ASMB-TTB0-0A3A2 High Brightness Tall Black Surface PLCC6 Tricoolor LED Data Sheet Description Features This family of SMT LEDs is packaged in the form of PLCC-6 with a separate heat path for each LED die, enabling it to be driven at higher current. Individually addressable pin-outs give higher flexibility in circuitry design. With closely matched radiation pattern along the package’s X-axis, these LEDs are suitable for full color display application. The black top surface of the LED provides better contrast enhancement. For easy pick and place, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity. * The test is conducted on component level by mounting the components on PCB with potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application. These LEDs are compatible with reflow soldering process. CAUTION CAUTION These LEDs are ESD-sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. Customer is advised to keep the LED in the MBB when not in use, as prolonged exposure to environment might cause the silver-plated leads to tarnish, which might cause difficulties in soldering. Standard PLCC-6 package (Plastic Leaded Chip Carrier) LED package with diffused encapsulation Tall package enable potting on LED’s lead. High brightness using AlInGaP and InGaN dice technologies Typical viewing angle at 115° Compatible with reflow soldering process JEDEC MSL 4 Enhanced corrosion resistance. Water resistance (IPx6* and IPx8) per IEC 60529:2001 Applications Avago Technologies -1- Full color display ASMB-TTB0-0A3A2 Data Sheet Package Dimensions Package Dimensions 3.50 2.80 3 5 2 6 1 0.70 4 2.80 3.50 1.20 0.40 0.75 Package Marking 4 3 Red 5 2 Green 6 1 Blue Lead Configuration 1 Cathode (Blue) 2 Cathode (Green) 3 Cathode (Red) 4 Anode (Red) 5 Anode (Green) 6 Anode (Blue) NOTE 1. 2. 3. All dimensions are in millimeters (mm). Unless otherwise specified, tolerance is ± 0.20 mm. Terminal finish = silver plating. Avago Technologies -2- ASMB-TTB0-0A3A2 Data Sheet Absolute Maximum Ratings (TJ = 25 °C) Absolute Maximum Ratings (TJ = 25 °C) Parameter Red Green & Blue Unit DC forward currenta 50 35 mA Peak forward current b 100 100 mA Power dissipation 130 126 mW Maximum junction temperature Tj max 110 °C Operating temperature range –40 to + 100 °C Storage temperature range –40 to +100 °C a. Derate linearly as shown in Figure 7 to Figure 10. b. Duty Factor = 10% Frequency = 1 kHz Optical Characteristics (TJ = 25 °C) Luminous Intensity, IV (mcd) @ IF = 20mAa Color Dominant Wavelength, d (nm) @IF = 20mAb Peak Wavelength, P (nm) @IF = 20m Viewing Angle, 2½ (°)c Min. Typ. Max. Min. Typ. Max. Typ. Typ. Red 560 790 1125 618 621 628 635 115 Green 1800 2400 3550 523 530 535 521 115 Blue 355 500 715 465 470 473 464 115 a. The luminous intensity Iv is measured at the mechanical axis of LED package and it is tested in pulsing condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. ½ is the off axis angle where the luminous intensity is ½ the peak intensity Electrical Characteristics (TJ = 25 °C) Forward Voltage, VF (V) @IF = 20mAa Color Reverse Voltage, VR (V) @IR = 100μAb Reverse Voltage, VR (V) @IR = 10μAb Min. Min. 1 chip on 3 chips on Thermal Resistance, RJ-S (°C/W) Min. Typ. Max. Red 1.8 2.1 2.5 4 — 320 320 Green 2.8 3.1 3.6 — 4 320 320 Blue 2.8 3.1 3.6 — 4 320 320 a. Tolerance = ±0.1V. b. Indicates product final testing condition. Long term reverse bias is not recommended. Avago Technologies -3- ASMB-TTB0-0A3A2 Data Sheet Part Numbering System Part Numbering System A S M B - T T B 0 - 0 x1 Code A 3 A 2 x2 x3 x4 x5 Description Option x1 Package type B Black surface x2 Minimum intensity bin A Red: bin U2 Green: bin X1, X2, Y1 Blue: Blue: bin T2 Number of intensity bins 3 3 intensity bins from minimum x4 Color bin combination A Red: full distribution Green: bin E, A, B Blue: Test option 2 bin U2, V1, V2 Green: bin X1 x3 x5 Red: bin A, B, C Test current = 20 mA Avago Technologies -4- bin T2, U1, U2 ASMB-TTB0-0A3A2 Data Sheet Bin Information Bin Information Color Bins (BIN) – Red Intensity Bins (CAT) Bin ID Luminous