TI LM248NE4 Quadruple operational amplifier Datasheet

 SLOS058C – OCTOBER 1979 – REVISED DECEMBER 2002
D µA741 Operating Characteristics
D Low Supply-Current Drain . . . 0.6 mA Typ
D
D
D
D
D
LM148 . . . J PACKAGE
LM248 . . . D OR N PACKAGE
LM348 . . . D, N, OR NS PACKAGE
(TOP VIEW)
(per amplifier)
Low Input Offset Voltage
Low Input Offset Current
Class AB Output Stage
Input/Output Overload Protection
Designed to Be Interchangeable With
Industry Standard LM148, LM248, and
LM348
1OUT
1IN–
1 IN+
VCC+
2IN+
2IN–
2OUT
description/ordering information
1
14
2
13
3
12
4
11
5
10
6
9
7
8
4OUT
4IN–
4IN+
VCC–
3IN+
3IN–
3OUT
LM148 . . . FK PACKAGE
(TOP VIEW)
1IN–
1OUT
NC
4OUT
4IN–
The LM148, LM248, and LM348 are quadruple,
independent, high-gain, internally compensated
operational amplifiers designed to have operating
characteristics similar to the µA741. These
amplifiers exhibit low supply-current drain and
input bias and offset currents that are much less
than those of the µA741.
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4IN+
NC
VCC–
NC
3IN+
2IN–
2OUT
NC
3OUT
3IN–
1IN+
NC
VCC+
NC
2IN+
NC – No internal connection
ORDERING INFORMATION
TA
VIOmax
AT 25°C
PACKAGE†
PDIP (N)
0°C to 70°C
–25°C to 85°C
6 mV
TOP-SIDE
MARKING
Tube of 25
LM348N
Tube of 50
LM348D
Reel of 2500
LM348DR
SOP (NS)
Reel of 2000
LM348NSR
LM348
PDIP (N)
Tube of 25
LM248N
LM248N
Tube of 50
LM248D
Reel of 2500
LM248DR
Tube of 25
LM148J
SOIC (D)
6 mV
SOIC (D)
CDIP (J)
–55°C
55°C to 125°C
ORDERABLE
PART NUMBER
LM348N
LM348
LM248
LM148J
5 mV
LCCC (FK)
Tube of 50
LM148FK
LM148FK
† Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2002, Texas Instruments Incorporated
!"# $"%&! '#(
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# - && $## (
$'"! !$& .. / / && $## # # #'
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1
SLOS058C – OCTOBER 1979 – REVISED DECEMBER 2002
symbol (each amplifier)
+
IN+
OUT
–
IN–
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1): LM148 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 V
LM248, LM348 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Supply voltage, VCC– (see Note 1): LM148 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –22 V
LM248, LM348 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 V
Differential input voltage, VID (see Note 2): LM148 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 V
LM248, LM348 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Input voltage, VI (either input, see Notes 1 and 3): LM148 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –22 V
LM248, LM348 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 V
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Operating virtual junction temperature,TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Package thermal impedance, θJA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Package thermal impedance, θJC (see Notes 7 and 8): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
J package . . . . . . . . . . . . . . . . . . . . . . . . . . 15.05°C/W
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: J package . . . . . . . . . . . . . . . . . . . . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, N, or NS package . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC–.
2. Differential voltages are at IN+ with respect to IN–.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or the value specified in the table,
whichever is less.
4. The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure that
the dissipation rating is not exceeded.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
MIN
MAX
Supply voltage, VCC+
4
18
V
Supply voltage, VCC–
–4
–18
V
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
electrical characteristics at specified free-air temperature, VCC± = ±15 V (unless otherwise noted)
LM148
TEST CONDITIONS†
PARAMETER
MIN
25°C
VIO
Inp t offset voltage
Input
oltage
VO = 0
IIO
Input offset current
VO = 0
Full range
IIB
Inp t bias current
Input
c rrent
VO = 0
Full range
VICR
Common-mode input voltage range
RL ≥ 10 kΩ
Full range
±12
RL = 2 kΩ
25°C
±10
RL ≥ 2 kΩ
Full range
±10
VO = ±10 V,
RL= ≥ 2 kΩ
25°C
50
Full range
25
25°C
0.8
CMRR
Common mode rejection ratio
Common-mode
VIC = VICRmin,
VO = 0
kSVR
Su ly-voltage rejection ratio
Supply-voltage
(∆VCC±/∆VIO)
VCC± = ±9 V to ±15 V,
VO = 0
IOS
Short-circuit output current
AVD = 1
AVD = 1
No load
4
30
50
±10
±10
±10
25
V
160
25
160
V/mV
15
2.5
0.8
2.5
MΩ
MHz
1
1
1
25°C
60°
60°
60°
25°C
70
Full range
70
25°C
77
Full range
77
90
70
90
77
96
77
77
±25
2.4
dB
96
dB
77
±25
3.6
90
70
2.4
25°C
70
70
96
V
±12
±10
15
0.8
nA
±13
±12
±12
nA
200
400
±12
mV
50
±12
±13
±12
2.5
30
UNIT
6
100
500
±12
160
4
200
±12
MAX
7.5
125
100
±12
1
25°C
25°C
VO = 0
VO = VOM
6
TYP
7.5
25
±13
MIN
±25
4.5
2.4
mA
4.5
mA
VO1/VO2 Crosstalk attenuation
f = 1 Hz to 20 kHz
25°C
120
120
120
dB
† All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. Full range for TA is –55°C to 125°C for
LM148, –25°C to 85°C for LM248, and 0°C to 70°C for LM348.
‡ This parameter is not production tested.
3
00 0 0 Unity-gain bandwidth
LM348
MAX
SLOS058C – OCTOBER 1979 – REVISED FEBRUARY 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
±12
B1
φm
1
325
±12
Input resistance‡
S ppl current
Supply
c rrent (four
(fo r amplifiers)
30
25°C
ri
TYP
75
Full range
Large-signal differential voltage
amplification
ICC
5
4
RL = 10 kΩ
AVD
Phase margin
1
MIN
6
25°C
Maximum peak
eak output
out ut voltage
swing
g
MAX
Full range
25°C
VOM
LM248
TYP
SLOS058C – OCTOBER 1979 – REVISED FEBRUARY 2002
operating characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER
SR
TEST CONDITIONS
Slew rate at unity gain
RL = 2 kΩ,
CL = 100 pF,
See Figure 1
PARAMETER MEASUREMENT INFORMATION
–
VI
+
CL = 100 pF
RL = 2 kΩ
Figure 1. Unity-Gain Amplifier
10 kΩ
100 Ω
VI
–
+
RL = 2 kΩ
CL = 100 pF
AVD = –100
Figure 2. Inverting Amplifier
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
TYP
0.5
MAX
UNIT
V/µs
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LM148FKB
ACTIVE
LCCC
FK
20
1
TBD
LM148J
ACTIVE
CDIP
J
14
1
TBD
LM148JB
ACTIVE
CDIP
J
14
1
LM248D
ACTIVE
SOIC
D
14
50
LM248DE4
ACTIVE
SOIC
D
14
50
LM248DR
ACTIVE
SOIC
D
LM248DRE4
ACTIVE
SOIC
LM248N
ACTIVE
LM248NE4
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
TBD
A42 SNPB
N / A for Pkg Type
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LM348D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LM348NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LM348NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LM348NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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