LAPIS FEDL610406-03 8-bit microcontroller with a built-in lcd driver Datasheet

FEDL610406-05
Issue Date: May. 23, 2014
ML610404/ML610405/ML610406
8-bit Microcontroller with a Built-in LCD driver
GENERAL DESCRIPTION
ML610404/ML610405/ML610406 is a high-performance 8-bit CMOS microcontroller into which peripheral circuits, such as
synchronous serial port, UART, melody driver, RC oscillation type A/D converter, and LCD driver, are incorporated around
LAPIS Semiconductor-original 8-bit CPU nX-U8/100. ML610404/ML610405/ML610406 operates in both high/low-speed
mode and power-saving mode, it is most suitable for battery operated products.
The short TAT are entertained by offering MTP version ML610Q407/ML610Q408/ML610Q409.
ML610404P/ ML610405P/ML610406P support industrial temperature -40°C to +85°C, are added to the product lineup.
FEATURES
• CPU
− 8-bit RISC CPU (CPU name: nX-U8/100)
− Instruction system: 16-bit instructions
− Instruction set:
Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit
manipulations, bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic
shift, and so on
− Minimum instruction execution time
30.5 µs (@32.768 kHz system clock)
2µs (@500kHz system clock)
0.5µs(@2MHz system clock)
• Internal memory
− ML610404/5/6 :
Internal 8KByte Mask ROM (4K×16 bits) (including unusable 128 Byte TEST area)
Internal 256Byte Data RAM (256×8 bits)
• Interrupt controller
− 1 non-maskable interrupt sources
Internal source: 1 (Watch dog timer)
− 27 maskable interrupt sources
Internal sources: 14 (Synchronous serial port 0, Synchronous serial port 1, Timer0, Timer1, Timer2, Timer3, UART0,
Melody0, RC Oscillation type A/D converter, PWM0, TBC128Hz, TBC32Hz, TBC16Hz, TBC2Hz)
External sources: 13 (P00, P01, P02, P03, P04, P50, P51, P52, P53, P54, P55, P56, P57)
(One interrupt request is generated from P50 to P57 interrupt sources.)
• Time base counter
− Low-speed time base counter ×1 channel
Frequency compensation (Compensation range: Approx. −488ppm to +488ppm. Compensation accuracy: Approx.
0.48ppm)
− High-speed time base counter ×1 channel
•
Watchdog timer
− Non-maskable interrupt and reset
− Free running
− Overflow period: 4 types selectable (125ms, 500ms, 2s, 8s)
• Timers
− 8 bits × 4 channels [also available is 16-bit configuration (using Timers 0 and 1, or Timers 2 and 3) x 2 channels]
− Clock frequency measurement function mode (16-bit configuration using Timers 2 and 3 x 1 channel only)
1/30
FEDL610406-05
ML610404/ML610405/ML610406
• Capture
− Time base capture × 2 channels (4096 Hz to 32 Hz)
• PWM
− Resolution 16 bits × 1 channel
• Synchronous serial port
− Master/slave selectable × 2 channel
− LSB first/MSB first selectable
− 8-bit length/16-bit length selectable
• UART
− TXD/RXD × 1 channel
− Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits
− Positive logic/negative logic selectable
− Built-in baud rate generator
• Melody driver
− Scale: 29 types (Melody sound frequency: 508 Hz to 32.768 kHz)
− Tone length: 63 types
− Tempo: 15 types
− Buzzer output mode (4 output modes, 8 frequencies, 16 duty levels)
• RC oscillation type A/D converter
− 16-bit counter
− Time division × 2 channels
• General-purpose ports
− Input-only port × 5 channels (including secondary functions)
− Output-only port
ML610404: × 12 channels (including secondary functions)
ML610405: × 8 channels (including secondary functions)
ML610406: × 4 channels (including secondary functions)
− Input/output port × 22 channels (including secondary functions)
• LCD driver
Number of segments
ML610404: Up to 105 dots (select among 21 segments x 5 commons, 22 segments x 4 commons, 23 segments
x 3 commons, and 24segments x 2 commons)
ML610405: Up to 125 dots (select among 25 segments x 5 commons, 26 segments x 4 commons, 27 segments
x 3 commons, and 28 segments x 2 commons)
ML610406: Up to 145 dots (select among 29 segments x 5 commons, 30 segments x 4 commons, 31 segments
x 3 commons, and 32 segments x 2 commons)
− 1/1 to 1/5 duty
− 1/2, 1/3 bias (built-in bias generation circuit)
− Frame frequency selecable: approx. 64Hz, 73Hz, 85Hz, and 102Hz
− Bias voltage multiplying clock selectable (8 types)
− LCD drive stop mode, LCD display mode, all LCDs on mode, and all LCDs off mode selectable
− Programmable display allocation function
• Reset
− Reset through the RESET_N pin
− Power-on reset generation when powered on
− Reset when oscillation stop of the low-speed clock is detected (Cancellation by a mask option is possible)
− Reset by the watchdog timer (WDT) overflow
2/30
FEDL610406-05
ML610404/ML610405/ML610406
• Clock
− Low-speed clock (Operation of this LSI is not guaranteed under a condition with no supply of low-speed crystal oscillation
clock)
Crystal oscillation (32.768 kHz)
− High-speed clock: Built-in RC oscillation (500 kHz, 2MHz)
• Power management
− HALT mode: Suspends the instruction execution by CPU (peripheral circuits are in operating states)
− STOP mode: Stops the low-speed oscillation and high-speed oscillation (Operations of CPU and peripheral circuits are
stopped.)
