Obsolete Device www.ti.com SLWS156 − MARCH 2004 D Single-Ended or Differential Clock D 1-GHz −3-dB Input Bandwidth D 48-Pin TQFP Package With PowerPad FEATURES D 11-Bit Resolution D 65-MSPS Maximum Sample Rate D 2-Vpp Differential Input Range D 3.3-V Single Supply Operation D 1.8-V to 3.3-V Output Supply D 400-mW Total Power Dissipation D Two’s Complement Output Format D On-Chip S/H and Duty Cycle Adjust Circuit D Internal or External Reference D 63.3-dBFS SNR and 72.9-dBc SFDR at (7 mm x 7 mm body size) APPLICATIONS D Cellular Base Transceiver Station Receive Channel − High IF Sampling Applications − CDMA: IS-95, UMTS, CDMA1X − TDMA: GSM, IS-136, EDGE/UWC-136 − Wireless Local Loop 65 MSPS and 220-MHz Input D Power-Down Mode − Wideband Baseband Receivers DESCRIPTION The ADS5413−11 is a low power, 11-bit, 65-MSPS, CMOS pipeline analog-to-digital converter (ADC) that operates from a single 3.3-V supply, while offering the choice of digital output levels from 1.8 V to 3.3 V. The low noise, high linearity, and low clock jitter makes the ADC well suited for high-input frequency sampling applications. On-chip duty cycle adjust circuit allows the use of a non-50% duty cycle. This can be bypassed for applications requiring low jitter or asynchronous sampling. The device can also be clocked with single ended or differential clock, without change in performance. The internal reference can be bypassed to use an external reference to suit the accuracy and low drift requirements of the application. The device is specified over full temperature range (−40°C to +85°C). FUNCTIONAL BLOCK DIAGRAM AVDD PWD Gain Stage S/H VINP Gain Stage Σ Σ A/D REF SEL CML VREFB Flash Σ A/D 7 Stages VINN VREFT Gain Stage OVDD D/A A/D D/A A/D D/A 2.25 V Internal Reference 1.25 V Generator 1.8 V 2 VBG 2 2 2 Digital Error Correction CLK DCA CLKC DCA D[0:10] AGND OGND Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. CommsADC is a trademark of Texas Instruments. !"#$ % &'!!($ #% )'*+&#$ ,#$(- !,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1!,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- Copyright 2004, Texas Instruments Incorporated Obsolete Device www.ti.com SLWS156 − MARCH 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS5413−11 HTQFP-48(2) PowerPAD PHP −40°C to 85°C A5413−11 ADS5413−11IPHP Tray, 250 (1) For the most current product and ordering information, see the Package Option Addendum located at the end of this data sheet. (2) Thermal pad size: 3,5 mm × 3,5 mm ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNITS AVDD measured with respect to AGND Supply voltage range −0.3 V to 3.9 V OVDD measure with respect to OGND −0.3 V to 3.9 V Digital input, measured with respect to AGND −0.3 V to AVDD + 0.3 V Reference inputs Vrefb or Vreft, measured with respect to AGND −0.3 V to AVDD + 0.3 V Analog inputs Vinp or Vinn, measured with respect to AGND −0.3 V to AVDD + 0.3 V Maximum storage temperature 150°C Soldering reflow temperature 235°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS(1) MIN NOM MAX UNIT ENVIRONMENTAL Operating free-air temperature, TA −40 85 °C 3.6 V 3.6 V SUPPLIES Analog supply voltage, V(AVDD) Output driver supply voltage, V(OVDD) 3 3.3 1.6 ANALOG INPUTS CML(2) Input common-mode voltage Differential input voltage range V 2 VPP CLOCK INPUTS, CLK AND CLKC Sample rate, fS = 1/tc 5 Differential input swing (see Figure 16) 1 Differential input common-mode voltage Clock pulse width high, tw(H) (see Figure 15, with DCA off) 1.65 6.92 65 MHz 6 VPP V ns Clock pulse width low, tw(L) (see Figure 15, with DCA off) 6.92 ns (1) Recommended by design and characterization but not tested at final production unless specified under the electrical characteristics section. (2) See V(CML) in the internal reference generator section. 