ON NCV87706DT50RKG Ultra low iq 350 ma ldo regulator with reset Datasheet

NCV8770
Ultra Low Iq 350 mA LDO
Regulator with Reset
The NCV8770 is 350 mA LDO regulator with integrated reset
functions dedicated for microprocessor applications. Its robustness allows
NCV8770 to be used in severe automotive environments. Ultra low
quiescent current as low as 21 mA typical makes it suitable for
applications permanently connected to battery requiring ultra low
quiescent current with or without load. This feature is especially critical
when modules remain in active mode when ignition is off. The NCV8770
contains protection functions as current limit, thermal shutdown and
reverse output current protection.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
Output Voltage Options: 5 V
Output Voltage Accuracy: ±1.5% (TJ = 25°C to 125°C)
Output Current up to 350 mA
Ultra Low Quiescent Current: typ 21 mA (max 28 mA)
Very Wide Range of Cout and ESR Values for Stability
Microprocessor Compatible Control Functions:
− Reset with Adjustable Power−On Delay
Wide Input Voltage Operation Range: up to 40 V
Protection Features
− Current Limitation
− Thermal Shutdown
These are Pb−Free Devices
y
xx
A
WL, L
Y
WW
G or G
Typical Applications
•
•
•
•
Body Control Module
Instruments and Clusters
Occupant Protection and Comfort
Powertrain
VBAT
Cin
0.1 mF
Vin
Vout
770yxxG
ALYWW
D2PAK−5
D5S SUFFIX
CASE 936A
NC
V8770yxx
AWLYWWG
= Timing and Reset Threshold Option
= Voltage Option
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Vout
NCV8770
DPAK−5
DT SUFFIX
CASE 175AA
Cout
1 mF
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
VDD
Microprocessor
DT
RO
RESET
GND
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 1
1
Publication Order Number:
NCV8770/D
NCV8770
Vin
Vout
Thermal
Shutdown
RO
Driver
With
Erorr Amplifier
Current
Reset Comparator
Reset Driver
Limit
Reference
Timing
DT
Circuit
*
Timer
GND
* Pull−Down Resistor (typ 150 kW) active only in Reset State
Figure 2. Simplified Block Diagram
PIN CONNECTIONS
PIN
Tab,
1. Vin
2. RO
3. GND
4. DT
5. Vout
PIN
Tab,
1. Vin
2. RO
3. GND
4. DT
5. Vout
1
1
D2PAK−5
DPAK−5
Figure 3. Pin Connections
PIN FUNCTION DESCRIPTION
Pin No.
DPAK−5
D2PAK−5
Pin Name
1
Vin
Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
2
RO
Reset Output. 30 kW internal Pull−up resistor connected to Vout. RO goes Low when Vout drops by more
than 7% (typ) from its nominal value (for NCV8770y devices with y = 1,2,3,...) or more than 10% (typ) from
its nominal value (for NCV8770y devices with y = A, B, C,...).
3, TAB
GND
4
DT
Reset Delay Time Select. Short to GND or connected to Vout to select time.
5
Vout
Regulated Output Voltage. Connect 1 mF capacitor with ESR < 100 W to ground.
−
NC
Not Connected
−
GND
Description
Power Supply Ground.
Exposed Pad is Connected to Ground.
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NCV8770
ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Symbol
Min
Max
Unit
Vin
−0.3
−
40
45
V
DC
Transient, t < 100 ms
Input Current
Iin
−5
−
mA
Output Voltage (Note 2)
Vout
−0.3
5.5
V
Output Current
Iout
−3
Current Limited
mA
DT (Reset Delay Time Select) Voltage
VDT
−0.3
5.5
V
DT (Reset Delay Time Select) Current
IDT
−1
1
mA
Reset Output Voltage
VRO
−0.3
5.5
V
Reset Output Current
IRO
−3
3
mA
Junction Temperature
TJ
−40
150
°C
Storage Temperature
TSTG
−55
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (Vin + 0.3 V) (whichever is lower).
