NICHIA NFSL757GT-P5 Specifications for warm white led Datasheet

NICHIA STS-DA1-5010 <Cat.No.171020>
NICHIA CORPORATION
SPECIFICATIONS FOR WARM WHITE LED
NFSL757GT-P5
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
NICHIA STS-DA1-5010 <Cat.No.171020>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Symbol
Absolute Maximum Rating
Unit
Forward Current
Item
IF
180
mA
Pulse Forward Current
IFP
240
mA
Allowable Reverse Current
IR
85
mA
Power Dissipation
PD
594
mW
Operating Temperature
Topr
-40~100
°C
Storage Temperature
Tstg
-40~100
°C
Junction Temperature
TJ
120
°C
* Absolute Maximum Ratings at TJ=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.
* For IF and IFP, see the "DERATING CHARACTERISTICS" of this specification.
(2) Initial Electrical/Optical Characteristics
Item
Forward Voltage
R8000
R9050
Chromaticity Coordinate
Thermal Resistance
Luminous Flux
Symbol
Condition
Typ
Max
Unit
VF
IF=65mA
2.89
-
V
IF=65mA
31.9
-
IF=65mA
27.4
-
IF=65mA
0.4338
-
IF=65mA
0.4030
-
-
13
19
Φv
x
-
y
RθJS
lm
°C/W
* Characteristics at TJ=25°C and measured in pulse mode.
* Optical Characteristics as per CIE 127:2007 standard.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
* RθJS is measured using the Dynamic Mode detailed in JESD51-1.
* RθJS is the thermal resistance from the junction to the TS measurement point. （Test board: FR4 board thickness=1.6mm, copper
layer thickness=0.07mm）
1
NICHIA STS-DA1-5010 <Cat.No.171020>
RANKS
Item
Forward Voltage
Rank
-
Condition
IF=65mA
30.3
36.0
25.5
30.3
21.4
25.5
Ra
80
-
R9
0
-
90
-
50
-
IF=65mA
P9
R9050
V
3.3
42.8
P10
Color Rendering Index
Unit
2.4
P11
R8000
Max
36.0
P12
Luminous Flux
Min
Ra
IF=65mA
R9
lm
-
Color Ranks(IF=65mA)
The color ranks have chromaticity ranges within 3-step MacAdam ellipse.
Color Temperature
(Unit: K)
Center Point
Rank
Rank
Rank
Rank
sm273
sm303
sm353
sm403
TCP
2700
3000
3500
4000
x
0.4578
0.4338
0.4073
0.3818
y
0.4101
0.4030
0.3917
0.3797
a
0.004056
0.004107
0.004098
0.004071
Major Axis
b
0.007872
0.008391
0.008796
0.009282
Ellipse Rotation Angle
Φ
-36.05
-36.00
-35.47
-35.95
Minor Axis
The color ranks have chromaticity ranges within 5-step MacAdam ellipse.
Color Temperature
Rank
Rank
Rank
Rank
Rank
Rank
sm2750a
sm2750b
sm2750c
sm2750d
sm2750e
sm2750f
TCP
2700
x
0.4578
y
0.4101
a
0.006760
Major Axis
b
0.013120
Ellipse Rotation Angle
Φ
-36.05
(Unit: K)
Center Point
Minor Axis
Color Temperature
Rank
Rank
Rank
Rank
Rank
Rank
sm3050a
sm3050b
sm3050c
sm3050d
sm3050e
sm3050f
TCP
3000
x
0.4338
y
0.4030
a
0.006845
Major Axis
b
0.013985
Ellipse Rotation Angle
Φ
-36.00
(Unit: K)
Center Point
Minor Axis
2
NICHIA STS-DA1-5010 <Cat.No.171020>
Color Temperature
Rank
Rank
Rank
Rank
Rank
Rank
sm3550a
sm3550b
sm3550c
sm3550d
sm3550e
sm3550f
TCP
3500
x
0.4073
y
0.3917
Minor Axis
a
0.006830
Major Axis
b
0.014660
Ellipse Rotation Angle
Φ
-35.47
(Unit: K)
Center Point
Color Temperature
Rank
Rank
Rank
Rank
Rank
Rank
sm4050a
sm4050b
sm4050c
sm4050d
sm4050e
sm4050f
TCP
4000
x
0.3818
y
0.3797
Minor Axis
a
0.006785
Major Axis
b
0.015470
Ellipse Rotation Angle
Φ
-35.95
(Unit: K)
Center Point
* Ranking at TJ=25°C and measured in pulse mode.
