9.54
9.69
2.28
1.88
11.44
11.60
ns
–2
0.49
8.51
0.03
0.98
0.32
8.38
8.51
2.00
1.65
10.05
10.18
ns
Std.
0.66
7.96
0.04
1.31
0.43
8.11
7.81
3.05
2.89
10.34
10.05
ns
–1
0.56
6.77
0.04
1.11
0.36
6.90
6.65
2.59
2.46
8.80
8.55
ns
–2
0.49
5.94
0.03
0.98
0.32
6.05
5.84
2.28
2.16
7.72
7.50
ns
Std.
0.66
6.18
0.04
1.31
0.43
6.29
5.92
3.30
3.32
8.53
8.15
ns
–1
0.56
5.26
0.04
1.11
0.36
5.35
5.03
2.81
2.83
7.26
6.94
ns
–2
0.49
4.61
0.03
0.98
0.32
4.70
4.42
2.47
2.48
6.37
6.09
ns
Std.
0.66
6.18
0.04
1.31
0.43
6.29
5.92
3.30
3.32
8.53
8.15
ns
–1
0.56
5.26
0.04
1.11
0.36
5.35
5.03
2.81
2.83
7.26
6.94
ns
–2
0.49
4.61
0.03
0.98
0.32
4.70
4.42
2.47
2.48
6.37
6.09
ns
Std.
0.66
6.18
0.04
1.31
0.43
6.29
5.92
3.30
3.32
8.53
8.15
ns
–1
0.56
5.26
0.04
1.11
0.36
5.35
5.03
2.81
2.83
7.26
6.94
ns
–2
0.49
4.61
0.03
0.98
0.32
4.70
4.42
2.47
2.48
6.37
6.09
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 187
Device Architecture
Table 2-115 • 2.5 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Advanced I/Os
Drive
Strength
4 mA
8 mA
12 mA
16 mA
24 mA
Speed
Grade
tDOUT
Std.
0.66
–1
0.56
–2
0.49
Std.
tDP
tDIN
tPY
8.66
0.04
1.31
7.37
0.04
1.11
6.47
0.03
0.98
0.66
5.17
0.04
1.31
–1
0.56
4.39
0.04
1.11
–2
0.49
3.86
0.03
0.98
Std.
0.66
3.56
0.04
1.31
–1
0.56
3.03
0.04
1.11
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
0.43
7.83
8.66
2.68
2.30
10.07
10.90
ns
0.36
6.66
7.37
2.28
1.96
8.56
9.27
ns
0.32
5.85
6.47
2.00
1.72
7.52
8.14
ns
0.43
5.04
5.17
3.05
3.00
7.27
7.40
ns
0.36
4.28
4.39
2.59
2.55
6.19
6.30
ns
0.32
3.76
3.86
2.28
2.24
5.43
5.53
ns
0.43
3.63
3.43
3.30
3.44
5.86
5.67
ns
0.36
3.08
2.92
2.81
2.92
4.99
4.82
ns
–2
0.49
2.66
0.03
0.98
0.32
2.71
2.56
2.47
2.57
4.38
4.23
ns
Std.
0.66
3.35
0.04
1.31
0.43
3.41
3.06
3.36
3.55
5.65
5.30
ns
–1
0.56
2.85
0.04
1.11
0.36
2.90
2.60
2.86
3.02
4.81
4.51
ns
–2
0.49
2.50
0.03
0.98
0.32
2.55
2.29
2.51
2.65
4.22
3.96
ns
Std.
0.66
3.56
0.04
1.31
0.43
3.63
3.43
3.30
3.44
5.86
5.67
ns
–1
0.56
3.03
0.04
1.11
0.36
3.08
2.92
2.81
2.92
4.99
4.82
ns
–2
0.49
2.66
0.03
0.98
0.32
2.71
2.56
2.47
2.57
4.38
4.23
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-116 • 2.5 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
11.00
0.04
1.29
0.43
10.37
11.00
2.03
1.83
ns
–1
0.56
9.35
0.04
1.10
0.36
8.83
9.35
1.73
1.56
ns
–2
0.49
8.21
0.03
0.96
0.32
7.75
8.21
1.52
1.37
ns
Std.
0.66
11.00
0.04
1.29
0.43
10.37
11.00
2.03
1.83
ns
–1
0.56
9.35
0.04
1.10
0.36
8.83
9.35
1.73
1.56
ns
–2
0.49
8.21
0.03
0.96
0.32
7.75
8.21
1.52
1.37
ns
Std.
0.66
7.50
0.04
1.29
0.43
7.36
7.50
2.39
2.46
ns
–1
0.56
6.38
0.04
1.10
0.36
6.26
6.38
2.03
2.10
ns
–2
0.49
5.60
0.03
0.96
0.32
5.49
5.60
1.78
1.84
ns
Std.
0.66
7.50
0.04
1.29
0.43
7.36
7.50
2.39
2.46
ns
–1
0.56
6.38
0.04
1.10
0.36
6.26
6.38
2.03
2.10
ns
–2
0.49
5.60
0.03
0.96
0.32
5.49
5.60
1.78
1.84
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 18 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-117 • 2.5 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
6 mA
8 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
8.20
0.04
1.29
0.43
7.24
8.20
2.03
1.91
ns
–1
0.56
6.98
0.04
1.10
0.36
6.16
6.98
1.73
1.62
ns
–2
0.49
6.13
0.03
0.96
0.32
5.41
6.13
1.52
1.43
ns
Std.
0.66
8.20
0.04
1.29
0.43
7.24
8.20
2.03
1.91
ns
–1
0.56
6.98
0.04
1.10
0.36
6.16
6.98
1.73
1.62
ns
–2
0.49
6.13
0.03
0.96
0.32
5.41
6.13
1.52
1.43
ns
Std.
0.66
4.77
0.04
1.29
0.43
4.55
4.77
2.38
2.55
ns
–1
0.56
4.05
0.04
1.10
0.36
3.87
4.05
2.03
2.17
ns
–2
0.49
3.56
0.03
0.96
0.32
3.40
3.56
1.78
1.91
ns
Std.
0.66
4.77
0.04
1.29
0.43
4.55
4.77
2.38
2.55
ns
–1
0.56
4.05
0.04
1.10
0.36
3.87
4.05
2.03
2.17
ns
–2
0.49
3.56
0.03
0.96
0.32
3.40
3.56
1.78
1.91
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 189
Device Architecture
1.8 V LVCMOS
Low-Voltage CMOS for 1.8 V is an extension of the LVCMOS standard (JESD8-5) used for generalpurpose 1.8 V applications. It uses a 1.8 V input buffer and push-pull output buffer.
Table 2-118 • Minimum and Maximum DC Input and Output Levels
1.8 V
LVCMOS
Drive
Strength
VIL
Min.
V
VIH
Max.
V
Min.
V
Max.
V
VOL
VOH
IOL IOH
IOSL
IOSH
IIL1 IIH2
Max.
V
Min.
V
mA mA
Max.
mA3
Max.
mA3
µA4 µA4
Applicable to Pro I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45
2
2
11
9
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45
4
4
22
17
10
10
6 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45
6
6
44
35
10
10
8 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45
8
8
51
45
10
10
12 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45 12
12
74
91
10
10
16 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45 16
16
74
91
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45 VCCI – 0.45
2
2
11
9
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45 VCCI – 0.45
4
4
22
17
10
10
6 mA
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45 VCCI – 0.45
6
6
44
35
10
10
8 mA
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45 VCCI – 0.45
8
8
51
45
10
10
12 mA
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45 VCCI – 0.45 12
12
74
91
10
10
16 mA
–0.3
0.35 * VCCI 0.65 * VCCI
1.9
0.45 VCCI – 0.45 16
16
74
91
10
10
Applicable to Standard I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45
2
2
11
9
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.45 VCCI – 0.45
4
4
22
17
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
Figure 2-121 • AC Loading
Table 2-119 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
0
Input Low (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
1.8
0.9
–
35
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
2- 19 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-120 • 1.8 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.7 V
Applicable to Pro I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
16 mA
Speed
Grade tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
0.04
1.45
1.91
0.43
15.65 15.84
tLZ
tHZ
2.78
1.58
tZLS
tZHS
17.89 18.07
Units
Std.
0.66
15.84
ns
–1
0.56
13.47
0.04
1.23
1.62
0.36
13.31 13.47
2.37
1.35
15.22 15.37
ns
–2
0.49
11.83
0.03
1.08
1.42
0.32
11.69 11.83
2.08
1.18
13.36 13.50
ns
Std.
0.66
11.39
0.04
1.45
1.91
0.43
11.60 10.76
3.26
2.77
13.84 12.99
ns
–1
0.56
9.69
0.04
1.23
1.62
0.36
9.87
9.15
2.77
2.36
11.77 11.05
ns
–2
0.49
8.51
0.03
1.08
1.42
0.32
8.66
8.03
2.43
2.07
10.33
9.70
ns
Std.
0.66
8.97
0.04
1.45
1.91
0.43
9.14
8.10
3.57
3.36
11.37 10.33
ns
–1
0.56
7.63
0.04
1.23
1.62
0.36
7.77
6.89
3.04
2.86
9.67
8.79
ns
–2
0.49
6.70
0.03
1.08
1.42
0.32
6.82
6.05
2.66
2.51
8.49
7.72
ns
Std.
0.66
8.35
0.04
1.45
1.91
0.43
8.50
7.59
3.64
3.52
10.74
9.82
ns
–1
0.56
7.10
0.04
1.23
1.62
0.36
7.23
6.45
3.10
3.00
9.14
8.35
ns
–2
0.49
6.24
0.03
1.08
1.42
0.32
6.35
5.66
2.72
2.63
8.02
7.33
ns
Std.
0.66
7.94
0.04
1.45
1.91
0.43
8.09
7.56
3.74
4.11
10.32
9.80
ns
–1
0.56
6.75
0.04
1.23
1.62
0.36
6.88
6.43
3.18
3.49
8.78
8.33
ns
–2
0.49
5.93
0.03
1.08
1.42
0.32
6.04
5.65
2.79
3.07
7.71
7.32
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 191
Device Architecture
Table 2-121 • 1.8 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.7 V
Applicable to Pro I/Os
Drive
Speed
Strength Grade tDOUT
2 mA
4 mA
8 mA
12 mA
16 mA
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
Std.
0.66
12.10
0.04
1.45
1.91
0.43
9.59
12.10
2.78
1.64
11.83 14.34
tZHS
ns
–1
0.56
10.30
0.04
1.23
1.62
0.36
8.16
10.30
2.37
1.39
10.06 12.20
ns
Units
–2
0.49
9.04
0.03
1.08
1.42
0.32
7.16
9.04
2.08
1.22
8.83
10.71
ns
Std.
0.66
7.05
0.04
1.45
1.91
0.43
6.20
7.05
3.25
2.86
8.44
9.29
ns
–1
0.56
6.00
0.04
1.23
1.62
0.36
5.28
6.00
2.76
2.44
7.18
7.90
ns
–2
0.49
5.27
0.03
1.08
1.42
0.32
4.63
5.27
2.43
2.14
6.30
6.94
ns
Std.
0.66
4.52
0.04
1.45
1.91
0.43
4.47
4.52
3.57
3.47
6.70
6.76
ns
–1
0.56
3.85
0.04
1.23
1.62
0.36
3.80
3.85
3.04
2.95
5.70
5.75
ns
–2
0.49
3.38
0.03
1.08
1.42
0.32
3.33
3.38
2.66
2.59
5.00
5.05
ns
Std.
0.66
4.12
0.04
1.45
1.91
0.43
4.20
3.99
3.63
3.62
6.43
6.23
ns
–1
0.56
3.51
0.04
1.23
1.62
0.36
3.57
3.40
3.09
3.08
5.47
5.30
ns
–2
0.49
3.08
0.03
1.08
1.42
0.32
3.14
2.98
2.71
2.71
4.81
4.65
ns
Std.
0.66
3.80
0.04
1.45
1.91
0.43
3.87
3.09
3.73
4.24
6.10
5.32
ns
–1
0.56
3.23
0.04
1.23
1.62
0.36
3.29
2.63
3.18
3.60
5.19
4.53
ns
–2
0.49
2.83
0.03
1.08
1.42
0.32
2.89
2.31
2.79
3.16
4.56
3.98
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 19 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-122 • 1.8 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.7 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
16 mA
Speed
Grade
tDOUT
tDP
Std.
0.66
–1
0.56
–22
Std.
tDIN
tPY
tEOUT
tZL
tZH
tLZ
15.53
0.04
1.31
0.43
14.11
15.53
2.78
13.21
0.04
1.11
0.36
12.01
13.21
2.36
0.49
11.60
0.03
0.98
0.32
10.54
11.60
2.07
0.66
10.48
0.04
1.31
0.43
10.41
10.48
tHZ
tZLS
tZHS
Units
1.60
16.35
17.77
ns
1.36
13.91
15.11
ns
1.19
12.21
13.27
ns
3.23
2.73
12.65
12.71
ns
–1
0.56
8.91
0.04
1.11
0.36
8.86
8.91
2.75
2.33
10.76
10.81
ns
–2
0.49
7.82
0.03
0.98
0.32
7.77
7.82
2.41
2.04
9.44
9.49
ns
Std.
0.66
8.05
0.04
1.31
0.43
8.20
7.84
3.54
3.27
10.43
10.08
ns
–1
0.56
6.85
0.04
1.11
0.36
6.97
6.67
3.01
2.78
8.88
8.57
ns
–2
0.49
6.01
0.03
0.98
0.32
6.12
5.86
2.64
2.44
7.79
7.53
ns
Std.
0.66
7.50
0.04
1.31
0.43
7.64
7.30
3.61
3.41
9.88
9.53
ns
–1
0.56
6.38
0.04
1.11
0.36
6.50
6.21
3.07
2.90
8.40
8.11
ns
–2
0.49
5.60
0.03
0.98
0.32
5.71
5.45
2.69
2.55
7.38
7.12
ns
Std.
0.66
7.29
0.04
1.31
0.43
7.23
7.29
3.71
3.95
9.47
9.53
ns
–1
0.56
6.20
0.04
1.11
0.36
6.15
6.20
3.15
3.36
8.06
8.11
ns
–2
0.49
5.45
0.03
0.98
0.32
5.40
5.45
2.77
2.95
7.07
7.12
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 193
Device Architecture
Table 2-123 • 1.8 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.7 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
16 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
11.86
0.04
1.22
0.43
9.14
11.86
2.77
1.66
11.37
14.10
ns
–1
0.56
10.09
0.04
1.04
0.36
7.77
10.09
2.36
1.41
9.67
11.99
ns
–2
0.49
8.86
0.03
0.91
0.32
6.82
8.86
2.07
1.24
8.49
10.53
ns
Std.
0.66
6.91
0.04
1.22
0.43
5.86
6.91
3.22
2.84
8.10
9.15
ns
–1
0.56
5.88
0.04
1.04
0.36
4.99
5.88
2.74
2.41
6.89
7.78
ns
–2
0.49
5.16
0.03
0.91
0.32
4.38
5.16
2.41
2.12
6.05
6.83
ns
Std.
0.66
4.45
0.04
1.22
0.43
4.18
4.45
3.53
3.38
6.42
6.68
ns
–1
0.56
3.78
0.04
1.04
0.36
3.56
3.78
3.00
2.88
5.46
5.69
ns
–2
0.49
3.32
0.03
0.91
0.32
3.12
3.32
2.64
2.53
4.79
4.99
ns
Std.
0.66
3.92
0.04
1.22
0.43
3.93
3.92
3.60
3.52
6.16
6.16
ns
–1
0.56
3.34
0.04
1.04
0.36
3.34
3.34
3.06
3.00
5.24
5.24
ns
–2
0.49
2.93
0.03
0.91
0.32
2.93
2.93
2.69
2.63
4.60
4.60
ns
Std.
0.66
3.53
0.04
1.22
0.43
3.60
3.04
3.70
4.08
5.84
5.28
ns
–1
0.56
3.01
0.04
1.04
0.36
3.06
2.59
3.15
3.47
4.96
4.49
ns
–2
0.49
2.64
0.03
0.91
0.32
2.69
2.27
2.76
3.05
4.36
3.94
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-124 • 1.8 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.7 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
Std.
0.66
15.01
0.04
–1
0.56
12.77
0.04
–2
0.49
11.21
Std.
0.66
–1
–2
tEOUT
tZL
tZH
tLZ
tHZ
Units
1.20
0.43
13.15
15.01
1.99
1.99
ns
1.02
0.36
11.19
12.77
1.70
1.70
ns
0.03
0.90
0.32
9.82
11.21
1.49
1.49
ns
10.10
0.04
1.20
0.43
9.55
10.10
2.41
2.37
ns
0.56
8.59
0.04
1.02
0.36
8.13
8.59
2.05
2.02
ns
0.49
7.54
0.03
0.90
0.32
7.13
7.54
1.80
1.77
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 19 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-125 • 1.8 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.7 V
Applicable to Standard I/Os
Drive
Strength
2 mA
4 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
11.21
0.04
1.20
0.43
8.53
11.21
1.99
1.21
ns
–1
0.56
9.54
0.04
1.02
0.36
7.26
9.54
1.69
1.03
ns
–2
0.49
8.37
0.03
0.90
0.32
6.37
8.37
1.49
0.90
ns
Std.
0.66
6.34
0.04
1.20
0.43
5.38
6.34
2.41
2.48
ns
–1
0.56
5.40
0.04
1.02
0.36
4.58
5.40
2.05
2.11
ns
–2
0.49
4.74
0.03
0.90
0.32
4.02
4.74
1.80
1.85
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 195
Device Architecture
1.5 V LVCMOS (JESD8-11)
Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for generalpurpose 1.5 V applications. It uses a 1.5 V input buffer and push-pull output buffer.
Table 2-126 • Minimum and Maximum DC Input and Output Levels
1.5 V
LVCMOS
Drive
Strength
VIL
Min.
V
VIH
Max.
V
Min.
V
Max.
V
VOL
VOH
IOL IOH IOSL IOSH IIL1 IIH2
Max.
V
Min.
V
Max. Max.
mA mA mA3 mA3 µA4 µA4
Applicable to Pro I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
2
2
16
13
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
4
4
33
25
10
10
6 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
6
6
39
32
10
10
8 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
8
8
55
66
10
10
12 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI 12
12
55
66
10
10
Applicable to Advanced I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI
2
2
16
13
10
10
4 mA
–0.3
0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI
4
4
33
25
10
10
6 mA
–0.3
0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI
6
6
39
32
10
10
8 mA
–0.3
0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI
8
8
55
66
10
10
12 mA
–0.3
0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 12
12
55
66
10
10
2
16
13
10
10
Applicable to Pro I/O Banks
2 mA
–0.3
0.35 * VCCI 0.65 * VCCI
3.6
0.25 * VCCI 0.75 * VCCI
2
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Test Point
Data Path
35 pF
R=1k
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
Figure 2-122 • AC Loading
Table 2-127 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
0
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
1.5
0.75
–
35
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
2- 19 6
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-128 • 1.5 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V
Applicable to Pro I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
Std.
0.66
14.11
0.04
1.70
2.14
–1
0.56
12.00
0.04
1.44
–2
0.49
10.54
0.03
Std.
0.66
11.23
–1
0.56
–2
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
0.43 14.37 13.14
3.40
2.68
16.61 15.37
ns
1.82
0.36 12.22 11.17
2.90
2.28
14.13 13.08
ns
1.27
1.60
0.32 10.73
9.81
2.54
2.00
12.40 11.48
ns
0.04
1.70
2.14
0.43 11.44
9.87
3.77
3.36
13.68 12.10
ns
9.55
0.04
1.44
1.82
0.36
9.73
8.39
3.21
2.86
11.63 10.29
ns
0.49
8.39
0.03
1.27
1.60
0.32
8.54
7.37
2.81
2.51
10.21
9.04
ns
Std.
0.66
10.45
0.04
1.70
2.14
0.43 10.65
9.24
3.84
3.55
12.88 11.48
ns
–1
0.56
8.89
0.04
1.44
1.82
0.36
9.06
7.86
3.27
3.02
10.96
9.76
ns
–2
0.49
7.81
0.03
1.27
1.60
0.32
7.95
6.90
2.87
2.65
9.62
8.57
ns
Std.
0.66
10.02
0.04
1.70
2.14
0.43 10.20
9.23
3.97
4.22
12.44 11.47
ns
–1
0.56
8.52
0.04
1.44
1.82
0.36
8.68
7.85
3.38
3.59
10.58
9.75
ns
–2
0.49
7.48
0.03
1.27
1.60
0.32
7.62
6.89
2.97
3.15
9.29
8.56
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on page 3-9.
Table 2-129 • 1.5 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V
Applicable to Pro I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
Std.
0.66
8.53
0.04
1.70
–1
0.56
7.26
0.04
–2
0.49
6.37
Std.
0.66
–1
tEOU
T
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
2.14
0.43
7.26
8.53
3.39
2.79
9.50 10.77
ns
1.44
1.82
0.36
6.18
7.26
2.89
2.37
8.08
9.16
ns
0.03
1.27
1.60
0.32
5.42
6.37
2.53
2.08
7.09
8.04
ns
5.41
0.04
1.70
2.14
0.43
5.22
5.41
3.75
3.48
7.45
7.65
ns
0.56
4.60
0.04
1.44
1.82
0.36
4.44
4.60
3.19
2.96
6.34
6.50
ns
–2
0.49
4.04
0.03
1.27
1.60
0.32
3.89
4.04
2.80
2.60
5.56
5.71
ns
Std.
0.66
4.80
0.04
1.70
2.14
0.43
4.89
4.75
3.83
3.67
7.13
6.98
ns
–1
0.56
4.09
0.04
1.44
1.82
0.36
4.16
4.04
3.26
3.12
6.06
5.94
ns
–2
0.49
3.59
0.03
1.27
1.60
0.32
3.65
3.54
2.86
2.74
5.32
5.21
ns
Std.
0.66
4.42
0.04
1.70
2.14
0.43
4.50
3.62
3.96
4.37
6.74
5.86
ns
–1
0.56
3.76
0.04
1.44
1.82
0.36
3.83
3.08
3.37
3.72
5.73
4.98
ns
–2
0.49
3.30
0.03
1.27
1.60
0.32
3.36
2.70
2.96
3.27
5.03
4.37
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 197
Device Architecture
Table 2-130 • 1.5 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
12.78
0.04
1.31
0.43
12.81
12.78
3.40
2.64
15.05
15.02
ns
–1
0.56
10.87
0.04
1.11
0.36
10.90
10.87
2.89
2.25
12.80
12.78
ns
–2
0.49
9.55
0.03
0.98
0.32
9.57
9.55
2.54
1.97
11.24
11.22
ns
Std.
0.66
10.01
0.04
1.31
0.43
10.19
9.55
3.75
3.27
12.43
11.78
ns
–1
0.56
8.51
0.04
1.11
0.36
8.67
8.12
3.19
2.78
10.57
10.02
ns
–2
0.49
7.47
0.03
0.98
0.32
7.61
7.13
2.80
2.44
9.28
8.80
ns
Std.
0.66
9.33
0.04
1.31
0.43
9.51
8.89
3.83
3.43
11.74
11.13
ns
–1
0.56
7.94
0.04
1.11
0.36
8.09
7.56
3.26
2.92
9.99
9.47
ns
–2
0.49
6.97
0.03
0.98
0.32
7.10
6.64
2.86
2.56
8.77
8.31
ns
Std.
0.66
8.91
0.04
1.31
0.43
9.07
8.89
3.95
4.05
11.31
11.13
ns
–1
0.56
7.58
0.04
1.11
0.36
7.72
7.57
3.36
3.44
9.62
9.47
ns
–2
0.49
6.65
0.03
0.98
0.32
6.78
6.64
2.95
3.02
8.45
8.31
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-131 • 1.5 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V
Applicable to Advanced I/Os
Drive
Strength
2 mA
4 mA
8 mA
12 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
8.36
0.04
1.44
0.43
6.82
8.36
3.39
2.77
9.06
10.60
ns
–1
0.56
7.11
0.04
1.22
0.36
5.80
7.11
2.88
2.35
7.71
9.02
ns
–2
0.49
6.24
0.03
1.07
0.32
5.10
6.24
2.53
2.06
6.76
7.91
ns
Std.
0.66
5.31
0.04
1.44
0.43
4.85
5.31
3.74
3.40
7.09
7.55
ns
–1
0.56
4.52
0.04
1.22
0.36
4.13
4.52
3.18
2.89
6.03
6.42
ns
–2
0.49
3.97
0.03
1.07
0.32
3.62
3.97
2.79
2.54
5.29
5.64
ns
Std.
0.66
4.67
0.04
1.44
0.43
4.55
4.67
3.82
3.56
6.78
6.90
ns
–1
0.56
3.97
0.04
1.22
0.36
3.87
3.97
3.25
3.03
5.77
5.87
ns
–2
0.49
3.49
0.03
1.07
0.32
3.40
3.49
2.85
2.66
5.07
5.16
ns
Std.
0.66
4.08
0.04
1.44
0.43
4.15
3.58
3.94
4.20
6.39
5.81
ns
–1
0.56
3.47
0.04
1.22
0.36
3.53
3.04
3.36
3.58
5.44
4.95
ns
–2
0.49
3.05
0.03
1.07
0.32
3.10
2.67
2.95
3.14
4.77
4.34
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 19 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-132 • 1.5 V LVCMOS Low Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V
Applicable to Standard I/Os
Drive
Strength
2 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
Std.
0.66
12.33
0.04
1.42
–1
0.56
10.49
0.04
1.21
–2
0.49
9.21
0.03
1.06
tZL
tZH
tLZ
tHZ
Units
0.43
11.79
12.33
2.45
2.32
ns
0.36
10.03
10.49
2.08
1.98
ns
0.32
8.81
9.21
1.83
1.73
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-133 • 1.5 V LVCMOS High Slew
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V
Applicable to Standard I/Os
Drive
Strength
2 mA
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
tLZ
tHZ
Units
Std.
0.66
7.65
0.04
1.42
0.43
6.31
7.65
2.45
2.45
ns
–1
0.56
6.50
0.04
1.21
0.36
5.37
6.50
2.08
2.08
ns
–2
0.49
5.71
0.03
1.06
0.32
4.71
5.71
1.83
1.83
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 199
Device Architecture
3.3 V PCI, 3.3 V PCI-X
The Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI
Bus applications.
Table 2-134 • Minimum and Maximum DC Input and Output Levels
3.3 V PCI/PCI-X
Drive Strength
VIL
Min.
V
VIH
Max.
V
Min.
V
Max.
V
Per PCI
specification
VOL
VOH
IOL
IOH
IOSL
IOSH
IIL1
IIH2
Max.
V
Min.
V
mA
mA
Max.
mA3
Max.
mA3
µA4
µA4
10
10
Per PCI curves
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable
path characterization are described in Figure 2-123.
R to VCCI for tDP (F)
R to GND for tDP (R)
R = 25
Test Point
Data Path
R=1k
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
10 pF for tZH / tZHS / tZL / tZLS
10 pF for tHZ / tLZ
Figure 2-123 • AC Loading
AC loadings are defined per PCI/PCI-X specifications for the data path; Microsemi loading for tristate is
described in Table 2-135.
Table 2-135 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
0
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
CLOAD (pF)
3.3
0.285 * VCCI for tDP(R)
0.615 * VCCI for tDP(F)
–
10
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
2- 20 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Timing Characteristics
Table 2-136 • 3.3 V PCI/PCI-X
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
2.81
0.04
1.05
1.67
0.43
2.86
2.00
3.28
3.61
5.09
4.23
ns
–1
0.56
2.39
0.04
0.89
1.42
0.36
2.43
1.70
2.79
3.07
4.33
3.60
ns
–2
0.49
2.09
0.03
0.78
1.25
0.32
2.13
1.49
2.45
2.70
3.80
3.16
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Table 2-137 • 3.3 V PCI/PCI-X
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Advanced I/Os
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
tZLS
tZHS
Units
Std.
0.66
2.68
0.04
0.86
0.43
2.73
1.95
3.21
3.58
4.97
4.19
0.66
ns
–1
0.56
2.28
0.04
0.73
0.36
2.32
1.66
2.73
3.05
4.22
3.56
0.56
ns
–2
0.49
2.00
0.03
0.65
0.32
2.04
1.46
2.40
2.68
3.71
3.13
0.49
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 201
Device Architecture
Voltage Referenced I/O Characteristics
3.3 V GTL
Gunning Transceiver Logic is a high-speed bus standard (JESD8-3). It provides a differential amplifier
input buffer and an open-drain output buffer. The VCCI pin should be connected to 3.3 V.
Table 2-138 • Minimum and Maximum DC Input and Output Levels
3.3 V GTL
VIL
Drive
Strength
Min.
V
20 mA3
–0.3
VOL
VOH
IOL IOH IOSL
IOSH
IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA mA
Max.
mA3
Max.
mA3
µA4 µA4
3.6
0.4
–
20
181
268
VIH
Max.
V
Min.
V
VREF – 0.05 VREF + 0.05
20
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
VTT
GTL
25
Test Point
10 pF
Figure 2-124 • AC Loading
Table 2-139 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.05
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.05
0.8
0.8
1.2
10
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-140 • 3.3 V GTL
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V, VREF = 0.8 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.08
0.04
2.93
0.43
2.04
–1
0.56
1.77
0.04
2.50
0.36
–2
0.49
1.55
0.03
2.19
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.08
4.27
4.31
ns
1.73
1.77
3.63
3.67
ns
1.52
1.55
3.19
3.22
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 20 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
2.5 V GTL
Gunning Transceiver Logic is a high-speed bus standard (JESD8-3). It provides a differential amplifier
input buffer and an open-drain output buffer. The VCCI pin should be connected to 2.5 V.
Table 2-141 • Minimum and Maximum DC Input and Output Levels
2.5 GTL
VIL
Drive
Strength
Min.
V
20 mA3
–0.3
VOL
VOH
IOL IOH
IOSL
IOSH
IIL1
IIH2
Max.
V
Max.
V
Min.
V
mA
mA
Max.
mA3
Max.
mA3
µA4
µA4
3.6
0.4
–
20
20
124
169
10
10
VIH
Max.
V
Min.
V
VREF – 0.05 VREF + 0.05
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
VTT
GTL
25
Test Point
10 pF
Figure 2-125 • AC Loading
Table 2-142 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.05
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.05
0.8
0.8
1.2
10
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-143 • 2.5 V GTL
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V, VREF = 0.8 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.13
0.04
2.46
0.43
2.16
–1
0.56
1.81
0.04
2.09
0.36
–2
0.49
1.59
0.03
1.83
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.13
4.40
4.36
ns
1.84
1.81
3.74
3.71
ns
1.61
1.59
3.28
3.26
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 203
Device Architecture
3.3 V GTL+
Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It provides a differential
amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 3.3 V.
Table 2-144 • Minimum and Maximum DC Input and Output Levels
3.3 V GTL+
VIL
Drive
Strength
Min.
V
35 mA
–0.3
VOL
VOH
IOL IOH
IOSL
IOSH IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA mA
Max.
mA3
Max.
mA3
3.6
0.6
–
35
181
268
VIH
Max.
V
Min.
V
VREF – 0.1 VREF + 0.1
35
µA4 µA4
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
VTT
GTL+
25
Test Point
10 pF
Figure 2-126 • AC Loading
Table 2-145 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.1
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
1.0
1.0
1.5
10
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-146 • 3.3 V GTL+
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V, VREF = 1.0 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.06
0.04
1.59
0.43
2.09
–1
0.56
1.75
0.04
1.35
0.36
–2
0.49
1.53
0.03
1.19
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.06
4.33
4.29
ns
1.78
1.75
3.68
3.65
ns
1.56
1.53
3.23
3.20
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 20 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
2.5 V GTL+
Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It provides a differential
amplifier input buffer and an open-drain output buffer. The VCCI pin should be connected to 2.5 V.
Table 2-147 • Minimum and Maximum DC Input and Output Levels
2.5 V
GTL+
VIL
Drive
Strength
Min.
V
33 mA
–0.3
VOL
VOH
IOL
IOH
IOSL
IOSH
IIL1
Max.
V
Max.
V
Min.
V
mA
mA
Max.
mA3
Max.
mA3
µA4 µA4
3.6
0.6
–
33
33
124
169
VIH
Max.
V
Min.
V
VREF – 0.1 VREF + 0.1
10
IIH2
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
VTT
GTL+
25
Test Point
10 pF
Figure 2-127 • AC Loading
Table 2-148 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.1
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
1.0
1.0
1.5
10
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-149 • 2.5 V GTL+
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V, VREF = 1.0 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.21
0.04
1.51
0.43
2.25
–1
0.56
1.88
0.04
1.29
0.36
–2
0.49
1.65
0.03
1.13
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.10
4.48
4.34
ns
1.91
1.79
3.81
3.69
ns
1.68
1.57
3.35
4.34
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 205
Device Architecture
HSTL Class I
High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).
Fusion devices support Class I. This provides a differential amplifier input buffer and a push-pull output
buffer.
Table 2-150 • Minimum and Maximum DC Input and Output Levels
HSTL
Class I
VIL
Drive
Strength
Min.
V
8 mA
–0.3
VOL
VOH
IOL IOH IOSL IOSH IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA mA
3.6
0.4
VCCI – 0.4
VIH
Max.
V
Min.
V
VREF – 0.1 VREF + 0.1
8
8
Max.
mA3
39
Max.
mA3 µA4 µA4
32
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
HSTL
Class I
VTT
50
Test Point
20 pF
Figure 2-128 • AC Loading
Table 2-151 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.1
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
0.75
0.75
0.75
20
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-152 • HSTL Class I
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V, VREF = 0.75 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
3.18
0.04
2.12
0.43
3.24
–1
0.56
2.70
0.04
1.81
0.36
–2
0.49
2.37
0.03
1.59
0.32
tLZ
tHZ
tZLS
tZHS
Units
3.14
5.47
5.38
ns
2.75
2.67
4.66
4.58
ns
2.42
2.35
4.09
4.02
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 20 6
R e visio n 4
Fusion Family of Mixed Signal FPGAs
HSTL Class II
High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6).
