1 of 3 Creation Date : February 24, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012X5R2E153M125AA TDK item description C2012X5R2E153MT**** Applications Commercial Grade Feature Mid Mid Voltage (100 to 630V) Series C2012 [EIA 0805] Status Production (Not Recommended for New Design) Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 1.25mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 15nF ±20% Rated Voltage 250VDC Temperature Characteristic X5R(±15%) Dissipation Factor (Max.) 3% Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : February 24, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012X5R2E153M125AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012X5R2E153M125AA ESR C2012X5R2E153M125AA Capacitance C2012X5R2E153M125AA C2012X5R2E153M125AA Temperature Characteristic C2012X5R2E153M125AA(No Bias) DC Bias Characteristic C2012X5R2E153M125AA(DC Bias = 125V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012X5R2E153M125AA(100kHz) C2012X5R2E153M125AA(500kHz) C2012X5R2E153M125AA(1MHz) Multilayer Ceramic Chip Capacitors C2012X5R2E153M125AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : February 24, 2017 (GMT)