Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 OPAx350 High-Speed, Single-Supply, Rail-to-Rail Operational Amplifiers MicroAmplifier Series 1 Features 3 Description • • • • • • • • • The OPA350 series of rail-to-rail CMOS operational amplifiers are optimized for low voltage, single-supply operation. Rail-to-rail input and output, low noise (5 nV/√Hz), and high speed operation (38 MHz, 22 V/μs) make the amplifiers ideal for driving sampling Analogto-Digital (A/D) converters. They are also suited for cell phone PA control loops and video processing (75-Ω drive capability), as well as audio and general purpose applications. Single, dual, and quad versions have identical specifications for maximum design flexibility. Rail-to-Rail Input Rail-to-Rail Output (Within 10 mV) Wide Bandwidth: 38 MHz High Slew Rate: 22 V/μs Low Noise: 5 nV/√Hz Low THD+Noise: 0.0006% Unity-Gain Stable MicroSize Packages Single, Dual, and Quad 1 The OPA350 series operates on a single supply as low as 2.5 V, with an input common-mode voltage range that extends 300 mV below ground and 300 mV above the positive supply. Output voltage swing is to within 10 mV of the supply rails, with a 10-kΩ load. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. 2 Applications • • • • • • • • • Cell Phone PA Control Loops Driving A/D Converters Video Processing Data Acquisition Process Controls Audio Processing Communications Active Filters Test Equipment The single (OPA350) and dual (OPA2350) come in the miniature MSOP-8 surface mount, SO-8 surface mount, and DIP-8 packages. The quad (OPA4350) packages are in the space-saving SSOP-16 surface mount and SO-14 surface mount. All are specified from −40°C to 85°C and operate from −55°C to 150°C. OPAx350 Harmonic Distortion Harmonic Distortion (%) 1 (−40dBc) 0.1 (−60dBc) Device Information(1) G=1 VO = 2.5VPP RL = 600Ω PART NUMBER OPA350 0.01 (−80dBc) OPA2350 0.001 (−100dBc) 3rd−Harmonic 2nd−Harmonic 0.0001 (−120dBc) 1k 10k 100k Frequency (Hz) OPA4350 PACKAGE BODY SIZE (NOM) MSOP (8) 3.00 mm × 3.00 mm SOIC (8) 3.91 mm × 4.90 mm PDIP (8) 6.35 mm × 9.81 mm MSOP (8) 3.00 mm × 3.00 mm SOIC (8) 3.91 mm × 4.90 mm PDIP (8) 6.35 mm × 9.81 mm SSOP (16) 3.90 mm × 4.90 mm SOIC (14) 3.91 mm × 8.65 mm 1M (1) For all available packages, see the orderable addendum at the end of the data sheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 5 5 6 8 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information: OPA350 and OPA2350........... Thermal Information: OPA4350 ................................ Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 12 7.1 Overview ................................................................. 12 7.2 Functional Block Diagram ....................................... 12 7.3 Feature Description................................................. 12 7.4 Device Functional Modes........................................ 17 8 Application and Implementation ........................ 18 8.1 Application Information............................................ 18 8.2 Typical Applications ................................................ 18 9 Power Supply Recommendations...................... 22 10 Layout................................................................... 22 10.1 Layout Guidelines ................................................. 22 10.2 Layout Example .................................................... 23 11 Device and Documentation Support ................. 24 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Device Support .................................................... Documentation Support ....................................... Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 24 24 24 25 25 25 25 12 Mechanical, Packaging, and Orderable Information ........................................................... 25 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (January 2005) to Revision D • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 5 Pin Configuration and Functions D Package 14-Pin SOIC Top View OPA350: P, D, and DGK Packages 8-Pin PDIP, SOIC, and VSSOP Top View NC 1 8 NC −In 2 7 V+ +In 3 6 Output V− 4 5 NC Out A 1 −In A 2 13 −In D 3 12 +In D V+ 4 11 V− +In B 5 10 +In C B Out A 1 −In A 2 +In A 3 − 4 A B 8 V+ 7 Out B 6 −In B 5 +In B Out D +In A A OPA2350: P, D, and DGK Packages 8-Pin PDIP, SOIC, and VSSOP Top View 14 D C −In B 6 9 −In C Out B 7 8 Out C 16 Out D 15 −In D DBQ Package 16-Pin SSOP Top View Out A 1 −In A 2 A D +In A 3 14 +In D +V 4 13 −V +In B 5 12 +In C B C −In B 6 11 −In C Out B 7 10 Out C NC 8 9 NC Pin Functions PIN OPA350 NO. OPA2350 NO. OPA4350 SO-14 NO. OPA4350 SSOP NO. I/O DESCRIPTION NC 1, 5, 8 — — 8, 9 — No internal connection –In 2 — — — I Inverting input +In 3 — — — I Noninverting input V– 4 4 11 13 I Negative power supply Output 6 — — — O Output V+ 7 8 