2 Obsolete Device www.ti.com SLWS156 − MARCH 2004 ELECTRICAL CHARACTERISTICS over operating free-air temperature range, clock frequency = 65 MSPS, 50% clock duty cycle (AVDD = OVDD = 3.3 V), duty cylce adjust off, internal reference, AIN = −1 dBFS, 1.2-VPP square differential clock (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC PERFORMANCE Power Supply Total analog supply current with internal reference and DCA on I(AVDD) Analog supply current with external reference and DCA on 113 AIN = 0 dBFS, fIN = 2 MHz mA 96 Analog supply current with internal reference and DCA off 107 I(OVDD) Digital output driver supply current PD Total power dissipation AIN = 0 dBFS, fIN = 2 MHz AIN = 0 dBFS, fIN = 2 MHz PD Power down dissipation DC Accuracy PWDN = high 8 No missing codes mA 400 480 mW 30 75 mW Assured DNL Differential nonlinearity Sinewave input, fIN = 2 MHz −0.75 ±0.3 0.75 LSB INL Integral nonlinearity Sinewave input, fIN = 2 MHz −1 ±0.5 1 LSB EO EG Offset error Sinewave input, fIN = 2 MHz 3 Gain error Sinewave input, fIN = 2 MHz 0.3 mV %FS Internal Reference Generator VREFB Reference bottom VREFT Reference top 1.1 1.25 1.4 V 2.1 2.25 2.4 V VREFT − VREFB VREFT − VREFB variation (6σ) V(CML) Common-mode output voltage Digital Inputs (PWD, DCA, REF SEL) IIH IIL High-level input current VIH VIL High-level input voltage Low-level input current VI = 2.4 V VI = 0.3 V 1.06 V 0.06 V 1.8 V −60 60 µA −60 60 µA 2 V Low-level input voltage 0.8 V Digital Outputs VOH VOL High-level output voltage Low-level output voltage IOH = 50 µA IOL = −50 µA 2.4 fIN = 14 MHz fIN = 39 MHz 61.5 V 0.8 V AC PERFORMANCE SNR Signal-to-noise ratio Signal-to-noise and distortion 65.9 fIN = 70 MHz fIN = 150 MHz 65.7 fIN = 190 MHz fIN = 220 MHz 63.9 fIN = 14 MHz fIN = 39 MHz SINAD 65.7 64.3 dBFS 63.3 61 65.3 65.3 fIN = 70 MHz fIN = 150 MHz 65.5 fIN = 190 MHz fIN = 220 MHz 62.3 63.2 dBFS 62.4 3 Obsolete Device www.ti.com SLWS156 − MARCH 2004 ELECTRICAL CHARACTERISTICS (CONTINUED) over operating free-air temperature range, clock frequency = 65 MSPS, 50% clock duty cycle (AVDD = OVDD = 3.3 V), duty cylce adjust off, internal reference, AIN = −1 dBFS, 1.2-VPP square differential clock (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP 70 77.7 MAX UNIT AC PERFORMANCE (Continued) fIN = 14 MHz fIN = 39 MHz SFDR HD2 HD3 Spurious free dynamic range Second order harmonic Third order harmonic Analog input bandwidth 75.8 fIN = 70 MHz fIN = 150 MHz 84.5 fIN = 190 MHz fIN = 220 MHz 68.3 dBc 70.5 72.9 fIN = 14 MHz fIN = 39 MHz 95 fIN = 70 MHz fIN = 150 MHz 89 fIN = 190 MHz fIN = 220 MHz 84.5 fIN = 14 MHz fIN = 39 MHz 77.6 fIN = 70 MHz fIN = 150 MHz 85.5 fIN = 190 MHz fIN = 220 MHz 68.3 94 dBc 79 72 75.4 dBc 70.5 77.6 −3 dB BW respect to −3 dBFS input at low frequency 1 GHz TIMING CHARACTERISTICS 25°C, CL = 10 pF MIN Aperture delay td(A) td(Pipe) td1 td2 td1 td2 td1 td2 td1 4 2 Aperture jitter 0.4 Latency 6 Propagation delay from clock input to beginning of data stable(1) Propagation delay from clock input to end of data stable(1) DCS off, OVDD = 1.8 V Propagation delay from clock input to beginning of data stable(1) Propagation delay from clock input to end of data stable(1) DCS off, OVDD = 3.3 V Propagation delay from clock input to beginning of data stable(1) Propagation delay from clock input to end of data stable(1) DCS