− High-speed clock gear: The frequency of high-speed system clock can be changed by software (1/1, 1/2, 1/4, or 1/8 of the
oscillation clock)
− Block control function: Completely stops the operation of any function block circuit that is not used (resets registers and
stops clock)
• Guaranteed operating range
− Operating temperature: -20°C to +70°C (P version: -40°C to +85°C)
− Operating voltage: VDD = 1.25V to 3.6V
3/30
FEDL610406-05
ML610404/ML610405/ML610406
• Product name – Supported Function
- Chip (Die) -
LCD bias
Low-speed
oscillation
stop detect reset
Cancellation by a
mask option is
possible
Cancellation by a
mask option is
possible
Operating
temperature
Product availability
-20°C to +70°C
Yes
-20°C to +70°C
Yes
1/2
1/3
ML610404-xxxWA
Yes
Yes
ML610405-xxxWA
Yes
Yes
ML610406-xxxWA
Yes
Yes
Cancellation by a
mask option is
possible
-20°C to +70°C
Yes
ML610404P-xxxWA
Yes
Yes
Cancellation by a
mask option is
possible
-40°C to +85°C
Yes
ML610405P-xxxWA
Yes
Yes
Cancellation by a
mask option is
possible
-40°C to +85°C
Yes
Yes
Cancellation by a
mask option is
possible
-40°C to +85°C
Yes
ML610406P-xxxWA
-80-pin plastic
TQFP -
Yes
LCD bias
Low-speed
oscillation
stop detect reset
Cancellation by a
mask option is
possible
Cancellation by a
mask option is
possible
Operating
temperature
Product availability
-20°C to +70°C
-
-20°C to +70°C
-
1/2
1/3
ML610404-xxxTB
Yes
Yes
ML610405-xxxTB
Yes
Yes
ML610406-xxxTB
Yes
Yes
Cancellation by a
mask option is
possible
-20°C to +70°C
-
ML610404P-xxxTB
Yes
Yes
Cancellation by a
mask option is
possible
-40°C to +85°C
-
ML610405P-xxxTB
Yes
Yes
Cancellation by a
mask option is
possible
-40°C to +85°C
ML610406P-xxxTB
Yes
Yes
Cancellation by a
mask option is
possible
-40°C to +85°C
-
xxx: ROM code number (xxx of the blank product is NNN)
Q: MTP version
P: Wide range temperature version (P version)
WA: Chip (Die)
TB: TQFP
4/30
FEDL610406-05
ML610404/ML610405/ML610406
BLOCK DIAGRAM
Block Diagram of ML610404/ML610405/ML610406
CPU (nX-U8/100)
EPSW1~3
GREG
0~15
PSW
Timing
Controller
ALU
ECSR1~3
LR
DSR/CSR
EA
PC
SP
Instruction
Decoder
Instruction
Register
Data-bus
VDD
VSS
RESET_N
TEST0
ELR1~3
Program
Memory
(ROM)
8Kbyte
BUS
Controller
INT
2
RAM
256byte
RESET &
TEST
SSIO
×2
Interrupt
Controller
XT0**
XT1**
INT
1
OSC
LSCLK*
OUTCLK*
VDDL
IN0*
CS0*
RS0*
RT0*
RCT0*
RCM*
IN1*
CS1*
RS1*
RT1*
INT
4
WDT
TBC
Power
INT
1
RC-ADC
×2
INT
4
8bit Timer
×4
Display
Allocation
RAM
Display
register
320bit
SCK1*
SIN1*
SOUT1*
INT
1
UART
RXD0*
TXD0*
PWM
PWM0*
INT
1
INT
1
Capture
×2
SCK0*
SIN0*
SOUT0*
Melody
INT
6
GPIO
MD0*
P00 to P04
P20 to P23, P24
P30 to P35
P40 to P47
P50 to P57
P60 to P67 (ML610404)
P60 to P63 (ML610405)
LCD
Driver
LCD
BIAS
COM0 to COM4 (*1)(*2)(*3)
SEG0 to SEG23 (ML610404) (*1)
SEG0 to SEG27 (ML610405) (*2)
SEG0 to SEG31 (ML610406) (*3)
VL1, VL2, VL3
C1, C2
* Secondary function
or Tertiary function
“*1”: Select among 21 segments x 5 commons, 22 segments x 4 commons, 23 segments x 3 commons, and 24 segments x 2
commons with the register
“*2”: Select among 25 segments x 5 commons, 26 segments x 4 commons, 27 segments x 3 commons, and 28 segments x 2
commons with the register
“*3”: Select among 29 segments x 5 commons, 30 segments x 4 commons, 31 segments x 3 commons, and 32 segments x 2
commons with the register
Figure 1 Block Diagram of ML610404/ML610405/ML610406
5/30
FEDL610406-05
ML610404/ML610405/ML610406
PIN CONFIGURATION
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
P22
P21
P20
VSS
P60
P61
P62
P63
P64
P65
P66
P67
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
Pin Layout of ML610404 Chip
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
XT1
RESET_N
TEST0
VL1
VL2
VL3
P50
P40
P41
P42
P43
P44
P45
P46
P47
VDD
VSS
VDDL
XT0
2.1 mm
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
2.1 mm
SEG6
SEG5
SEG4
SEG3
COM4/SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
C2
C1
14
15
16
17
18
19
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
1
2
3
4
5
6
7
8
9
10
11
12
13
P24
P00
P01
P02
P03
P04
P30
P31
P34
P32
P33
P35
P57
P56
P55
P54
P53
P52
P51
Y
X
Note:
The assignment of the pads P30 to P35 are not in order.
Chip size: 2.1 mm × 2.1 mm
PAD count: 78 pins
Minimum PAD pitch: 80µm
PAD aperture: 70µm×70µm
Chip thickness: 350µm
Voltage of the rear side of chip: VSS leve
Figure 2 Dimensions of ML610404 Chip
6/30
FEDL610406-05
ML610404/ML610405/ML610406
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
P22
P21
P20
VSS
P60
P61
P62
P63
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
Pin Layout of ML610405 Chip
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
XT1
RESET_N
TEST0
VL1
VL2
VL3
P50
P40
P41
P42
P43
P44
P45
P46
P47
VDD
VSS
VDDL
XT0
2.1 mm
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
2.1 mm
SEG6
SEG5
SEG4
SEG3
COM4/SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
C2
C1
14
15
16
17
18
19
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
1
2
3
4
5
6
7
8
9
10
11
12
13
P24
P00
P01
P02
P03
P04
P30
P31
P34
P32
P33
P35
P57
P56
P55
P54
P53
P52
P51
Y
X
Note:
The assignment of the pads P30 to P35 are not in order.
Chip size: 2.1 mm × 2.1 mm
PAD count: 78 pins
Minimum PAD pitch: 80µm
PAD aperture: 70µm×70µm
Chip thickness: 350µm
Voltage of the rear side of chip: VSS level.
Figure 3 Dimensions of ML610405 Chip
7/30
FEDL610406-05
ML610404/ML610405/ML610406
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
P22
P21
P20
VSS
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
Pin Layout of ML610406 Chip
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
XT1
RESET_N
TEST0
VL1
VL2
VL3
P50
P40
P41
P42
P43
P44
P45
P46
P47
VDD
VSS
VDDL
XT0
2.1 mm
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
2.1 mm
SEG6
SEG5
SEG4
SEG3
COM4/SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
C2
C1
14
15
16
17
18
19
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
1
2
3
4
5
6
7
8
9
10
11
12
13
P24
P00
P01
P02
P03
P04
P30
P31
P34
P32
P33
P35
P57
P56
P55
P54
P53
P52
P51
Y
X
Note:
The assignment of the pads P30 to P35 are not in order.
Chip size: 2.1 mm × 2.1 mm
PAD count: 78pins
Minimum PAD pitch: 80 µm
PAD aperture: 70 µm×70 µm
Chip thickness: 350 µm
Voltage of the rear side of chip: VSS level.
Figure 4 Dimensions of ML610406 Chip
8/30
FEDL610406-05
ML610404/ML610405/ML610406
Pad Coordinates of ML610404/ML610405/M610406 Chip
Table 1 Pad Coordinates of ML610404/ML610405/ML610406
(*1)
PAD
No.