* Forward Voltage Tolerance: ±0.05V
* Luminous Flux Tolerance: ±5%
* Color Rendering Index Ra Tolerance: ±1.5
* Color Rendering Index R9 Tolerance: ±3
* The R9 value for the above rank shall be greater than 0.
* Chromaticity Coordinate Tolerance: ±0.003
* LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia.
Definition of the MacAdam ellipse ranks:
b
60°
A perfect circle is divided
into 60 degree-sections
and then transformed
into the MacAdam ellipse
that is presented
on the chromaticity diagram
in this document.
Φ
a
Luminous Flux Ranks by Color Rank, Color Rendering Index Rank
Ranking by
Luminous Flux
Ranking by
P9
P10
P11
P12
Color Coordinates,
Color Rendering Index
sm273,sm2750a,sm2750b,sm2750c,sm2750d,sm2750e,sm2750f,
sm303,sm3050a,sm3050b,sm3050c,sm3050d,sm3050e,sm3050f,
sm353,sm3550a,sm3550b,sm3550c,sm3550d,sm3550e,sm3550f,
sm403,sm4050a,sm4050b,sm4050c,sm4050d,sm4050e,sm4050f
R8000
R9050
3
NICHIA STS-DA1-5010 <Cat.No.171020>
CHROMATICITY DIAGRAM
0.46
2700K
0.44
sm3050a
sm3050b
3500K
sm3050c
0.42
sm4050a
sm4050b
sm4050c
3000K
sm2750a
sm2750b
sm2750c
sm3550a
sm3550b
sm3550c
4000K
sm2750d
sm273
sm2750e
sm2750f
y
0.40
0.38
sm3550d
sm353
sm3550e
sm4050d sm3550f
sm403
0.36
sm3050d
sm303
sm3050e
sm3050f
sm4050e
sm4050f
0.34
0.32
0.34
黒体放射軌跡
Blackbody Locus
0.36
0.38
0.40
0.42
0.44
0.46
0.48
x
4
NICHIA STS-DA1-5010 <Cat.No.171020>
OUTLINE DIMENSIONS
* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.
* 括弧で囲まれた寸法は参考値です。
The dimension(s) in parentheses are for reference purposes.
管理番号 No.
NFSx757G-P5
STS-DA7-12598
(単位 Unit:±0.2)
mm)
(単位 Unit: mm, 公差 Tolerance:
3
（2.6）
0.65
3
（2.6）
光学的中心位置
Location of the optical center
Cathode Mark
a
(Cathode)
b
(Anode)
2.27
2.6
Cathode
Anode
1.42
K
0.48
項目 Item
内容 Description
パッケージ材質
Package Materials
耐熱性ポリマー
Heat-Resistant Polymer
封止樹脂材質
Encapsulating Resin
Materials
シリコーン樹脂
（拡散剤+蛍光体入り）
Silicone Resin
(with diffuser and phosphor)
電極材質
Electrodes Materials
銅合金+銀メッキ
Ag-plated Copper Alloy
質量
Weight
0.018g(TYP)
* バリは寸法に含まないものとします。
Dimensions do not include mold flash.
* b>aとなる場合、aがカソード側です。
The side with the larger distance is the cathode.
Example: b>a, then a is the side that has the cathode.
A
保護素子
Protection Device
5
NICHIA STS-DA1-5010 <Cat.No.171020>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
• Recommended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
260°CMax
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
1.53
0.69
0.6
1.45
0.95
0.58
3.15
2
0.6
2.3
2.3
0.6
● Recommended Metal Solder Stencil Aperture
0.85
0.85
2.3
3.15
● Recommended Soldering Pad Pattern
0.6
0.4
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or
atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. Pressure can cause nicks,
chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron
should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by
repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle with a smaller
diameter than the size of the LED's emitting surface will cause damage to the emitting surface and may also cause the LED not
to illuminate.
