Hirose IT3D-200P-30H03 High-speed(10gbps) bga mezzanine connector Datasheet

NEW
High-Speed(10+Gbps) BGA Mezzanine Connectors
IT3 Series
■Flexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10+Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
■Mechanical features
● Unique 3-piece structure for flexibility
● Stacking heights from 15 to 40mm
(*15mmH is 2-piece)
● Staggered 1.5mm ∞ 1.75mm ball grid array
● Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
● Differential, single-ended, and power
● Low mating/extracting forces
● Wide misalignment tolerances for multiple
connector use
● Both of SnPb and Pb-free are available
Interposer
Signal
Ground
Signal / Ground Configuration
● Excellent reflow solderability
■Signal integrity features
● Insertion loss to Crosstalk Ratio (ICR)
0
ICR
IEEE spec
50
-10
40
RL (dB)
● Return Loss
60
ICR (dB)
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10+Gbps
with skipped pin assignment.
30
-20
-30
20
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
-40
10
0
0
5
10
15
20
-50
RL
IEEE Spec
0
5
Frequency (GHz)
10
15
20
Frequency (GHz)
■Stacking height variations
Stacking Height
Contact Position
100
200
300
17mm
*
20mm
22mm
*
25mm
26mm
28mm
30mm
32mm
*
*
38mm
40mm
* : Under planning
2010.02
1
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Product Specifications
Rating
Current Rating: 1.0A / pin (note 1)
Voltage Rating: 50Vrms
Storage Temperature Range: -10˚C to +60˚C
Item
Specification
1. Insulation Resistance 1000Mø min.
2. Withstanding Voltage No flashover or insulation breakdown
50mø max. (height 15-24mm) (note 2)
3. Contact Resistance
55mø max. (height 25-32mm)
60mø max. (height 33-40mm)
1) No electrical discontinuity of 1µs or more
4. Vibration
2) No damage, crack, or loose part
1) Contact resistance change: 20mø or less
5. Cyclic Temperature
2) Insulation resistance: 100Mø min.
and Humidity
3) No damage, crack or loose part
6. Durability
1) Contact resistance change: 20mø or less
(Mating/Un-mating)
2) No damage, crack or loose part
Operating Temperature Range: -55˚C to +85˚C
Operating Humidity Range: For relative humidity,
90% max (no condensation is permitted)
Conditions
100V DC
150V duty for 60 seconds (2mA max leak)
100mA
Frequency: 20 to 500Hz; power spectrum density: 0.02G2/Hz
Overall rms G: 3.1 Grms; for 15 minutes in three directions
25˚C, 80% RH: 60 min dwell time, 30 min ramp time
65˚C, 50% RH: 60 min dwell time under 24 cycles
100 cycles
Note1: Refer to IT3 derating curves on test report TR636E-20041 for power application.
Note2: The value of contact resistance includes 2 contact points and the bulk resistance.
■Material Information
●Receptacle
Component
Housing
Locator
Material
LCP
LCP
Contact
Copper Alloy
Solder Ball
Tray
Pick Up Cap
Pick Up Tape
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Stainless steel
Paper (Nomex)
Finish & Remarks
Black , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 µm) over Nickel (1.5 µm)
Mounting Area : Gold (0.03 µm) over Nickel (1.5 µm)
Other
: Nickel (1.5 µm)
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Black
300pos
100pos and 200pos
●Interposer
Component
Guide (Mounting Side)
Guide (Detachable/Mating Side)
Blade
Contact
Ground Shield
Tray
2
Material
PBT
LCP
PBT
LCP
Copper Alloy
Copper Alloy
Polypropylene
Finish & Remarks
Black , UL 94V-0
Gray , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 µm) over Nickel (1.5 µm)
Other
: Nickel (1.5 µm)
----------
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Ordering Information
●Receptacle
IT 3 ** - *** S - BGA ** (**)
1
2
3
4
5
6
7
●Interposer
IT 3 ** - *** P - ** H ** (**)
1
2
1 Series name : IT3
2 Receptacle Type
D
: Mating Receptacle
D* : Mating Receptacle ( Customized )
M
: Mounting Receptacle
M* : Mounting Receptacle ( Coustomized )
Interposer Type
Blank: Standard
** : Customized
3 Contact Positions : 100, 180*, 200, 300
*180 pos. is 2 columns depopulated version for
higher voltage proof.
