SN54LS377, SN54LS378, SN54LS379, SN74LS377, SN74LS378, SN74LS379 OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE SDLS167 – OCTOBER 1976 – REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54LS377, SN54LS378, SN54LS379, SN74LS377, SN74LS378, SN74LS379 OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE SDLS167 – OCTOBER 1976 – REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS377, SN54LS378, SN54LS379, SN74LS377, SN74LS378, SN74LS379 OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE SDLS167 – OCTOBER 1976 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54LS377, SN54LS378, SN54LS379, SN74LS377, SN74LS378, SN74LS379 OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE SDLS167 – OCTOBER 1976 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8992501EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8992501EA SNJ54LS378J JM38510/32504BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BRA JM38510/32504BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BRA JM38510/32504BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BSA JM38510/32504BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BSA M38510/32504BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BRA M38510/32504BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BRA M38510/32504BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BSA M38510/32504BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 32504BSA SN54LS377J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS377J SN54LS377J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS377J SN54LS378J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS378J SN54LS378J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS378J SN54LS379J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS379J SN54LS379J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS379J SN74LS377DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS377 SN74LS377DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS377 SN74LS377DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS377 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74LS377DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS377 SN74LS377DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS377 SN74LS377DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS377 SN74LS377N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS377N SN74LS377N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS377N SN74LS377N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS377N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS377NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS377N SN74LS377NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS377N SN74LS377NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS377 SN74LS377NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS377 SN74LS378D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS378 SN74LS378D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS378 SN74LS378DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS378 SN74LS378DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS378 SN74LS378N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS378N SN74LS378N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS378N SN74LS378N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS378N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS379D OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74LS379D OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74LS379J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70 SN74LS379J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70 SN74LS379N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS379N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SNJ54LS377J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS377J SNJ54LS377J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS377J SNJ54LS377W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS377W SNJ54LS377W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS377W SNJ54LS378FK OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 SNJ54LS378FK OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 SNJ54LS378J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8992501EA SNJ54LS378J SNJ54LS378J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8992501EA SNJ54LS378J SNJ54LS379FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 379FK SNJ54LS379FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 379FK SNJ54LS379J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS379J SNJ54LS379J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS379J (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS377, SN54LS378, SN54LS379, SN74LS377, SN74LS378, SN74LS379 : • Catalog: SN74LS377, SN74LS378, SN74LS379 • Military: SN54LS377, SN54LS378, SN54LS379 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS377DWR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74LS377NSR SO NS 20 2000 330.0 24.4 9.0 13.0 2.4 12.0 24.0 Q1 SN74LS378DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS377DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS377NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS378DR SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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