ISM34 Series 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, HC-MOS Applications: Product Features: RoHs Compliant CMOS Logic Levels Compatible with Leadfree Processing Small Footprint Package Real Time Clocks Metering Industrial Control Time Reference System Clock Frequency 32.768 kHz Output Level HC-MOS ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. Duty Cycle Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 50 nS Max. Output Load 15pF ±5% Recommended Pad layout Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) Enable / Disable Time 200 nS Max. Start Up Time 28 mS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % 2.6 2.0 1.3 1.4 Current Pin Connection 1 Enable 2 GND 3 Output 4 Vcc 1.0 mA Max. Operating See Operating Temperature Table in Part Number Guide Dimension Units: mm -40 C to +90 C Storage Part Number Guide Package ISM34 - Input Voltage Sample Part Number: Operating Temperature Symmetry (Duty Cycle) 3 = 3.3 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 6 = 2.5 V 6 = -10 C to +70 C 6 = 40 / 60 Max. 1 = 1.8 V* 3 = -20 C to +70 C ISM34 -3153BH – 32.768 Output 3 = 15 pF HC-MOS Stability (in ppm) Enable / Disable A = 25 H = Enable B = 50 C = 100 4 = -30 C to +75 C 2 = -40 C to +85 C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/11 _B Frequency Specifications subject to change without notice Page 1 - 32.768 kHz ISM34 Series 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, HC-MOS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/11 _B Specifications subject to change without notice Page 2