Microchip MIC5202-5.0YM-TR Dual 100 ma low-dropout regulator Datasheet

MIC5202
Dual 100 mA Low-Dropout Regulator
Features
General Description
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The MIC5202 is a dual linear voltage regulator with low
dropout voltage (typically 17 mV at light loads and
210 mV at 100 mA), and low ground current (1 mA at
100 mA per output). Ideal for battery-operated
applications, the MIC5202 offers 1% output voltage
accuracy and dual enable pins. The enable pins may
be driven individually or tied directly to VIN. When the
part is disabled, power consumption drops to nearly
zero. The MIC5202 ground current increases slightly in
dropout, which minimizes power consumption and
increases battery life. Some key features include
reversed battery protection, current-limit, and
overtemperature protection.
High Output Voltage Accuracy
Variety of Output Voltages
Up to 100 mA of Continuous Output Current
Low Ground Current
Low Dropout Voltage
Excellent Line and Load Regulations
Extremely Low Temperature Coefficient
Current and Thermal Limit Protections
Reverse-Battery Protection
Zero-Off Mode Current
Logic-Controlled Electronic Shutdown
8-Pin SOIC Package
The MIC5202 is available in fixed output voltages in the
small 8-pin SOIC package.
Applications
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Cell Phones
Laptop, Notebook, and Palmtop Computers
Battery-Powered Equipment
PCMCIA VCC and VPP Regulation/Switching
Barcode Scanners
SMPS Post-Regulator/DC-to-DC Modules
High-Efficiency Linear Power Supplies
Typical Application Schematic
MIC5202
8-PIN SOIC
U1
MIC5202
VOUT1
VOUT2
 2016 Microchip Technology Inc.
VOUT1
VIN1
GND1
EN1
VOUT2
VIN2
GND2
EN2
EN1
EN2
DS20005614A-page 1
MIC5202
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Supply Voltage (VIN1, VIN2) ................................................................................................................ –20V to +60V
Enable Input Voltage (EN1, EN2)................................................................................................................ –20V to +60V
ESD Rating (Note 1)................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Input Supply Voltage (VIN1, VIN2) ............................................................................................................... +2.5V to +26V
Enable Input Voltage (EN1, EN2)....................................................................................................................... 0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with
100 pF.
DS20005614A-page 2
 2016 Microchip Technology Inc.
MIC5202
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V, COUT = 10 µF; IOUT = 1 mA; TJ = 25°C, bold values indicate –40°C ≤
TJ ≤ +125°C; unless noted. Specifications are for one LDO. (Note 1).
Parameters
Min.
Typ.
Max.
–1
—
1
–2
—
2
∆VOUT/∆T
—
40
150
Line Regulation
∆VOUT/
VOUT
—
0.004
0.10
—
—
0.40
Load Regulation (Note 3)
∆VOUT/
VOUT
—
0.04
0.16
—
—
0.30
—
17
—
IOUT = 100 µA
—
130
—
IOUT = 20 mA
—
150
—
—
180
—
IOUT = 50 mA
—
225
350
IOUT = 100 mA
—
0.01
—
—
170
—
VEN ≥ 2.0V, IOUT = 100 µA
—
270
—
IOUT = 20 mA
—
330
—
—
500
—
IOUT = 50 mA
—
1200
1500
IOUT = 100 mA
Output Voltage Accuracy
Output Voltage Temperature
Coefficient (Note 2)
Dropout Voltage (Note 4)
Ground Pin Current Shutdown
Ground Pin Current (Note 5)
Sym.
VOUT
VIN –
VOUT
ISHUTDOWN
IGND
Units
Conditions
%
—
ppm/°C
—
%
VIN = VOUT + 1V to 26V
%
IOUT = 0.1 mA to 100 mA
mV
µA
µA
IOUT = 30 mA
VEN ≤ 0.7V (shutdown)
IOUT = 30 mA
Ground Pin Current in Dropout
IGNDDO
—
270
330
µA
VIN = 0.5V less than VOUT,
IOUT = 100 µA
Power Supply Rejection Ratio
PSRR
—
75
—
dB
—
Short Circuit Current Limit
Thermal Regulation (Note 6)
Output Noise
Note 1:
2:
3:
4:
5:
6:
ILIMIT
—
280
—
mA
VOUT = 0V
∆VOUT/
∆PD
—
0.05
—
%/W
—
en
—
100
—
µV
—
Specification for packaged product only.
