Material Content Data Sheet Sales Product Name BTS5045-2EKA MA# MA001109722 Package PG-DSO-14-40 Issued 29. August 2013 Weight* 149.59 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.875 1.92 0.017 0.01 0.070 0.05 465 1.392 0.93 9304 56.512 37.78 38.77 377770 387655 0.781 0.52 0.52 5223 5223 0.169 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.92 19216 19216 116 1129 7.766 5.19 76.476 51.13 56.43 511224 564265 1.226 0.82 0.82 8197 8197 1.417 0.95 0.95 9476 9476 0.156 0.10 0.737 0.49 51912 1044 0.59 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4924 5968 1000000