CT Micro CT827 Dc input 8-pin phototransistor optocoupler Datasheet

CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Features
Description

High isolation 5000 VRMS
The CT827 series consists of dual channels each

DC input with transistor output

Operating temperature range - 55 °C to 110 °C

External Creepage ≥ 7.5mm (S/SL Type)

External Creepage ≥ 8.0mm (SLM Type)

RoHS compliant
Applications

REACH compliance

Switch mode power supplies

Green material

Computer peripheral interface

Regulatory Approvals

Microprocessor system interface

UL - UL1577 (E364000) (pending approval)

VDE - EN60747-5-5(VDE0884-5)

CQC – GB4943.1, GB8898

IEC60065, IEC60950
contains a photo transistor optically coupled to a
gallium arsenide Infrared-emitting diode in a 8-lead
DIP package different lead forming options.
Package Outline
Schematic
Note: Different lead forming options available. See package
dimension.
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Preliminary
Jun, 2017
CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Absolute Maximum Rating at 25oC
Symbol
Parameters
Ratings
Units
VISO
Isolation voltage
5000
VRMS
PTOT
Total power dissipation
200
mW
TOPR
Operating temperature
-55 ~ +110
oC
TSTG
Storage temperature
-55 ~ +150
oC
TSOL
Soldering temperature
260
oC
60
mA
1
A
6
V
100
mW
Detector power dissipation
150
mW
BVCEO
Collector-Emitter Breakdown Voltage
80
V
BVECO
Emitter-Collector Breakdown Voltage
7
V
Collector Current
50
mA
Notes
Emitter (1 circuit)
IF
IF(TRANS)
Forward current
Peak transient current
(≤1μs P.W,300pps)
VR
Reverse voltage
PD
Emitter power dissipation
Detector (1 circuit)
PD
IC
CT Micro
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Preliminary
Jun, 2017
CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Electrical Characteristics T
A
= 25°C (unless otherwise specified)
Emitter Characteristics
Symbol
Parameters
Test Conditions
Min
Typ
Max
Units
1.24
1.4
V
VF
Forward voltage
IF=10mA
IR
Reverse Current
VR = 6V
-
-
5
µA
Input Capacitance
f= 1MHz
-
10
30
pF
Min
Typ
Max
Units
CIN
Notes
Detector Characteristics
Symbol
Parameters
Test Conditions
BVCEO
Collector-Emitter Breakdown
IC= 100µA
80
-
-
V
BVECO
Emitter-Collector Breakdown
IE= 100µA
7
-
-
V
Collector-Emitter Dark Current
VCE= 20V, IF=0mA
-
-
100
nA
Min
Typ
Max
Units
ICEO
Notes
Transfer Characteristics
Symbol
Parameters
Test Conditions
CT827
CTR
Current Transfer Ratio
CT827A
IF= 5mA, VCE= 5V
CT827B
50
600
80
160
130
260
Notes
%
Collector-Emitter Saturation
VCE(SAT)
IF= 20mA, IC= 1mA
-
0.1
0.2
V
Voltage
RIO
Isolation Resistance
VIO= 500VDC
CIO
Isolation Capacitance
f= 1MHz
Ω
5x1010
0.5
1
pF
Min
Typ
Max
Units
Switching Characteristics
Symbol
Parameters
Test Conditions
tr
Rise Time
IC= 2mA, VCE= 2V
-
6
18
tf
Fall Time
RL= 100Ω
-
8
18
Notes
µs
CT Micro
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Preliminary
Jun, 2017
CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Test Circuit
IC
Input
Pulse
RL
IF
Input
Output
Output
Pulse
RIN
tr
ton
tf
toff
Figure 12: Switching Time Test Circuits
CT Micro
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Preliminary
Jun, 2017
CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Package Dimension Dimensions in mm unless otherwise stated
Standard DIP – Through Hole
Gullwing (400mil) Lead Forming – Through Hole (M Type)
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CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Surface Mount Lead Forming (S Type)
Surface Mount (Low Profile) Lead Forming (SL Type)
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Preliminary
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CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Recommended Solder Mask Dimensions in mm unless otherwise stated
Device Marking
CT
827R
VYWWK
Note:
CT
827
R
: Denotes “CT Micro”
: Product Number
: CTR Rank
V
Y
WW
K
: VDE Option
: Fiscal Year
: Work Week
: Production Code
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Preliminary
Jun, 2017
CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Ordering Information
CT827X(V)(Y)(Z)
CT
827
X
=Denotes “CT Micro”
=Product Number
= Part No. (X=A, B or None)
V
Y
Z
= VDE Option ( V or None)
= Lead form option (S, SL, M or none)
= Tape and reel option (T1, T2 or none)
Option
Description
Quantity
None
Standard 8 Pin Dip
40 Units/Tube
M
Gullwing (400mil) Lead Forming
40 Units/Tube
S(T1)
Surface Mount Lead Forming – With Option 1 Taping
1000 Units/Reel
S(T2)
Surface Mount Lead Forming – With Option 2 Taping
1000 Units/Reel
SL(T1)
Surface Mount (Low Profile) Lead Forming– With Option 1 Taping
1000 Units/Reel
SL(T2)
Surface Mount (Low Profile) Lead Forming– With Option 2 Taping
1000 Units/Reel
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Preliminary
Jun, 2017
CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Carrier Tape Specifications Dimensions in mm unless otherwise stated
Option S(T1) & SL(T1)
Option S(T2) & SL(T2)
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Preliminary
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CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Wave soldering (follow the JEDEC standard JESD22-A111)
One time soldering is recommended within the condition of temperature.
Temperature: 260+0/-5˚C.
Time: 10 sec.
Preheat temperature:25 to 140˚C.
Preheat time: 30 to 80 sec.
Hand soldering by soldering iron
Allow single lead soldering in every single process.
One time soldering is recommended. Temperature: 380+0/-5˚C
Time: 3 sec max.
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Preliminary
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CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
Reflow Profile
Profile Feature
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
150°C
Temperature Max. (Tsmax)
200°C
Time (ts) from (Tsmin to Tsmax)
60-120 seconds
Ramp-up Rate (tL to tP)
3°C/second max.
Liquidous Temperature (TL)
217°C
Time (tL) Maintained Above (TL)
60 – 150 seconds
Peak Body Package Temperature
260°C +0°C / -5°C
Time (tP) within 5°C of 260°C
30 seconds
Ramp-down Rate (TP to TL)
6°C/second max
Time 25°C to Peak Temperature
8 minutes max.
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CT827 Series
DC Input 8-Pin Phototransistor Optocoupler
DISCLAIMER
CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
______________________________________________________________________________________
DISCOLORATION MIGHT OCCUR ON THE PACKAGE SURFACE AFTER SOLDERING, REFLOW OR LONG
TERM USE. THIS DOES NOT IMPACT THE PRODUCT PERFORMANCE NOR THE PRODUCT RELIABILITY.
CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION.
1. Life support devices or systems are devices or
2. A critical component is any component of a life
systems which, (a) are intended for surgical
support device or system whose failure to perform
implant into the body, or (b) support or sustain life,
can be reasonably expected to cause the failure of
or (c) whose failure to perform when properly used
the life support device or system, or to affect its
in accordance with instruction for use provided in
safety or effectiveness.
the labelling, can be reasonably expected to result
in significant injury to the user.
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Preliminary
Jun, 2017
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