Output voltage temperature coefficient is defined as the worst case voltage change divided by the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Parts
are tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage caused
by heating effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at
VIN = 26V for t = 10 ms.
 2016 Microchip Technology Inc.
DS20005614A-page 3
MIC5202
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V, COUT = 10 µF; IOUT = 1 mA; TJ = 25°C, bold values indicate –40°C ≤
TJ ≤ +125°C; unless noted. Specifications are for one LDO. (Note 1).
Parameters
Sym.
Min.
Typ.
Max.
—
—
0.7
2.0
—
—
IENL
—
0.01
—
IENH
—
8
50
Units
Conditions
Enable Input
Enable Input Voltage
Enable Input Current
Note 1:
2:
3:
4:
5:
6:
VEN
V
µA
Logic-Low = Off
Logic-High = On
VEN ≤ 0.7V
VEN ≥ 2.0V
Specification for packaged product only.
Output voltage temperature coefficient is defined as the worst case voltage change divided by the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Parts
are tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage caused
by heating effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at
VIN = 26V for t = 10 ms.
DS20005614A-page 4
 2016 Microchip Technology Inc.
MIC5202
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
Storage Temperature
TS
–65
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 10s
JA
—
63
—
°C/W
Temperature Ranges
Note 1
Package Thermal Resistances
Thermal Resistance, SOIC 8-Ld
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
 2016 Microchip Technology Inc.
DS20005614A-page 5
MIC5202
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
10
GROUND CURRENT (mA)
DROPOUT VOLTAGE (mV)
250
200
150
100
50
0
0.01
0.1
1
10
100
1
0.1
0.01
1000
OUTPUT CURRENT (mA)
FIGURE 2-1:
Current.
Dropout Voltage vs. Output
FIGURE 2-4:
Current.
10
100
Ground Current vs. Output
0.3
IOUT = 100mA
0.2
0.1
IOUT = 1mA
-60
0
-30
30
60
120
90
1.4
1.2
0.8
0.6
0.4
IOUT = 1mA
0.2
0.0
150
IOUT = 100mA
1.0
0
TEMPERATURE (ºC)
FIGURE 2-2:
Temperature.
Dropout Voltage vs.
4
8
6
10
FIGURE 2-5:
Voltage.
Ground Current vs. Input
3.5
OUTPUT VOLTAGE (V)
3.0
IOUT = 100mA
2.5
2.0
1.5
1.0
IOUT = 100μA, 1mA
0
2
4
6
3.0
2.5
CIN = 2.2μF
COUT = 4.7μF
2.0
1.5
1.0
0.5
0.5
0.0
2
INPUT VOLTAGE (V)
3.5
OUTPUT VOLTAGE (V)
1
1.6
GROUND CURRENT (mA)
DROPOUT VOLTAGE (V)
0.4
0
0.1
OUTPUT CURRENT (mA)
8
10
0.0
0
FIGURE 2-3:
DS20005614A-page 6
Dropout Characteristics.
0.1
0.2
0.3
OUTPUT CURRENT (A)
INPUT VOLTAGE (V)
FIGURE 2-6:
Current.
Output Voltage vs. Output
 2016 Microchip Technology Inc.
MIC5202
3.6
IOUT = 100μA
OUTPUT VOLTAGE (V)
GROUND CURRENT (mA)
0.30
CIN = 2.2μF
COUT = 4.7μF
0.25
0.20
0.15
-60
-30
0
30
60
90
120
3.5
COUT = 4.7μF
3.4
3.3
3.2
3 DEVICES:
HI/AVG/LO
3.1
CURVES APPLICABLE
AT 100μA AND 100mA
3.0
-60
150
CIN = 2.2μF
-30
TEMPERATURE (ºC)
FIGURE 2-7:
Temperature.
Ground Current vs.
OUTPUT CURRENT (mA)
GROUND CURRENT (mA)
90
60
120
150
300
IOUT = 100mA
1.4
CIN = 2.2μF
COUT = 4.7μF
1.3
1.2
1.1
280
260
240
220
VOUT = 3.3V
200
180
VOUT = 0V
(SHORT CIRCUIT)
160
140
120
1.0
-50
50
0
100
100
-60
150
-30
FIGURE 2-8:
Temperature.
