1 of 3 Creation Date : May 25, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216X6S1A106K085AB TDK item description C3216X6S1A106KT**** Applications Commercial Grade Feature General General (Up to 50V) Series C3216 [EIA 1206] Status Production (Not Recommended for New Design) Size Length(L) 3.20mm ±0.20mm Width(W) 1.60mm ±0.20mm Thickness(T) 0.85mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 2.10mm to 2.50mm(Flow Soldering) Recommended Land Pattern (PA) 2.00mm to 2.40mm(Reflow Soldering) 1.10mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PB) 1.00mm to 1.20mm(Reflow Soldering) 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PC) 1.10mm to 1.60mm(Reflow Soldering) Electrical Characteristics Capacitance 10μF ±10% Rated Voltage 10VDC Temperature Characteristic X6S(±22%) Dissipation Factor (Max.) 10% Insulation Resistance (Min.) 10MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 25, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216X6S1A106K085AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C3216X6S1A106K085AB ESR C3216X6S1A106K085AB Capacitance C3216X6S1A106K085AB C3216X6S1A106K085AB Temperature Characteristic C3216X6S1A106K085AB(No Bias) DC Bias Characteristic C3216X6S1A106K085AB(DC Bias = 5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C3216X6S1A106K085AB(100kHz) C3216X6S1A106K085AB(500kHz) C3216X6S1A106K085AB(1MHz) Multilayer Ceramic Chip Capacitors C3216X6S1A106K085AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 25, 2017 (GMT)