ESD CAPABILITY (Note 3)
Rating
Symbol
Min
Max
Unit
ESDHBM
−2
2
kV
ESD Capability, Machine Model
ESDMM
−200
200
V
ESD Capability, Charged Device Model
ESDCDM
−1
1
kV
Max
Unit
ESD Capability, Human Body Model
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Symbol
Rating
Moisture Sensitivity Level
DPAK−5
D2PAK−5
Min
MSL
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
TSLD
1
1
−
−
265 peak
°C
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS (Note 5)
Rating
Symbol
Value
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
RqJA
RYJC
56
8.4
Thermal Characteristics, D2PAK−5
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
RqJA
RYJC
53
8.4
Unit
°C/W
°C/W
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
RECOMMENDED OPERATING RANGE (Note 7)
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 8)
Vin
5.5
40
V
Junction Temperature
TJ
−40
150
°C
7. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
8. Minimum Vin = 5.5 V or (Vout + VDO), whichever is higher.
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NCV8770
ELECTRICAL CHARACTERISTICS Vin = 13.2 V, Cin = 0.1 mF, Cout = 1 mF, for typical values TJ = 25°C, for min/max values TJ =
−40°C to 150°C; unless otherwise noted. (Notes 9 and 10)
Parameter
Test Conditions
Symbol
TJ = 25 °C to 125 °C
Vin = 5.575 V to 16 V, Iout = 0.1 mA to 200 mA
Vout
Min
Typ
Max
4.925
(−1.5 %)
5.0
5.075
(+1.5%)
4.9
4.9
(−2 %)
5.0
5.0
5.1
5.1
(+2%)
4.9
(−2 %)
5.0
5.1
(+2%)
Unit
REGULATOR OUTPUT
Output Voltage (Accuracy %)
Output Voltage (Accuracy %)
Vin = 5.6 V to 40 V, Iout = 0.1 mA to 200 mA
Vin = 5.975 V to 16 V, Iout = 0.1 mA to 350 mA
Vout
V
Output Voltage (Accuracy %)
TJ = −40°C to 125°C
Vin = 5.975 V to 28 V, Iout = 0 mA to 350 mA
Line Regulation
Vin = 6 V to 28 V, Iout = 5 mA
Regline
−20
0
20
mV
Load Regulation
Iout = 0.1 mA to 350 mA
Regload
−35
0
35
mV
−
−
250
440
500
875
−
−
21
−
27
28
Dropout Voltage (Note 11)
Vout
V
VDO
Iout = 200 mA
Iout = 350 mA
V
mV
QUIESCENT CURRENT
Quiescent Current (Iq = Iin − Iout)
Iout = 0.1 mA, TJ = 25°C
Iout = 0.1 mA to 350 mA, TJ ≤ 125°C
Iq
mA
CURRENT LIMIT PROTECTION
Current Limit
Vout = 0.96 x Vout_nom
ILIM
400
−
1100
mA
Short Circuit Current Limit
Vout = 0 V
ISC
400
−
1100
mA
PSRR
−
54
−
dB
−
2.0
−
−
0.8
−
−
−
1.0
PSRR
Power Supply Ripple Rejection (Note 12) f = 100 Hz, 0.5 Vpp
DT (RESET DELAY TIME SELECT)
Vth(DT)
DT Threshold Voltage
Logic Low
Logic High
DT Input Current
VDT = 5 V
IDT
V
mA
9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V.
12. Values based on design and/or characterization.
13. See APPLICATION INFORMATION section for Reset Thresholds and Reset Delay Time Options
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NCV8770
ELECTRICAL CHARACTERISTICS Vin = 13.2 V, Cin = 0.1 mF, Cout = 1 mF, for typical values TJ = 25°C, for min/max values TJ =
−40°C to 150°C; unless otherwise noted. (Notes 9 and 10)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
RESET OUTPUT RO
Output Voltage Reset Threshold
(Note 13)
(NCV8770y) where y = 1,2,3,...
(NCV8770y) where y = A,B,C,...
Vout decreasing, Vin > 5.5 V
VRT
%Vout
90
87
93
90
96
93
VRH
−
2.0
−
%Vout
IROmax
1.75
−
−
mA
VROL
−
0.15
0.25
V
Reset Output High Voltage
VROH
4.5
−
−
V
Integrated Reset Pull−up Resistor
RRO
15
30
50
kW
tRD
3.2
102.4
−20%
4.0
128
4.8
153.6
+20%
ms
tRR
16
25
38
ms
Thermal Shutdown Temperature
(Note 12)
TSD
150
175
195
°C
Thermal Shutdown Hysteresis
(Note 12)
TSH
−
25
−
°C
5.0 V
5.0 V
Reset Hysteresis
Maximum Reset Sink Current
Vout = 4.5 V, VRO = 0.25 V
Reset Output Low Voltage
Vout > 1 V, IRO < 200 mA
Reset Delay Time (Note 13)
Min Available Time, DT connected to GND
Max Available Time, DT connected to Vout
Reset Reaction Time (see Figure 21)
THERMAL SHUTDOWN
9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V.
