19.00mm [0.748"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 19.00mm [0.748"] Top View 1 Side View 3.76mm [0.148"] 2 Ø 0.20mm [0.008"] ±0.0005" 1.68mm [0.066"] 17.00mm [0.669"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA SMT Land Socket 324 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 16x16 array) Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA324G-41 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 5:1 Rev: C Drawing: H. Hansen Date: 7/27/04 File: LS-BGA324G-41 Dwg Modified: 4/18/05 A th b F w A a