Fusion devices support Class II. This provides a differential amplifier input buffer and a push-pull output
buffer.
Table 2-153 • Minimum and Maximum DC Input and Output Levels
HSTL Class II
VIL
Drive Strength
Min.
V
15 mA3
–0.3
VOL
VOH
IOL IOH
IOSL
IOSH IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA mA
Max.
mA3
Max.
mA3 µA4 µA4
3.6
0.4
VIH
Max.
V
Min.
V
VREF – 0.1 VREF + 0.1
VCCI – 0.4 15
15
55
66
10
10
Note:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Output drive strength is below JEDEC specification.
HSTL
Class II
VTT
25
Test Point
20 pF
Figure 2-129 • AC Loading
Table 2-154 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.1
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.1
0.75
0.75
0.75
20
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-155 • HSTL Class II
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 1.4 V, VREF = 0.75 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
3.02
0.04
2.12
0.43
3.08
–1
0.56
2.57
0.04
1.81
0.36
–2
0.49
2.26
0.03
1.59
0.32
tLZ
tHZ
tZLS
tZHS
Units
2.71
5.32
4.95
ns
2.62
2.31
4.52
4.21
ns
2.30
2.03
3.97
3.70
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 207
Device Architecture
SSTL2 Class I
Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). Fusion devices support Class
I. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-156 • Minimum and Maximum DC Input and Output Levels
SSTL2 Class I
VIL
VOL
VOH
IOL IOH IOSL IOSH IIL1
Max.
V
Max.
V
Min.
V
Max.
mA mA mA3
3.6
0.54
VIH
Drive
Strength
Min.
V
Max.
V
Min.
V
15 mA
–0.3 VREF – 0.2 VREF + 0.2
VCCI – 0.62 15
15
IIH2
Max.
mA3 µA4 µA4
87
83
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
SSTL2
Class I
VTT
50
Test Point
25
30 pF
Figure 2-130 • AC Loading
Table 2-157 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.2
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.25
1.25
1.25
30
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-158 • SSTL 2 Class I
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V, VREF = 1.25 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.13
0.04
1.33
0.43
2.17
–1
0.56
1.81
0.04
1.14
0.36
–2
0.49
1.59
0.03
1.00
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.85
4.40
4.08
ns
1.84
1.57
3.74
3.47
ns
1.62
1.38
3.29
3.05
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 20 8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
SSTL2 Class II
Stub-Speed Terminated Logic for 2.5 V memory bus standard (JESD8-9). Fusion devices support Class
II. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-159 • Minimum and Maximum DC Input and Output Levels
SSTL2 Class II
VIL
Drive Strength
Min.
V
18 mA
–0.3
VOL
VOH
IOL IOH IOSL IOSH IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA mA
3.6
0.35
VIH
Max.
V
Min.
V
VREF – 0.2 VREF + 0.2
VCCI – 0.43 18
18
Max.
mA3
Max.
mA3
124
169
µA4 µA4
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
SSTL2
Class II
VTT
25
Test Point
25
30 pF
Figure 2-131 • AC Loading
Table 2-160 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.2
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.25
1.25
1.25
30
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-161 • SSTL 2 Class II
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V, VREF = 1.25 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.17
0.04
1.33
0.43
2.21
–1
0.56
1.84
0.04
1.14
0.36
–2
0.49
1.62
0.03
1.00
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.77
4.44
4.01
ns
1.88
1.51
3.78
3.41
ns
1.65
1.32
3.32
2.99
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 209
Device Architecture
SSTL3 Class I
Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). Fusion devices support Class
I. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-162 • Minimum and Maximum DC Input and Output Levels
SSTL3 Class I
VIL
VOL
VOH
IOL
IOH IOSL
IOSH
IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA
mA
Max.
mA3
Max.
mA3
µA4 µA4
3.6
0.7
VCCI – 1.1
14
14
54
51
VIH
Drive
Strength
Min.
V
Max.
V
Min.
V
14 mA
–0.3 VREF – 0.2 VREF + 0.2
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
SSTL3
Class I
VTT
50
Test Point
25
30 pF
Figure 2-132 • AC Loading
Table 2-163 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.2
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.5
1.5
1.485
30
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-164 • SSTL3 Class I
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V, VREF = 1.5 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.31
0.04
1.25
0.43
2.35
–1
0.56
1.96
0.04
1.06
0.36
–2
0.49
1.72
0.03
0.93
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.84
4.59
4.07
ns
2.00
1.56
3.90
3.46
ns
1.75
1.37
3.42
3.04
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 21 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
SSTL3 Class II
Stub-Speed Terminated Logic for 3.3 V memory bus standard (JESD8-8). Fusion devices support Class
II. This provides a differential amplifier input buffer and a push-pull output buffer.
Table 2-165 • Minimum and Maximum DC Input and Output Levels
SSTL3 Class II
VIL
Drive Strength
Min.
V
21 mA
–0.3
VOL
VOH
IOL IOH
IOSL
IOSH
IIL1 IIH2
Max.
V
Max.
V
Min.
V
mA mA
Max.
mA3
Max.
mA3
µA4 µA4
3.6
0.5
VCCI – 0.9
21
109
103
VIH
Max.
V
Min.
V
VREF – 0.2 VREF + 0.2
21
10
10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
SSTL3
Class II
VTT
25
Test Point
25
30 pF
Figure 2-133 • AC Loading
Table 2-166 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
VREF – 0.2
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
VTT (typ.) (V)
CLOAD (pF)
VREF + 0.2
1.5
1.5
1.485
30
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-167 • SSTL3- Class II
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V, VREF = 1.5 V
Speed
Grade
tDOUT
tDP
tDIN
tPY
tEOUT
tZL
tZH
Std.
0.66
2.07
0.04
1.25
0.43
2.10
–1
0.56
1.76
0.04
1.06
0.36
–2
0.49
1.54
0.03
0.93
0.32
tLZ
tHZ
tZLS
tZHS
Units
1.67
4.34
3.91
ns
1.79
1.42
3.69
3.32
ns
1.57
1.25
3.24
2.92
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 211
Device Architecture
Differential I/O Characteristics
Configuration of the I/O modules as a differential pair is handled by the Microsemi Designer
software when the user instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and Double Data Rate (DDR). However, there is no
support for bidirectional I/Os or tristates with these standards.
LVDS
Low-Voltage Differential Signal (ANSI/TIA/EIA-644) is a high-speed differential I/O standard. It requires
that one data bit be carried through two signal lines, so two pins are needed. It also requires external
resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-134.
The building blocks of the LVDS transmitter–receiver are one transmitter macro, one receiver macro,
three board resistors at the transmitter end, and one resistor at the receiver end. The values for the three
driver resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Bourns Part Number: CAT16-LV4F12
OUTBUF_LVDS
FPGA
P
165 
ZO = 50 
165 
ZO = 50 
FPGA
+
–
100 
140 
N
P
INBUF_LVDS
N
Figure 2-134 • LVDS Circuit Diagram and Board-Level Implementation
Table 2-168 • Minimum and Maximum DC Input and Output Levels
DC Parameter
Description
Min.
Typ.
Max.
Units
VCCI
Supply Voltage
2.375
2.5
2.625
V
VOL
Output Low Voltage
0.9
1.075
1.25
V
VOH
Input High Voltage
1.25
1.425
1.6
V
Output Low Voltage
0.65
0.91
1.16
mA
Output High Voltage
0.65
0.91
IOL
1
IOH
1
VI
Input Voltage
0
1.16
mA
2.925
V
IIL
2,3
Input Low Voltage
10
A
IIH
2,4
Input High Voltage
10
A
VODIFF
Differential Output Voltage
250
350
450
mV
VOCM
Output Common Mode Voltage
1.125
1.25
1.375
V
VICM
Input Common Mode Voltage
0.05
1.25
2.35
V
VIDIFF
Input Differential Voltage
100
350
mV
Notes:
1.
2.
3.
4.
IOL/IOH defined by VODIFF/(Resistor Network)
Currents are measured at 85°C junction temperature.
IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
2- 21 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 2-169 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
1.325
Cross point
–
1.075
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-170 • LVDS
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 2.3 V
Applicable to Pro I/Os
Speed Grade
tDOUT
tDP
tDIN
tPY
Units
Std.
0.66
2.10
0.04
1.82
ns
–1
0.56
1.79
0.04
1.55
ns
–2
0.49
1.57
0.03
1.36
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
BLVDS/M-LVDS
Bus LVDS (BLVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard to
high-performance multipoint bus applications. Multidrop and multipoint bus configurations can contain
any combination of drivers, receivers, and transceivers. Microsemi LVDS drivers provide the higher drive
current required by BLVDS and M-LVDS to accommodate the loading. The driver requires series
terminations for better signal quality and to control voltage swing. Termination is also required at both
ends of the bus, since the driver can be located anywhere on the bus. These configurations can be
implemented using TRIBUF_LVDS and BIBUF_LVDS macros along with appropriate terminations.
Multipoint designs using Microsemi LVDS macros can achieve up to 200 MHz with a maximum of 20
loads. A sample application is given in Figure 2-135. The input and output buffer delays are available in
the LVDS section in Table 2-171.
Example: For a bus consisting of 20 equidistant loads, the following terminations provide the required
differential voltage, in worst-case industrial operating conditions at the farthest receiver: RS = 60  and
RT = 70 , given Z0 = 50  (2") and Zstub = 50  (~1.5").
Receiver
Transceiver
EN
R
+
RS
Zstub
Z0
RT Z
0
T
-
+
RS
Zstub
Driver
D
EN
RS
Zstub
-
Zstub
RS
Zstub
R
+
RS
Zstub
Transceiver
EN
-
+
RS
Receiver
EN
RS
Zstub
EN
T
-
+
RS
Zstub
RS
BIBUF_LVDS
-
RS
...
Z0
Z0
Z0
Z0
Z0
Z0
Z0
Z0
Z0
Z0
R
T
Figure 2-135 • BLVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers
Revision 4
2- 213
Device Architecture
LVPECL
Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires
that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-136.
The building blocks of the LVPECL transmitter–receiver are one transmitter macro, one receiver macro,
three board resistors at the transmitter end, and one resistor at the receiver end. The values for the three
driver resistors are different from those used in the LVDS implementation because the output standard
specifications are different.
Bourns Part Number: CAT16-PC4F12
OUTBUF_LVPECL
FPGA
P
100 
ZO = 50 
FPGA
+
–
INBUF_LVPECL
Max.
Min.
Max.
100 
187 W
ZO = 50 
100 
N
P
N
Figure 2-136 • LVPECL Circuit Diagram and Board-Level Implementation
Table 2-171 • Minimum and Maximum DC Input and Output Levels
DC Parameter
Description
Min.
Max.
Min.
3.0
3.3
Units
VCCI
Supply Voltage
VOL
Output Low Voltage
0.96
1.27
1.06
1.43
1.30
3.6
1.57
V
V
VOH
Output High Voltage
1.8
2.11
1.92
2.28
2.13
2.41
V
VIL, VIH
Input Low, Input High Voltages
0
3.6
0
3.6
0
3.6
V
VODIFF
Differential Output Voltage
0.625
0.97
0.625
0.97
0.625
0.97
V
VOCM
Output Common Mode Voltage
1.762
1.98
1.762
1.98
1.762
1.98
V
VICM
Input Common Mode Voltage
1.01
2.57
1.01
2.57
1.01
2.57
V
VIDIFF
Input Differential Voltage
300
300
300
mV
Table 2-172 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ.) (V)
1.94
Cross point
–
1.64
Note: *Measuring point = Vtrip. See Table 2-90 on page 2-169 for a complete table of trip points.
Timing Characteristics
Table 2-173 • LVPECL
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI = 3.0 V
Applicable to Pro I/Os
tDOUT
tDP
tDIN
tPY
Units
Std.
0.66
2.14
0.04
1.63
ns
–1
0.56
1.82
0.04
1.39
ns
–2
0.49
1.60
0.03
1.22
ns
Speed Grade
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 21 4
R e visio n 4
Fusion Family of Mixed Signal FPGAs
I/O Register Specifications
Fully Registered I/O Buffers with Synchronous Enable and Asynchronous Preset
INBUF
Preset
X
D
L
Pad Out
X
DOUT
Data_out
Enable
INBUF
CLK
CLKBUF
X
B
E
X
Y
F
Core
Array
X
G
X
X
E
X
E
PRE
D
Q
DFN1E1P1
TRIBUF
PRE
X D
Q
C DFN1E1P1
INBUF
Data
EOUT
H
X
X
A
X
I
J
X
X
INBUF
INBUF
D_Enable
CLK
CLKBUF
Enable
Data Input I/O Register with:
Active High Enable
Active High Preset
Positive Edge Triggered
K
PRE
D
Q
DFN1E1P1
E
Data Output Register and
Enable Output Register with:
Active High Enable
Active High Preset
Postive Edge Triggered
Figure 2-137 • Timing Model of Registered I/O Buffers with Synchronous Enable and Asynchronous Preset
Revision 4
2- 215
Device Architecture
Table 2-174 • Parameter Definitions and Measuring Nodes
Parameter
Name
Parameter Definition
Measuring Nodes
(from, to)*
tOCLKQ
Clock-to-Q of the Output Data Register
H, DOUT
tOSUD
Data Setup Time for the Output Data Register
F, H
tOHD
Data Hold Time for the Output Data Register
F, H
tOSUE
Enable Setup Time for the Output Data Register
G, H
tOHE
Enable Hold Time for the Output Data Register
G, H
tOPRE2Q
Asynchronous Preset-to-Q of the Output Data Register
tOREMPRE
Asynchronous Preset Removal Time for the Output Data Register
L, H
tORECPRE
Asynchronous Preset Recovery Time for the Output Data Register
L, H
tOECLKQ
Clock-to-Q of the Output Enable Register
tOESUD
Data Setup Time for the Output Enable Register
J, H
tOEHD
Data Hold Time for the Output Enable Register
J, H
tOESUE
Enable Setup Time for the Output Enable Register
K, H
tOEHE
Enable Hold Time for the Output Enable Register
K, H
tOEPRE2Q
Asynchronous Preset-to-Q of the Output Enable Register
tOEREMPRE
Asynchronous Preset Removal Time for the Output Enable Register
I, H
tOERECPRE
Asynchronous Preset Recovery Time for the Output Enable Register
I, H
tICLKQ
Clock-to-Q of the Input Data Register
A, E
tISUD
Data Setup Time for the Input Data Register
C, A
tIHD
Data Hold Time for the Input Data Register
C, A
tISUE
Enable Setup Time for the Input Data Register
B, A
tIHE
Enable Hold Time for the Input Data Register
B, A
tIPRE2Q
Asynchronous Preset-to-Q of the Input Data Register
D, E
tIREMPRE
Asynchronous Preset Removal Time for the Input Data Register
D, A
tIRECPRE
Asynchronous Preset Recovery Time for the Input Data Register
D, A
Note: *See Figure 2-137 on page 2-215 for more information.
2- 21 6
R e visio n 4
L,DOUT
H, EOUT
I, EOUT
Fusion Family of Mixed Signal FPGAs
Fully Registered I/O Buffers with Synchronous Enable and Asynchronous Clear
D
CC
Q
DFN1E1C1
EE
Core
Array
D
Q
DFN1E1C1
TRIBUF
INBUF
Data
Data_out FF
Pad Out
DOUT
Y
GG
INBUF
Enable
BB
EOUT
E
E
CLR
CLR
LL
INBUF
CLR
CLKBUF
CLK
HH
AA
JJ
DD
KK
D
Q
DFN1E1C1
E
CLR
INBUF
CLKBUF
CLK
Enable
INBUF
D_Enable
Data Input I/O Register with
Active High Enable
Active High Clear
Positive Edge Triggered
Data Output Register and
Enable Output Register with
Active High Enable
Active High Clear
Positive Edge Triggered
Figure 2-138 • Timing Model of the Registered I/O Buffers with Synchronous Enable and Asynchronous Clear
Revision 4
2- 217
Device Architecture
Table 2-175 • Parameter Definitions and Measuring Nodes
Parameter Name
Parameter Definition
Measuring Nodes
(from, to)*
tO CL KQ
Clock-to-Q of the Output Data Register
tOSUD
Data Setup Time for the Output Data Register
FF, HH
tOHD
Data Hold Time for the Output Data Register
FF, HH
tOSUE
Enable Setup Time for the Output Data Register
GG, HH
tOHE
Enable Hold Time for the Output Data Register
GG, HH
tOCLR2Q
Asynchronous Clear-to-Q of the Output Data Register
tOREMCLR
Asynchronous Clear Removal Time for the Output Data Register
LL, HH
tORECCLR
Asynchronous Clear Recovery Time for the Output Data Register
LL, HH
tOECLKQ
Clock-to-Q of the Output Enable Register
tOESUD
Data Setup Time for the Output Enable Register
JJ, HH
tOEHD
Data Hold Time for the Output Enable Register
JJ, HH
tOESUE
Enable Setup Time for the Output Enable Register
KK, HH
tOEHE
Enable Hold Time for the Output Enable Register
KK, HH
tOECLR2Q
Asynchronous Clear-to-Q of the Output Enable Register
II, EOUT
tOEREMCLR
Asynchronous Clear Removal Time for the Output Enable Register
II, HH
tOERECCLR
Asynchronous Clear Recovery Time for the Output Enable Register
II, HH
tICLKQ
Clock-to-Q of the Input Data Register
AA, EE
tISUD
Data Setup Time for the Input Data Register
CC, AA
tIHD
Data Hold Time for the Input Data Register
CC, AA
tISUE
Enable Setup Time for the Input Data Register
BB, AA
tIHE
Enable Hold Time for the Input Data Register
BB, AA
tICLR2Q
Asynchronous Clear-to-Q of the Input Data Register
DD, EE
tIREMCLR
Asynchronous Clear Removal Time for the Input Data Register
DD, AA
tIRECCLR
Asynchronous Clear Recovery Time for the Input Data Register
DD, AA
Note: *See Figure 2-138 on page 2-217 for more information.
2- 21 8
R e visio n 4
HH, DOUT
LL, DOUT
HH, EOUT
Fusion Family of Mixed Signal FPGAs
Input Register
tICKMPWH tICKMPWL
CLK
50%
50%
Enable
50%
1
50%
50%
50%
tIHD
tISUD
Data
50%
50%
50%
0
50%
tIWPRE
tIRECPRE
tIREMPRE
50%
50%
tIHE
Preset
50%
tISUE
tIWCLR
50%
Clear
tIRECCLR
tIREMCLR
50%
50%
tIPRE2Q
50%
Out_1
50%
tICLR2Q
50%
tICLKQ
Figure 2-139 • Input Register Timing Diagram
Timing Characteristics
Table 2-176 • Input Data Register Propagation Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tICLKQ
Clock-to-Q of the Input Data Register
0.24
0.27
0.32
ns
tISUD
Data Setup Time for the Input Data Register
0.26
0.30
0.35
ns
tIHD
Data Hold Time for the Input Data Register
0.00
0.00
0.00
ns
tISUE
Enable Setup Time for the Input Data Register
0.37
0.42
0.50
ns
tIHE
Enable Hold Time for the Input Data Register
0.00
0.00
0.00
ns
tICLR2Q
Asynchronous Clear-to-Q of the Input Data Register
0.45
0.52
0.61
ns
tIPRE2Q
Asynchronous Preset-to-Q of the Input Data Register
0.45
0.52
0.61
ns
tIREMCLR
Asynchronous Clear Removal Time for the Input Data Register
0.00
0.00
0.00
ns
tIRECCLR
Asynchronous Clear Recovery Time for the Input Data Register
0.22
0.25
0.30
ns
tIREMPRE
Asynchronous Preset Removal Time for the Input Data Register
0.00
0.00
0.00
ns
tIRECPRE
Asynchronous Preset Recovery Time for the Input Data Register
0.22
0.25
0.30
ns
tIWCLR
Asynchronous Clear Minimum Pulse Width for the Input Data Register
0.22
0.25
0.30
ns
tIWPRE
Asynchronous Preset Minimum Pulse Width for the Input Data Register
0.22
0.25
0.30
ns
tICKMPWH
Clock Minimum Pulse Width High for the Input Data Register
0.36
0.41
0.48
ns
tICKMPWL
Clock Minimum Pulse Width Low for the Input Data Register
0.32
0.37
0.43
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 219
Device Architecture
Output Register
tOCKMPWH tOCKMPWL
CLK
50%
50%
50%
50%
50%
50%
50%
tOSUD tOHD
1
Data_out
Enable
50%
50%
0
50%
tOWPRE
tOHE
Preset
tOSUE
tOREMPRE
tORECPRE
50%
50%
50%
tOWCLR
50%
Clear
tOREMCLR
tORECCLR
50%
50%
tOPRE2Q
50%
DOUT
50%
tOCLR2Q
50%
tOCLKQ
Figure 2-140 • Output Register Timing Diagram
Timing Characteristics
Table 2-177 • Output Data Register Propagation Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tOCLKQ
Clock-to-Q of the Output Data Register
0.59
0.67
0.79
ns
tOSUD
Data Setup Time for the Output Data Register
0.31
0.36
0.42
ns
tOHD
Data Hold Time for the Output Data Register
0.00
0.00
0.00
ns
tOSUE
Enable Setup Time for the Output Data Register
0.44
0.50
0.59
ns
tOHE
Enable Hold Time for the Output Data Register
0.00
0.00
0.00
ns
tOCLR2Q
Asynchronous Clear-to-Q of the Output Data Register
0.80
0.91
1.07
ns
tOPRE2Q
Asynchronous Preset-to-Q of the Output Data Register
0.80
0.91
1.07
ns
tOREMCLR
Asynchronous Clear Removal Time for the Output Data Register
0.00
0.00
0.00
ns
tORECCLR
Asynchronous Clear Recovery Time for the Output Data Register
0.22
0.25
0.30
ns
tOREMPRE
Asynchronous Preset Removal Time for the Output Data Register
0.00
0.00
0.00
ns
tORECPRE
Asynchronous Preset Recovery Time for the Output Data Register
0.22
0.25
0.30
ns
tOWCLR
Asynchronous Clear Minimum Pulse Width for the Output Data Register
0.22
0.25
0.30
ns
tOWPRE
Asynchronous Preset Minimum Pulse Width for the Output Data
Register
0.22
0.25
0.30
ns
tOCKMPWH
Clock Minimum Pulse Width High for the Output Data Register
0.36
0.41
0.48
ns
tOCKMPWL
Clock Minimum Pulse Width Low for the Output Data Register
0.32
0.37
0.43
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
2- 22 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Output Enable Register
tOECKMPWH tOECKMPWL
CLK
50%
50%
50%
50%
50%
50%
50%
tOESUD tOEHD
1
D_Enable
Enable
Preset
50%
0 50%
50%
tOEWPRE
tOESUEtOEHE
tOEREMPRE
tOERECPRE
50%
50%
50%
tOEWCLR
50%
Clear
tOEPRE2Q
50%
EOUT
tOEREMCLR
tOERECCLR
50%
50%
tOECLR2Q
50%
50%
tOECLKQ
Figure 2-141 • Output Enable Register Timing Diagram
Timing Characteristics
Table 2-178 • Output Enable Register Propagation Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Std.
Units
tOECLKQ
Clock-to-Q of the Output Enable Register
Description
0.44 0.51
–2
–1
0.59
ns
tOESUD
Data Setup Time for the Output Enable Register
0.31 0.36
0.42
ns
tOEHD
Data Hold Time for the Output Enable Register
0.00 0.00
0.00
ns
tOESUE
Enable Setup Time for the Output Enable Register
0.44 0.50
0.58
ns
tOEHE
Enable Hold Time for the Output Enable Register
0.00 0.00
0.00
ns
tOECLR2Q
Asynchronous Clear-to-Q of the Output Enable Register
0.67 0.76
0.89
ns
tOEPRE2Q
Asynchronous Preset-to-Q of the Output Enable Register
0.67 0.76
0.89
ns
tOEREMCLR
Asynchronous Clear Removal Time for the Output Enable Register
0.00 0.00
0.00
ns
tOERECCLR
Asynchronous Clear Recovery Time for the Output Enable Register
0.22 0.25
0.30
ns
tOEREMPRE
Asynchronous Preset Removal Time for the Output Enable Register
0.00 0.00
0.00
ns
tOERECPRE
Asynchronous Preset Recovery Time for the Output Enable Register
0.22 0.25
0.30
ns
tOEWCLR
Asynchronous Clear Minimum Pulse Width for the Output Enable 0.22 0.25
Register
0.30
ns
tOEWPRE
Asynchronous Preset Minimum Pulse Width for the Output Enable 0.22 0.25
Register
0.30
ns
tOECKMPWH
Clock Minimum Pulse Width High for the Output Enable Register
0.36 0.41
0.48
ns
tOECKMPWL
Clock Minimum Pulse Width Low for the Output Enable Register
0.32 0.37
0.43
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 221
Device Architecture
DDR Module Specifications
Input DDR Module
Input DDR
A
D
Data
INBUF
FF1
E
B
CLK
Out_QF
(to core)
CLKBUF
Out_QR
(to core)
FF2
C
CLR
INBUF
DDR_IN
Figure 2-142 • Input DDR Timing Model
Table 2-179 • Parameter Definitions
Parameter Name
Parameter Definition
Measuring Nodes (from, to)
tDDRICLKQ1
Clock-to-Out Out_QR
B, D
tDDRICLKQ2
Clock-to-Out Out_QF
B, E
tDDRISUD
Data Setup Time of DDR Input
A, B
tDDRIHD
Data Hold Time of DDR Input
A, B
tDDRICLR2Q1
Clear-to-Out Out_QR
C, D
tDDRICLR2Q2
Clear-to-Out Out_QF
C, E
tDDRIREMCLR
Clear Removal
C, B
tDDRIRECCLR
Clear Recovery
C, B
2- 22 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
CLK
tDDRISUD
Data
1
2
3
4
5
tDDRIHD
6
7
8
9
tDDRIRECCLR
CLR
tDDRIREMCLR
tDDRICLKQ1
tDDRICLR2Q1
Out_QF
2
6
4
tDDRICLKQ2
tDDRICLR2Q2
Out_QR
3
7
5
Figure 2-143 • Input DDR Timing Diagram
Timing Characteristics
Table 2-180 • Input DDR Propagation Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDDRICLKQ1
Clock-to-Out Out_QR for Input DDR
0.39
0.44
0.52
ns
tDDRICLKQ2
Clock-to-Out Out_QF for Input DDR
0.27
0.31
0.37
ns
tDDRISUD
Data Setup for Input DDR
0.28
0.32
0.38
ns
tDDRIHD
Data Hold for Input DDR
0.00
0.00
0.00
ns
tDDRICLR2Q1
Asynchronous Clear-to-Out Out_QR for Input DDR
0.57
0.65
0.76
ns
tDDRICLR2Q2
Asynchronous Clear-to-Out Out_QF for Input DDR
0.46
0.53
0.62
ns
tDDRIREMCLR
Asynchronous Clear Removal Time for Input DDR
0.00
0.00
0.00
ns
tDDRIRECCLR
Asynchronous Clear Recovery Time for Input DDR
0.22
0.25
0.30
ns
tDDRIWCLR
Asynchronous Clear Minimum Pulse Width for Input DDR
0.22
0.25
0.30
ns
tDDRICKMPWH
Clock Minimum Pulse Width High for Input DDR
0.36
0.41
0.48
ns
tDDRICKMPWL
Clock Minimum Pulse Width Low for Input DDR
0.32
0.37
0.43
ns
FDDRIMAX
Maximum Frequency for Input DDR
1404
1232
1048
MHz
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 223
Device Architecture
Output DDR
A
Data_F
(from core)
FF1
B
CLK
CLKBUF
E
C
D
Data_R
Out
0
OUTBUF
1
(from core)
FF2
B
CLR
INBUF
C
DDR_OUT
Figure 2-144 • Output DDR Timing Model
Table 2-181 • Parameter Definitions
Parameter Name
2- 22 4
Parameter Definition
Measuring Nodes (From, To)
tDDROCLKQ
Clock-to-Out
B, E
tDDROCLR2Q
Asynchronous Clear-to-Out
C, E
tDDROREMCLR
Clear Removal
C, B
tDDRORECCLR
Clear Recovery
C, B
tDDROSUD1
Data Setup Data_F
A, B
tDDROSUD2
Data Setup Data_R
D, B
tDDROHD1
Data Hold Data_F
A, B
tDDROHD2
Data Hold Data_R
D, B
R e visio n 4
Fusion Family of Mixed Signal FPGAs
CLK
tDDROSUD2 tDDROHD2
1
Data_F
2
tDDROSUD1
Data_R 6
4
3
5
tDDROHD1
7
8
9
10
11
tDDRORECCLR
tDDROREMCLR
CLR
tDDROCLR2Q
tDDROCLKQ
Out
2
7
8
3
9
4
10
Figure 2-145 • Output DDR Timing Diagram
Timing Characteristics
Table 2-182 • Output DDR Propagation Delays
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDDROCLKQ
Clock-to-Out of DDR for Output DDR
0.70
0.80
0.94
ns
tDDROSUD1
Data_F Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROSUD2
Data_R Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROHD1
Data_F Data Hold for Output DDR
0.00
0.00
0.00
ns
tDDROHD2
Data_R Data Hold for Output DDR
0.00
0.00
0.00
ns
tDDROCLR2Q
Asynchronous Clear-to-Out for Output DDR
0.80
0.91
1.07
ns
tDDROREMCLR
Asynchronous Clear Removal Time for Output DDR
0.00
0.00
0.00
ns
tDDRORECCLR
Asynchronous Clear Recovery Time for Output DDR
0.22
0.25
0.30
ns
tDDROWCLR1
Asynchronous Clear Minimum Pulse Width for Output DDR
0.22
0.25
0.30
ns
tDDROCKMPWH
Clock Minimum Pulse Width High for the Output DDR
0.36
0.41
0.48
ns
tDDROCKMPWL
Clock Minimum Pulse Width Low for the Output DDR
0.32
0.37
0.43
ns
FDDOMAX
Maximum Frequency for the Output DDR
1404
1232
1048
MHz
Note: For the derating values at specific junction temperature and voltage supply levels, refer to Table 3-7 on
page 3-9.
Revision 4
2- 225
Device Architecture
Pin Descriptions
Supply Pins
GND
Ground
Ground supply voltage to the core, I/O outputs, and I/O logic.
GNDQ
Ground (quiet)
Quiet ground supply voltage to input buffers of I/O banks. Within the package, the GNDQ plane is
decoupled from the simultaneous switching noise originated from the output buffer ground domain. This
minimizes the noise transfer within the package and improves input signal integrity. GNDQ needs to
always be connected on the board to GND. Note: In FG256, FG484, and FG676 packages, GNDQ and
GND pins are connected within the package and are labeled as GND pins in the respective package pin
assignment tables.
ADCGNDREF
Analog Reference Ground
Analog ground reference used by the ADC. This pad should be connected to a quiet analog ground.
GNDA
Ground (analog)
Quiet ground supply voltage to the Analog Block of Fusion devices. The use of a separate analog ground
helps isolate the analog functionality of the Fusion device from any digital switching noise. A 0.2 V
maximum differential voltage between GND and GNDA/GNDQ should apply to system implementation.
GNDAQ
Ground (analog quiet)
Quiet ground supply voltage to the analog I/O of Fusion devices. The use of a separate analog ground
helps isolate the analog functionality of the Fusion device from any digital switching noise. A 0.2 V
maximum differential voltage between GND and GNDA/GNDQ should apply to system implementation.
Note: In FG256, FG484, and FG676 packages, GNDAQ and GNDA pins are connected within the
package and are labeled as GNDA pins in the respective package pin assignment tables.
GNDNVM
Flash Memory Ground
Ground supply used by the Fusion device's flash memory block module(s).
GNDOSC
Oscillator Ground
Ground supply for both integrated RC oscillator and crystal oscillator circuit.
VCC15A
Analog Power Supply (1.5 V)
1.5 V clean analog power supply input for use by the 1.5 V portion of the analog circuitry.
VCC33A
Analog Power Supply (3.3 V)
3.3 V clean analog power supply input for use by the 3.3 V portion of the analog circuitry.
VCC33N
Negative 3.3 V Output
This is the –3.3 V output from the voltage converter. A 2.2 µF capacitor must be connected from this pin
to ground.
VCC33PMP
Analog Power Supply (3.3 V)
3.3 V clean analog power supply input for use by the analog charge pump. To avoid high current draw,
VCC33PMP should be powered up simultaneously with or after VCC33A.
VCCNVM
Flash Memory Block Power Supply (1.5 V)
1.5 V power supply input used by the Fusion device's flash memory block module(s). To avoid high
current draw, VCC should be powered up before or simultaneously with VCCNVM.
2- 22 6
R e visio n 4
Fusion Family of Mixed Signal FPGAs
VCCOSC
Oscillator Power Supply (3.3 V)
Power supply for both integrated RC oscillator and crystal oscillator circuit. The internal 100 MHz
oscillator, powered by the VCCOSC pin, is needed for device programming, operation of the VDDN33
pump, and eNVM operation. VCCOSC is off only when VCCA is off. VCCOSC must be powered
whenever the Fusion device needs to function.
VCC
Core Supply Voltage
Supply voltage to the FPGA core, nominally 1.5 V. VCC is also required for powering the JTAG state
machine, in addition to VJTAG. Even when a Fusion device is in bypass mode in a JTAG chain of
interconnected devices, both VCC and VJTAG must remain powered to allow JTAG signals to pass
through the Fusion device.
VCCIBx
I/O Supply Voltage
Supply voltage to the bank's I/O output buffers and I/O logic. Bx is the I/O bank number. There are either
four (AFS090 and AFS250) or five (AFS600 and AFS1500) I/O banks on the Fusion devices plus a
dedicated VJTAG bank.