Pad
Name
1
P50
2
P40
3
P41
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
P42
P43
P44
P45
P46
P47
VDD
VSS
VDDL
XT0
XT1
RESET_N
TEST0
VL1
VL2
VL3
C1
21
C2
22
COM0
23
COM1
24
COM2/SEG0
25
COM3/SEG1
26
COM4/SEG2
27
SEG3
28
SEG4
29
SEG5
30
SEG6
31
SEG7
32
SEG8
33
SEG9
34
SEG10
35
SEG11
36
SEG12
37
SEG13
38
SEG14
39
SEG15
40
SEG16
41
SEG17
42
SEG18
43
SEG19
ML610404/5/6
X (µm)
Y (µm)
-773
-693
-613
-533
-453
-373
-293
-213
-133
-53
27
107
187
347
427
507
587
667
747
944
944
944
944
944
944
944
944
944
944
944
944
944
944
944
944
944
944
944
944
770
690
610
530
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-810
-730
-650
-570
-490
-410
-330
-250
-170
-90
-10
70
150
230
310
390
470
550
630
710
944
944
944
944
PAD
No.
Pad
Name
44
SEG20
45
SEG21
46
SEG22
47
55
SEG23
P67 (*1)
SEG24 (*2)(*3)
P66 (*1)
SEG25 (*2)(*3)
P65 (*1)
SEG26 (*2)(*3)
P64 (*1)
SEG27 (*2)(*3)
P63 (*1)(*2)
SEG28 (*3)
P62 (*1)(*2)
SEG29 (*3)
P61 (*1)(*2)
SEG30 (*3)
P60 (*1)(*2)
SEG31 (*3)
56
VSS
57
P20
58
P21
59
P22
60
P24
61
P00
62
P01
63
P02
64
P03
65
P04
66
P30
67
P31
68
P34
69
P32
70
P33
71
P35
72
P57
73
P56
74
P55
75
P54
76
P53
77
P52
78
P51
48
49
50
51
52
53
54
Chip Center: X=0,Y=0
ML610404/5/6
X (µm)
Y (µm)
450
370
290
210
944
944
944
944
115
944
35
944
-45
944
-125
944
-205
944
-285
944
-365
944
-445
-525
-605
-685
-765
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
-944
944
944
944
944
944
717
617
537
457
377
297
217
137
57
-23
-103
-183
-263
-343
-423
-503
-583
-663
-743
Pad for ML610404 . (*2) Pad for ML610405. (*3) Pad for ML610406
9/30
FEDL610406-05
ML610404/ML610405/ML610406
List of Pins
Primary function
PIN
No.
PAD
No.
Pin name
I/O
Function
11,57
10
11,56
10
Vss
VDD
⎯
⎯
12
12
VDDL
⎯
18
17
VL1
⎯
19
18
VL2
⎯
20
19
VL3
⎯
21
20
C1
⎯
22
21
C2
⎯
17
16
14
15
16
15
13
14
TEST0
RESET_N
XT0
XT1
I/O
I
I
O
62
61
P00/EXI0/
CAP0
I
63
62
P01/EXI1/
CAP1
I
64
63
P02/EXI2/
RXD0
I
65
64
P03/EXI3
I
66
65
P04/EXI4/
T02P0CK
I
58
59
60
61
57
58
59
60
P20/LED0
P21/LED1
P22/LED2
P24/LED4
O
O
O
O
Negative power supply pin
Positive power supply pin
Power supply pin for internal logic
(internally generated)
Power supply pin for LCD bias
(internally generated or connected
to positive power supply pin)(*1)
Power supply pin for LCD bias
(internally generated or connected
to positive power supply pin)(*1)
Power supply pin for LCD bias
(internally generated or connected
to positive power supply pin)(*1)
Capacitor connection pin for LCD
bias generation
Capacitor connection pin for LCD
bias generation
Test input pin
Reset input pin
Low-speed clock oscillation pin
Low-speed clock oscillation pin
Input port,
External interrupt,
Capture 0 input
Input port,
External interrupt,
Capture 1 input
Input port,
External interrupt,
UART0 received data
Input port,
External interrupt
Input port,
Timer 0/Timer 2/PWM0 external
clock input
External interrupt
Output port
Output port
Output port
Output port
67
66
P30
I/O
68
67
P31
69
68
70
Secondary function or Tertiary function
Secondary/
Tertiary
⎯
⎯
Pin name
I/O
Function
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Secondary
Secondary
Secondary
Secondary
LSCLK
OUTCLK
MD0
PWM0
O
O
O
O
Input/output port
Secondary
IN0
I
I/O
Input/output port
Secondary
CS0
O
P34
I/O
Input/output port
Secondary
RCT0
O
69
P32
I/O
Input/output port
Secondary
RS0
O
71
70
P33
I/O
Input/output port
Secondary
RT0
O
72
71
P35
I/O
Input/output port
Secondary
RCM
O
Low-speed clock output
High-speed clock output
Melody 0 output
PWM0 output
RC type ADC0 oscillation
input pin
RC type ADC0 reference
capacitor connection pin
RC type ADC0
resistor/capacitor sensor
connection pin
RC type ADC0 reference
resistor connection pin
RC type ADC0 measurement
resistor sensor connection
pin
RC type ADC oscillation
monitor
10/30
FEDL610406-05
ML610404/ML610405/ML610406
Primary function
PIN
No.
PAD
No.
Pin name
I/O
2
2
P40
I/O
Input/output port
3
3
P41
I/O
Input/output port
4
4
P42
I/O
Input/output port
5
5
P43
I/O
Input/output port
6
6
P44/
T02P0CK
I/O
Input/output port,
Timer 0/Timer 2/PWM0 external
clock input
I/O
Input/output port,
Timer 1/Timer 3 external clock
input
7
8
9
7
8
9
P45/T13CK
P46
P47
I/O
Function
Input/output port
Secondary function or Tertiary function
Secondary
/Tertiary
Secondary
Tertiary
Secondary
Pin name
I/O
Function
⎯
SIN0
⎯
⎯
I
⎯
Tertiary
SCK0
I/O
Secondary
Tertiary
Secondary
Tertiary
RXD0
SOUT0
TXD0
PWM0
I
O
O
O
Secondary
IN1
I
Tertiary
SIN0
I
Secondary
CS1
O
⎯
SSIO0 data input
⎯
SSIO0 synchronous clock
input/output
UART data input
SSIO0 data output
UART data output
PWM0 output
RC type ADC1 oscillation input
pin
SSIO0 data input
RC type ADC1 reference
capacitor connection pin
Tertiary
SCK0
I/O
Secondary
RS1
O
Tertiary
SOUT0
O
I/O
Input/output port
Secondary
RT1
O
Secondary
Tertiary
Secondary
MD0
SIN1
⎯
O
I
⎯
Tertiary
SCK1
I/O
Secondary
Tertiary
⎯
SOUT1
⎯
O
⎯
⎯
⎯
Secondary
Tertiary
Secondary
⎯
SIN1
⎯
⎯
I
⎯
Tertiary
SCK1
I/O
Secondary
Tertiary
⎯
SOUT1
⎯
O
⎯
⎯
⎯
1
1
P50/EXI8
I/O
Input/output port,
External interrupt
79
78
P51/EXI8
I/O
Input/output port,
External interrupt
78
77
P52/EXI8
I/O
77
76
P53/EXI8
I/O
76
75
P54/EXI8
I/O
75
74
P55/EXI8
I/O
74
73
P56/EXI8
I/O
73
72
P57/EXI8
I/O
Input/output port,
External interrupt
Input/output port,
External interrupt
Input/output port,
External interrupt
Input/output port,
External interrupt
Input/output port,
External interrupt
Input/output port,
External interrupt
SSIO0 synchronous clock
input/output
RC type ADC1 reference
resistor connection pin
SSIO0 data output
RC type ADC1 measurement
resistor sensor connection pin
Melody 0 output
SSIO1 data input
⎯
SSIO1 synchronous clock
input/output
⎯
SSIO1 data output
⎯
⎯
SSIO1 data input
⎯
SSIO1 synchronous clock
input/output
⎯
SSIO1 data output
⎯
11/30
FEDL610406-05
ML610404/ML610405/ML610406
PIN
No.
