USER GUIDE | UG:015 Analog HV and LV 6123 ChiP BCM® Bus Converter Evaluation Board User Guide Written by: Peter Makrum Applications Engineer April 2015 Contents Introduction Page 1 Enable Options 1 Fault Monitor Options 1 Contents 2 Features 3 Board Description 3 General Components 3 Test Points Description 6 Bill of Materials 11 Recommended Test Equipment 12 Basic Connections 13 Board Operation Details 13 Thermal Considerations 13 Paralleling 14 Introduction The 6123 Converter housed in a Package (ChiP) Bus Converter Module (BCM) evaluation board described in this document is designed to be used with the BCM family of isolated, DC-DC Bus converters. The Evaluation board is used for both the analog control, and digital control BCM products. The focus of this document is to assist the user in evaluating the analog control version of the BCM family. The BCM evaluation board can be configured for various enabling and fault monitoring schemes, as well as to exercise various loading conditions depending on the application requirements. The evaluation board can be used to evaluate BCMs in either a stand-alone configuration, or as an array of modules. It is important to remember the fast response of BCMs can readily show the limitations of the source, load, and associated wiring connected to the evaluation board. Care should be exercised to minimize the stray source and load impedance in order to fully exercise the BCM. Refer to the appropriate data sheet for performance and operating limits. Data sheets are available at www.vicorpower.com. Enable Options: 1. Apply input voltage greater than the BCM under voltage lockout. (Default) 2. On-board mechanical switch 3. External control using available test point Fault Monitor Options: 1. On-board LED: the VAUX pin drives a visible LED for visual feedback on the BCM status such as enabled or fault condition. UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 1 IMPORTANT NOTICE: Hazardous voltages are present on the HV BCM Evaluation Board under power. PERSONAL CONTACT WITH LINE VOLTAGE MAY RESULT IN SEVERE INJURY, DISABILITY, OR DEATH. IMPROPER OR UNSAFE HANDLING OF THIS BOARD MAY RESULT IN SERIOUS INJURY OR DEATH. Read the precautions below entirely BEFORE using the BCM Evaluation Board. Do not operate the evaluation board unless appropriate bench safety precautions are in place to guarantee safety. The list below is not comprehensive and is not a substitute for common sense and good practice. n During operation, the power devices and surrounding structures can be operated safely at high temperatures. n Remove power and use caution when connecting and disconnecting test probes and interface lines to avoid inadvertent short circuits and contact with hot surfaces. n Never use a jumper in place of the fuse. n When testing electronic products always use approved safety glasses. Follow good laboratory practice and procedures. n Avoid creating ground loops when making measurements of the isolated input or output voltage. n Care should be taken to protect the user from accidental contact when under power. n Care should be taken to avoid reversing polarities if connecting to the opposite (solder) side of the board. n The product evaluation boards described in this document are designed for general laboratory evaluation, and are not suitable for installation in end user equipment. n Refer to the specific BCM module data sheet for electrical, thermal, and mechanical product details. These boards provide a convenient way to evaluate/demonstrate the performance of Vicor’s BCM products. Kelvin connections are provided for accurate voltage measurements on power nodes. Sockets are provided to permit quick installation and changing of bulk filtering capacitors. The evaluation board also provides lugs for Input / output connections, test points and sockets for easy connection to standard test equipment, and a high performance air cooled heatsink assembly. Contents The evaluation board arrives with the following contents: n 1 x BCM evaluation board n 1 x Top heatsink pre-installed as well as a bottom of the ChiP heatsink when applicable n 1 x hardware kit: n 1 