Each bank can have a separate VCCI connection. All I/Os in a bank will run off the same VCCIBx supply.
VCCI can be 1.5 V, 1.8 V, 2.5 V, or 3.3 V, nominal voltage. Unused I/O banks should have their
corresponding VCCI pins tied to GND.
VCCPLA/B
PLL Supply Voltage
Supply voltage to analog PLL, nominally 1.5 V, where A and B refer to the PLL. AFS090 and AFS250
each have a single PLL. The AFS600 and AFS1500 devices each have two PLLs. Microsemi
recommends tying VCCPLX to VCC and using proper filtering circuits to decouple VCC noise from PLL.
If unused, VCCPLA/B should be tied to GND.
VCOMPLA/B
Ground for West and East PLL
VCOMPLA is the ground of the west PLL (CCC location F) and VCOMPLB is the ground of the east PLL
(CCC location C).
VJTAG
JTAG Supply Voltage
Fusion devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run at any
voltage from 1.5 V to 3.3 V (nominal). Isolating the JTAG power supply in a separate I/O bank gives
greater flexibility in supply selection and simplifies power supply and PCB design. If the JTAG interface is
neither used nor planned to be used, the VJTAG pin together with the TRST pin could be tied to GND. It
should be noted that VCC is required to be powered for JTAG operation; VJTAG alone is insufficient. If a
Fusion device is in a JTAG chain of interconnected boards and it is desired to power down the board
containing the Fusion device, this may be done provided both VJTAG and VCC to the Fusion part remain
powered; otherwise, JTAG signals will not be able to transition the Fusion device, even in bypass mode.
VPUMP
Programming Supply Voltage
Fusion devices support single-voltage ISP programming of the configuration flash and FlashROM. For
programming, VPUMP should be in the 3.3 V +/-5% range. During normal device operation, VPUMP can
be left floating or can be tied to any voltage between 0 V and 3.6 V.
When the VPUMP pin is tied to ground, it shuts off the charge pump circuitry, resulting in no sources of
oscillation from the charge pump circuitry.
For proper programming, 0.01 µF and 0.33 µF capacitors (both rated at 16 V) are to be connected in
parallel across VPUMP and GND, and positioned as close to the FPGA pins as possible.
Revision 4
2- 227
Device Architecture
User-Defined Supply Pins
VREF
I/O Voltage Reference
Reference voltage for I/O minibanks. Both AFS600 and AFS1500 (north bank only) support Microsemi
Pro I/O. These I/O banks support voltage reference standard I/O. The VREF pins are configured by the
user from regular I/Os, and any I/O in a bank, except JTAG I/Os, can be designated as the voltage
reference I/O. Only certain I/O standards require a voltage reference—HSTL (I) and (II), SSTL2 (I) and
(II), SSTL3 (I) and (II), and GTL/GTL+. One VREF pin can support the number of I/Os available in its
minibank.
VAREF
Analog Reference Voltage
The Fusion device can be configured to generate a 2.56 V internal reference voltage that can be used by
the ADC. While using the internal reference, the reference voltage is output on the VAREF pin for use as
a system reference. If a different reference voltage is required, it can be supplied by an external source
and applied to this pin. The valid range of values that can be supplied to the ADC is 1.0 V to 3.3 V. When
VAREF is internally generated by the Fusion device, a bypass capacitor must be connected from this pin
to ground. The value of the bypass capacitor should be between 3.3 µF and 22 µF, which is based on the
needs of the individual designs. The choice of the capacitor value has an impact on the settling time it
takes the VAREF signal to reach the required specification of 2.56 V to initiate valid conversions by the
ADC. If the lower capacitor value is chosen, the settling time required for VAREF to achieve 2.56 V will
be shorter than when selecting the larger capacitor value. The above range of capacitor values supports
the accuracy specification of the ADC, which is detailed in the datasheet. Designers choosing the smaller
capacitor value will not obtain as much margin in the accuracy as that achieved with a larger capacitor
value. Depending on the capacitor value selected in the Analog System Builder, a tool in Libero SoC, an
automatic delay circuit will be generated using logic tiles available within the FPGA to ensure that VAREF
has achieved the 2.56 V value. Microsemi recommends customers use 10 µF as the value of the bypass
capacitor. Designers choosing to use an external VAREF need to ensure that a stable and clean VAREF
source is supplied to the VAREF pin before initiating conversions by the ADC. Designers should also
make sure that the ADCRESET signal is deasserted before initiating valid conversions.2
If the user connects VAREF to external 3.3 V on their board, the internal VAREF driving OpAmp tries to
bring the pin down to the nominal 2.56 V until the device is programmed and up/functional. Under this
scenario, it is recommended to connect an external 3.3 V supply through a ~1 KOhm resistor to limit
current, along with placing a 10-100nF capacitor between VAREF and GNDA.
User Pins
I/O
User Input/Output
The I/O pin functions as an input, output, tristate, or bidirectional buffer. Input and output signal levels are
compatible with the I/O standard selected. Unused I/O pins are configured as inputs with pull-up
resistors.
During programming, I/Os become tristated and weakly pulled up to VCCI. With the VCCI and VCC
supplies continuously powered up, when the device transitions from programming to operating mode, the
I/Os get instantly configured to the desired user configuration.
Unused I/Os are configured as follows:
•
Output buffer is disabled (with tristate value of high impedance)
•
Input buffer is disabled (with tristate value of high impedance)
•
Weak pull-up is programmed
Axy
Analog Input/Output
Analog I/O pin, where x is the analog pad type (C = current pad, G = Gate driver pad, T = Temperature
pad, V = Voltage pad) and y is the Analog Quad number (0 to 9). There is a minimum 1 M to ground on
AV, AC, and AT. This pin can be left floating when it is unused.
2. The ADC is functional with an external reference down to 1V, however to meet the performance parameters highlighted in the
datasheet refer to the VAREF specification in Table 3-2 on page 3-3.
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Fusion Family of Mixed Signal FPGAs
ATRTNx
Temperature Monitor Return
AT returns are the returns for the temperature sensors. The cathode terminal of the external diodes
should be connected to these pins. There is one analog return pin for every two Analog Quads. The x in
the ATRTNx designator indicates the quad pairing (x = 0 for AQ1 and AQ2, x = 1 for AQ2 and AQ3, ...,
x = 4 for AQ8 and AQ9). The signals that drive these pins are called out as ATRETURNxy in the software
(where x and y refer to the quads that share the return signal). ATRTN is internally connected to ground.
It can be left floating when it is unused. The maximum capacitance allowed across the AT pins is 500 pF.
GL
Globals
GL I/Os have access to certain clock conditioning circuitry (and the PLL) and/or have direct access to the
global network (spines). Additionally, the global I/Os can be used as Pro I/Os since they have identical
capabilities. Unused GL pins are configured as inputs with pull-up resistors. See more detailed
descriptions of global I/O connectivity in the "Clock Conditioning Circuits" section on page 2-23.
Refer to the "User I/O Naming Convention" section on page 2-161 for a description of naming of global
pins.
JTAG Pins
Fusion devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run at any
voltage from 1.5 V to 3.3 V (nominal). VCC must also be powered for the JTAG state machine to operate,
even if the device is in bypass mode; VJTAG alone is insufficient. Both VJTAG and VCC to the Fusion
part must be supplied to allow JTAG signals to transition the Fusion device.
Isolating the JTAG power supply in a separate I/O bank gives greater flexibility with supply selection and
simplifies power supply and PCB design. If the JTAG interface is neither used nor planned to be used,
the VJTAG pin together with the TRST pin could be tied to GND.
TCK
Test Clock
Test clock input for JTAG boundary scan, ISP, and UJTAG. The TCK pin does not have an internal pullup/-down resistor. If JTAG is not used, Microsemi recommends tying off TCK to GND or VJTAG through
a resistor placed close to the FPGA pin. This prevents JTAG operation in case TMS enters an undesired
state.
Note that to operate at all VJTAG voltages, 500  to 1 k will satisfy the requirements. Refer to
Table 2-183 for more information.
Table 2-183 • Recommended Tie-Off Values for the TCK and TRST Pins
Tie-Off Resistance2, 3
VJTAG
VJTAG at 3.3 V
200  to 1 k
VJTAG at 2.5 V
200  to 1 k
VJTAG at 1.8 V
500  to 1 k
VJTAG at 1.5 V
500  to 1 k
Notes:
1. Equivalent parallel resistance if more than one device is on JTAG chain.
2. The TCK pin can be pulled up/down.
3. The TRST pin can only be pulled down.
TDI
Test Data Input
Serial input for JTAG boundary scan, ISP, and UJTAG usage. There is an internal weak pull-up resistor
on the TDI pin.
TDO
Test Data Output
Serial output for JTAG boundary scan, ISP, and UJTAG usage.
Revision 4
2- 229
Device Architecture
TMS
Test Mode Select
The TMS pin controls the use of the IEEE1532 boundary scan pins (TCK, TDI, TDO, TRST). There is an
internal weak pull-up resistor on the TMS pin.
TRST
Boundary Scan Reset Pin
The TRST pin functions as an active low input to asynchronously initialize (or reset) the boundary scan
circuitry. There is an internal weak pull-up resistor on the TRST pin. If JTAG is not used, an external pulldown resistor could be included to ensure the TAP is held in reset mode. The resistor values must be
chosen from Table 2-183 and must satisfy the parallel resistance value requirement. The values in
Table 2-183 correspond to the resistor recommended when a single device is used and to the equivalent
parallel resistor when multiple devices are connected via a JTAG chain.
In critical applications, an upset in the JTAG circuit could allow entering an undesired JTAG state. In such
cases, Microsemi recommends tying off TRST to GND through a resistor placed close to the FPGA pin.
Note that to operate at all VJTAG voltages, 500  to 1 k will satisfy the requirements.
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Don't Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
NCAP
Negative Capacitor
Negative Capacitor is where the negative terminal of the charge pump capacitor is connected. A
capacitor, with a 2.2 µF recommended value, is required to connect between PCAP and NCAP.
PCAP
Positive Capacitor
Positive Capacitor is where the positive terminal of the charge pump capacitor is connected. A capacitor,
with a 2.2 µF recommended value, is required to connect between PCAP and NCAP.
PUB
Push Button
Push button is the connection for the external momentary switch used to turn on the 1.5 V voltage
regulator and can be floating if not used.
PTBASE
Pass Transistor Base
Pass Transistor Base is the control signal of the voltage regulator. This pin should be connected to the
base of the external pass transistor used with the 1.5 V internal voltage regulator and can be floating if
not used.
PTEM
Pass Transistor Emitter
Pass Transistor Emitter is the feedback input of the voltage regulator.
This pin should be connected to the emitter of the external pass transistor used with the 1.5 V internal
voltage regulator and can be floating if not used.
XTAL1
Crystal Oscillator Circuit Input
Input to crystal oscillator circuit. Pin for connecting external crystal, ceramic resonator, RC network, or
external clock input. When using an external crystal or ceramic oscillator, external capacitors are also
recommended (Please refer to the crystal oscillator manufacturer for proper capacitor value).
If using external RC network or clock input, XTAL1 should be used and XTAL2 left unconnected. In the
case where the Crystal Oscillator block is not used, the XTAL1 pin should be connected to GND and the
XTAL2 pin should be left floating.
2- 23 0
R e visio n 4
Fusion Family of Mixed Signal FPGAs
XTAL2
Crystal Oscillator Circuit Input
Input to crystal oscillator circuit. Pin for connecting external crystal, ceramic resonator, RC network, or
external clock input. When using an external crystal or ceramic oscillator, external capacitors are also
recommended (Please refer to the crystal oscillator manufacturer for proper capacitor value).
If using external RC network or clock input, XTAL1 should be used and XTAL2 left unconnected. In the
case where the Crystal Oscillator block is not used, the XTAL1 pin should be connected to GND and the
XTAL2 pin should be left floating.
Security
Fusion devices have a built-in 128-bit AES decryption core. The decryption core facilitates highly secure,
in-system programming of the FPGA core array fabric and the FlashROM. The FlashROM and the FPGA
core fabric can be programmed independently from each other, allowing the FlashROM to be updated
without the need for change to the FPGA core fabric. The AES master key is stored in on-chip nonvolatile
memory (flash). The AES master key can be preloaded into parts in a security-protected programming
environment (such as the Microsemi in-house programming center), and then "blank" parts can be
shipped to an untrusted programming or manufacturing center for final personalization with an AESencrypted bitstream. Late stage product changes or personalization can be implemented easily and with
high level security by simply sending a STAPL file with AES-encrypted data. Highly secure remote field
updates over public networks (such as the Internet) are possible by sending and programming a STAPL
file with AES-encrypted data. For more information, refer to the Fusion Security application note.
128-Bit AES Decryption
The 128-bit AES standard (FIPS-197) block cipher is the National Institute of Standards and Technology
(NIST) replacement for DES (Data Encryption Standard FIPS46-2). AES has been designed to protect
sensitive government information well into the 21st century. It replaces the aging DES, which NIST
adopted in 1977 as a Federal Information Processing Standard used by federal agencies to protect
sensitive, unclassified information. The 128-bit AES standard has 3.4 × 1038 possible 128-bit key
variants, and it has been estimated that it would take 1,000 trillion years to crack 128-bit AES cipher text
using exhaustive techniques. Keys are stored (protected with security) in Fusion devices in nonvolatile
flash memory. All programming files sent to the device can be authenticated by the part prior to
programming to ensure that bad programming data is not loaded into the part that may possibly damage
it. All programming verification is performed on-chip, ensuring that the contents of Fusion devices remain
as secure as possible.
AES decryption can also be used on the 1,024-bit FlashROM to allow for remote updates of the
FlashROM contents. This allows for easy support of subscription model products and protects them with
measures designed to provide the highest level of security available. See the application note Fusion
Security for more details.
AES for Flash Memory
AES decryption can also be used on the flash memory blocks. This provides the best available security
during update of the flash memory blocks. During runtime, the encrypted data can be clocked in via the
JTAG interface. The data can be passed through the internal AES decryption engine, and the decrypted
data can then be stored in the flash memory block.
Programming
Programming can be performed using various programming tools, such as Silicon Sculptor II (BP Micro
Systems) or FlashPro3 (Microsemi).
The user can generate STP programming files from the Designer software and can use these files to
program a device.
Fusion devices can be programmed in-system. During programming, VCCOSC is needed in order to
power the internal 100 MHz oscillator. This oscillator is used as a source for the 20 MHz oscillator that is
used to drive the charge pump for programming.
Revision 4
2- 231
Device Architecture
ISP
Fusion devices support IEEE 1532 ISP via JTAG and require a single VPUMP voltage of 3.3 V during
programming. In addition, programming via a microcontroller in a target system can be achieved. Refer to
the standard or the "In-System Programming (ISP) of Microsemi's Low Power Flash Devices Using
FlashPro4/3/3X" chapter of the Fusion FPGA Fabric User’s Guide for more details.
JTAG IEEE 1532
Programming with IEEE 1532
Fusion devices support the JTAG-based IEEE1532 standard for ISP. As part of this support, when a
Fusion device is in an unprogrammed state, all user I/O pins are disabled. This is achieved by keeping
the global IO_EN signal deactivated, which also has the effect of disabling the input buffers.
Consequently, the SAMPLE instruction will have no effect while the Fusion device is in this
unprogrammed state—different behavior from that of the ProASICPLUS® device family. This is done
because SAMPLE is defined in the IEEE1532 specification as a noninvasive instruction. If the input
buffers were to be enabled by SAMPLE temporarily turning on the I/Os, then it would not truly be a
noninvasive instruction. Refer to the standard or the "In-System Programming (ISP) of Microsemi's Low
Power Flash Devices Using FlashPro4/3/3X" chapter of the Fusion FPGA Fabric User’s Guide for more
details.
Boundary Scan
Fusion devices are compatible with IEEE Standard 1149.1, which defines a hardware architecture and
the set of mechanisms for boundary scan testing. The basic Fusion boundary scan logic circuit is
composed of the test access port (TAP) controller, test data registers, and instruction register (Figure 2146 on page 2-233). This circuit supports all mandatory IEEE 1149.1 instructions (EXTEST,
SAMPLE/PRELOAD, and BYPASS) and the optional IDCODE instruction (Table 2-185 on page 2-233).
Each test section is accessed through the TAP, which has five associated pins: TCK (test clock input),
TDI, TDO (test data input and output), TMS (test mode selector), and TRST (test reset input). TMS, TDI,
and TRST are equipped with pull-up resistors to ensure proper operation when no input data is supplied
to them. These pins are dedicated for boundary scan test usage. Refer to the "JTAG Pins" section on
page 2-229 for pull-up/-down recommendations for TDO and TCK pins. The TAP controller is a 4-bit state
machine (16 states) that operates as shown in Figure 2-146 on page 2-233. The 1s and 0s represent the
values that must be present on TMS at a rising edge of TCK for the given state transition to occur. IR and
DR indicate that the instruction register or the data register is operating in that state.
Table 2-184 • TRST and TCK Pull-Down Recommendations
VJTAG
Tie-Off Resistance*
VJTAG at 3.3 V
200  to 1 k
VJTAG at 2.5 V
200  to 1 k
VJTAG at 1.8 V
500  to 1 k
VJTAG at 1.5 V
500  to 1 k
Note: *Equivalent parallel resistance if more than one device is on JTAG chain.
The TAP controller receives two control inputs (TMS and TCK) and generates control and clock signals
for the rest of the test logic architecture. On power-up, the TAP controller enters the Test-Logic-Reset
state. To guarantee a reset of the controller from any of the possible states, TMS must remain High for
five TCK cycles. The TRST pin can also be used to asynchronously place the TAP controller in the TestLogic-Reset state.
Fusion devices support three types of test data registers: bypass, device identification, and boundary
scan. The bypass register is selected when no other register needs to be accessed in a device. This
speeds up test data transfer to other devices in a test data path. The 32-bit device identification register
is a shift register with four fields (LSB, ID number, part number, and version). The boundary scan register
observes and controls the state of each I/O pin. Each I/O cell has three boundary scan register cells,
each with a serial-in, serial-out, parallel-in, and parallel-out pin.
The serial pins are used to serially connect all the boundary scan register cells in a device into a
boundary scan register chain, which starts at the TDI pin and ends at the TDO pin. The parallel ports are
2- 23 2
R e visio n 4
Fusion Family of Mixed Signal FPGAs
connected to the internal core logic I/O tile and the input, output, and control ports of an I/O buffer to
capture and load data into the register to control or observe the logic state of each I/O.
I/O
I/O
I/O
I/O
I/O
TDI
Test Data
Registers
TAP
Controller
Instruction
Register
Device
Logic
TDO
I/O
TRST
I/O
TMS
I/O
TCK
I/O
Bypass Register
I/O
I/O
I/O
I/O
I/O
Figure 2-146 • Boundary Scan Chain in Fusion
Table 2-185 • Boundary Scan Opcodes
Hex Opcode
EXTEST
00
HIGHZ
07
USERCODE
0E
SAMPLE/PRELOAD
01
IDCODE
0F
CLAMP
05
BYPASS
FF
Revision 4
2- 233
IEEE 1532 Characteristics
JTAG timing delays do not include JTAG I/Os. To obtain complete JTAG timing, add I/O buffer delays to
the corresponding standard selected; refer to the I/O timing characteristics in the "User I/Os" section on
page 2-135 for more details.
Timing Characteristics
Table 2-186 • JTAG 1532
Commercial Temperature Range Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDISU
Test Data Input Setup Time
0.50
0.57
0.67
ns
tDIHD
Test Data Input Hold Time
1.00
1.13
1.33
ns
tTMSSU
Test Mode Select Setup Time
0.50
0.57
0.67
ns
tTMDHD
Test Mode Select Hold Time
1.00
1.13
1.33
ns
tTCK2Q
Clock to Q (data out)
6.00
6.80
8.00
ns
tRSTB2Q
Reset to Q (data out)
20.00
22.67
26.67
ns
FTCKMAX
TCK Maximum Frequency
25.00
22.00
19.00
MHz
tTRSTREM
ResetB Removal Time
0.00
0.00
0.00
ns
tTRSTREC
ResetB Recovery Time
0.20
0.23
0.27
ns
tTRSTMPW
ResetB Minimum Pulse
TBD
TBD
TBD
ns
Note: For the derating values at specific junction temperature and voltage supply levels, refer to
Table 3-7 on page 3-9.
3 – DC and Power Characteristics
General Specifications
Operating Conditions
Stresses beyond those listed in Table 3-1 may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
Devices should not be operated outside the recommended operating ranges specified in Table 3-2 on
page 3-3.
Table 3-1 • Absolute Maximum Ratings
Symbol
Parameter
Commercial
Industrial
Units
VCC
DC core supply voltage
–0.3 to 1.65
–0.3 to 1.65
V
VJTAG
JTAG DC voltage
–0.3 to 3.75
–0.3 to 3.75
V
VPUMP
Programming voltage
–0.3 to 3.75
–0.3 to 3.75
V
VCCPLL
Analog power supply (PLL)
–0.3 to 1.65
–0.3 to 1.65
V
VCCI
DC I/O output buffer supply voltage
–0.3 to 3.75
–0.3 to 3.75
V
1
–0.3 V to 3.6 V (when I/O hot insertion mode is
enabled)
–0.3 V to (VCCI + 1 V) or 3.6 V, whichever
voltage is lower (when I/O hot-insertion mode is
disabled)
V
VI
I/O input voltage
VCC33A
+3.3 V power supply
–0.3 to 3.75 2
–0.3 to 3.75 2
V
VCC33PMP +3.3 V power supply
–0.3 to 3.75 2
–0.3 to 3.75 2
V
VAREF
Voltage reference for ADC
–0.3 to 3.75
–0.3 to 3.75
V
VCC15A
Digital power supply for the analog system
–0.3 to 1.65
–0.3 to 1.65
V
VCCNVM
Embedded flash power supply
–0.3 to 1.65
–0.3 to 1.65
V
VCCOSC
Oscillator power supply
–0.3 to 3.75
–0.3 to 3.75
V
Notes:
1. The device should be operated within the limits specified by the datasheet. During transitions, the input signal may
undershoot or overshoot according to the limits shown in Table 3-4 on page 3-4.
2. Analog data not valid beyond 3.65 V.
3. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be used, based on
voltage on the pad.
4. For flash programming and retention maximum limits, refer to Table 3-5 on page 3-5. For recommended operating limits
refer to Table 3-2 on page 3-3.
Revision 4
3 -1
DC and Power Characteristics
Table 3-1 • Absolute Maximum Ratings (continued)
Symbol
AV, AC
AG
AT
Parameter
Commercial
Industrial
Units
–11.0 to 12.6
–11.0 to 12.0
V
Analog input (+16 V to +2 V prescaler range)
–0.4 to 12.6
–0.4 to 12.0
V
Analog input (+1 V to +0.125 V prescaler
range)
–0.4 to 3.75
–0.4 to 3.75
V
Analog input (–16 V to –2 V prescaler range)
–11.0 to 0.4
–11.0 to 0.4
V
Analog input (–1 V to –0.125 V prescaler
range)
–3.75 to 0.4
–3.75 to 0.4
V
Analog input (direct input to ADC)
–0.4 to 3.75
–0.4 to 3.75
V
Digital input
–0.4 to 12.6
–0.4 to 12.0
V
or
–11.0 to 12.6
–11.0 to 12.0
V
Low Current Mode (1 µA, 3 µA, 10 µA, 30 µA)
–0.4 to 12.6
–0.4 to 12.0
V
Low Current Mode (–1 µA, –3 µA, –10 µA, –30
µA)
–11.0 to 0.4
–11.0 to 0.4
V
High Current Mode 3
–11.0 to 12.6
–11.0 to 12.0
V
–0.4 to 16.0
–0.4 to 15.0
V
Analog input (+16 V, 4 V prescaler range)
–0.4 to 16.0
–0.4 to 15.0
V
Analog input (direct input to ADC)
–0.4 to 3.75
–0.4 to 3.75
V
Digital input
–0.4 to 16.0
–0.4 to 15.0
V
Unpowered,
unconfigured
Unpowered,
unconfigured
Unpowered,
unconfigured
ADC
ADC
ADC
reset
reset
reset
asserted
asserted
asserted
or
or
TSTG 4
Storage temperature
–65 to +150
°C
4
Junction temperature
+125
°C
TJ
Notes:
1. The device should be operated within the limits specified by the datasheet. During transitions, the input signal may
undershoot or overshoot according to the limits shown in Table 3-4 on page 3-4.
2. Analog data not valid beyond 3.65 V.
3. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be used, based on
voltage on the pad.
4. For flash programming and retention maximum limits, refer to Table 3-5 on page 3-5. For recommended operating limits
refer to Table 3-2 on page 3-3.
3-2
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Table 3-2 • Recommended Operating Conditions1
Parameter2
Symbol
TJ
Junction temperature
VCC
1.5 V DC core supply voltage
VJTAG
JTAG DC voltage
VPUMP
Programming voltage
Programming mode3
Operation4
Commercial
Industrial
Units
0 to +85
–40 to +100
°C
1.425 to 1.575
1.425 to 1.575
V
1.4 to 3.6
1.4 to 3.6
V
3.15 to 3.45
3.15 to 3.45
V
0 to 3.6
0 to 3.6
V
VCCPLL
Analog power supply (PLL)
1.425 to 1.575
1.425 to 1.575
V
VCCI
1.5 V DC supply voltage
1.425 to 1.575
1.425 to 1.575
V
1.8 V DC supply voltage
1.7 to 1.9
1.7 to 1.9
V
2.5 V DC supply voltage
2.3 to 2.7
2.3 to 2.7
V
3.3 V DC supply voltage
3.0 to 3.6
3.0 to 3.6
V
2.375 to 2.625
2.375 to 2.625
V
3.0 to 3.6
3.0 to 3.6
V
+3.3 V power supply
2.97 to 3.63
2.97 to 3.63
V
VCC33PMP +3.3 V power supply
2.97 to 3.63
2.97 to 3.63
V
LVDS differential I/O
LVPECL differential I/O
VCC33A
VAREF
Voltage reference for ADC
2.527 to 2.593
2.527 to 2.593
V
VCC15A 5
Digital power supply for the analog system
1.425 to 1.575
1.425 to 1.575
V
VCCNVM
Embedded flash power supply
1.425 to 1.575
1.425 to 1.575
V
VCCOSC
Oscillator power supply
2.97 to 3.63
2.97 to 3.63
V
AV, AC 6
Unpowered, ADC reset asserted or unconfigured
–10.5 to 12.0
–10.5 to 11.6
V
Analog input (+16 V to +2 V prescaler range)
–0.3 to 12.0
–0.3 to 11.6
V
Analog input (+1 V to + 0.125 V prescaler range)
–0.3 to 3.6
–0.3 to 3.6
V
Analog input (–16 V to –2 V prescaler range)
–10.5 to 0.3
–10.5 to 0.3
V
Analog input (–1 V to –0.125 V prescaler range)
–3.6 to 0.3
–3.6 to 0.3
V
Analog input (direct input to ADC)
–0.3 to 3.6
–0.3 to 3.6
V
AG 6
AT 6
Digital input
–0.3 to 12.0
–0.3 to 11.6
V
Unpowered, ADC reset asserted or unconfigured
–10.5 to 12.0
–10.5 to 11.6
V
Low Current Mode (1 µA, 3 µA, 10 µA, 30 µA)
–0.3 to 12.0
–0.3 to 11.6
V
Low Current Mode (–1 µA, –3 µA, –10 µA, –30 µA)
–10.5 to 0.3
–10.5 to 0.3
V
High Current Mode 7
–10.5 to 12.0
–10.5 to 11.6
V
Unpowered, ADC reset asserted or unconfigured
–0.3 to 15.5
–0.3 to 14.5
V
Analog input (+16 V, +4 V prescaler range)
–0.3 to 15.5
–0.3 to 14.5
V
Analog input (direct input to ADC)
–0.3 to 3.6
–0.3 to 3.6
V
Digital input
–0.3 to 15.5
–0.3 to 14.5
V
Notes:
1. The ranges given here are for power supplies only. The recommended input voltage ranges specific to each I/O
standard are given in Table 2-85 on page 2-160.
2. All parameters representing voltages are measured with respect to GND unless otherwise specified.
3. The programming temperature range supported is Tambient = 0°C to 85°C.
4. VPUMP can be left floating during normal operation (not programming mode).
5. Violating the VCC15A recommended voltage supply during an embedded flash program cycle can corrupt the page being
programmed.
6. The input voltage may overshoot by up to 500 mV above the Recommended Maximum (150 mV in Direct mode),
provided the duration of the overshoot is less than 50% of the operating lifetime of the device.
7. The AG pad should also conform to the limits as specified in Table 2-48 on page 2-117.
Revision 4
3 -3
DC and Power Characteristics
Table 3-3 • Input Resistance of Analog Pads
Pads
AV, AC
Pad Configuration
Prescaler Range
Input Resistance to Ground
–
2 k (typical)
–
> 10 M
+16 V to +2 V
1 M (typical)
+1 V to +0.125 V
> 10 M
–16 V to –2 V
1 M (typical)
–1 V to –0.125 V
> 10 M
Digital input
+16 V to +2 V
1 M (typical)
Current monitor
+16 V to +2 V
1 M (typical)
–16 V to –2 V
1 M (typical)
–
1 M (typical)
Analog Input (positive prescaler)
+16 V, +4 V
1 M (typical)
Digital input
+16 V, +4 V
1 M (typical)
Temperature monitor
+16 V, +4 V
> 10 M
Analog Input (direct input to ADC)
Analog Input (positive prescaler)
Analog Input (negative prescaler)
AT
Analog Input (direct input to ADC)
Table 3-4 • Overshoot and Undershoot Limits 1
VCCI
2.7 V or less
3.0 V
3.3 V
3.6 V
Average VCCI–GND Overshoot or Undershoot
Duration as a Percentage of Clock Cycle2
Maximum Overshoot/
Undershoot2
10%
1.4 V
5%
1.49 V
10%
1.1 V
5%
1.19 V
10%
0.79 V
5%
0.88 V
10%
0.45 V
5%
0.54 V
Notes:
1. Based on reliability requirements at a junction temperature of 85°C.
2. The duration is allowed at one cycle out of six clock cycle. If the overshoot/undershoot occurs at one out of two cycles,
the maximum overshoot/undershoot has to be reduced by 0.15 V.
3-4
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Table 3-5 • FPGA Programming, Storage, and Operating Limits
Product
Grade
Storage
Temperature
Element
Grade Programming
Cycles
Retention
Commercial
Min. TJ = 0°C
FPGA/FlashROM
500
20 years
Max. TJ = 85°C
Embedded Flash
< 1,000
20 years
< 10,000
10 years
< 15,000
5 years
Min. TJ = –40°C
FPGA/FlashROM
500
20 years
Max. TJ = 100°C
Embedded Flash
< 1,000
20 years
< 10,000
10 years
< 15,000
5 years
Industrial
I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)
Sophisticated power-up management circuitry is designed into every Fusion device. These circuits
ensure easy transition from the powered off state to the powered up state of the device. The many
different supplies can power up in any sequence with minimized current spikes or surges. In addition, the
I/O will be in a known state through the power-up sequence. The basic principle is shown in Figure 3-1
on page 3-6.
There are five regions to consider during power-up.
Fusion I/Os are activated only if ALL of the following three conditions are met:
1. VCC and VCCI are above the minimum specified trip points (Figure 3-1).
2. VCCI > VCC – 0.75 V (typical).
3. Chip is in the operating mode.
VCCI Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.2 V
Ramping down: 0.5 V < trip_point_down < 1.1 V
VCC Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.1 V
Ramping down: 0.5 V < trip_point_down < 1 V
VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This specifically
built-in hysteresis prevents undesirable power-up oscillations and current surges. Note the following:
•
During programming, I/Os become tristated and weakly pulled up to VCCI.
•
JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O
behavior.
Internal Power-Up Activation Sequence
1. Core
2. Input buffers
3. Output buffers, after 200 ns delay from input buffer activation
PLL Behavior at Brownout Condition
Microsemi recommends using monotonic power supplies or voltage regulators to ensure proper powerup behavior. Power ramp-up should be monotonic at least until VCC and VCCPLX exceed brownout
activation levels. The VCC activation level is specified as 1.1 V worst-case (see Figure 3-1 on page 3-6
for more details).
When PLL power supply voltage and/or VCC levels drop below the VCC brownout levels
(0.75 V ± 0.25 V), the PLL output lock signal goes low and/or the output clock is lost.
Revision 4
3 -5
DC and Power Characteristics
VCC = VCCI + VT
VCC
Where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
VCC = 1.575 V
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential inputs)
but slower because VCCI is
below specification. For the
same reason, input buffers do not
meet VIH / VIL levels, and output
buffers do not meet VOH / VOL levels.
Region 1: I/O Buffers are OFF
Region 5: I/O buffers are ON
and power supplies are within
specification.
I/Os meet the entire datasheet
and timer specifications for
speed, VIH / VIL, VOH VOL, etc.
VCC = 1.425 V
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI / VCC are below
specification. For the same reason, input
buffers do not meet VIH / VIL levels, and
output buffers do not meet VOH / VOL levels.
Activation trip point:
Va = 0.85 V ± 0.25 V
Deactivation trip point:
Vd = 0.75 V ± 0.25 V
Region 1: I/O buffers are OFF
Activation trip point:
Va = 0.9 V ±0.3 V
Deactivation trip point:
Vd = 0.8 V ± 0.3 V
Figure 3-1 •
3-6
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
I/O State as a Function of VCCI and VCC Voltage Levels
R e vi s i o n 4
VCCI
Fusion Family of Mixed Signal FPGAs
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient, case, or board temperatures. This is an important distinction because dynamic and static power
consumption will cause the chip's junction temperature to be higher than the ambient, case, or board
temperatures. EQ 1 through EQ 3 give the relationship between thermal resistance, temperature
gradient, and power.