PAD
No.
23
24
22
23
25
24
26
25
27
26
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
49
48
50
49
51
50
52
51
53
52
54
53
55
54
56
55
Primary function
Function
Secondary function or Tertiary function
Secondary/
Tertiary
⎯
⎯
Pin
name
⎯
⎯
Pin name
I/O
COM0
COM1
COM2/
SEG0
COM3/
SEG1
COM4/
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
P67(*2)
SEG24(*3)
P66(*2)
SEG25(*3)
P65(*2)
SEG26(*3)
P64(*2)
SEG27(*3)
P63(*4)
SEG28(*5)
P62(*4)
SEG29*5)
P61(*4)
SEG30(*5)
P60(*4)
SEG31(*5)
O
O
LCD common pin
LCD common pin
I/O
Function
⎯
⎯
⎯
⎯
O
LCD common/segment pin
⎯
⎯
⎯
⎯
O
LCD common/segment pin
⎯
⎯
⎯
⎯
O
LCD common/segment pin
⎯
⎯
⎯
⎯
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
Output port
LCD segment pin
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
(*1) Internally generated, or connect to either positive power supply pin (VDD) or power supply pin for internal logic (VDDL). For
details, see user’s manual.
(*2) Pin for ML610404
(*3) Pin for ML610405/ML610406
(*4) Pin for ML610404/ML610405
(*5) Pin for ML610406
12/30
FEDL610406-05
ML610404/ML610405/ML610406
PIN DESCRIPTION
Pin name
I/O
Description
Primary/
Secondary/
Tertiary
Logic
System
Reset input pin. When this pin is set to a “L” level, system reset mode is
—
Negative
set and the internal section is initialized. When this pin is set to a “H” level
subsequently, program execution starts. A pull-up resistor is internally
connected.
XT0
I Crystal connection pin for low-speed clock.
—
—
XT1
O A 32.768 kHz crystal resonator is connected to this pin. Capacitors CDL
—
—
and CGL are connected across this pin and VSS. (see measuring circuit 1) .
LSCLK
O Low-speed clock output. Assigned to the secondary function of the P20
Secondary
—
pin.
OUTCLK
O High-speed clock output pin. This pin is used as the secondary function of Secondary
—
the P21 pin.
General-purpose input port
RESET_N
I
P00 to P04
I General-purpose input port.
General-purpose output port
P20 to P22, O General-purpose output port.
P24
This cannot be used as the general output port when used as the
secondary function.
General-purpose input/output port
P30 to P35 I/O General-purpose input/output port.
This cannot be used as the general input/output port when used as the
secondary function.
P40 to P47 I/O General-purpose input/output port.
This cannot be used as the general input/output port when used as the
secondary or tertiary function.
P50 to P57 I/O General-purpose input/output port.
This cannot be used as the general input/output port when used as the
secondary function.
P60 to P63
O General-purpose output port.
Incorporated only into ML610404/ML610405, and not into ML610406.
P64 to P67
O General-purpose output port.
Incorporated only into ML610404, and not into ML610405/ ML610406.
Primary
Positive
Primary
Positive
Primary
Positive
Primary
Positive
Primary
Positive
Primary
Positive
Primary
Positive
13/30
FEDL610406-05
ML610404/ML610405/ML610406
Pin name
Primary/
Secondary/
Tertiary
Logic
Secondary
Positive
Primary/
Secondary
Positive
Tertiary
—
Tertiary
Positive
Tertiary
Positive
Tertiary
—
Tertiary
Positive
Tertiary
Positive
Secondary
Tertiary
Primary
Positive
External maskable interrupt input pins. Interrupt enable and edge
selection can be performed for each bit by software. These pins are used
as the primary functions of the P00 to P04 pins.
External maskable interrupt input pins. Interrupt enable and edge
selection can be performed for each bit by software. Assigned to the
primary function of the P50 to P57 pins.
Primary
Positive/
negative
Primary
Positive/
negative
Capture trigger input pins. The value of the time base counter is captured
in the register synchronously with the interrupt edge selected by software.
These pins are used as the primary functions of the P00 pin(CAP0) and
P01 pin(CAP1).
Primary
Positive/
negative
Positive/
negative
I/O
UART
TXD0
O
RXD0
I
Description
UART data output pin. This pin is used as the secondary function of the
P43 pin.
UART data input pin. This pin is used as the secondary function of the
P42 or the primary function of the P02 pin.
Synchronous serial (SSIO)
SCK0
SIN0
SOUT0
SCK1
SIN1
SOUT1
PWM
PWM0
T02P0CK
I/O Synchronous serial clock input/output pin. This pin is used as the tertiary
function of the P41 or P45 pin.
I Synchronous serial data input pin. This pin is used as the tertiary function
of the P40 or P44 pin.
O Synchronous serial data output pin. This pin is used as the tertiary
function of the P42 or P46 pin.
I/O Synchronous serial clock input/output pin. Assigned to the tertiary
function of the P51 pin and P55 pin.
I Synchronous serial data input pin. Assigned to the tertiary function of the
P50 pin and P54 pin.
O Synchronous serial data output pin. Assigned to the tertiary function of the
P52 pin and P56 pin.
O
PWM0 output pin. This pin is used as the secondary function of the P24
and tertiary function of the P43 pin.
O
PWM0 external clock input pin. This pin is used as the primary function of
the P04 pin and P44 pin.
External interrupt
EXI0-4
I
EXI8
I
Capture
CAP0
I
CAP1
I
Timer
T02P0CK
T13CK
Melody
MD0
LED drive
LED0 to
LED2, LED4
I
I
External clock input pin used for both Timer 0 and Timer 2. This pin is
used as the primary function of the P04 pin and P44 pin.
External clock input pin used for both Timer 1 and Timer 3. This pin is
used as the primary function of the P45 pin.
O
Melody/buzzer signal output pin. This pin is used as the secondary
function of the P22 and P50 pins.
O
N-channel open drain output pins to drive LED. This pin is used as the
primary function of the P20 to P22 and P24 pins.
Primary
Primary
Primary
—
—
—
Secondary Positive/
negative
Primary
Positive/
negative
14/30
FEDL610406-05
ML610404/ML610405/ML610406
Pin name
I/O
Description
RC oscillation type A/D converter
IN0
I Channel 0 oscillation input pin. This pin is used as the secondary function
of the P30 pin.