6
NICHIA STS-DA1-5010 <Cat.No.171020>
* If the top cover tape is removed right next to where the nozzle picks up the LEDs, regardless of whether the LEDs have been baked
or not, it may cause the LED to be picked up incorrectly; it is recommended to remove the top cover tape further from where the
nozzle picks up the LEDs. Ensure that there are no issues with the conditions when the nozzle picks up the LEDs.
● Recommended Tape Removal Position(Removing the cover tape further from the pick-and-place nozzle)
吸着ノズル
Pick-and-place nozzle
テープ剥離位置
Tape Removal Position
製品テープ
Top Cover Tape
キャリアテープ引き出し方向
Feed Direction of the Carrier Tape
● Incorrect Tape Removal Position(Removing the cover tape right next to the pick-and-place nozzle)
吸着ノズル
Pick-and-place nozzle
テープ剥離位置
Tape Removal Position
製品テープ
Top Cover Tape
キャリアテープ引き出し方向
Feed Direction of the Carrier Tape
* Verify the setting conditions when the LEDs are mounted onto a PCB to ensure that the LEDs are mounted onto the PCB with the
correct polarity. If the cathode mark is not able to be easily recognized with a visual inspection, check the back or side of the LED
to determine the polarity.
* The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting
accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design.
* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the
flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
* All of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a
normal visual inspection. When using the product, ensure that there are no issues with the soldering conditions.
7
NICHIA STS-DA1-5010 <Cat.No.171020>
TAPE AND REEL DIMENSIONS
4±0.1
0.2±0.05
Nxxx757x
STS-DA7-9622
(単位 Unit: mm)
3.18±0.1
3.5±0.05
Cathode Mark
2
±0.05
1.75±0.1
4±0.1
Φ1.5+0.1
-0
管理番号 No.
8+0.3
-0.1
テーピング部 Tape
Φ1+0.2
-0
0.8±0.1
3.18±0.1
エンボスキャリアテープ
Embossed Carrier Tape
トレーラ部/リーダ部 Trailer and Leader
トップカバーテープ
Top Cover Tape
引き出し方向
Feed
Direction
LED装着部
Loaded Pockets
トレーラ部最小160mm（空部）
Trailer 160mm MIN(Empty Pockets)
引き出し部最小100mm（空部）
Leader with Top Cover Tape
100mm MIN(Empty Pocket)
リーダ部最小400mm
Leader without Top Cover Tape 400mm MIN
リール部 Reel
180+0
-3
9+1
-0
Φ
* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,
no more than 10N should be applied to
the embossed carrier tape.
The LEDs may stick to the top cover tape.
±
21
8
0.
f2
1 ±0.
Φ
13 ±
0
.2
f 13
Φ60+1
-0
8
±0.2
* 数量は1リールにつき 5000個入りです。
Reel Size: 5000pcs
11.4±1
* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
ラベル
Label
8
NICHIA STS-DA1-5010 <Cat.No.171020>
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
Reels are shipped with desiccants in heat-sealed moisture-proof bags.
管理番号 No.
Nxxxxxxx
STS-DA7-4989
ラベル Label
リール
Reel
シリカゲル
Desiccants
XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
熱シール
Seal
アルミ防湿袋
Moisture-proof Bag
アルミ防湿袋を並べて入れ、ダンボールで仕切ります。
Moisture-proof bags are packed in cardboard boxes
with corrugated partitions.
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
* 客先型名を*******で示します。
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it will not be indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING CODE"
in this document.
* ランク分けがない場合はランク表記はありません。
The label does not have the RANK field for
un-ranked products.
* 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or expose the box to external forces as it may damage the products.
* ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。
Do not expose to water. The box is not water-resistant.
* 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。
Using the original package material or equivalent in transit is recommended.