x through-hole aluminum-electrolytic output capacitor (C121) n 3 x Connector Receptacle 8 position n 2 x Connector socket 2 position n 5 x size 10 screws, lugs and washers UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 2 Features The BCM evaluation board has the following features: 1. Input and output lugs for source and load connections 2. Appropriately rated input fuse 3. Input Aluminum Electrolytic capacitor for additional source decoupling 4. Basic output filtering footprint, including sockets to add through-hole output Aluminum Electrolytic capacitors 5. Toggle switch for enabling and disabling the BCM via the enable (EN) pin 6. Oscilloscope probe jack for accurate, high frequency output voltage measurements 7. Connectors for BCM signal pins (TM, EN, and VAUX) and temperature monitor filtered signal 8. Kelvin voltage test points for all power pins 9. Top and bottom heatsink assembly for the BCM where applicable Board Description The following section provides a detailed description of the evaluation board components, test points and sockets. General Components 1. BCM (PS01) 2. Input lugs: Sized for #10 hardware. Use for making connection to the input source. This board does not contain reverse polarity protection. Check for proper polarity before applying the power. It is important to remember that noise from the source and voltage drops, will appear at the output of he bus converter multiplied by transformation ratio (K). The K factor is the ratio of the output voltage to the input voltage (VOUT / VIN). 3. Input fuse (F101 & F102): Appropriately rated for the BCM model installed on the board. The fuse is not meant to protect the module. 4. Input filtering: Aluminum Electrolytic input capacitor (C101). 5. Enable / Disable switch (SW101): When actuator is in top position towards “ON” text on the board, the (EN) pin will be open and the BCM will be enabled. When actuator is in bottom position towards “OFF” text on the board, the (EN) pin will be connected to (-IN) pin and the BCM will be disabled. When switch (SW101) is “ON”, an external voltage source can control the EN pin state. 6. Signal connector (J102): provides access to the bus converter signal pins (TM, EN, and VAUX) as well as (TM_DC) externally filtered signal. All signal pins are reference to the primary non-isolated voltage return (-IN) pin. UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 3 Figure 1 BCM Signal connector (J102) 2 –VIN 4 –VIN 6 –VIN 1 3 5 TM_PWM EN TM_DC 8 –VIN 7 VAUX n Temperature Monitor (TM): The BCM (TM) pin outputs a 250kHz PWM signal. A 1kΩ and a 10nF is the recommended low pass filtering solution. (TM_PWM) and filtered (TM_DC) are both accessible on (J102) connector header. (TM_DC) measures 1.27 V for a 27°C internal temperature corresponding to a (TM_PWM) duty cycle of 38.48%. n Enable Control (EN): Connecting the BCM (EN) pin to (–IN) will disable the module. (SW101) can be used to turn off the power train and disable the module. The (EN) pin is internally pulled up. This connector can be used to bus the (EN) pin in an array allowing array synchronous startup. n Auxiliary Voltage Source (VAUX): The BCM (VAUX) can be used as a fault flag it is internally driven low during a fault condition. The (VAUX) pin can also be used as a ready to process full power flag. A 2ms delay from power train active is introduced on this pin signaling the end of soft-start. During normal operation this pin can be used as an auxiliary supply up to 4mA max load. 7. Output lugs: Sized for #10 hardware. Use these lugs to connect the output directly to the load. 8. Output oscilloscope probe Jack (J101): Used for making accurate scope measurements of the output voltage (e.g. ripple). The jack is directly compatible with many common passive voltage probes models. Remove the grounding lead and insulating barrel of the probe and insert the probe tip and barrel directly into the jack, ensuring that the probe tip sits in the center socket of the jack. To avoid the risk of an inadvertent short circuit, do not attempt to install while power is applied. This Johnson Jack is kelvin connected to the module output pins. The effect of the output capacitors will not be noticeable. 