4 4 I Positive power supply Out A — 1 1 1 O Output channel A –In A — 2 2 2 I Inverting input channel A +In A — 3 3 3 I Noninverting input channel A +In B — 5 5 5 I Noninverting input channel B –In B — 6 6 6 I Inverting input channel B Out B — 7 7 7 O Output channel B Out C — — 8 10 O Output channel C –In C — — 9 11 I Inverting input channel C +In C — — 10 12 I Noninverting input channel C +In D — — 12 14 I Noninverting input channel D –In D — — 13 15 I Inverting input channel D Out D — — 14 16 O Output channel D NAME Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 3 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Supply voltage Voltage Signal input terminals (2) (V−) − 0.3 (1) (2) (3) V V 10 mA Continuous Operating temperature Tstg UNIT 7 (V+) + 0.3 Current Open short circuit current (3) MAX 150 °C Lead temperature (soldering, 10 s) –55 300 °C Junction temperature 150 °C 150 °C Storage temperature –55 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current-limited to 10 mA or less. Short-circuit to ground, one amplifier per package. 6.2 ESD Ratings VALUE UNIT ±1000 V ±1500 V OPA350, OPA2350, OPA4350 (ALL PACKAGE TYPES) V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) OPA350, OPA2350, OPA4350 (SOIC PACKAGES ONLY) V(ESD) (1) (2) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22C101 (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX 2.7 (±1.35) 5 (±2.5) 5.5 (±2.75) V Specified temperature –40 25 85 °C Operating temperature –55 25 150 °C Power supply voltage, (V+)-(V-) 4 Submit Documentation Feedback UNIT Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 6.4 Thermal Information: OPA350 and OPA2350 OPA350, OPA2350 THERMAL METRIC (1) DGK (VSSOP) P (PDIP) D (SOIC) 8 PINS 8 PINS 8 PINS 169.2 53.1 140.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 62.8 42.5 89.8 °C/W RθJB Junction-to-board thermal resistance 89.8 30.3 80.6 °C/W ψJT Junction-to-top characterization parameter 7.5 19.7 28.7 °C/W ψJB Junction-to-board characterization parameter 88.2 30.2 80.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W RθJA (1) Junction-to-ambient thermal resistance UNIT For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information: OPA4350 OPA4350 THERMAL METRIC (1) D (SOIC) DBQ (SSOP) UNIT 14 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 83.8 115.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 70.7 67 °C/W RθJB Junction-to-board thermal resistance 59.5 58.3 °C/W ψJT Junction-to-top characterization parameter 11.6 19.9 °C/W ψJB Junction-to-board characterization parameter 37.7 57.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 5 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 6.6 Electrical Characteristics VS = 2.7 V to 5.5 V; All specifications at TA = 25°C, RL = 1 kΩ connected to VS/2 and VOUT = VS/2, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT ±150 ±500 µV ±1 mV OFFSET VOLTAGE VS = 5 V VOS Input offset voltage TA = −40°C to 85°C vs Temperature PSRR TA = –40°C to 85°C vs Power-supply rejection ratio VS = 2.7 V to 5.5 V, VCM = 0 V Channel separation (dual, quad) DC μV/°C ±4 40 150 175 0.15 µV/V µV/V INPUT BIAS CURRENT IB Input bias current IOS Input offset current ±0.5 vs Temperature ±10 See Typical Characteristics ±0.5 ±10 pA pA NOISE en in Input voltage noise, f = 100 Hz to 400 kHz 4 μVrms Input voltage noise density, f = 10 kHz 7 nV/√Hz Input current noise density, f = 100 kHz 5 nV/√Hz Current noise density, f = 10 kHz 4 fA/√Hz INPUT VOLTAGE RANGE VCM Common-mode voltage range CMRR Common-mode rejection ratio TA = −40°C to 85°C –0.1 (V+) + 0.1 VS = 2.7 V, −0.1 V < VCM < 2.8 V 66 84 VS = 5.5 V, −0.1 V < VCM < 5.6 V 74 90 TA = −40°C to 85°C, VS = 5.5 V, −0.1 V < VCM < 5.6 V 74 V dB INPUT IMPEDANCE 1013 || 2.5 Differential 13 Common-mode 10 Ω || pF Ω || pF || 6.5 OPEN-LOOP GAIN Open-loop voltage gain AOL TA = –40°C to 85°C RL = 10 kΩ, 50 mV < VO < (V+) –50 mV 100 RL = 10 kΩ, 50 mV < VO < (V+) –50 mV 100 RL = 1 kΩ, 200 mV < VO < (V+) –200 mV 100 RL = 1 kΩ, 200 mV < VO < (V+) –200 mV 100 122 dB 120 FREQUENCY RESPONSE (CL = 100 pF) GBW Gain-bandwidth product G=1 38 MHz SR Slew rate G=1 22 V/µs Settling time 0.1% 0.01% Overload recovery time 0.22 G = ±1, 2-V Step VIN × G = VS THD+N Total harmonic distortion + noise µs 0.5 0.1 RL = 600 Ω, VO = 2.5 VPP (2), G = 1, f = 1 kHz µs 0.0006% Differential gain error G = 2, RL = 600 Ω, VO = 1.4 V (3) 0.17% Differential phase error G = 2, RL = 600 Ω, VO = 1.4 V (3) 0.17 ° OUTPUT RL = 10 kΩ, AOL ≥ 100 dB VOUT Voltage output swing from rail (4) IOUT Output current ISC short circuit current CLOAD Capacitive load drive (1) (2) (3) (4) (5) 6 TA = –40°C to 85°C 10 50 25 200 RL = 10 kΩ, AOL ≥ 100 dB 50 RL = 1 kΩ, AOL ≥ 100 dB mV ±40 (5) mA ±80 mA See Typical Characteristics VS = 5 V VOUT = 0.25 V to 2.75 V NTSC signal generator used. See Figure 31 for test circuit. Output voltage swings are measured between the output and power supply rails. See Figure 17. Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Electrical Characteristics (continued) VS = 2.7 V to 5.5 V; All specifications at TA = 25°C, RL = 1 kΩ connected to VS/2 and VOUT = VS/2, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT POWER SUPPLY VS TA = −40°C to 85°C Operating voltage range 2.7 Minimum operating voltage IQ Quiescent current (per amplifier) 5.5 2.5 5.2 TA = –40°C to 85°C IO = 0 V V 7.5 8.5 mA TEMPERATURE RANGE Specified range –40 85 °C Operating range –55 150 °C Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 7 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 6.7 Typical Characteristics All specifications at TA = 25°C, VS = 5 V, and RL = 1 kΩ connected to VS/2, unless otherwise noted. 100 0 160 90 120 80 PSRR, CMRR (dB) 100 φ −90 60 G 40 PSRR 80 −45 Phase ( ) Voltage Gain (dB) 140 −135 20 70 CMRR (VS = +5V VCM = −0.1V to 5.1V) 60 50 40 30 20 0 0.1 1 10 100 1k 10k 100k Frequency (Hz) −180 10M 100M 1M 10 0 10 100 1k 10k 100k 1M 10M Frequency (Hz) Figure 1. Open-Loop Gain and Phase vs Frequency Figure 2. Power Supply and Common-Mode Rejection Ratio vs Frequency 140 10k 100k 100 1k Voltage Noise 100 10 10 1 Channel Separation (dB) 1k Current Noise Current Noise (fA√ Hz) Voltage Noise (nV√Hz) 130 10k 120 110 100 90 80 70 1 10 100 1k 10k 100k 1M 0.1 10M Dual and quad devices. 60 10 100 1k Frequency (Hz) Figure 3. Input Voltage and Current Noise Spectral Density vs Frequency 1 (−40dBc) 0.01 G = 10, 3VPP (VO = 1V to 4V) Harmonic Distortion (%) THD+N (%) RL = 600Ω G = 100, 3VPP (VO = 1V to 4V) G = 1, 3VPP (VO = 1V to 4V) Input goes through transition region 0.001 G = 1, 2.5VPP (VO = 0.25V to 2.75V) Input does NOT go through transition region 100 1k 10k 100k Figure 5. Total Harmonic Distortion + Noise vs Frequency Submit Documentation Feedback 10M 0.1 (−60dBc) G=1 VO = 2.5VPP RL = 600Ω 0.01 (−80dBc) 0.001 (−100dBc) 3rd−Harmonic 0.0001 (−120dBc) 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) 8 1M 2nd−Harmonic 0.0001 10 100k Figure 4. Channel Separation vs Frequency 1 0.1 10k Frequency (Hz) Figure 6. Harmonic Distortion + Noise vs Frequency Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Typical Characteristics (continued) All specifications at TA = 25°C, VS = 5 V, and RL = 1 kΩ connected to VS/2, unless otherwise noted. 130 0.5 Open−Loop Gain (dB) Phase 0.4 Differential Gain (%) Differential Phase (° ) G=2 VO = 1.4V NTSC Signal Generator See Figure 6 for test circuit. 0.3 0.2 Gain 125 RL = 1kΩ RL = 10kΩ 120 RL = 600Ω 115 0.1 110 0 0 100 200 300 400 500 600 −75 700 800 900 1000 −50 −25 0 110 75 100 125 40 CMRR, VS = 5.5V (VCM = −0.1V to +5.6V) 35 100 PSRR 70 Slew Rate (V/µs) 90 CMRR, VS = 2.7V (VCM =− 0.1V to +2.8V) 30 PSRR (dB) 90 CMRR (dB) 50 Figure 8. Open-Loop Gain vs Temperature Figure 7. Differential Gain and Phase vs Resistive Load 100 80 25 Temperature ( °C) Resistive Load ( Ω ) 80 Negative Slew Rate 25 Positive Slew Rate 20 15 10 5 60 −75 −50 −25 0 25 50 75 100 70 125 0 −75 −50 −25 0 Temperature ( °C) Figure 9. Common-Mode and Power-Supply Rejection Ratio vs Temperature 7.0 100 6.0 90 5.5 IQ 60 4.5 50 4.0 40 30 −50 −25 0 25 50 Temperature ( °C) 75 100 125 Quiescent Current (mA) 70 Short−Circuit Current (mA) Quiescent Current (mA) 80 −ISC 5.5 3.5 −75 75 100 125 Per Amplifier 6.5 5.0 50 Figure 10. Slew Rate vs Temperature +ISC 6.0 25 Temperature ( °C) 5.0 4.5 4.0 3.5 3.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) Figure 11. Quiescent Current and short circuit Current vs Temperature Figure 12. Quiescent Current vs Supply Voltage Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 9 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com Typical Characteristics (continued) 1k 1.5 100 1.0 Input Bias Current (pA) Input Bias Current (pA) All specifications at TA = 25°C, VS = 5 V, and RL = 1 kΩ connected to VS/2, unless otherwise noted. 10 1 −50 −25 0 25 50 Temperature (°C) 75 100 0.0 −0.5 −0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.1 −75 0.5 125 Common−Mode Voltage (V) Figure 13. Input Bias Current vs Temperature Figure 14. Input Bias Current vs Input Common-Mode Voltage 100 6 Maximum output voltage without slew rate−induced distortion. 5 Output Voltage (VPP) 10 Output Impedance (Ω) VS = 5.5V 1 0.1 G = 100 0.01 G = 10 0.001 G=1 10 VS = 2.7V 3 2 1 0 100k 0.0001 1 4 100 1k 10k 100k 1M 10M 100M 1M Frequency (Hz) Figure 15. Closed-Loop Output Impedance vs Frequency 100M Figure 16. Maximum Output Voltage vs Frequency 140 V+ (V+)−1 Open−Loop Gain (dB) (V+)−2 +25°C −55°C +125°C Depending on circuit configuration (including closed−loop gain) performance may be degraded in shaded region. (V−)+2 +25°C +125°C −55 °C (V−)+1 I OUT = 2.5mA IOUT = 250µA 130 Output Voltage (V) 10M Frequency (Hz) 120 110 IOUT = 4.2mA 100 90 80 70 60 (V−) 0 ±10 ±20 ±30 ±40 Output Current (mA) Figure 17. Output Voltage Swing vs Output Current 10 Submit Documentation Feedback 0 20 40 60 80 100 120 140 160 180 200 Output Voltage Swing from Rails (mV) Figure 18. Open-Loop Gain vs Output Voltage Swing Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Typical Characteristics (continued) All specifications at TA = 25°C, VS = 5 V, and RL = 1 kΩ connected to VS/2, unless otherwise noted. 