DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5% sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512 Product specification – June 21, 2016 V.5 RoHS compliant & Halogen free Product specification Chip Resistor Surface Mount AF 9 SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER This specification describes AF0201 to AF2512 chip resistors with anti-sulfuration capabilities. Part number is identified by the series name, size, tolerance, packaging type, temperature coefficient, taping reel and resistance value. APPLICATIONS Industrial Equipment Power Application Networking Application High-end Computer & Multimedia Electronics in high sulfur environment Automotive electronics 2 0201 to 2512 SERIES GLOBAL PART NUMBER AF XXXX X X X XX XXXX L (1) (2) (3) (4) (5) (6) (7) (1) SIZE 0201/0402/0603/0805/1206/1210/1218/2010/2512 (2) TOLERANCE D = ± 0.5% F = ± 1% J = ± 5% (for jumper ordering, use code of J) FEATURES AEC-Q200 qualified Superior resistance against sulfur containing atmosphere Halogen free product and production RoHS compliant Reduces environmentally hazardous waste High component and equipment reliability Saving of PCB space Moisture sensitivity level: MSL 1 (3) PACKAGING TYPE R = Paper taping reel K = Embossed plastic tape reel (4) TEMPERATURE COEFFICIENT OF RESISTANCE – = Base on spec (5) TAPING REEL 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel (6) RESISTANCE VALUE There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point. Detailed resistance rules are displayed in the table of “Resistance rule of global part number”. (7) DEFAULT CODE Letter L is system default code for ordering only (Note) Resistance rule of global part number Resistance coding rule Example XRXX (1 to 9.76 Ω) 1R = 1 Ω 1R5 = 1.5 Ω 9R76 = 9.76 Ω XXRX (10 to 97.6 Ω) 10R = 10 Ω 97R6 = 97.6 Ω XXXR (100 to 976 Ω) 100R = 100 Ω XKXX (1 to 9.76 KΩ) 1K = 1,000 Ω 9K76 = 9760 Ω XMXX (1 to 9.76 MΩ) 1M = 1,000,000 Ω 9M76= 9,760,000 Ω O RDERING EXAMPLE The ordering code for an AF0402 chip resistor, value 100 KΩ with ± 1% tolerance, supplied in 7-inch tape reel with 10Kpcs quantity is: AF0402FR-07100KL. NOTE 1. All our R-Chip products are RoHS compliant and Halogen free. "LFP" of the internal 2D reel label states "Lead-Free Process" 2. On customized label, "LFP" or specific symbol can be printed www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF SERIES 3 9 0201 to 2512 MARKING AF0201 / AF0402 No marking Fig. 1 AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512 03 Fig. 2 Value=10 KΩ E-24 series: 3 digits, ±5%, ≥10Ω First two digits for significant figure and 3rd digit for number of zeros AF0603 0 Fig. 3 Value = 24 Ω E-24 series: 3 digits, ± 1% One short bar under marking letter E-96 series: 3 digits, ± 1% First two digits for E-96 marking rule and 3rd letter for number of zeros Fig. 4 Value = 12.4 KΩ AF0805 / AF1206 / AF1210 / AF2010 / AF2512 Fig. 5 Value = 10 KΩ Both E-24 and E-96 series: 4 digits, ± 1% First three digits for significant figure and 4th digit for number of zeros AF1218 Fig. 6 Value = 10 KΩ 00 Fig. 7 Value = 10 KΩ E-24 series: 3 digits, ± 5% First two digits for significant figure and 3rd digit for number of zeros Both E-24 and E-96 series: 4 digits, ± 1% First three digits for significant figure and 4th digit for number of zeros NOTE For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF CONSTRUCTION The resistors are constructed on top of a high grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The resistive glaze is covered by a glass. The composition of the glaze is adjusted to