on, OVDD = 1.8 V Propagation delay from clock input to beginning of data stable(1) Propagation delay from clock input to end of data stable(1) DCS on, OVDD = 3.3 V td2 (1) Data stable if VO < 10% OVDD or VO > 90% OVDD TYP MAX UNIT ns ps Cycles 8 20.3 ns 7 20.3 ns 10 22.3 ns 9 22.3 ns Obsolete Device www.ti.com SLWS156 − MARCH 2004 TIMING DIAGRAM Sample N VINP td(A) tw(H) td(Pipe) tw(L) CLK tc D[0:10] Data N−7 td2(O) Data N−6 Data N−5 Data N−4 Data N−3 Data N−2 Data N−1 Data N Data N+1 Data N+2 td1(O) Figure 1. ADS5413−11 Timing Diagram PIN ASSIGNMENTS OVDD NC AVDD OGND AGND AGND AGND AVDD AVDD AVDD AGND REF SEL PHP PACKAGE (TOP VIEW) 48 47 46 45 44 43 42 41 40 39 38 37 AVDD 1 36 NC AGND VINP 2 3 35 34 D0 (LSB) D1 VINN AGND 4 5 33 32 D2 D3 31 D4 30 29 D5 D6 CML 6 AVDD VREFB 7 8 VREFT AVDD 9 10 28 27 D7 D8 AGND NC 11 12 26 25 D9 D10 (MSB) THERMAL PAD (Connect to GND Plane) OVDD DCA AGND OGND CLK CLKC AVDD PWD NC NC DECOUPLING VBG 13 14 15 16 17 18 19 20 21 22 23 24 5 Obsolete Device www.ti.com SLWS156 − MARCH 2004 Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. AVDD 1, 7, 10, 18, 40, 44, 45, 47 I Analog power supply AGND 2, 5, 11, 21, 41, 42, 43, 46 I Analog ground CLK 19 I Clock input CLKC 20 I Complementary clock input CML 6 O Common-mode output voltage 25−35 O Digital outputs, D10 is most significant data bit, D0 is least significant data bit. D10−D0 DCA 24 I Duty cycle adjust control. High = enable, low = disable, NC = enable DECOUPLING 15 O Decoupling pin. Add 0.1 µF to GND NC 12, 14, 17, 36, 37 Internally not connected OGND 22, 39 I Digital driver ground OVDD 23, 38 I Digital driver power supply PWD 16 I Power down. High = powered down, low = powered up, NC = powered up REF SEL 48 I Reference select. High = external reference, low = internal reference, NC = internal reference VBG 13 O Bandgap voltage output VINN 4 I Complementary analog input VINP 3 I Analog input VREFB 8 I/O Reference bottom VREFT 9 I/O Reference top 6 Obsolete Device www.ti.com SLWS156 − MARCH 2004 TYPICAL CHARACTERISTICS† SPECTRAL PERFORMANCE SPECTRAL PERFORMANCE fS = 65 MSPS fIN = 2 MHz SNR = 66 dBFS SINAD = 65 dBFS SFDR = 72.8 dBc THD = 72 dBc Amplitude − dBFS −20 −40 −60 −80 −100 0 fS = 65 MSPS fIN = 14 MHz SNR = 65.7 dBFS SINAD = 65.3 dBFS SFDR = 77.7 dBc THD = 76.2 dBc −20 Amplitude − dBFS 0 −40 −60 −80 −100 −120 −120 −140 −140 0 5 10 15 20 25 0 30 5 Figure 3 30 SPECTRAL PERFORMANCE 0 fS = 65 MSPS fIN = 70 MHz SNR = 65.7 dBFS SINAD = 65.5 dBFS SFDR = 84.5 dBc THD = 79.6 dBc −20 −60 −80 −100 −120 −40 −60 −80 −100 −120 −140 −140 0 5 10 15 20 25 30 0 5 20 f − Frequency − MHz Figure 5 25 30 SPECTRAL PERFORMANCE 0 fS = 65 MSPS fIN = 190 MHz SNR = 63.9 dBFS SINAD = 62.3 dBFS SFDR = 68.3 dBc THD = 67.6 dBc −20 Amplitude − dBFS −40 15 Figure 4 fS = 65 MSPS fIN = 150 MHz SNR = 64.3 dBFS SINAD = 63.2 dBFS SFDR = 70.5 dBc THD = 69.7 dBc −20 10 f − Frequency − MHz SPECTRAL PERFORMANCE 0 Amplitude − dBFS 25 Figure 2 Amplitude − dBFS Amplitude − dBFS −40 20 f − Frequency − MHz fS = 65 MSPS fIN = 39 MHz SNR = 65.9 dBFS SINAD = 65.3 dBFS SFDR = 75.8 dBc THD = 74 dBc −20 15 f − Frequency − MHz SPECTRAL PERFORMANCE 0 10 −60 −80 −100 −120 −40 −60 −80 −100 −120 −140 −140 0 5 10 15 20 25 30 0 5 10 15 20 f − Frequency − MHz f − Frequency − MHz Figure 6 Figure 7 25 30 † 50% duty cycle. AVDD = 3.3 V, OVDD = 3.3 V, 25°C, DCA off, internal reference, Ain = –1 dBFS, CLK 2.8-VPP sine wave single ended, unless otherwise noted 7 Obsolete Device www.ti.com SLWS156 − MARCH 2004 TYPICAL CHARACTERISTICS† SPECTRAL PERFORMANCE SPECTRAL PERFORMANCE 0 0 fS = 