FIGURE 2-11:
Temperature.
Ground Current vs.
30
60
90
120
150
Output Current vs.
3.30
MINIMUM INPUT VOLTAGE (V)
100
50
0
COUT = 4.7μF
100
0
0
5
10
15
20
25
30
35
3.29
3.28
Thermal Regulation (3.3V
 2016 Microchip Technology Inc.
CIN = 2.2μF
3.27
COUT = 4.7μF
3.26
IOUT = 1mA
3.25
3.24
3.23
3.22
3.21
3.20
-60
-30
0
30
60
90
120
150
TEMPERATURE (ºC)
TIME (ms)
FIGURE 2-9:
Version).
0
TEMPERATURE (ºC)
TEMPERATURE (ºC)
¨OUTPUT (mV)
30
FIGURE 2-10:
Output Voltage vs.
Temperature (3.3V Version).
1.5
OUTPUT
CURRENT (mA)
0
TEMPERATURE (ºC)
FIGURE 2-12:
Temperature.
Minimum Input Voltage vs.
DS20005614A-page 7
300
120
250
100
INPUT CURRENT (mA)
SHORT CIRCUIT CURRENT (mA)
MIC5202
200
150
100
CIN = 2.2μF
50
VOUT = 3.3V
0
COUT = 4.7μF
1
2
3
5
4
6
80
60
40
20
0
7
ROUT = 33Ÿ
0
1
2
Short Circuit Current vs.
¨OUTPUT (mV)
20
10
0
-10
COUT = 4.7μF
-20
200
100
0
0
2
4
8
6
¨OUTPUT (mV)
COUT = 47μF
200
100
10
20
-5
6
4
0.2
DS20005614A-page 8
0.4
0.6
0.8
30
Load Transient.
Line Transient.
15
10
COUT = 10μF
5
IOUT = 1mA
0
6
4
40
0
TIME (ms)
FIGURE 2-15:
10
IOUT = 1mA
0
INPUT
VLOTAGE (V)
¨OUTPUT (mV)
OUTPUT
CURRENT (mA)
0
0
9
0
FIGURE 2-17:
10
0
8
TIME (ms)
20
-20
7
COUT = 1μF
5
10
Load Transient.
-10
6
10
TIME (ms)
FIGURE 2-14:
5
4
FIGURE 2-16:
Input Current vs. Input
Voltage (3.3V Version).
INPUT
VLOTAGE (V)
OUTPUT
CURRENT (mA)
¨OUTPUT (mV)
FIGURE 2-13:
Input Voltage.
3
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
0.1
0.2
0.3
0.4
0.5
0.6
TIME (ms)
FIGURE 2-18:
Line Transient.
 2016 Microchip Technology Inc.
MIC5202
1000
0.001
0
1
2
3
4
5
6
IOUT = 100mA
0.01
7
FREQUENCY (Hz)
INPUT VOLTAGE (V)
FIGURE 2-19:
Input Current vs. Input
Voltage (3.3V Version).
FIGURE 2-22:
4
ENABLE CURRENT (μA)
OUTPUT (V)
ENABLE (V)
Output Impedance.
35
5
3
2
COUT = 4.7μF
1
IOUT = 1mA
0
2
0
0
50
150
100
200
250
COUT = 4.7μF
25
20
15
VEN = 5V
10
5
VEN = 2V
0
-5
-60
300
CIN = 2.2μF
30
-30
FIGURE 2-20:
Version).
Enable Transient (3.3V
FIGURE 2-23:
vs. Temperature.
4
3
2
ENABLE VOLTAGE (V)
OUTPUT (V)
30
60
90
120
150
Enable Current Threshold
1.6
5
ENABLE (V)
0
TEMPERATURE (ºC)
TIME (μs)
COUT = 4.7μF
1
IOUT = 100mA
0
2
0
0
50
100
150
200
250
300
TIME (μs)
FIGURE 2-21:
Version).