T J – A
 JA = -----------------P
EQ 1
TJ – TB
 JB = ------------------P
EQ 2
 JC
TJ – TC
= ------------------P
EQ 3
where
JA = Junction-to-air thermal resistance
JB = Junction-to-board thermal resistance
JC = Junction-to-case thermal resistance
TJ
= Junction temperature
TA
= Ambient temperature
TB
= Board temperature (measured 1.0 mm away from the
package edge)
TC
= Case temperature
P
= Total power dissipated by the device
Table 3-6 • Package Thermal Resistance
JA
Still Air
1.0 m/s
2.5 m/s
JC
JB
Units
AFS090-QN108
34.5
30.0
27.7
8.1
16.7
°C/W
AFS090-QN180
33.3
27.6
25.7
9.2
21.2
°C/W
AFS250-QN180
32.2
26.5
24.7
5.7
15.0
°C/W
AFS250-PQ208
42.1
38.4
37
20.5
36.3
°C/W
AFS600-PQ208
23.9
21.3
20.48
6.1
16.5
°C/W
Product
AFS090-FG256
37.7
33.9
32.2
11.5
29.7
°C/W
AFS250-FG256
33.7
30.0
28.3
9.3
24.8
°C/W
AFS600-FG256
28.9
25.2
23.5
6.8
19.9
°C/W
AFS1500-FG256
23.3
19.6
18.0
4.3
14.2
°C/W
AFS600-FG484
21.8
18.2
16.7
7.7
16.8
°C/W
AFS1500-FG484
21.6
16.8
15.2
5.6
14.9
°C/W
AFS1500-FG676
TBD
TBD
TBD
TBD
TBD
°C/W
Revision 4
3 -7
DC and Power Characteristics
Theta-JA
Junction-to-ambient thermal resistance (JA) is determined under standard conditions specified by
JEDEC (JESD-51), but it has little relevance in actual performance of the product. It should be used with
caution but is useful for comparing the thermal performance of one package to another.
A sample calculation showing the maximum power dissipation allowed for the AFS600-FG484 package
under forced convection of 1.0 m/s and 75°C ambient temperature is as follows:
T J(MAX) – T A(MAX)
Maximum Power Allowed = -------------------------------------------- JA
EQ 4
where
JA
= 19.00°C/W (taken from Table 3-6 on page 3-7).
TA
= 75.00°C
100.00°C – 75.00°C
Maximum Power Allowed = ---------------------------------------------------- = 1.3 W
19.00°C/W
EQ 5
The power consumption of a device can be calculated using the Microsemi power calculator. The
device's power consumption must be lower than the calculated maximum power dissipation by the
package. If the power consumption is higher than the device's maximum allowable power dissipation, a
heat sink can be attached on top of the case, or the airflow inside the system must be increased.
Theta-JB
Junction-to-board thermal resistance (JB) measures the ability of the package to dissipate heat from the
surface of the chip to the PCB. As defined by the JEDEC (JESD-51) standard, the thermal resistance
from junction to board uses an isothermal ring cold plate zone concept. The ring cold plate is simply a
means to generate an isothermal boundary condition at the perimeter. The cold plate is mounted on a
JEDEC standard board with a minimum distance of 5.0 mm away from the package edge.
Theta-JC
Junction-to-case thermal resistance (JC) measures the ability of a device to dissipate heat from the
surface of the chip to the top or bottom surface of the package. It is applicable for packages used with
external heat sinks. Constant temperature is applied to the surface in consideration and acts as a
boundary condition. This only applies to situations where all or nearly all of the heat is dissipated through
the surface in consideration.
Calculation for Heat Sink
For example, in a design implemented in an AFS600-FG484 package with 2.5 m/s airflow, the power
consumption value using the power calculator is 3.00 W. The user-dependent Ta and Tj are given as
follows:
TJ
=
100.00°C
TA =
70.00°C
From the datasheet:
JA
=
17.00°C/W
JC
=
8.28°C/W
TJ – TA
100°C – 70°C
P = ------------------- = ------------------------------------ = 1.76 W
 JA
17.00 W
EQ 6
3-8
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
The 1.76 W power is less than the required 3.00 W. The design therefore requires a heat sink, or the
airflow where the device is mounted should be increased. The design's total junction-to-air thermal
resistance requirement can be estimated by EQ 7:
TJ – TA
100°C – 70°C
 ja(total) = ------------------- = ------------------------------------ = 10.00°C/W
P
3.00 W
EQ 7
Determining the heat sink's thermal performance proceeds as follows:
 JA(TOTAL) =  JC +  CS +  SA
EQ 8
where
JA
SA
=
0.37°C/W
=
Thermal resistance of the interface material between
the case and the heat sink, usually provided by the
thermal interface manufacturer
=
Thermal resistance of the heat sink in °C/W
 SA =  JA(TOTAL) –  JC –  CS
EQ 9
 SA = 13.33°C/W – 8.28°C/W – 0.37°C/W = 5.01°C/W
A heat sink with a thermal resistance of 5.01°C/W or better should be used. Thermal resistance of heat
sinks is a function of airflow. The heat sink performance can be significantly improved with increased
airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Microsemi FPGA.
Design engineers should always correlate the power consumption of the device with the maximum
allowable power dissipation of the package selected for that device.
Note: The junction-to-air and junction-to-board thermal resistances are based on JEDEC standard
(JESD-51) and assumptions made in building the model. It may not be realized in actual application and
therefore should be used with a degree of caution. Junction-to-case thermal resistance assumes that all
power is dissipated through the case.
Temperature and Voltage Derating Factors
Table 3-7 • Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, Worst-Case VCC = 1.425 V)
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.88
0.93
0.95
1.00
1.02
1.05
1.500
0.83
0.88
0.90
0.95
0.96
0.99
1.575
0.80
0.85
0.87
0.91
0.93
0.96
Revision 4
3 -9
DC and Power Characteristics
Calculating Power Dissipation
Quiescent Supply Current
Table 3-8 • AFS1500 Quiescent Supply Current Characteristics
Parameter
ICC1
Description
1.5 V quiescent current
Conditions
Temp.
Typ.
Max.
Unit
TJ = 25°C
20
40
mA
TJ = 85°C
32
65
mA
TJ = 100°C
59
120
mA
0
0
µA
TJ = 25°C
9.8
13
mA
TJ = 85°C
10.7
14
mA
TJ = 100°C
10.8
15
mA
TJ = 25°C
0.31
2
mA
TJ = 85°C
0.35
2
mA
TJ = 100°C
0.45
2
mA
TJ = 25°C
2.9
3.6
mA
TJ = 85°C
2.9
4
mA
TJ = 100°C
3.3
6
mA
TJ = 25°C
17
19
µA
TJ = 85°C
18
20
µA
TJ = 100°C
24
25
µA
Operational
TJ = 25°C
Standby mode, and Sleep Mode6,
TJ = 85°C
VCCIx = 3.63 V
TJ = 100°C
417
649
µA
417
649
µA
417
649
µA
Operational standby4,
VCC = 1.575 V
5
6
Standby mode or Sleep mode ,
VCC = 0 V
ICC332
3.3 V analog supplies
current
Operational standby4,
VCC33 = 3.63 V
Operational standby, only Analog
Quad and –3.3 V output ON,
VCC33 = 3.63 V
5,
Standby mode VCC33 = 3.63 V
Sleep mode6, VCC33 = 3.63 V
3
ICCI
I/O quiescent current
standby4,
Min.
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC and ICC15A.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, ICCI2, and ICCI4.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTAG = VPUMP = 0 V.
3- 10
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 3-8 • AFS1500 Quiescent Supply Current Characteristics (continued)
Parameter
IJTAG
Description
JTAG I/O quiescent
current
Conditions
Temp.
4
Operational standby ,
VJTAG = 3.63 V
5
Typ.
Max.
Unit
TJ = 25°C
80
100
µA
TJ = 85°C
80
100
µA
TJ = 100°C
80
100
µA
0
0
µA
TJ = 25°C
39
80
µA
TJ = 85°C
40
80
µA
TJ = 100°C
40
80
µA
0
0
µA
TJ = 25°C
50
150
µA
TJ =85°C
50
150
µA
TJ = 100°C
50
150
µA
TJ = 25°C
130
200
µA
TJ = 85°C
130
200
µA
TJ = 100°C
130
200
µA
6
Standby mode or Sleep mode ,
VJTAG = 0 V
IPP
Programming supply
current
Non-programming mode,
VPUMP = 3.63 V
5
6
Standby mode or Sleep mode ,
VPUMP = 0 V
ICCNVM
ICCPLL
Embedded NVM
current
1.5 V PLL quiescent
current
Reset asserted, VCCNVM = 1.575 V
Operational standby
, VCCPLL = 1.575 V
Min.
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC and ICC15A.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, ICCI2, and ICCI4.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTAG = VPUMP = 0 V.
Revision 4
3- 11
DC and Power Characteristics
Table 3-9 • AFS600 Quiescent Supply Current Characteristics
Parameter
1
ICC
Description
1.5 V quiescent current
Conditions
Typ
Max
Unit
TJ = 25°C
13
25
mA
TJ = 85°C
20
45
mA
TJ=100°C
25
75
mA
0
0
µA
TJ = 25°C
9.8
13
mA
TJ = 85°C
10.7
14
mA
TJ = 100°C
10.8
15
mA
Operational standby,
TJ = 25°C
only Analog Quad and –3.3 V
TJ = 85°C
output ON, VCC33 = 3.63 V
TJ = 100°C
0.31
2
mA
0.35
2
mA
0.45
2
mA
Standby mode5,
VCC33 = 3.63 V
TJ = 25°C
2.8
3.6
mA
TJ = 85°C
2.9
4
mA
TJ = 100°C
3.5
6
mA
TJ = 25°C
17
19
µA
TJ = 85°C
18
20
µA
TJ = 100°C
24
25
µA
TJ = 25°C
417
648
µA
TJ = 85°C
417
648
µA
TJ = 100°C
417
649
µA
TJ = 25°C
80
100
µA
TJ = 85°C
80
100
µA
TJ = 100°C
80
100
µA
0
0
µA
4
Operational standby ,
VCC = 1.575 V
Temp.
5
Standby mode or Sleep
mode6, VCC = 0 V
ICC332
3.3 V analog supplies
current
Operational standby4,
VCC33 = 3.63 V
6,
Sleep mode VCC33 = 3.63 V
3
ICCI
IJTAG
I/O quiescent current
JTAG I/O quiescent current
standby4,
Operational
VCCIx = 3.63 V
4,
Operational standby
VJTAG = 3.63 V
Standby mode5 or Sleep
mode6, VJTAG = 0 V
Min
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC and ICC15A.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, ICCI2, and ICCI4.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTAG = VPUMP = 0 V.
3- 12
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 3-9 • AFS600 Quiescent Supply Current Characteristics (continued)
Parameter
IPP
Description
Programming supply
current
Conditions
Non-programming mode,
VPUMP = 3.63 V
Temp.
Typ
Max
Unit
TJ = 25°C
36
80
µA
TJ = 85°C
36
80
µA
TJ = 100°C
36
80
µA
0
0
µA
TJ = 25°C
22
80
µA
TJ = 85°C
24
80
µA
TJ = 100°C
25
80
µA
TJ = 25°C
130
200
µA
TJ = 85°C
130
200
µA
TJ = 100°C
130
200
µA
5
Standby mode or Sleep
mode6, VPUMP = 0 V
ICCNVM
ICCPLL
Embedded NVM current
Reset asserted,
VCCNVM = 1.575 V
1.5 V PLL quiescent current Operational standby,
VCCPLL = 1.575 V
Min
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC and ICC15A.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, ICCI2, and ICCI4.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTAG = VPUMP = 0 V.
Revision 4
3- 13
DC and Power Characteristics
Table 3-10 • AFS250 Quiescent Supply Current Characteristics
Parameter
1
ICC
Description
1.5 V quiescent current
Conditions
Typ
Max
Unit
TJ = 25°C
4.8
10
mA
TJ = 85°C
8.2
30
mA
TJ = 100°C
15
50
mA
0
0
µA
TJ = 25°C
9.8
13
mA
TJ = 85°C
9.8
14
mA
TJ = 100°C
10.8
15
mA
TJ = 25°C
0.29
2
mA
TJ = 85°C
0.31
2
mA
TJ = 100°C
0.45
2
mA
Standby mode5, VCC33 = 3.63V TJ = 25°C
2.9
3.0
mA
TJ = 85°C
2.9
3.1
mA
TJ = 100°C
3.5
6
mA
TJ = 25°C
19
18
µA
TJ = 85°C
19
20
µA
TJ = 100°C
24
25
µA
TJ = 25°C
266
437
µA
TJ = 85°C
266
437
µA
TJ = 100°C
266
437
µA
TJ = 25°C
80
100
µA
TJ = 85°C
80
100
µA
TJ = 100°C
80
100
µA
0
0
µA
4
Operational standby ,
VCC = 1.575 V
Temp.
5
Standby mode or Sleep
mode6, VCC = 0 V
ICC332
3.3 V analog supplies
current
Operational standby4,
VCC33 = 3.63 V
Operational standby, only
Analog Quad and –3.3 V
output ON, VCC33 = 3.63 V
6,
Sleep mode VCC33 = 3.63 V
3
ICCI
IJTAG
I/O quiescent current
JTAG I/O quiescent current
standby6,
Operational
VCCIx = 3.63 V
4,
Operational standby
VJTAG = 3.63 V
Standby mode5 or Sleep
mode6, VJTAG = 0 V
Min
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC, ICCPLL, ICC15A, ICCNVM.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, and ICCI2.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTA G = VPUMP = 0 V.
3- 14
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 3-10 • AFS250 Quiescent Supply Current Characteristics (continued)
Parameter
IPP
Description
Programming supply
current
Conditions
Non-programming mode,
VPUMP = 3.63 V
Temp.
Typ
Max
Unit
TJ = 25°C
37
80
µA
TJ = 85°C
37
80
µA
TJ = 100°C
80
100
µA
0
0
µA
TJ = 25°C
10
40
µA
TJ = 85°C
14
40
µA
TJ = 100°C
14
40
µA
TJ = 25°C
65
100
µA
TJ = 85°C
65
100
µA
TJ = 100°C
65
100
µA
5
Standby mode or Sleep
mode6, VPUMP = 0 V
ICCNVM
ICCPLL
Embedded NVM current
Reset asserted,
VCCNVM = 1.575 V
1.5 V PLL quiescent current Operational standby,
VCCPLL = 1.575 V
Min
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC, ICCPLL, ICC15A, ICCNVM.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, and ICCI2.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTA G = VPUMP = 0 V.
Revision 4
3- 15
DC and Power Characteristics
Table 3-11 • AFS090 Quiescent Supply Current Characteristics
Parameter
1
ICC
Description
1.5 V quiescent current
Conditions
4
Operational standby ,
VCC = 1.575 V
Temp.
Typ
Max
Unit
TJ = 25°C
5
7.5
mA
TJ = 85°C
6.5
20
mA
TJ = 100°C
14
48
mA
0
0
µA
TJ = 25°C
9.8
12
mA
TJ = 85°C
9.8
12
mA
TJ = 100°C
10.7
15
mA
TJ = 25°C
0.30
2
mA
TJ = 85°C
0.30
2
mA
TJ = 100°C
0.45
2
mA
TJ = 25°C
2.9
2.9
mA
TJ = 85°C
2.9
3.0
mA
TJ = 100°C
3.5
6
mA
TJ = 25°C
17
18
µA
TJ = 85°C
18
20
µA
TJ = 100°C
24
25
µA
TJ = 25°C
260
437
µA
TJ = 85°C
260
437
µA
TJ = 100°C
260
437
µA
TJ = 25°C
80
100
µA
TJ = 85°C
80
100
µA
TJ = 100°C
80
100
µA
0
0
µA
TJ = 25°C
37
80
µA
TJ = 85°C
37
80
µA
TJ = 100°C
80
100
µA
0
0
µA
5
Standby mode or Sleep
mode6, VCC = 0 V
ICC332
3.3 V analog supplies
current
Operational standby4,
VCC33 = 3.63 V
Operational standby, only
Analog Quad and –3.3 V
output ON, VCC33 = 3.63 V
Standby mode5,
VCC33 = 3.63 V
6,
Sleep mode VCC33 = 3.63 V
3
ICCI
IJTAG
I/O quiescent current
standby6,
Operational
VCCIx = 3.63 V
4,
JTAG I/O quiescent current Operational standby
VJTAG = 3.63 V
Standby mode5 or Sleep
mode6, VJTAG = 0 V
IPP
Programming supply
current
Non-programming mode,
VPUMP = 3.63 V
5
Standby mode or Sleep
mode6, VPUMP = 0 V
Min
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC, ICCPLL, ICC15A, ICCNVM.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, and ICCI2.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTAG = VPUMP = 0 V.
3- 16
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 3-11 • AFS090 Quiescent Supply Current Characteristics (continued)
Parameter
ICCNVM
ICCPLL
Description
Embedded NVM current
Conditions
Reset asserted,
VCCNVM = 1.575 V
1.5 V PLL quiescent current Operational standby,
VCCPLL = 1.575 V
Temp.
Min
Typ
Max
Unit
TJ = 25°C
10
40
µA
TJ = 85°C
14
40
µA
TJ = 100°C
14
40
µA
TJ = 25°C
65
100
µA
TJ = 85°C
65
100
µA
TJ = 100°C
65
100
µA
Notes:
1.
2.
3.
4.
ICC is the 1.5 V power supplies, ICC, ICCPLL, ICC15A, ICCNVM.
ICC33A includes ICC33A, ICC33PMP, and ICCOSC.
ICCI includes all ICCI0, ICCI1, and ICCI2.
Operational standby is when the Fusion device is powered up, all blocks are used, no I/O is toggling, Voltage Regulator is
loaded with 200 mA, VCC33PMP is ON, XTAL is ON, and ADC is ON.
5. XTAL is configured as high gain, VCC = VJTAG = VPUMP = 0 V.
6. Sleep Mode, VCC = VJTAG = VPUMP = 0 V.
Revision 4
3- 17
DC and Power Characteristics
Power per I/O Pin
Table 3-12 • Summary of I/O Input Buffer Power (per pin)—Default I/O Software Settings
VCCI (V)
Static Power
PDC7 (mW)1
Dynamic Power
PAC9 (µW/MHz)2
3.3 V LVTTL/LVCMOS
3.3
–
17.39
3.3 V LVTTL/LVCMOS – Schmitt trigger
3.3
–
25.51
2.5 V LVCMOS
2.5
–
5.76
2.5 V LVCMOS – Schmitt trigger
2.5
–
7.16
1.8 V LVCMOS
1.8
–
2.72
1.8 V LVCMOS – Schmitt trigger
1.8
–
2.80
1.5 V LVCMOS (JESD8-11)
1.5
–
2.08
1.5 V LVCMOS (JESD8-11) – Schmitt trigger
1.5
–
2.00
3.3 V PCI
3.3
–
18.82
3.3 V PCI – Schmitt trigger
3.3
–
20.12
3.3 V PCI-X
3.3
–
18.82
3.3 V PCI-X – Schmitt trigger
3.3
–
20.12
3.3 V GTL
3.3
2.90
8.23
2.5 V GTL
2.5
2.13
4.78
3.3 V GTL+
3.3
2.81
4.14
2.5 V GTL+
2.5
2.57
3.71
HSTL (I)
1.5
0.17
2.03
HSTL (II)
1.5
0.17
2.03
SSTL2 (I)
2.5
1.38
4.48
SSTL2 (II)
2.5
1.38
4.48
SSTL3 (I)
3.3
3.21
9.26
SSTL3 (II)
3.3
3.21
9.26
LVDS
2.5
2.26
1.50
LVPECL
3.3
5.71
2.17
Applicable to Pro I/O Banks
Single-Ended
Voltage-Referenced
Differential
Notes:
1. PDC7 is the static power (where applicable) measured on VCCI.
2. PAC9 is the total dynamic power measured on VCC and VCCI.
3- 18
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 3-12 • Summary of I/O Input Buffer Power (per pin)—Default I/O Software Settings (continued)
VCCI (V)
Static Power
PDC7 (mW)1
Dynamic Power
PAC9 (µW/MHz)2
3.3 V LVTTL/LVCMOS
3.3
–
16.69
2.5 V LVCMOS
2.5
–
5.12
1.8 V LVCMOS
1.8
–
2.13
1.5 V LVCMOS (JESD8-11)
1.5
–
1.45
3.3 V PCI
3.3
–
18.11
3.3 V PCI-X
3.3
–
18.11
LVDS
2.5
2.26
1.20
LVPECL
3.3
5.72
1.87
3.3 V LVTTL/LVCMOS
3.3
–
16.79
2.5 V LVCMOS
2.5
–
5.19
1.8 V LVCMOS
1.8
–
2.18
1.5 V LVCMOS (JESD8-11)
1.5
–
1.52
Applicable to Advanced I/O Banks
Single-Ended
Differential
Applicable to Standard I/O Banks
Notes:
1. PDC7 is the static power (where applicable) measured on VCCI.
2. PAC9 is the total dynamic power measured on VCC and VCCI.
Revision 4
3- 19
DC and Power Characteristics
Table 3-13 • Summary of I/O Output Buffer Power (per pin)—Default I/O Software Settings1
CLOAD (pF)
VCCI (V)
Static Power
PDC8 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
3.3 V LVTTL/LVCMOS
35
3.3
–
474.70
2.5 V LVCMOS
35
2.5
–
270.73
1.8 V LVCMOS
35
1.8
–
151.78
1.5 V LVCMOS (JESD8-11)
35
1.5
–
104.55
3.3 V PCI
10
3.3
–
204.61
3.3 V PCI-X
10
3.3
–
204.61
3.3 V GTL
10
3.3
–
24.08
2.5 V GTL
10
2.5
–
13.52
3.3 V GTL+
10
3.3
–
24.10
2.5 V GTL+
10
2.5
–
13.54
HSTL (I)
20
1.5
7.08
26.22
HSTL (II)
20
1.5
13.88
27.22
SSTL2 (I)
30
2.5
16.69
105.56
SSTL2 (II)
30
2.5
25.91
116.60
SSTL3 (I)
30
3.3
26.02
114.87
SSTL3 (II)
30
3.3
42.21
131.76
LVDS
–
2.5
7.70
89.62
LVPECL
–
3.3
19.42
168.02
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
–
468.67
2.5 V LVCMOS
35
2.5
–
267.48
1.8 V LVCMOS
35
1.8
–
149.46
1.5 V LVCMOS (JESD8-11)
35
1.5
–
103.12
3.3 V PCI
10
3.3
–
201.02
3.3 V PCI-X
10
3.3
–
201.02
Applicable to Pro I/O Banks
Single-Ended
Voltage-Referenced
Differential
Applicable to Advanced I/O Banks
Single-Ended
Notes:
1. Dynamic power consumption is given for standard load and software-default drive strength and output slew.
2. PDC8 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
3- 20
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Table 3-13 • Summary of I/O Output Buffer Power (per pin)—Default I/O Software Settings1 (continued)
CLOAD (pF)
VCCI (V)
Static Power
PDC8 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
LVDS
–
2.5
7.74
88.92
LVPECL
–
3.3
19.54
166.52
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
–
431.08
2.5 V LVCMOS
35
2.5
–
247.36
1.8 V LVCMOS
35
1.8
–
128.46
1.5 V LVCMOS (JESD8-11)
35
1.5
–
89.46
Differential
Applicable to Standard I/O Banks
Single-Ended
Notes:
1. Dynamic power consumption is given for standard load and software-default drive strength and output slew.
2. PDC8 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
Revision 4
3- 21
DC and Power Characteristics
Dynamic Power Consumption of Various Internal Resources
Table 3-14 • Different Components Contributing to the Dynamic Power Consumption in Fusion Devices
Device-Specific
Dynamic Contributions
Power Supply
Parameter
Definition
Name
PAC1
Clock contribution of a Global
Rib
VCC
1.5 V
14.5
12.8
11
11
µW/MHz
PAC2
Clock contribution of a Global
Spine
VCC
1.5 V
2.5
1.9
1.6
0.8
µW/MHz
PAC3
Clock contribution of a VersaTile
row
VCC
1.5 V
0.81
µW/MHz
PAC4
Clock contribution of a VersaTile
used as a sequential module
VCC
1.5 V
0.11
µW/MHz
PAC5
First contribution of a VersaTile
used as a sequential module
VCC
1.5 V
0.07
µW/MHz
PAC6
Second
contribution
of
a
VersaTile used as a sequential
module
VCC
1.5 V
0.29
µW/MHz
PAC7
Contribution of a VersaTile used
as a combinatorial module
VCC
1.5 V
0.29
µW/MHz
PAC8
Average contribution of a routing
net
VCC
1.5 V
0.70
µW/MHz
PAC9
Contribution of an I/O input pin
(standard dependent)
VCCI
See Table 3-12 on page 3-18
PAC10
Contribution of an I/O output pin
(standard dependent)
VCCI
See Table 3-13 on page 3-20
PAC11
Average contribution of a RAM
block during a read operation
VCC
1.5 V
25
µW/MHz
PAC12
Average contribution of a RAM
block during a write operation
VCC
1.5 V
30
µW/MHz
PAC13
Dynamic Contribution for PLL
VCC
1.5 V
2.6
µW/MHz
PAC15
Contribution of NVM block during
a read operation (F < 33MHz)
VCC
1.5 V
358
µW/MHz
PAC16
1st contribution of NVM block
during a read operation (F > 33
MHz)
VCC
1.5 V
12.88
mW
PAC17
2nd contribution of NVM block
during a read operation (F > 33
MHz)
VCC
1.5 V
4.8
µW/MHz
PAC18
Crystal Oscillator contribution
VCC33A
3.3 V
0.63
mW
PAC19
RC Oscillator contribution
VCC33A
3.3 V
3.3
mW
PAC20
Analog Block dynamic power
contribution of ADC
VCC
1.5 V
3
mW
3- 22
Setting AFS1500
R e visio n 4
AFS600
AFS250 AFS090
Units
Fusion Family of Mixed Signal FPGAs
Static Power Consumption of Various Internal Resources
Table 3-15 • Different Components Contributing to the Static Power Consumption in Fusion Devices
Parameter
Device-Specific Static Contributions
Power
Supply
Definition
VCC
AFS1500 AFS600 AFS250 AFS090 Units
PDC1
Core static power contribution in
operating mode
1.5 V
PDC2
Device static power contribution in VCC33A
standby mode
3.3 V
0.66
mW
PDC3
Device static power contribution in VCC33A
sleep mode
3.3 V
0.03
mW
PDC4
NVM static power contribution
1.5 V
1.19
mW
PDC5
Analog
Block
static
contribution of ADC
power VCC33A
3.3 V
8.25
mW
PDC6
Analog
Block
static
contribution per Quad
power VCC33A
3.3 V
3.3
mW
PDC7
Static contribution per input pin –
standard dependent contribution
VCCI
See Table 3-12 on page 3-18
PDC8
Static contribution per input pin –
standard dependent contribution
VCCI
See Table 3-13 on page 3-20
PDC9
Static contribution for PLL
VCC
VCC
18
1.5 V
7.5
4.50
2.55
3.00
mW
mW
Power Calculation Methodology
This section describes a simplified method to estimate power consumption of an application. For more
accurate and detailed power estimations, use the SmartPower tool in the Libero SoC software.
The power calculation methodology described below uses the following variables:
•
The number of PLLs as well as the number and the frequency of each output clock generated
•
The number of combinatorial and sequential cells used in the design
•
The internal clock frequencies
•
The number and the standard of I/O pins used in the design
•
The number of RAM blocks used in the design
•
The number of NVM blocks used in the design
•
The number of Analog Quads used in the design
•
Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 3-16 on
page 3-27.
•
Enable rates of output buffers—guidelines are provided for typical applications in Table 3-17 on
page 3-27.
•
Read rate and write rate to the RAM—guidelines are provided for typical applications in
Table 3-17 on page 3-27.
•
Read rate to the NVM blocks
The calculation should be repeated for each clock domain defined in the design.
Revision 4
3- 23
DC and Power Characteristics
Methodology
Total Power Consumption—PTOTAL
Operating Mode, Standby Mode, and Sleep Mode
PTOTAL = PSTAT + PDYN
PSTAT is the total static power consumption.
PDYN is the total dynamic power consumption.
Total Static Power Consumption—PSTAT
Operating Mode
PSTAT = PDC1 + (NNVM-BLOCKS * PDC4) + PDC5+ (NQUADS * PDC6) + (NINPUTS * PDC7) +
(NOUTPUTS * PDC8) + (NPLLS * PDC9)
NNVM-BLOCKS is the number of NVM blocks available in the device.
NQUADS is the number of Analog Quads used in the design.
NINPUTS is the number of I/O input buffers used in the design.
NOUTPUTS is the number of I/O output buffers used in the design.
NPLLS is the number of PLLs available in the device.
Standby Mode
PSTAT = PDC2
Sleep Mode
PSTAT = PDC3
Total Dynamic Power Consumption—PDYN
Operating Mode
PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL + PNVM+
PXTL-OSC + PRC-OSC + PAB
Standby Mode
PDYN = PXTL-OSC
Sleep Mode
PDYN = 0 W
Global Clock Dynamic Contribution—PCLOCK
Operating Mode
PCLOCK = (PAC1 + NSPINE * PAC2 + NROW * PAC3 + NS-CELL * PAC4) * FCLK
NSPINE is the number of global spines used in the user design—guidelines are provided in the
"Spine Architecture" section of the Global Resources chapter in the Fusion and Extended
Temperature Fusion FPGA Fabric User's Guide.
NROW is the number of VersaTile rows used in the design—guidelines are provided in the "Spine
Architecture" section of the Global Resources chapter in the Fusion and Extended Temperature
Fusion FPGA Fabric User's Guide.
FCLK is the global clock signal frequency.
NS-CELL is the number of VersaTiles used as sequential modules in the design.
Standby Mode and Sleep Mode
PCLOCK = 0 W
Sequential Cells Dynamic Contribution—PS-CELL
Operating Mode
3- 24
R e visio n 4
Fusion Family of Mixed Signal FPGAs
PS-CELL = NS-CELL * (PAC5 + (1 / 2) * PAC6) * FCLK
NS-CELL is the number of VersaTiles used as sequential modules in the design. When a multi-tile
sequential cell is used, it should be accounted for as 1.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 3-16 on page 3-27.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PS-CELL = 0 W
Combinatorial Cells Dynamic Contribution—PC-CELL
Operating Mode
PC-CELL = NC-CELL* (1 / 2) * PAC7 * FCLK
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 3-16 on page 3-27.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PC-CELL = 0 W
Routing Net Dynamic Contribution—PNET
Operating Mode
PNET = (NS-CELL + NC-CELL) * (1 / 2) * PAC8 * FCLK
NS-CELL is the number VersaTiles used as sequential modules in the design.
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 3-16 on page 3-27.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PNET = 0 W
I/O Input Buffer Dynamic Contribution—PINPUTS
Operating Mode
PINPUTS = NINPUTS * (2 / 2) * PAC9 * FCLK
NINPUTS is the number of I/O input buffers used in the design.
2 is the I/O buffer toggle rate—guidelines are provided in Table 3-16 on page 3-27.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
PINPUTS = 0 W
I/O Output Buffer Dynamic Contribution—POUTPUTS
Operating Mode
POUTPUTS = NOUTPUTS * (2 / 2) * 1 * PAC10 * FCLK
NOUTPUTS is the number of I/O output buffers used in the design.
2 is the I/O buffer toggle rate—guidelines are provided in Table 3-16 on page 3-27.
1 is the I/O buffer enable rate—guidelines are provided in Table 3-17 on page 3-27.
FCLK is the global clock signal frequency.
Standby Mode and Sleep Mode
POUTPUTS = 0 W
Revision 4
3- 25
DC and Power Characteristics
RAM Dynamic Contribution—PMEMORY
Operating Mode
PMEMORY = (NBLOCKS * PAC11 * 2 * FREAD-CLOCK) + (NBLOCKS * PAC12 * 3 * FWRITE-CLOCK)
NBLOCKS is the number of RAM blocks used in the design.
FREAD-CLOCK is the memory read clock frequency.
2
is the RAM enable rate for read operations—guidelines are provided in Table 3-17 on
page 3-27.
3 the RAM enable rate for write operations—guidelines are provided in Table 3-17 on page 3-27.
FWRITE-CLOCK is the memory write clock frequency.
Standby Mode and Sleep Mode
PMEMORY = 0 W
PLL/CCC Dynamic Contribution—PPLL
Operating Mode
PPLL = PAC13 * FCLKOUT
FCLKIN is the input clock frequency.
FCLKOUT is the output clock frequency.1
Standby Mode and Sleep Mode
PPLL = 0 W
Nonvolatile Memory Dynamic Contribution—PNVM
Operating Mode
The NVM dynamic power consumption is a piecewise linear function of frequency.
PNVM = NNVM-BLOCKS * 4 * PAC15 * FREAD-NVM when FREAD-NVM 33 MHz,
PNVM = NNVM-BLOCKS * 4 *(PAC16 + PAC17 * FREAD-NVM when FREAD-NVM > 33 MHz
NNVM-BLOCKS is the number of NVM blocks used in the design (2 inAFS600).
4 is the NVM enable rate for read operations. Default is 0 (NVM mainly in idle state).
FREAD-NVM is the NVM read clock frequency.
Standby Mode and Sleep Mode
PNVM = 0 W
Crystal Oscillator Dynamic Contribution—PXTL-OSC
Operating Mode
PXTL-OSC = PAC18
Standby Mode
PXTL-OSC = PAC18
Sleep Mode
PXTL-OSC = 0 W
1.
3- 26
The PLL dynamic contribution depends on the input clock frequency, the number of output clock signals generated by the
PLL, and the frequency of each output clock. If a PLL is used to generate more than one output clock, include each output
clock in the formula output clock by adding its corresponding contribution (PAC14 * FCLKOUT product) to the total PLL
contribution.