65 MSPS fIN = 220 MHz SNR = 63.3 dBFS SINAD = 62.4 dBFS SFDR = 72.9 dBc THD = 69.4 dBc −40 fS = 40 MSPS fIN = 70.5 MHz SNR = 65.9 dBFS SINAD = 65 dBFS SFDR = 73.1 dBc THD = 72.3 dBc −20 Amplitude − dBFS Amplitude − dBFS −20 −60 −80 −100 −40 −60 −80 −100 −120 −120 −140 −140 0 5 10 15 20 25 0 30 5 10 f − Frequency − MHz f − Frequency − MHz Figure 8 Figure 9 AC PERFORMANCE vs REFERENCE VOLTAGES AC Performance − dB 72 100 fS = 65 MSPS fIN = 80 MHz 80 SFDR (dBc) 70 68 66 SNR (dBFS) 64 62 60 0.3 SNR (dBFS) 60 40 SFDR (dBc) 20 SNR (dBc) 0 −20 0.5 20 AC PERFORMANCE vs INPUT AMPLITUDE AC Performance − dB 74 15 0.7 0.9 1.1 1.3 1.5 1.7 −40 −80 fS = 65 MSPS fIN = 69 MHz −70 −60 −50 −40 −30 −20 VrefT − VrefB − Reference Voltage Difference − V PIN − Input Amplitude − dBFS Figure 10 Figure 11 −10 0 AC PERFORMANCE vs INPUT AMPLITUDE 90 AC Performance − dB SNR (dBFS) 60 SFDR (dBc) 30 SNR (dBc) 0 fS = 65 MSPS fIN = 220 MHz −30 −80 −70 −60 −50 −40 −30 −20 −10 0 PIN − Input Amplitude − dBFS Figure 12 † 50% duty cycle. AVDD = 3.3 V, OVDD = 3.3 V, 25°C, DCA off, internal reference, Ain = –1 dBFS, CLK 2.8-VPP sine wave single ended, unless otherwise noted 8 Obsolete Device www.ti.com SLWS156 − MARCH 2004 TYPICAL CHARACTERISTICS† 62 100 61 63 64 59 63 90 fS − Sampling Frequency − MHz 60 64 80 58 59 60 61 62 63 65 57 60 61 62 56 58 64 62 63 65 70 64 65 66 60 50 66 65 40 66 65 64 30 65 20 64 0 20 62 63 65 10 64 80 100 63 62 61 60 59 57 58 120 140 61 59 60 61 62 60 40 63 160 180 200 220 fIN − Input Frequency − MHz 55 56 57 58 59 60 61 62 63 64 65 66 Figure 13. SNR− dBFS 100 69 73 80 65 69 71 73 77 60 75 79 63 65 67 67 69 71 70 61 63 67 90 fS − Sampling Frequency − MHz 59 81 65 69 65 79 77 75 69 73 83 73 81 79 77 81 30 73 71 73 69 71 69 20 69 71 75 73 69 40 55 60 60 80 100 120 fIN − Input Frequency − MHz 65 70 140 71 75 77 73 71 67 69 10 20 71 75 77 50 40 69 71 75 160 75 73 75 71 67 73 180 200 220 80 Figure 14. SFDR − dBc † 50% duty cycle. AVDD = 3.3 V, OVDD = 3.3 V, 25°C, DCA off, internal reference, Ain = –1 dBFS, CLK 2.8-VPP sine wave single ended, unless otherwise noted 9 Obsolete Device www.ti.com SLWS156 − MARCH 2004 TYPICAL CHARACTERISTICS† AC PERFORMANCE vs CLOCK AMPLITUDE AC PERFORMANCE vs DUTY CYCLE 90 fS = 65 MSPS fIN = 14.4 MHz SFDR (DCA On) 80 AC Performance − dB AC Performance − dB 85 75 SFDR (DCA Off) 70 SNR (DCA On) 65 60 SNR (DCA Off) 55 50 25 30 35 40 45 50 55 60 74 72 70 68 66 64 62 60 58 56 54 52 50 fS = 65 MSPS fIN = 190 MHz SNR Diff 3.3V SNR SE 3.3V SNR Diff 1.8V SNR SE 1.8V SE = Single Ended Diff = Differential Ended 1.8V = OVDD is 1.8 V 3.3V = OVDD is 3.3 V 1 2 3 Figure 15 74 65 64 DCA On BP Filter 63 62 DCA On No Filter DCA Off No Filter 25 50 75 100 125 150 SFDR 70 68 66 SNR 64 62 60 58 59 0 fS = 65 MSPS fIN = 220 MHz 72 AC Performance − dB SNR − Signal-to-Noise Ratio − dBFS DCA Off BP Filter OVDD = 1.8 V DCA Off BP Filter fS = 65 MSPS 7 AC PERFORMANCE vs ANALOG SUPPLY VOLTAGE 76 67 60 6 Figure 16 SIGNAL-TO-NOISE RATIO vs INPUT FREQUENCY 61 5 ‡ Measured from CLK to CLKC CLK 1.15-VPP square-wave differential 66 4 Clock Amplitude − VPP‡ Duty Cycle − % NOTE: SFDR Diff 3.3V SFDR SE 3.3V 0 65 SFDR Diff 1.8V SFDR SE 1.8V 175 200 225 56 3.0 3.2 3.4 fIN − Input Frequency − MHz AVDD − Analog Supply Voltage − V Figure 17 Figure 18 3.6 AC PERFORMANCE vs OUTPUT SUPPLY VOLTAGE 74 AC Performance − dB 72 SFDR 70 68 66 SNR 64 62 60 58 1.8 fS = 65 MSPS fIN = 220 MHz 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 OVDD − Output Supply Voltage − V Figure 19 † 50% duty cycle. AVDD = 3.3 V, OVDD = 3.3 V, 25°C, DCA off, internal