Sample & Buy Product Folder Tools & Software Technical Documents Support & Community HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 HDC1008 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor 1 Features 3 Description • The HDC1008 is a digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full -40°C to +125°C temperature range. 1 • • • • • • • • Relative Humidity (RH) Operating Range 0% to 100% 14 Bit Measurement Resolution Relative Humidity Accuracy ±4% Temperature Accuracy ±0.2 °C 200 nA Sleep Mode Current Average Supply Current: – 820 nA @ 1sps, 11 bit RH Measurement – 1.2 µA @ 1sps, 11 bit RH and Temperature Measurement Supply Voltage 3 V to 5 V Tiny 2 mm x 1.6 mm Device Footprint I2C Interface Device Information PART NUMBER PACKAGE (1) BODY SIZE (NOM) 2 Applications HDC1008 • • • • • • • • • • (1) For all available packages, see the orderable addendum at the end of the datasheet. HVAC Smart Thermostats and Room Monitors White Goods Printers Handheld Meters Medical Devices Cargo Shipping Automotive Windshield Defog Wearable Devices Mobile Devices DSBGA (8-bump) 2.04 mm x 1.59 mm 4 Typical Application 3.3V RH HDC1008 ADC TEMPERATURE 3.3V 3.3V VDD Registers + Logic I2C SDA SCL DRDYn ADR0 ADR1 MCU VDD 2 IC Peripheral GPIO OTP Calibration Coefficients GND GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Typical Application ................................................ Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 4 4 4 4 5 6 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... I2C Interface Electrical Characteristics...................... I2C Interface Timing Requirements ......................... Typical Characteristics .............................................. Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes.......................................... 9 8.5 Programming........................................................... 10 8.6 Register Map .......................................................... 14 9 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 16 9.3 Do's and Don'ts ...................................................... 18 10 Power Supply Recommendations ..................... 18 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 21 12 Device and Documentation Support ................. 22 12.1 12.2 12.3 12.4 12.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 22 22 22 22 22 13 Mechanical, Packaging, and Orderable Information ........................................................... 22 5 Revision History Changes from Revision A (November 2014) to Revision B Page • Deleted references to functional and operating temperature ranges. ................................................................................... 1 • Changed wording to clarify ..................................................................................................................................................... 3 • Moved Storage Temperature to Abs Max Rating Table ........................................................................................................ 4 • Changed Handling Ratings table to ESD Ratings table. ....................................................................................................... 4 • Added separate conditions for RH ........................................................................................................................................ 4 • Added RH condition ............................................................................................................................................................... 5 • Added figure reference. ......................................................................................................................................................... 5 • Added condition ..................................................................................................................................................................... 5 • Changed wording to clarify hysteresis definition ................................................................................................................... 5 • Changed recommended operating range .............................................................................................................................. 5 • Changed register reference for supply voltage monitoring. The original reference was incorrect ........................................ 