18 Typical production distribution of packaged units. 18 14 Percent of Amplifiers (%) Percent of Amplifiers (%) 20 Typical distribution of packaged units. 16 12 10 8 6 4 16 14 12 10 8 6 4 2 2 0 − 500 −450 −400 −350 − 300 −250 −200 −150 −100 −50 0 50 100 150 200 250 300 350 400 450 500 0 0 1 2 3 4 Offset Voltage (µV) 5 6 7 8 9 10 11 12 13 14 15 Offset Voltage Drift (µV/ °C) Figure 19. Offset Voltage Production Distribution Figure 20. Offset Voltage Drift Production Distribution 80 10 70 G=1 Settling Time (µs) Overshoot (%) 60 50 G= −1 40 30 G = ±10 20 0.01% 1 10 0.1% 0 0.1 10 100 1k 10k 100k 1M −1 −10 Load Capacitance (pF) Figure 21. Small-Signal Overshoot vs Load Capacitance Figure 22. Settling Time vs Closed-Loop Gain 1V/div 50mV/div −100 Closed−Loop Gain (V/V) 100ns/div 200ns/div Figure 23. Small-Signal Step Response CL = 100 pF Figure 24. Large-Signal Step Response CL = 100 pF Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 11 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 7 Detailed Description 7.1 Overview The OPA350 series rail-to-rail CMOS operational amplifiers are optimized for low voltage, single-supply operation. Rail-to-rail input and output, low noise (5 nV/√Hz), and high speed operation (38 MHz, 22 V/μs) make the amplifiers ideal for driving sampling Analog-to-Digital (A/D) converters. They are also suited for cell phone PA control loops and video processing (75-Ω drive capability), as well as audio and general purpose applications. Single, dual, and quad versions have identical specifications for maximum design flexibility. 7.2 Functional Block Diagram V+ Reference Current VIN+ VINVBIAS1 Class AB Control Circuitry VO VBIAS2 V(Ground) 7.3 Feature Description The OPA350 series of operational amplifiers (op amps) are fabricated on a state-of-the-art 0.6 micron CMOS process. They are unity-gain stable and suitable for a wide range of general purpose applications. Rail-to-rail input and output make them ideal for driving sampling A/D converters. They are also suited for controlling the output power in cell phones. These applications often require high speed and low noise. In addition, the OPA350 series offers a low-cost solution for general-purpose and consumer video applications (75-Ω drive capability). Excellent AC performance makes the OPA350 series suited for audio applications. Their bandwidth, slew rate, low noise (5 nV/√Hz), low THD (0.0006%), and small package options are ideal for these applications. The class AB output stage is capable of driving 600-Ω loads connected to any point between V+ and ground. Rail-to-rail input and output swing significantly increases dynamic range, especially in low voltage supply applications. Figure 25 shows the input and output waveforms for the OPA350 in unity-gain configuration. Operation is from a single 5-V supply with a 1-kΩ load connected to VS/2. The input is a 5 VPP sinusoid. Output voltage swing is approximately 4.95 VPP. Power supply pins should be bypassed with 0.01-μF ceramic capacitors. 12 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Feature Description (continued) VS = +5, G = +1, RL = 1kΩ 5V 0 5V 1.25V/div VIN VOUT 0 Figure 25. Rail-to-Rail Input and Output 7.3.1 Operating Voltage OPA350 series operational amplifiers are fully specified from 2.7 V to 5.5 V. Supply voltage may range from 2.5 V to 5.5 V. Parameters are tested over the specified supply range: a feature of the OPA350 series. In addition, many specifications apply from −40°C to 85°C. Most behavior remains virtually unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltage or temperature are shown in Typical Characteristics. 7.3.2 Rail-to-Rail Input The tested input common-mode voltage range of the OPA350 series extends 100 mV beyond the supply rails. This is achieved with a complementary input stage: an N-channel input-differential pair in parallel with a Pchannel differential pair, as shown in Figure 26. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 1.8 V to 100 mV above the positive supply, while the P-channel pair is on for inputs from 100 mV below the negative supply to approximately (V+) – 1.8 V. There is a small transition region, typically (V+) – 2 V to (V+) – 1.6 V, in which both pairs are on. This 400-mV transition region can vary ±400 mV with process variation. Thus, the transition region (both input stages on) can range from (V+) – 2.4 V to (V+) – 2 V on the low end, up to (V+) – 1.6 V to (V+) – 1.2 V on the high end. Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 13 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com Feature Description (continued) V+ Reference Current VIN+ VIN− VBIAS1 Class AB Control Circuitry VO VBIAS2 V− (Ground) Figure 26. Simplified Schematic OPA350 series operational amplifiers are laser-trimmed to reduce offset voltage difference between the Nchannel and P-channel input stages, resulting in improved common-mode rejection and a smooth transition between the N-channel pair and the P-channel pair. However, within the 400-mV transition region PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region. A double-folded cascode adds the signal from the two input pairs and presents a differential signal to the class AB output stage. Normally, input bias current is approximately 500 fA. However, large inputs (greater than 300 mV beyond the supply rails) can turn on the input protection diodes, causing excessive current to flow in or out of the input pins. Momentary voltages greater than 300 mV beyond the power supply can be tolerated if the current on the input pins is limited to 10 mA. This is easily accomplished with an input resistor, as shown in Figure 27. Many input signals are inherently current-limited to less than 10 mA; therefore, a limiting resistor is not required. V+ IOVERLOAD 10mA max OPAx350 VOUT VIN 5kΩ Figure 27. Input Current Protection for Voltages Exceeding the Supply Voltage 7.3.3 Rail-to-Rail Output A class AB output stage with common-source transistors achieves rail-to-rail output. For light resistive loads (>10 kΩ), the output voltage swing is typically ten millivolts from the supply rails. With heavier resistive loads (600 Ω to 10 kΩ), the output can swing to within a few tens of millivolts from the supply rails and maintain high open-loop gain. See Figure 17 and Figure 18 for more information. 14 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Feature Description (continued) 7.3.4 Capacitive Load and Stability OPA350 series operational amplifiers can drive a wide range of capacitive loads. However, all operational amplifiers under certain conditions may become unstable. operational amplifier configuration, gain, and load value are just a few of the factors to consider when determining stability. An operational amplifier in unity-gain configuration is the most susceptible to the effects of capacitive load. The capacitive load reacts with the output impedance of the operational amplifier, along with any additional load resistance, to create a pole in the smallsignal response that degrades the phase margin. In unity gain, OPA350 series operational amplifiers perform well with large capacitive loads. Increasing gain enhances the ability of the amplifier to drive more capacitance. Figure 21 shows performance with a 1-kΩ resistive load. Increasing load resistance improves capacitive load drive capability. 7.3.5 Driving A/D Converters OPA350 series operational amplifiers are optimized for driving medium speed (up to 500 kHz) sampling A/D converters, and also offer excellent performance for higher speed converters. The OPA350 series provides an effective means of buffering the input capacitance of the A/D and resulting charge injection while providing signal gain. Figure 28 shows the OPA350 driving an ADS7861. The ADS7861 is a dual, 500 kHz, 12-bit sampling converter in the tiny SSOP-24 package. When used with the miniature package options of the OPA350 series, the combination is ideal for space-limited applications. For further information, consult the ADS7861 data sheet, Dual, 500kSPS, 12-Bit, 2 + 2 Channel, Simultaneous Sampling ANALOG-TO-DIGITAL CONVERTER (SBAS110). Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 15 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com Feature Description (continued) CB1 2 4 1 1/ 4 3 VIN B1 +5V 2kΩ 2kΩ O P A 43 5 0 0.1µF 0.1µF CB0 24 2kΩ 2kΩ 2 3 6 7 1/ 4 5 VIN B0 4 O P A 43 5 0 5 6 CA1 7 2kΩ 2kΩ 8 9 9 VIN A1 10 8 1/ 4 10 13 +VD O P A 43 5 0 11 CA0 +VA CH B1+ SERIAL DATA A CH B1− SERIAL DATA B CH B0+ BUSY CH B0− CLOCK CH A1+ CS CH A1− ADS7861 RD CH A0+ CONVST CH A0− A0 REFIN M0 REFOUT M1 DGND 1 23 22 21 20 19 18 Serial Interface 17 16 15 14 AGND 12 2kΩ 2kΩ 12 14 1/ 4 VIN A0 13 O P A 43 5 0 11 VIN = 0V to 2.45V for 0V to 4.9V output. Choose CB1, CB0, CA1, CA0 to filter high frequency noise. Figure 28. OPA4350 Driving Sampling A/D Converter 7.3.6 Output Impedance The low-frequency open-loop output impedance of the common-source output stage of the OPA350 is approximately 1 kΩ. When the operational amplifier is connected with feedback, this value is reduced significantly by the loop gain of the operational amplifier. For example, with 122 dB of open-loop gain, the output impedance is reduced in unity-gain to less than 0.001 Ω. For each decade rise in the closed-loop gain, the loop gain is reduced by the same amount which results in a ten-fold increase in effective output impedance (see Figure 15). At higher frequencies, the output impedance rises as the open-loop gain of the operational amplifier drops. However, at these frequencies the output also becomes capacitive due to parasitic capacitance. This prevents the output impedance from becoming too high, which can cause stability problems when driving capacitive loads. The OPA350 has excellent capacitive load drive capability for an operational amplifier with its bandwidth. 