give the approximate required resistance value and laser trimming of this resistive glaze achieves the value within tolerance. The whole element is covered by a protective overcoat. Size 0603 and bigger is marked with the resistance value on top. Finally, the two external terminations (Ni / matte tin) are added. See fig.8 DIMENSIONS Table 1 For outlines see fig. 8 TYPE L (mm) W (mm) H (mm) AF0201 I1 (mm) SERIES 0201 to 2512 4 9 OUTLINES For dimensions see Table 1 I2 (mm) 0.60± 0.03 0.30± 0.03 0.23± 0.03 0.12± 0.05 0.15± 0.05 AF0402 1.00 ± 0.05 0.50 ± 0.05 0.32 ± 0.05 0.20 ± 0.10 0.25 ± 0.10 AF0603 1.60 ± 0.10 0.80 ± 0.10 0.45 ± 0.10 0.25 ± 0.15 0.25 ± 0.15 AF0805 2.00 ± 0.10 1.25 ± 0.10 0.50 ± 0.10 0.35 ± 0.20 0.35 ± 0.20 Fig. 8 Chip resistor outlines AF1206 3.10 ± 0.10 1.60 ± 0.10 0.55 ± 0.10 0.45 ± 0.20 0.40 ± 0.20 AF1210 3.10± 0.10 2.60± 0.15 0.50± 0.10 0.45± 0.15 0.50± 0.20 AF1218 3.10± 0.10 4.60± 0.10 0.55± 0.10 0.45± 0.20 0.40± 0.20 AF2010 5.00± 0.10 2.50± 0.15 0.55± 0.10 0.55± 0.15 0.50± 0.20 AF2512 6.35± 0.10 3.10± 0.15 0.55± 0.10 0.60± 0.20 0.50± 0.20 www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF SERIES 5 9 0201 to 2512 ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS TYPE AF0201 RESISTANCE RANGE Operating Max. Max. Dielectric Temperature Working Overload Withstanding Range Voltage Voltage Voltage Jumper Criteria Rated Current 0.5A ± 5% (E24), 1Ωto 10MΩ ± 0.5%, ± 1% (E24/E96), 1Ω to 10MΩ Zero Ohm Jumper < 0.05Ω AF0402 AF0603 AF0805 Temperature Coefficient of Resistance 50 V 50 V 100 V 100 V Rated Current 1.0A 150 V Max. Current 2.0A 150 V 1 Ω≤ R ≤ 10 Ω, ± 200 ppm/°C 150 V 300 V 300 V 10 Ω< R ≤ 10 MΩ, ± 100 ppm/°C 10 MΩ< R ≤ 22 MΩ, ± 200 ppm/°C AF1210 AF1218 AF2010 AF2512 ± 5% (E24), 1Ω to 1MΩ ± 0.5%, ± 1% (E24/E96), 1Ω to 1M Zero Ohm Jumper < 0.05Ω ± 5% (E24), 1Ω to 10MΩ ± 0.5%, ± 1% (E24/E96), 1Ω to 10M Zero Ohm Jumper < 0.05Ω Rated Current 2.0A Max. Current 5.0A Rated Current 2.0A 200 V ± 5% (E24), 1Ω to 10MΩ ± 0.5%, ± 1% (E24/E96), 1Ω to 10M Zero Ohm Jumper < 0.05Ω 1.0A 50 V –55 °C to +155 °C AF1206 Max. Current 25 V 75 V ± 5% (E24), 1 Ω to 22 MΩ ± 0.5%, ± 1% (E24/E96), 1 Ω to 10 MΩ Zero Ohm Jumper < 0.05 Ω 1Ω≤ R ≤10Ω, -100/+350 ppm/°C 10Ω＜R ≤ 10MΩ, ± 200 ppm/°C 400 V 500 V Max. Current 10.0A Rated Current 2.0A 200 V 500 V 500 V Max. Current 10.0A 200 V 500 V 500 V 200 V 500 V 500 V 200V 500V 500V 1Ω≤ R≤ 10Ω, ±200 ppm/°C 10Ω＜R ≤ 10MΩ, ±100 ppm/°C Rated Current 2.0A Max. Current 10.0A Rated Current 2.0A Max. Current 10.0A www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF SERIES 6 9 0201 to 2512 FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special data sheet “Chip resistors mounting”. PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PACKING STYLE REEL DIMENSION AF0201 7" (178 mm) 10,000/20,000 10,000/20,000 13" (330 mm) 50,000 7" (178 mm) -- Paper taping reel (R) Embossed taping reel (K) AF0402 AF0603/0805/ 1206 AF1210 AF1218/2010/ 2512 5,000 5,000 -- 50,000 20,000 20,000 -- -- -- -- 4,000 NOTE 1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”. RESISTANCE TEMPERATURE COEFFICIENT OF RESISTANCE RANGE 100 mΩ to 910 mΩ PT040 FUNCTIONAL DESCRIPTION 2 OPERATING TEMPERATUR±E200 RAppm/°C NGE PT060 AF0201 - AF2512 Range: ± 200 ppm/°C 3 -55 °C to + 155 °C (Fig. 7) PT080 ± 200 ppm/°C 5 POWER100 RAMΩ TING TO 910 MΩ PT120type rated power at 70 °C: Each 100 mΩ 6 AF0201=1/20W (0.05W) AF0402=1/16 W (0.0625W) PT201 ± 100 ppm/°C AF0603=1/10 W (0.1W) 0 AF0805=1/8 W (0.125W) PT251 AF1206=1/4 W (0.25W) ± 100 ppm/°C 2 AF1210=1/2W (0.5W) AF1218=1W AF2010=3/4W (0.75W) AF2512=1W > 100 mΩ ± 75 ppm/°C ± 75 ppm/°C Fig. 7 Maximum dissipation (P max) in percentage of rated power as a function of the operating ambient temperature (T amb) R ATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V= (P X R) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω ) www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF SERIES 7 9 0201 to 2512 TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 At +25/–55 °C and +25/+125 °C Refer to table 2 MIL-STD-202 Method 304 Formula: R2–R1 T.C.R= ------------------------- × 106 (ppm/°C) R1(t2–t1) Where t1=+25 °C or specified room temperature t2=–55 °C or +125 °C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Life/Endurance IEC 60115-1 4.25 MIL-STD-202 Method 108 At 70± 2 °C for 1,000 hours, RCWV applied for 1.5 hours on, 0.5 hour off, still-air required ± (1.0%+0.05 Ω) High Temperature Exposure MIL-STD-202 Method 108 1,000 hours at 155±3℃ ± (1.0%+0.05 Ω) unpowered <100 mΩ for Jumper Moisture Resistance MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 hours, 3 cycles / 24 hours for 10d. with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered ± (0.5%+0.05 Ω) for 0.5%, 1% tol. Parts mounted on test-boards, without condensation on parts Thermal Shock MIL-STD-202 Method 107 –55 / +125 °C Number of cycles required is 300. Devices mounted Short Time Overload IEC60115-1 4.13 Bending IEC 60115-1 4.33 <100 mΩ for Jumper ± (1.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper ± (0.5%+0.05 Ω) for 0.5%, 1% tol. ± (1%+0.05 Ω) for 5% tol. Maximum transfer time is 20 seconds. Dwell time is 15 minutes <100 mΩ for Jumper 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 seconds at room temperature ± (1.0%+0.05 Ω) Chips mounted on a 90 mm glass epoxy resin PCB (FR4) ± (1.0%+0.05 Ω) Bending: 0201/0402: 5 mm 0603/0805: 3 mm 1206 & above: 2 mm No visible damage No visible damage <100 mΩ for Jumper Bending time: 60± 5 seconds www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF SERIES 8 9 0201 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Biased Humidity MIL-STD-202 method 103 1,000 hours; 85℃/85%R.H., 10% of operating 1Ω≤R≤1MΩ: ±(3%+0.05Ω) power. 1MΩ<R≤10MΩ: ±(5%+0.05Ω) Measurement at 24± 4 hours after test conclusion. Solderability - Resistance to Soldering Heat - Wetting IEC 60115-1 4.18 MIL-STD-202 Method 215 J-STD-002 Condition B, no pre-heat of samples ± (0.5%+0.05Ω) for 0.5%, 1% tol. Lead-free solder, 260± 5 °C, 10± 1 seconds immersion time ± (1.0%+0.05Ω) for 5% tol. Procedure 2 for SMD: devices fluxed and cleaned with isopropanol No visible damage Electrical test not required Well tinned (≥95% covered) Magnification 10X No visible damage <50 mΩfor Jumper SMD conditions: (a) Method B, aging 4 hours at 155 °C dry heat, lead-free solder bath at 245 °C (b) Method B, dipping at 215 °C for 3 seconds FOS ASTM-B-809-95* Sulfur 750 hours, 105 °C. unpowered ± (4.0%+0.05Ω) * Modified www.yageo.com Jun. 21, 2016 V.5 Product specification Chip Resistor Surface Mount AF SERIES 9 9 0201 to 2512 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 5 Jun. 21, 2016 - - Update test and requirement Version 4 Dec. 24, 2015 - - Update Dielectric Withstanding Voltage& Resistance value Version 3 Apr. 01, 2015 - - Modified test and requirements Version 2 Nov. 20, 2014 - - Tests and requirement update Version 1 Sep. 27, 2013 - - Size 0201/1210/1218/2010/2512 extend Version 0 Jan 07, 2011 - - First issue of this specification “ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any product change will be announced by PCN.” www.yageo.com Jun. 21, 2016 V.5