12. Values based on design and/or characterization.
13. See APPLICATION INFORMATION section for Reset Thresholds and Reset Delay Time Options
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NCV8770
TYPICAL CHARACTERISTICS
250
Vin = 13.2 V
Iout = 100 mA
27
26
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
28
25
24
23
22
21
20
19
18
−40 −20
0
20
40
60
80
200
150
100
50
0
100 120 140 160
Iout = 0 mA
TJ = 25°C
0
5
10
TJ, JUNCTION TEMPERATURE (°C)
Figure 4. Quiescent Current vs. Temperature
26
TJ = 150°C
25
24
23
22
TJ = −40°C
21
20
TJ = 25°C
19
18
0
50
100
150
200
250
35
40
300
5.00
4.95
4.90
−40 −20
350
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 7. Output Voltage vs. Temperature
800
6
VDO, DROPOUT VOLTAGE (mV)
Iout = 1 mA
Vout, OUTPUT VOLTAGE (V)
30
Vin = 13.2 V
Iout = 100 mA
5.05
Figure 6. Quiescent Current vs. Output Current
5
4
3
TJ = 25°C
2
TJ = 150°C
1
0
25
5.10
Vin = 13.2 V
27
20
Figure 5. Quiescent Current vs. Input Voltage
Vout, OUTPUT VOLTAGE (V)
Iq, QUIESCENT CURRENT (mA)
28
15
Vin, INPUT VOLTAGE (V)
TJ = −40°C
0
1
2
3
4
5
6
7
700
500
TJ = 25°C
400
300
200
TJ = −40°C
100
0
0
8
TJ = 150°C
600
50
100
150
200
250
300
Vin, INPUT VOLTAGE (V)
Iout, OUTPUT CURRENT (mA)
Figure 8. Output Voltage vs. Input Voltage
Figure 9. Dropout vs. Output Current
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350
NCV8770
800
800
700
700
ILIM, ISC, CURRENT LIMIT (mA)
VDO, DROPOUT VOLTAGE (mV)
TYPICAL CHARACTERISTICS
600
Iout = 350 mA
500
400
Iout = 200 mA
300
200
100
0
−40 −20
ISC @ Vout = 0 V
600
ILIM @ Vout = 4.8 V
500
400
300
200
100
0
0
20 40 60 80 100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
TJ = 25°C
0
Figure 10. Dropout vs. Temperature
700
650
ISC @ Vout = 0 V
600
550
ILIM @ Vout = 4.8 V
500
450
400
−40 −20
0
20
40
60
80
15
20
25
30
Vin, INPUT VOLTAGE (V)
35
40
100
Vin = 13.2 V
750
10
Figure 11. Output Current Limit vs. Input
Voltage
ESR, STABILITY REGION (W)
ILIM, ISC, CURRENT LIMIT (mA)
800
5
10
1
STABLE REGION
0.1
0.01
100 120 140 160
Vin = 13.2 V
TJ = −40°C to 150°C
Cout = 1 mF − 100 mF
0
50
100
150
200
250
300
350
TJ, JUNCTION TEMPERATURE (°C)
Iout, OUTPUT CURRENT (mA)
Figure 12. Output Current Limit vs. Temperature
Figure 13. Cout ESR Stability Region vs. Output
Current
TJ = 25°C
Iout = 1.0 mA
Cout = 10 mF
trise/fall = 1 ms (Vin)
12.2 V
14.2 V
Vin
(1 V/div)
13 V
TJ = 25°C
Vin = 13.2 V
Cout = 10 mF
trise/fall = 1 ms (Iout)
0.1 mA
100 mA
Iout
(50 mA/div)
5.16 V
5.16 V
5V
Vout
(100 mV/div)
Vout
(100 mV/div)
5V
4.95 V
4.77 V
TIME (1 ms/div)
TIME (50 us/div)
Figure 14. Line Transients
Figure 15. Load Transients
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NCV8770
TYPICAL CHARACTERISTICS
TJ = 25°C
VEN = Vin
Rout = 5 kW
100
TJ = 25°C
Vin = 13.2 V $ 0.5 Vpp
Cout = 1 mF
Iout = 1.0 mA
90
80
Vin
(5 V/div)
PSRR (dB)
70
Vout
(5 V/div)
60
50
40
30
20
10
VRO
(5 V/div)
0
10
100
1000
10000
TIME (100 ms/div)
f, FREQUENCY (Hz)
Figure 16. Power Up/Down Response
Figure 17. PSRR vs. Frequency
5000
TJ = 25°C
Vin = 13.2 V
Cout = 1 mF
Iout = 350 mA
4500
NOISE DENSITY (nV/√Hz)
100000
4000
3500
3000
2500
2000
1500
1000
500
0
10
100
1000
10000
100000
f, FREQUENCY (Hz)
Figure 18. Noise vs. Frequency
20
Vin = 13.2 V
tRD, RESET DELAY TIME (ms)
VRT, RESET THRESHOLD (V)
4.80
4.75
4.70
4.65
4.60
−40 −20
0
20
40
60
80
Vin = 13.2 V
19
18
17
16
15
14
13
12
−40 −20
100 120 140 160
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Reset Threshold vs. Temperature
Figure 20. Reset Delay Time vs. Temperature
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NCV8770
Vin
t
Vout
< tRR
VRT + VRH
VRT
VRO