9 • Added recommendation for recovery from soldering. ......................................................................................................... 18 Changes from Original (October 2014) to Revision A Page • Changed Datasheet's title ...................................................................................................................................................... 1 • Changed description............................................................................................................................................................... 1 • Changed overview ................................................................................................................................................................. 9 • Changed application information .......................................................................................................................................... 16 • Changed recovery from soldering ....................................................................................................................................... 18 2 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 6 Pin Configuration and Functions WLCSP (DSBGA) 8 Pin YPA Top View A2 B1 B2 C1 D1 RH SENSOR A1 C2 D2 Pin Functions PIN I/O TYPE (1) DESCRIPTION NAME NO. SCL A1 I Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD VDD B1 P Supply Voltage ADR0 C1 I Address select pin – hardwired to GND or VDD ADR1 D1 I Address select pin – hardwired to GND or VDD SDA A2 I/O Serial data line for I2C, open-drain; requires a pull-up resistor to VDD GND B2 G Ground DNC C2 - Do Not Connect, or may be connected to GND DRDYn D2 O Data ready, active low, open-drain, requires a pull-up resistor to VDD. If not used tie to GND. (1) P=Power, G=Ground, I=Input, O=Output Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 3 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) Input Voltage Storage Temperature (1) (2) MIN MAX VDD -0.3 6 SCL -0.3 6 SDA -0.3 6 DRDYn -0.3 6 ADR0 -0.3 VDD+0.3 ADR1 -0.3 VDD+0.3 -65 150 TSTG (2) UNIT V °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For long term storage, it is recommended to stay within 10%RH-80%RH and +5°C to 60°C. Storage beyond this range may result in a temporary RH offset shift. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±1000 Charged device model (CDM), per JEDEC specification –500 500 JESD22-C101, all pins (2) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating range (unless otherwise noted) MIN NOM MAX VDD Supply Voltage 2.7 3 5.5 UNIT V TA, Temperature Sensor Ambient Operating Temperature -40 125 °C TA, Humidity Sensor Ambient Operating Temperature -20 60 °C 7.4 Thermal Information HDC1008 THERMAL METRIC (1) DSBGA (YPA) UNIT 8 PINS RθJA (1) 4 Junction-to-Ambient Thermal Resistance 98.0 °C/W For more information about traditional and new thermal metrics, see the: IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 7.5 Electrical Characteristics The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C, VDD = 3V, and RH = 40%. PARAMETER TEST CONDITION MIN TYP MAX UNIT RH measurement, bit 12 of 0x02 register = 0 (1) 180 220 µA Temperature measurement, bit 12 of 0x02 register = 0 (1) 155 185 µA Sleep Mode 110 200 nA Average @ 1 measurement/second, RH (11 bit), bit 12 of 0x02 register = 0 (1) (2) 730 nA Average @ 1 measurement/second, Temp (11 bit), bit 12 of 0x02 register = 0 (1) (2) 580 nA Average @ 1 measurement/second, RH (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1 (1) (2) 1.2 µA Startup (average on Start-up time) 300 µA Peak current 7.6 mA Average @ 1 measurement/second, RH (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1 (1) (2) 57 µA Refer to Figure 2 in Typical Characteristics section. ±4 %RH ±0.1 %RH ±1 %RH POWER CONSUMPTION IDD Supply Current IHEAT Heater Current (3) RELATIVE HUMIDITY SENSOR RHACC Accuracy RHREP Repeatability (3) RHHYS Hysteresis 0%RH (4) 20% ≤ RH ≤ 60% (5) RHRT Response Time RHCT Conversion Time (3) t 63% (6) 15 2.50 ms 11 bit resolution 3.85 ms 14 bit resolution RHHOR Operating Range (7) RHLTD Long Term Drift s 8 bit resolution Non-condensing 6.50 0 ms 100 ±0.5 %RH %RH/yr TEMPERATURE SENSOR TEMPACC Accuracy (3) TEMPREP Repeatability (3) TEMPCT Conversion Time (3) TEMPOR Operating Range 5°C < TA< 60°C ±0.2 11 bit accuracy 14 bit accuracy (1) (2) (3) (4) (5) (6) (7) ±0.4 °C 3.65 ms 6.35 -40 °C ±0.1 ms 125 °C 2 I C read/write communication and pull-up resistors current through SCL, SDA and DRDYn not included. Average current consumption while conversion is in progress. This parameter is specified by design and/or characterization and it is not tested in production. The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point. Actual response times will vary dependent on system thermal mass and air-flow. Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity. Recommended humidity operating range is 20% to 60% RH. Prolonged operation outside this range may result in a measurement offset. The measurement offset will decrease after operating the sensor in this recommended operating range. Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 5 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 7.6 I2C Interface Electrical Characteristics At TA=30°C, VDD=3V (unless otherwise noted) PARAMETER TEST CONDITION MIN TYP MAX UNIT 2 I C INTERFACE VOLTAGE LEVEL VIH Input High Voltage VIL Input Low Voltage VOL Output Low Voltage 0.7xVDD Sink current 3mA (1) HYS Hysteresis CIN Input Capacitance on all digital pins (1) V 0.3xVDD V 0.4 V 0.1xVDD V 0.5 pF This parameter is specified by design and/or characterization and it is not tested in production. I2C Interface Timing Requirements 7.7 PARAMETER TEST CONDITION MIN TYP MAX UNIT 400 kHz I2C INTERFACE VOLTAGE LEVEL fSCL Clock Frequency 10 tLOW Clock Low Time 1.3 µs tHIGH Clock High Time 0.6 µs tSP Pulse width of spikes that must be suppressed by the input filter (1) tSTART Device Start-up time (1) (2) From VDD ≥ 2.7 V to ready for a conversion (1) (2) 10 50 ns 15 ms This parameter is specified by design and/or characterization and it is not tested in production. Within this interval it is not possible to communicate to the device. SDA tLOW tSP SCL tHIGH START REPEATED START STOP START Figure 1. I2C Timing 6 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 7.8 Typical Characteristics Unless otherwise noted, TA = 30°C, VDD = 3V. 10 1 Typical Typical 0.9 0.8 0.7 Accuracy (r°C) Accuracy (r%RH) 8 6 4 0.6 0.5 0.4 0.3 2 0.2 0.1 0 0 10 20 30 40 50 60 70 80 90 0 -40 100 -25 -10 5 20 35 Figure 2. RH Accuracy vs. RH 80 95 110 125 300 T= -20°C T= 25°C T= 40°C T= 85°C T= 125°C 275 250 250 225 225 200 200 175 175 150 150 125 125 100 2.7 Vdd=2.7V Vdd=3V Vdd=3.3V Vdd=5V 275 Idd (PA) Idd (PA) 65 Figure 3. Temperature Accuracy vs. Temperature 300 100 3 3.3 3.6 3.9 4.2 4.5 4.8 5 0 25 50 Vdd (V) 125 300 T= -20°C T= 25°C T= 40°C T= 85°C T= 125°C Vdd=2.7V Vdd=3V Vdd=3.3V Vdd=5V 275 250 225 225 Idd (PA) 250 200 200 175 175 150 150 125 125 100 2.7 100 Figure 5. Supply Current vs. Temperature, RH Measurement 300 275 75 Temp (°C) Figure 4. Supply Current vs. Supply Voltage, RH Measurement Idd (PA) 50 Temp (°C) RH (%RH) 100 3 3.3 3.6 3.9 4.2 4.5 4.8 5 0 25 Vdd (V) 50 75 100 125 Temp (°C) Figure 6. Supply Current vs. Supply Voltage, Temp Measurement Figure 7. Supply Current vs. Temperature, Temp Measurement Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 7 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com Typical Characteristics (continued) Unless otherwise noted, TA = 30°C, VDD = 3V. 1200 1000 1200 T= -20°C T= 25°C T= 40°C T= 85°C T= 125°C 1000 8 800 Idd (nA) Idd (nA) 800 600 600 400 400 200 200 0 2.7 Vdd=2.7V Vdd=3V Vdd=3.3V Vdd=5V 0 3 3.3 3.6 3.9 4.2 4.5 4.8 5 0 25 50 75 100 125 Vdd (V) Temp (°C) Figure 8. Supply Current vs. Supply Voltage, Sleep Mode Figure 9. Supply Current vs. Temperature, Sleep Mode Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 8 Detailed Description 8.1 Overview The HDC1008 is a digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power and long term. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. Measurement results can be read out through the I2C compatible interface. Resolution is based on the measurement time and can be 8, 11, or 14 bits for humidity; 11 or 14 bits for temperature. 8.2 Functional Block Diagram RH HDC1008 ADC TEMPERATURE VDD Registers + Logic I2C SDA SCL DRDYn ADR0 ADR1 OTP Calibration Coefficients GND 8.3 Feature Description 8.3.1 Power Consumption One of the key features of the HDC1008 is its low power consumption, which makes the device suitable in battery or power harvesting applications. In these applications the HDC1008 spends most of the time in sleep mode; with a typical 110nA of current consumption in sleep mode, the averaged current consumption is minimal. Moreover its low consumption in measurement mode minimizes any self-heating. 