SO−8 Single/Dual SSOP−16 Quad (Obsolete) SOT−23−5 Single MSOP Dual OPA237 OPA2237 OPA4237 SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 SINGLE-SUPPLY OPERATIONAL AMPLIFIERS MicroAmplifierE Series FEATURES DESCRIPTION D MICRO-SIZE, MINIATURE PACKAGES: The OPA237 op amp family is one of Texas Instruments’ MicroAmplifier series of miniature products. In addition to small size, these devices feature low offset voltage, low quiescent current, low bias current, and a wide supply range. Single, dual, and quad versions have identical specifications for maximum design flexibility. They are ideal for single-supply, battery-operated, and space-limited applications, such as PCMCIA cards and other portable instruments. − Single: SOT23-5, SO-8 − Dual: MSOP-8, SO-8 − Quad: SSOP-16 (Obsolete) LOW OFFSET VOLTAGE: 750µV max D D WIDE SUPPLY RANGE: D D − Single Supply: +2.7V to +36V − Dual Supply: +1.35V to +18V LOW QUIESCENT CURRENT: 350µV max WIDE BANDWIDTH: 1.5MHz OPA237 series op amps can operate from either single or dual supplies. When operated from a single supply, the input common-mode range extends below ground and the output can swing to within 10mV of ground. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. APPLICATIONS D D D D D BATTERY-POWERED INSTRUMENTS PORTABLE DEVICES PCMCIA CARDS MEDICAL INSTRUMENTS TEST EQUIPMENT Single, dual, and quad are offered in space-saving surface-mount packages. The single version is available in the ultra-miniature 5-lead SOT23-5 and SO-8 surface-mount. The dual version comes in a miniature MSOP-8 and SO-8 surface-mount. The quad version is obsolete. MSOP-8 has the same lead count as a SO-8 but half the size. The SOT23-5 is even smaller at one-fourth the size of an SO-8. All are specified for −40°C to +85°C operation. A macromodel is available for design analysis. OPA237 Out 1 V− 2 +In 3 5 V+ 4 −In SOT23−5 OPA4237 OPA237 OPA2237 Out A 1 −In A 2 A NC 1 8 NC Out A 1 −In 2 7 V+ −In A 2 +In 3 6 Output +In A 3 V− 4 5 NC V− A B 4 SO−8 Out D 15 −In D D +In A 3 14 +In D Out B V+ 4 13 V− −In B +In B 5 12 +In C +In B −In B 6 11 −In C Out B 7 10 Out C NC 8 9 8 V+ 7 6 5 16 B C SO−8, MSOP−8 NC SSOP−16 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroAmplifier is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. Copyright 1996-2007, Texas Instruments Incorporated ! ! www.ti.com "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage, V+ to V− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V−) −0.7V to (V+) +0.7V Output Short-Circuit(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. (2) Short circuit to ground, one amplifier per package. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE−LEAD PACKAGE DRAWING PACKAGE MARKING SOT23-5 DBV A37A SO-8 D OPA237UA MSOP-8 DGK B37A SO-8 D OPA2237UA SSOP-16 DBQ OPA4237UA Single OPA237NA OPA237UA Dual OPA2237EA OPA2237UA Quad(2) OPA4237UA (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) Quad version is obsolete. 2 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 ELECTRICAL CHARACTERISTICS: VS = +5V Boldface limits apply over the specified temperature range, TA = −40°C to +85°C. At TA = +25°C, VS = +5V, RL = 10kΩ, connected to VS/2, unless otherwise noted. OPA237UA, NA OPA2237UA, EA OPA4237UA PARAMETER CONDITIONS MIN TYP MAX UNITS VCM = 2.5V ±250 ±750 µV Specified Temperature Range +2 +5 µV/°C 10 30 µV/V OFFSET VOLTAGE Input Offset Voltage vs Temperature(1) vs Power Supply (PSRR) VS = +2.7V to +36V Channel Separation (dual and quad) µV/V 0.5 INPUT BIAS CURRENT Input Bias Current(2) VCM = 2.5V −10 −40 nA Input Offset Current VCM = 2.5V ±0.5 ±10 nA NOISE Input Voltage Noise, f = 0.1 to 10Hz 1 µVPP Input Voltage Noise Density, f = 1kHz 28 nV/√Hz Current Noise Density, f = 1kHz 60 fA/√Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range −0.2 Common-Mode Rejection Ratio VCM = −0.2V to 3.5V 78 (V+) −1.5 V 86 dB 5 • 106 || 4 5 • 109 || 2 Ω || pF 88 dB INPUT IMPEDANCE Differential Common-Mode Ω || pF OPEN-LOOP GAIN Open-Loop Voltage Gain VO = 0.5V to 4V 80 FREQUENCY RESPONSE Gain-Bandwidth Product 1.4 MHz G=1 0.5 V/µs G = −1, 3V Step, CL = 100pF 11 µs G = −1, 3V Step, CL = 100pF 16 µs Slew Rate Settling Time, 0.1% 0.01% OUTPUT Voltage Output, Positive RL = 100kΩ to Ground (V+) −1 (V+) −0.75 V Negative RL = 100kΩ to Ground 0.01 0.001 V Positive RL = 100kΩ to 2.5V (V+) −1 (V+) −0.75 V Negative RL = 100kΩ to 2.5V 0.12 0.04 V Positive RL = 10kΩ to 2.5V (V+) −1 (V+) −0.75 V Negative RL = 10kΩ to 2.5V 0.5 0.35 V −10/+4 mA Short-Circuit Current Capacitive Load Drive (stable operation) See Typical Characteristic Curves POWER SUPPLY Specified Operating Voltage Operating Range +5 +2.7 Quiescent Current (per amplifier) 170 V +36 V 350 µA TEMPERATURE RANGE Specified Range −40 +85 °C Operating Range −55 +125 °C Storage Range −55 +125 °C Thermal Resistance, qJA SOT23-5 200 °C/W MSOP-8 150 °C/W SSOP-16 (Obsolete) 150 °C/W SO-8 150 °C/W (1) Specified by wafer-level test to 95% confidence. (2) Positive conventional current flows into the input terminals. 3 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 ELECTRICAL CHARACTERISTICS: VS = +2.7V Boldface limits apply over the specified temperature range, TA = −40°C to +85°C. At TA = +25°C, VS = +2.7V , RL = 10kΩ, connected to VS/2, unless otherwise noted. OPA237UA, NA OPA2237UA, EA OPA4237UA PARAMETER CONDITIONS MIN TYP MAX UNITS VCM = 1V ±250 ±750 µV Specified Temperature Range +2 +5 µV/°C 10 30 µV/V OFFSET VOLTAGE Input Offset Voltage vs Temperature(1) vs Power Supply (PSRR) VS = +2.7V to +36V Channel Separation (dual and quad) µV/V 0.5 INPUT BIAS CURRENT Input Bias Current(2) VCM = 1V −10 −40 nA Input Offset Current VCM = 1V ±0.5 ±10 nA NOISE Input Voltage Noise, f = 0.1 to 10Hz 1 µVPP Input Voltage Noise Density, f = 1kHz 28 nV/√Hz Current Noise Density, f = 1kHz 60 fA/√Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range −0.2 Common-Mode Rejection Ratio VCM = −0.2V to 1.2V 75 (V+) −1.5 V 85 dB 5 • 106 || 4 5 • 109 || 2 Ω || pF 88 dB INPUT IMPEDANCE Differential Common-Mode Ω || pF OPEN-LOOP GAIN Open-Loop Voltage Gain VO = 0.5V to 1.7V 80 FREQUENCY RESPONSE Gain-Bandwidth Product 1.2 MHz G=1 0.5 V/µs G = −1, 1V Step, CL = 100pF 5 µs G = −1, 1V Step, CL = 100pF 8 µs Slew Rate Settling Time, 0.1% 0.01% OUTPUT Voltage Output, Positive RL = 100kΩ to Ground (V+) −1 (V+) −0.75 V Negative RL = 100kΩ to Ground 0.01 0.001 V Positive RL = 100kΩ to 1.35V (V+) −1 (V+) −0.75 V Negative RL = 100kΩ to 1.35V 0.06 0.02 V Positive RL = 10kΩ to 1.35V (V+) −1 (V+) −0.75 V Negative RL = 10kΩ to 1.35V 0.3 0.2 V −5/+3.5 mA Short-Circuit Current Capacitive Load Drive (stable operation) See Typical Characteristic Curves POWER SUPPLY Specified Operating Voltage Operating Range +2.7 +2.7 Quiescent Current (per amplifier) 160 V +36 V 350 µA TEMPERATURE RANGE Specified Range −40 +85 °C Operating Range −55 +125 °C Storage Range −55 +125 °C Thermal Resistance, qJA SOT23-5 200 °C/W MSOP-8 150 °C/W SSOP-16 (Obsolete) 150 °C/W SO-8 150 °C/W (1) Specified by wafer-level test to 95% confidence. (2) Positive conventional current flows into the input terminals. 