CS0
O Channel 0 reference capacitor connection pin. This pin is used as the
secondary function of the P31 pin.
RS0
O This pin is used as the secondary function of the P32 pin which is the
reference resistor connection pin of Channel 0.
RCT0
O Resistor/capacitor sensor connection pin of Channel 0 for measurement.
This pin is used as the secondary function of the P34 pin.
RT0
O Resistor sensor connection pin of Channel 0 for measurement. This pin is
used as the secondary function of the P33 pin.
RCM
O RC oscillation monitor pin. This pin is used as the secondary function of
the P35 pin.
IN1
I Oscillation input pin of Channel 1. This pin is used as the secondary
function of the P44 pin.
CS1
O Reference capacitor connection pin of Channel 1. This pin is used as the
secondary function of the P45 pin.
RS1
O Reference resistor connection pin of Channel 1. This pin is used as the
secondary function of the P46 pin.
Resistor
sensor connection pin for measurement of Channel 1. This pin is
RT1
O
used as the secondary function of the P47 pin.
LCD drive signal
COM0 to
O Common output pins. COM2, COM3, and COM4 can be switched to
SEG0, SEG1, and SEG2, respectively, through the register setting. To
COM4
change the setting, switch between COM4 and SEG2 for one pin and
switch between COM3, COM4 and SEG1, SEG2 for two pins.
Segment
output pin. The SEG0, SEG1, and SEG2 pins are for switching
SEG0 to
O
the
register
setting with the COM2, COM3, and COM4.
SEG23
SEG24 to
O Segment output pin. Incorporated into ML610405/ML610406, not into
ML610404.
SEG27
SEG28 to
O Segment output pin. Incorporated into ML610406, not into
ML610404/ML610405.
SEG31
LCD driver power supply
VL1
— Power supply pin for LCD bias (internally generated) or power supply
VL2
— connection pin. Depending on LCD Bias setting and VDD voltage level, VDD
V
— or VDDL or capacitor is connected.
L3
C1
C2
For testing
TEST0
Power supply
VSS
VDD
VDDL
—
—
Power supply pins for LCD bias (internally generated). Capacitor C12 (see
measuring circuit 1) is connected between C1 and C2.
I/O Pin for testing. A pull-down resistor is internally connected.
—
—
—
Negative power supply pin.
Positive power supply pin.
Positive power supply pin (internally generated) for internal logic.
Capacitor CL (see measuring circuit 1) is connected between this pin and
VSS.
Primary/
Secondary/
Tertiary
Secondary
Secondary
Secondary
Secondary
Secondary
Secondary
Secondary
Secondary
Secondary
Secondary
Logic
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Positive
—
—
—
—
—
—
15/30
FEDL610406-05
ML610404/ML610405/ML610406
TERMINATION OF UNUSED PINS
Table 3 shows methods of terminating the unused pins.
Table 3
Pin
VL1
VL2
VL3
C1, C2
RESET_N
TEST0
P00 to P04
P20 to P22, P24
P30 to P35
P40 to P47
P50 to P57
P60 to P67
COM0 to COM4
SEG0 to SEG31
Termination of Unused Pins
Recommended pin handling
Open
Open
Open
Open
Open
Open
VDD or VSS
Open
Open
Open
Open
Open
Open
Open
Note:
It is recommended to set the unused input ports and input/output ports to the inputs with pull-down resistors/pull-up resistors
or the output mode since the supply current may become excessively large if the pins are left open in the high impedance
input setting.
16/30
FEDL610406-05
ML610404/ML610405/ML610406
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
(VSS = 0V)
Parameter
Symbol
Condition
Rating
Unit
Power supply voltage 1
VDD
Ta = 25°C
−0.3 to +4.6
V
Power supply voltage 2
VDDL
Ta = 25°C
−0.3 to +3.6
V
Power supply voltage 3
VL1
Ta = 25°C
−0.3 to +2.0
V
Power supply voltage 4
VL2
Ta = 25°C
−0.3 to +4.0
V
Power supply voltage 5
VL3
Ta = 25°C
−0.3 to +6.0
V
VIN
Ta = 25°C
−0.3 to VDD+0.3
V
Output voltage
VOUT
Ta = 25°C
−0.3 to VDD+0.3
V
Output current 1
IOUT1
Port 3 to 6, Ta = 25°C
−12 to +11
mA
Output current 2
IOUT2
Port 2, Ta = 25°C
−12 to +20
mA
Power dissipation
PD
Ta = 25°C
0.9
W
Storage temperature
TSTG
⎯
−55 to +150
°C
Input voltage
RECOMMENDED OPERATING CONDITIONS
(VSS = 0V)
Parameter
Symbol
Condition
Range
Unit
Operating temperature
TOP
without P version
P version
-20 to +70
-40 to +85
°C
Operating voltage
VDD
fOP = 30k to 625kHz
1.25 to 3.6
fOP = 30k to 2.5MHz
1.8 to 3.6
Operating frequency (CPU)
fOP
VDD pin external capacitance
VDDL pin external capacitance
CV
CL
VDD = 1.25 to 3.6V
VDD = 1.8 to 3.6V
―
⎯
30k to 625k
30k to 2.5M
1
1.0±30% to 2.2±30%*
2
0.47±30% to 2.2±30%*
Ca, b, c
⎯
0.1±30%
µF
C12
⎯
0.47±30%
µF
VL1, 2, or 3 pin external capacitance
Pin-to-pin (C1 to C2) external
capacitance
V
Hz
µF
µF
*1: Please select as CV is larger than CL or same as CL.
*2: When the load of VDD is small and the power rise time is too short, it may happen that the power-on reset is not
generated. In this case please select CL with larger capacitance
CLOCK GENERATION CIRCUIT OPERATING CONDITIONS
(VSS = 0V)
Parameter
Low-speed crystal oscillation
frequency
Recommended equivalent series
resistance value of low-speed
crystal oscillation
Low-speed crystal oscillation
external capacitor
Symbol
Condition
fXTL
Rating
Unit
Min.
Typ.
Max.
⎯
⎯
32.768k
⎯
Hz
RL
⎯
⎯
⎯
40k
Ω
⎯
12
⎯
CDL/CGL
CL=6pF of crystal
oscillation
CL=9pF of crystal
oscillation
CL=12pF of
crystal oscillation
⎯
18
⎯
⎯
24
⎯
pF
17/30
FEDL610406-05
ML610404/ML610405/ML610406
DC CHARACTERISTICS (1/5)
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Measuring
Rating
Parameter
Symbol
Condition
Unit
circuit
Min.
Typ.
Max.
Typ.
Typ.
500
Ta = 25°C
+10%
−10%
VDD = 1.25
kHz
to 3.6V
Typ.
Typ.
3
500
*
+25%
−25%
500kHz/2MHz RC oscillation
fRC
frequency
Typ.
Typ.
2.0
Ta = 25°C
+10%
−10%
VDD = 1.80
MHz
to 3.6V
Typ.
Typ.