8.3.2 Voltage Supply Monitoring The HDC1008 monitors the supply voltage level and indicates when the voltage supply of the HDC1008 is less than 2.8V. This information is useful in battery-powered systems in order to inform the user to replace the battery. This is reported in the BTST field (register address 0x02:bit[11]) which is updated after POR and after each measurement request. 8.3.3 Heater The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off the sensor. The heater can be activated using HEAT, bit 13 in Configuration Register. The heater helps in reducing the accumulated offset after long exposure at high humidity conditions. Once enabled the heater is turned on only in the measurement mode. To have a reasonable increase of the temperature it is suggested to increase the measurement data rate. 8.4 Device Functional Modes The HDC1008 has two modes of operation: sleep mode and measurement mode. After power up, the HDC1008 is in sleep mode. In this mode, the HDC1008 waits for I2C input including commands to configure the conversion times, read the status of the battery, trigger a measurement, and read measurements. Once it receives a command to trigger a measurement, the HDC1008 moves from sleep mode to measurement mode. In measurement mode, the HDC1008 acquires the configured measurements and sets the DRDYn line low when the measurement is complete. After completing the measurement and setting DRDYn low, the HDC1008 returns to sleep mode. Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 9 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 8.5 Programming 8.5.1 I2C Serial Bus Address Configuration To communicate with the HDC1008, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a read or write operation. The HDC1008 features two address pins to allow up to 4 devices to be addressed on a single bus. Table 1 describes the pin logic levels used to properly connect up to 4 devices. The state of the ADR0 and ADR1 pins is sampled on every bus communication and should be set before any activity on the interface occurs. The address pin is read at the start of each communication event. Table 1. HDC1008 ADDRESS ADR1 ADR0 ADDRESS (7-bit address) 0 0 1000000 0 1 1000001 1 0 1000010 1 1 1000011 8.5.2 I2C Interface The HDC1008 operates only as a slave device on the I2C bus interface. It is not allowed to have on the I2C bus multiple devices with the same address. Connection to the bus is made via the open-drain I/O lines, SDA, and SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. After power-up, the sensor needs at most 15 ms, to be ready to start RH and temperature measurement. During this power-up time the HDC1008 is only able to provide the content of the serial number registers (0xFB to 0xFF) if requested. After the power-up the sensor is in the sleep mode until a communication or measurement is performed. All data bytes are transmitted MSB first. 8.5.2.1 Serial Bus Address To communicate with the HDC1008, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a read or write operation. 8.5.2.2 Read and Write Operations Access a particular register on the HDC1008 by writing the appropriate value to the Pointer Register. The pointer value is the first byte transferred after the slave address byte with the R/W bit low. Every write operation to the HDC1008 requires a value for the pointer register (refer to Figure 10). When reading from the HDC1008, the last value stored in the pointer by a write operation is used to determine which register is read by a read operation. To change the pointer register for a read operation, a new value must be written to the pointer. This transaction is accomplished by issuing the slave address byte with the R/W bit low, followed by the pointer byte. No additional data is required (refer to Figure 11). The master can then generate a START condition and send the slave address byte with the R/W bit high to initiate the read command. Note that register bytes are sent MSB first, followed by the LSB. A write operation in a read-only register such as (DEVICE ID, MANUFACTURER ID, SERIAL ID) returns a NACK after each data byte; read/write operation to unused address returns a NACK after the pointer; a read/write operation with incorrect I2C address returns a NACK after the I2C address. 