9
NICHIA STS-DA1-5010 <Cat.No.171020>
LOT NUMBERING CODE
Lot Number is presented by using the following alphanumeric code.
YMxxxx - RRR
Y - Year
Year
Y
2016
G
2017
H
2018
I
2019
J
2020
K
2021
L
M - Month
Month
M
Month
M
1
1
7
7
2
2
8
8
3
3
9
9
4
4
10
A
5
5
11
B
6
6
12
C
xxxx-Nichia's Product Number
RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Color Rendering Index
10
NICHIA STS-DA1-5010 <Cat.No.171020>
DERATING CHARACTERISTICS
周囲温度-許容順電流特性
Ambient Temperature vs
Allowable Forward Current
Derating1 R θJA = 76°C/W
300
はんだ接合部温度(カソード側)-許容順電流特性
Solder Temperature(Cathode Side) vs
Allowable Forward Current
Derating2
300
許容順電流
Allowable Forward Current(mA)
許容順電流
Allowable Forward Current(mA)
NFSx757G-P5
管理番号 No. STS-DA7-12591
250
200
(70, 180)
150
100
(100, 70.0)
50
250
200
(100, 180)
150
100
50
0
0
0
20
40
60
80
100
120
周囲温度
Ambient Temperature(°C)
デューティー比-許容順電流特性
Duty Ratio vs
Allowable Forward Current
0
20
40
60
80
100
120
はんだ接合部温度(カソード側)
Solder Temperature(Cathode Side)(°C)
TA =25°C
Duty
許容順電流
Allowable Forward Current(mA)
300
250
240
200
180
150
100
50
0
0
20
40
60
80
100
デューティー比
Duty Ratio(%)
11
NICHIA STS-DA1-5010 <Cat.No.171020>
OPTICAL CHARACTERISTICS
NFSL757G-P5
管理番号 No. STS-DA7-12599
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
* パルス駆動により測定しています。
The following graphs show the characteristics measured in pulse mode.
発光スペクトル
Spectrum
Spectrum
1.0
相対発光強度(最大強度で正規化)
Relative Emission Intensity(a.u.)
(Normalized to peak spectral intensity)
Tcp =3000K
TJ =25°C
IFP = 65mA
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-20°
-10°
0°
10°
-30°
TJ =25°C
IFP = 65mA
20°
30°
-40°
40°
放射角度
Radiation Angle
-50°
50°
-60°
60°
-70°
70°
-80°
80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
* 本特性は演色性ランクR8000に対応しています。
The graphs above show the characteristics for R8000 LEDs of this product.
12
NICHIA STS-DA1-5010 <Cat.No.171020>
OPTICAL CHARACTERISTICS
NFSL757G-P5
管理番号 No. STS-DA7-12600
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
* パルス駆動により測定しています。
The following graphs show the characteristics measured in pulse mode.
発光スペクトル
Spectrum
Spectrum
1.0
相対発光強度(最大強度で正規化)
Relative Emission Intensity(a.u.)
(Normalized to peak spectral intensity)
Tcp =3000K
TJ =25°C
IFP = 65mA
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
波長
Wavelength(nm)
Directivity1
指向特性
Directivity
-20°
-10°
0°
10°
-30°
TJ =25°C
IFP = 65mA
20°
30°
-40°
40°
放射角度
Radiation Angle
-50°
50°
-60°
60°
-70°
70°
-80°
80°
-90°
90°
1
0.5
0
0.5
1
相対照度
Relative Illuminance(a.u.)
* 本特性は演色性ランクR9050に対応しています。
The graphs above show the characteristics for R9050 LEDs of this product.
13
NICHIA STS-DA1-5010 <Cat.No.171020>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NFSL757G-P5
管理番号 No. STS-DA7-12601
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
* パルス駆動により測定しています。
The following graphs show the characteristics measured in pulse mode.