R e visio n 4
Fusion Family of Mixed Signal FPGAs
RC Oscillator Dynamic Contribution—PRC-OSC
Operating Mode
PRC-OSC = PAC19
Standby Mode and Sleep Mode
PRC-OSC = 0 W
Analog System Dynamic Contribution—PAB
Operating Mode
PAB = PAC20
Standby Mode and Sleep Mode
PAB = 0 W
Guidelines
Toggle Rate Definition
A toggle rate defines the frequency of a net or logic element relative to a clock. It is a percentage. If the
toggle rate of a net is 100%, this means that the net switches at half the clock frequency. Below are some
examples:
•
The average toggle rate of a shift register is 100%, as all flip-flop outputs toggle at half of the clock
frequency.
•
The average toggle rate of an 8-bit counter is 25%:
–
Bit 0 (LSB) = 100%
–
Bit 1 = 50%
–
Bit 2 = 25%
–
…
–
Bit 7 (MSB) = 0.78125%
–
Average toggle rate = (100% + 50% + 25% + 12.5% + . . . 0.78125%) / 8.
Enable Rate Definition
Output enable rate is the average percentage of time during which tristate outputs are enabled. When
non-tristate output buffers are used, the enable rate should be 100%.
Table 3-16 • Toggle Rate Guidelines Recommended for Power Calculation
Component
1
2
Definition
Guideline
Toggle rate of VersaTile outputs
10%
I/O buffer toggle rate
10%
Table 3-17 • Enable Rate Guidelines Recommended for Power Calculation
Component
1
2
3
4
Definition
Guideline
I/O output buffer enable rate
100%
RAM enable rate for read operations
12.5%
RAM enable rate for write operations
12.5%
NVM enable rate for read operations
0%
Revision 4
3- 27
DC and Power Characteristics
Example of Power Calculation
This example considers a shift register with 5,000 storage tiles, including a counter and memory that
stores analog information. The shift register is clocked at 50 MHz and stores and reads information from
a RAM.
The device used is a commercial AFS600 device operating in typical conditions.
The calculation below uses the power calculation methodology previously presented and shows how to
determine the dynamic and static power consumption of resources used in the application.
Also included in the example is the calculation of power consumption in operating, standby, and sleep
modes to illustrate the benefit of power-saving modes.
Global Clock Contribution—PCLOCK
FCLK = 50 MHz
Number of sequential VersaTiles: NS-CELL = 5,000
Estimated number of Spines: NSPINES = 5
Estimated number of Rows: NROW = 313
Operating Mode
PCLOCK = (PAC1 + NSPINE * PAC2 + NROW * PAC3 + NS-CELL * PAC4) * FCLK
PCLOCK = (0.0128 + 5 * 0.0019 + 313 * 0.00081 + 5,000 * 0.00011) * 50
PCLOCK = 41.28 mW
Standby Mode and Sleep Mode
PCLOCK = 0 W
Logic—Sequential Cells, Combinational Cells, and Routing Net Contributions—PS-CELL,
PC-CELL, and PNET
FCLK = 50 MHz
Number of sequential VersaTiles: NS-CELL = 5,000
Number of combinatorial VersaTiles: NC-CELL = 6,000
Estimated toggle rate of VersaTile outputs: 1 = 0.1 (10%)
Operating Mode
PS-CELL = NS-CELL * (PAC5+ (1 / 2) * PAC6) * FCLK
PS-CELL = 5,000 * (0.00007 + (0.1 / 2) * 0.00029) * 50
PS-CELL = 21.13 mW
PC-CELL = NC-CELL* (1 / 2) * PAC7 * FCLK
PC-CELL = 6,000 * (0.1 / 2) * 0.00029 * 50
PC-CELL = 4.35 mW
PNET = (NS-CELL + NC-CELL) * (1 / 2) * PAC8 * FCLK
PNET = (5,000 + 6,000) * (0.1 / 2) * 0.0007 * 50
PNET = 19.25 mW
PLOGIC = PS-CELL + PC-CELL + PNET
PLOGIC = 21.13 mW + 4.35 mW + 19.25 mW
PLOGIC = 44.73 mW
Standby Mode and Sleep Mode
3- 28
R e visio n 4
Fusion Family of Mixed Signal FPGAs
PS-CELL = 0 W
PC-CELL = 0 W
PNET = 0 W
PLOGIC = 0 W
I/O Input and Output Buffer Contribution—PI/O
This example uses LVTTL 3.3 V I/O cells. The output buffers are 12 mA–capable, configured with high
output slew and driving a 35 pF output load.
FCLK = 50 MHz
Number of input pins used: NINPUTS = 30
Number of output pins used: NOUTPUTS = 40
Estimated I/O buffer toggle rate: 2 = 0.1 (10%)
Estimated IO buffer enable rate: 1 = 1 (100%)
Operating Mode
PINPUTS = NINPUTS * (2 / 2) * PAC9 * FCLK
PINPUTS = 30 * (0.1 / 2) * 0.01739 * 50
PINPUTS = 1.30 mW
POUTPUTS = NOUTPUTS * (2 / 2) * 1 * PAC10 * FCLK
POUTPUTS = 40 * (0.1 / 2) * 1 * 0.4747 * 50
POUTPUTS = 47.47 mW
PI/O = PINPUTS + POUTPUTS
PI/O = 1.30 mW + 47.47 mW
PI/O = 48.77 mW
Standby Mode and Sleep Mode
PINPUTS = 0 W
POUTPUTS = 0 W
PI/O = 0 W
RAM Contribution—PMEMORY
Frequency of Read Clock: FREAD-CLOCK = 10 MHz
Frequency of Write Clock: FWRITE-CLOCK = 10 MHz
Number of RAM blocks: NBLOCKS = 20
Estimated RAM Read Enable Rate: 2 = 0.125 (12.5%)
Estimated RAM Write Enable Rate: 3 = 0.125 (12.5%)
Operating Mode
PMEMORY = (NBLOCKS * PAC11 * 2 * FREAD-CLOCK) + (NBLOCKS * PAC12 * 3 * FWRITE-CLOCK)
PMEMORY = (20 * 0.025 * 0.125 * 10) + (20 * 0.030 * 0.125 * 10)
PMEMORY = 1.38 mW
Standby Mode and Sleep Mode
PMEMORY = 0 W
Revision 4
3- 29
DC and Power Characteristics
PLL/CCC Contribution—PPLL
PLL is not used in this application.
PPLL = 0 W
Nonvolatile Memory—PNVM
Nonvolatile memory is not used in this application.
PNVM = 0 W
Crystal Oscillator—PXTL-OSC
The application utilizes standby mode. The crystal oscillator is assumed to be active.
Operating Mode
PXTL-OSC = PAC18
PXTL-OSC = 0.63 mW
Standby Mode
PXTL-OSC = PAC18
PXTL-OSC = 0.63 mW
Sleep Mode
PXTL-OSC = 0 W
RC Oscillator—PRC-OSC
Operating Mode
PRC-OSC = PAC19
PRC-OSC = 3.30 mW
Standby Mode and Sleep Mode
PRC-OSC = 0 W
Analog System—PAB
Number of Quads used: NQUADS = 4
Operating Mode
PAB = PAC20
PAB = 3.00 mW
Standby Mode and Sleep Mode
PAB = 0 W
Total Dynamic Power Consumption—PDYN
Operating Mode
PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL + PNVM+
PXTL-OSC + PRC-OSC + PAB
PDYN = 41.28 mW + 21.1 mW + 4.35 mW + 19.25 mW + 1.30 mW + 47.47 mW + 1.38 mW + 0 + 0 +
0.63 mW + 3.30 mW + 3.00 mW
PDYN = 143.06 mW
Standby Mode
PDYN = PXTL-OSC
PDYN = 0.63 mW
Sleep Mode
PDYN = 0 W
3- 30
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Total Static Power Consumption—PSTAT
Number of Quads used: NQUADS = 4
Number of NVM blocks available (AFS600): NNVM-BLOCKS = 2
Number of input pins used: NINPUTS = 30
Number of output pins used: NOUTPUTS = 40
Operating Mode
PSTAT = PDC1 + (NNVM-BLOCKS * PDC4) + PDC5 + (NQUADS * PDC6) + (NINPUTS * PDC7) +
(NOUTPUTS * PDC8)
PSTAT = 7.50 mW + (2 * 1.19 mW) + 8.25 mW + (4 * 3.30 mW) + (30 * 0.00) + (40 * 0.00)
PSTAT = 31.33 mW
Standby Mode
PSTAT = PDC2
PSTAT = 0.03 mW
Sleep Mode
PSTAT = PDC3
PSTAT = 0.03 mW
Total Power Consumption—PTOTAL
In operating mode, the total power consumption of the device is 174.39 mW:
PTOTAL = PSTAT + PDYN
PTOTAL = 143.06 mW + 31.33 mW
PTOTAL = 174.39 mW
In standby mode, the total power consumption of the device is limited to 0.66 mW:
PTOTAL = PSTAT + PDYN
PTOTAL = 0.03 mW + 0.63 mW
PTOTAL = 0.66 mW
In sleep mode, the total power consumption of the device drops as low as 0.03 mW:
PTOTAL = PSTAT + PDYN
PTOTAL = 0.03 mW
Revision 4
3- 31
DC and Power Characteristics
Power Consumption
Table 3-18 • Power Consumption
Parameter
Description
Condition
Min.
Typical
Max.
Units
Crystal Oscillator
ISTBXTAL
Standby Current of Crystal
Oscillator
IDYNXTAL
Operating Current
10
µA
RC
0.6
mA
0.032–0.2
0.19
mA
0.2–2.0
0.6
mA
2.0–20.0
0.6
mA
1
mA
RC Oscillator
IDYNRC
Operating Current
ACM
Operating
clock)
Current
(fixed
200
µA/MHz
Operating
clock)
Current
(user
30
µA
Idle
795
µA
Read
operation
See
Table 3-15 on
page 3-23.
See
Table 3-15 on
page 3-23.
Erase
900
µA
Write
900
µA
20
µW/MHz
NVM System
NVM Array Operating Power
PNVMCTRL
3- 32
NVM Controller
Power
Operating
R e visio n 4
4 – Package Pin Assignments
QN108
A44
A56
B41
B52
Pin A1 Mark
A43
A1
B40
B1
B13
A14
B27
A29
B26
B14
A28
A15
Note: The die attach paddle center of the package is tied to ground (GND).
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Revision 4
4 -1
Package Pin Assignments
QN108
QN108
QN108
Pin Number
AFS090 Function
Pin Number
AFS090 Function
Pin Number
AFS090 Function
A1
NC
A39
GND
B21
AC2
A2
GNDQ
A40
GCB1/IO35PDB1V0
B22
ATRTN1
A3
GAA2/IO52PDB3V0
A41
GCB2/IO33PDB1V0
B23
AG3
A4
GND
A42
GBA2/IO31PDB1V0
B24
AV3
A5
GFA1/IO47PDB3V0
A43
NC
B25
VCC33A
A6
GEB1/IO45PDB3V0
A44
GBA1/IO30RSB0V0
B26
VAREF
A7
VCCOSC
A45
GBB1/IO28RSB0V0
B27
PUB
A8
XTAL2
A46
GND
B28
VCC33A
A9
GEA1/IO44PPB3V0
A47
VCC
B29
PTBASE
A10
GEA0/IO44NPB3V0
A48
GBC1/IO26RSB0V0
B30
VCCNVM
A11
GEB2/IO42PDB3V0
A49
IO21RSB0V0
B31
VCC
A12
VCCNVM
A50
IO19RSB0V0
B32
TDI
A13
VCC15A
A51
IO09RSB0V0
B33
TDO
A14
PCAP
A52
GAC0/IO04RSB0V0
B34
VJTAG
A15
NC
A53
VCCIB0
B35
A16
GNDA
A54
GND
GDC0/IO38NDB1V
0
A17
AV0
A55
GAB0/IO02RSB0V0
B36
VCCIB1
A18
AG0
A56
GAA0/IO00RSB0V0
B37
GCB0/IO35NDB1V0
A19
ATRTN0
B1
VCOMPLA
B38
A20
AT1
B2
VCCIB3
GCC2/IO33NDB1V
0
A21
AC1
B3
GAB2/IO52NDB3V0
B39
GBB2/IO31NDB1V0
A22
AV2
B4
VCCIB3
B40
VCCIB1
A23
AG2
B5
GFA0/IO47NDB3V0
B41
GNDQ
A24
AT2
B6
GEB0/IO45NDB3V0
B42
GBA0/IO29RSB0V0
A25
AT3
B7
XTAL1
B43
VCCIB0
A26
AC3
B8
GNDOSC
B44
GBB0/IO27RSB0V0
A27
GNDAQ
B9
GEC2/IO43PSB3V0
B45
GBC0/IO25RSB0V0
A28
ADCGNDREF
B10
GEA2/IO42NDB3V0
B46
IO20RSB0V0
A29
NC
B11
VCC
B47
IO10RSB0V0
A30
GNDA
B12
GNDNVM
B48
GAC1/IO05RSB0V0
A31
PTEM
B13
NCAP
B49
GAB1/IO03RSB0V0
A32
GNDNVM
B14
VCC33PMP
B50
VCC
A33
VPUMP
B15
VCC33N
B51
GAA1/IO01RSB0V0
A34
TCK
B16
GNDAQ
B52
VCCPLA
A35
TMS
B17
AC0
A36
TRST
B18
AT0
A37
GDB1/IO39PSB1V0
B19
AG1
A38
GDC1/IO38PDB1V0
B20
AV1
4-2
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
QN180
A64
B60
A49
B46
C56
C43
Pin A1 Mark
D1
D4
A48
A33
B1
A1
B45
C42
C1
C29
B31
C14
B15
D3
A16
D2
Optional Corner
Pad (4X)
C15
C28
B16
B30
A32
A17
Note: The die attach paddle center of the package is tied to ground (GND).
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Revision 4
4 -3
Package Pin Assignments
QN180
QN180
Pin Number
AFS090 Function
AFS250 Function
Pin Number
AFS090 Function
AFS250 Function
A1
GNDQ
GNDQ
A37
VPUMP
VPUMP
A2
VCCIB3
VCCIB3
A38
TDI
TDI
A3
GAB2/IO52NDB3V0
IO74NDB3V0
A39
TDO
TDO
A4
GFA2/IO51NDB3V0
IO71NDB3V0
A40
VJTAG
VJTAG
A5
GFC2/IO50NDB3V0
IO69NPB3V0
A41
GDB1/IO39PPB1V0 GDA1/IO54PPB1V0
A6
VCCIB3
VCCIB3
A42
GDC1/IO38PDB1V0 GDB1/IO53PDB1V0
A7
GFA1/IO47PPB3V0 GFB1/IO67PPB3V0
A43
A8
GEB0/IO45NDB3V0
NC
A44
GCB0/IO35NPB1V0 GCB0/IO48NPB1V0
A9
XTAL1
XTAL1
A45
GCC1/IO34PDB1V0 GCC1/IO47PDB1V0
A10
GNDOSC
GNDOSC
A46
A11
4-4
GEC2/IO43PPB3V0 GEA1/IO61PPB3V0
A47
VCC
VCCIB1
VCC
VCCIB1
GBC2/IO32PPB1V0 GBB2/IO41PPB1V0
A12
IO43NPB3V0
GEA0/IO61NPB3V0
A48
VCCIB1
VCCIB1
A13
NC
VCCIB3
A49
NC
NC
A14
GNDNVM
GNDNVM
A50
A15
PCAP
PCAP
A51
A16
VCC33PMP
VCC33PMP
A52
GBB0/IO27RSB0V0 GBC0/IO34RSB0V0
A17
NC
NC
A53
GBC1/IO26RSB0V0
IO33RSB0V0
A18
AV0
AV0
A54
IO24RSB0V0
IO29RSB0V0
A19
AG0
AG0
A55
IO21RSB0V0
IO26RSB0V0
A20
ATRTN0
ATRTN0
A56
VCCIB0
VCCIB0
A21
AG1
AG1
A57
IO15RSB0V0
IO21RSB0V0
A22
AC1
AC1
A58
IO10RSB0V0
IO13RSB0V0
A23
AV2
AV2
A59
IO07RSB0V0
IO10RSB0V0
A24
AT2
AT2
A60
GAC0/IO04RSB0V0
IO06RSB0V0
A25
AT3
AT3
A61
GAB1/IO03RSB0V0 GAC1/IO05RSB0V0
A26
AC3
AC3
A62
A27
AV4
AV4
A63
A28
AC4
AC4
A64
NC
NC
A29
AT4
AT4
B1
VCOMPLA
VCOMPLA
A30
NC
AG5
B2
GAA2/IO52PDB3V0 GAC2/IO74PDB3V0
A31
NC
AV5
B3
GAC2/IO51PDB3V0 GFA2/IO71PDB3V0
A32
ADCGNDREF
ADCGNDREF
B4
GFB2/IO50PDB3V0 GFB2/IO70PSB3V0
A33
VCC33A
VCC33A
B5
A34
GNDA
GNDA
B6
GFC0/IO49NDB3V0 GFC0/IO68NDB3V0
A35
PTBASE
PTBASE
B7
GEB1/IO45PDB3V0
NC
A36
VCCNVM
VCCNVM
B8
VCCOSC
VCCOSC
R e vi s i o n 4
GBA0/IO29RSB0V0 GBB1/IO37RSB0V0
VCCIB0
VCC
VCCIB0
VCC
GAA1/IO01RSB0V0 GAB0/IO02RSB0V0
VCC
VCC
Fusion Family of Mixed Signal FPGAs
QN180
QN180
Pin Number
AFS090 Function
AFS250 Function
Pin Number
B9
XTAL2
XTAL2
B45
AFS090 Function
AFS250 Function
GBA2/IO31PDB1V0 GBA2/IO40PDB1V0
B10
GEA0/IO44NDB3V0 GFA0/IO66NDB3V0
B46
GNDQ
GNDQ
B11
GEB2/IO42PDB3V0
IO60NDB3V0
B47
GBA1/IO30RSB0V0 GBA0/IO38RSB0V0
B12
VCC
VCC
B48
GBB1/IO28RSB0V0 GBC1/IO35RSB0V0
B13
VCCNVM
VCCNVM
B49
VCC
VCC
B14
VCC15A
VCC15A
B50
GBC0/IO25RSB0V0
IO31RSB0V0
B15
NCAP
NCAP
B51
IO23RSB0V0
IO28RSB0V0
B16
VCC33N
VCC33N
B52
IO20RSB0V0
IO25RSB0V0
B17
GNDAQ
GNDAQ
B53
VCC
VCC
B18
AC0
AC0
B54
IO11RSB0V0
IO14RSB0V0
B19
AT0
AT0
B55
IO08RSB0V0
IO11RSB0V0
B20
AT1
AT1
B56
GAC1/IO05RSB0V0
IO08RSB0V0
B21
AV1
AV1
B57
VCCIB0
VCCIB0
B22
AC2
AC2
B58
GAB0/IO02RSB0V0 GAC0/IO04RSB0V0
B23
ATRTN1
ATRTN1
B59
GAA0/IO00RSB0V0 GAA1/IO01RSB0V0
B24
AG3
AG3
B60
VCCPLA
VCCPLA
B25
AV3
AV3
C1
NC
NC
B26
AG4
AG4
C2
NC
VCCIB3
B27
ATRTN2
ATRTN2
C3
GND
GND
B28
NC
AC5
C4
NC
GFC2/IO69PPB3V0
B29
VCC33A
VCC33A
C5
GFC1/IO49PDB3V0 GFC1/IO68PDB3V0
B30
VAREF
VAREF
C6
GFA0/IO47NPB3V0 GFB0/IO67NPB3V0
B31
PUB
PUB
C7
VCCIB3
NC
B32
PTEM
PTEM
C8
GND
GND
B33
GNDNVM
GNDNVM
C9
GEA1/IO44PDB3V0 GFA1/IO66PDB3V0
B34
VCC
VCC
C10
GEA2/IO42NDB3V0 GEC2/IO60PDB3V0
B35
TCK
TCK
C11
NC
GEA2/IO58PSB3V0
B36
TMS
TMS
C12
NC
NC
B37
TRST
TRST
C13
GND
GND
B38
GDB2/IO41PSB1V0 GDA2/IO55PSB1V0
C14
NC
NC
B39
GDC0/IO38NDB1V0 GDB0/IO53NDB1V0
C15
NC
NC
C16
GNDA
GNDA
B40
VCCIB1
VCCIB1
B41
GCA1/IO36PDB1V0 GCA1/IO49PDB1V0
C17
NC
NC
B42
GCC0/IO34NDB1V0 GCC0/IO47NDB1V0
C18
NC
NC
B43
GCB2/IO33PSB1V0 GBC2/IO42PSB1V0
C19
NC
NC
C20
NC
NC
B44
VCC
VCC
Revision 4
4 -5
Package Pin Assignments
QN180
QN180
Pin Number
AFS090 Function
AFS250 Function
Pin Number
AFS090 Function
AFS250 Function
C21
AG2
AG2
D1
NC
NC
C22
NC
NC
D2
NC
NC
C23
NC
NC
D3
NC
NC
C24
NC
NC
D4
NC
NC
C25
NC
AT5
C26
GNDAQ
GNDAQ
C27
NC
NC
C28
NC
NC
C29
NC
NC
C30
NC
NC
C31
GND
GND
C32
NC
NC
C33
NC
NC
C34
NC
NC
C35
GND
GND
4-6
C36
GDB0/IO39NPB1V0 GDA0/IO54NPB1V0
C37
GDA1/IO37NSB1V0 GDC0/IO52NSB1V0
C38
GCA0/IO36NDB1V0 GCA0/IO49NDB1V0
C39
GCB1/IO35PPB1V0 GCB1/IO48PPB1V0
C40
GND
GND
C41
GCA2/IO32NPB1V0
IO41NPB1V0
C42
GBB2/IO31NDB1V0
IO40NDB1V0
C43
NC
NC
C44
NC
GBA1/IO39RSB0V0
C45
NC
GBB0/IO36RSB0V0
C46
GND
GND
C47
NC
IO30RSB0V0
C48
IO22RSB0V0
IO27RSB0V0
C49
GND
GND
C50
IO13RSB0V0
IO16RSB0V0
C51
IO09RSB0V0
IO12RSB0V0
C52
IO06RSB0V0
IO09RSB0V0
C53
GND
GND
C54
NC
GAB1/IO03RSB0V0
C55
NC
GAA0/IO00RSB0V0
C56
NC
NC
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
PQ208
1
208
208-Pin PQFP
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Revision 4
4 -7
Package Pin Assignments
PQ208
PQ208
Pin
Number
AFS250 Function
AFS600 Function
Pin
Number
AFS250 Function
AFS600 Function
1
VCCPLA
VCCPLA
38
IO60NDB3V0
GEB0/IO62NDB4V0
2
VCOMPLA
VCOMPLA
39
GND
GEA1/IO61PDB4V0
3
GNDQ
GAA2/IO85PDB4V0
40
VCCIB3
GEA0/IO61NDB4V0
4
VCCIB3
IO85NDB4V0
41
5
6
7
IO76NDB3V0
IO84NDB4V0
GAB2/IO75PDB3V0 GAC2/IO83PDB4V0
42
IO59NDB3V0
IO60NDB4V0
43
GEA2/IO58PDB3V0
VCCIB4
44
IO58NDB3V0
GNDQ
8
IO75NDB3V0
IO83NDB4V0
45
VCC
VCC
9
NC
IO77PDB4V0
45
VCC
VCC
10
NC
IO77NDB4V0
46
VCCNVM
VCCNVM
11
VCC
IO76PDB4V0
47
GNDNVM
GNDNVM
12
GND
IO76NDB4V0
48
GND
GND
13
VCCIB3
VCC
49
VCC15A
VCC15A
14
IO72PDB3V0
GND
50
PCAP
PCAP
15
IO72NDB3V0
VCCIB4
51
NCAP
NCAP
52
VCC33PMP
VCC33PMP
53
VCC33N
VCC33N
54
GNDA
GNDA
16
17
18
4-8
GAA2/IO76PDB3V0 GAB2/IO84PDB4V0
GEB2/IO59PDB3V0 GEC2/IO60PDB4V0
GFA2/IO71PDB3V0 GFA2/IO75PDB4V0
IO71NDB3V0
IO75NDB4V0
GFB2/IO70PDB3V0 GFC2/IO73PDB4V0
19
IO70NDB3V0
IO73NDB4V0
55
GNDAQ
GNDAQ
20
GFC2/IO69PDB3V0
VCCOSC
56
NC
AV0
21
IO69NDB3V0
XTAL1
57
NC
AC0
22
VCC
XTAL2
58
NC
AG0
23
GND
GNDOSC
59
NC
AT0
24
VCCIB3
GFC1/IO72PDB4V0
60
NC
ATRTN0
25
GFC1/IO68PDB3V0 GFC0/IO72NDB4V0
61
NC
AT1
26
GFC0/IO68NDB3V0 GFB1/IO71PDB4V0
62
NC
AG1
27
GFB1/IO67PDB3V0 GFB0/IO71NDB4V0
63
NC
AC1
28
GFB0/IO67NDB3V0 GFA1/IO70PDB4V0
64
NC
AV1
29
VCCOSC
GFA0/IO70NDB4V0
65
AV0
AV2
30
XTAL1
IO69PDB4V0
66
AC0
AC2
31
XTAL2
IO69NDB4V0
67
AG0
AG2
32
GNDOSC
VCC
68
AT0
AT2
33
GEB1/IO62PDB3V0
GND
69
ATRTN0
ATRTN1
34
GEB0/IO62NDB3V0
VCCIB4
70
AT1
AT3
35
GEA1/IO61PDB3V0 GEC1/IO63PDB4V0
71
AG1
AG3
36
GEA0/IO61NDB3V0 GEC0/IO63NDB4V0
72
AC1
AC3
37
GEC2/IO60PDB3V0 GEB1/IO62PDB4V0
73
AV1
AV3
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
PQ208
PQ208
Pin
Number
AFS250 Function
AFS600 Function
Pin
Number
AFS250 Function
AFS600 Function
74
AV2
AV4
111
VCCNVM
VCCNVM
75
AC2
AC4
112
VCC
VCC
76
AG2
AG4
112
VCC
VCC
77
AT2
AT4
113
VPUMP
VPUMP
78
ATRTN1
ATRTN2
114
GNDQ
NC
79
AT3
AT5
115
VCCIB1
TCK
80
AG3
AG5
116
TCK
TDI
81
AC3
AC5
117
TDI
TMS
82
AV3
AV5
118
TMS
TDO
83
AV4
AV6
119
TDO
TRST
84
AC4
AC6
120
TRST
VJTAG
85
AG4
AG6
121
VJTAG
IO57NDB2V0
86
AT4
AT6
122
IO57NDB1V0
GDC2/IO57PDB2V0
87
ATRTN2
ATRTN3
123
GDC2/IO57PDB1V0
IO56NDB2V0
88
AT5
AT7
124
IO56NDB1V0
GDB2/IO56PDB2V0
89
AG5
AG7
125
GDB2/IO56PDB1V0
IO55NDB2V0
90
AC5
AC7
126
VCCIB1
GDA2/IO55PDB2V0
91
AV5
AV7
127
GND
GDA0/IO54NDB2V0
92
NC
AV8
128
IO55NDB1V0
GDA1/IO54PDB2V0
93
NC
AC8
129
GDA2/IO55PDB1V0
VCCIB2
94
NC
AG8
130
GDA0/IO54NDB1V0
GND
95
NC
AT8
131
GDA1/IO54PDB1V0
VCC
96
NC
ATRTN4
132
GDB0/IO53NDB1V0 GCA0/IO45NDB2V0
97
NC
AT9
133
GDB1/IO53PDB1V0 GCA1/IO45PDB2V0
98
NC
AG9
134
GDC0/IO52NDB1V0 GCB0/IO44NDB2V0
99
NC
AC9
135
GDC1/IO52PDB1V0 GCB1/IO44PDB2V0
100
NC
AV9
136
IO51NSB1V0
101
GNDAQ
GNDAQ
GCC0/IO43NDB2V
0
102
VCC33A
VCC33A
137
VCCIB1
GCC1/IO43PDB2V0
138
GND
IO42NDB2V0
139
VCC
IO42PDB2V0
140
IO50NDB1V0
IO41NDB2V0
141
IO50PDB1V0
GCC2/IO41PDB2V0
142
GCA0/IO49NDB1V0
VCCIB2
143
GCA1/IO49PDB1V0
GND
144
GCB0/IO48NDB1V0
VCC
145
GCB1/IO48PDB1V0
IO40NDB2V0
146
GCC0/IO47NDB1V0 GCB2/IO40PDB2V0
103
ADCGNDREF
ADCGNDREF
104
VAREF
VAREF
105
PUB
PUB
106
VCC33A
VCC33A
107
GNDA
GNDA
108
PTEM
PTEM
109
PTBASE
PTBASE
110
GNDNVM
GNDNVM
Revision 4
4 -9
Package Pin Assignments
PQ208
PQ208
Pin
Number
AFS250 Function
AFS600 Function
Pin
Number
AFS250 Function
AFS600 Function
147
GCC1/IO47PDB1V0
IO39NDB2V0
184
IO18RSB0V0
IO10PPB0V1
148
IO42NDB1V0
GCA2/IO39PDB2V0
185
IO17RSB0V0
IO09PPB0V1
149
GBC2/IO42PDB1V0
IO31NDB2V0
186
IO16RSB0V0
IO10NPB0V1
150
VCCIB1
GBB2/IO31PDB2V0
187
IO15RSB0V0
IO09NPB0V1
151
GND
IO30NDB2V0
188
VCCIB0
IO08PPB0V1
152
VCC
GBA2/IO30PDB2V0
189
GND
IO07PPB0V1
153
IO41NDB1V0
VCCIB2
190
VCC
IO08NPB0V1
154
GBB2/IO41PDB1V0
GNDQ
191
IO14RSB0V0
IO07NPB0V1
155
IO40NDB1V0
VCOMPLB
192
IO13RSB0V0
IO06PPB0V0
156
GBA2/IO40PDB1V0
VCCPLB
193
IO12RSB0V0
IO05PPB0V0
157
GBA1/IO39RSB0V0
VCCIB1
194
IO11RSB0V0
IO06NPB0V0
158
GBA0/IO38RSB0V0
GNDQ
195
IO10RSB0V0
IO04PPB0V0
159
GBB1/IO37RSB0V0 GBB1/IO27PPB1V1
196
IO09RSB0V0
IO05NPB0V0
160
GBB0/IO36RSB0V0 GBA1/IO28PPB1V1
197
IO08RSB0V0
IO04NPB0V0
161
GBC1/IO35RSB0V0 GBB0/IO27NPB1V1
198
IO07RSB0V0
GAC1/IO03PDB0V0
4- 10
162
VCCIB0
GBA0/IO28NPB1V1
199
IO06RSB0V0
GAC0/IO03NDB0V0
163
GND
VCCIB1
200
GAC1/IO05RSB0V0
VCCIB0
164
VCC
GND
201
VCCIB0
GND
165
GBC0/IO34RSB0V0
VCC
202
GND
VCC
166
IO33RSB0V0
GBC1/IO26PDB1V1
203
VCC
GAB1/IO02PDB0V0
167
IO32RSB0V0
GBC0/IO26NDB1V1
204
GAC0/IO04RSB0V0 GAB0/IO02NDB0V0
168
IO31RSB0V0
IO24PPB1V1
205
GAB1/IO03RSB0V0 GAA1/IO01PDB0V0
169
IO30RSB0V0
IO23PPB1V1
206
GAB0/IO02RSB0V0 GAA0/IO01NDB0V0
170
IO29RSB0V0
IO24NPB1V1
207
GAA1/IO01RSB0V0
GNDQ
171
IO28RSB0V0
IO23NPB1V1
208
GAA0/IO00RSB0V0
VCCIB0
172
IO27RSB0V0
IO22PPB1V0
173
IO26RSB0V0
IO21PPB1V0
174
IO25RSB0V0
IO22NPB1V0
175
VCCIB0
IO21NPB1V0
176
GND
IO20PSB1V0
177
VCC
IO19PSB1V0
178
IO24RSB0V0
IO14NSB0V1
179
IO23RSB0V0
IO12PDB0V1
180
IO22RSB0V0
IO12NDB0V1
181
IO21RSB0V0
VCCIB0
182
IO20RSB0V0
GND
183
IO19RSB0V0
VCC
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG256
A1 Ball Pad Corner
16 15 14 13 12 11 10 9
8
7
6 5 4
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Revision 4
4- 11
Package Pin Assignments
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
A1
GND
GND
GND
GND
A2
VCCIB0
VCCIB0
VCCIB0
VCCIB0
A3
GAB0/IO02RSB0V0
GAA0/IO00RSB0V0
GAA0/IO01NDB0V0
GAA0/IO01NDB0V0
A4
GAB1/IO03RSB0V0
GAA1/IO01RSB0V0
GAA1/IO01PDB0V0
GAA1/IO01PDB0V0
A5
GND
GND
GND
GND
A6
IO07RSB0V0
IO11RSB0V0
IO10PDB0V1