1×106
0
0.1
100×103
10
IOUT = 1mA
1
10×103
ROUT = 66Ÿ
20
10
1×103
30
IOUT = 100μA
100×100
40
100
10×100
50
1×100
OUTPUT IMPEDANCE (Ÿ)
INPUT CURRENT (mA)
60
Enable Transient (3.3V
 2016 Microchip Technology Inc.
1.4
CIN = 2.2μF
COUT = 4.7μF
1.2
1.0
ON
0.8
OFF
0.6
0.4
-60
-30
0
30
60
90
120
150
TEMPERATURE (ºC)
FIGURE 2-24:
vs. Temperature.
Enable Voltage Threshold
DS20005614A-page 9
MIC5202
80
IOUT = 100μA
60
40
FIGURE 2-25:
FREQUENCY (Hz)
1×106
100×103
10×103
1×103
0
100×100
20
10×100
RIPPLE VOLTAGE (dB)
100
Ripple vs. Frequency.
80
IOUT = 1mA
60
40
FIGURE 2-26:
FREQUENCY (Hz)
1×106
100×103
10×103
1×103
0
100×100
20
10×100
RIPPLE VOLTAGE (dB)
100
Ripple vs. Frequency.
80
IOUT = 100mA
60
40
FIGURE 2-27:
DS20005614A-page 10
FREQUENCY (Hz)
1×106
100×103
10×103
1×103
0
100×100
20
10×100
RIPPLE VOLTAGE (dB)
100
Ripple vs. Frequency.
 2016 Microchip Technology Inc.
MIC5202
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Package Type
MIC5202
8-Pin SOIC (M)
(Top View)
TABLE 3-1:
VOUT1
1
8
VIN1
GND1
2
7
EN1
VOUT2
3
6
VIN2
GND2
4
5
EN2
PIN FUNCTION TABLE
Pin Number
Pin Name
1
VOUT1
Output of regulator 1.
2
GND1
Ground pin of LDO1.
3
VOUT2
Output of regulator 2.
4
GND2
Ground pin of LDO2.
5
EN2
Enable input for LDO2. Active-high Input. Logic-high = On, logic-low = Off. Do not
leave floating.
6
VIN2
Voltage input for LDO2.
7
EN1
Enable input for LDO1. Active-high Input. Logic-high = On, logic-low = Off. Do not
leave floating.
8
VIN1
Voltage input for LDO1.
 2016 Microchip Technology Inc.
Description
DS20005614A-page 11
MIC5202
4.0
APPLICATION INFORMATION
The MIC5202 is a dual linear voltage regulator with low
dropout voltage and low ground current features. Ideal
for battery-operated applications, the MIC5202 offers
1% output voltage accuracy, two independent enable
pins, reversed battery protection, short circuit current
limit and overtemperature protection. When the
MIC5202 is disabled, the ground pin current drops to
sub-micro amp and prolongs the battery life.
4.1
Input Supply Voltage
VIN1 and VIN2 provide power to each internal circuit and
may be tied together.
4.2
regulator and sends it to a “zero” off-mode-current
state. In this state, current consumed by the regulator
goes nearly to zero. Forcing the enable pin high
enables the output voltage. The active-high enable pin
typically consumes 8 µA of current and cannot be left
floating; a floating enable pin may cause an
indeterminate state on the output.
4.7
Thermal Shutdown
When the internal die temperature of MIC5202 reaches
the limit, the internal driver is disabled until the die
temperature falls.
Ground
Both ground pins (pin 2 and 4) must be tied to the same
ground potential when using a single power supply.
4.3
Input Capacitor
A 1 µF tantalum or aluminum electrolytic capacitor
should be placed close to each VIN pin if there is more
than 10 inches of copper between the input and the
capacitor, or if a battery is used as the supply.
4.4
Output Capacitor
The MIC5202 requires an output capacitor of 1 µF or
greater to maintain stability. Increasing the output
capacitor leads to an improved transient response;
however, the size and cost also increase. Most
tantalum and aluminum electrolytic capacitors are
adequate; film capacitors will work as well, but at a
higher cost. Many aluminum electrolytics have
electrolytes that freeze at –30°C, so tantalum
capacitors are recommended for operations below
–25°C. An equivalent series resistance (ESR) of 5Ω or
less with a resonance frequency above 500 kHz is
recommended. The output capacitor value may be
increased without limit.
At lower output loads, a smaller output capacitor value
is required for output stability. The capacitor can be
reduced to 0.47 µF for current below 10 mA or 0.33 µF
for current below 1 mA.