16 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 7.4 Device Functional Modes The OPAx350 has a single functional mode and is operational when the power-supply voltage is greater than 2.7 V (±1.35 V). The maximum power supply voltage for the OPAx350 is 5.5V (±2.75 V). Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 17 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information Low pass filters are commonly employed in signal processing applications to reduce noise and prevent aliasing. The OPAx350 are ideally suited to construct high speed, high precision active filters. Figure 29 illustrates a second order low pass filter commonly encountered in signal processing applications. 8.2 Typical Applications 8.2.1 Second Order Low Pass Filter R4 2.94 k C5 1 nF R1 590 R3 499 Input C2 39 nF ± Output + OPAx350 Figure 29. Second Order Low Pass Filter 8.2.1.1 Design Requirements Use the following parameters for this design example: • Gain = 5 V/V (inverting gain). • Low pass cutoff frequency = 25 kHz. • Second order Chebyshev filter response with 3-dB gain peaking in the passband. 8.2.1.2 Detailed Design Procedure The infinite-gain multiple-feedback circuit for a low-pass network function is shown in Equation 1. Use Equation 2 to calculate the voltage transfer function. 1 R1R3C2C5 Output s 2 Input s s C2 1 R1 1 R3 1 R4 1 R3R4C2C5 (1) This circuit produces a signal inversion. For this circuit the gain at DC and the low pass cutoff frequency can be calculated using Equation 2. R4 Gain R1 fC 1 2S 1 R3R 4 C2C5 (2) Software tools are readily available to simplify filter design. WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive components from TI's vendor partners. Available as a web based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to design, optimize, and simulate complete multi-stage active filter solutions within minutes. 18 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Typical Applications (continued) 8.2.1.3 Application Curve 20 Gain (db) 0 -20 -40 -60 100 1k 10k Frequency (Hz) 100k 1M Figure 30. OPAx350 2nd Order 25-kHz, Chebyshev, Low-Pass Filter 8.2.2 Single-Supply Video Line Driver Figure 31 shows a circuit for a single supply, G = 2 composite video line driver. The synchronized outputs of a composite video line driver extend below ground. As shown, the input to the operational amplifier should be ACcoupled and shifted positively to provide adequate signal swing to account for these negative signals in a singlesupply configuration. The input is terminated with a 75-Ω resistor and AC-coupled with a 47-μF capacitor to a voltage divider that provides the DC bias point to the input. In Figure 31, this point is approximately (V−) + 1.7 V. Setting the optimal bias point requires some understanding of the nature of composite video signals. For best performance, avoid the distortion caused by the transition region of the complementary input stage of the OPA350. See the discussion of rail-to-rail input in Rail-to-Rail Input. RF 1kΩ RG 1kΩ +5V C1 220µF C4 0.1µF 0.1µF 2 + 7 6 C5 1000µF ROUT VOUT RL 3 R1 75Ω Cable OPA350 C2 47µF Video In 10µF 4 R2 5kΩ R3 5kΩ R4 5kΩ +5V (pin 7) C3 10µF Figure 31. Single-Supply Video Line Driver Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 19 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com Typical Applications (continued) 8.2.3 Adding a Feedback Capacitor to Improve Response For optimum settling time and stability with high-impedance feedback networks, it may be necessary to add a feedback capacitor across the feedback resistor, RF, as shown in Figure 32. This capacitor compensates for the zero created by the feedback network impedance and the input capacitance of the OPA350 (and any parasitic layout capacitance). The effect becomes more significant with higher impedance networks. CF RF R IN VIN V+ CIN RIN • CIN = RF • CF VOUT O PA350 CL CIN Where CIN is equal to the OPA350’s input capacitance (approximately 9pF) plus any parasitic layout capacitance. Figure 32. Feedback Capacitor Improves Dynamic Performance A variable capacitor can be used for the feedback capacitor, because input capacitance may vary between operational amplifiers and layout capacitance is difficult to determine. For the circuit shown in Figure 32, the value of the variable feedback capacitor should be chosen so that the input resistance times the input capacitance of the OPA350 (typically 9 pF) plus the estimated parasitic layout capacitance equals the feedback capacitor times the feedback resistor: RIN × CIN = RF × CF where • CIN is equal to the input capacitance of the OPA350 (sum of differential and common-mode) plus the layout capacitance. (3) The capacitor can be varied until optimum performance is obtained. 