3
2.0
*
+25%
−25%
Low-speed crystal oscillation
TXTL
⎯
⎯
0.6
2
s
2
1
start time*
500kHz/2MHz RC oscillation
⎯
⎯
⎯
3
µs
TRC
start time
Low-speed oscillation stop
⎯
12
16.4
41
ms
TSTOP
*1
detect time
Reset pulse width
PRST
⎯
200
⎯
⎯
µs
Reset noise elimination
⎯
⎯
⎯
0.3
PNRST
pulse width
Power-on reset generated
TPOR
⎯
⎯
⎯
10
ms
power rise time
1
* : When low-speed crystal oscillation stops for a duration more than the low-speed oscillation stop detect time, the system is
reset to shift to system reset mode.
2
* : 32.768KHz Crystal resonator DT-26 (Load Capacitance 6pF) (made by KDS:DAISHINKU CORP.) is used (CGL=CDL=6pF)
3
* : Recommended operating temperature (Ta=-20 to 70°C, Ta=-40 to 85°C for P version)
VIL1
RESET_N
VIL1
PRST
Reset pulse width (PRST)
0.9xVDD
VDD
0.1xVDD
TPOR
Power-on reset activation power rise time (TPOR )
18/30
FEDL610406-05
ML610404/ML610405/ML610406
DC CHARACTERISTICS (2/5)
Parameter
VDDL voltage
VDDL temperature
1
deviation *
VDDL voltage
1
dependency *
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Measuring
Rating
Symbol
Condition
Unit
circuit
Min.
Typ.
Max.
fOP = 30k to 625kHz
1.1
1.2
1.3
V
VDDL
1.35
1.5
1.65
fOP = 30k to 2.5MHz
∆VDDL
VDD = 3.0V
⎯
-1
⎯
mV/°C
∆VDDL
⎯
⎯
5
20
mV/V
1
*1: The maximum VDDL voltage becomes the VDD voltage level when the VDDL voltage determined by the temperature and voltage deviations
mathematically exceeds the VDD voltage.
19/30
FEDL610406-05
ML610404/ML610405/ML610406
DC CHARACTERISTICS (3/5)
Parameter
Supply current 1
Supply current 2
Supply current 3
Supply current
4-1
Symbol
IDD1
IDD2
IDD3
IDD4-1
(VDD=3.0V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Measuring
Rating
Condition
Unit
circuit
Min.
Typ.
Max.
CPU: In STOP state.
Low-speed/high-speed oscillation:
stopped.
CPU: In HALT state (LTBC and WDT
3 4
are Operating.).* *
High-speed 500kHz/2MHz
oscillation: Stopped.
6
LCD and BIAS circuits: Operating. *
CPU: In 32.768kHz operating
1 3
state.* *
High-speed 500kHz/2MHz
oscillation: Stopped.
2
LCD and BIAS circuits: Operating. *
CPU: In 500kHz RC operating state.
2
LCD/BIAS circuits: Operating. *
Ta= 25°C
⎯
0.4
0.8
µA
5
*
⎯
⎯
6.5
Ta= 25°C
⎯
0.9
1.8
µA
5
*
⎯
⎯
7.5
Ta= 25°C
⎯
4.0
7.5
1
µA
5
*
⎯
⎯
11.0
Ta= 25°C
⎯
60
80
*
⎯
⎯
90
Ta= 25°C
⎯
240
300
µA
5
1
Supply current
4-2
IDD4-2
CPU: In 2MHz RC operating state.
2
LCD/BIAS circuits: Operating. *
µA
5
*
⎯
⎯
320
1
* : When the CPU operating rate is 100% (No HALT state).
2
* : All SEGs: off waveform, No LCD panel load, 1/3 bias, 1/3 duty, Frame frequency: Approx. 64 Hz, Bias voltage multiplying
clock: 1/128 LSCLK (256Hz)
3
* : 32.768KHz Crystal resonator DT-26 (Load capacitance 6pF) (made by KDS:DAISHINKU CORP.) is used (CGL=CDL=6pF).
4
* : Significant bits of BLKCON0 to BLKCON4 registers are all “1” except DLCD bit on BLKCON4.
5
* : Recommended operating temperature (Ta=-20 to 70°C, Ta=-40 to 85°C for P version)
6
* : LCD stop mode, 1/3 bias, Bias voltage multiplying clock: 1/128 LSCLK (256Hz)
20/30
FEDL610406-05
ML610404/ML610405/ML610406
DC CHARACTERISTICS (4/5)
Parameter
Output voltage 1
(P20 to P22,P24
(N-channel open
drain output
mode is not
selected))
(P30 to P35)
(P40 to P47)
(P50 to P57)
*2
(P60 to P63)
*1
(P60 to P67)
Output voltage 2
(P20 to P22,P24
(N-channel open
drain output mode
is not selected))
Output voltage 3
(COM0 to 4)
*1
(SEG0 to 23)
*2
(SEG0 to 27)
*3
(SEG0 to 31)
Output leakage
(P20 to P22,P24)
(P30 to P35)
(P40 to P47)
(P50 to P57)
*2
(P60 to P63)
*1
(P60 to P67)
Input current 1
(RESET_N)
Input current 2
(TEST0)
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Rating
Measuring
Symbol
Condition
Unit
circuit
Min.
Typ.
Max.
IOL1 = +0.5mA, VDD = 1.8 to 3.6V
VDD
−0.5
VDD
−0.3
⎯
IOL1 = +0.1mA, VDD = 1.25 to 3.6V
VOL2
⎯
⎯
⎯
⎯
⎯
0.5
⎯
⎯
0.3
IOL2 = +5mA, VDD = 1.8 to 3.6V
⎯
⎯
0.5
VOH3
IOH3 = −0.05mA, VL1=1.2V
VL3
−0.2
⎯
⎯
VOML3
IOML3 = +0.05mA, VL1=1.2V
⎯
⎯
VL2
+0.2
VOML3S
IOML3S = −0.05mA, VL1=1.2V
VL2
−0.2
⎯
⎯
VOLM3
IOLM3 = +0.05mA, VL1=1.2V
⎯
⎯
VL1
+0.2
VOLM3S
IOLM3S = −0.05mA, VL1=1.2V
VL1
−0.2
⎯
⎯
VOL3
IOL3 = +0.05mA, VL1=1.2V
⎯
⎯
0.2
IOOH
VOH = VDD (in high-impedance state)
⎯
⎯
1
IOH1 = −0.5mA, VDD = 1.8 to 3.6V
VOH1
IOH1 = -0.03mA, VDD = 1.25 to 3.6V
VOL1
IOOL
VOL = VSS (in high-impedance state)
−1
⎯
⎯
IIH1
IIL1
IIH2
IIL2
VIH1 = VDD
VIL1 = VSS
VIH2 = VDD
VIL2 = Vss
VIH3 = VDD, VDD = 1.8 to 3.6V
(when pulled-down)
VIH3 = VDD, VDD = 1.25 to 3.6V
(when pulled-down)
VIL3 = Vss, VDD = 1.8 to 3.6V
(when pulled-up)
VIL3 = Vss, VDD = 1.25 to 3.6V
(when pulled-up)
⎯
-600
2
-1
⎯
-300
300
⎯
1
-2
600
⎯
2
30
200
0.01
30
200
-200
-30
-2
-200
-30
-0.01
IIH3
Input current 3
(P00 to P04)
(P30 to P35)
(P40 to P47)
(P50 to P57)
IIL3
IIH3Z
VIH3 = VDD (in high-impedance state)
⎯
⎯
1
IIL3Z
VIL3 = VSS (in high-impedance state)
−1
⎯
⎯
V
2
µA
3
µA
4
1
* : Characteristics for ML610404
2
* : Characteristics for ML610405
3
* : Characteristics for ML610406
21/30
FEDL610406-05
ML610404/ML610405/ML610406
DC CHARACTERISTICS (5/5)
Parameter
Input voltage 1
(RESET_N)
(TEST0)
(P00 to P04)
(P30 to P35)
(P40 to P47)
(P50 to P57)
Input pin
capacitance
(P00 to P04)
(P30 to P35)
(P40 to P47)
(P50 to P57)
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Rating
Measuring
Symbol
Condition
Unit
circuit
Min.