9. Output filter: 10x output ceramic capacitors 1206 footprint provision (C103, C104, C113, C114, C115, C116, C117, C118, C119, and C120). In addition to socket (C121) that can be used for easy installation of an Aluminum Electrolytic output capacitor included with in hardware kit of the evaluation board. 10. Isolation barrier: R106, R107, R108 each are a 2010 package. The footprint can be used to provide a convenient means to short the isolation barrier or provided an additional AC path using capacitors. UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 4 Figure 2 PCB#42030 evaluation board photo, top side UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 5 Test Points Description Test nodes are labeled and include an SMT test point for attaching miniature probes, clips or hooks. Table 1 Primary referenced test point descriptions Name Description Provide measurement test points for the input voltage of +VIN, –VIN the BCM module. Test points are Kelvin connected to the module input pins. EN TM_DC TM_PWM VAUX Table 2 Secondary referenced test point descriptions Name Used to measure the BCM EN pin relative to –VIN. Used to measure the filtered BCM TM signal using a recommended low pass filter relative to –VIN. Used to measure the BCM TM pin which is a pulse width modulated output signal relative to –VIN. Used to measure the BCM VAUX pin output signal relative to –VIN. Description Provide measurement test points for the output voltage of +VOUT, –VOUT the BCM module. Test points are Kelvin connected to the module output pins. UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 6 UG:015 vicorpower.com -IN +IN -VIN FID101 -VIN +IN C102 29400-103 0603 0.01uF TM_DC FID102 37688 40A FUSE F102 19924 5A F101 TM_DC TP113 -VIN TM_PWM TP114 1SW101 2 3 FID103 -VIN J102 CAP ALEL 10uF 20% 450V RAD FID104 2 4 6 8 EN TP112 TM_PWM -VIN 0603 14695-7500 750 R102 TP101 +VIN TP102 -VIN -VIN +VIN 0603 15462-0R00 0603 14695-00R0 R105 0603 15462-0R00 R104 R103 Kelvin VAUX TP115 EN_NON-COM CONN HEADER R/A .100 8P OS A33079-ND / 5103166-2 41009 1 3 5 7 LED 40058 0805 D101 TM_PWM TM_DC EN_NON-COM VAUX C101 30799 SW_GT11MSABE 40538 BCM ON/OFF CONTROL 0603 15462-1001 R101 1K TP106 PRIMARY i PRIMARY i SER-IN EN SER-OUT Kelvin TP105 TP111 TP110 TP109 -VIN -IN +IN PS01 R108 DNP 2010 DNP DNP R106 2010 DNP DNP CHASSIS_GND 2010 DNP DNP DNP ISOLATION BOUNDRY -OUT +OUT -VOUT +VOUT SECONDARY i SECONDARY i -VOUT HSGND SECONDARY R107 DNP HS01 GND PRIMARY VAUX CL EN DA TM AD 6123 LV / HV BCM EMI TP108 Kelvin DNP C104 1uF 1206 25185-105 TP107 C103 1uF 1206 25185-105 DNP TP104 -VOUT Kelvin TP103 33292 J101 DNP C114 1uF 1206 25185-105 +VOUT C113 1uF 1206 25185-105 DNP C115 1uF 1206 25185-105 DNP -VOUT +VOUT C116 1uF 1206 25185-105 DNP C117 1uF 1206 25185-105 DNP C118 1uF 1206 25185-105 DNP C119 1uF 1206 25185-105 DNP -OUT +OUT C120 1uF 1206 25185-105 DNP H02 30799 C121 H01 DNP PCB#42030 evaluation board schematic 1 Figure 3 Applications Engineering: 800 927.9474 Page 7 UG:015 vicorpower.com -IN +IN -VIN FID101 -VIN +IN C102 29400-103 0603 0.01uF TM_DC FID102 37688 40A FUSE F102 19924 5A F101 TM_DC TP113 -VIN TM_PWM TP114 1SW101 2 3 FID103 -VIN 1 3 5 7 J102 2 4 6 8 LED 40058 0805 D101 C101 30799 FID104 CAP ALEL 10uF 20% 450V RAD TM_PWM 0603 14695-7500 750 TP101 +VIN TP102 -VIN -VIN +VIN 0603 15462-0R00 0603 14695-00R0 R105 0603 15462-0R00 R104 R103 Kelvin VAUX TP115 EN_NON-COM R102 -VIN EN TP112 CONN HEADER R/A .100 8P OS A33079-ND / 5103166-2 41009 TM_PWM TM_DC EN_NON-COM VAUX SW_GT11MSABE 40538 BCM ON/OFF CONTROL 0603 15462-1001 R101 1K TP106 PRIMARY i PRIMARY i SER-IN EN SER-OUT Kelvin TP105 TP111 TP110 TP109 -VIN * -IN +IN CL DA AD R108 DNP 2010 DNP DNP R106 2010 DNP DNP CHASSIS_GND 2010 DNP DNP DNP -OUT +OUT -VOUT +VOUT SECONDARY i SECONDARY i -VOUT HSGND SECONDARY ISOLATION BOUNDRY 6123 R107 DNP HS01 GND PRIMARY VAUX PS01 EN TM 6123 LV / HV Isolated BCM EMI TP108 Kelvin DNP C104 1uF 1206 25185-105 TP107 C103 1uF 1206 25185-105 DNP TP104 -VOUT Kelvin TP103 33292 J101 DNP C114 1uF 1206 25185-105 +VOUT C113 1uF 1206 25185-105 DNP C115 1uF 1206 25185-105 