t
tRD
tRR
VROH
VROL
t
Figure 21. Reset Function and Timing Diagram
DEFINITIONS
General
Current Limit and Short Circuit Current Limit
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
Current Limit is value of output current by which output
voltage drops below 96% of its nominal value. Short Circuit
Current Limit is output current value measured with output
of the regulator shorted to ground.
Output voltage
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
PSRR
Power Supply Rejection Ratio is defined as ratio of output
voltage and input voltage ripple. It is measured in decibels
(dB).
Line Regulation
The change in output voltage for a change in input voltage
measured for specific output current over operating ambient
temperature range.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Load Transient Response
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between low−load and high−load conditions.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Quiescent Current
Maximum Package Power Dissipation
Quiescent Current (Iq) is the difference between the input
current (measured through the LDO input pin) and the
output load current.
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
Thermal Protection
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NCV8770
APPLICATIONS INFORMATION
The NCV8770 regulator is self−protected with internal
thermal shutdown and internal current limit. Typical
characteristics are shown in Figure 4 to Figure 21.
RESET DELAY AND RESET THRESHOLD OPTIONS
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV8770 package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
If extremely fast input voltage transients are expected then
appropriate input filter must be used in order to decrease
rising and/or falling edges below 50 V/ms for proper
operation. The filter can be composed of several capacitors
in parallel.
Output Decoupling (Cout)
The NCV8770 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. Stability region of ESR vs Output Current
is shown in Figure 13. The minimum output decoupling
value is 1 mF and can be augmented to fulfill stringent load
transient requirements. The regulator works with ceramic
chip capacitors as well as tantalum devices. Larger values
improve noise rejection and load regulation transient
response.
DT = GND
Reset
Time
DT = Vout
Reset
Time
Reset
Threshold
NCV87701
8 ms
128 ms
93%
NCV87702
8 ms
32 ms
93%
NCV87703
16 ms
64 ms
93%
NCV87704
32 ms
128 ms
93%
NCV87705
4 ms
8 ms
93%
NCV87706
16 ms
128 ms
93%
NCV8770A
8 ms
128 ms
90%
NCV8770B
8 ms
32 ms
90%
NCV8770C
16 ms
64 ms
90%
NCV8770D
32 ms
128 ms
90%
NCV8770E
4 ms
8 ms
90%
NCV8770F
16 ms
128 ms
90%
NOTE:
The timing values can be selected from the following list:
4, 8, 16, 32, 64, 128 ms. Contact factory for options not
included in ORDERING INFORMATION table on
following page.
Thermal Considerations
As power in the NCV8770 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV8770 has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV8770 can handle is given by:
Reset Operation
A reset signal is provided on the Reset Output (RO) pin to
provide feedback to the microprocessor of an out of
regulation condition. The timing diagram of reset function
is shown in Figure 21. This is in the form of a logic signal on
RO. Output voltage conditions below the RESET threshold
cause RO to go low. The RO integrity is maintained down
to Vout = 1.0 V. For 5 V voltage option, the Reset Output
(RO) circuitry includes internal pull−up (30 kW) connected
to the output (Vout) No external pull−up is necessary.