reference, Ain = –1 dBFS, CLK 2.8-VPP sine wave single ended, unless otherwise noted 10 Obsolete Device www.ti.com SLWS156 − MARCH 2004 TYPICAL CHARACTERISTICS† INTEGRAL NONLINEARITY fS = 65 MSPS fIN = 15.5 MHz 0.4 INL − Integral Nonlinearity − LSB DNL − Differential Nonlinearity − LSB DIFFERENTIAL NONLINEARITY 0.5 0.3 0.2 0.1 0.0 −0.0 −0.1 −0.2 −0.3 −0.4 −0.5 0 500 1000 1500 0.6 0.5 0.4 0.3 0.2 0.1 0.0 −0.0 −0.1 −0.2 −0.3 −0.4 −0.5 −0.6 fS = 65 MSPS fIN = 15.5 MHz 0 2000 Code Code Figure 21 fS = 65 MSPS fIN = 220 MHz 2000 INPUT BANDWIDTH SFDR 0 72 THD 70 68 66 SNR 64 −5 −10 −15 62 60 −40 1500 5 Output Power − dB‡ AC Performance − dB 74 1000 Figure 20 AC PERFORMANCE vs FREE-AIR TEMPERATURE 76 500 SINAD −20 0 20 40 60 TA − Free-Air Temperature − °C 80 100 −20 10 100 1k 10k f − Frequency − MHz ‡ dB with respect to −3 dBFS Figure 22 Figure 23 † 50% duty cycle. AVDD = 3.3 V, OVDD = 3.3 V, 25°C, DCA off, internal reference, Ain = –1 dBFS, CLK 2.8-VPP sine wave single ended, unless otherwise noted 11 Obsolete Device www.ti.com SLWS156 − MARCH 2004 EQUIVALENT CIRCUITS R2 φ2 R1 BAND GAP VREFT R1 CML 120 Ω R2 VREFB φ1 φ1′ 2 pF VINP AVDD VINN 450 Ω φ1 2 pF φ1′ CML CML 550 Ω φ2 AGND Figure 24. References Figure 25. Analog Input Stage AVDD AVDD To Timing Circuits R1 5 kΩ OVDD R1 5 kΩ AVDD 20 Ω CLK CLKC AGND R2 5 kΩ R2 5 kΩ D0−D10 AGND OGND AGND Figure 26. Clock Inputs 12 Figure 27. Digital Outputs Obsolete Device www.ti.com SLWS156 − MARCH 2004 APPLICATION INFORMATION CONVERTER OPERATION of an RF transformer. Since the input signal must be biased around the common-mode voltage of the internal circuitry, the common-mode (CML) reference from the ADS5413−11 is connected to the center-tap of the secondary. To ensure a steady low noise CML reference, the best performance is obtained when the CML output is connected to ground with a 0.1-µF and 0.01-µF low inductance capacitor. The ADS5413−11 is a 11-bit pipeline ADC. Its low power (400 mW) at 65 MSPS and high sampling rate is achieved using a state-of-the-art switched capacitor pipeline architecture built on an advanced low-voltage CMOS process. The ADS5413−11 analog core operates from a 3.3 V supply consuming most of the power. For additional interfacing flexibility, the digital output supply (OVDD) can be set from 1.6 V to 3.6 V. The ADC core consists of 10 pipeline stages and one flash ADC. Each of the stages produces 1.5 bits per stage. Both the rising and the falling clock edges are utilized to propagate the sample through the pipeline every half clock, for a total of six clock cycles. R0 Z0 = 50 Ω 1:1 VINP 50 Ω R ADS5413−11 50 Ω VINN VCM AC Signal Source T1-1T ANALOG INPUTS The analog input for the ADS5413−11 consists of a differential track-and-hold amplifier implemented using a switched capacitor technique, shown in Figure 25. This differential input topology, along with closely matched capacitors, produces a high level of ac-performance up to high sampling and input frequencies. 0.01 µF Figure 28. Driving the ADS5413−11 Analog Input With Impedance Matched Transmission Line If it is necessary to buffer or apply a gain to the incoming analog signal, it is possible to combine a single-ended amplifier with an RF transformer as shown in Figure 29. Texas Instruments offers a wide selection of operational amplifiers, as the THS3001/2, the OPA847, or the OPA695 that can be selected depending on the application. RIN and CIN can be placed to isolate the source from the switching inputs of the ADC and to implement a low-pass RC filter to limit the input noise in the