DNP -VOUT +VOUT C116 1uF 1206 25185-105 DNP C117 1uF 1206 25185-105 DNP C118 1uF 1206 25185-105 DNP C119 1uF 1206 25185-105 DNP -OUT +OUT C120 1uF 1206 25185-105 DNP H02 30799 C121 H01 DNP PCB#42143 evaluation board schematic 1 Figure 4 Applications Engineering: 800 927.9474 Page 8 Figure 5 PCB#42030 evaluation board Figure 6 BPCB#42030 evaluation board UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 9 Figure 7 PCB#42143 evaluation board Figure 8 PCB#42143 evaluation board UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 10 Bill of Materials Following table describes the design specific components of all 6123 BCM evaluation board. Table 3 BCM Evaluation board components common to all boards Reference Description Designator C101 Manufacturer CAP ALEL 10 µF 20% 450 V RAD C102 CAP X7R .010 µF 10% 50 V 0603 D101 DLED RED 0805 F101 F102 J101 J102 United Chemi-Con Murata Manufacturing Manufacturer Part Number EKXG451ELL100MK20S GRM188R71H103KA01D Rohm SML-211UTT86 Tektronix 131-5031-00 TE Connectivity Ltd 5-103166-2 Design specific - See Table 4 JACK VERTICAL MECH THRU HOLE CONN HEADER R/A .100 8POS 30AU HS01 Design specific - See Table 4 PCB Part Number Design specific - See Table 4 R103, R104, R105 RES 0 OHM JUMPER 1 A 0603 KOA Speer Electronics RK73Z1JTTD R102 RES 750 OHM 1/10W 5% 0603 KOA Speer Electronics RK73B1JTTD751J R101 RES 1K OHM 1/10W 1% 0603 KOA Speer Electronics RK73H1JTTD1001F SW Horizontal SPDT 1 POS SMD C&K Components GT11MSABETR SW101 UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 11 Table 4 BOM additions, components which are BCM model specific Reference Description Designator Manufacturer Manufacturer Part Number Evaluation board numbers: BCM6123E60E15A3T00; BCM6123E60E10A5T00 PS01 PCB Part Number F102 HS01 BCM6123T60E15A3T00; LV BCM Vicor Corporation BCM Evaluation Board Vicor Corporation 42030 Littelfuse 0456040.DR Vicor Corporation 42676 FUSE 40A 60VAC FAST 4.5X12.5 SMD BOM HEATSINK, TOP BCM6123T60E10A5T00 Evaluation board numbers: BCD384P120T1K5AC0; BCD384P120T800AC0; BCD384P120T1K5ACR; BCD384P120T800ACR BCM384P120T1K5AC0; PS01 HV BCM Vicor Corporation BCM384P120T800AC0; BCM384P120T1K5ACR; BCM384P120T800ACR PCB Part Number BCM Evaluation Board Vicor Corporation 42030 F101 FUSE PC-TRON PCI 5A Cooper Industries PCI-5-R HS01 BOM HEATSINK, TOP Vicor Corporation 42676 Evaluation board numbers: BCD400P500T1K8A30; BCD380P475T1K2A30; BCD380P475T800A30; BCD400P500T1K8A3R; BCD380P475T1K2A3R; BCD380P475T800A3R BCM400P500T1K8A30; BCM380P475T1K2A30; PS01 HV BCM Vicor Corporation BCM380P475T800A30; BCM400P500T1K8A3R; BCM380P475T1K2A3R; BCM380P475T800A3R PCB Part Number BCM Evaluation Board Vicor Corporation 42143 F101 FUSE PC-TRON PCI 5A Cooper Industries PCI-5-R Vicor Corporation 40528 HS01 BOM ASSY 6123 DUAL HTSNK NO TIM FOR 11 MM Recommended Test Equipment The following is a list of recommended test equipment. 1. Safety glasses 2. DC power supply: Refer to the specific BCM model datasheet to ensure the supply has sufficient power and current capability 3. Electronic load: Refer to the specific BCM model datasheet to ensure the load has sufficient power handling and current capability for testing 4. Cooling fan 5. Digital multi-meters (DMMs) 6. Oscilloscope and probes 7. Interconnect wires, cables and fastening hardware UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 12 Basic Connections n Confirm bench equipment is powered off. n Connect the input DC power supply positive lead to the +IN input lug of the evaluation board, connect the input power supply negative lead to the –IN input lug of the evaluation board. n Connect the CHASSIS_GND lug of the evaluation board to a safety “green wire” earth ground. n Connect the +OUT lug of the evaluation board to the electronic load positive input, connect the –OUT lug of the evaluation board to the electronic load negative input. n Verify proper polarity of the connections. n Verify (SW101) desired actuator position. n Direct airflow from the cooling fan through the BCM heatsink fins. n Have the latest BCM datasheet on hand for reference. Board Operation Details n SW01 provides control over enable. n In the “OFF” position, the switch will connect –IN pin to the EN net, which disables the BCM. n In the “ON” position, the EN net is allowed to float. n External connection to EN is permitted using the EN test point. (SW01) should be set to “ON” to allow external control. n The (J102) paralleling connectors can be used to connect EN nets across different boards. Note: to enable the BCMs in a parallel array, all boards need (SW01) set to “ON” to avoid pulling the EN node low. n The heatsink assembly of the BCM is connected to the CHASSIS_GND lug. A connection from the CHASSIS_GND lug to earth ground is required for safety as the heatsink will be floating otherwise. n The visible LED at D101 and its bias resistor network (R102 & R105) are connected to the VAUX pin. LED turns “ON” when VAUX is high signaling that the BCM is ready to process full power. n Primary input voltage greater than the undervoltage lockout must be applied to enable the BCM power train. This applies to all products listed in this document which includes reversible products. Thermal Considerations The evaluation board is supplied with a pre-installed 11mm double sided heatsink assembly for PCB#42143 and a 27mm top only for PCB#42030. A fan blowing across the evaluation board and heat sink assembly is required during operation at load. The fan should be placed about 4 inches away from the evaluation board facing the output voltage side. A typical bench top fan is recommended providing about 1000 LFM. Using the supplied rubber feet is also required in order to elevate the board about 0.4 inches off a flat surface and enable air flow underneath the PCB. The PCB top layer used for the 42676 heatsink ChiP is required to be of the same potential of the heatsink this is to allow heat transfer from the bottom of the ChiP and leads to the heatsink. CHOMERICS GEL-8010 is used on both top and bottom surface of the ChiP. (Between the ChiP top and heatsink as well as the ChiP bottom and the PCB). It is also required to apply to the heatsink extended surface resting on the PCB. UG:015 vicorpower.com Applications Engineering: 800 927.9474 Page 13 Paralleling The paralleling and sharing performance of multiple BCMs can be easily demonstrated by stacking multiple evaluation boards and interconnecting the inputs and outputs with standoffs to create a parallel array. Each BCM in an array operates in the same way as it does as a stand-alone unit. With equal impedance, the load is effectively shared across multiple BCMs. Mismatches in this case are modest, and are further canceled by an effective negative voltage vs. temperature coefficient. The following connections and settings should be used for an array of BCM evaluation boards: n All BCMs in a parallel array must be the same model. n The boards should be physically stacked using metal standoffs at the +IN & –IN lugs, the +OUT & –OUT lugs, and the CHASSIS_GND lug. This also connects these nodes electrically so that a single source, single load, and earth ground connection can be made to the system. n The +IN lugs are required to be connected together for an array of BCMs. n Standoffs must be sufficient in length to avoid contact between boards, and to permit airflow to all BCMs in the system. n If coordinated enable control then the paralleling connectors (J102) can be used to easily interconnect the EN pin across boards. n The paralleling connector receptacle (J102) is provided to daisy chain EN signal and –VIN. The will accept a wire size range 26 - 22 AWG, 0.12 - 0.3mm2 wires. The paralleling and current sharing capability of the devices can be demonstrated by stacking multiple evaluation board and interconnecting the inputs and outputs with standoffs of sufficient current rating to create a parallel array. If synchronous startup is desired, connect EN pin 5 and –VIN pin 6 in (J102) using a twisted pair to all respective pins in different paralleled units. Figure 9 BCM evaluation boards stacked to form a high power parallel array, using common -IN and the paralleling connectors. Paralleling of BCM evaluation board. Rev 1.5 11/2016 vicorpower.com Applications Engineering: 800 927.9474 Page 14