順電圧-順電流特性
Forward Voltage vs
Forward Current
VfIf
300
ジャンクション温度-順電圧特性
Junction Temperature vs
Forward Voltage
TJ =25°C
IFP=65mA
4.0
順電圧
Forward Voltage(V)
250
240
順電流
Forward Current(mA)
TaVf
200
150
100
3.5
3.0
2.5
65
50
0
2.0
2.0
2.5
3.0
3.5
4.0
-60
順電圧
Forward Voltage(V)
順電流-相対光束特性
Forward Current vs
Relative Luminous Flux
IfIv
4.0
-30
0
30
60
90
120
150
ジャンクション温度
Junction Temperature(°C)
ジャンクション温度-相対光束特性
Junction Temperature vs
Relative Luminous Flux
TJ =25°C
TaIv
IFP=65mA
1.4
相対光束(T J =25°Cで正規化)
Relative Luminous Flux(a.u.)
(Normalized at T J =25°C)
相対光束 (IFP= 65mAで正規化)
Relative Luminous Flux(a.u.)
(Normalized at IFP= 65mA)
3.5
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.0
0.6
0
50
100
150
200
順電流
Forward Current(mA)
250
300
-60
-30
0
30
60
90
120
150
ジャンクション温度
Junction Temperature(°C)
* 本特性は色温度2700K~4000K、演色性ランクR8000に対応しています。
The graphs above show the characteristics for 2700K~4000K, R8000 LEDs of this product.
14
NICHIA STS-DA1-5010 <Cat.No.171020>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NFSL757G-P5
管理番号 No. STS-DA7-12602
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
* パルス駆動により測定しています。
The following graphs show the characteristics measured in pulse mode.
順電圧-順電流特性
Forward Voltage vs
Forward Current
VfIf
300
ジャンクション温度-順電圧特性
Junction Temperature vs
Forward Voltage
TJ =25°C
IFP=65mA
4.0
順電圧
Forward Voltage(V)
250
240
順電流
Forward Current(mA)
TaVf
200
150
100
3.5
3.0
2.5
65
50
0
2.0
2.0
2.5
3.0
3.5
4.0
-60
順電圧
Forward Voltage(V)
順電流-相対光束特性
Forward Current vs
Relative Luminous Flux
IfIv
4.0
-30
0
30
60
90
120
150
ジャンクション温度
Junction Temperature(°C)
ジャンクション温度-相対光束特性
Junction Temperature vs
Relative Luminous Flux
TJ =25°C
TaIv
IFP=65mA
1.4
相対光束(T J =25°Cで正規化)
Relative Luminous Flux(a.u.)
(Normalized at T J =25°C)
相対光束 (IFP= 65mAで正規化)
Relative Luminous Flux(a.u.)
(Normalized at IFP= 65mA)
3.5
3.0
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.5
0.0
0.6
0
50
100
150
200
順電流
Forward Current(mA)
250
300
-60
-30
0
30
60
90
120
150
ジャンクション温度
Junction Temperature(°C)
* 本特性は色温度2700K~4000K、演色性ランクR9050に対応しています。
The graphs above show the characteristics for 2700K~4000K, R9050 LEDs of this product.
15
NICHIA STS-DA1-5010 <Cat.No.171020>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NFSL757G-P5
管理番号 No. STS-DA7-12603
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
* パルス駆動により測定しています。
The following graphs show the characteristics measured in pulse mode.
順電流-色度 特性
Forward Current vs
Chromaticity Coordinate
Ifxy
Tcp =3000K
T J =25°C
0.42
y
0.41
240mA
65mA
10mA
0.40
0.39
0.38
0.41
0.42
0.43
0.44
0.45
x
ジャンクション温度-色度 特性
Junction Temperature vs
Chromaticity Coordinate
Taxy
Tcp =3000K
IFP =65mA
0.42
y
0.41
0.40
100˚C
-40˚C
0˚C
25˚C
120˚C
0.39
0.38
0.41
0.42
0.43
0.44
0.45
x
* 本特性は演色性ランクR8000に対応しています。
The graphs above show the characteristics for R8000 LEDs of this product.
16
NICHIA STS-DA1-5010 <Cat.No.171020>
FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS
NFSL757G-P5
管理番号 No. STS-DA7-12604
* 本特性は参考です。
All characteristics shown are for reference only and are not guaranteed.