ADC. Although not needed, it is recommended to lay out the circuit with placement for those three components, which allows fine tune of the prototype if necessary. Nevertheless, any mismatch between the differential lines of the input produces a degradation in performance at high input frequencies, mainly characterized by an increase in the even harmonics. In this case, special care should be taken keeping as much electrical symmetry as possible between both inputs. This includes shorting RIN and leaving CIN unpopulated. The ADS5413−11 requires each of the analog inputs (VINP and VINM) to be externally biased around the common mode level of the internal circuitry (CML, pin 6). For a full-scale differential input, each of the differential lines of the input signal (pins 3 and 4) swings symmetrically between CML+(Vreft+Vrefb)/2 and CML−(Vreft+Vrefb)/2. The maximum swing is determined by the difference between the two reference voltages, the top reference (REFT), and the bottom reference (REFB). The total differential full-scale input swing is 2(Vreft − Vrefb). See the reference circuit section for possible adjustments of the input full scale. Although the inputs can be driven in single-ended configuration, the ADS5413−11 obtains optimum performance when the analog inputs are driven differentially. The circuit in Figure 28 shows one possible configuration. The single-ended signal is fed to the primary 5V −5 V + VIN RS OPA690 − R1 R2 0.1 µF 0.1 mF 1:n RIN RT R IN CIN AIN+ ADS5413−11 AIN− CML 0.1 mF Figure 29. Converting a Single-Ended Input Signal Into a Differential Signal Using an RF Transformer 13 Obsolete Device www.ti.com SLWS156 − MARCH 2004 Another possibility is the use of differential input/output amplifiers that can simplify the driver circuit for applications requiring input dc coupling. Flexible in their configurations (see Figure 30), such amplifiers can be used for single ended to differential conversion, for signal amplification, and for filtering prior to the ADC. CF RS VS Rg RT Rg VREFT 0.1 µF 0.1 µF 1 µF Rf VREFB 5V 3.3 V 10 µF 1 µF Figure 10 shows the variation on SNR and SFDR for a sampling rate of 65 MHz and a single-tone input of 80 MHz at −1 dBFS for different VREFT−VREFB voltage settings. 0.1 µF 0.1 µF + − VOCM + − IN IN ADS5413−11 11 Bit/65 MSPS CML THS4503 −5 V 1 µF VBG 0.1 µF 10 µF 0.1 µF 1 µF 0.1 µF Rf Figure 31. Internal Reference Usage CF Figure 30. Using the THS4503 With the ADS5413−11 REFERENCE CIRCUIT The ADS5413−11 has its own internal reference generation saving external circuitry in the design. For optimum performance, it is best to connect both VREFB and VREFT to ground with a 1-µF and a 0.1-µF decoupling capacitor in parallel and a 0.1-µF capacitor between both pins (see Figure 31). The series inductance with these capacitors should be minimized as much as possible. For that we recommend to follow the layout of the EVM. In particular, the 0.1-µF capacitors should be placed on the same side of the printed circuit board as the ADS5413−11, and as close as possible to the pins 8, 9, and 11. The band-gap voltage output is not a voltage source to be used external to the ADS5413−11. However, it should be decoupled to ground with a 1-µF and a 0.01-µF capacitor in parallel. For even more design flexibility, the internal reference can be disabled using the pin 48. By default, this pin is internally connected with a 70-kΩ pulldown resistor to ground, which enables the internal reference circuit. Tying this pin to AVDD powers down the internal reference generator, allowing the user to