Typ.
Max.
VIH1
⎯
0.7
×VDD
⎯
VDD = 1.8 to 3.6V
0
⎯
VDD = 1.25 to 3.6V
0
⎯
f = 10kHz
Vrms = 50mV
Ta = 25°C
⎯
⎯
VIL1
CIN
VDD
0.3
×VDD
0.2
×VDD
5
V
5
pF
⎯
22/30
FEDL610406-05
ML610404/ML610405/ML610406
MEASURING CIRCUITS
CGL
XT0
CDL
XT1
C2
32.768kHz
crystal
resonator
C12
C1
VDD
VDDL
VL1 VL2 VL3
CV
: 1µF
CL
: 2.2uF
Ca,Cb,Cc
: 0.1µF
C12
: 0.47µF
32.768kHz crystal resonator
: DT-26 (Load capacitance 6pF)
VSS
A
CV
CL
(Made by KDS:DAISHINKU CORP.)
Cc
Ca
CGL, CDL
: 6pF
MEASURING CIRCUIT 2
(Note 2)
VIH
Output pin
VIL
Input pin
(Note 1)
VDD
VDDL
VL1
VL2
VL3
V
VSS
(Note 1) Input logic circuit to determine the specified measuring conditions.
(Note 2) Repeats for the specified output pin
23/30
FEDL610406-05
ML610404/ML610405/ML610406
MEASURING CIRCUIT 3
(Note 2)
VIH
Output pin
Input pin
(Note 1)
VIL
VDD
VDDL
VL1
VL2
VL3
A
VSS
(Note 1) Input logic circuit to determine the specified measuring conditions.
(Note 2) Repeats for the specified output pin
MEASURING CIRCUIT 4
(Note 3)
Output pin
Input pin
A
VDD
VDDL
VL1
VL2
VL3
VSS
(Note 3) Repeats for the specified input pin
MEASURING CIRCUIT 5
VIH
VDD
VDDL
VL1
VL2
VL3
Waveform observation
Output pin
VIL
Input pin
(Note 1)
VSS
(Note 1) Input logic circuit to determine the specified measuring conditions.
24/30
FEDL610406-05
ML610404/ML610405/ML610406
AC CHARACTERISTICS (External Interrupt)
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Rating
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
External interrupt disable period
TNUL
Interrupt: Enabled (MIE = 1),
CPU: NOP operation
System clock: 32.768kHz
⎯
76.8
106.8
µs
P00 to P04
(Rising-edge interrupt mode)
tNUL
P00 to P04
(Falling-edge interrupt mode)
tNUL
P00 to P04
P50 to P57
(Both-edge interrupt mode)
tNUL
AC CHARACTERISTICS (UART)
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Rating
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
Transmit baud rate
⎯
tTBRT
1
⎯
BRT*
1
⎯
s
1
BRT*
BRT*
1
BRT*
s
−3%
+3%
*1: Baud rate period (including the error of the clock frequency selected) set with the UART baud rate register (UA0BRTL,H) and
the UART mode register 0 (UA0MOD0).
Receive baud rate
⎯
tRBRT
tTBRT
TXD0*
tRBRT
RXD0*
*: Indicates the secondary function of the port.
25/30
FEDL610406-05
ML610404/ML610405/ML610406
AC CHARACTERISTICS (Synchronous Serial Port)
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Parameter
Symbol
SCLK input cycle
(slave mode)
Rating
Condition
In the 500kHz oscillation mode*
tSCYC
In the 2MHz oscillation mode*
Typ.
Max.
10
―
―
µs
1
―
―
µs
―
SCLK*
―
s
4
―
―
µs
0.4
―
―
µs
2
3
VDD=1.8 to 3.6V
SCLK output cycle
(master mode)
SCLK input pulse width
(slave mode)
tSCYC
―
In the 500kHz oscillation mode*
tSW
In the 2MHz oscillation mode*
2
(master mode)
1
―
tSW
In the 500kHz oscillation mode*
SOUT output delay time
(slave mode)
tSD
SCLK*
×0.4
×0.5
×0.6
―
―
500
―
―
240
―
―
500
tSD
ns
2
Output load 10pF
In the 2MHz oscillation mode*
s
2
3
In the 500kHz oscillation mode*
(master mode)
1
SCLK*
Output load 10pF
In the 2MHz oscillation mode*
1
SCLK*
Output load 10pF
SOUT output delay time
1
3
VDD=1.8 to 3.6V
SCLK output pulse width
Unit
Min.
ns
3
―
―
240
80
―
―
500
―
―
240
―
―
300
―
―
80
―
―
Output load 10pF, VDD=1.8 to 3.6V
SIN input
―
tSS
setup time
ns
(slave mode)
In the 500kHz oscillation mode*
SIN input
setup time
tSS
In the 2MHz oscillation mode*
(master mode)
3
VDD=1.8 to 3.6V
In the 500kHz oscillation mode*
SIN input
tSH
hold time
2
In the 2MHz oscillation mode*
2
3
VDD=1.8 to 3.6V
ns
ns
*1: Clock cycle selected with SnCK2–0 of the serial port n mode register (SIOnMOD1) (n= 0, 1)
*2: When 500kHz oscillation is selected with OSCM2 of the frequency control register 0 (FCON0)
*3: When 2MHz oscillation is selected with OSCM2 of the frequency control register 0 (FCON0)
tSCYC
tSW
tSW
SCLKn*
tSD
tSD
SOUTn*
tSS
tSH
SINn*
*: Indicates the tertiary function of the port (n= 0,1)
26/30
FEDL610406-05
ML610404/ML610405/ML610406
AC CHARACTERISTICS (RC Oscillation A/D Converter)
Condition for VDD=1.8 to 3.6V
(VDD=1.8 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Rating
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
RS0,RS1,RT0,
Oscillation resistor
1
―
―
CS0, CT0, CS1≥740pF
kΩ
RT0-1,RT1
fOSC1
457.3
525.2
575.1
kHz
Resistor for oscillation=1kΩ
Oscillation frequency
fOSC2
53.48
58.18
62.43
kHz
Resistor for oscillation=10kΩ
VDD = 3.0V
fOSC3
5.43
5.89
6.32
kHz
Resistor for oscillation=100kΩ
Kf1
7.972
9.028
9.782
RT0,
RT0-1,
RT1=1kΩ
⎯
RS to RT oscillation
*1
frequency ratio
Kf2
0.981
1
1.019
RT0, RT0-1, RT1=10kΩ
⎯
VDD = 3.0V
Kf3
0.099
0.101
0.104
RT0, RT0-1, RT1=100kΩ
⎯
*1: Kfx is the ratio of the oscillation frequency by the sensor resistor to the oscillation frequency by the reference resistor on the
same conditions.
fOSCX(RT0-1-CS0 oscillation)
fOSCX(RS0-CS0 oscillation)
IN0 CS0 RCT0
(Note 1)
RT0
RS0
RS0 RT0
VIL
RCM
VDD
CV
VDDL
RT0, RT0-1, RT1: 1kΩ/10kΩ/100kΩ
RS0, RS1: 10kΩ
CS0, CT0, CS1: 560pF
CVR0, CVR1: 820pF
IN1 CS1 RS1 RT1
Input pin
VIH
CVR1
RT0-1
CT0
CS0
CVR0
fOSCX(RT1-CS1 oscillation)
fOSCX(RS1-CS1 oscillation)
,
RT1
,
RS1
fOSCX(RT0-CS0 oscillation)
fOSCX(RS0-CS0 oscillation)
( x = 1, 2, 3 )
CS1
Kfx =
Frequency measurement (fOSCX)
VSS
CL
*1: Input logic circuit to determine the
specified measuring conditions.
27/30
FEDL610406-05
ML610404/ML610405/ML610406
Condition for VDD=1.25 to 3.6V
(VDD=1.25 to 3.6V, VSS=0V, Ta=-20 to +70°C, Ta=-40 to +85°C for P version, unless otherwise specified)
Rating
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
RS0,RS1,RT0,
Oscillation resistor
1
―
―
CS0, CT0, CS1≥740pF
kΩ
RT0-1,RT1
fOSC1
81.93
93.16
101.2
kHz
Resistor for oscillation=6kΩ
Oscillation frequency
fOSC2
35.32
38.75
41.48
kHz
Resistor
for
oscillation=15kΩ
VDD = 1.5V
fOSC3
5.22
5.65
6.03
kHz
Resistor for oscillation=105kΩ
Kf1
2.139
2.381
2.632
RT0, RT0-1, RT1=1kΩ
⎯
RS to RT oscillation
*1
frequency ratio
Kf2
0.973
1
1.028
RT0, RT0-1, RT1=10kΩ
⎯
VDD = 1.5V
Kf3
0.142
0.147
0.152
RT0, RT0-1, RT1=100kΩ
⎯
fOSC1
85.28
94.58
103.3
kHz
Resistor for oscillation=6kΩ
Oscillation frequency
fOSC2
35.72
38.87
41.78
kHz
Resistor for oscillation=15kΩ
VDD = 3.0V
5.189
5.622
6.012
kHz
fOSC3
Resistor for oscillation=105kΩ
Kf1
2.227
2.432
2.626
RT0,
RT0-1,
RT1=1kΩ
⎯
RS to RT oscillation
*1
frequency ratio
Kf2
0.982
1
1.018
RT0, RT0-1, RT1=10kΩ
⎯
VDD = 3.0V
Kf3
0.141
0.145
0.149
RT0, RT0-1, RT1=100kΩ
⎯
*1: Kfx is the ratio of the oscillation frequency by the sensor resistor to the oscillation frequency by the reference resistor on the
same conditions.
fOSCX(RT0-1-CS0 oscillation)
fOSCX(RS0-CS0 oscillation)
,
IN0 CS0 RCT0
VIH
,
RA1
RT1
RA0
RT0
RS0
RS0 RT0
RT0, RT0-1, RT1: 1kΩ/10kΩ/100kΩ
RA0, RA0-1, RA1: 5kΩ
RS0, RS1: 15kΩ
CS0, CT0, CS1: 560pF
CVR0, CVR1: 820pF
IN1 CS1 RS1 RT1
Frequency measurement (fOSCX)
Input pin
RCM
(Note 1)
fOSCX(RT1-CS1 oscillation)
fOSCX(RS1-CS1 oscillation)
CVR1
RT0-1 RA0-1
CT0
CS0
CVR0
RS1
fOSCX(RT0-CS0 oscillation)
fOSCX(RS0-CS0 oscillation)
( x = 1, 2, 3 )
CS1
Kfx =
VIL
VDD
CV
VDDL
VSS
CL
*1: Input logic circuit to determine the
specified measuring conditions.
Note:
•Please have the shortest layout for the common node (wiring patterns which are connected to the external capacitors, resistors and IN0/IN1
pin), including CVR0/CVR1. Especially, do not have long wiring between IN0/IN1 and RS0/RS1. The coupling capacitance on the wires
may occur incorrect A/D conversion. Also, please do not have signals which may be a source of noise around the node.
•When RT0/RT1 (Thermistor and etc.) requires long wiring due to the restricted placement, please have VSS(GND) trace next to the signal.
•Please make wiring to components (capacitor, resistor, and so on) necessary for objective measurement. Wiring to reserved components may
affect to the A/D conversion operation by noise the components itself may have.
28/30
FEDL610406-05
ML610404/ML610405/ML610406
Revision History
Document No.
Date
FEDL610406-01
FEDL610406-02
Dec.15,2011
Dec.5,2012
FEDL610406-03
Feb.21,2014
FEDL610406-04
FEDL610406-05
Apr.18,2014
May.23,2014
Page
Previous Current
Edition
Edition
–
15
17
19
19,25
All
–
15
17
19
19,25
All
3
4
20
18
Description
Final edition
Remove the word “appendixC” in the table.
Correct the symbol of capacitor at VDDL.
The notes about CV, CL were added.
The value of capacitor CL was changed to 2.2uF.
Change header and footer
Change from "Shipment" to " Product name – Supported
Function "
Correct minimum time of Power-on reset generated power
rise time
3,5,6,7,
31
4
-
4
Delete package products
4
17
18
18
18
18
18
18
Correct the “Product name – Supported Function”
Add Clock Generation Circuit Operating Conditions
Change "RESET" to " Reset pulse width (PRST)" and "
Power-on reset activation power rise time (TPOR )".
Correct minimum time of Power-on reset generated power
rise time
Correct the CGL’s value and the CDL’s value of
DC
CHARACTERISTICS (1/5)’s note No.2
29/30
FEDL610406-05
ML610404/ML610405/ML610406
NOTES
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co.,
Ltd.
The content specified herein is subject to change for improvement without notice.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and
operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any
damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such
damage.
The technical information specified herein is intended only to show the typical functions of and examples of application circuits
for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual
property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility
whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio
visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical
injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and
fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the
prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely
high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human
injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller
or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the
above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales
representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign
Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Copyright
2011-2014 LAPIS Semiconductor Co., Ltd.
30/30
Similar pages