4 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 ELECTRICAL CHARACTERISTICS: VS = +15V Boldface limits apply over the specified temperature range, TA = −40°C to +85°C. At TA = +25°C, VS = ±15V , RL = 10kΩ, connected to VS/2, unless otherwise noted. OPA237UA, NA OPA2237UA, EA OPA4237UA PARAMETER CONDITIONS MIN TYP MAX UNITS VCM = 0V ±350 ±950 µV Specified Temperature Range +2.5 +7 µV/°C 10 30 µV/V OFFSET VOLTAGE Input Offset Voltage vs Temperature(1) VS = ±1.35V to ±18V vs Power Supply (PSRR) Channel Separation (dual and quad) µV/V 0.5 INPUT BIAS CURRENT Input Bias Current(2) VCM = 0V −8.5 −40 nA Input Offset Current VCM = 0V ±0.5 ±10 nA NOISE Input Voltage Noise, f = 0.1 to 10Hz 1 µVPP Input Voltage Noise Density, f = 1kHz 28 nV/√Hz Current Noise Density, f = 1kHz 60 fA/√Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range (V−)−0.2 Common-Mode Rejection Ratio VCM = −15V to 13.5V 80 (V+) −1.5 V 90 dB 5 • 106 || 4 5 • 109 || 2 Ω || pF 88 dB INPUT IMPEDANCE Differential Common-Mode Ω || pF OPEN-LOOP GAIN Open-Loop Voltage Gain VO = −14V to 13.8V 80 FREQUENCY RESPONSE Gain-Bandwidth Product 1.5 MHz G=1 0.5 V/µs G = −1, 10V Step, CL = 100pF 18 µs G = −1, 10V Step, CL = 100pF 21 µs Slew Rate Settling Time, 0.1% 0.01% OUTPUT Voltage Output, Positive RL = 100kΩ (V+) −1.2 (V+) −0.9 V Negative RL = 100kΩ (V−) +0.5 (V−) +0.3 V Positive RL = 10kΩ (V+) −1.2 (V+) −0.9 V Negative RL = 10kΩ (V−) +1 (V−) +0.85 V −8/+4.5 mA Short-Circuit Current Capacitive Load Drive (stable operation) See Typical Characteristic Curves POWER SUPPLY ±15 Specified Operating Range Operating Range ±1.35 ±200 Quiescent Current (per amplifier) V ±18 V ±475 µA TEMPERATURE RANGE Specified Range −40 +85 °C Operating Range −55 +125 °C Storage Range −55 +125 °C Thermal Resistance, qJA SOT23-5 200 °C/W MSOP-8 150 °C/W SSOP-16 (Obsolete) 150 °C/W SO-8 150 °C/W (1) Specified by wafer-level test to 95% confidence. (2) Positive conventional current flows into the input terminals. 5 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 TYPICAL CHARACTERISTICS At TA = +25°C and RL = 10kΩ, unless otherwise noted. POWER SUPPLY and COMMON−MODE REJECTION vs FREQUENCY OPEN−LOOP GAIN/PHASE vs FREQUENCY 100 120 CL = 100pF G +PSR (VS = +5V, ±15V) 0 −45 Φ VS = ±15V 40 −90 20 −135 0 PSR, CMR (dB) 60 100 Phase (_) Voltage Gain (dB) 80 −180 VS = +2.7V, +5V 10 100 1k 10k 100k 1M 60 40 +PSR (VS = +2.7V) −PSR (VS = ±15V) 20 −20 1 CMR (VS = +2.7V, +5V or ±15V) 80 0 10M 10 100 1k Frequency (Hz) 10k 100k 1M 10M Frequency (Hz) INPUT NOISE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY 130 Channel Separation (dB) Voltage Noise (nV/√Hz) Current Noise (fA/√Hz) 1k Current Noise 100 Voltage Noise 120 110 100 90 80 10 10 1 100 1k 10k Dual and quad devices. G = 1, all channels. Quad measured channel A to D or B to C other combinations yield improved rejection. 10 100k 100 1k Frequency (Hz) 14 −12 −11 12 VS = +2.7V, +5V Input Bias Current (nA) Input Bias Current (nA) 100k INPUT BIAS CURRENT vs INPUT COMMON−MODE VOLTAGE INPUT BIAS CURRENT vs TEMPERATURE 10 8 VS = ±15V 6 VS = +2.7V VS = +5V −10 −9 VS = ±15V −8 −7 4 −75 −50 −25 0 25 50 Temperature (_ C) 6 10k Frequency (Hz) 75 100 125 −6 −15 −10 −5 0 5 Common−Mode Voltage (V) 10 15 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 TYPICAL CHARACTERISTICS (Continued) At TA = +25°C and RL = 10kΩ, unless otherwise noted. OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE PRODUCTION DISTRIBUTION 9 VS = +2.7V, +5V 7.5 5 2.5 0.2% 8 0.4% 0.7% 6 5 4 3 2 1 0.1% 0.1% 0 −950 −850 −750 −650 −550 −450 −350 −250 −150 −50 50 150 250 350 450 550 650 750 850 950 750 650 550 450 350 250 50 150 −50 −150 −250 −350 −450 −550 −650 −750 0 Offset Voltage (µV) Offset Voltage (µV) OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION 30 16 25 20 15 10 5 0.2% 0.2% 12 10 8 6 4 0.6% 0.2% 0.4% 2 0 0.2% VS = ±15V AOL, CMR, PSR (dB) 6 4 2 8 7 7.5 6 6.5 5 5.5 4 4.5 3 CMR AOL PSR 110 8 0.2% 0.4% AOL, CMR, PSR vs TEMPERATURE 120 Typical production distribution of packaged units. Single, dual, and quad units included. 