provide external voltages for VREFT (pin 9) and VREFB (pin 8). In addition to the power consumption reduction (typically 56 mW) which is now transferred to the external circuitry, it also allows for a precise setting of the input range. To further remove any variation with external factors, such as temperature or supply voltage, the user has direct access to the internal resistor divider, without any intermediate buffering. The equivalent circuit for the reference input pins is shown in Figure 24. The core of the ADC is designed for a 1 V difference between the reference pins. Nevertheless, the user can use these pins to set a different input range. 14 CLOCK INPUTS The ADS5413−11 clock input can be driven with either a differential clock signal or a single ended clock input with little or no difference in performance between the single-ended and differential-input configurations (see Figure 16). The common mode of the clock inputs is set internally to AVDD/2 using 5-kΩ resistors (see Figure 26). When driven with a single-ended clock input, it is best to connect the CLKC input to ground with a 0.01-µF capacitor (see Figure 32), while CLK is ac-coupled with 0.01 µF to the clock source. Square Wave or Sine Wave 1 Vp-p to 3 Vp-p CLK 0.01 µF ADS5413−11 CLKC 0.01 µF Figure 32. AC-Coupled Single-Ended Clock Input The ADS5413−11 clock input can also be driven differentially. In this case, it is best to connect both clock inputs to the differential input clock signal with 0.01-µF capacitors (see Figure 33). The differential input swing can vary between 1 V and 6 V with little or no performance degradation (see Figure 16). CLK Differential Square Wave or Sine Wave 1 Vp-p to 6 Vp-p 0.01 µF ADS5413−11 CLKC 0.01 µF Figure 33. AC-Coupled Differential Clock Input Obsolete Device www.ti.com SLWS156 − MARCH 2004 The ADS5413−11 can be driven either with a sine wave or a square wave. The internal ADC core uses both edges of the clock for the conversion process. This means that ideally, a 50% duty cycle should be provided. Nevertheless, the ADC includes an on-board duty cycle adjuster (DCA) that adjusts the incoming clock duty cycle which may not be 50%, to a 50% duty cycle for the internal use. By default, this circuit is enabled internally (with a pull-up resistor of 70 kΩ), which relaxes the design specifications of the external clock. Nevertheless, there are some situations where the user may prefer to disable the DCA. For asynchronous clocking, i.e., when the sampling period is purposely not constant, this circuit should be disabled. Another situation is the case of high input frequency sampling. For high input frequencies, a low jitter clock should be provided. On that sense, we recommend to band-pass filter the source which, consequently, provides a sinusoidal clock with 50% duty cycle. The use of the DCA on that case would not be beneficial and adds noise to the internal clock, increasing the jitter and degrading the performance. Figure 17 shows the performance versus input frequency for the different clocking schemes. Finally, adding the DCA introduces delay between the input clock and the output data and what is more important, slightly bigger variation of this delay versus external conditions, such as temperature. To disable the DCA, user should connect it to ground. POWER DOWN When power down (pin 16) is tied to AVDD, the device reduces its power consumption to a typical value of 23 mW. Connecting this pin to AGND or leaving it not connected (an internal 70-kΩ pulldown resistor is provided) enables the device