CYSTEKEC DTC115TS3-0-T1-G Npn digital transistors (built-in resistors) Datasheet

Spec. No. : C358S3
Issued Date : 2004.03.09
Revised Date :2016.07.18
Page No. : 1/6
CYStech Electronics Corp.
NPN Digital Transistors (Built-in Resistors)
DTC115TS3
Features
• Built-in bias resistors enable the configuration of an inverter circuit without connecting external input
resistors (see equivalent circuit).
• The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the
input. They also have the advantage of almost completely eliminating parasitic effects.
• Only the on/off conditions need to be set for operation, making device design easy.
• Complements the DTA115TS3.
• Pb-free & Halogen-free package.
Equivalent Circuit
Outline
DTC115TS3
SOT-323
C
B
C
R1
E
R1=100 kΩ
B:Base
C:Collector
E:Emitter
B
E
Ordering Information
Device
DTC115TS3-0-T1-G
Package
SOT-323
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
DTC115TS3
CYStek Product Specification
Spec. No. : C358S3
Issued Date : 2004.03.09
Revised Date :2016.07.18
Page No. : 2/6
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
Pd
Tj
Tstg
50
50
5
100
200
150
-55~+150
V
V
V
mA
mW
°C
°C
Electrical Characteristics (Ta=25°C)
Parameter
Symbol
Min. Typ. Max.
Unit
Test Conditions
Collector-Base Breakdown Voltage
VCBO
50
-
-
V
IC=50μA
Collector-Emitter Breakdown Voltage
VCEO
50
-
-
V
IC=1mA
Emitter-Base Breakdown Voltage
VEBO
5
-
-
V
IE=50μA
Collector-Base Cutoff Current
ICBO
-
-
0.5
μA
VCB=50V
Emitter-Base Cutoff Current
IEBO
-
-
0.5
μA
VEB=4V
VCE(sat)
-
-
0.3
V
IC=1mA, IB=0.1mA
DC Current Gain
hFE
100
-
600
-
VCE=5V, IC=1mA
Input Resistance
R
70
100
130
kΩ
Transition Frequency
fT
-
250
-
MHz
Collector-Emitter Saturation Voltage
VCE=10V, IC=5mA, f=100MHz *
* Transition frequency of the device
Recommended Soldering Footprint
DTC115TS3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C358S3
Issued Date : 2004.03.09
Revised Date :2016.07.18
Page No. : 3/6
Typical Characteristics
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
Saturation Voltage---(mV)
Current Gain---HFE
1000
100
HFE@VCE=5V
100
VCESAT@IC=20IB
VCESAT@IC=10IB
10
10
0.1
1
10
Collector Current---IC(mA)
100
0.1
1
10
Collector Current --- IC(mA)
100
Power Derating Curve
Power Dissipation---PD(mW)
250
200
150
100
50
0
0
DTC115TS3
50
100
150
Ambient Temperature --- Ta(℃ )
200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C358S3
Issued Date : 2004.03.09
Revised Date :2016.07.18
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
DTC115TS3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C358S3
Issued Date : 2004.03.09
Revised Date :2016.07.18
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
DTC115TS3
CYStek Product Specification
Spec. No. : C358S3
Issued Date : 2004.03.09
Revised Date :2016.07.18
Page No. : 6/6
CYStech Electronics Corp.
SOT-323 Dimension
Marking:
3
Q
A1
1
C
Device Code
Lp
2
8U
TE
□□
A
detail Z
bp
e1
W
B
e
Date Code
E
D
A
Z
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
θ
He
0
v
A
2 mm
1
Style: Pin 1.Base 2.Emitter 3.Collector
scale
*: Typical
Inches
Min.
Max.
0.0315 0.0433
0.0000 0.0039
0.0078 0.0157
0.0031 0.0059
0.0709 0.0866
0.0453 0.0531
0.0472 0.0551
DIM
A
A1
bp
C
D
E
e
Millimeters
Min.
Max.
0.80
1.10
0.00
0.10
0.20
0.40
0.08
0.15
1.80
2.20
1.15
1.35
1.20
1.40
DIM
e1
He
Lp
Q
v
w
θ
Inches
Min.
Max.
0.0256*
0.0846 0.0965
0.0105 0.0181
0.0051 0.0091
0.0079
0.0079
0°
8°
Millimeters
Min.
Max.
0.65*
2.15
2.45
0.26
0.46
0.13
0.23
0.2
0.2
0°
8°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DTC115TS3
CYStek Product Specification
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