INCHANGE Semiconductor isc N-Channel MOSFET Transistor SPD02N60C3,ISPD02N60C3 ·FEATURES ·Static drain-source on-resistance: RDS(on)≤3Ω ·Enhancement mode: ·100% avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation ·DESCRITION ·Ultra low effective capacitance ·ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-Source Voltage 600 V VGS Gate-Source Voltage ±20 V ID Drain Current-Continuous 1.8 A IDM Drain Current-Single Pulsed 5.4 A PD Total Dissipation @TC=25℃ 25 W Tj Max. Operating Junction Temperature 150 ℃ -55~150 ℃ Tstg Storage Temperature ·THERMAL CHARACTERISTICS SYMBOL Rth(j-c) Rth(j-a) PARAMETER Channel-to-case thermal resistance Channel-to-ambient thermal resistance isc website：www.iscsemi.cn 1 MAX UNIT 5 ℃/W 75 ℃/W isc & iscsemi is registered trademark INCHANGE Semiconductor isc N-Channel MOSFET Transistor SPD02N60C3,ISPD02N60C3 ELECTRICAL CHARACTERISTICS TC=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN BVDSS Drain-Source Breakdown Voltage VGS=0V; ID=0.25mA 600 VGS(th) Gate Threshold Voltage VDS=VGS; ID=80μA 2.1 RDS(on) Drain-Source On-Resistance IGSS TYP MAX UNIT V 3.9 V VGS=10V; ID=1.1A 3 Ω Gate-Source Leakage Current VGS= 30V;VDS=0V 0.1 μA IDSS Drain-Source Leakage Current VDS=600V; VGS= 0V 1 μA VSD Diode forward voltage IF=Is, VGS = 0V 1.2 V isc website：www.iscsemi.cn 2 isc & iscsemi is registered trademark