MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor Diode
Features
Rev. V1
Flip-Chip Design
Constant Gamma for Linear Tuning
Low Parasitic Capacitance
High Q
Silicon Nitride Passivation
Polyimide Scratch Protection
Surface Mount Configuration
Lead Free (RoHS Compliant*)
Available in Pocket Tape and Reel
Can withstand 500 Temperature Cycles (-65°C
to +150°C), mounted with Sn96.5/Pb3.5 solder
without Mechanical Degradation
Can be Mounted with Solder or Conductive
Epoxy
Front View (Circuit Side)
Description
Back View (Operator Side)
The MAVR-011020-1411 is a gallium arsenide flip
chip hyperabrupt varactor diode. This device is
fabricated on OMCVD epitaxial wafers using a
process designed for high device uniformity and
extremely low parasitics. This diode is fully
passivated with silicon nitride and has an additional
layer of polyimide for scratch protection. The
protective coatings prevent damage to the junction
during automated or manual handling.
Ordering Information2,3
The flip chip configuration is suitable for pick and
place insertion.
Part Number
Package
MAVR-011020-14110P
Pocket Tape
MAVR-011020-14110G
Gel Pack
2. Reference Application Note M513 for reel size information.
3. All sample boards include x loose parts.
Electrical Specifications: TA = +25°C
Breakdown Voltage @ IR = 10 µA, VB = 22 V Minimum
Reverse Leakage Current @ VR =18 V, IR = 100 nA Maximum
Forward Voltage @ 1 mA = 1.15 - 1.25 V
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Total Capacitance
1 MHz, 0 V
1 MHz, 4 V
1 MHz, 15 V
pF
0.19
0.065
0.025
—
0.275
0.097
0.048
Q Factor
50 MHz, 4 V
—
—
3000
—
Gamma
2 - 12 V
—
—
0.9
1.1
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor Diode
Parameter
Absolute Maximum
Power Dissipation
100 mW
Mounting Temperature
+260°C
Operating Temperature
-40°C to +125°C
Storage Temperature
-65°C to +150°C
5. Exceeding any one or combination of these limits may cause
permanent damage to this device.
6. MACOM does not recommend sustained operation near these
survivability limits.
Performance Curve @ +25°C
1.0
Total Capacitance (pF)
Absolute Maximum Ratings5,6
Rev. V1
0.1
0.0
1
Reverse Bias Voltage (V)
Schematic (equivalent circuit)
RS (V)
CJ (V)
10
LS
CPARASITIC
Mounting Techniques
Handling Procedures
Die attach for these devices is made simple through
the use of surface mount die attach technology. This
chip was designed to be inserted onto hard or soft
substrates with the junction side down. This chip can
be mounted with conductive epoxy or with solder.
The following precautions should be observed to
avoid damaging these chips:
Solder Die Attach:
This device can be mounted with Sn63/Pb37 or
RoHS compliant solder.
Typical reflow profiles are provided on application
note M538, “Surface Mounting Instructions” which
can be found @ www.macom.com
Epoxy Die Attach:
This device can also be attached with conductive
epoxy. The assembly can be preheated to
125 - 150°C. Use a minimum amount of epoxy. Cure
epoxy as per manufacturer’s instructions.
Cleanliness
The chips should be handled in a clean
environment. Do not attempt to clean die after
installation.
Static Sensitivity
Semiconductor devices are ESD sensitive and can
be damaged by static electricity. Proper ESD
techniques should be used when handling these
devices.
General Handling
The protective polymer coating on the active areas
of these die provides scratch protection, particularly
for the metal air bridge which contacts the anode.
Die can be handled with tweezers or vacuum
pickups and are suitable for use with automatic
pick-and-place equipment.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor Diode
Rev. V1
Flip Chip Outline Drawing (Case Style 1500)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor Diode
Rev. V1
M/A-COM Technology Solutions Inc. All rights reserved.
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products. These materials are provided by MACOM as a service to its customers and may be used for
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4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support