Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design HDC1010 SNAS685 – MAY 2016 HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor 1 Features 3 Description • • • • • • The HDC1010 is a digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The HDC1010 operates over a wide supply range, and is a low cost, low power alternative to competitive solutions in a wide range of common applications. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1010 is placed on the bottom part of the device, which makes the HDC1010 more robust against dirt, dust, and other environmental contaminants. The humidity and temperature sensors are factory calibrated and the calibration data is stored in the onchip non-volatile memory. • • • Relative Humidity Accuracy ±2% (typical) Temperature Accuracy ±0.2°C (typical) Excellent Stability at High Humidity 14 Bit Measurement Resolution 100 nA Sleep Mode Current Average Supply Current: – 710 nA @ 1 sps, 11 bit RH Measurement – 1.3 µA @ 1 sps, 11 bit RH and Temperature Measurement Supply Voltage 2.7 V to 5.5 V Tiny 2 mm x 1.6 mm Device Footprint I2C Interface Device Information 2 Applications • • • • • • • PART NUMBER HVAC IoT Smart Thermostats and Room Monitors Refrigerators Printers White Goods Medical Devices Wireless Sensor (TIDA: 00374, 00484, 00524) HDC1010 PACKAGE (1) BODY SIZE (NOM) DSBGA (8-bump) 2.04 mm x 1.59 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 4 Typical Application 3.3 V RH HDC1010 ADC TEMPERATURE 3.3 V 3.3 V VDD Registers and Logic 2 IC SDA SCL DRDYn ADR0 ADR1 MCU VDD 2 IC Peripheral GPIO OTP Calibration Coefficients GND GND Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW 1 HDC1010 SNAS685 – MAY 2016 www.ti.com 5 Device and Documentation Support 5.1 Documentation Support 5.1.1 Related Documentation Wireless Sensor Humidity & Temp Sensor Node for Star Networks Enabling 10+ Year Coin Cell Battery Life Ref Design TIDA-00374 Humidity & Temp Sensor Node for Sub-1GHz Star Networks Enabling 10+ Year Coin Cell Battery Life TIDA00484 Ultralow Power Multi-sensor Data Logger with NFC Interface Reference Design TIDA-00524 HDC1010 Texas Instruments Humidity Sensors, SNAA216 5.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. PRODUCT PREVIEW TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: HDC1010 PACKAGE OPTION ADDENDUM www.ti.com 15-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) HDC1010YPAR PREVIEW DSBGA YPA 8 3000 TBD Call TI Call TI -40 to 125 HDC1010YPAT PREVIEW DSBGA YPA 8 250 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-May-2016 Addendum-Page 2 PACKAGE OUTLINE YPA0008 DSBGA - 0.675 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B A E BALL A1 CORNER D 0.675 MAX C SEATING PLANE 0.265 0.215 BALL TYP 1 TYP D C 1.5 TYP 0.5 TYP B A 1 8X 0.005 C A 2 0.335 0.305 B 4215068/A 11/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT YPA0008 DSBGA - 0.675 mm max height DIE SIZE BALL GRID ARRAY 8X 0.275 0.250 (0.5) TYP 1 2 A (0.5) TYP B SYMM C D SYMM LAND PATTERN EXAMPLE SCALE:20X 0.05 MAX ( 0.263) METAL METAL UNDER MASK 0.05 MIN ( 0.263) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4215068/A 11/2013 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017). www.ti.com EXAMPLE STENCIL DESIGN YPA0008 DSBGA - 0.675 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.25) 1 (R0.05) TYP 2 A B SYMM (0.5) TYP METAL TYP C D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1mm THICK STENCIL SCALE:25X 4215068/A 11/2013 NOTES: (continued) 4. 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