4 Connector type
S : Receptacle
P : Interposer
3
4
8
6
9
5 BGA : Ball Grid Array
6 Package Specification
Blank : Standard
** : Customized
7 Material and Plating Specification of Receptacle
(37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76µm)+Ni(1.5µm)
(57) : Eutectic Solder Sn(63)-Pb(37)
Contact Area : Au(0.76µm)+Ni(1.5µm)
8 Stacking Height (mm)
17, 20, 22, 25, 26, 28, 30, 32, 38, 40
9 Plating Specification of Interposer
(03) : Contact Area : Au(0.76µm)+Ni(1.5µm)
3
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Signal Integrity
●Pin assignment
For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the
figures below. In the following data, one victim pair and eight aggressor pairs are included.
7
8
9
16
17
18
4
5
6
13
14
15
1
2
3
10
11
12
Mating receptacle side
Mounting receptacle side
Ground
Signal
Victim pair
Aggressor pair
●Impedance profile at 60ps rise time (20-80%)
115
115
110
110
110
105
100
Z (Ohm)
115
Z (Ohm)
Z (Ohm)
The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are
designed with higher impedance to offset the via’s low impedance.
105
100
100
S11
95
0
200
400
600
Time (ps)
800
1000
105
S11
95
0
200
400
600
Time (ps)
800
1000
S11
95
0
25mm Height
17mm Height
400
600
Time (ps)
32mm Height
●Differential propagation delay
4
200
Stacking Height (mm)
17
25
32
Delay (ps)
101.05
146.69
188.48
800
1000
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
●Differential Insertion Loss
The differential insertion loss is less than -2dB up to 12GHz.
0
0
-1
-2
-2
-2
-3
-3
-3
-4
-4
-4
-5
S (dB)
-1
S (dB)
S (dB)
0
-1
-5
-5
-6
-6
-6
-7
-7
-7
-8
-8
-8
-9
-9
-9
S514
-10
0
5
10
15
S514
-10
20
0
5
10
15
S514
-10
20
0
5
25mm Height
17mm Height
10
15
20
32mm Height
●Differential Return Loss
The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to
12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.)
0
0
-10
-10
-20
-20
-20
-30
-40
-50
5
10
15
-30
-40
RL
IEEE Spec
0
RL (dB)
-10
RL (dB)
RL (dB)
0
-50
20
-40
RL
IEEE Spec
0
5
Frequency (GHz)
10
15
-30
-50
20
RL
IEEE Spec
0
5
Frequency (GHz)
25mm Height
17mm Height
10
15
20
Frequency (GHz)
32mm Height
●Differential Near-End Crosstalk (NEXT)
The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as
critical because TX and RX can be grouped into separate wafers.
0
0
-10
S51
S52
S53
S54
S56
S57
S58
S59
Sum
-30
-40
-50
-60
0
5
10
15
Frequency (GHz)
17mm Height
S51
S52
S53
S54
S56
S57
S58
S59
Sum
-20
S (dB)
S (dB)
-20
-10
-30
-40
-50
20
-60
0
5
10
15
Frequency (GHz)
25mm Height
S51
S52
S53
S54
S56
S57
S58
S59
Sum
-20
S (dB)
-10
0
-30
-40
-50
20
-60
0
5
10
15
20
Frequency (GHz)
32mm Height
5
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
●Differential Far-End Crosstalk (FEXT)
Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower crosstalk
can be achieved by skipping pins.
0
0
-10
S141
S142
S143
S144
S146
S147
S148
S149
Sum
-30
-40
-50
-60
0
5
10
15
S141
S142
S143
S144
S146
S147
S148
S149
Sum
-20
S (dB)
S (dB)
-20
-10
-30
-40
-50
20
-60
0
5
Frequency (GHz)
10
15
S141
S142
S143
S144
S146
S147
S148
S149
Sum
-20
S (dB)
-10
0
-30
-40
-50
20
-60
0
5
Frequency (GHz)
25mm Height
17mm Height
10
15
20
Frequency (GHz)
32mm Height
●Insertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT
The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE 802.3ap
specification up to 12GHz.