10 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 1 9 1 9 SCL SDA A6 A5 A4 A3 A2 A1 A0 P7 R/W Start by Master P6 P5 P4 P3 P2 P1 P0 Ack by Slave Ack by Slave Frame 1 7-bit Serial Bus Address Byte Frame 2 Pointer Register Byte 1 9 1 9 SCL D15 SDA D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Ack by Slave Ack by Slave Frame 3 Data MSB from MASTER Stop by Master Frame 4 Data LSB from MASTER Figure 10. Writing Frame (Configuration Register) 1 9 1 9 SCL SDA A6 A5 A4 A3 A2 A1 A0 R/W Start by Master P7 P6 P5 P4 P3 P2 P1 P0 Ack by Slave Ack by Slave Frame 1 Frame 2 7-bit Serial Bus Address Byte Pointer Register Byte 1 9 1 9 1 9 SCL A6 SDA A5 A4 A3 A2 A1 D15 D14 D13 D12 D11 D10 A0 R/W Start by Master D9 D8 Ack by Slave D7 D6 D5 D4 D3 D2 Frame 3 D0 Nack by Stop by Master Master Ack by Master Frame 4 Data MSB from Slave 7-bit Serial Bus Address Byte D1 Frame 5 Data LSB from Slave Figure 11. Reading Frame (Configuration Register) 8.5.2.3 Device Measurement Configuration By default the HDC1008 will first perform a temperature measurement followed by a humidity measurement. On power-up, the HDC1008 enters a low power sleep mode and is not actively measuring. Use the following steps to perform a measurement of both temperature and humidity and then retrieve the results: 1. Configure the acquisition parameters in register address 0x02: (a) Set the acquisition mode to measure both temperature and humidity by setting Bit[12] to 1. (b) Set the desired temperature measurement resolution: – Set Bit[10] to 0 for 14 bit resolution. – Set Bit[10] to 1 for 11 bit resolution. (c) Set the desired humidity measurement resolution: – Set Bit[9:8] to 00 for 14 bit resolution. – Set Bit[9:8] to 01 for 11 bit resolution. – Set Bit[9:8] to 10 for 8 bit resolution. 2. Trigger the measurements by executing a pointer write transaction with the address pointer set to 0x00. Refer to Figure 12. 3. Wait for the measurements to complete, based on the conversion time (refer to Electrical Characteristics for the conversion time). Alternatively, wait for the assertion of DRDYn. Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 11 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 4. Read the output data: Read the temperature data from register address 0x00, followed by the humidity data from register address 0x01 in a single transaction as shown in Figure 14. A read operation will return a NACK if the contents of the registers have not been updated as shown in Figure 13. To perform another acquisition with the same measurement configuration simply repeat steps 2 through 4. If only a humidity or temperature measurement is desired, the following steps will perform a measurement and retrieve the result: 1. Configure the acquisition parameters in register address 0x02: (a) Set the acquisition mode to independently measure temperature or humidity by setting Bit[12] to 0. (b) For a temperature measurement, set the desired temperature measurement resolution: – Set Bit[10] to 0 for 14 bit resolution. – Set Bit[10] to 1 for 11 bit resolution. (c) For a humidity measurement, set the desired humidity measurement resolution: – Set Bit[9:8] to 00 for 14 bit resolution. – Set Bit[9:8] to 01 for 11 bit resolution. – Set Bit[9:8] to 10 for 8 bit resolution. 2. Trigger the measurement by executing a pointer write transaction. Refer to Figure 12. – Set the address pointer to 0x00 for a temperature measurement. – Set the address pointer to 0x01 for a humidity measurement. 3. Wait for the measurement to complete, based on the conversion time (refer to Electrical Characteristics for the conversion time). Alternatively, wait for the assertion of DRDYn. 4. Read the output data: Retrieve the completed measurement result from register address 0x00 or 0x01, as appropriate, as shown in Figure 10. A read operation will return a NACK if the measurement result is not yet available, as shown in Figure 13. To perform another acquisition with the same measurement configuration repeat steps 2 through 4. It is possible to read the output registers (addresses 0x00 and 0x01) during an Temperature or Relative Humidity measurement without affecting any ongoing measurement. Note that a write to address 0x00 or 0x01 while a measurement is ongoing will abort the ongoing measurement. If the newest acquired measurement is not read, DRDYn stays low until the next measurement is triggered. 