IO07PDB0V1
A7
IO10RSB0V0
IO14RSB0V0
IO12PDB0V1
IO13PDB0V2
A8
IO11RSB0V0
IO15RSB0V0
IO12NDB0V1
IO13NDB0V2
A9
IO16RSB0V0
IO24RSB0V0
IO22NDB1V0
IO24NDB1V0
A10
IO17RSB0V0
IO25RSB0V0
IO22PDB1V0
IO24PDB1V0
A11
IO18RSB0V0
IO26RSB0V0
IO24NDB1V1
IO29NDB1V1
A12
GND
GND
GND
GND
A13
GBC0/IO25RSB0V0
GBA0/IO38RSB0V0
GBA0/IO28NDB1V1
GBA0/IO42NDB1V2
A14
GBA0/IO29RSB0V0
IO32RSB0V0
IO29NDB1V1
IO43NDB1V2
A15
VCCIB0
VCCIB0
VCCIB1
VCCIB1
A16
GND
GND
GND
GND
B1
VCOMPLA
VCOMPLA
VCOMPLA
VCOMPLA
B2
VCCPLA
VCCPLA
VCCPLA
VCCPLA
B3
GAA0/IO00RSB0V0
IO07RSB0V0
IO00NDB0V0
IO00NDB0V0
B4
GAA1/IO01RSB0V0
IO06RSB0V0
IO00PDB0V0
IO00PDB0V0
B5
NC
GAB1/IO03RSB0V0
GAB1/IO02PPB0V0
GAB1/IO02PPB0V0
B6
IO06RSB0V0
IO10RSB0V0
IO10NDB0V1
IO07NDB0V1
B7
VCCIB0
VCCIB0
VCCIB0
VCCIB0
B8
IO12RSB0V0
IO16RSB0V0
IO18NDB1V0
IO22NDB1V0
B9
IO13RSB0V0
IO17RSB0V0
IO18PDB1V0
IO22PDB1V0
B10
VCCIB0
VCCIB0
VCCIB1
VCCIB1
B11
IO19RSB0V0
IO27RSB0V0
IO24PDB1V1
IO29PDB1V1
B12
GBB0/IO27RSB0V0
GBC0/IO34RSB0V0
GBC0/IO26NPB1V1
GBC0/IO40NPB1V2
B13
GBC1/IO26RSB0V0
GBA1/IO39RSB0V0
GBA1/IO28PDB1V1
GBA1/IO42PDB1V2
B14
GBA1/IO30RSB0V0
IO33RSB0V0
IO29PDB1V1
IO43PDB1V2
B15
NC
NC
VCCPLB
VCCPLB
B16
NC
NC
VCOMPLB
VCOMPLB
C1
VCCIB3
VCCIB3
VCCIB4
VCCIB4
C2
GND
GND
GND
GND
C3
VCCIB3
VCCIB3
VCCIB4
VCCIB4
C4
NC
NC
VCCIB0
VCCIB0
C5
VCCIB0
VCCIB0
VCCIB0
VCCIB0
C6
GAC1/IO05RSB0V0
GAC1/IO05RSB0V0
GAC1/IO03PDB0V0
GAC1/IO03PDB0V0
4- 12
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
C7
IO09RSB0V0
IO12RSB0V0
IO06NDB0V0
IO09NDB0V1
C8
IO14RSB0V0
IO22RSB0V0
IO16PDB1V0
IO23PDB1V0
C9
IO15RSB0V0
IO23RSB0V0
IO16NDB1V0
IO23NDB1V0
C10
IO22RSB0V0
IO30RSB0V0
IO25NDB1V1
IO31NDB1V1
C11
IO20RSB0V0
IO31RSB0V0
IO25PDB1V1
IO31PDB1V1
C12
VCCIB0
VCCIB0
VCCIB1
VCCIB1
C13
GBB1/IO28RSB0V0
GBC1/IO35RSB0V0
GBC1/IO26PPB1V1
GBC1/IO40PPB1V2
C14
VCCIB1
VCCIB1
VCCIB2
VCCIB2
C15
GND
GND
GND
GND
C16
VCCIB1
VCCIB1
VCCIB2
VCCIB2
D1
GFC2/IO50NPB3V0
IO75NDB3V0
IO84NDB4V0
IO124NDB4V0
D2
GFA2/IO51NDB3V0
GAB2/IO75PDB3V0
GAB2/IO84PDB4V0
GAB2/IO124PDB4V0
D3
GAC2/IO51PDB3V0
IO76NDB3V0
IO85NDB4V0
IO125NDB4V0
D4
GAA2/IO52PDB3V0
GAA2/IO76PDB3V0
GAA2/IO85PDB4V0
GAA2/IO125PDB4V0
D5
GAB2/IO52NDB3V0
GAB0/IO02RSB0V0
GAB0/IO02NPB0V0
GAB0/IO02NPB0V0
D6
GAC0/IO04RSB0V0
GAC0/IO04RSB0V0
GAC0/IO03NDB0V0
GAC0/IO03NDB0V0
D7
IO08RSB0V0
IO13RSB0V0
IO06PDB0V0
IO09PDB0V1
D8
NC
IO20RSB0V0
IO14NDB0V1
IO15NDB0V2
D9
NC
IO21RSB0V0
IO14PDB0V1
IO15PDB0V2
D10
IO21RSB0V0
IO28RSB0V0
IO23PDB1V1
IO37PDB1V2
D11
IO23RSB0V0
GBB0/IO36RSB0V0
GBB0/IO27NDB1V1
GBB0/IO41NDB1V2
D12
NC
NC
VCCIB1
VCCIB1
D13
GBA2/IO31PDB1V0
GBA2/IO40PDB1V0
GBA2/IO30PDB2V0
GBA2/IO44PDB2V0
D14
GBB2/IO31NDB1V0
IO40NDB1V0
IO30NDB2V0
IO44NDB2V0
D15
GBC2/IO32PDB1V0
GBB2/IO41PDB1V0
GBB2/IO31PDB2V0
GBB2/IO45PDB2V0
D16
GCA2/IO32NDB1V0
IO41NDB1V0
IO31NDB2V0
IO45NDB2V0
E1
GND
GND
GND
GND
E2
GFB0/IO48NPB3V0
IO73NDB3V0
IO81NDB4V0
IO118NDB4V0
E3
GFB2/IO50PPB3V0
IO73PDB3V0
IO81PDB4V0
IO118PDB4V0
E4
VCCIB3
VCCIB3
VCCIB4
VCCIB4
E5
NC
IO74NPB3V0
IO83NPB4V0
IO123NPB4V0
E6
NC
IO08RSB0V0
IO04NPB0V0
IO05NPB0V1
E7
GND
GND
GND
GND
E8
NC
IO18RSB0V0
IO08PDB0V1
IO11PDB0V1
E9
NC
NC
IO20NDB1V0
IO27NDB1V1
E10
GND
GND
GND
GND
E11
IO24RSB0V0
GBB1/IO37RSB0V0
GBB1/IO27PDB1V1
GBB1/IO41PDB1V2
E12
NC
IO50PPB1V0
IO33PSB2V0
IO48PSB2V0
Revision 4
4- 13
Package Pin Assignments
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
E13
VCCIB1
VCCIB1
VCCIB2
VCCIB2
E14
GCC2/IO33NDB1V0
IO42NDB1V0
IO32NDB2V0
IO46NDB2V0
E15
GCB2/IO33PDB1V0
GBC2/IO42PDB1V0
GBC2/IO32PDB2V0
GBC2/IO46PDB2V0
E16
GND
GND
GND
GND
F1
NC
NC
IO79NDB4V0
IO111NDB4V0
F2
NC
NC
IO79PDB4V0
IO111PDB4V0
F3
GFB1/IO48PPB3V0
IO72NDB3V0
IO76NDB4V0
IO112NDB4V0
F4
GFC0/IO49NDB3V0
IO72PDB3V0
IO76PDB4V0
IO112PDB4V0
F5
NC
NC
IO82PSB4V0
IO120PSB4V0
F6
GFC1/IO49PDB3V0
GAC2/IO74PPB3V0
GAC2/IO83PPB4V0
GAC2/IO123PPB4V0
F7
NC
IO09RSB0V0
IO04PPB0V0
IO05PPB0V1
F8
NC
IO19RSB0V0
IO08NDB0V1
IO11NDB0V1
F9
NC
NC
IO20PDB1V0
IO27PDB1V1
F10
NC
IO29RSB0V0
IO23NDB1V1
IO37NDB1V2
F11
NC
IO43NDB1V0
IO36NDB2V0
IO50NDB2V0
F12
NC
IO43PDB1V0
IO36PDB2V0
IO50PDB2V0
F13
NC
IO44NDB1V0
IO39NDB2V0
IO59NDB2V0
F14
NC
GCA2/IO44PDB1V0
GCA2/IO39PDB2V0
GCA2/IO59PDB2V0
F15
GCC1/IO34PDB1V0
GCB2/IO45PDB1V0
GCB2/IO40PDB2V0
GCB2/IO60PDB2V0
F16
GCC0/IO34NDB1V0
IO45NDB1V0
IO40NDB2V0
IO60NDB2V0
G1
GEC0/IO46NPB3V0
IO70NPB3V0
IO74NPB4V0
IO109NPB4V0
G2
VCCIB3
VCCIB3
VCCIB4
VCCIB4
G3
GEC1/IO46PPB3V0
GFB2/IO70PPB3V0
GFB2/IO74PPB4V0
GFB2/IO109PPB4V0
G4
GFA1/IO47PDB3V0
GFA2/IO71PDB3V0
GFA2/IO75PDB4V0
GFA2/IO110PDB4V0
G5
GND
GND
GND
GND
G6
GFA0/IO47NDB3V0
IO71NDB3V0
IO75NDB4V0
IO110NDB4V0
G7
GND
GND
GND
GND
G8
VCC
VCC
VCC
VCC
G9
GND
GND
GND
GND
G10
VCC
VCC
VCC
VCC
G11
GDA1/IO37NDB1V0
GCC0/IO47NDB1V0
GCC0/IO43NDB2V0
GCC0/IO62NDB2V0
G12
GND
GND
GND
GND
G13
IO37PDB1V0
GCC1/IO47PDB1V0
GCC1/IO43PDB2V0
GCC1/IO62PDB2V0
G14
GCB0/IO35NPB1V0
IO46NPB1V0
IO41NPB2V0
IO61NPB2V0
G15
VCCIB1
VCCIB1
VCCIB2
VCCIB2
G16
GCB1/IO35PPB1V0
GCC2/IO46PPB1V0
GCC2/IO41PPB2V0
GCC2/IO61PPB2V0
H1
GEB1/IO45PDB3V0
GFC2/IO69PDB3V0
GFC2/IO73PDB4V0
GFC2/IO108PDB4V0
H2
GEB0/IO45NDB3V0
IO69NDB3V0
IO73NDB4V0
IO108NDB4V0
4- 14
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
H3
XTAL2
XTAL2
XTAL2
XTAL2
H4
XTAL1
XTAL1
XTAL1
XTAL1
H5
GNDOSC
GNDOSC
GNDOSC
GNDOSC
H6
VCCOSC
VCCOSC
VCCOSC
VCCOSC
H7
VCC
VCC
VCC
VCC
H8
GND
GND
GND
GND
H9
VCC
VCC
VCC
VCC
H10
GND
GND
GND
GND
H11
GDC0/IO38NDB1V0
IO51NDB1V0
IO47NDB2V0
IO69NDB2V0
H12
GDC1/IO38PDB1V0
IO51PDB1V0
IO47PDB2V0
IO69PDB2V0
H13
GDB1/IO39PDB1V0
GCA1/IO49PDB1V0
GCA1/IO45PDB2V0
GCA1/IO64PDB2V0
H14
GDB0/IO39NDB1V0
GCA0/IO49NDB1V0
GCA0/IO45NDB2V0
GCA0/IO64NDB2V0
H15
GCA0/IO36NDB1V0
GCB0/IO48NDB1V0
GCB0/IO44NDB2V0
GCB0/IO63NDB2V0
H16
GCA1/IO36PDB1V0
GCB1/IO48PDB1V0
GCB1/IO44PDB2V0
GCB1/IO63PDB2V0
J1
GEA0/IO44NDB3V0
GFA0/IO66NDB3V0
GFA0/IO70NDB4V0
GFA0/IO105NDB4V0
J2
GEA1/IO44PDB3V0
GFA1/IO66PDB3V0
GFA1/IO70PDB4V0
GFA1/IO105PDB4V0
J3
IO43NDB3V0
GFB0/IO67NDB3V0
GFB0/IO71NDB4V0
GFB0/IO106NDB4V0
J4
GEC2/IO43PDB3V0
GFB1/IO67PDB3V0
GFB1/IO71PDB4V0
GFB1/IO106PDB4V0
J5
NC
GFC0/IO68NDB3V0
GFC0/IO72NDB4V0
GFC0/IO107NDB4V0
J6
NC
GFC1/IO68PDB3V0
GFC1/IO72PDB4V0
GFC1/IO107PDB4V0
J7
GND
GND
GND
GND
J8
VCC
VCC
VCC
VCC
J9
GND
GND
GND
GND
J10
VCC
VCC
VCC
VCC
J11
GDC2/IO41NPB1V0
IO56NPB1V0
IO56NPB2V0
IO83NPB2V0
J12
NC
GDB0/IO53NPB1V0
GDB0/IO53NPB2V0
GDB0/IO80NPB2V0
J13
NC
GDA1/IO54PDB1V0
GDA1/IO54PDB2V0
GDA1/IO81PDB2V0
J14
GDA0/IO40PDB1V0
GDC1/IO52PPB1V0
GDC1/IO52PPB2V0
GDC1/IO79PPB2V0
J15
NC
IO50NPB1V0
IO51NSB2V0
IO77NSB2V0
J16
GDA2/IO40NDB1V0
GDC0/IO52NPB1V0
GDC0/IO52NPB2V0
GDC0/IO79NPB2V0
K1
NC
IO65NPB3V0
IO67NPB4V0
IO92NPB4V0
K2
VCCIB3
VCCIB3
VCCIB4
VCCIB4
K3
NC
IO65PPB3V0
IO67PPB4V0
IO92PPB4V0
K4
NC
IO64PDB3V0
IO65PDB4V0
IO96PDB4V0
K5
GND
GND
GND
GND
K6
NC
IO64NDB3V0
IO65NDB4V0
IO96NDB4V0
K7
VCC
VCC
VCC
VCC
K8
GND
GND
GND
GND
Revision 4
4- 15
Package Pin Assignments
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
K9
VCC
VCC
VCC
VCC
K10
GND
GND
GND
GND
K11
NC
GDC2/IO57PPB1V0
GDC2/IO57PPB2V0
GDC2/IO84PPB2V0
K12
GND
GND
GND
GND
K13
NC
GDA0/IO54NDB1V0
GDA0/IO54NDB2V0
GDA0/IO81NDB2V0
K14
NC
GDA2/IO55PPB1V0
GDA2/IO55PPB2V0
GDA2/IO82PPB2V0
K15
VCCIB1
VCCIB1
VCCIB2
VCCIB2
K16
NC
GDB1/IO53PPB1V0
GDB1/IO53PPB2V0
GDB1/IO80PPB2V0
L1
NC
GEC1/IO63PDB3V0
GEC1/IO63PDB4V0
GEC1/IO90PDB4V0
L2
NC
GEC0/IO63NDB3V0
GEC0/IO63NDB4V0
GEC0/IO90NDB4V0
L3
NC
GEB1/IO62PDB3V0
GEB1/IO62PDB4V0
GEB1/IO89PDB4V0
L4
NC
GEB0/IO62NDB3V0
GEB0/IO62NDB4V0
GEB0/IO89NDB4V0
L5
NC
IO60NDB3V0
IO60NDB4V0
IO87NDB4V0
L6
NC
GEC2/IO60PDB3V0
GEC2/IO60PDB4V0
GEC2/IO87PDB4V0
L7
GNDA
GNDA
GNDA
GNDA
L8
AC0
AC0
AC2
AC2
L9
AV2
AV2
AV4
AV4
L10
AC3
AC3
AC5
AC5
L11
PTEM
PTEM
PTEM
PTEM
L12
TDO
TDO
TDO
TDO
L13
VJTAG
VJTAG
VJTAG
VJTAG
L14
NC
IO57NPB1V0
IO57NPB2V0
IO84NPB2V0
L15
GDB2/IO41PPB1V0
GDB2/IO56PPB1V0
GDB2/IO56PPB2V0
GDB2/IO83PPB2V0
L16
NC
IO55NPB1V0
IO55NPB2V0
IO82NPB2V0
M1
GND
GND
GND
GND
M2
NC
GEA1/IO61PDB3V0
GEA1/IO61PDB4V0
GEA1/IO88PDB4V0
M3
NC
GEA0/IO61NDB3V0
GEA0/IO61NDB4V0
GEA0/IO88NDB4V0
M4
VCCIB3
VCCIB3
VCCIB4
VCCIB4
M5
NC
IO58NPB3V0
IO58NPB4V0
IO85NPB4V0
M6
NC
NC
AV0
AV0
M7
NC
NC
AC1
AC1
M8
AG1
AG1
AG3
AG3
M9
AC2
AC2
AC4
AC4
M10
AC4
AC4
AC6
AC6
M11
NC
AG5
AG7
AG7
M12
VPUMP
VPUMP
VPUMP
VPUMP
M13
VCCIB1
VCCIB1
VCCIB2
VCCIB2
M14
TMS
TMS
TMS
TMS
4- 16
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
M15
TRST
TRST
TRST
TRST
M16
GND
GND
GND
GND
N1
GEB2/IO42PDB3V0
GEB2/IO59PDB3V0
GEB2/IO59PDB4V0
GEB2/IO86PDB4V0
N2
GEA2/IO42NDB3V0
IO59NDB3V0
IO59NDB4V0
IO86NDB4V0
N3
NC
GEA2/IO58PPB3V0
GEA2/IO58PPB4V0
GEA2/IO85PPB4V0
N4
VCC33PMP
VCC33PMP
VCC33PMP
VCC33PMP
N5
VCC15A
VCC15A
VCC15A
VCC15A
N6
NC
NC
AG0
AG0
N7
AC1
AC1
AC3
AC3
N8
AG3
AG3
AG5
AG5
N9
AV3
AV3
AV5
AV5
N10
AG4
AG4
AG6
AG6
N11
NC
NC
AC8
AC8
N12
GNDA
GNDA
GNDA
GNDA
N13
VCC33A
VCC33A
VCC33A
VCC33A
N14
VCCNVM
VCCNVM
VCCNVM
VCCNVM
N15
TCK
TCK
TCK
TCK
N16
TDI
TDI
TDI
TDI
P1
VCCNVM
VCCNVM
VCCNVM
VCCNVM
P2
GNDNVM
GNDNVM
GNDNVM
GNDNVM
P3
GNDA
GNDA
GNDA
GNDA
P4
NC
NC
AC0
AC0
P5
NC
NC
AG1
AG1
P6
NC
NC
AV1
AV1
P7
AG0
AG0
AG2
AG2
P8
AG2
AG2
AG4
AG4
P9
GNDA
GNDA
GNDA
GNDA
P10
NC
AC5
AC7
AC7
P11
NC
NC
AV8
AV8
P12
NC
NC
AG8
AG8
P13
NC
NC
AV9
AV9
P14
ADCGNDREF
ADCGNDREF
ADCGNDREF
ADCGNDREF
P15
PTBASE
PTBASE
PTBASE
PTBASE
P16
GNDNVM
GNDNVM
GNDNVM
GNDNVM
R1
VCCIB3
VCCIB3
VCCIB4
VCCIB4
R2
PCAP
PCAP
PCAP
PCAP
R3
NC
NC
AT1
AT1
R4
NC
NC
AT0
AT0
Revision 4
4- 17
Package Pin Assignments
FG256
Pin Number
AFS090 Function
AFS250 Function
AFS600 Function
AFS1500 Function
R5
AV0
AV0
AV2
AV2
R6
AT0
AT0
AT2
AT2
R7
AV1
AV1
AV3
AV3
R8
AT3
AT3
AT5
AT5
R9
AV4
AV4
AV6
AV6
R10
NC
AT5
AT7
AT7
R11
NC
AV5
AV7
AV7
R12
NC
NC
AT9
AT9
R13
NC
NC
AG9
AG9
R14
NC
NC
AC9
AC9
R15
PUB
PUB
PUB
PUB
R16
VCCIB1
VCCIB1
VCCIB2
VCCIB2
T1
GND
GND
GND
GND
T2
NCAP
NCAP
NCAP
NCAP
T3
VCC33N
VCC33N
VCC33N
VCC33N
T4
NC
NC
ATRTN0
ATRTN0
T5
AT1
AT1
AT3
AT3
T6
ATRTN0
ATRTN0
ATRTN1
ATRTN1
T7
AT2
AT2
AT4
AT4
T8
ATRTN1
ATRTN1
ATRTN2
ATRTN2
T9
AT4
AT4
AT6
AT6
T10
ATRTN2
ATRTN2
ATRTN3
ATRTN3
T11
NC
NC
AT8
AT8
T12
NC
NC
ATRTN4
ATRTN4
T13
GNDA
GNDA
GNDA
GNDA
T14
VCC33A
VCC33A
VCC33A
VCC33A
T15
VAREF
VAREF
VAREF
VAREF
T16
GND
GND
GND
GND
4- 18
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG484
A1 Ball Pad Corner
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Revision 4
4- 19
Package Pin Assignments
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
A1
GND
GND
AA14
AG7
AG7
A2
VCC
NC
AA15
AG8
AG8
A3
GAA1/IO01PDB0V0
GAA1/IO01PDB0V0
AA16
GNDA
GNDA
A4
GAB0/IO02NDB0V0
GAB0/IO02NDB0V0
AA17
AG9
AG9
A5
GAB1/IO02PDB0V0
GAB1/IO02PDB0V0
AA18
VAREF
VAREF
A6
IO07NDB0V1
IO07NDB0V1
AA19
VCCIB2
VCCIB2
A7
IO07PDB0V1
IO07PDB0V1
AA20
PTEM
PTEM
A8
IO10PDB0V1
IO09PDB0V1
AA21
GND
GND
A9
IO14NDB0V1
IO13NDB0V2
AA22
VCC
NC
A10
IO14PDB0V1
IO13PDB0V2
AB1
GND
GND
A11
IO17PDB1V0
IO24PDB1V0
AB2
VCC
NC
A12
IO18PDB1V0
IO26PDB1V0
AB3
NC
IO94NSB4V0
A13
IO19NDB1V0
IO27NDB1V1
AB4
GND
GND
A14
IO19PDB1V0
IO27PDB1V1
AB5
VCC33N
VCC33N
A15
IO24NDB1V1
IO35NDB1V2
AB6
AT0
AT0
A16
IO24PDB1V1
IO35PDB1V2
AB7
ATRTN0
ATRTN0
A17
GBC0/IO26NDB1V1
GBC0/IO40NDB1V2
AB8
AT1
AT1
A18
GBA0/IO28NDB1V1
GBA0/IO42NDB1V2
AB9
AT2
AT2
A19
IO29NDB1V1
IO43NDB1V2
AB10
ATRTN1
ATRTN1
A20
IO29PDB1V1
IO43PDB1V2
AB11
AT3
AT3
A21
VCC
NC
AB12
AT6
AT6
A22
GND
GND
AB13
ATRTN3
ATRTN3
AA1
VCC
NC
AB14
AT7
AT7
AA2
GND
GND
AB15
AT8
AT8
AA3
VCCIB4
VCCIB4
AB16
ATRTN4
ATRTN4
AA4
VCCIB4
VCCIB4
AB17
AT9
AT9
AA5
PCAP
PCAP
AB18
VCC33A
VCC33A
AA6
AG0
AG0
AB19
GND
GND
AA7
GNDA
GNDA
AB20
NC
IO76NPB2V0
AA8
AG1
AG1
AB21
VCC
NC
AA9
AG2
AG2
AB22
GND
GND
AA10
GNDA
GNDA
B1
VCC
NC
AA11
AG3
AG3
B2
GND
GND
AA12
AG6
AG6
B3
GAA0/IO01NDB0V0
GAA0/IO01NDB0V0
AA13
GNDA
GNDA
B4
GND
GND
4- 20
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
B5
IO05NDB0V0
IO04NDB0V0
C18
VCCIB1
VCCIB1
B6
IO05PDB0V0
IO04PDB0V0
C19
VCOMPLB
VCOMPLB
B7
GND
GND
C20
GBA2/IO30PDB2V0
GBA2/IO44PDB2V0
B8
IO10NDB0V1
IO09NDB0V1
C21
NC
IO48PSB2V0
B9
IO13PDB0V1
IO11PDB0V1
C22
GBB2/IO31PDB2V0
GBB2/IO45PDB2V0
B10
GND
GND
D1
IO82NDB4V0
IO121NDB4V0
B11
IO17NDB1V0
IO24NDB1V0
D2
GND
GND
B12
IO18NDB1V0
IO26NDB1V0
D3
IO83NDB4V0
IO123NDB4V0
B13
GND
GND
D4
GAC2/IO83PDB4V0 GAC2/IO123PDB4V0
B14
IO21NDB1V0
IO31NDB1V1
D5
GAA2/IO85PDB4V0 GAA2/IO125PDB4V0
B15
IO21PDB1V0
IO31PDB1V1
D6
GAC0/IO03NDB0V0
GAC0/IO03NDB0V0
B16
GND
GND
D7
GAC1/IO03PDB0V0
GAC1/IO03PDB0V0
B17
GBC1/IO26PDB1V1
GBC1/IO40PDB1V2
D8
IO09NDB0V1
IO10NDB0V1
B18
GBA1/IO28PDB1V1
GBA1/IO42PDB1V2
D9
IO09PDB0V1
IO10PDB0V1
B19
GND
GND
D10
IO11NDB0V1
IO14NDB0V2
B20
VCCPLB
VCCPLB
D11
IO16NDB1V0
IO23NDB1V0
B21
GND
GND
D12
IO16PDB1V0
IO23PDB1V0
B22
VCC
NC
D13
NC
IO32NPB1V1
C1
IO82PDB4V0
IO121PDB4V0
D14
IO23NDB1V1
IO34NDB1V1
C2
NC
IO122PSB4V0
D15
IO23PDB1V1
IO34PDB1V1
C3
IO00NDB0V0
IO00NDB0V0
D16
IO25PDB1V1
IO37PDB1V2
C4
IO00PDB0V0
IO00PDB0V0
D17
GBB1/IO27PDB1V1
GBB1/IO41PDB1V2
C5
VCCIB0
VCCIB0
D18
VCCIB2
VCCIB2
C6
IO06NDB0V0
IO05NDB0V1
D19
NC
IO47PPB2V0
C7
IO06PDB0V0
IO05PDB0V1
D20
IO30NDB2V0
IO44NDB2V0
C8
VCCIB0
VCCIB0
D21
GND
GND
C9
IO13NDB0V1
IO11NDB0V1
D22
IO31NDB2V0
IO45NDB2V0
C10
IO11PDB0V1
IO14PDB0V2
E1
IO81NDB4V0
IO120NDB4V0
C11
VCCIB0
VCCIB0
E2
IO81PDB4V0
IO120PDB4V0
C12
VCCIB1
VCCIB1
E3
VCCIB4
VCCIB4
C13
IO20NDB1V0
IO29NDB1V1
E4
C14
IO20PDB1V0
IO29PDB1V1
E5
IO85NDB4V0
IO125NDB4V0
C15
VCCIB1
VCCIB1
E6
GND
GND
C16
IO25NDB1V1
IO37NDB1V2
E7
VCCIB0
VCCIB0
C17
GBB0/IO27NDB1V1
GBB0/IO41NDB1V2
E8
NC
IO08NDB0V1
Revision 4
GAB2/IO84PDB4V0 GAB2/IO124PDB4V0
4- 21
Package Pin Assignments
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
E9
NC
IO08PDB0V1
F22
IO35PDB2V0
IO51PDB2V0
E10
GND
GND
G1
IO77PDB4V0
IO115PDB4V0
E11
IO15NDB1V0
IO22NDB1V0
G2
GND
GND
E12
IO15PDB1V0
IO22PDB1V0
G3
IO78NDB4V0
IO116NDB4V0
E13
GND
GND
G4
IO78PDB4V0
IO116PDB4V0
E14
NC
IO32PPB1V1
G5
VCCIB4
VCCIB4
E15
NC
IO36NPB1V2
G6
NC
IO117PDB4V0
E16
VCCIB1
VCCIB1
G7
VCCIB4
VCCIB4
E17
GND
GND
G8
GND
GND
E18
NC
IO47NPB2V0
G9
IO04NDB0V0
IO06NDB0V1
E19
IO33PDB2V0
IO49PDB2V0
G10
IO04PDB0V0
IO06PDB0V1
E20
VCCIB2
VCCIB2
G11
IO12NDB0V1
IO16NDB0V2
E21
IO32NDB2V0
IO46NDB2V0
G12
IO12PDB0V1
IO16PDB0V2
E22
GBC2/IO32PDB2V0
GBC2/IO46PDB2V0
G13
NC
IO28NDB1V1
F1
IO80NDB4V0
IO118NDB4V0
G14
NC
IO28PDB1V1
F2
IO80PDB4V0
IO118PDB4V0
G15
GND
GND
F3
NC
IO119NSB4V0
G16
NC
IO38PPB1V2
F4
IO84NDB4V0
IO124NDB4V0
G17
NC
IO53PDB2V0
F5
GND
GND
G18
VCCIB2
VCCIB2
F6
VCOMPLA
VCOMPLA
G19
IO36PDB2V0
IO52PDB2V0
F7
VCCPLA
VCCPLA
G20
IO36NDB2V0
IO52NDB2V0
F8
VCCIB0
VCCIB0
G21
GND
GND
F9
IO08NDB0V1
IO12NDB0V1
G22
IO35NDB2V0
IO51NDB2V0
F10
IO08PDB0V1
IO12PDB0V1
H1
IO77NDB4V0
IO115NDB4V0
F11
VCCIB0
VCCIB0
H2
IO76PDB4V0
IO113PDB4V0
F12
VCCIB1
VCCIB1
H3
VCCIB4
VCCIB4
F13
IO22NDB1V0
IO30NDB1V1
H4
IO79NDB4V0
IO114NDB4V0
F14
IO22PDB1V0
IO30PDB1V1
H5
IO79PDB4V0
IO114PDB4V0
F15
VCCIB1
VCCIB1
H6
NC
IO117NDB4V0
F16
NC
IO36PPB1V2
H7
GND
GND
F17
NC
IO38NPB1V2
H8
VCC
VCC
F18
GND
GND
H9
VCCIB0
VCCIB0
F19
IO33NDB2V0
IO49NDB2V0
H10
GND
GND
F20
IO34PDB2V0
IO50PDB2V0
H11
VCCIB0
VCCIB0
F21
IO34NDB2V0
IO50NDB2V0
H12
VCCIB1
VCCIB1
4- 22
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
H13
GND
GND
K4
IO75NDB4V0
IO110NDB4V0
H14
VCCIB1
VCCIB1
K5
GND
GND
H15
GND
GND
K6
NC
IO104NDB4V0
H16
GND
GND
K7
NC
IO111NDB4V0
H17
NC
IO53NDB2V0
K8
GND
GND
H18
IO38PDB2V0
IO57PDB2V0
K9
VCC
VCC
H19
GCA2/IO39PDB2V0
GCA2/IO59PDB2V0
K10
GND
GND
H20
VCCIB2
VCCIB2
K11
VCC
VCC
H21
IO37NDB2V0
IO54NDB2V0
K12
GND
GND
H22
IO37PDB2V0
IO54PDB2V0
K13
VCC
VCC
J1
NC
IO112PPB4V0
K14
GND
GND
J2
IO76NDB4V0
IO113NDB4V0
K15
GND
GND
J3
GFB2/IO74PDB4V0 GFB2/IO109PDB4V0
K16
IO40NDB2V0
IO60NDB2V0
J4
GFA2/IO75PDB4V0
GFA2/IO110PDB4V0
K17
NC
IO58PDB2V0
J5
NC
IO112NPB4V0
K18
GND
GND
J6
NC
IO104PDB4V0
K19
NC
IO68NPB2V0
J7
NC
IO111PDB4V0
K20
IO41NDB2V0
IO61NDB2V0
J8
VCCIB4
VCCIB4
K21
GND
GND
J9
GND
GND
K22
IO42NDB2V0
IO56NDB2V0
J10
VCC
VCC
L1
IO73NDB4V0
IO108NDB4V0
J11
GND
GND
L2
VCCOSC
VCCOSC
J12
VCC
VCC
L3
VCCIB4
VCCIB4
J13
GND
GND
L4
XTAL2
XTAL2
J14
VCC
VCC
L5
J15
VCCIB2
VCCIB2
L6
J16
GCB2/IO40PDB2V0
GCB2/IO60PDB2V0
L7
J17
NC
IO58NDB2V0
L8
VCCIB4
VCCIB4
J18
IO38NDB2V0
IO57NDB2V0
L9
GND
GND
J19
IO39NDB2V0
IO59NDB2V0
L10
VCC
VCC
J20
GCC2/IO41PDB2V0
GCC2/IO61PDB2V0
L11
GND
GND
J21
NC
IO55PSB2V0
L12
VCC
VCC
J22
IO42PDB2V0
IO56PDB2V0
L13
GND
GND
L14
VCC
VCC
K1
GFC2/IO73PDB4V0 GFC2/IO108PDB4V0
GFC1/IO72PDB4V0 GFC1/IO107PDB4V0
VCCIB4
VCCIB4
GFB1/IO71PDB4V0 GFB1/IO106PDB4V0
K2
GND
GND
L15
VCCIB2
VCCIB2
K3
IO74NDB4V0
IO109NDB4V0
L16
IO48PDB2V0
IO70PDB2V0
Revision 4
4- 23
Package Pin Assignments
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
L17
VCCIB2
VCCIB2
N8
GND
GND
L18
IO46PDB2V0
IO69PDB2V0
N9
GND
GND
L19
GCA1/IO45PDB2V0
GCA1/IO64PDB2V0
N10
VCC
VCC
L20
VCCIB2
VCCIB2
N11
GND
GND
L21
GCC0/IO43NDB2V0
GCC0/IO62NDB2V0
N12
VCC
VCC
L22
GCC1/IO43PDB2V0
GCC1/IO62PDB2V0
N13
GND
GND
M1
NC
IO103PDB4V0
N14
VCC
VCC
M2
XTAL1
XTAL1
N15
GND
GND
M3
VCCIB4
VCCIB4
N16
GDB2/IO56PDB2V0
GDB2/IO83PDB2V0
M4
GNDOSC
GNDOSC
N17
NC
IO78PDB2V0
N18
GND
GND
N19
IO47NDB2V0
IO72NDB2V0
N20
IO47PDB2V0
IO72PDB2V0
M5
M6
M7
GFC0/IO72NDB4V0 GFC0/IO107NDB4V0
VCCIB4
VCCIB4
GFB0/IO71NDB4V0 GFB0/IO106NDB4V0
M8
VCCIB4
VCCIB4
N21
GND
GND
M9
VCC
VCC
N22
IO49PDB2V0
IO71PDB2V0
M10
GND
GND
P1
GFA1/IO70PDB4V0
GFA1/IO105PDB4V0
M11
VCC
VCC
P2
GFA0/IO70NDB4V0 GFA0/IO105NDB4V0
M12
GND
GND
P3
IO68NDB4V0
IO101NDB4V0
M13
VCC
VCC
P4
IO65PDB4V0
IO96PDB4V0
M14
GND
GND
P5
IO65NDB4V0
IO96NDB4V0
M15
VCCIB2
VCCIB2
P6
NC
IO99NDB4V0
M16
IO48NDB2V0
IO70NDB2V0
P7
NC
IO97NDB4V0
M17
VCCIB2
VCCIB2
P8
VCCIB4
VCCIB4
M18
IO46NDB2V0
IO69NDB2V0
P9
VCC
VCC
M19
GCA0/IO45NDB2V0
GCA0/IO64NDB2V0
P10
GND
GND
M20
VCCIB2
VCCIB2
P11
VCC
VCC
M21
GCB0/IO44NDB2V0
GCB0/IO63NDB2V0
P12
GND
GND
M22
GCB1/IO44PDB2V0
GCB1/IO63PDB2V0
P13
VCC
VCC
N1
NC
IO103NDB4V0
P14
GND
GND
N2
GND
GND
P15
VCCIB2
VCCIB2
N3
IO68PDB4V0
IO101PDB4V0
P16
IO56NDB2V0
IO83NDB2V0
N4
NC
IO100NPB4V0
P17
NC
IO78NDB2V0
N5
GND
GND
P18
GDA1/IO54PDB2V0
GDA1/IO81PDB2V0
N6
NC
IO99PDB4V0
P19
GDB1/IO53PDB2V0
GDB1/IO80PDB2V0
N7
NC
IO97PDB4V0
P20
IO51NDB2V0
IO73NDB2V0
4- 24
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
P21
IO51PDB2V0
IO73PDB2V0
T12
AV5
AV5
P22
IO49NDB2V0
IO71NDB2V0
T13
AC5
AC5
R1
IO69PDB4V0
IO102PDB4V0
T14
NC
NC
R2
IO69NDB4V0
IO102NDB4V0
T15
GNDA
GNDA
R3
VCCIB4
VCCIB4
T16
NC
IO77PPB2V0
R4
IO64PDB4V0
IO91PDB4V0
T17
NC
IO74PDB2V0
R5
IO64NDB4V0
IO91NDB4V0
T18
VCCIB2
VCCIB2
R6
NC
IO92PDB4V0
T19
IO55NDB2V0
IO82NDB2V0
R7
GND
GND
T20
GDA2/IO55PDB2V0
GDA2/IO82PDB2V0
R8
GND
GND
T21
GND
GND
R9
VCC33A
VCC33A
T22
GDC1/IO52PDB2V0
GDC1/IO79PDB2V0
R10
GNDA
GNDA
U1
IO67PDB4V0
IO98PDB4V0
R11
VCC33A
VCC33A
U2
IO67NDB4V0
IO98NDB4V0
R12
GNDA
GNDA
U3
GEC1/IO63PDB4V0
GEC1/IO90PDB4V0
R13
VCC33A
VCC33A
U4
GEC0/IO63NDB4V0
GEC0/IO90NDB4V0
R14
GNDA
GNDA
U5
GND
GND
R15
VCC
VCC
U6
VCCNVM
VCCNVM
R16
GND
GND
U7
VCCIB4
VCCIB4
R17
NC
IO74NDB2V0
U8
VCC15A
VCC15A
R18
GDA0/IO54NDB2V0
GDA0/IO81NDB2V0
U9
GNDA
GNDA
R19
GDB0/IO53NDB2V0
GDB0/IO80NDB2V0
U10
AC4
AC4
R20
VCCIB2
VCCIB2
U11
VCC33A
VCC33A
R21
IO50NDB2V0
IO75NDB2V0
U12
GNDA
GNDA
R22
IO50PDB2V0
IO75PDB2V0
U13
AG5
AG5
T1
NC
IO100PPB4V0
U14
GNDA
GNDA
T2
GND
GND
U15
PUB
PUB
T3
IO66PDB4V0
IO95PDB4V0
U16
VCCIB2
VCCIB2
T4
IO66NDB4V0
IO95NDB4V0
U17
TDI
TDI
T5
VCCIB4
VCCIB4
U18
GND
GND
T6
NC
IO92NDB4V0
U19
IO57NDB2V0
IO84NDB2V0
T7
GNDNVM
GNDNVM
U20
GDC2/IO57PDB2V0
GDC2/IO84PDB2V0
T8
GNDA
GNDA
U21
NC
IO77NPB2V0
T9
NC
NC
U22
GDC0/IO52NDB2V0
GDC0/IO79NDB2V0
T10
AV4
AV4
V1
GEB1/IO62PDB4V0
GEB1/IO89PDB4V0
T11
NC
NC
V2
GEB0/IO62NDB4V0
GEB0/IO89NDB4V0
Revision 4
4- 25
Package Pin Assignments
FG484
FG484
Pin
Number
AFS600 Function
AFS1500 Function