60
60
ICR
IEEE spec
50
50
40
ICR (dB)
30
30
30
20
20
20
10
10
10
0
0
5
10
15
Frequency (GHz)
17mm Height
20
0
ICR
IEEE spec
50
40
ICR (dB)
ICR (dB)
40
6
60
ICR
IEEE spec
0
5
10
15
Frequency (GHz)
25mm Height
20
0
0
5
10
15
Frequency (GHz)
32mm Height
20
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Receptacle
6.0
19.2
A
Shown: 200 position mating receptacle, IT3M-200S-BGA
*
Contact Positions
100
(100 signals/90 grounds)
180
(180 signals/162 grounds)
200
(200 signals/180 grounds)
300
(300 signals/270 grounds)
Type
Mating
Receptacle
Mounting
Receptacle
Mating
Receptacle
Mounting
Receptacle
Mating
Receptacle
Mounting
Receptacle
Mating
Receptacle
Mounting
Receptacle
Solder Ball Material
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Part Number
IT3D-100S-BGA(37)
IT3D-100S-BGA(57)
IT3M-100S-BGA(37)
IT3M-100S-BGA(57)
IT3D2-180S-BGA(37)
IT3D2-180S-BGA(57)
IT3M2-180S-BGA(37)
IT3M2-180S-BGA(57)
IT3D-200S-BGA(37)
IT3D-200S-BGA(57)
IT3M-200S-BGA(37)
IT3M-200S-BGA(57)
IT3D-300S-BGA(37)
IT3D-300S-BGA(57)
IT3M-200S-BGA(37)
IT3M-200S-BGA(57)
CL No.
636-0013-1-37
636-0013-1-57
636-0014-4-37
636-0014-4-57
636-0011-6-37
636-0011-6-57
636-0012-9-37
636-0012-9-57
636-0003-8-37
636-0003-8-57
636-0004-0-37
636-0004-0-57
636-0007-9-37
636-0007-9-57
636-0008-1-37
636-0008-1-57
Unit: mm
A
21.0
38.5
56.0
7
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Interposer
21±0.5
A±0.5
B±0.5
Mating Side
Spacer height : D±0.127
Spacer
Spacer
IT3**-300P-25H(**)
IT3M*-300S-BGA(**)
Mother board
Mating Side
(1.0 with spacers)
1.4±0.3 (Contact wipe)
IT3D*-300S-BGA(**) Daughter card
0.9±0.3
Contact wipe
Mated connector height : C±0.25
Mounting Side
Mounting Side
Mating Cross Section(FREE)
Mating condition with spacers
Mating condition without spacers
*
Unit: mm
Height
(mm)
17
20
22
25
26
8
Part Number
CL No.
A
IT3-200P-17H(03)
IT3-300P-17H(03)
IT3-100P-20H(03)
IT3-200P-20H(03)
IT3-300P-20H(03)
IT3-200P-22H(03)
IT3-300P-22H(03)
IT3-100P-25H(03)
IT3M2-180P-25H(03)
IT3-200P-25H(03)
IT3-300P-25H(03)
IT3-100P-26H(03)
IT3-200P-26H(03)
IT3-300P-26H(03)
636-0100-4-03
636-0130-5-03
636-0223-4-03
636-0224-7-03
636-0225-0-03
636-0209-3-03
636-0210-2-03
636-0150-2-03
636-0157-1-03
636-0155-6-03
636-0160-6-03
636-0165-0-03
636-0110-8-03
636-0135-9-03
41.5
59.0
24.0
41.5
59.0
41.5
59.0
24.0
41.5
41.5
59.0
24.0
41.5
59.0
B
C
D
Height
(mm)
15.8 16.6 17.0
28
18.8 19.6 20.0
30
20.8 21.6 22.0
32
23.8 24.6 25.0
24.8 25.6 26.0
38
40
Part Number
CL No.
A
IT3-100P-28H(03)
IT3M2-180P-28H(03)
IT3-200P-28H(03)
IT3-300P-28H(03)
IT3-200P-30H(03)
IT3-300P-30H(03)
IT3-200P-32H(03)
IT3-300P-32H(03)
IT3-100P-38H(03)
IT3-200P-38H(03)
IT3-300P-38H(03)
IT3-100P-40H(03)
IT3-200P-40H(03)
IT3-300P-40H(03)
636-0170-0-03
636-0107-3-03
636-0105-8-03
636-0140-9-03
636-0180-3-03
636-0185-7-03
636-0115-1-03
636-0145-2-03
636-0200-9-03
636-0195-0-03
636-0190-7-03
636-0230-0-03
636-0227-5-03
636-0175-3-03
24.0
41.5
41.5
59.0
41.5
59.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
B
C
D
26.8 27.6 28.0
28.8 29.6 30.0
30.8 31.6 32.0
36.8 37.6 38.0
38.8 39.6 40.0
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
29.2 Minimum clearance for sensitive devices
27.2 Minimum clearance for all devices
Row
A
C
E
G
J
L
N
R
U
W
B
D
F
H
K
M
P
T
V
13.5
Signal
Ground
0.75
Column
No.1
No.n
1.5
■PCB footprint (mounting foot pattern)
0.875
1.75
0.875
Signal Pad
Ground Pad
A
B Minimum clearance for all devices
C Minimum clearance for sensitive devices
29.2 Minimum clearance for sensitive devices
27.2 Minimum clearance for all devices
Row
W
U
R
N
L
J
G
E
C
A
V
T
P
M
K
H
F
D
B
13.5
Signal
Ground
0.75
Column
No.1
No.n
1.5
Mounting Receptacle – IT3M
0.875
1.75
0.875
Signal Pad
Ground Pad
A
B Minimum clearance for all devices
C Minimum clearance for sensitive devices
Mating Receptacle – IT3D
*
Dimension (mm)
A
B
C
100
15.75
28.10
30.10
180 / 200
33.25
45.60
47.50
Unit: mm
300
50.75
63.10
65.10
9
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Spacers
Spacers are required to support the PWB’s and protect the BGA solder joints.