intensity (mcd) Bin ID — Dominant Wavelength (nm) Chromaticity Coordinate (for Reference) Min. Max. Cx Cy 618.0 628.0 0.6873 0.3126 Min Max T2 355 450 0.6696 0.3136 U1 450 560 0.6866 0.2967 U2 560 715 0.7052 0.2948 V1 715 900 V2 900 1125 W1 1125 1400 W2 1400 1800 X1 1800 2240 X2 2240 2850 Y1 2850 3550 Tolerance: ±1 nm. Color Bins (BIN) – Green Bin ID Dominant Wavelength (nm) Min. Max. Cx Cy 523.0 529.0 0.0979 0.8316 0.1685 0.6821 0.2027 0.6673 0.1468 0.8104 0.1223 0.8228 0.1856 0.6759 Cy 0.2192 0.6576 0.1355 0.0399 0.1702 0.7965 0.1553 0.0692 0.1468 0.8104 0.1473 0.0814 0.2027 0.6673 0.1267 0.0534 0.2350 0.6471 0.1314 0.0459 0.1929 0.7816 0.1516 0.0746 0.1427 0.0897 E Tolerance: ±12% Color Bins (BIN) – Blue Bin ID Dominant Wavelength (nm) Min. A B C 465.0 467.0 469.0 Max. 469.0 471.0 473.0 Chromaticity Coordinate (for Reference) A Chromaticity Coordinate (for Reference) Cx 0.1215 0.0626 0.1267 0.0534 0.1473 0.0814 0.1376 0.0996 0.1158 0.0736 B 526.0 529.0 Tolerance: ±1 nm. Tolerance: ±1 nm. Avago Technologies -5- 532.0 535.0 ASMB-TTB0-0A3A2 Data Sheet Bin Information Figure 2 Forward Current vs. Forward Voltage 1.0 100 0.8 80 Green Blue FORWARD CURRENT (mA) WAVELENGTH - nm Figure 1 Relative Intensity vs. Wavelength Red 0.6 0.4 0.2 0.0 400 450 500 550 600 RELATIVE INTENSITY 650 20 1 2 3 FORWARD VOLTAGE - V 4 5 3 DOMINANT WAVELENGTH SHIFT - nm 2.0 1.5 1.0 0.5 0.0 10 20 30 40 FORWARD CURRENT - mA 50 60 Figure 5 Relative Intensity vs. Junction Temperature Red Green Blue 2 1 0 -1 -2 0 0 1.6 0.3 FORWARD VOLTAGE SHIFT - V 0.4 1.4 1.2 1.0 0.8 Red Green Blue 0.6 0.4 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 10 20 30 40 FORWARD CURRENT - mA 50 60 Figure 6 Forward Voltage vs. Junction Temperature 1.8 0.2 0 Figure 4 Dominant Wavelength Shift vs. Forward Current Red Green Blue 2.5 RELATIVE INTENSITY 40 0 3.0 NORMALZIED INTENSITY 60 700 Figure 3 Relative Intensity vs. Forward Current Red Green/Blue 0.2 0.1 0 -0.2 -0.3 120 Avago Technologies -6- Red Green Blue -0.1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 120 ASMB-TTB0-0A3A2 Data Sheet Bin Information Figure 7 Maximum Forward Current vs. Temperature for Red (1 Chip On) Figure 8 Maximum Forward Current vs. Temperature for Red (3 Chips On) 60 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 60 50 40 TA 30 TS 20 10 50 30 TA 20 10 0 0 0 20 40 60 80 TEMPERATURE (°C) 100 120 Figure 9 Maximum Forward Current vs. Temperature for Green and Blue (1 Chip On) MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 20 40 60 80 TEMPERATURE (°C) 100 120 40 30 TS TA 20 10 NOTE 0 Figure 10 Maximum Forward Current vs. Temperature for Green and Blue (3 Chips On) 40 0 TS 40 0 20 40 60 80 TEMPERATURE (°C) 100 10 0 120 Thermal Resistance from LED Junction to Ambient, RJ-A (°C/W) Red Green and Blue 1 chip on 437 485 3 chips on 654 654 TA 20 Maximum forward current graphs based on ambient temperature, TA are with reference to thermal resistance RJ-A as follows. For more details, see Precautionary Notes (4). Condition TS 30 Avago Technologies -7- 0 20 40 60 80 TEMPERATURE (°C) 100 120 ASMB-TTB0-0A3A2 Data Sheet Bin Information Figure 12 Radiation Pattern Along Y-Axis of the Package 1.0 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 11 Radiation Pattern Along X-Axis of the Package 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE 60 0.4 Y X Y Avago Technologies -8- Red Green Blue 0.2 0.0 -90 90 Figure 13 Illustration of Package Axis for Radiation Pattern X 0.6 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE 60 90 ASMB-TTB0-0A3A2 Data Sheet Bin Information Figure 14 Recommended Soldering Land Pattern 2.80 0.70 4.60 1.40 1.60 0.35 Maximize the size of copper pad for PIN1, PIN4,PIN5 for better heat dissipation. Copper Pad Solder mask Figure 15 Carrier Tape Dimensions 4.00 2.00 O 1.50 B O 1.55 +0.10 0 PACKAGE MARKING 3.15 1.50 A 1.75 5.50 3.70 12.00 ± 0.3 5.50 B 0.30 A 8.00 1.50 0.30 3.60 7.00 Avago Technologies -9- ASMB-TTB0-0A3A2 Data Sheet Bin Information Figure 16 Reel Orientation Package Marking Printed Label Figure 17 Reel Dimensions 