1 9 1 9 SCL SDA A6 A5 A4 A3 A2 A1 A0 R/W Start by Master P7 P6 P5 P4 P3 P2 P1 P0 Ack by Slave Ack by Slave Frame 1 Frame 2 7-bit Serial Bus Address Byte Pointer Register Byte Figure 12. Trigger Humidity/Temperature Measurement 1 9 SCL A6 SDA A5 A4 A3 A2 A1 A0 R/W Start by Master Nack by Slave Frame 3 7-bit Serial Bus Address Byte Figure 13. Read Humidity/Temperature Measurement (Data Not Ready) 12 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 1 1 9 9 1 9 SCL A6 SDA A5 A4 A3 A2 A1 D15 D14 D13 D12 D11 D10 A0 R/W Start by Master D9 D8 Ack by Slave D7 D6 D3 D2 D1 D0 Ack by Master Frame 4 Data MSB from Slave Frame 3 9 D4 Ack by Master 7-bit Serial Bus Address Byte 1 D5 Frame 5 Data LSB from Slave 1 9 SCL SDA D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 Frame 6 Data MSB from Slave D0 Nack by Stop by Master Master Ack by Master Frame 7 Data LSB from Slave Figure 14. Read Humidity and Temperature Measurement (Data Ready) Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 13 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 8.6 Register Map The HDC1008 contains data registers that hold configuration information, temperature and humidity measurement results, and status information. Table 2. Register Map POINTER NAME RESET VALUE DESCRIPTION 0x00 Temperature 0x0000 Temperature measurement output 0x01 Humidity 0x0000 Relative Humidity measurement output 0x02 Configuration 0x1000 HDC1008 configuration and status 0xFB Serial ID device dependent First 2 bytes of the serial ID of the part 0xFC Serial ID device dependent Mid 2 bytes of the serial ID of the part 0xFD Serial ID device dependent Last byte bit of the serial ID of the part Registers from 0x03 to 0xFA are reserved and should not be written. The HDC1008 has an 8-bit pointer used to address a given data register. The pointer identifies which of the data registers should respond to a read or write command on the two-wire bus. This register is set with every write command. A write command must be issued to set the proper value in the pointer before executing a read command. The power-on reset (POR) value of the pointer is 0x00, which selects a temperature measurement. 8.6.1 Temperature Register The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result of the acquisition is always a 14 bit value, while the accuracy is related to the selected conversion time (refer to Electrical Characteristics). The temperature can be calculated from the output data with: § TEMPERATURE>15:00@ · Temperature(qC) ¨ ¸ *165qC - 40qC 216 © ¹ (1) Table 3. Temperature Register Description (0x00) NAME REGISTERS TEMPERATURE [15:02] Temperature Temperature measurement (read only) DESCRIPTION [01:00] Reserved Reserved, always 0 (read only) 8.6.2 Humidity Register The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result of the acquisition is always a 14 bit value, while the accuracy is related to the selected conversion time (refer to Electrical Characteristics). The humidity can be calculated from the output data with: § HUMIDITY >15 :00 @ · Relative Humidity(% RH) ¨ ¸ *100%RH 216 © ¹ (2) Table 4. Humidity Register Description (0x01) NAME HUMIDITY 14 REGISTERS DESCRIPTION [15:02] Relative Humidity Relative Humidity measurement (read only) [01:00] Reserved Reserved, always 0 (read only) Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 8.6.3 Configuration Register This register configures device functionality and returns status. Table 5. Configuration Register Description (0x02) NAME RST REGISTERS [15] DESCRIPTION Software reset bit 0 Normal Operation, this bit self clears 1 Software Reset Reserved [14] Reserved 0 Reserved, must be 0 HEAT [13] Heater 0 Heater Disabled 1 Heater Enabled MODE [12] Mode of acquisition 0 Temperature or Humidity is acquired. 1 Temperature and Humidity are acquired in sequence, Temperature first. BTST [11] Battery Status 0 Battery voltage > 2.8V (read only) 1 Battery voltage < 2.8V (read only) Temperature Measurement Resolution 0 14 bit 1 11 bit Humidity Measurement Resolution 00 14 bit 01 11 bit 10 8 bit 0 Reserved, must be 0 TRES HRES Reserved [10] [9:8] [7:0] Reserved 8.6.4 Serial Number Registers These registers contain a 40bit unique serial number for each individual HDC1008. Table 6. Serial Number Register Description (0xFB) NAME SERIAL ID[39:24] REGISTERS [15:0] DESCRIPTION Serial Id bits Device Serial Number bits from 39 to 24 (read only) Table 7. Serial Number Register Description (0xFC) NAME SERIAL ID[23:8] REGISTERS [15:0] DESCRIPTION Serial Id bits Device Serial Number bits from 23 to 8 (read only) Table 8. Serial Number Register Description (0xFD) NAME SERIAL ID[7:0] REGISTERS DESCRIPTION [15:7] Serial ID bits Device Serial Number bits from 7 to 0 (read only) [6:0] Reserved Reserved, always 0 (read only) Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 15 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information A HVAC or Thermostat are based on environmental sensors and a micro-controller which acquires data from humidity sensors and temperature sensors and controls the heating/cooling system. The collected data are then showed on a display that can be easily controlled by the micro controller. Based on data from the humidity and temperature sensor, the heating/cooling system then maintains the environment at customer-defined preferred conditions. 