Stacking
Height
Spacers
Suggested spacer style is shown below:
Spacer, male-male, M3 thread
The recommended spacer height corresponds to the interposer stacking height as shown in the chart below:
Stacking Height
17 mm
20 mm
22 mm
25 mm
26 mm
28 mm
30 mm
32 mm
38 mm
40 mm
Recommended Spacer Height
17 +/-0.127 mm
20 +/-0.127 mm
22 +/-0.127 mm
25 +/-0.127 mm
26 +/-0.127 mm
28 +/-0.127 mm
30 +/-0.127 mm
32 +/-0.127 mm
38 +/-0.127 mm
40 +/-0.127 mm
1050mm
1050mm
Two spacers located diagonally are minimally
required. Some applications may require 4 spacers.
Spacers should be located 10 – 50 mm from the
corners of the receptacles to prevent excessive
mechanical loading on the interconnections.
If assembly will be subjected to vibration, spacers
should be located to prevent resonance, and
additional spacers may be required.
Recommended Spacer Location
10
Ø3.5
Non plated through hole
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Interposer installation
Position interposer directly over mounting receptacle, aligning the polarity chamfers.
If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap
onto interposer and push straight down to engage the locking latches:
Manual Installation
*Installation caps are available upon
request for manual operation
Press firmly on installation cap only,
not on wafers or interposer body
Locking
Latch
Always support PWB from
underside to prevent flexing
■Daughter card installation
After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align the
spacer holes in the daughter card with the threads on the spacers.
The spacers help align the mating receptacle with the interposer. If positioned correctly, the mating
receptacle will slip down into the interposer.
Push directly down on the assembly to lock the mating receptacle in place. Install nuts onto the spacer
threads. Tighten nuts to specified torque.
11
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Daughter card removal
To remove a daughter card, first
remove the nuts from the reinforcing
spacers, then lift the daughter card
straight off the interposers, as shown
right.
■Interposer removal
Interposer Removal
1) Hold the Interposer Assembly on the walls
without locking latches
Locking
Latch
2) Gently rotate one side of the Interposer
Assembly laterally 10° maximum
10°MAX
Caution: do not rotate more than 10 degrees
3) While gently rotating, pull up on other side of
the Interposer Assembly
12
4) The Interposer Assembly is removed, and
the Mounting Receptacle is ready to accept
another Interposer Assembly.
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Assembly reflow soldering profile
Parameters
Eutectic (SnPb)
Pb-Free
Preheat Ramp Rate
2 - 3ç/sec
2 - 3ç/sec
Soak Time
0 - 120 sec
0 - 120 sec
Soak Temperature
140 - 180ç
160 - 215ç
Peak Reflow Temperature
205 - 225ç
230 - 250ç
Time Above Liquidus (TAL)
30 - 90 sec
45 - 120 sec
Cooling Rate
>6ç/sec
>6ç/sec
Maximum Package Body Temperature (T)
240ç
260ç
10ç
10ç
5 sec
5 sec
Maximum Delta T between Body and
PWB at Liquidus
Package Body Exposure Limit
at Maximum Temperature
Comment
Other components may limit ramp rate to 2ç/sec
Soak requirements determined by board design,
oven capability, and paste activation requirements
Caution - "oversoaking" may exhaust flux and
affect soldering
Cooler peak temperatures may require longer
TAL's
Shorter TAL's may require higher peak
temperatures
Faster cooling rates produce finer grain structures
and smoother joint appearances
Open body design allows for low delta T between
package and solder joint
Standard practice is easy to achieve with open
body design
Adjust profile if maximum exposure limit is
approached or exceeded
Max Body Temp
260
225
MaxPeak Temp
250
205
Min Peak Temp
183
Melting Point
Reflow
。
SnAgCu Temperatures ( C)
240
230
217
Soak
Min Soak Temp
nal)
(optio
Pr
eh
ea
t
140
21
160
ol
Co
。
SnPb Temperatures( C)
Reflow Profile
Time, typically 3 to 7 minutes total
21
Different solder pastes have different thermal performance characteristics. Consult with paste manufacturer for optimum profile
settings.
