Micrel MIC95410YFL 6.6mî© rds(on), 7a, 5.5v vin load switch in 1.2mm ã 2.0mm qfn package Datasheet

MIC95410
6.6mΩ RDS(ON), 7A, 5.5V VIN Load Switch in
1.2mm × 2.0mm QFN Package
General Description
Features
The MIC95410 is a high-side load switch for computing
and ultra-dense embedded computing boards where highcurrent low-voltage rails from sub-1V to 5.5V have to be
sectioned. The integrated 6.6mΩ RDS(ON) N-channel
MOSFET ensures low voltage drop and low power
dissipation while delivering up to 7A of load current.
•
•
•
•
•
•
•
The MIC95410 is internally powered by a separated bias
voltage from 2.7V to 9V. It includes a TTL-logic level to
gate a voltage translator driving a charge pump, and an
output discharge function when disabled. The OFF-state
current from bias supply (VS) and the power switch OFFstate leakage current (IOFF) are both below 1µA.
•
•
•
•
Ultra-low RDS(on): 6.6mΩ typical
True 7A current capability
Power rail switching from sub-1V to 5.5V
Bias voltage form 2.7V to 9V
≤1μA OFF-state bias supply current
≤1μA OFF-state power switch leakage current
Adjustable slew rate for inrush current limiting by
external capacitor
Load discharge
TTL-compatible control input
10-pin 1.2mm × 2.0mm QFN package, 0.5mm pin pitch
–40°C to +125°C junction temperature range
The MIC95410 provides user-adjustable slew-ratecontrolled turn-on to limit the inrush current to the input
supply voltage.
Applications
The MIC95410 is available in a thermally efficient, spacesaving 10-pin 1.2mm x 2.0mm QFN package with 0.5mm
pin pitch and an operating junction temperature range from
–40°C to +125°C.
• Embedded computing boards
• Servers
• Data storage equipment
Datasheets and support documentation are available on
Micrel’s web site at: www.micrel.com.
Typical Application
MIC95410 Load Switch
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
October 30, 2014
Revision 1.0
Micrel, Inc.
MIC95410
Ordering Information
(1)
Part Number
MIC95410YFL
Marking
Junction Temperature
Range
9541
–40°C to +125°C
Package
(1)
10-Pin 1.2mm × 2.0mm QFN
Lead Finish
Pb-Free
Note:
1. QFN is a GREEN, RoHS-compliant package. Lead finish is Matte Tin. Mold compound is Halogen Free.
Pin Configuration
10-Pin 1.2mm × 2.0mm QFN (FL)
(Top View)
Pin Description
Pin Number
Pin Name
1
NC
Not internally connected. It is recommended to connect pin 1 to IN such that the width of the input
trace can be maximized in the layout.
2, 3, E1
IN
Power switch input (up to 5.5V).
4
GND
5
VS
6, 7, 8, E2
OUT
Power switch output.
9
GC
Gate connection of power FET. Add a ceramic capacitor from GC to ground GND for slew rate
control.
10
CTL
Control input. TTL compatible. Logic high enables the power switch. A logic low disables the power
switch and discharges OUT.
October 30, 2014
Pin Function
Driver ground and discharge return.
Bias supply input (2.7V to 9V). Bypass with 4.7µF ceramic capacitor to GND.
2
Revision 1.0
Micrel, Inc.
MIC95410
Absolute Maximum Ratings(2)
Operating Ratings(3)
IN, OUT to GND .............................................. –0.3V to +6V
IN to OUT ........................................................ –0.3V to +6V
IN to GC ......................................................................... +6V
VS to GND.................................................... –0.6V to +10V
CTL to GND........................................................ 0.6V to VVS
Lead Temperature (soldering, 10s) ............................ 260°C
Storage Temperature (Ts)......................... –65°C to +150°C
(4)
ESD Rating
Human Body Model .............................................. 1.5kV
Machine Model ...................................................... 150V
Input Voltage (VIN) ....................................................... +5.5V
Bias Voltage (VVS) ........................................... +2.7V to +9V
Gate Connection Voltage (VGC).......................... 0V to +11V
ON-state current (IIN) ........................................................ 7A
Junction Temperature (TJ) ........................ –40°C to +125°C
(5)
Junction Thermal Resistance
10-pin 1.2mm × 2mm QFN (θJA) ........................ 60°C/W
Electrical Characteristics(6)
VVS = VIN = VCTL = 5V, CVS = 4.7µF, CIN = 1µF, COUT = 100nF, RLOAD = 50Ω unless otherwise specified (see Typical Application
Schematic). Typical values at TA = 25°C; Bold indicates values/limits over -40°C < TJ < +125°C.