9.2 Typical Application In a battery-powered HVAC or thermostat, one of the key parameters in the selection of components is the power consumption. The HDC1008, with its 1.2μA of current consumption (average consumption over 1s for RH and Temperature measurements) in conjunction with an MSP430 represents an excellent choice for the low power consumption, which extends the battery life. A system block diagram of a battery powered HVAC or Thermostat is shown in Figure 15. DISPLAY - Lithium ion battery Temp 29°C RH 40% + TIME xx:xx Date xx/xx/xxxx KEYBOARD RH HDC1008 Registers + Logic ADC TEMPERATURE VDD I2C SDA SCL DRDYn ADR0 ADR1 VDD Button I2C Peripheral GPIO GPIO GPIO GPIO GPIO GPIO OTP Calibration Coefficients GND MCU Button Button GND TO AIRCONDITIONING SYSTEM Figure 15. Typical Application Schematic HVAC 9.2.1 Design Requirements In order to correctly sense the ambient temperature and humidity, the HDC1008 should be positioned away from heat sources on the PCB. Generally, it should not be close to the LCD and battery. Moreover, to minimize any self-heating of the HDC1008 it is recommended to acquire at a maximum sample rate of 1sps (RH + Temp). In home systems, humidity and the temperature monitoring rates of less than 1sps (even 0.5sps or 0.2sps) can be still effective. 16 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 Typical Application (continued) 9.2.2 Detailed Design Procedure When a circuit board layout is created from the schematic shown in Figure 15, a small circuit board is possible. The accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of the sensing system. The HDC1008 samples relative humidity and temperature in its immediate environment, it is therefore important that the local conditions at the sensor match the monitored environment. Use one or more openings in the physical cover of the HVAC to obtain a good airflow even in static conditions. Refer to the layout below (Figure 19) for a PCB layout which minimizes the thermal mass of the PCB in the region of the HDC1008, which can improve measurement response time and accuracy. 9.2.3 Application Curve The data showed below have been acquired with the HDC1000EVM populated with HDC1008 . The environment conditions have been evaluated in a humidity chamber. 90 80 Temperature 30°C Ambient (chamber) HDC1000EVM populated with HDC1008 RH (%RH) 70 60 50 40 30 20 10 0:00:00 0:30:00 1:00:00 1:30:00 2:00:00 2:30:00 3:00:00 3:30:00 4:00:00 4:30:00 Time Figure 16. RH vs. Time Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 17 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 9.3 Do's and Don'ts 9.3.1 Soldering For soldering HDC1008, standard reflow soldering ovens may be used. The sensor is qualified to withstand soldering profile according to IPC/JEDEC J-STD-020 with peak temperatures at 260 °C. Refer to the document SNVA009 for more details on the DSBGA package. In the document refer to DSBGA package with bump size 0.5mm pitch and 0.32mm diameter. When soldering the HDC1008 it is mandatory to use no-clean solder paste and no board wash shall be applied. The HDC1008 should be limited to a single IR reflow and no rework is recommended. 9.3.2 Hydration Procedure The HDC1008 may exhibit a negative RH offset due to either the thermal stress of soldering or settling of the RH sensor. It will slowly settle when the humidity sensor is exposed to ambient conditions. If faster settling is required, the following hydration process can be used: Store the PCB containing the HDC1008 at 85% RH and 85 °C for 12 hours. 9.3.3 Chemical Exposure The humidity sensor is not a standard IC and therefore should not be exposed to volatile chemicals such as solvents or other organic compounds. If any type of protective coating must be applied to the circuit board, the sensor must be protected during the coating process. 10 Power Supply Recommendations The HDC1008 require a voltage supply within 2.7V and 5.5V. A multilayer ceramic bypass X7R capacitor of 0.1µF between VDD and GND pin is recommended. 18 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 11 Layout 11.1 Layout Guidelines The Relative Humidity sensor element is located on the bottom side of the package. It is positioned between the two rows of bumps. It is recommended to not route any traces below the sensor element. Moreover, the external components, such as pull-up resistors and bypass capacitors need to be placed next to the 2 rows of bumps or on the bottom side of the PCB in order to guarantee a good air flow. 11.1.1 Surface Mount Two types of PCB land patterns are used for surface mount packages: 1. Non-solder mask defined (NSMD) 2. Solder mask defined (SMD) Pros and cons of NSMD and SMD: 1. The NSMD configuration is preferred due to its tighter control of the copper etch process and a reduction in the stress concentration points on the PCB side compared to SMD configuration. 2. A copper layer thickness of less than 1 oz. is recommended to achieve higher solder joint stand-off. A 1 oz. (35 micron) or greater copper thickness causes a lower effective solder joint stand-off, which may compromise solder joint reliability. 3. For the NSMD pad geometry, the trace width at the connection to the land pad should not exceed 2/3 of the pad diameter. 0.05 MAX ( 0.263) METAL METAL UNDER MASK 0.05 MIN ( 0.263) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE Figure 17. Solder Mask Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 19 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com Layout Guidelines (continued) 11.1.2 Stencil Printing Process 1. Use laser cutting followed by electro-polishing for stencil fabrication. 2. If possible, offset apertures from land pads to maximize separation and minimize possibility of bridging for DSBGA packages. 3. Use Type 3 (25 to 45 micron particle size range) or finer solder paste for printing. (0.5) TYP 8X ( 0.25) 1 (R0.05) TYP 2 A B SYMM (0.5) TYP METAL TYP C D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1mm THICK STENCIL SCALE:25X Figure 18. Solder Paste 20 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 HDC1008 www.ti.com SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 11.2 Layout Example The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent on the temperature, the HDC1008 should be positioned away from hot points present on the board such as battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass for a quicker response to environmental changes. TOP LAYER BOTTOM LAYER Figure 19. HDC1008 Layout Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 21 HDC1008 SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation HDC1000 Texas Instruments Humidity Sensors, SNAA216 AN-1112 Micro SMD Wafer Level Chip Scale Package, SNVA009 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 22 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: HDC1008 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) HDC1008YPAR NRND DSBGA YPA 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 GK HDC1008YPAT NRND DSBGA YPA 8 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 GK (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Dec-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) HDC1008YPAR DSBGA YPA 8 3000 178.0 8.4 HDC1008YPAT DSBGA YPA 8 250 178.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.68 2.13 0.76 4.0 8.0 Q1 1.68 2.13 0.76 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Dec-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) HDC1008YPAR DSBGA YPA 8 3000 210.0 185.0 35.0 HDC1008YPAT DSBGA YPA 8 250 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE YPA0008 DSBGA - 0.675 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B A E BALL A1 CORNER D 0.675 MAX C SEATING PLANE 0.265 0.215 BALL TYP 1 TYP D C 1.5 TYP 0.5 TYP D: Max = 2.07 mm, Min = 2.01 mm B E: Max = 1.62 mm, Min = 1.56 mm A 1 8X 0.005 C A 2 0.335 0.305 B 4215068/A 11/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT YPA0008 DSBGA - 0.675 mm max height DIE SIZE BALL GRID ARRAY 8X 0.275 0.250 (0.5) TYP 1 2 A (0.5) TYP B SYMM C D SYMM LAND PATTERN EXAMPLE SCALE:20X 0.05 MAX ( 0.263) METAL METAL UNDER MASK 0.05 MIN ( 0.263) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4215068/A 11/2013 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017). www.ti.com EXAMPLE STENCIL DESIGN YPA0008 DSBGA - 0.675 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.25) 1 (R0.05) TYP 2 A B SYMM (0.5) TYP METAL TYP C D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1mm THICK STENCIL SCALE:25X 4215068/A 11/2013 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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