Check thermal exposure limits of PWB laminate if processing with Pb-free solder.
13
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Mating self alignment
*
Unit: mm
+/-0.8
X-direction
+/-0.6
Y-direction
■Mating tolerance
Due to its 3-piece design, the IT3 connector system can accept mating tolerances of up to ±0.3mm tolerance
in the X-axis and up to ±0.2mm in the Y-axis.
+/-0.3
X-direction
14
+/-0.2
Y-direction
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Packaging information
Please order per box with its Minimum Order Quantity (MOQ) of connectors contained.
The number for each configuration is shown below.
●Receptacles
µm
IT 3** - ***S - BGA(57)...SnPb / Au0.76µ
µm
IT 3** - ***S - BGA(37)...Pb-Free / Au0.76µ
(1)
(2)
Unit: pcs
(2)
(1)
M
D
M*
D*
100S
180S
200S
300S
120
120
-------------------
72
72
48
48
-------------------
72
72
-------------------
-------------------
This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you
place more.
Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes)
Dry package and deoxidizer
Box
Cushion
materials
Three trays
+ One empty tray as lid
Bundle
15
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Packaging information
●Interposers
µm
IT 3 - ***P - **H(03)...Au0.76µ
(3)
(4)
Unit: pcs
(3)
(4)
17H
20H
22H
25H
26H
28H
30H
32H
38H
40H
100P
180P
200P
300P
----------
----------------------------
80
80
80
80
80
40
40
40
40
40
60
60
60
60
60
30
30
30
30
30
100
----------
100
100
50
-------------------
50
50
80
----------
40
-------------------------------------
This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you
place more.
Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes)
Box
Cushion
materials
One or two trays (depending on height)
+One empty tray as lid
16
Bundle
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Tray information
Chamfer (Connector Column1)
X3
31
31
31
31
31
31
31
31
Y3
18
32.8
32.8
135.9±0.5
32.8 18.75
31
Tape
(3.8)
315±0.5
JEDEC Tray for IT3M 100 Position Receptacles
Chamfer (Connector Column1)
X3
51.7
51.7
51.7
51.7
28.25
Y3
32.8
32.8
135.9±0.5
32.8 18.75
51.7
Tape
(3.8)
315±0.5
JEDEC Tray for IT3M 200 Position Receptacles
X3
77.6
77.6
Chamfer (Connector Column1)
41.1
Y3
(3.8)
32.8
32.8
135.9±0.5
32.8 18.75
77.6
315±0.5
Cap
JEDEC Tray for IT3M 300 Position Receptacles
17
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Tray information (con’t)
X3
31
31
31
31
31
31
31
31
Chamfer (Connector Column1)
18
Y3
32.8
32.8
135.9±0.5
32.8 18.75
31
(3.8)
Tape
315±0.5
JEDEC Tray for IT3D 100 Position Receptacles
X3
51.7
51.7
51.7
51.7
51.7
Chamfer (Connector Column1)
28.25
32.8
32.8
135.9±0.5
32.8
18.75
Y3
Tape
(3.8)
315±0.5
JEDEC Tray for IT3D 200 Position Receptacles
X3
77.6
77.6
41.1
Y3
32.8
32.8
135.9±0.5
32.8 18.75
77.6
Chamfer (Connector Column1)
(3.8)
315±0.5
JEDEC Tray for IT3D 300 Position Receptacles
18
Cap
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
NOTES :
19
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
USA:
HIROSE ELECTRIC (U.S.A.), INC. North California Office
20400 Stevens Creek Blvd., Ste 250, Cupertino,
CA 95014
Phone : 1-408-253-9640
Fax : 1-408-253-9641
http://www.hiroseusa.com
USA:
HIROSE ELECTRIC (U.S.A.), INC. Dallas Office