* パルス駆動により測定しています。
The following graphs show the characteristics measured in pulse mode.
順電流-色度 特性
Forward Current vs
Chromaticity Coordinate
Ifxy
0.42
Tcp =3000K
T J =25°C
0.41
y
240mA 65mA
10mA
0.40
0.39
0.38
0.41
0.42
0.43
0.44
0.45
x
ジャンクション温度-色度 特性
Junction Temperature vs
Chromaticity Coordinate
Taxy
Tcp =3000K
IFP =65mA
0.42
-40˚C
0.41
0˚C
y
25˚C
0.40
0.39
100˚C
120˚C
0.38
0.41
0.42
0.43
0.44
0.45
x
* 本特性は演色性ランクR9050に対応しています。
The graphs above show the characteristics for R9050 LEDs of this product.
17
NICHIA STS-DA1-5010 <Cat.No.171020>
RELIABILITY
(1) Tests and Results
Reference
Test
Standard
Resistance to
Test
Test Conditions
Duration
JEITA ED-4701
Tsld=260°C, 10sec, 2reflows,
300 301
Precondition: 30°C, 70%RH, 168hr
Solderability
JEITA ED-4701
Tsld=245±5°C, 5sec,
(Reflow Soldering)
303 303A
Lead-free Solder(Sn-3.0Ag-0.5Cu)
JEITA ED-4701
-40°C(30min)~25°C(5min)~
100 105
100°C(30min)~25°C(5min)
Moisture Resistance
JEITA ED-4701
25°C~65°C~-10°C, 90%RH,
(Cyclic)
200 203
24hr per cycle
High Temperature
JEITA ED-4701
Storage
200 201
Temperature Humidity
JEITA ED-4701
Storage
100 103
Low Temperature
JEITA ED-4701
Storage
200 202
Soldering Heat
(Reflow Soldering)
Temperature Cycle
Room Temperature
Room Temperature
#2
0/22
100cycles
#1
0/50
10cycles
#1
0/22
TA=100°C
1000hours
#1
0/22
TA=60°C, RH=90%
1000hours
#1
0/22
TA=-40°C
1000hours
#1
0/22
1000hours
#1
0/22
500hours
#1
0/22
1000hours
#1
0/22
500hours
#1
0/22
1000hours
#1
0/22
48minutes
#1
0/22
#1
0/22
#3
0/22
#1
0/22
TA=25°C, IF=180mA
Operating Life
Test board: See NOTES below
Condition 2
High Temperature
TA=100°C, IF=70mA
Operating Life
Test board: See NOTES below
Temperature Humidity
60°C, RH=90%, IF=65mA
Operating Life
Test board: See NOTES below
Low Temperature
TA=-40°C, IF=65mA
Operating Life
Test board: See NOTES below
Vibration
Electrostatic Discharges
JEITA ED-4701
200m/s2, 100~2000~100Hz,
400 403
4cycles, 4min, each X, Y, Z
JEITA ED-4701
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
300 304
alternately positive or negative
1bend to a deflection of 2mm
Board Bending
for 5±1sec
Soldering Joint Shear
JEITA ED-4702B
Strength
002 3
Failed/Tested
0/22
Test board: See NOTES below
Condition 1
#
Units
#1
TA=25°C, IF=65mA
Operating Life
Failure
Criteria
5N, 10±1sec
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈76°C/W
The Board Bending is performed using an exclusive test board.
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=65mA
>U.S.L.×1.1
Luminous Flux(ΦV)
IF=65mA
<L.S.L.×0.7
#2
Solderability
-
Less than 95% solder coverage
#3
Appearance
-
The light emission is abnormal
#1
U.S.L. : Upper Specification Limit
L.S.L. : Lower Specification Limit
18
NICHIA STS-DA1-5010 <Cat.No.171020>
CAUTIONS
(1) Storage
Conditions
Storage
Temperature
Humidity
Time
Before Opening Aluminum Bag
≤30°C
≤90%RH
Within 1 Year from Delivery Date
After Opening Aluminum Bag
≤30°C
≤70%RH
≤168hours
65±5°C
-
≥24hours
Baking
● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination and result
in optical performance degradation. Products are packed in moisture-proof aluminum bags to minimize moisture absorption
during transportation and storage. Included silica gel desiccants change from blue to red if moisture had penetrated bags.