Pin
Number
AFS600 Function
AFS1500 Function
V3
VCCIB4
VCCIB4
W16
GNDA
GNDA
V4
GEA1/IO61PDB4V0
GEA1/IO88PDB4V0
W17
AV9
AV9
V5
GEA0/IO61NDB4V0
GEA0/IO88NDB4V0
W18
VCCIB2
VCCIB2
V6
GND
GND
W19
NC
IO68PPB2V0
V7
VCC33PMP
VCC33PMP
W20
TCK
TCK
V8
NC
NC
W21
GND
GND
V9
VCC33A
VCC33A
W22
NC
IO76PPB2V0
V10
AG4
AG4
Y1
GEC2/IO60PDB4V0
GEC2/IO87PDB4V0
V11
AT4
AT4
Y2
IO60NDB4V0
IO87NDB4V0
V12
ATRTN2
ATRTN2
Y3
GEA2/IO58PDB4V0
GEA2/IO85PDB4V0
V13
AT5
AT5
Y4
IO58NDB4V0
IO85NDB4V0
V14
VCC33A
VCC33A
Y5
NCAP
NCAP
V15
NC
NC
Y6
AC0
AC0
V16
VCC33A
VCC33A
Y7
VCC33A
VCC33A
V17
GND
GND
Y8
AC1
AC1
V18
TMS
TMS
Y9
AC2
AC2
V19
VJTAG
VJTAG
Y10
VCC33A
VCC33A
V20
VCCIB2
VCCIB2
Y11
AC3
AC3
V21
TRST
TRST
Y12
AC6
AC6
V22
TDO
TDO
Y13
VCC33A
VCC33A
W1
NC
IO93PDB4V0
Y14
AC7
AC7
W2
GND
GND
Y15
AC8
AC8
W3
NC
IO93NDB4V0
Y16
VCC33A
VCC33A
W4
GEB2/IO59PDB4V0
GEB2/IO86PDB4V0
Y17
AC9
AC9
W5
IO59NDB4V0
IO86NDB4V0
Y18
ADCGNDREF
ADCGNDREF
W6
AV0
AV0
Y19
PTBASE
PTBASE
W7
GNDA
GNDA
Y20
GNDNVM
GNDNVM
W8
AV1
AV1
Y21
VCCNVM
VCCNVM
W9
AV2
AV2
Y22
VPUMP
VPUMP
W10
GNDA
GNDA
W11
AV3
AV3
W12
AV6
AV6
W13
GNDA
GNDA
W14
AV7
AV7
W15
AV8
AV8
4- 26
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG676
A1 Ball Pad Corner
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8
7 6
5 4
3
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Revision 4
4- 27
Package Pin Assignments
FG676
FG676
FG676
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
A1
NC
AA11
AV2
AB21
PTBASE
A2
GND
AA12
GNDA
AB22
GNDNVM
A3
NC
AA13
AV3
AB23
VCCNVM
A4
NC
AA14
AV6
AB24
VPUMP
A5
GND
AA15
GNDA
AB25
NC
A6
NC
AA16
AV7
AB26
GND
A7
NC
AA17
AV8
AC1
NC
A8
GND
AA18
GNDA
AC2
NC
A9
IO17NDB0V2
AA19
AV9
AC3
NC
A10
IO17PDB0V2
AA20
VCCIB2
AC4
GND
A11
GND
AA21
IO68PPB2V0
AC5
VCCIB4
A12
IO18NDB0V2
AA22
TCK
AC6
VCCIB4
A13
IO18PDB0V2
AA23
GND
AC7
PCAP
A14
IO20NDB0V2
AA24
IO76PPB2V0
AC8
AG0
A15
IO20PDB0V2
AA25
VCCIB2
AC9
GNDA
A16
GND
AA26
NC
AC10
AG1
A17
IO21PDB0V2
AB1
GND
AC11
AG2
A18
IO21NDB0V2
AB2
NC
AC12
GNDA
A19
GND
AB3
GEC2/IO87PDB4V0
AC13
AG3
A20
IO39NDB1V2
AB4
IO87NDB4V0
AC14
AG6
A21
IO39PDB1V2
AB5
GEA2/IO85PDB4V0
AC15
GNDA
A22
GND
AB6
IO85NDB4V0
AC16
AG7
A23
NC
AB7
NCAP
AC17
AG8
A24
NC
AB8
AC0
AC18
GNDA
A25
GND
AB9
VCC33A
AC19
AG9
A26
NC
AB10
AC1
AC20
VAREF
AA1
NC
AB11
AC2
AC21
VCCIB2
AA2
VCCIB4
AB12
VCC33A
AC22
PTEM
AA3
IO93PDB4V0
AB13
AC3
AC23
GND
AA4
GND
AB14
AC6
AC24
NC
AA5
IO93NDB4V0
AB15
VCC33A
AC25
NC
AA6
GEB2/IO86PDB4V0
AB16
AC7
AC26
NC
AA7
IO86NDB4V0
AB17
AC8
AD1
NC
AA8
AV0
AB18
VCC33A
AD2
NC
AA9
GNDA
AB19
AC9
AD3
GND
AA10
AV1
AB20
ADCGNDREF
AD4
NC
4- 28
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG676
FG676
FG676
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
AD5
IO94NPB4V0
AE15
GNDA
AF25
GND
AD6
GND
AE16
NC
AF26
NC
AD7
VCC33N
AE17
NC
B1
GND
AD8
AT0
AE18
GNDA
B2
GND
AD9
ATRTN0
AE19
NC
B3
NC
AD10
AT1
AE20
NC
B4
NC
AD11
AT2
AE21
NC
B5
NC
AD12
ATRTN1
AE22
NC
B6
VCCIB0
AD13
AT3
AE23
NC
B7
NC
AD14
AT6
AE24
NC
B8
NC
AD15
ATRTN3
AE25
GND
B9
VCCIB0
AD16
AT7
AE26
GND
B10
IO15NDB0V2
AD17
AT8
AF1
NC
B11
IO15PDB0V2
AD18
ATRTN4
AF2
GND
B12
VCCIB0
AD19
AT9
AF3
NC
B13
IO19NDB0V2
AD20
VCC33A
AF4
NC
B14
IO19PDB0V2
AD21
GND
AF5
NC
B15
VCCIB1
AD22
IO76NPB2V0
AF6
NC
B16
IO25NDB1V0
AD23
NC
AF7
NC
B17
IO25PDB1V0
AD24
GND
AF8
NC
B18
VCCIB1
AD25
NC
AF9
VCC33A
B19
IO33NDB1V1
AD26
NC
AF10
NC
B20
IO33PDB1V1
AE1
GND
AF11
NC
B21
VCCIB1
AE2
GND
AF12
VCC33A
B22
NC
AE3
NC
AF13
NC
B23
NC
AE4
NC
AF14
NC
B24
NC
AE5
NC
AF15
VCC33A
B25
GND
AE6
NC
AF16
NC
B26
GND
AE7
NC
AF17
NC
C1
NC
AE8
NC
AF18
VCC33A
C2
NC
AE9
GNDA
AF19
NC
C3
GND
AE10
NC
AF20
NC
C4
NC
AE11
NC
AF21
NC
C5
GAA1/IO01PDB0V0
AE12
GNDA
AF22
NC
C6
GAB0/IO02NDB0V0
AE13
NC
AF23
NC
C7
GAB1/IO02PDB0V0
AE14
NC
AF24
NC
C8
IO07NDB0V1
Revision 4
4- 29
Package Pin Assignments
FG676
FG676
FG676
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
C9
IO07PDB0V1
D19
GBC1/IO40PDB1V2
F3
IO121NDB4V0
C10
IO09PDB0V1
D20
GBA1/IO42PDB1V2
F4
GND
C11
IO13NDB0V2
D21
GND
F5
IO123NDB4V0
C12
IO13PDB0V2
D22
VCCPLB
F6
GAC2/IO123PDB4V0
C13
IO24PDB1V0
D23
GND
F7
GAA2/IO125PDB4V0
C14
IO26PDB1V0
D24
NC
F8
GAC0/IO03NDB0V0
C15
IO27NDB1V1
D25
NC
F9
GAC1/IO03PDB0V0
C16
IO27PDB1V1
D26
NC
F10
IO10NDB0V1
C17
IO35NDB1V2
E1
GND
F11
IO10PDB0V1
C18
IO35PDB1V2
E2
IO122NPB4V0
F12
IO14NDB0V2
C19
GBC0/IO40NDB1V2
E3
IO121PDB4V0
F13
IO23NDB1V0
C20
GBA0/IO42NDB1V2
E4
IO122PPB4V0
F14
IO23PDB1V0
C21
IO43NDB1V2
E5
IO00NDB0V0
F15
IO32NPB1V1
C22
IO43PDB1V2
E6
IO00PDB0V0
F16
IO34NDB1V1
C23
NC
E7
VCCIB0
F17
IO34PDB1V1
C24
GND
E8
IO05NDB0V1
F18
IO37PDB1V2
C25
NC
E9
IO05PDB0V1
F19
GBB1/IO41PDB1V2
C26
NC
E10
VCCIB0
F20
VCCIB2
D1
NC
E11
IO11NDB0V1
F21
IO47PPB2V0
D2
NC
E12
IO14PDB0V2
F22
IO44NDB2V0
D3
NC
E13
VCCIB0
F23
GND
D4
GND
E14
VCCIB1
F24
IO45NDB2V0
D5
GAA0/IO01NDB0V0
E15
IO29NDB1V1
F25
VCCIB2
D6
GND
E16
IO29PDB1V1
F26
NC
D7
IO04NDB0V0
E17
VCCIB1
G1
NC
D8
IO04PDB0V0
E18
IO37NDB1V2
G2
IO119PPB4V0
D9
GND
E19
GBB0/IO41NDB1V2
G3
IO120NDB4V0
D10
IO09NDB0V1
E20
VCCIB1
G4
IO120PDB4V0
D11
IO11PDB0V1
E21
VCOMPLB
G5
VCCIB4
D12
GND
E22
GBA2/IO44PDB2V0
G6
GAB2/IO124PDB4V0
D13
IO24NDB1V0
E23
IO48PPB2V0
G7
IO125NDB4V0
D14
IO26NDB1V0
E24
GBB2/IO45PDB2V0
G8
GND
D15
GND
E25
NC
G9
VCCIB0
D16
IO31NDB1V1
E26
GND
G10
IO08NDB0V1
D17
IO31PDB1V1
F1
NC
G11
IO08PDB0V1
D18
GND
F2
VCCIB4
G12
GND
4- 30
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG676
FG676
FG676
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
G13
IO22NDB1V0
H23
IO50NDB2V0
K7
IO114PDB4V0
G14
IO22PDB1V0
H24
IO51PDB2V0
K8
IO117NDB4V0
G15
GND
H25
NC
K9
GND
G16
IO32PPB1V1
H26
GND
K10
VCC
G17
IO36NPB1V2
J1
NC
K11
VCCIB0
G18
VCCIB1
J2
VCCIB4
K12
GND
G19
GND
J3
IO115PDB4V0
K13
VCCIB0
G20
IO47NPB2V0
J4
GND
K14
VCCIB1
G21
IO49PDB2V0
J5
IO116NDB4V0
K15
GND
G22
VCCIB2
J6
IO116PDB4V0
K16
VCCIB1
G23
IO46NDB2V0
J7
VCCIB4
K17
GND
G24
GBC2/IO46PDB2V0
J8
IO117PDB4V0
K18
GND
G25
IO48NPB2V0
J9
VCCIB4
K19
IO53NDB2V0
G26
NC
J10
GND
K20
IO57PDB2V0
H1
GND
J11
IO06NDB0V1
K21
GCA2/IO59PDB2V0
H2
NC
J12
IO06PDB0V1
K22
VCCIB2
H3
IO118NDB4V0
J13
IO16NDB0V2
K23
IO54NDB2V0
H4
IO118PDB4V0
J14
IO16PDB0V2
K24
IO54PDB2V0
H5
IO119NPB4V0
J15
IO28NDB1V1
K25
NC
H6
IO124NDB4V0
J16
IO28PDB1V1
K26
NC
H7
GND
J17
GND
L1
GND
H8
VCOMPLA
J18
IO38PPB1V2
L2
NC
H9
VCCPLA
J19
IO53PDB2V0
L3
IO112PPB4V0
H10
VCCIB0
J20
VCCIB2
L4
IO113NDB4V0
H11
IO12NDB0V1
J21
IO52PDB2V0
L5
GFB2/IO109PDB4V0
H12
IO12PDB0V1
J22
IO52NDB2V0
L6
GFA2/IO110PDB4V0
H13
VCCIB0
J23
GND
L7
IO112NPB4V0
H14
VCCIB1
J24
IO51NDB2V0
L8
IO104PDB4V0
H15
IO30NDB1V1
J25
VCCIB2
L9
IO111PDB4V0
H16
IO30PDB1V1
J26
NC
L10
VCCIB4
H17
VCCIB1
K1
NC
L11
GND
H18
IO36PPB1V2
K2
NC
L12
VCC
H19
IO38NPB1V2
K3
IO115NDB4V0
L13
GND
H20
GND
K4
IO113PDB4V0
L14
VCC
H21
IO49NDB2V0
K5
VCCIB4
L15
GND
H22
IO50PDB2V0
K6
IO114NDB4V0
L16
VCC
Revision 4
4- 31
Package Pin Assignments
FG676
FG676
FG676
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
L17
VCCIB2
N1
NC
P11
VCC
L18
GCB2/IO60PDB2V0
N2
NC
P12
GND
L19
IO58NDB2V0
N3
IO108NDB4V0
P13
VCC
L20
IO57NDB2V0
N4
VCCOSC
P14
GND
L21
IO59NDB2V0
N5
VCCIB4
P15
VCC
L22
GCC2/IO61PDB2V0
N6
XTAL2
P16
GND
L23
IO55PPB2V0
N7
GFC1/IO107PDB4V0
P17
VCCIB2
L24
IO56PDB2V0
N8
VCCIB4
P18
IO70NDB2V0
L25
IO55NPB2V0
N9
GFB1/IO106PDB4V0
P19
VCCIB2
L26
GND
N10
VCCIB4
P20
IO69NDB2V0
M1
NC
N11
GND
P21
GCA0/IO64NDB2V0
M2
VCCIB4
N12
VCC
P22
VCCIB2
M3
GFC2/IO108PDB4V0
N13
GND
P23
GCB0/IO63NDB2V0
M4
GND
N14
VCC
P24
GCB1/IO63PDB2V0
M5
IO109NDB4V0
N15
GND
P25
IO66NDB2V0
M6
IO110NDB4V0
N16
VCC
P26
IO67PDB2V0
M7
GND
N17
VCCIB2
R1
NC
M8
IO104NDB4V0
N18
IO70PDB2V0
R2
VCCIB4
M9
IO111NDB4V0
N19
VCCIB2
R3
IO103NDB4V0
M10
GND
N20
IO69PDB2V0
R4
GND
M11
VCC
N21
GCA1/IO64PDB2V0
R5
IO101PDB4V0
M12
GND
N22
VCCIB2
R6
IO100NPB4V0
M13
VCC
N23
GCC0/IO62NDB2V0
R7
GND
M14
GND
N24
GCC1/IO62PDB2V0
R8
IO99PDB4V0
M15
VCC
N25
IO66PDB2V0
R9
IO97PDB4V0
M16
GND
N26
IO65NDB2V0
R10
GND
M17
GND
P1
NC
R11
GND
M18
IO60NDB2V0
P2
NC
R12
VCC
M19
IO58PDB2V0
P3
IO103PDB4V0
R13
GND
M20
GND
P4
XTAL1
R14
VCC
M21
IO68NPB2V0
P5
VCCIB4
R15
GND
M22
IO61NDB2V0
P6
GNDOSC
R16
VCC
M23
GND
P7
GFC0/IO107NDB4V0
R17
GND
M24
IO56NDB2V0
P8
VCCIB4
R18
GDB2/IO83PDB2V0
M25
VCCIB2
P9
GFB0/IO106NDB4V0
R19
IO78PDB2V0
M26
IO65PDB2V0
P10
VCCIB4
R20
GND
4- 32
R e visio n 4
Fusion Family of Mixed Signal FPGAs
FG676
FG676
FG676
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
Pin Number
AFS1500 Function
R21
IO72NDB2V0
U5
VCCIB4
V15
AC5
R22
IO72PDB2V0
U6
IO91PDB4V0
V16
NC
R23
GND
U7
IO91NDB4V0
V17
GNDA
R24
IO71PDB2V0
U8
IO92PDB4V0
V18
IO77PPB2V0
R25
VCCIB2
U9
GND
V19
IO74PDB2V0
R26
IO67NDB2V0
U10
GND
V20
VCCIB2
T1
GND
U11
VCC33A
V21
IO82NDB2V0
T2
NC
U12
GNDA
V22
GDA2/IO82PDB2V0
T3
GFA1/IO105PDB4V0
U13
VCC33A
V23
GND
T4
GFA0/IO105NDB4V0
U14
GNDA
V24
GDC1/IO79PDB2V0
T5
IO101NDB4V0
U15
VCC33A
V25
VCCIB2
T6
IO96PDB4V0
U16
GNDA
V26
NC
T7
IO96NDB4V0
U17
VCC
W1
GND
T8
IO99NDB4V0
U18
GND
W2
IO94PPB4V0
T9
IO97NDB4V0
U19
IO74NDB2V0
W3
IO98PDB4V0
T10
VCCIB4
U20
GDA0/IO81NDB2V0
W4
IO98NDB4V0
T11
VCC
U21
GDB0/IO80NDB2V0
W5
GEC1/IO90PDB4V0
T12
GND
U22
VCCIB2
W6
GEC0/IO90NDB4V0
T13
VCC
U23
IO75NDB2V0
W7
GND
T14
GND
U24
IO75PDB2V0
W8
VCCNVM
T15
VCC
U25
NC
W9
VCCIB4
T16
GND
U26
NC
W10
VCC15A
T17
VCCIB2
V1
NC
W11
GNDA
T18
IO83NDB2V0
V2
VCCIB4
W12
AC4
T19
IO78NDB2V0
V3
IO100PPB4V0
W13
VCC33A
T20
GDA1/IO81PDB2V0
V4
GND
W14
GNDA
T21
GDB1/IO80PDB2V0
V5
IO95PDB4V0
W15
AG5
T22
IO73NDB2V0
V6
IO95NDB4V0
W16
GNDA
T23
IO73PDB2V0
V7
VCCIB4
W17
PUB
T24
IO71NDB2V0
V8
IO92NDB4V0
W18
VCCIB2
T25
NC
V9
GNDNVM
W19
TDI
T26
GND
V10
GNDA
W20
GND
U1
NC
V11
NC
W21
IO84NDB2V0
U2
NC
V12
AV4
W22
GDC2/IO84PDB2V0
U3
IO102PDB4V0
V13
NC
W23
IO77NPB2V0
U4
IO102NDB4V0
V14
AV5
W24
GDC0/IO79NDB2V0
Revision 4
4- 33
Package Pin Assignments
FG676
Pin Number
AFS1500 Function
W25
NC
W26
GND
Y1
NC
Y2
NC
Y3
GEB1/IO89PDB4V0
Y4
GEB0/IO89NDB4V0
Y5
VCCIB4
Y6
GEA1/IO88PDB4V0
Y7
GEA0/IO88NDB4V0
Y8
GND
Y9
VCC33PMP
Y10
NC
Y11
VCC33A
Y12
AG4
Y13
AT4
Y14
ATRTN2
Y15
AT5
Y16
VCC33A
Y17
NC
Y18
VCC33A
Y19
GND
Y20
TMS
Y21
VJTAG
Y22
VCCIB2
Y23
TRST
Y24
TDO
Y25
NC
Y26
NC
4- 34
R e visio n 4
5 – Datasheet Information
List of Changes
The following table lists critical changes that were made in each revision of the Fusion datasheet.
Revision
Revision 4
(January 2013)
Changes
Page
The "Product Ordering Codes" section has been updated to mention "Y" as "Blank"
mentioning "Device Does Not Include License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio" (SAR 43177).
III
The note in Table 2-12 • Fusion CCC/PLL Specification referring the reader to
SmartGen was revised to refer instead to the online help associated with the core
(SAR 42563).
2-30
Table 2-49 • Analog Channel Specifications was modified to update the uncalibrated
offset values (AFS250) of the external and internal temperature monitors (SAR
43134).
2-120
In Table 2-57 • Prescaler Control Truth Table—AV (x = 0), AC (x = 1), and AT (x = 3),
changed the column heading from 'Full-Scale Voltage' to 'Full Scale Voltage in 10-Bit
Mode', and added and updated Notes as required (SAR 20812).
2-133
The values for the Speed Grade (-1 and Std.) for FDDRIMAX (Table 2-180 • Input
DDR Propagation Delays) and values for the Speed Grade (-2 and Std.) for
FDDOMAX (Table 2-182 • Output DDR Propagation Delays) had been inadvertently
interchanged. This has been rectified (SAR 38514).
2-223,
2-225
Added description about what happens if a user connects VAREF to an external 3.3
V on their board to the "VAREF Analog Reference Voltage" section (SAR 35188).
2-228
Added a note to Table 3-2 • Recommended Operating Conditions1 (SAR 43429):
The programming temperature range supported is Tambient = 0°C to 85°C.
3-3
Added the Package Thermal details for AFS600-PQ208 and AFS250-PQ208 to
Table 3-6 • Package Thermal Resistance (SAR 37816). Deleted the Die Size column
from the table (SAR 43503).
3-7
Libero Integrated Design Environment (IDE) was changed to Libero System-on-Chip
(SoC) throughout the document (SAR 42495).
NA
Live at Power-Up (LAPU) has been replaced with ’Instant On’.
Revision 3
(August 2012)
Microblade U1AFS250 and U1AFS1500 devices were added to the product tables.
I – IV
A sentence pertaining to the analog I/Os was added to the "Specifying I/O States
During Programming" section (SAR 34831).
1-8
The "RC Oscillator" section was revised to correct a sentence that did not
differentiate accuracy for commercial and industrial temperature ranges, which is
given in Table 2-9 • Electrical Characteristics of RC Oscillator (SAR 33722).
2-20
Figure 2-57 • FIFO Read and Figure 2-58 • FIFO Write are new (SAR 34840).
2-75
The first paragraph of the "Offset" section was removed; it was intended to be
replaced by the paragraph following it (SAR 22647).
2-98
IOL and IOH values for 3.3 V GTL+ and 2.5 V GTL+ were corrected in Table 2-86 •
Summary of Maximum and Minimum DC Input and Output Levels Applicable to
Commercial and Industrial Conditions (SAR 39813).
2-167
Revision 4
5 -1
Datasheet Information
Revision
Revision 3
(continued)
Changes
The drive strength, IOL, and IOH for 3.3 V GTL and 2.5 V GTL were changed from
25 mA to 20 mA in the following tables (SAR 37373):
Table 2-86 • Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions,
2-167
Table 2-92 • Summary of I/O Timing Characteristics – Software Default Settings
2-170
2-172
2-202
2-203
Table 2-96 • I/O Output Buffer Maximum Resistances 1
Table 2-138 • Minimum and Maximum DC Input and Output Levels
Table 2-141 • Minimum and Maximum DC Input and Output Levels
Revision 2
(March 2012)
Page
The following sentence was deleted from the "2.5 V LVCMOS" section (SAR 34800):
"It uses a 5 V–tolerant input buffer and push-pull output buffer."
2-184
Corrected the inadvertent error in maximum values for LVPECL VIH and VIL and
revised them to "3.6" in Table 2-171 • Minimum and Maximum DC Input and Output
Levels, making these consistent with Table 3-1 • Absolute Maximum Ratings, and
Table 3-4 • Overshoot and Undershoot Limits 1 (SAR 37687).
2-214
The maximum frequency for global clock parameter was removed from Table 2-5 •
AFS1500 Global Resource Timing through Table 2-8 • AFS090 Global Resource
Timing because a frequency on the global is only an indication of what the global
network can do. There are other limiters such as the SRAM, I/Os, and PLL.
SmartTime software should be used to determine the design frequency (SAR
36955).
2-17 to
2-18
The phrase "without debug" was removed from the "Soft ARM Cortex-M1 Fusion
Devices (M1)" section (SAR 21390).
I
The "In-System Programming (ISP) and Security" section, "Security" section, "Flash
Advantages" section, and "Security" section were revised to clarify that although no
existing security measures can give an absolute guarantee, Microsemi FPGAs
implement the best security available in the industry (SAR 34679).
I, 1-2,
2-231
The Y security option and Licensed DPA Logo was added to the "Product Ordering
Codes" section. The trademarked Licensed DPA Logo identifies that a product is
covered by a DPA counter-measures license from Cryptography Research (SAR
34721).
III
The "Specifying I/O States During Programming" section is new (SAR 34693).
1-8
The following information was added before Figure 2-17 • XTLOSC Macro:
2-21
In the case where the Crystal Oscillator block is not used, the XTAL1 pin should be
connected to GND and the XTAL2 pin should be left floating (SAR 24119).
5-2
Table 2-12 • Fusion CCC/PLL Specification was updated. A note was added
indicating that when the CCC/PLL core is generated by Microsemi core generator
software, not all delay values of the specified delay increments are available (SAR
34814).
2-30
A note was added to Figure 2-27 • Real-Time Counter System (not all the signals are
shown for the AB macro) stating that the user is only required to instantiate the
VRPSM macro if the user wishes to specify PUPO behavior of the voltage regulator
to be different from the default, or employ user logic to shut the voltage regulator off
(SAR 21773).
2-33
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Revision
Revision 2
(continued)
Changes
Page
VPUMP was incorrectly represented as VPP in several places. This was corrected to 2-34, 3-10
VPUMP in the "Standby and Sleep Mode Circuit Implementation" section and
Table 3-8 • AFS1500 Quiescent Supply Current Characteristics through Table 3-11 •
AFS090 Quiescent Supply Current Characteristics (21963).
Additional information was added to the Flash Memory Block "Write Operation"
section, including an explanation of the fact that a copy-page operation takes no less
than 55 cycles (SAR 26338).
2-47
The "FlashROM" section was revised to refer to Figure 2-46 • FlashROM Timing 2-56, 2-57
Diagram and Table 2-26 • FlashROM Access Time rather than stating 20 MHz as the
maximum FlashROM access clock and 10 ns as the time interval for D0 to become
valid or invalid (SAR 22105).
The following figures were deleted (SAR 29991). Reference was made to a new
application note, Simultaneous Read-Write Operations in Dual-Port SRAM for FlashBased cSoCs and FPGAs, which covers these cases in detail (SAR 34862).
Figure 2-55 • Write Access after Write onto Same Address
Figure 2-56 • Read Access after Write onto Same Address
Figure 2-57 • Write Access after Read onto Same Address
The port names in the SRAM "Timing Waveforms", "Timing Characteristics", SRAM
2-66,
tables, Figure 2-55 • RAM Reset. Applicable to both RAM4K9 and RAM512x18., and
2-69,
the FIFO "Timing Characteristics" tables were revised to ensure consistency with the 2-68, 2-78
software names (SAR 35753).
In several places throughout the datasheet, GNDREF was corrected to
ADCGNDREF (SAR 20783):
Figure 2-64 • Analog Block Macro
Table 2-36 • Analog Block Pin Description
"ADC Operation" section
The following note was added below Figure 2-78 • Timing Diagram for the
Temperature Monitor Strobe Signal:
2-80
2-81
2-107
2-96
When the IEEE 1149.1 Boundary Scan EXTEST instruction is executed, the AG pad
drive strength ceases and becomes a 1 µA sink into the Fusion device. (SAR
24796).
The "Analog-to-Digital Converter Block" section was extensively revised,
reorganizing the information and adding the "ADC Theory of Operation" section and
"Acquisition Time or Sample Time Control" section. The "ADC Example" section was
reworked and corrected (SAR 20577).
2-99
Table 2-49 • Analog Channel Specifications was modified to include calibrated and
uncalibrated values for offset (AFS090 and AFS250) for the external and internal
temperature monitors. The "Offset" section was revised accordingly and now
references Table 2-49 • Analog Channel Specifications (SARs 22647, 27015).
2-98,
2-120
The "Intra-Conversion" section and "Injected Conversion" section had definitions
incorrectly interchanged and have been corrected. Figure 2-92 • Intra-Conversion
Timing Diagram and Figure 2-93 • Injected Conversion Timing Diagram were also
incorrectly interchanged and have been replaced correctly. Reference in the figure
notes to EQ 10 has been corrected to EQ 23 (SAR 20547).
2-112,
2-115,
2-116
The prescalar range for the 'Analog Input (direct input to ADC)" configurations was
removed as inapplicable for direct inputs. The input resistance for direct inputs is
covered in Table 2-50 • ADC Characteristics in Direct Input Mode (SAR 31201).