1701 N. Greenville Ave. Ste 817, Richardson,
TX 75081
Phone : 1-469-330-9200
Fax : 1-469-330-9205
http://www.hiroseusa.com
USA:
USA:
HIROSE ELECTRIC (U.S.A.), INC. New York Office
HIROSE ELECTRIC (U.S.A.), INC. Chicago Office
2777 Finley Road, Suite 19 Downers Grove, 510 Broadhollow Road, Suite 305, Melville,
NY 11747
IL 60515
Phone : 1-516-249-5259
Phone : 1-630-916-1455
http://www.hiroseusa.com
Fax : 1-630-916-1451
http://www.hiroseusa.com
USA:
HIROSE ELECTRIC (U.S.A.), INC. Detroit Office (Automotive)
37650 Professional Center Drive, Suite 120A,
Livonia, MI 48154
Phone : 1-734-542-9963
Fax : 1-734-542-9964
http://www.hiroseusa.com
USA:
HIROSE ELECTRIC (U.S.A.), INC. Headquarters
2688 Westhills Court, Simi Valley, CA 93065-6235
Phone : 1-805-522-7958
Fax : 1-805-522-3217
http://www.hiroseusa.com
GERMANY:
HIROSE ELECTRIC GmbH
Herzog-Carl-Strasse 4 D-73760 Ostfildern
(Scharnhauser Park)
Phone : 49-711-4560-02-1
Fax : 49-711-4560-02-299
http://www.hirose.de
FINLAND:
HIROSE ELECTRIC EUROPE B.V. FINLAND OFFICE
Teknobulevardi 3-5 01530 VANTAA
Phone : 358-46-712-2178
Fax : 358-46-712-2179
http://www.hiroseeurope.com
CHINA:
UNITED KINGDOM:
HIROSE ELECTRIC UK LTD.
HIROSE ELECTRIC CO., LTD. BEIJING REPRESENTATIVE OFFICE
First Floor, St Andrews House, Caldecotte Lake A1205, Ocean International Center, Building 56# East 4th
Business Park, Milton Keynes MK7 8LE
Ring Middle Road, Chao Yang District, Beijing, 100025
Phone : 44-1908-369060
Phone : 86-10-5165-9332
Fax : 44-1908-369078
Fax : 86-10-5908-1381
http://www.hirose.co.uk
http://www.hirose-china.com.cn
CHINA:
HIROSE ELECTRIC (SHANGHAI) CO., LTD.
1501-02, Cross Tower Building, 318 Fuzhou Road,
Huang Pu District, Shanghai 200001
Phone : 86-21-6391-3355
Fax : 86-21-6391-3335
http://www.hirose-china.com.cn
CHINA:
HIROSE ELECTRIC CO., LTD. SHENZHEN OFFICE
Room 1902-05, Office Tower Shun Hing Square, Di Wang Commercial Centre
5002, ShenNanDong Road, ShenZhen City, Guangdong Province, 518008
Phone : 86-755-8207-0851
Fax : 86-755-8207-0873
http://www.hirose-china.com.cn
HONG KONG:
HIROSE ELECTRIC HONGKONG TRADING CO., LTD.
Unit 1102 A&B, Energy Plaza, 92 Granville Road,
Tsim Sha Tsui East, Kowloon
Phone : 852-2803-5338
Fax : 852-2591-6560
http://www.hirose-hongkong.com.hk
TAIWAN:
HIROSE ELECTRIC TAIWAN CO., LTD.
No.28 Lane 247 Sec. 2, Yen Ping N, Rd. Taipei
Phone : 886-2-2557-7351,7352
Fax : 886-2-2552-9851
http://www.hirose-taiwan.com.tw
SINGAPORE:
HIROSE ELECTRIC CO., LTD. Singapore Branch
10 Anson Road #26-16 International Plaza 079903
Phone : 65-6324-6113
Fax : 65-6324-6123
http://www.hirose-singapore.com.sg
KOREA:
HIROSE KOREA CO., LTD.
1261-10, Jeoungwhang-Dong, Shihung-City,
Kyunggi-Do 429-450
Phone : 82-31-496-7000,7124
Fax : 82-31-496-7100
http://www.hirose.co.kr
®
20
THE NETHERLANDS:
HIROSE ELECTRIC EUROPE B.V.
Hogehillweg #8 1101 CC Amsterdam Z-O
Phone : 31-20-6557490
Fax : 31-20-6557469
http://www.hiroseeurope.com
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-5300, FAX: 81-3-3495-5230
http://www.hirose.com
http://www.hirose-connectors.com
The contents of this catalog are current as of date of 02/2010. Contents are subject to change without notice for the purpose of improvements.
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