Diodes DMT3003LFG 30v n-channel enhancement mode mosfet Datasheet

DMT3003LFG
Green
30V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
RDS(ON) Max
ID Max
TC = +25°C


Low RDS(ON) – Ensures On-State Losses are Minimized
Excellent QGD × RDS(ON) Product (FOM)
3.2mΩ @ VGS = 10V
100A


5.5mΩ @ VGS = 4.5V
85A
Advanced Technology for DC-DC Converts
Small Form Factor Thermally Efficient Package Enables Higher
Density End Products
Occupies Just 33% of the Board Area Occupied by SO-8 Enabling
Smaller End Product
100% UIS (Avalanche) Rated
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
BVDSS
30V





Description
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)), yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Applications
Mechanical Data




Case: PowerDI 3333-8

Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminal Finish – Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (Approximate)
Backlighting
Power Management Functions
DC-DC Converters




®
D
PowerDI3333-8
Pin 1
S
S
S
1
8
2
7
3
6
4
5
G
D
D
D
D
Top View
G
S
Top View
Internal Schematic
Bottom View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMT3003LFG-7
DMT3003LFG-13
Notes:
Case
PowerDI3333-8
PowerDI3333-8
Packaging
2,000/Tape & Reel
3,000/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
YYWW
Marking Information
SG2 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 16 = 2016)
WW = Week Code (01 to 53)
SG2
PowerDI is a registered trademark of Diodes Incorporated.
DMT3003LFG
Document number: DS37819 Rev. 2 - 2
1 of 7
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June 2016
© Diodes Incorporated
DMT3003LFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Continuous Drain Current (Note 5) VGS = 10V
TC = +25°C
TC = +70°C
TA = +25°C
TA = +70°C
Value
30
±20
100
90
ID
Units
V
V
A
IS
IDM
IAS
EAS
22
18
3
100
16
250
A
A
A
mJ
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
Value
2.4
52
62
2
-55 to +150
Units
W
°C/W
W
°C/W
°C
ID
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L=1mH
Avalanche Energy, L=1mH
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
TA = +25°C
TC = +25°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
30
—
—
—
—
—
—
1
V
μA
±100
nA
—
2.4
4
0.75
3
3.2
5.5
1
V
VSD
1
—
—
—
CISS
COSS
CRSS
RG
QG
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2,370
1,360
240
0.6
20
44
7
8
6.2
4.3
21
8
25
37
—
—
—
—
—
—
—
—
—
—
—
—
—
—
IGSS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(TH)
Static Drain-Source On-Resistance
RDS(ON)
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Bodyy Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
VGS = 0V, ID = 1mA
VDS = 24V, VGS = 0V
VGS = +20V, VDS = 0V
VGS = -16V, VDS = 0V
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 15A
VGS = 0V, IS = 10A
pF
VDS = 15V, VGS = 0V,
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDS = 15V, ID = 20A
ns
VDD = 15V, VGS = 10V,
RL = 0.75Ω, RG = 3Ω, ID = 20A
ns
nC
IF = 15A, di/dt = 500A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMT3003LFG
Document number: DS37819 Rev. 2 - 2
2 of 7
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June 2016
© Diodes Incorporated
DMT3003LFG
30
VGS = 10.0V
VGS = 4.5V
25.0
VDS = 5V
25
VGS = 4.0V
VGS = 3.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
30.0
20.0
VGS = 3.5V
15.0
VGS = 2.8V
10.0
5.0
85oC
125oC
10
0
150oC
0.5
1
1.5
-55oC
0.5
1.5
2
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
VGS = 4.5V
0.004
0.003
0.002
VGS = 10V
0.001
0
5
10
15
20
25
30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VDS, DRAIN-SOURCE VOLTAGE (V)
0.005
VGS = 10V
0.004
150oC
125oC
0.003
85oC
25oC
0.002
-55oC
0.001
0
5
10
15
20
25
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
ID = 20A
0.02
0.01
0
0
2
6
8
10
12
14
16
2
VGS = 10V, ID = 20A
1.5
1
VGS = 4.5V, ID = 15A
0.5
0
30
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
Document number: DS37819 Rev. 2 - 2
4
2.5
ID, DRAIN CURRENT (A)
DMT3003LFG
5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
0.005
0
1
Figure 1. Typical Output Characteristic
0.006
0
0
2
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
25oC
0
0.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
15
5
VGS = 2.5V
VGS = 2.2V
20
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Figure 6. On-Resistance Variation with Junction
Temperature
June 2016
© Diodes Incorporated
0.008
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMT3003LFG
0.007
0.006
VGS = 4.5V, ID = 15A
0.005
0.004
0.003
0.002
VGS = 10V, ID = 20A
0.001
2.5
2
ID = 1mA
1.5
ID = 250µA
1
0.5
0
0
-50
-25
0
25
50
75
100
125
-50
150
-25
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
20
10000
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
IS, SOURCE CURRENT (A)
0
15
TJ = 85oC
10
TJ = 125oC
5
TJ = 25oC
TJ = 150oC
TJ = -55oC
f=1MHz
Ciss
1000
Coss
Crss
100
10
0
0
0.3
0.6
0.9
1.2
0
1.5
5
10
15
20
25
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
10
1000
RDS(ON) Limited
PW =100µs
ID, DRAIN CURRENT (A)
VGS (V)
8
6
4
VDS = 15V, ID = 20A
2
100
10
PW =1ms
0.1
0
0
5
10
15
20
25
30
35
40
45
50
0.1
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
Figure 11. Gate Charge
Document number: DS37819 Rev. 2 - 2
P =100ms
TJ(Max) = 150℃ W
TA = 25℃
PW =1s
Single Pulse
PW =10s
DUT on 1*MRP Board
DC
VGS=10V
0.01
0.01
Qg (nC)
DMT3003LFG
PW =10ms
1
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DMT3003LFG
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.7
D=0.5
D=0.3
0.1
D=0.9
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA(t) = r(t) * RθJA
RθJA = 51℃/W
Duty Cycle, D = t1 / t2
D=Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMT3003LFG
Document number: DS37819 Rev. 2 - 2
5 of 7
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© Diodes Incorporated
DMT3003LFG
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI3333-8
A3
A1
A
Seating Plane
D
L(4x)
D2
1
Pin #1 ID
b2(4x)
E
E2
e1
8
z(4x)
b
PowerDI3333-8
Dim Min Max Typ
A
0.75 0.85 0.80
A1 0.00 0.05 0.02
A3

 0.203
b
0.27 0.37 0.32
b2
0.20


D
3.25 3.35 3.30
D2 2.22 2.32 2.27
E
3.25 3.35 3.30
E2 1.56 1.66 1.61
e
0.65


e1 0.79 0.89 0.84
L
0.35 0.45 0.40
L1
0.39


z

 0.515
All Dimensions in mm
L1(3x)
e
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI3333-8
X3
X2
8
Y2
X1
Y1
Y3
Y
X
DMT3003LFG
Document number: DS37819 Rev. 2 - 2
Dimensions Value (in mm)
C
0.650
X
0.420
X1
0.420
X2
0.230
X3
2.370
Y
0.700
Y1
1.850
Y2
2.250
Y3
3.700
1
C
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© Diodes Incorporated
DMT3003LFG
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
DMT3003LFG
Document number: DS37819 Rev. 2 - 2
7 of 7
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June 2016
© Diodes Incorporated
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