Datasheet Serial-in Parallel-out LED Driver 12ch LED Driver IC with 3-line Serial Interface BD8379EFV-M Key Specifications General Description Input voltage range: Output voltage range: DC Output Current (per CH): Output ON Resistance: Standby current: Operating temperature range: The BD8379EFV-M is a serial-in parallel-out controlled LED driver with 35V output voltage rating. With the input of 3-line serial data, it turns the 12ch open drain output on/off. Due to its compact size, it is optimal for small space. 3.0V to 5.5V 35V (Max.) 50mA(Max.) 6Ω(Typ.) 0μA (Typ.) -40°C to +105°C Features Package Open Drain Output. 3-line Serial Control + Enable Signal. Cascade Connection Compatible. HTSSOP-B20 Package. Internal 12ch Power Transistor. Output Slew Rate Typical 20V/μs (for Low EMC Noise). AEC-Q100 Qualified. (Note 1) HTSSOP-B20 W(Typ.) x D(Typ.) x H(Max.) 6.50mm x 6.40mm x 1.00mm (Note 1) Grade2 Applications For indicator of Cluster Panel. Typical Application Circuit VCC 10μF VBAT 10μF ID RL VF VCC OEN_B LATCH RST_B CLK SERIN SEROUT GND Micro computer D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 ID VCC RL 10μF VF VCC OEN_B LATCH RST_B CLK SERI N SEROUT GND D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Pin Configurations Pin Descriptions (TOP VIEW) VCC 1 Pin No. 20 GND Symbol 1 VCC 2 SERIN Function Power supply voltage input Serial data input SERIN 2 19 CLK 3 D0 Drain output 0 D0 3 18 D11 4 D1 Drain output 1 D1 4 17 D10 5 D2 Drain output 2 6 D3 Drain output 3 7 D4 Drain output 4 8 D5 Drain output 5 D2 5 16 D9 D3 6 15 D8 D4 7 14 D7 D5 8 RST_B 9 OEN_B 10 Thermal Pad 13 D6 12 LATCH 11 SEROUT 9 RST_B Reset invert input (Low:FF data 0) 10 OEN_B Output enable (High:Output OFF) 11 Figure 2. Pin Configuration Block Diagram SEROUT Serial data output 12 LATCH 13 D6 Drain output 6 14 D7 Drain output 7 15 D8 Drain output 8 16 D9 Drain output 9 17 D10 Drain output 10 18 D11 Drain output 11 19 CLK Clock input 20 GND Thermal PAD - VCC Latch signal input (High:Data latch) GND Back side thermal PAD (Please connect to GND) D0 D1 CLK D2 Latch & Control Logic Shift Register SERIN SEROUT LATCH D3 D4 D5 D6 D7 RST_B D8 OEN_B D9 D10 D11 GND Figure 3. Block Diagram www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Absolute Maximum Ratings Item Symbol Value Unit VCC 7 V VDmax 35 V Input Voltage VIN -0.3 to VCC V Operating Temperature Range Topr -40 to +105 °C Storage Temperature Range Tstg -55 to +150 °C Drive Current (DC) IomaxD 50 mA Drive Current (Pulse) IomaxP 150 *1 mA Junction Temperature Tjmax 150 °C Power Supply Voltage Output Voltage Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Ratings Item Symbol Value Unit Power Supply Voltage VCC 3.0 to 5.5 V Operational Temperature Topr -40 to 105 °C Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) θJA 143.0 26.8 °C/W ΨJT 8 4 °C/W HTSSOP-B20 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1) Based on JESD51-2A (Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board 4 Layers Thermal Via(NOTE 5) Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Pitch 1.20mm Diameter Φ0.30mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Electrical Characteristics (Unless specified, Ta=-40 to 105°C VCC=3.0 to 5.5V) Item Symbol Standard Value Min Typ Max Unit Condition 【Output D0 to D11】 ON Resistor1 RON1 - 6 12 Ω ID=20mA, VCC=4.5 to 5.5V ON Resistor2 RON2 - 9 18 Ω ID=20mA, VCC=3.0 to 4.5V IDL1 - - 0.3 μA VD=34V, Ta=-40~125°C - - V VCC=4.5 to 5.5V - - V VCC=3.0 to 4.5V V VCC=4.5 to 5.5V V VCC=3.0 to 4.5V VCC=5.0, OEN_B PIN Output leakage current1 【Logic input】 VCC ×0.5 VCC ×0.6 Upper limit threshold voltage1 VTH1 Upper limit threshold voltage2 VTH2 Bottom limit threshold voltage1 VTL1 - - Bottom limit threshold voltage2 VTL2 - - OEN_B Hysteresis width VHYS 0.15 0.30 0.50 V Serial clock frequency FCLK - - 1.25 MHz Input leakage Current L IINLL -5 0 - μA VIN=0V Input leakage Current H IINLH - 0 5 μA VIN=5V Circuit Current ICC - 0.05 1 mA Serial Data Input, VCC=5V, CLK=500KHz, VTH=VCC, VTL=0V SEROUT=OPEN Static Current ISTN - 0 50 μA SEROUT=OPEN Output Voltage High1 VOH1 4.6 4.8 - V VCC=5V, ISO=-4mA Output Voltage Low1 VOL1 - 0.2 0.4 V VCC=5V, ISO=4mA Output Voltage High2 VOH2 2.7 3.0 - V VCC=3.3V, ISO=-4mA Output Voltage Low2 VOL2 - 0.3 0.6 V VCC=3.3V, ISO=4mA VCC ×0.2 VCC ×0.3 【WHOLE】 【SEROUT】(Pin 11) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Typical Performance Curves (unless otherwise specified, Ta=25°C) 100 105℃ 80 SUPPLY CURRENT : ICC[μA] SUPPLY CURRENT：ICC[μA] 100 25℃ 105℃ -40℃ 60 25℃ -40℃ 40 20 80 5.5V 60 5.0V 40 4.5V 20 3.6V 3.3V 3.0V 0 0 0 1 2 3 4 5 -40 SUPPLY VOLTAGE：VCC[V] Figure 4. Circuit current (VCC characteristic) Figure 5. Circuit current (Temperature characteristic) 12 OUTPUT ON RESISTANCE ： RON [Ω] 12 OUTPUT ON RESISTANCE ：RON [Ω] -15 10 35 60 85 AMBIENT TEMPERATURE ： Ta [℃] 105℃ 10 8 25℃ 6 -40℃ 4 2 0 3.0V 3.3V 3.6V 10 8 4.5V 5.0V 5.5V 6 4 2 0 3.0 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE：VCC[V] -40 5.5 Figure 6. Output ON resistance (VCC characteristic @ ID=20mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -15 10 35 60 85 AMBIENT TEMPERATURE ：Ta [℃] Figure 7. Output ON resistance (Temperature characteristic @ ID=20mA) 5/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 400 6.0 350 5.5 300 OUTPUT VOLTAGE ： VOH [V] OUTPUT VOLTAGE ： VOUT [mV] BD8379EFV-M 3.0V 3.3V 3.6V 250 200 4.5V 5.0V 5.5V 150 100 5.0 -40℃ 25℃ 4.5 105℃ 4.0 3.5 3.0 2.5 50 2.0 0 10 20 30 40 INPUT CURRENT ：ID [mA] 3.0 50 5.5 Figure 9. SEROUT high side voltage (VCC characteristic @ ISO=-4mA) Figure 8. Output ON resistance (ID characteristic) 0.30 5.5 5.5V 5.0 5.0V 4.5 4.5V 4.0 3.6V 3.5 3.3V OUTPUT VOLTAGE ： VOL [V] OUTPUT VOLTAGE ： VOH [V] 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE：VCC[V] 0.25 0.20 105℃ 0.15 25℃ -40℃ 0.10 0.05 3.0 3.0V 0.00 2.5 -40 3.0 -15 10 35 60 85 AMBIENT TEMPERATURE ：Ta [℃] 5.5 Figure 11. SEROUT low side voltage (VCC characteristic @ ISO=4mA) Figure 10. SEROUT high side voltage (Temperature characteristic @ ISO=-4mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE：VCC[V] 6/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M OUTPUT VOLTAGE ： VOL [V] 0.30 0.25 3.0V 3.3V 3.6V 0.20 0.15 4.5V 5.0V 5.5V 0.10 0.05 0.00 -40 -15 10 35 60 85 AMBIENT TEMPERATURE ：Ta [℃] Figure 12. SEROUT low side voltage (Temperature characteristic @ ISO=4mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Serial Communication The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a register to store those signals with a LATCH signal. The registers are reset by applying a voltage below VTL to the RST_B terminal, and D11 to D0 become open. To prevent erroneous LED lighting, please apply voltage below VTL to RST_B during start-up. CLK 12bit Shift Register SERIN 12bit Driver Register LATCH Figure 13. Block Diagram of Serial Communication 14) Serial Communication Timing The 12-bit serial data input from SERIN is taken into the shift register by the rising edge of the CLK signal, and is recorded in the register by the rising edge of the LATCH signal. The recorded data is valid until the next rising edge of the LATCH signal. 2) Serial Communication Data The serial data input configuration of SERIN terminal is shown below: First → d11 d10 d9 d8 d7 d6 d5 →Last d4 d3 d2 d1 d0 Data Terminal D11 D10 D9 D8 … D3 D2 D1 D0 Output Condition d11 d10 d9 Data d8 d7 d6 d5 d4 d3 d2 d1 d0 ON 1 * * * * * * * * * * * OFF 0 * * * * * * * * * * * ON * 1 * * * * * * * * * * OFF * 0 * * * * * * * * * * ON * * 1 * * * * * * * * * OFF * * 0 * * * * * * * * * ON * * * 1 * * * * * * * * OFF * * * 0 * * * * * * * * … … … … … … … … … … … … … ON * * * * * * * * 1 * * * OFF * * * * * * * * 0 * * * ON * * * * * * * * * 1 * * OFF * * * * * * * * * 0 * * ON * * * * * * * * * * 1 * OFF * * * * * * * * * * 0 * ON * * * * * * * * * * * 1 OFF * * * * * * * * * * * 0 * indicate Don’t care www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M 3) Enable Signal By applying voltage at least VTH or more to the OEN_B terminal, D11 to D0 become open forcibly. D11 to D0 become PWM operation by having the PWM signal to the OEN_B terminal. OEN_B VIH H L VIL (Input) VBAT LED OFF D11 to D0 (Output) LED ON ILED LED ON VOL LED OFF OFF Figure 14. PWM Signal 4) SEROUT A cascade connection can be made (connecting at least 2 or more IC’s in serial). Serial signal input from SERIN is transferred into receiver IC by the falling edge of the CLK signal. Since this functionality gives enough margins for the setup time prior to the rising edge of the CLK signal on the receiver IC (using the exact same CLK signal of sender IC), the application reliability can be improved as cascade connection functionality. LATCH SERIN d11 d10 CLK 1 2 d9 d8 3 d7 4 d6 5 d5 6 d4 7 d3 8 d2 9 d1 10 d0 11 12 SEROUT d11 Figure 15. SEROUT Output Signal Cascade Connection By using (at least) 2 ICs, each IC’s D11 to D0, at (at least) 24ch, can be controlled by the 24-bit SERIN signal. The serial data input to the sender IC can be transferred to the receiver IC by inputting 12 CLK to the CLK terminal. Receive side IC Send side IC LATCH SERIN d23 CLK 1 d22 2 d21 3 d14 10 d13 11 d12 12 d11 13 d10 14 d9 15 d2 22 d1 23 d0 24 Figure 16. Cascade Connection www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M INPUT SIGNAL’S TIMING CHART TCK 50% CLK TCKH TSEST TCKL TSEHD 50% SERIN TLADZ TSEW TLAH 50% LATCH Figure 17. Timing Chart of Input Signal INPUT SIGNAL’S TIMING RULE (Ta=-40 to 105°C VCC=3.0 to 5.5V) Parameter Symbol Min Unit TCK 800 ns CLK high pulse width TCKH 380 ns CLK low pulse width TCKL 380 ns SERIN high and low pulse width TSEW 780 ns SERIN setup time prior to CLK rise TSEST 150 ns SERIN hold time after CLK rise TSEHD 150 ns TLAH 380 ns TLADZ 200 ns CLK period LATCH high pulse time Last CLK rise to LATCH rise www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M OUTPUT SIGNAL’S DELAY CHART 50% OEN_B TDOENH TDOENL 90% 50% OUTPUT (D11 to D0) 10% SRFALL SRRISE 50% TDLAH LATCH 50% OUTPUT (D11 to D0) CLK 50% TDSOL TDSOH 50% SEROUT Figure 18. Delay Chart of Output Signal OUTPUT SIGNAL’S DELAY TIME (Ta=-40 to 105℃ VCC=3.0 to 5.5V) Parameter Symbol Min. Typ. Max. Unit OEN_B Switching Time (L→H) TDOENH - - 3000 ns OEN_B Switching Time (H→L) TDOENL - - 2000 ns LATCH Switching Delay Time TDLAH - - 3000 ns SEROUT Propagation Delay Time (L→H) TDSOH - - 350 ns SEROUT Propagation Delay Time (H→L) TDSOL - - 350 ns Rising Slew Rate SRRISE - 20 - V/μs Falling Slew Rate SRFALL - 20 - V/μs www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/17 Condition Ta=25°C, VCC=5V, RL=500Ω, VBAT=10V Ta=25°C, VCC=5V, RL=500Ω, VBAT=10V TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M I/O equivalence circuits 2PIN (SERIN) 9PIN (RST_B) 10PIN (OEN_B) 12PIN (LATCH) 19PIN (CLK) 3PIN (D0), 4PIN (D1), 5PIN (D2), 6PIN (D3), 7PIN (D4), 8PIN (D5), 13PIN (D6), 14PIN (D7), 15PIN (D8), 16PIN (D9), 17PIN (D10), 18PIN (D11) VCC www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11PIN (SEROUT) VCC 12/17 VCC TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Operational Notes – continued 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by avoided. Figure 19. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Ordering Information B D 8 3 7 9 E F V Package EFV: HTSSOP-B20 Part Number ME2 Packaging and forming specification M: High reliability E2: Embossed tape and reel Marking Diagram (TOP VIEW) HTSSOP-B20(TOP VIEW) Part Number Marking B D 8 3 7 9 LOT Number 1PIN MARK www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTSSOP-B20 16/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 BD8379EFV-M Revision History Date Revision 14 Mar. 2016 001 New Release of Specification. 002 P.3 Thermal Resistance 2 Internal Layers / Copper Pattern, Bottom / Copper Pattern Before : 74.2mm2(Square) After : 74.2mm x 74.2mm 1 Jun. 2016 Changes www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/17 TSZ02201-0T1T0C500190-1-2 01.Jun.2016 Rev.002 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD8379EFV-M - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD8379EFV-M HTSSOP-B20 2500 2500 Taping inquiry Yes