8.2.4 Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode Rejection The OPAx350 is well suited for high input impedance applications such as an instrumentation amplifier. The two amplifier configuration shown in Figure 33 rejects any common mode signals and senses the small differential input voltage developed by the resistive bridge. The voltage reference sets the output to 2.5 V when the differential signal developed by the bridge is zero. The high common mode rejection versus frequency response of the OPAx350, rejects and common mode noise that may be coupled into the bridge circuit from the bridge excitation source. The gain of the circuit is determined by RG according to the equation shown in Figure 33. 20 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 Typical Applications (continued) +5V 50kΩ (2.5V) 8 RG REF1004−2.5 4 R1 100kΩ +5V R2 25kΩ R3 25kΩ 1/ 2 R4 100kΩ O P A 2 35 0 1/ 2 VO O P A 23 5 0 G=5+ RL 10kΩ 200kΩ RG Figure 33. Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode Rejection Schematic 8.2.5 10-kHz High-Pass Filter High-pass filters are used to reject DC signals and low-frequency time varying signals such as drift versus temperature. Figure 34 illustrates a high-pass filter with a 10 kHz low-frequency cutoff frequency. R1 10.5kΩ +2.5V C1 1830pF C2 270pF VOUT OPA350 RL 20kΩ VIN R2 49.9kΩ −2.5V Figure 34. 10-kHz High-Pass Filter Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 21 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 9 Power Supply Recommendations The OPAx350 are specified for operation from 2.7 V to 5.5 V (±1.35 V to ±2.75 V); many specifications apply from –40°C to 85°C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in the Typical Characteristics. 10 Layout 10.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole and operational amplifier itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for singlesupply applications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds paying attention to the flow of the ground current. For more detailed information, see Circuit Board Layout Techniques (SLOA089). • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed to in parallel with the noisy trace. • Place the external components as close to the device as possible. As illustrated in Figure 35, keeping RF and RG close to the inverting input minimizes parasitic capacitance. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. • Cleaning the PCB following board assembly is recommended for best performance. • Any precision integrated circuit may experience performance shifts due to moisture ingress into the plastic package. Following any aqueous PCB cleaning process, baking the PCB assembly is recommended to remove moisture introduced into the device packaging during the cleaning process. A low temperature, post cleaning bake at 85°C for 30 minutes is sufficient for most circumstances. 22 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 10.2 Layout Example + VIN VOUT RG RF (Schematic Representation) Run the input traces as far away from the supply lines as possible Place components close to device and to each other to reduce parasitic errors VS+ RF N/C N/C GND ±IN V+ VIN +IN OUTPUT V± N/C RG Use low-ESR, ceramic bypass capacitor GND GND Use low-ESR, ceramic bypass capacitor VOUT VS± Ground (GND) plane on another layer Figure 35. Operational Amplifier Board Layout for Noninverting Configuration Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 23 OPA350, OPA2350, OPA4350 SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ (Free Software Download) TINA™ is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI™ is a free, fully-functional version of the TINA software, preloaded with a library of macro models in addition to a range of both passive and active models. TINA-TI provides all the conventional DC, transient, and frequency domain analysis of SPICE, as well as additional design capabilities. Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select input waveforms and probe circuit nodes, voltages, and waveforms, creating a dynamic quick-start tool. WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive components from TI's vendor partners. Available as a web based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to design, optimize, and simulate complete multi-stage active filter solutions within minutes. NOTE These files require that either the TINA software (from DesignSoft™) or TINA-TI software be installed. Download the free TINA-TI software from the TINA-TI folder. 11.1.1.2 TI Precision Designs The OPA350 is featured in several TI Precision Designs, available online at http://www.ti.com/ww/en/analog/precision-designs/. TI Precision Designs are analog solutions created by TI’s precision analog applications experts and offer the theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of many useful circuits. 11.2 Documentation Support 11.2.1 Related Documentation For related documentation see the following: • Circuit Board Layout Techniques, SLOA089 • Op Amps for Everyone, SLOD006 • Compensate Transimpedance Amplifiers Intuitively, SBOS055 • Noise Analysis for High Speed op Amps, SBOA066 11.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links 24 PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY OPA350 Click here Click here Click here Click here Click here OPA2350 Click here Click here Click here Click here Click here OPA4350 Click here Click here Click here Click here Click here Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 OPA350, OPA2350, OPA4350 www.ti.com SBOS099D – SEPTEMBER 2000 – REVISED DECEMBER 2015 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks TINA-TI, E2E are trademarks of Texas Instruments. TINA, DesignSoft are trademarks of DesignSoft, Inc. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: OPA350 OPA2350 OPA4350 Submit Documentation Feedback 25 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA2350EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 D50 OPA2350EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 D50 OPA2350EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 D50 OPA2350EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 D50 OPA2350PA NRND PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA2350PA OPA2350PAG4 NRND PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA2350PA OPA2350UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2350UA OPA2350UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2350UA OPA2350UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2350UA OPA2350UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2350UA OPA350EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 C50 OPA350EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 C50 OPA350EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 C50 OPA350EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 C50 OPA350PA ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA350PA OPA350PAG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA350PA OPA350UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 350UA Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA350UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 350UA OPA350UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 350UA OPA350UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 350UA OPA4350EA/250 ACTIVE SSOP DBQ 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 4350EA OPA4350EA/250G4 ACTIVE SSOP DBQ 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 4350EA OPA4350EA/2K5 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4350UA ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4350UA OPA4350UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4350UA OPA4350UA/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4350UA OPA4350UAG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4350UA -40 to 85 OPA 4350EA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2016 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Apr-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OPA2350EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2350EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA350EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA350UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4350EA/250 SSOP DBQ 16 250 180.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4350EA/2K5 SSOP DBQ 16 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4350UA/2K5 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Apr-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2350EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA2350EA/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA350EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA350UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA4350EA/250 SSOP DBQ 16 250 210.0 185.0 35.0 OPA4350EA/2K5 SSOP DBQ 16 2500 367.0 367.0 35.0 OPA4350UA/2K5 SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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