12.40 RECYCLE Detail-1 2.3 R8 O 13.0 ±0.2 O 100.0 ±1.0 10.75 O 110 O 90 O 320.0 ±2.0 DATE OF YEAR DATE OF MONTH O 330.0 ±2.0 Avago Technologies - 10 - Detail-1 2.20 ASMB-TTB0-0A3A2 Data Sheet Packing Label Packing Label (i) Standard Label (Attached on Moisture Barrier Bag) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL4 (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Color Bin (1P) Item: Part Number (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Baby Label (Attached on Plastic Reel) (1P) PART #: Part Number BABY LABEL COSB (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin (9D): DATE CODE: (1T) TAPE DATE: D/C: Date Code 001B V0.0 VF: CAT: INTENSITY BIN BIN: COLOR BIN Example of Luminous Intensity (lv) Bin Information on Label Example of Color Bin Information on Label BIN: A B CAT: U2 X1 T2 Intensity bin for Blue: T2 Intensity bin for Green: X1 Intensity bin for Red: U2 Color bin for Blue: B Color bin for Green: A NOTE Avago Technologies - 11 - There is no color bin ID for Red color as there is only one range as stated in Table 4. ASMB-TTB0-0A3A2 Data Sheet Soldering Soldering Recommended reflow soldering condition (ii) Lead-Free Reflow Soldering (i) Leaded Reflow Soldering 20 SEC. MAX. TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 120 SEC. MAX. 60-150 SEC. TIME TIME 1. 2. Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in the following section. 3. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. 4. It is preferred to use reflow soldering to solder the LED. Hand soldering shall only be used for rework if unavoidable but must be strictly controlled to the following conditions: Recommended board reflow direction: Soldering iron tip temperature = 320 °C max Soldering duration = 3 sec max — Number of cycles = 1 only — Power of soldering iron = 50W max — — 5. Do not touch the LED body with hot soldering iron except the soldering terminals as it may cause damage to the LED. 6. For de-soldering, it is recommended to use double flat tip. 7. The user is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. Avago Technologies - 12 - ASMB-TTB0-0A3A2 Data Sheet Precautionary Notes Precautionary Notes 1. Handling precautions a. b. c. d. e. It is recommended that the MBB not be opened prior to assembly (e.g., for IQC). Control after opening the MBB The humidity indicator card (HIC) shall be read immediately upon opening of MBB. The LEDs must be kept at < 30 °C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 72 hours. Control for unfinished reel Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at < 5%RH. Control of assembled boards If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB must be stored in a sealed MBB with desiccant or desiccator at < 5%RH to ensure that all LEDs have not exceeded their floor life of 72 hours. Baking is required if: The HIC indicator is not BROWN at 10% and is AZURE at 5%. The LEDs are exposed to condition of > 30°C / 60% RH at any time. The LED floor life exceeded 72 hrs. b. Do not poke sharp objects into the encapsulant. Sharp object like tweezers or syringes might apply excessive force or even pierce through the encapsulant and induce failures to the LED die or wire bond. Do not touch the encapsulant. Uncontrolled force acting on the encapsulant might result in excessive stress on the wire bond. The LED should only be held by the body. Do no stack assembled PCBs together. Use an appropriate rack to hold the PCBs. To remove foreign particles on the surface of the encapsulant, a cotton bud can be used with isopropyl alcohol (IPA). During cleaning, rub the surface gently without applying too much pressure. Ultrasonic cleaning is not recommended. For automated pick and place, Avago has tested the following nozzle size to be working fine with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the machine, customer is recommended to verify the nozzle selected will not cause damage to the LED. c. d. e. The recommended baking condition is: 60±5 ºC for 24 hrs. Baking should only be done once. f. ID OD ID = 1.7mm OD = 3.5mm