2-123
Revision 4
5 -3
Datasheet Information
Revision
Revision 2
(continued)
Changes
Page
The "Examples" for calibrating accuracy for ADC channels were revised and
corrected to make them consistent with terminology in the associated tables (SARs
36791, 36773).
2-127
A note was added to Table 2-56 • Analog Quad ACM Byte Assignment and the
introductory text for Table 2-66 • Internal Temperature Monitor Control Truth Table,
stating that for the internal temperature monitor to function, Bit 0 of Byte 2 for all 10
Quads must be set (SAR 34418).
2-132,
2-134
tDOUT was corrected to tDIN in Figure 2-116 • Input Buffer Timing Model and Delays
(example) (SAR 37115).
2-164
The formulas in the table notes for Table 2-97 • I/O Weak Pull-Up/Pull-Down
Resistances were corrected (SAR 34751).
2-174
The AC Loading figures in the "Single-Ended I/O Characteristics" section were
updated to match tables in the "Summary of I/O Timing Characteristics – Default I/O
Software Settings" section (SAR 34877).
2-178
The following notes were removed from Table 2-168 • Minimum and Maximum DC
Input and Output Levels (SAR 34808):
2-212
±5%
Differential input voltage = ±350 mV
July 2010
5-4
An incomplete, duplicate sentence was removed from the end of the "GNDAQ
Ground (analog quiet)" pin description (SAR 30185).
2-226
Information about configuration of unused I/Os was added to the "User Pins" section
(SAR 32642).
2-228
The following information was added to the pin description for "XTAL1 Crystal
Oscillator Circuit Input" and "XTAL2 Crystal Oscillator Circuit Input" (SAR 24119).
2-230
The input resistance to ground value in Table 3-3 • Input Resistance of Analog Pads
for Analog Input (direct input to ADC), was corrected from 1 M (typical) to 2 k
(typical) (SAR 34371).
3-4
The Storage Temperature column in Table 3-5 • FPGA Programming, Storage, and
Operating Limits stated Min. TJ twice for commercial and industrial product grades
and has been corrected to Min. TJ and Max. TJ (SAR 29416).
3-5
The reference to guidelines for global spines and VersaTile rows, given in the
"Global Clock Dynamic Contribution—PCLOCK" section, was corrected to the
"Spine Architecture" section of the Global Resources chapter in the Fusion
FPGA Fabric User's Guide (SAR 34741).
3-24
Package names used in the "Package Pin Assignments" section were revised to
match standards given in Package Mechanical Drawings (SAR 36612).
4-1
The versioning system for datasheets has been changed. Datasheets are assigned
a revision number that increments each time the datasheet is revised. The "Fusion
Device Status" table indicates the status for each device in the device family.
N/A
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Revision
v2.0, Revision 1
(July 2009)
Changes
Page
The MicroBlade and Fusion datasheets have been combined. Pigeon Point
information is new.
N/A
CoreMP7 support was removed since it is no longer offered.
–F was removed from the datasheet since it is no longer offered.
The operating temperature was changed from ambient to junction to better reflect
actual conditions of operations.
Commercial: 0°C to 85°C
Industrial: –40°C to 100°C
The version number category was changed from Preliminary to Production, which
means the datasheet contains information based on final characterization. The
version number changed from Preliminary v1.7 to v2.0.
The "Integrated Analog Blocks and Analog I/Os" section was updated to include a
reference to the "Analog System Characteristics" section in the Device Architecture
chapter of the datasheet, which includes Table 2-46 • Analog Channel Specifications
and specific voltage data.
1-4
The phrase "Commercial-Case Conditions" in timing table titles was changed to
"Commercial Temperature Range Conditions."
N/A
The "Crystal Oscillator" section was updated significantly. Please review carefully.
2-21
The "Real-Time Counter (part of AB macro)" section was updated significantly.
Please review carefully.
2-35
There was a typo in Table 2-19 • Flash Memory Block Pin Names for the
ERASEPAGE description; it was the same as DISCARDPAGE. As as a result, the
ERASEPAGE description was updated.
2-42
The tFMAXCLKNVM parameter was updated in Table 2-25 • Flash Memory Block
Timing.
2-54
Table 2-31 • RAM4K9 and Table 2-32 • RAM512X18 were updated.
2-69
In Table 2-36 • Analog Block Pin Description, the Function description for PWRDWN
was changed from "Comparator power-down if 1"
2-81
to
"ADC comparator power-down if 1. When asserted, the ADC will stop functioning,
and the digital portion of the analog block will continue operating. This may result in
invalid status flags from the analog block. Therefore, Microsemi does not
recommend asserting the PWRDWN pin."
Figure 2-75 • Gate Driver Example was updated.
2-94
The "ADC Operation" section was updated. Please review carefully.
2-107
Figure 2-92 • Intra-Conversion Timing Diagram and Figure 2-93 • Injected
Conversion Timing Diagram are new.
2-116
The "Typical Performance Characteristics" section is new.
2-118
Table 2-49 • Analog Channel Specifications was significantly updated.
2-120
Table 2-50 • ADC Characteristics in Direct Input Mode was significantly updated.
2-123
In Table 2-52 • Calibrated Analog Channel Accuracy 1,2,3, note 2 was updated.
2-126
In Table 2-53 • Analog Channel Accuracy: Monitoring Standard Positive Voltages,
note 1 was updated.
2-127
In Table 2-54 • ACM Address Decode Table for Analog Quad, bit 89 was removed.
2-129
Revision 4
5 -5
Datasheet Information
Revision
v2.0, Revision 1
(continued)
Changes
Page
The data in the 2.5 V LCMOS and LVCMOS 2.5 V / 5.0 V rows were updated in
Table 2-75 • Fusion Standard and Advanced I/O – Hot-Swap and 5 V Input Tolerance
Capabilities.
2-146
In Table 2-78 • Fusion Standard I/O Standards—OUT_DRIVE Settings, LVCMOS
1.5 V, for OUT_DRIVE 2, was changed from a dash to a check mark.
2-155
The "VCC15A Analog Power Supply (1.5 V)" definition was changed from "A 1.5 V
analog power supply input should be used to provide this input" to "1.5 V clean
analog power supply input for use by the 1.5 V portion of the analog circuitry."
2-226
In the "VCC33PMP Analog Power Supply (3.3 V)" pin description, the following text
was changed from "VCC33PMP should be powered up before or simultaneously
with VCC33A" to "VCC33PMP should be powered up simultaneously with or after
VCC33A."
2-226
The "VCCOSC Oscillator Power Supply (3.3 V)" section was updated to include
information about when to power the pin.
2-227
In the "128-Bit AES Decryption" section, FIPS-192 was incorrect and changed to
FIPS-197.
2-231
The note in Table 2-84 • Fusion Standard and Advanced I/O Attributes vs. I/O
Standard Applications was updated.
2-159
For 1.5 V LVCMOS, the VIL and VIH parameters, 0.30 * VCCI was changed to 0.35 *
VCCI and 0.70 * VCCI was changed to 0.65 * VCCI in Table 2-86 • Summary of
Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions, Table 2-87 • Summary of Maximum and Minimum DC Input
and Output Levels Applicable to Commercial and Industrial Conditions, and
Table 2-88 • Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions.
2-167 to
2-168
In Table 2-87 • Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions, the VIH max column was
updated.
5-6
Table 2-89 • Summary of Maximum and Minimum DC Input Levels Applicable to
Commercial and Industrial Conditions was updated to include notes 3 and 4. The
temperature ranges were also updated in notes 1 and 2.
2-168
The titles in Table 2-92 • Summary of I/O Timing Characteristics – Software Default
Settings to Table 2-94 • Summary of I/O Timing Characteristics – Software Default
Settings were updated to "VCCI = I/O Standard Dependent."
2-170 to
2-171
Below Table 2-98 • I/O Short Currents IOSH/IOSL, the paragraph was updated to
change 110°C to 100°C and three months was changed to six months.
2-175
Table 2-99 • Short Current Event Duration before Failure was updated to remove
110°C data.
2-177
In Table 2-101 • I/O Input Rise Time, Fall Time, and Related I/O Reliability,
LVTTL/LVCMOS rows were changed from 110°C to 100°C.
2-177
VCC33PMP was added to Table 3-1 • Absolute Maximum Ratings. In addition,
conditions for AV, AC, AG, and AT were also updated.
3-1
VCC33PMP was added to Table 3-2 • Recommended Operating Conditions1. In
addition, conditions for AV, AC, AG, and AT were also updated.
3-3
Table 3-5 • FPGA Programming, Storage, and Operating Limits was updated to
include new data and the temperature ranges were changed. The notes were
removed from the table.
3-5
R e vi s i o n 4
Fusion Family of Mixed Signal FPGAs
Revision
v2.0, Revision 1
(continued)
Preliminary v1.7
(October 2008)
Changes
Table 3-6 • Package Thermal Resistance was updated to include new data.
In EQ 4 to EQ 6, the junction temperature was changed from 110°C to 100°C.
Page
3-7
3-8 to 3-8
Table 3-8 • AFS1500 Quiescent Supply Current Characteristics through Table 3-11 •
AFS090 Quiescent Supply Current Characteristics are new and have replaced the
Quiescent Supply Current Characteristics (IDDQ) table.
3-10 to
3-16
In Table 3-14 • Different Components Contributing to the Dynamic Power
Consumption in Fusion Devices, the power supply for PAC9 and PAC10 were
changed from VMV/VCC to VCCI.
3-22
In Table 3-15 • Different Components Contributing to the Static Power Consumption
in Fusion Devices, the power supply for PDC7 and PDC8 were changed from
VMV/VCC to VCCI. PDC1 was updated from TBD to 18.
3-23
The "QN108" table was updated to remove the duplicates of pins B12 and B34.
4-2
The version number category was changed from Advance to Preliminary, which
means the datasheet contains information based on simulation and/or initial
characterization. The information is believed to be correct, but changes are possible.
For the VIL and VIH parameters, 0.30 * VCCI was changed to 0.35 * VCCI and 0.70
* VCCI was changed to 0.65 * VCCI in Table 2-126 • Minimum and Maximum DC
Input and Output Levels.
2-196
The version number category was changed from Advance to Preliminary, which
means the datasheet contains information based on simulation and/or initial
characterization. The information is believed to be correct, but changes are possible.
N/A
The following updates were made to Table 2-141 • Minimum and Maximum DC Input
and Output Levels:
2-203
Temperature
Digital Output
213
00 1111 1101
283
01 0001 1011
358
01 0110 0110 – only the digital output was updated.
Temperature 358 remains in the temperature column.
Advance v1.6
(August 2008)
In Advance v1.2, the "VAREF Analog Reference Voltage" pin description was
significantly updated but the change was not noted in the change table.
2-228
The title of the datasheet changed from Actel Programmable System Chips to Actel
Fusion Mixed Signal FPGAs. In addition, all instances of programmable system chip
were changed to mixed signal FPGA.
N/A
The references to the Peripherals User’s Guide in the "No-Glitch MUX (NGMUX)" 2-32, 2-42
section and "Voltage Regulator Power Supply Monitor (VRPSM)" section were
changed to Fusion Handbook.
Advance v1.5
(July 2008)
The following bullet was updated from High-Voltage Input Tolerance: ±12 V to HighVoltage Input Tolerance: 10.5 V to 12 V.
I
The following bullet was updated from Programmable 1, 3, 10, 30 µA and 25 mA
Drive Strengths to Programmable 1, 3, 10, 30 µA and 20 mA Drive Strengths.
I
Revision 4
5 -7
Datasheet Information
Revision
Advance v1.5
(continued)
Changes
Page
This bullet was added to the "Integrated A/D Converter (ADC) and Analog I/O"
section: ADC Accuracy is Better than 1%
I
In the "Integrated Analog Blocks and Analog I/Os" section, ±4 LSB was changed to
0.72. The following sentence was deleted:
1-4
The input range for voltage signals is from –12 V to +12 V with full-scale output
values from 0.125 V to 16 V.
In addition, 2°C was changed to 3°C:
"One analog input in each quad can be connected to an external temperature
monitor diode and achieves detection accuracy of ±3ºC."
The following sentence was deleted:
The input range for voltage signals is from –12 V to +12 V with full-scale output
values from 0.125 V to 16 V.
Advance v1.4
(July 2008)
The title of the datasheet changed from Actel Programmable System Chips to Actel
Fusion Mixed Signal FPGAs. In addition, all instances of programmable system chip
were changed to mixed signal FPGA.
N/A
In Table 3-8 · Quiescent Supply Current
references were updated for IDC2 and IDC3.
3-11
Characteristics
(IDDQ)1,
footnote
Footnote 3 and 4 were updated and footnote 5 is new.
Advance v1.3
(July 2008)
The "ADC Description" section was significantly updated. Please review carefully.
2-102
Advance v1.2
(May 2008)
Table 2-25 • Flash Memory Block Timing was significantly updated.
2-55
The "VAREF Analog Reference Voltage" pin description section was significantly
update. Please review it carefully.
2-226
Table 2-45 • ADC Interface Timing was significantly updated.
2-110
Table 2-56 • Direct Analog Input Switch Control Truth Table—AV (x = 0), AC (x = 1),
and AT (x = 3) was significantly updated.
2-131
The following sentence was deleted from the "Voltage Monitor" section:
2-86
The Analog Quad inputs are tolerant up to 12 V + 10%.
The "180-Pin QFN" figure was updated. D1 to D4 are new and the figure was
changed to bottom view. The note below the figure is new.
Advance v1.1
(May 2008)
The following text was incorrect and therefore deleted:
VCC33A
Analog Power Filter
Analog power pin for the analog power supply low-pass filter. An external 100 pF
capacitor should be connected between this pin and ground.
There is still a description of VCC33A on page 2-224.
5-8
R e vi s i o n 4
3-3
2-204
Fusion Family of Mixed Signal FPGAs
Revision
Advance v1.0
(January 2008)
Changes
Page
All Timing Characteristics tables were updated. For the Differential I/O Standards,
the Standard I/O support tables are new.
N/A
Table 2-3 • Array Coordinates was updated to change the max x and y values
2-9
Table 2-12 • Fusion CCC/PLL Specification was updated.
2-31
A note was added to Table 2-16 · RTC ACM Memory Map.
2-37
A reference to the Peripheral’s User’s Guide was added to the "Voltage Regulator
Power Supply Monitor (VRPSM)" section.
2-42
In Table 2-25 • Flash Memory Block Timing, the commercial conditions were
updated.
2-55
In Table 2-26 • FlashROM Access Time, the commercial conditions were missing
and have been added below the title of the table.
2-58
In Table 2-36 • Analog Block Pin Description, the function description was updated
for the ADCRESET.
2-82
In the "Voltage Monitor" section, the following sentence originally had ± 10% and it
was changed to +10%.
2-86
The Analog Quad inputs are tolerant up to 12 V + 10%.
In addition, this statement was deleted from the datasheet:
Each I/O will draw power when connected to power (3 mA at 3 V).
The "Terminology" section is new.
2-88
The "Current Monitor" section was significantly updated. Figure 2-72 • Timing
Diagram for Current Monitor Strobe to Figure 2-74 • Negative Current Monitor and
Table 2-37 • Recommended Resistor for Different Current Range Measurement are
new.
2-90
The "ADC Description" section was updated to add the "Terminology" section.
2-93
In the "Gate Driver" section, 25 mA was changed to 20 mA and 1.5 MHz was
changed to 1.3 MHz. In addition, the following sentence was deleted:
2-94
The maximum AG pad switching frequency is 1.25 MHz.
The "Temperature Monitor" section was updated to rewrite most of the text and add
Figure 2-78, Figure 2-79, and Table 2-38 • Temperature Data Format.
2-96
In Table 2-38 • Temperature Data Format, the temperature K column was changed
for 85°C from 538 to 358.
2-98
In Table 2-45 • ADC Interface Timing, "Typical-Case" was changed to "Worst-Case."
2-110
The "ADC Interface Timing" section is new.
2-110
Table 2-46 • Analog Channel Specifications was updated.
2-118
The "VCC15A Analog Power Supply (1.5 V)" section was updated.
2-224
The "VCCPLA/B PLL Supply Voltage" section is new.
2-225
In "VCCNVM Flash Memory Block Power Supply (1.5 V)" section, supply was
changed to supply input.
2-224
The "VCCPLA/B PLL Supply Voltage" pin description was updated to include the
following statement:
2-225
Actel recommends tying VCCPLX to VCC and using proper filtering circuits to
decouple VCC noise from PLL.
The "VCOMPLA/B Ground for West and East PLL" section was updated.
Revision 4
2-225
5 -9
Datasheet Information
Revision
Advance 1.0
(continued)
Changes
Page
In Table 2-47 • ADC Characteristics in Direct Input Mode, the commercial conditions
were updated and note 2 is new.
2-121
The VCC33ACAP signal name was changed to "XTAL1 Crystal Oscillator Circuit
Input".
2-228
Table 2-48 • Uncalibrated Analog Channel Accuracy* is new.
2-123
Table 2-49 • Calibrated Analog Channel Accuracy 1,2,3 is new.
2-124
Table 2-50 • Analog Channel Accuracy: Monitoring Standard Positive Voltages is
new.
2-125
In Table 2-57 • Voltage Polarity Control Truth Table—AV (x = 0), AC (x = 1), and AT
(x = 3)*, the following I/O Bank names were changed:
2-131
Hot-Swap changed to Standard
LVDS changed to Advanced
In Table 2-58 • Prescaler Op Amp Power-Down Truth Table—AV (x = 0), AC (x = 1),
and AT (x = 3), the following I/O Bank names were changed:
2-132
Hot-Swap changed to Standard
LVDS changed to Advanced
In the title of Table 2-64 • I/O Standards Supported by Bank Type, LVDS I/O was
changed to Advanced I/O.
2-134
The title was changed from "Fusion Standard, LVDS, and Standard plus Hot-Swap
I/O" to Table 2-68 • Fusion Standard and Advanced I/O Features. In addition, the
table headings were all updated. The heading used to be Standard and LVDS I/O
and was changed to Advanced I/O. Standard Hot-Swap was changed to just
Standard.
2-136
This sentence was deleted from the "Slew Rate Control and Drive Strength" section:
2-152
The Standard hot-swap I/Os do not support slew rate control. In addition, these
references were changed:
• From: Fusion hot-swap I/O (Table 2-69 on page 2-122) To: Fusion Standard I/O
• From: Fusion LVDS I/O (Table 2-70 on page 2-122) To: Fusion Advanced I/O
The "Cold-Sparing Support" section was significantly updated.
2-143
In the title of Table 2-75 • Fusion Standard I/O Standards—OUT_DRIVE Settings,
Hot-Swap was changed to Standard.
2-153
In the title of Table 2-76 • Fusion Advanced I/O Standards—SLEW and OUT_DRIVE
Settings, LVDS was changed to Advanced.
2-153
In the title of Table 2-81 • Fusion Standard and Advanced I/O Attributes vs. I/O
Standard Applications, LVDS was changed to Advanced.
2-157
In Figure 2-111 • Naming Conventions of Fusion Devices with Three Digital I/O
Banks and Figure 2-112 • Naming Conventions of Fusion Devices with Four I/O
Banks the following names were changed:
2-160
Hot-Swap changed to Standard
LVDS changed to Advanced
5- 10
The Figure 2-113 • Timing Model was updated.
2-161
In the notes for Table 2-86 • Summary of Maximum and Minimum DC Input Levels
Applicable to Commercial and Industrial Conditions, TJ was changed to TA.
2-166
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Revision
Changes
Page
Advance v1.0
(continued)
This change table states that in the "208-Pin PQFP" table listed under the Advance
v0.8 changes, the AFS090 device had a pin change. That is incorrect. Pin 102 was
updated for AFS250 and AFS600. The function name changed from VCC33ACAP to
VCC33A.
3-8
Advance v0.9
(October 2007)
In
the
"Package
I/Os:
Single-/Double-Ended
(Analog)"
table,
AFS1500/M7AFS1500 I/O counts were updated for the following devices:
the
II
FG484: 223/109
FG676: 252/126
In the "108-Pin QFN" table, the function changed from VCC33ACAP to VCC33A for the
following pin:
3-2
B25
In the "180-Pin QFN" table, the function changed from VCC33ACAP to VCC33A for the
following pins:
3-4
AFS090: B29
AFS250: B29
In the "208-Pin PQFP" table, the function changed from VCC33ACAP to VCC33A for the
following pins:
3-8
AFS090: 102
AFS250: 102
In the "256-Pin FBGA" table, the function changed from VCC33ACAP to VCC33A for the
following pins:
3-12
AFS090: T14
AFS250: T14
AFS600: T14
AFS1500: T14
Advance v0.9
(continued)
In the "484-Pin FBGA" table, the function changed from VCC33ACAP to VCC33A for the
following pins:
3-20
AFS600: AB18
AFS1500: AB18
In the "676-Pin FBGA" table, the function changed from VCC33ACAP to VCC33A for the
following pins:
3-28
AFS1500: AD20
Advance v0.8
(June 2007)
Figure 2-16 • Fusion Clocking Options and the "RC Oscillator" section were updated 2-20, 2-21
to change GND_OSC and VCC_OSC to GNDOSC and VCCOSC.
Figure 2-19 • Fusion CCC Options: Global Buffers with the PLL Macro was updated
to change the positions of OADIVRST and OADIVHALF, and a note was added.
2-25
The "Crystal Oscillator" section was updated to include information about controlling
and enabling/disabling the crystal oscillator.
2-22
Table 2-11 · Electrical Characteristics of the Crystal Oscillator was updated to
change the typical value of IDYNXTAL for 0.032–0.2 MHz to 0.19.
2-24
The "1.5 V Voltage Regulator" section was updated to add "or floating" in the
paragraph stating that an external pull-down is required on TRST to power down the
VR.
2-41
The "1.5 V Voltage Regulator" section was updated to include information on
powering down with the VR.
2-41
Revision 4
5- 11
Datasheet Information
Revision
Advance v0.8
(continued)
Changes
Page
This sentence was updated in the "No-Glitch MUX (NGMUX)" section to delete GLA:
2-32
The GLMUXCFG[1:0] configuration bits determine the source of the CLK inputs (i.e.,
internal signal or GLC).
In Table 2-13 • NGMUX Configuration and Selection Table, 10 and 11 were deleted.
2-32
The method to enable sleep mode was updated for bit 0 in Table 2-16 • RTC
Control/Status Register.
2-38
S2 was changed to D2 in Figure 2-39 • Read Waveform (Pipe Mode, 32-bit access)
for RD[31:0] was updated.
2-51
The definitions for bits 2 and 3 were updated in Table 2-24 • Page Status Bit
Definition.
2-52
Figure 2-46 • FlashROM Timing Diagram was updated.
2-58
Table 2-26 • FlashROM Access Time is new.
2-58
Figure 2-55 • Write Access After Write onto Same Address, Figure 2-56 • Read
Access After Write onto Same Address, and Figure 2-57 • Write Access After Read
onto Same Address are new.
2-68–
2-70
Table 2-31 • RAM4K9 and Table 2-32 • RAM512X18 were updated.
The VAREF and SAMPLE functions were updated in Table 2-36 • Analog Block Pin
Description.
2-82
The title of Figure 2-72 • Timing Diagram for Current Monitor Strobe was updated to
add the word "positive."
2-91
The "Gate Driver" section was updated to give information about the switching rate
in High Current Drive mode.
2-94
The "ADC Description" section was updated to include information about the
SAMPLE and BUSY signals and the maximum frequencies for SYSCLK and
ADCCLK. EQ 2 was updated to add parentheses around the entire expression in the
denominator.
2-102
Table 2-46 · Analog Channel Specifications and Table 2-47 · ADC Characteristics in
Direct Input Mode were updated.
2-118,
2-121
The note was removed from Table 2-55 • Analog Multiplexer Truth Table—AV (x = 0),
AC (x = 1), and AT (x = 3).
2-131
Table 2-63 • Internal Temperature Monitor Control Truth Table is new.
2-132
The "Cold-Sparing Support" section was updated to add information about cases
where current draw can occur.
2-143
Figure 2-104 • Solution 4 was updated.
2-147
Table 2-75 • Fusion Standard I/O Standards—OUT_DRIVE Settings was updated.
2-153
The "GNDA Ground (analog)" section and "GNDAQ Ground (analog quiet)" section
were updated to add information about maximum differential voltage.
2-224
The "VAREF Analog Reference Voltage" section and "VPUMP Programming Supply
Voltage" section were updated.
2-226
The "VCCPLA/B PLL Supply Voltage" section was updated to include information
about the east and west PLLs.
2-225
The VCOMPLF pin description was deleted.
The "Axy Analog Input/Output" section was updated with information about
grounding and floating the pin.
5- 12
2-71, 2-72
R e visio n 4
N/A
2-226
Fusion Family of Mixed Signal FPGAs
Revision
Advance v0.8
(continued)
Changes
Page
The voltage range in the "VPUMP Programming Supply Voltage" section was
updated. The parenthetical reference to "pulled up" was removed from the
statement, "VPUMP can be left floating or can be tied (pulled up) to any voltage
2-225
between 0 V and 3.6 V."
Advance v0.7
(January 2007)
Advance v0.6
(October 2006)
The "ATRTNx Temperature Monitor Return" section was updated with information
about grounding and floating the pin.
2-226
The following text was deleted from the "VREF I/O Voltage Reference" section: (all
digital I/O).
2-225
The "NCAP Negative Capacitor" section and "PCAP Positive Capacitor" section
were updated to include information about the type of capacitor that is required to
connect the two.
2-228
1 µF was changed to 100 pF in the "XTAL1 Crystal Oscillator Circuit Input".
2-228
The "Programming" section was updated to include information about VCCOSC.
2-229
The VMV pins have now been tied internally with the VCCI pins.
N/A
The AFS090"108-Pin QFN" table was updated.
3-2
The AFS090 and AFS250 devices were updated in the "108-Pin QFN" table.
3-2
The AFS250 device was updated in the "208-Pin PQFP" table.
3-8
The AFS600 device was updated in the "208-Pin PQFP" table.
3-8
The AFS090, AFS250, AFS600, and AFS1500 devices were updated in the "256-Pin
FBGA" table.
3-12
The AFS600 and AFS1500 devices were updated in the "484-Pin FBGA" table.
3-20
The AFS600 device was updated in the "676-Pin FBGA" table.
3-28
The AFS1500 digital I/O count was updated in the "Fusion Family" table.
I
The AFS1500 digital I/O count was updated in the "Package I/Os: Single-/DoubleEnded (Analog)" table.
II
The second paragraph of the "PLL Macro" section was updated to include
information about POWERDOWN.
2-30
The description for bit 0 was updated in Table 2-17 · RTC Control/Status Register.
2-38
3.9 was changed to 7.8 in the "Crystal Oscillator (Xtal Osc)" section.
2-40.
All function descriptions in Table 2-18 · Signals for VRPSM Macro.
2-42
In Table 2-19 • Flash Memory Block Pin Names, the RD[31:0] description was
updated.
2-43
The "RESET" section was updated.
2-61
The "RESET" section was updated.
2-64
Table 2-35 • FIFO was updated.
2-79
The VAREF function description was updated in Table 2-36 • Analog Block Pin
Description.
2-82
The "Voltage Monitor" section was updated to include information about low power
mode and sleep mode.
2-86
The text in the "Current Monitor" section was changed from 2 mV to 1 mV.
2-90
The "Gate Driver" section was updated to include information about forcing 1 V on
the drain.
2-94
Revision 4
5- 13
Datasheet Information
Revision
Advance v0.6
(continued)
Changes
Page
The "Analog-to-Digital Converter Block" section was updated with the following
statement:
"All results are MSB justified in the ADC."
2-99
The information about the ADCSTART signal was updated in the "ADC Description"
section.
2-102
Table 2-46 · Analog Channel Specifications was updated.
2-118
Table 2-47 · ADC Characteristics in Direct Input Mode was updated.
2-121
Table 2-51 • ACM Address Decode Table for Analog Quad was updated.
2-127
In Table 2-53 • Analog Quad ACM Byte Assignment, the Function and Default
Setting for Bit 6 in Byte 3 was updated.
2-130
The "Introduction" section was updated to include information about digital inputs,
outputs, and bibufs.
2-133
In Table 2-69 • Fusion Pro I/O Features, the programmable delay descriptions were
updated for the following features:
2-137
Single-ended receiver
Voltage-referenced differential receiver
LVDS/LVPECL differential receiver features
5- 14
The "User I/O Naming Convention" section was updated to include "V" and "z"
descriptions
2-159
The "VCC33PMP Analog Power Supply (3.3 V)" section was updated to include
information about avoiding high current draw.
2-224
The "VCCNVM Flash Memory Block Power Supply (1.5 V)" section was updated to
include information about avoiding high current draw.
2-224
The "VMVx I/O Supply Voltage (quiet)" section was updated to include this
statement: VMV and VCCI must be connected to the same power supply and VCCI
pins within a given I/O bank.
2-185
The "PUB Push Button" section was updated to include information about leaving
the pin floating if it is not used.
2-228
The "PTBASE Pass Transistor Base" section was updated to include information
about leaving the pin floating if it is not used.
2-228
The "PTEM Pass Transistor Emitter" section was updated to include information
about leaving the pin floating if it is not used.
2-228
The heading was incorrect in the "208-Pin PQFP" table. It should be AFS250 and not
AFS090.
3-8
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Revision
Advance v0.5
(June 2006)
Changes
The low power modes of operation were updated and clarified.
Page
N/A
The AFS1500 digital I/O count was updated in Table 1 • Fusion Family.
i
The AFS1500 digital I/O count was updated in the "Package I/Os: Single-/DoubleEnded (Analog)" table.
ii
The "Voltage Regulator Power Supply Monitor (VRPSM)" was updated.
2-36
Figure 2-45 • FlashROM Timing Diagram was updated.
2-53
The "256-Pin FBGA" table for the AFS1500 is new.
3-12
Advance v0.4
(April 2006)
The G was moved in the "Product Ordering Codes" section.
III
Advance v0.3
(April 2006)
The "Features and Benefits" section was updated.
I
The "Fusion Family" table was updated.
I
The "Package I/Os: Single-/Double-Ended (Analog)" table was updated.
II
The "Product Ordering Codes" table was updated.
III
The "Temperature Grade Offerings" table was updated.
IV
The "General Description" section was updated to include ARM information.
1-1
Figure 2-46 • FlashROM Timing Diagram was updated.
2-58
The "FlashROM" section was updated.
2-57
The "RESET" section was updated.
2-61
The "RESET" section was updated.
2-64
Figure 2-27 · Real-Time Counter System was updated.
2-35
Table 2-19 • Flash Memory Block Pin Names was updated.
2-43
Figure 2-33 • Flash Memory Block Diagram was updated to include AUX block
information.
2-45
Figure 2-34 • Flash Memory Block Organization was updated to include AUX block
information.
2-46
The note in the "Program Operation" section was updated.
2-48
Figure 2-76 • Gate Driver Example was updated.
2-95
The "Analog Quad ACM Description" section was updated.
2-130
Information about the maximum pad input frequency was added to the "Gate Driver"
section.
2-94
Figure 2-65 • Analog Block Macro was updated.
2-81
Figure 2-65 • Analog Block Macro was updated.
2-81
The "Analog Quad" section was updated.
2-84
The "Voltage Monitor" section was updated.
2-86
The "Direct Digital Input" section was updated.
2-89
The "Current Monitor" section was updated.
2-90
Information about the maximum pad input frequency was added to the "Gate Driver"
section.
2-94
Revision 4
5- 15
Datasheet Information
Revision
Advance v0.3
(continued)
5- 16
Changes
Page
The "Temperature Monitor" section was updated.
2-96
EQ 2 is new.
2-103
The "ADC Description" section was updated.
2-102
Figure 2-16 • Fusion Clocking Options was updated.
2-20
Table 2-46 · Analog Channel Specifications was updated.
2-118
The notes in Table 2-72 • Fusion Standard and Advanced I/O – Hot-Swap and 5 V
Input Tolerance Capabilities were updated.
2-144
The "Simultaneously Switching Outputs and PCB Layout" section is new.
2-149
LVPECL and LVDS were updated in Table 2-81 • Fusion Standard and Advanced I/O
Attributes vs. I/O Standard Applications.
2-157
LVPECL and LVDS were updated in Table 2-82 • Fusion Pro I/O Attributes vs. I/O
Standard Applications.
2-158
The "Timing Model" was updated.
2-161
All voltage-referenced Minimum and Maximum DC Input and Output Level tables
were updated.
N/A
All Timing Characteristic tables were updated
N/A
Table 2-83 • Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions was updated.
2-165
Table 2-79 • Summary of I/O Timing Characteristics – Software Default Settings
was updated.
2-134
Table 2-93 • I/O Output Buffer Maximum Resistances 1 was updated.
2-171
The "BLVDS/M-LVDS" section is new. BLVDS and M-LVDS are two new I/O
standards included in the datasheet.
2-211
The "CoreMP7 and Cortex-M1 Software Tools" section is new.
2-257
Table 2-83 • Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions was updated.
2-165
Table 2-79 • Summary of I/O Timing Characteristics – Software Default Settings
was updated.
2-134
Table 2-93 • I/O Output Buffer Maximum Resistances 1 was updated.
2-171
The "BLVDS/M-LVDS" section is new. BLVDS and M-LVDS are two new I/O
standards included in the datasheet.
2-211
The "108-Pin QFN" table for the AFS090 device is new.
3-2
The "180-Pin QFN" table for the AFS090 device is new.
3-4
The "208-Pin PQFP" table for the AFS090 device is new.
3-8
The "256-Pin FBGA" table for the AFS090 device is new.
3-12
The "256-Pin FBGA" table for the AFS250 device is new.
3-12
R e visio n 4
Fusion Family of Mixed Signal FPGAs
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "Fusion Device Status" table, is designated as either "Product Brief," "Advance,"
"Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
Revision 4
5- 17
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