● After opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the
conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants in a hermetically sealed container,
preferably the original moisture-proof bags for storage.
● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue, the products should
be baked. Baking should only be done once.
● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment may cause
the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics. It is also
recommended to return the LEDs to the original moisture proof bags and reseal.
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close
proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above
should be taken into consideration when designing. Resin materials, in particular, may contain substances which can affect silver
plating, such as halogen.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a
material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products,
caused by low molecular weight volatile siloxane.
● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.
● Do not store the LEDs in a dusty environment.
● Do not expose the LEDs to direct sunlight and/or an environment where the temperature is higher than normal room temperature.
(2) Directions for Use
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating. Operating at a constant
current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended. If the LEDs are operated
with constant voltage using Circuit A, the current through the LEDs may vary due to the variation in Forward Voltage
characteristics of the LEDs.
(A)
(B)
...
...
● This product should be operated using forward current. Ensure that the product is not subjected to either forward or reverse
voltage while it is not in use. In particular, subjecting it to continuous reverse voltage may cause migration, which may cause
damage to the LED die. When used in displays that are not used for a long time, the main power supply should be switched off
for safety.
● It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
● Ensure that excessive voltages such as lightning surges are not applied to the LEDs.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
19
NICHIA STS-DA1-5010 <Cat.No.171020>
(3) Handling Precautions
● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might
cause the LED to be deformed and/or the wire to break, which will cause the LED not to illuminate.
● When handling the product with tweezers, be careful not to apply excessive force to the resin. Otherwise, The resin can be cut,
chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
● CRI Rank R9050 LEDs in this specification use materials that contain halogen-based compounds; the halogen element found in
these materials will not affect the LEDs when the LEDs are used under the conditions specified in this specification. The other CRI
ranks in this specification do not use these materials.
● Due to the variation in the amount of the reflective material (white resin) that is coating the protection device, the area around
the protection device may appear to be a black spot; this will not affect the characteristics of the LED. Do not use the location of
the protection device to determine the polarity of the LED; use the cathode mark.
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break. The LED should be placed in a way to
minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not using hands.
● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, packing, adhesive,
secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a
hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and
it may greatly reduce the LED light output and/or cause a color shift. In this case, ventilating the environment may improve the
reduction in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that
there are no issues, especially if the LEDs are planned to be used in a hermetically sealed environment.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the
products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and that proper grounding
techniques are used in work areas. For devices/equipment that mount the LEDs, protection against surge voltages should also be
used.
● If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge
are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
● The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in
the application. Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA).
● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current.
Failure Criteria: VF<2.0V at IF=0.5mA
20
NICHIA STS-DA1-5010 <Cat.No.171020>
(6) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected by PCB thermal
resistance and LED spacing on the board. Please design products in a way that the LED die temperature does not exceed the
maximum Junction Temperature (TJ).
● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
● The following equations can be used to calculate the LED temperature (i.e. TJ) once the saturation temperature at the junction has
been reached.
1) TJ=TA+RθJA･W
2) TJ=TS+RθJS･W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature (cathode side): °C
RθJA=Thermal resistance from junction to ambient: °C/W
RθJS=Thermal resistance from junction to TS measurement point: °C/W
W=Input power(IF×VF): W
TS Measurement Point
(7) Cleaning
● Do not wipe/clean the LEDs with a damp cloth soaked in water or solvents (e.g. benzine, thinner, etc.).
● If required, use isopropyl alcohol (IPA). If water or other solvent is used, it may cause issues. Before using the solvent, ensure that
sufficient verification is performed to ensure that the solvent does not adversely affect the LEDs. In addition, the use of CFCs such
as Freon is heavily regulated.