Storage The soldering terminals of these Avago LEDs are silver plated. If the LEDs are exposed too long in an ambient environment, the silver plating might be oxidized and thus affect its solderability performance. As such, unused LEDs must be kept in a sealed MBB with desiccant or in a desiccator at < 5%RH. 3. Application precautions 2. Handling of moisture sensitive device a. This product has a Moisture Sensitive Level 4 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use An unopened moisture barrier bag (MBB) can be stored at < 40 °C / 90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. Avago Technologies - 13 - b. The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. LEDs do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (i.e., intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. ASMB-TTB0-0A3A2 Data Sheet c. d. Precautionary Notes The complication of using this formula lies in TA and RJ-A. Actual TA is sometimes subjective and hard to determine. RJ-A varies from system to system depending on design and is usually not known. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. This LED is designed to have enhanced gas corrosion resistance. Its performance has been tested according to the following specific conditions: IEC 60068-2-43: 25 °C / 75%RH, H2S 15 ppm, 21 days IEC 60068-2-42: 25 °C / 75%RH, SO2 25 ppm, 21 days IEC 60068-2-60: 25 °C / 75%RH, SO2 200 ppb, NO2 200 ppb, Cl2 10 ppb, 21 days Another way of calculating TJ is by using solder point temperature TS as shown below: TJ = TS + RJ-S × IF × VFmax where; TS = LED solder point temperature as shown in the following illustration (°C) RJ-S = thermal resistance from junction to solder point (°C/W) As actual application conditions might not be exactly similar to the test conditions, the user is advised to verify that the LED will not be damaged by prolonged exposure in the intended environment. e. f. Avoid rapid change in ambient temperature especially in high humidity environment because this will cause condensation on the LED. Although the LED is rated as IPx6 and IPx8 according to IEC60529: Degree of protection provided by enclosure, the test condition may not represent actual exposure during the application. If the LED is intended to be used in an outdoor or a harsh environment, the LED must be protected against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stress, etc. Ts point - pin 5 TS can be measured easily by mounting a thermocouple on the soldering joint as shown in the preceding illustration, while RJ-S is provided in the data sheet. The user is advised to verify the TS of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the data sheet. 5. Eye safety precautions 4. Thermal management Optical, electrical, and reliability characteristics of the LED are affected by temperature. The junction temperature (TJ ) of the LED must be kept below the allowable limit at all times. TJ can be calculated as below: TJ = TA + RJ-A x IF × VFmax where; TA = ambient temperature (°C) RJ-A = thermal resistance from LED junction to ambient (°C/W) IF = forward current (A) VFmax = maximum forward voltage (V) Avago Technologies - 14 - LEDs may pose optical hazards when in operation. It is not advisable to view directly at operating LEDs as it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipments. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. This data sheet (including, without limitation, the Avago component [s] identified herein) is not designed, intended, or certified for use in any military, nuclear, medical, mass transportation, aviation, navigations, pollution control, hazardous substances management, or other high-risk application. Avago provides this data sheet "as-is," without warranty of any kind. Avago disclaims all warranties, expressed and implied, including, without limitation, the implied warranties of merchantability, fitness for a particular purpose, and noninfringement. Data subject to change. Copyright © 2014–2016 Avago Technologies. All Rights Reserved. AV02-4415EN – April 18, 2016