4.5
No-Load Stability
Unlike many other voltage regulators, the MIC5202
remains stable and in regulation with no load. This is
especially important in CMOS RAM keep-alive
applications.
4.6
Enable Input
The MIC5202 features dual active-high enable pins
that allow each regulator to be enabled and disabled
independently. Forcing the enable pin low disables the
DS20005614A-page 12
 2016 Microchip Technology Inc.
MIC5202
5.0
THERMAL CONSIDERATIONS
5.1
Layout
The MIC5202 (8-pin SOIC package) has the thermal
characteristics shown in Table 5-1, when mounted on a
single-layer copper-clad printed circuit board.
TABLE 5-1:
THERMAL CHARACTERISTIC
CONSIDERATIONS
PC Board Dielectric
θJA
FR4
160°C/W
Ceramic
120°C/W
Multi-layer boards with a dedicated ground plane, wide
traces, and large supply bus lines provide better
thermal conductivity.
The “worst case” value of 160°C/W assumes no ground
plane, minimum trace widths, and a FR4 material
board.
5.2
Nominal Power Dissipation and
Die Temperature
At +25°C ambient temperature, the MIC5202 operates
reliably at up to 625 mW when mounted in the “worst
case” manner described in the previous section. At an
ambient temperature of +55°C, the device can safely
dissipate 440 mW. These power levels are equivalent
to a die temperature of +125°C, which corresponds to
the recommended maximum temperature for
non-military grade silicon integrated circuits.
 2016 Microchip Technology Inc.
DS20005614A-page 13
MIC5202
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Legend: XX...X
Y
YY
WW
NNN
e3
*
8-Pin SOIC*
Example
XXXX
XXYM
YYWWC
5202
50YM
1423C
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) symbol may not be to scale.
DS20005614A-page 14
 2016 Microchip Technology Inc.
MIC5202
8-Pin SOIC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
 2016 Microchip Technology Inc.
DS20005614A-page 15
MIC5202
NOTES:
DS20005614A-page 16
 2016 Microchip Technology Inc.
MIC5202
APPENDIX A:
REVISION HISTORY
Revision A (August 2016)
• Converted Micrel document MIC5202 to Microchip data sheet DS20005614A.
• Minor text changes throughout.
 2016 Microchip Technology Inc.
DS20005614A-page 17
MIC5202
NOTES:
DS20005614A-page 18
 2016 Microchip Technology Inc.
MIC5202
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
–
PART NO.
Device
X.X
X
XX
–
X.X
Examples:
a) MIC5202-3.0YM:
Dual 100 mA Low-Dropout
Regulator, 3.0V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 95/Tube
b) MIC5202-3.0YM-TR:
Dual 100 mA Low-Dropout
Regulator, 3.0 Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 2,500/Reel
c) MIC5202-3.3YM:
Dual 100 mA Low-Dropout
Regulator, 3.3V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 95/Tube
d) MIC5202-3.3YM-TR:
Dual 100 mA Low-Dropout
Regulator, 3.3V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 2,500/Reel
e) MIC5202-4.8YM:
Dual 100 mA Low-Dropout
Regulator, 4.85V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 95/Tube
f)
Dual 100 mA Low-Dropout
Regulator, 4.85V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 2,500/Reel
Output Temperature Package Media Type
Voltage
Device:
MIC5202:
Output Voltage:
3.0
3.3
4.8
5.0
=
=
=
=
Dual 100 mA Low-Dropout Regulator
3.0V
3.3V
4.85V
5.0V
Temperature:
Y
=
–40°C to +125°C
Package:
M
=
8-Pin SOIC
Media Type:
TR =
blank=
2,500/Reel
95/Tube
 2016 Microchip Technology Inc.
MIC5202-4.8YM-TR:
g) MIC5202-5.0YM:
Dual 100 mA Low-Dropout
Regulator, 5.0V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 95/Tube
h) MIC5202-5.0YM-TR:
Dual 100 mA Low-Dropout
Regulator, 5.0V Voltage,
–40°C to +125°C Temp. Range,
8-Pin SOIC, 2,500/Reel
DS20005614A-page 19
MIC5202
NOTES:
DS20005614A-page 20
 2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2016 Microchip Technology Inc.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0891-8
DS20005614A-page 21
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06/23/16
DS20005614A-page 22
 2016 Microchip Technology Inc.