10 3.5 2 Offset Voltage Drift (µV/_C) OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION 12 2.5 1 0.5 11.5 10.5 9.5 8.5 7.5 6.5 5.5 4.5 3.5 2.5 1.5 0.5 0 Offset Voltage Drift (µV/_C) 100 VS = +2.7V, +5V, ±15V VS = ±15V VS = +2.7V, +5V 90 80 VS = ±15V VS = +2.7V, +5V 70 0.4% 60 Offset Voltage Drift (µV/_ C) 8 7.5 7 6.5 6 5.5 5 4.5 4 3.5 3 2 2.5 1.5 1 0 0.5 Percent of Amplifiers (%) Typical production distribution of packaged units. Single, dual, and quad units included. VS = +5V 14 Percent of Amplifiers (%) Typical production distribution of packaged units. Single, dual, and quad units included. VS = +2.7V Percent of Amplifiers (%) 7 VS = ±15V Typical production distribution of packaged units. Single, dual, and quad units included. 1.5 10 Typical production distribution of packaged units. Single, dual, and quad units included. Percent of Amplifiers (%) Percent of Amplifiers (%) 12.5 −75 −50 −25 0 25 50 75 100 125 Temperature (_C) 7 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 TYPICAL CHARACTERISTICS (Continued) At TA = +25°C and RL = 10kΩ, unless otherwise noted. 20mV/div SMALL−SIGNAL STEP RESPONSE (G = 1, CL = 220pF, VS = +5V) 20mV/div SMALL−SIGNAL STEP RESPONSE (G = 1, CL = 100pF, VS = +5V) 1µs/div 2µs/div SETTLING TIME vs GAIN LARGE−SIGNAL STEP RESPONSE (G = 1, CL = 100pF, VS = +5V) 100 VS = ±15V, 10V Step 1V/div Settling Time (µs) VS = +5V, 3V Step 10 VS = +2.7V, 1V Step 0.01% 0.1% 1 −1 −10 10µs/div SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE OUTPUT VOLTAGE SWING vs OUTPUT CURRENT V+ 70 Sourcing Current (V+) −1 +25_ C (V+) −1.5 50 +125_C −55_ C (V−) +2 +125_ C Sinking Current −55_ C (V−) +1.5 +5V, ±15V 40 30 20 (V−) +1 +25_C (V−) +0.5 10 +125_C V− 0 1 2 3 Output Current (mA) 8 G = +1, V S = +2.7V, +5V G = +1, V S = ±15V G = −1, V S = ±15V G = −2, V S = +2.7V, +5V G = −10, V S = +2.7V, 60 Overshoot (%) Output Voltage Swing (V) (V+) −0.5 (V+) −2 −100 Gain (V/V) 4 5 0 10 100 1k Load Capacitance (pF) 10k "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 TYPICAL CHARACTERISTICS (Continued) At TA = +25°C and RL = 10kΩ, unless otherwise noted. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY QUIESCENT CURRENT vs TEMPERATURE 300 VS = ±15V Maximum output voltage without slew−rate induced distortion 20 15 10 VS = +5V 5 200 150 VS = +5V VS = +2.7V 100 50 0 1k VS = ±15V 250 VS = +2.7V 10k 100k −75 1M −50 −25 0 25 50 75 100 125 Temperature (_ C) Frequency (Hz) SHORT−CIRCUIT CURRENT vs TEMPERATURE 12 VS = +5V Short−Circuit Current (mA) Output Voltage (VPP) 25 Quiescent Current (µA) 30 10 8 VS = ±15V VS = +2.7V 6 − ISC 4 + ISC 2 VS = ±15V VS = +2.7V VS = +5V 0 −75 −50 −25 0 25 50 75 100 125 Temperature (_C) 9 "#$ ""#$ %"#$ www.ti.com SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007 APPLICATION INFORMATION OPA237 series op amps remain stable with capacitive loads up to 4,000pF, if sinking current and up to 10,000pF, if sourcing current. Furthermore, in single-supply applications where the load is connected to ground, the op amp is only sourcing current, and as shown Figure 1, can drive 10,000pF with output currents up to 1.5mA. OPA237 series op amps are unity-gain stable and suitable for a wide range of general-purpose applications. Power supply pins should be bypassed with 10nF ceramic capacitors. OPERATING VOLTAGE 100k OPA237 series op amps operate from single (+2.7V to +36V) or dual (±1.35V to ±18V) supplies with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in typical performance curves. Specifications are production tested with +2.7V, +5V, and ±15V supplies. Capacitive Load (pF) OPERATION NOT RECOMMENDED 10k 1k VS = +5V, ±15V 100 OUTPUT CURRENT AND STABILITY VS = +2.7V OPA237 series op amps can drive large capacitive loads. However, under certain limited output conditions any op amp may become unstable. Figure 1 shows the region where the OPA237 has a potential for instability. These load conditions are rarely encountered, especially for single supply applications. For example, take the case when a +5V supply with a 10kΩ load to VS/2 is used. 10 −2 −1.5 −1 −0.5 0 0.5 1 To Load R5 383kΩ IH High−Side Current Sense R3 38.3kΩ V+ −In A1 Out +In OPA237 R4 20kΩ V+ for A1, A2 + VO = 10 • IH • RH R2 V− 19.1kΩ R2 and R4 divide down the common−mode input to A1. R8 100kΩ 2.7V to = ±15V V− for A1, A2 V+ −In A2 Out VO = 10 • IL • RL +In OPA237 V− R7 9.09kΩ R6 10kΩ RL 10Ω Low−Side Current Sense Common−mode range of A2 extends to V− for low−side sensing Optional for IB Cancellation (R7 = R6 II R8) To Load IL NOTE: Low and high−side sensing circuits can be used independently. Figure 2. Low and High-Side Battery Current Sensing 10 2 Figure 1. Stability-Capacitive Load vs Output Current RH 10Ω R1 38.3kΩ 1.5 Output Current (mA) PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2016 PACKAGING INFORMATION Orderable Device Status (1) (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA2237EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-3-260C-168 HR B37A OPA2237EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-3-260C-168 HR B37A OPA2237EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-3-260C-168 HR -40 to 85 B37A OPA2237EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-3-260C-168 HR -40 to 85 B37A OPA2237UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2237UA OPA2237UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2237UA OPA2237UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2237UA OPA2237UAE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA 2237UA OPA237NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 70 A37A OPA237NA/250E4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 70 A37A OPA237NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 70 A37A OPA237NA/3KE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 70 A37A OPA237UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 70 OPA 237UA OPA237UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 70 OPA 237UA OPA237UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 70 OPA 237UA OPA4237UA/250 OBSOLETE SSOP DBQ 16 TBD Call TI Call TI OPA4237UA/2K5 OBSOLETE SSOP DBQ 16 TBD Call TI Call TI The marketing status values are defined as follows: Addendum-Page 1 0 to 70 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2016 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device OPA2237EA/250 Package Package Pins Type Drawing VSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2237UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA237NA/250 SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA237NA/3K SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA237UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Nov-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2237EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA2237UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA237NA/250 SOT-23 DBV 5 250 180.0 180.0 18.0 OPA237NA/3K SOT-23 DBV 5 3000 180.0 180.0 18.0 OPA237UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated