1 of 3 Creation Date : June 29, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA4J3X5R1V475M125AB TDK item description CGA4J3X5R1V475MT**** Applications Feature Automotive Grade General General (Up to 50V) AEC-Q200 AEC-Q200 Series CGA4(2012) [EIA 0805] Status Production Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 1.25mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 4.7μF ±20% Rated Voltage 35VDC Temperature Characteristic X5R(±15%) Dissipation Factor (Max.) 7.5% Insulation Resistance (Min.) 106MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : June 29, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA4J3X5R1V475M125AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGA4J3X5R1V475M125AB ESR CGA4J3X5R1V475M125AB Capacitance CGA4J3X5R1V475M125AB CGA4J3X5R1V475M125AB Temperature Characteristic CGA4J3X5R1V475M125AB(No Bias) DC Bias Characteristic CGA4J3X5R1V475M125AB(DC Bias = 17.5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising CGA4J3X5R1V475M125AB(100kHz) CGA4J3X5R1V475M125AB(500kHz) CGA4J3X5R1V475M125AB(1MHz) Multilayer Ceramic Chip Capacitors CGA4J3X5R1V475M125AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : June 29, 2017 (GMT)