operation. DIGITAL OUTPUTS The ADS5413−11 output format is 2s complement. The voltage level of the outputs can be adjusted by setting the OVDD voltage between 1.6 V and 3.6 V, allowing for direct interface to several digital families. For better performance, customers should select the smaller output swing required in the application. To improve the performance, mainly on the higher output voltage swing configurations, the addition of a series resistor at the outputs, limiting peak currents, is recommended. The maximum value of this resistor is limited by the maximum data rate of the application. Values between 0 Ω and 200 Ω are usual. Also, limiting the length of the external traces is a good practice. All the data sheet plots have been obtained in the worst case situation, where OVDD is 3.3 V. The external series resistors were 150 Ω and the load was a 74AVC16244 buffer, as the one used in the evaluation board. In this configuration, the rising edge of the ADC output is 5 ns, which allows for a window to capture the data of 10.4 ns (without including other factors). 15 Obsolete Device www.ti.com SLWS156 − MARCH 2004 DEFINITION OF SPECIFICATIONS Maximum Conversion Rate Analog Bandwidth The clock rate at which parametric testing is performed. The analog bandwidth is the analog input frequency at which the spectral power of the fundamental frequency (as determined by the FFT analysis) is reduced by 3 dB in respect to the value measured at low input frequencies. Power Supply Rejection Ratio Aperture Delay The delay between the 50% point of the rising edge of the CLK command and the instant at which the analog input is sampled. Aperture Uncertainity (Jitter) The ratio of a change in input offset voltage to a change in power supply voltage. Signal-to-Noise and Distortion (SINAD) The ratio of the rms signal amplitude (set 1 dB below full scale) to rms value of the sum of all other spectral components, including harmonics but excluding dc. The sample-to-sample variation in aperture delay. Signal-to-Noise Ratio (Without Harmonics) Differential Nonlinearity The average deviation of any single LSB transition at the digital output from an ideal 1 LSB step at the analog input. The ratio of the rms signal amplitude (set at 1 dB below full scale) to the rms value of the the sum of all other spectral components, excluding the first five harmonics and dc. Integral Nonlinearity Spurious-Free Dynamic Range The deviation of the transfer function from a reference line measured in fractions of 1 LSB using a best straight line determined by a least square curve fit. The ratio of the rms signal amplitude to the rms value of the peak spurious spectral component. The peak spurious component may or may not be a harmonic and it is reported in dBc. Clock Pulse Width/Duty Cycle Pulse width high is the minimum amount of time that the CLK pulse should be left in logic 1 state to achieve rated performance; pulse width low is the minimum time CLK pulse should be left in low state. At a given clock rate, these specifications define acceptable clock duty cycles. 16 Two-Tone Intermodulation Distortion Rejection The ratio of the rms value of either input tone to the rms value of the worst third order intermodulation product reported in dBc. PACKAGE OPTION ADDENDUM www.ti.com 26-Nov-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS5413-11IPHP OBSOLETE HTQFP PHP 48 TBD Call TI Call TI -40 to 85 ADS5413-11IPHPG4 OBSOLETE HTQFP PHP 48 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. 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