Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LMH1226 SNLS517A – FEBRUARY 2016 – REVISED MARCH 2016 LMH1226 Low Power Dual Output 12G UHD Reclocker 1 Features 3 Description • The LMH1226 is a low-power dual-output 12G UHD reclocker. It supports SMPTE video rates up to 11.88 Gbps and 10 GbE video over IP, enabling UHD video for 4K/8K applications. An adaptive board trace equalizer at IN1 is SFF-8431 compatible and supports both SMPTE and 10 GbE data rates. 1 • • • • • • • • • • • • • Supports ST-2082-1(12G), ST-2081-1(6G), ST424(3G), ST-292(HD), and ST-259(SD) Supports SFF8431 (SFP+) for SMPTE 2022-5/6 Compatible with DVB-ASI and AES10 (MADI) Reference-Less Reclocker Locks to SMPTE and 10 GbE Rates: 11.88 Gbps, 5.94 Gbps, 2.97 Gbps, 1.485 Gbps, or Divide-by-1.001 Sub-Rates, 270 Mbps, and 10.3125 Gbps Reference Free with Fast Lock Time Adaptive Board Trace Equalizer at Input 1 (IN1) Low Power: 214 mW (typical) Power Save Mode: 16 mW Integrated 1:2 Fanout Outputs with De-Emphasis On-Chip Loop Filter and Eye Opening Monitor Powers from Single 2.5 V with On-Chip 1.8 V Regulator Configurable by Control Pins, SPI, or SMBus Interface 4 mm x 4 mm 24-Pin QFN Package Operating Temperature Range: -40°C to 85°C The reclocker attenuates high frequency jitter and provides the best signal integrity. High input jitter tolerance of the reclocker improves timing margin. The reclocker has built-in loop filter and operates without the need of a precision input reference clock. A non-disruptive eye monitor allows for real time measurement of the serial data to simplify system debug and accelerate board bring-up. The integrated 1:2 Fanout provides flexibility for multiple video signals. The output drivers offer programmable de-emphasis to compensate board trace losses at its outputs. The typical power consumption of LMH1226 is 214 mW. In the absence of input signal, power is further reduced to 16 mW. The LMH1226 is pin compatible with the LMH1219 (12G UHD cable equalizer with integrated reclocker). Device Information(1) 2 Applications • • • • • SMPTE Compatible Serial Digital Interface (SDI) UHDTV/4K/8K/HDTV/SDTV Video Broadcast Video Routers, Switchers, and Monitors Digital Video Processing and Editing 10 GbE - SDI Media Gateway PART NUMBER PACKAGE BODY SIZE (NOM) LMH1226 QFN (24) 4 mm x 4 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Block Diagram IN1± 2 Diff 100 Ÿ Term PCB EQ Reclocker Data with Integrated Clock LoopFilter, EyeMon OUT_MUX Power Management LDO Single 2.5 V or Dual 2.5 V and 1.8 V VDD_LDO Control Logic Control Lock Pins Indicator 100-Ÿ Driver 2 100-Ÿ Driver 2 OUT0± OUT1± Serial Interface SPI or SMBus 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMH1226 SNLS517A – FEBRUARY 2016 – REVISED MARCH 2016 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 1 1 1 2 3 5.1 5.2 5.3 5.4 6 Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 3 3 3 3 Mechanical, Packaging, and Orderable Information ............................................................. 3 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (February 2016) to Revision A • 2 Page Product Preview to Production Data ..................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMH1226 LMH1226 www.ti.com SNLS517A – FEBRUARY 2016 – REVISED MARCH 2016 5 Device and Documentation Support 5.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMH1226 3 PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMH1226RTWR ACTIVE WQFN RTW 24 3000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 L1226A2 LMH1226RTWT ACTIVE WQFN RTW 24 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 L1226A2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 28-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH1226RTWR WQFN RTW 24 3000 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH1226RTWT WQFN RTW 24 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH1226RTWR WQFN RTW 24 3000 367.0 367.0 35.0 LMH1226RTWT WQFN RTW 24 250 213.0 191.0 55.0 Pack Materials-Page 2 MECHANICAL DATA RTW0024A SQA24A (Rev B) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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