● When a foreign substance (e.g. dust, debris, loose materials, etc.) adheres to the LEDs, wipe it off with a damp well-squeezed
cloth that was soaked only in isopropyl alcohol (IPA).
● Do not wipe the emitting surface. Otherwise, it may result in excessive pressure to the emitting surface causing issues (e.g. wire
to deform, the encapsulating resin to become damaged, the color to change, etc.). If wiping the emitting surface is necessary,
ensure that sufficient preliminary verification is performed to ensure that there are no issues; wipe the emitting surface at the
customer’s risk.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs depending on the ultrasonic power and how
LED is assembled. If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior
to cleaning.
(8) Eye Safety
● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps and lamp
systems, which added LEDs in its scope. On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its
scope. However, please be advised that some countries and regions have adopted standards based on the IEC laser safety
standard IEC 60825-1:20112001, which still includes LEDs in its scope. Most of Nichia's LEDs can be classified as belonging into
either the Exempt Group or Risk Group 1. High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk
Group 2. Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs with optical
instruments which may greatly increase the damages to your eyes.
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product, please be careful to avoid
adverse effects on the human body caused by light stimulation.
21
NICHIA STS-DA1-5010 <Cat.No.171020>
(9) Miscellaneous
● Nichia warrants that the discrete LEDs will meet the requirements/criteria as detailed in the Reliability section within this
specification. If the LEDs are used under conditions/environments deviating from or inconsistent with those described in this
specification, the resulting damage and/or injuries will not be covered by this warranty.
● Nichia warrants that the discrete LEDs manufactured and/or supplied by Nichia will meet the requirements/criteria as detailed in
the Reliability section within this specification; it is the customer’s responsibility to perform sufficient verification prior to use to
ensure that the lifetime and other quality characteristics required for the intended use are met.
● The applicable warranty period is one year from the date that the LED is delivered. In the case of any incident that appears to be
in breach of this warranty, the local Nichia sales representative should be notified to discuss instructions on how to proceed while
ensuring that the LED in question is not disassembled or removed from the PCB if it has been attached to the PCB. If a breach of
this warranty is proved, Nichia will provide the replacement for the non-conforming LED or an equivalent item at Nichia’s
discretion. FOREGOING ARE THE EXCLUSIVE REMEDIES AVAILABLE TO THE CUSTOMER IN RESPECT OF THE BREACH OF THE
WARRANTY CONTAINED HEREIN, AND IN NO EVENT SHALL NICHIA BE RESPONSIBLE FOR ANY INDRECT, INCIDENTAL OR
CONSEQUENTIAL LOSSES AND/OR EXPENSES (INCLUDING LOSS OF PROFIT) THAT MAY BE SUFFERED BY THE CUSTOMER
ARISING OUT OF A BREACH OF THE WARRANTY.
● NICHIA DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
● This LED is intended to be used for general lighting, household appliances, electronic devices (e.g. mobile communication
devices); it is not designed or manufactured for use in applications that require safety critical functions (e.g. aircraft, automobiles,
combustion equipment, life support systems, nuclear reactor control system, safety devices, spacecraft, submarine repeaters,
traffic control equipment, trains, vessels, etc.). If the LEDs are planned to be used for these applications, unless otherwise
detailed in the specification, Nichia will neither guarantee that the LED is fit for that purpose nor be responsible for any resulting
property damage, injuries and/or loss of life/health. This LED does not comply with ISO/TS 16949 and is not intended for
automotive applications.
● The customer will not reverse engineer, disassemble or otherwise attempt to extract knowledge/design information from the LED.
● All copyrights and other intellectual property rights in this specification in any form are reserved by Nichia or the right holders who
have granted Nichia permission to use the content. Without prior written permission from Nichia, no part of this specification may
be reproduced in any form or by any means.
● Both the customer and Nichia will agree on the official specifications for the supplied LEDs before any programs are officially
launched. Without this agreement in writing (i.e. Customer Specific Specification), changes to the content of this specification
may occur without notice (e.g. changes to the foregoing specifications and appearance, discontinuation of the LEDs, etc.).
22