Reset Delay Time Select
P D(max) +
Selection of the NCV8770y devices and the state of the
DT pin determines the available Reset Delay times. The part
is designed for use with DT tied to ground or Vout, but may
be controlled by any logic signal which provides a threshold
between 0.8 V and 2 V. The default condition for an open DT
pin is the slower Reset time (DT = GND condition). Times
are in pairs and are highlighted in the chart below. Consult
factory for availability. The Delay Time select (DT) pin is
logic level controlled and provides Reset Delay time per the
chart. Note the DT pin is sampled only when RO is low, and
changes to the DT pin when RO is high will not effect the
reset delay time.
ƪTJ(max) * TAƫ
(eq. 1)
R qJA
Since TJ is not recommended to exceed 150°C, then the
NCV8770 soldered on 645 mm2, 1 oz copper area, FR4 can
dissipate up to 2.35 W (for D2PAK−5) when the ambient
temperature (TA) is 25°C. See Figure 22 for RqJA versus
PCB area. The power dissipated by the NCV8770 can be
calculated from the following equations:
P D + V inǒI q@I outǓ ) I outǒV in * V outǓ
(eq. 2)
or
V in(max) +
NOTE:
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P D(max) ) ǒV out
I outǓ
I out ) I q
Items containing Iq can be neglected if Iout >> Iq.
(eq. 3)
NCV8770
Hints
RqJA, THERMAL RESISTANCE (°C/W)
100
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8770 and
make traces as short as possible.
90
80
70
DPAK 1 oz
D2PAK 1 oz
60
50
40
0
D2PAK 2 oz
DPAK 2 oz
100
200
300
400
500
600
COPPER HEAT SPREADER (mm2)
700
Figure 22. Thermal Resistance vs. PCB Copper Area
ORDERING INFORMATION
Output Voltage
Reset Delay Time
(DT = GND/Vout)
Reset Threshold
Marking
Package
Shipping†
NCV87706DT50RKG
5.0 V
16/128 ms
93%
770650G
DPAK−5
(Pb−Free)
2500 /
Tape & Reel
NCV87706DS50R4G
5.0 V
16/128 ms
93%
NC
V8770650
D2PAK−5
(Pb−Free)
800 /
Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
11
NCV8770
PACKAGE DIMENSIONS
DPAK 5, CENTER LEAD CROP
CASE 175AA
ISSUE A
−T−
SEATING
PLANE
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
R
R1
Z
A
S
DIM
A
B
C
D
E
F
G
H
J
K
L
R
R1
S
U
V
Z
12 3 4 5
U
K
F
J
L
H
D
G
5 PL
0.13 (0.005)
M
INCHES
MIN
MAX
0.235 0.245
0.250 0.265
0.086 0.094
0.020 0.028
0.018 0.023
0.024 0.032
0.180 BSC
0.034 0.040
0.018 0.023
0.102 0.114
0.045 BSC
0.170 0.190
0.185 0.210
0.025 0.040
0.020
−−−
0.035 0.050
0.155 0.170
T
SOLDERING FOOTPRINT*
6.4
0.252
2.2
0.086
0.34 5.36
0.013 0.217
5.8
0.228
10.6
0.417
0.8
0.031
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
MILLIMETERS
MIN
MAX
5.97
6.22
6.35
6.73
2.19
2.38
0.51
0.71
0.46
0.58
0.61
0.81
4.56 BSC
0.87
1.01
0.46
0.58
2.60
2.89
1.14 BSC
4.32
4.83
4.70
5.33
0.63
1.01
0.51
−−−
0.89
1.27
3.93
4.32
NCV8770
PACKAGE DIMENSIONS
D2PAK 5
CASE 936A−02
ISSUE C
−T−
OPTIONAL
CHAMFER
A
TERMINAL 6
E
U
S
K
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A
AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED 0.025
(0.635) MAXIMUM.
V
H
1 2 3 4 5
M
D
0.010 (0.254)
M
T
L
P
N
G
R
SOLDERING FOOTPRINT*
C
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
8.38
0.33
MILLIMETERS
MIN
MAX
9.804
10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691
14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
1.702
0.067
10.66
0.42
16.02
0.63
3.05
0.12
SCALE 3:1
1.016
0.04
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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13
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NCV8770/D