Socay ESDP020604V12B1 Esd array Datasheet

ESD Array
ESDP020604V12B1
Description
This specification is applied to protect sensitive electronic
circuits from the threat of electrostatic discharge (ESD). The
function meets with the requirement of IEC61000-4-2
specification. The extreme low capacitance is suit for HDMI
ESD protection application. According to the special property
of device, we recommend not to use on such application as:
DC/AC power line.
Features
u
RoHS compliant, Lead-Free
u
Protection against ESD voltages and currents (IEC
Equivalent Circuits
61000-4-2 Level 4)
u
Extremely quick response time (<1ns) present ideal ESD
protection
6
u
Extremely low capacitance (0.1pF typical)
u
Extremely low leakage current
u
u
Surface mount device
Zero signal distortion
1
2
GND
4
3
GND
Pin
Identification
1,6
Data Lines
2,5
Data Lines
(No Internal Connection)
3,4
Ground
Product Model
Applications
u
u
u
u
u
5
u
u
u
u
Antenna circuit
USB2.0
IEEE-1394
DVI
HDMI
Digital Video Equipment
Mobil Phone
GPS Antenna
Bluetooth Communication Equipment
Electrical Characteristics
Characteristic
Rate Voltage
VDC
Leakage Current
Trigger Voltage
Value
(Max)
IL
12V
(Max) (@12VDC)
0.01μA
VT
Clamping Voltage
300V Typical
VC
Capacitance, @1MHz
30V Typical
CP
0.1pF Typical
Response Time
<1ns
ESD Voltage Capability, IEC61000-4-2 Contact Discharge Mode
8KV
ESD Voltage Capability, IEC61000-4-2 Air Discharge Mode
15KV
ESD Withstand Pulses
1000 Typical
CP - Device Capacitance measured with 1Vrms
SOCAY Electronics Co., Ltd.
Revision November 08, 2013
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@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
ESD Array
ESDP020604V12B1
Explanation of Part Number
ESDP
02
0604
V12
B1
B1, Mode Code
Max Rated Voltage VDC, V12=12V
Chip Size, 0604 = 0604 (EIA)
Channels, 02 = 2 channels
Series Type: Polymer ESD Suppressors
Construction & Dimensions
End termination
Unit: mm
Ag / Ni / Sn
Marking
Symbol
Spec.
L
1.60±0.10
W
1.00±0.10
T
0.55±0.10
B
0.20±0.10
C
0.20±0.05
D
0.50±0.05
P
0.5
P1
1.0
X
0.2
Y
0.7
Z
1.6
G
0.2
Overcoat color: Block
Recommended pad outline
SOCAY Electronics Co., Ltd.
Revision November 08, 2013
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@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
ESD Array
ESDP020604V12B1
Temperature Specifications
Parameter
Value
Unit
Operating Temperature
-55 to +125
°C
Storage Temperature
--55 to +125
°C
5 to 40
°C
<65
%RH
12 Max
Month
Taping Package
Storage
Condition
Storage Temperature
Relative Humidity
Storage Time
Soldering Parameters
Reflow Condition
TP
Critical Zone
TL to TP
Ramp-up
Pb free assembly
-Temperature Min (Ts(min))
+150°C
-Temperature Max (Ts(max))
+200°C
-Time (min to max) (TS)
60 -180 Seconds
TL
Pre Heat
Temperature
TS(max)
Ramp-down
TS(min)
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/Second Max
TS(max) to TL - Ramp-up Rate
3°C/Second Max
Preheat
25
Time to peak temperature
(t 25℃ to peak)
Time
- Temperature (TL) (Liquidus)
+217°C
- Time (min to max) (TL)
60 -150 Seconds
Reflow
Precaution for soldering
Precaution for soldering
Note that this product will be easily damaged by rapid heating,
Peak Temperature (TP)
260 +0/-5°C
rapid cooling or local heating.
Do not give heat shock over 100°C in the process of soldering.
Time within 5°C of actual peak
Temperature (TP)
20-40 Seconds
We recommend to take preheating and gradual cooling
Ramp-down Rate
6°C/Second Max
Time 25°C to peak Temperature (TP)
8 minutes Max
Soldering gun procedure
Note the follows, in case of using solder gun for replacement.
1) The tip temperature must be less than 280 for the period
within 3 seconds by using soldering gun under 30W
2) The soldering gun tip shall not touch this product directly.
Soldering volume
Note that excess of soldering volume will easily get crack the
body of this product.
SOCAY Electronics Co., Ltd.
Revision November 08, 2013
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@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
ESD Array
ESDP020604V12B1
Packaging Information
Carrier Tape Dimensions
Unit: mm
Packaging method
- Products shall be heat-sealed in the chip pocket, spacing
Symbol
Spec.
A
8.00±0.30
B
3.50±0.05
C
1.75±0.10
D
2.00±0.05
E
4.00±0.10
F
1.50±0.10
L
1.90±0.20
W
1.40±0.20
T
0.75±0.05
pitch 2-mm of paper carrier tape with cover tape, and carrier
tape shall be reeled to the reel.
- Tape material to be paper.
- Cover Tape adhesion to be 35±25 grams.
Taping Reel Dimensions
Unit: mm
Taping Specifications
There Shall be the portion having no product in
both the head and the end of taping, and there
shall be the cover tape in the heat of taping.
Quantity of products in the taping package
Standard Quantity
5000PCS / Reel
Shipping quantity is a multiple of standard quantity
SOCAY Electronics Co., Ltd.
Revision November 08, 2013
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@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
ESD Array
ESDP020604V12B1
HDMI Interface Application
HDMI Block Diagram
HDMI Source
Video
HDMI Sink
TMDS Channel 0
Video
TMDS Channel 1
Audio
TMDS Channel 2
Control/Status
TMDS Clock Channel
Audio
Control/Status
EDID
ROM
Display Data Channel (DDC)
CEC Line
Sink
Source
Video
Video
Audio
Audio
DCC Data1
DCC Data2
Control/status
GND
GND
SOCAY Electronics Co., Ltd.
Revision November 08, 2013
Control/status
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@SOCAY Electronics Co., Ltd. 2013
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
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