Symbol
IS
Parameter
Condition
Supply Current
Min.
Typ.
Max.
Units
VVS = 3.3V, VCTL = 0V
VVS = 3.3V, VCTL = 3.3V, IN = open, OUT = open
VVS = 3.3V, VCTL = 3.3V, IN = open, OUT =open,
TA = TJ = 25°C
0.1
1
140
70
90
µA
µA
µA
VVS = 5V, VCTL = 0V
VVS = 5V, VCTL = 5V, IN = open, OUT = open
VVS = 5V, VCTL = 5V, IN = open, OUT = open,
TA = TJ = 25°C
0.1
1
300
150
200
µA
µA
µA
0.8
VVS
VVS
V
V
V
1
µA
VCTL
Control Input Voltage
2.7V ≤ VVS ≤ 9V, logic-0
2.7V ≤ VVS ≤ 5V, logic-1
5V < VVS ≤ 9V, logic-1
ICTL
Control Input Current
2.7V ≤ VVS ≤ 9V
CCTL
Control Input Capacitance
RON
Switch ON-Resistance
0
2.0
2.4
0.01
5
VVS = 2.7V, VIN = 1V, IIN = IOUT = 4A
6.6
9.9
mΩ
VVS = 3.3V, VIN = 3.3V, IIN = IOUT = 4A
6.6
9.9
mΩ
VVS = 5V, VIN = 5V, IIN = IOUT = 4A
6.6
9.9
mΩ
1
µA
IOFF
Switch Input Leakage Current
VVS = 5V, VIN = 5.5V, VCTL = 0V
0.02
IGC
Gate Charge Current
VGC = 4.0V, RLOAD = ∞
VGC = 0.5V, RLOAD = ∞
27
630
TON
Turn-On Time
CGC = 10nF, VIN = 5V
CGC = 100nF, VIN = 1V
1.1
0.4
October 30, 2014
(7)
pF
3
µA
µA
2.0
1.0
ms
ms
Revision 1.0
Micrel, Inc.
MIC95410
Electrical Characteristics(6) (Continued)
TOFF
Turn-Off Time
(8)
CGC = 10nF, VIN = 5V, C3 = 0µF
CGC = 100nF, VIN = 1V, C3 = 0µF
30
150
RD
Discharge Resistance
VOUT = 5V, RLOAD = ∞
VOUT = 4V, RLOAD = ∞
VOUT = 2.5V, RLOAD = ∞
2.3
2.0
1.7
VD
Discharge Diode Forward Drop
(VOUT-VCG)
VCTL = 0V, IOUT = -10µA
0.5
60
300
µs
µs
kΩ
kΩ
kΩ
0.75
V
Notes:
2. Exceeding the absolute maximum ratings may damage the device.
3. The device is not guaranteed to function outside its operating ratings.
4. Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5kΩ in series with 100pF.
5. Junction-to-Ambient Thermal Resistance θJA is measured using the Evaluation Board as described in section PCB Layout Recommendations.
6. Specification for packaged product only.
7. The turn-on time is defined as the time it takes from asserting CTL to VOUT reaching 90% of VIN (rising).
8. The turn-off time is defined as the time it takes from the falling edge of CTL to VOUT reaching 90% of VIN (falling).
October 30, 2014
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Micrel, Inc.
MIC95410
Typical Characteristics
VS Supply Current vs. VS Supply
Voltage
1.40
700
7.00
1.20
500
25°C
400
-40°C
300
200
125°C
6.00
1.00
0.80
VS = 3.3V
0.60
0.40
VS = 5V
0.20
100
2
4
3
5
6
7
8
0
9
2
4
VS SUPPLY VOLTAGE (V)
Turn-On Time vs. GC Capacitance
VIN = 5V
14.00
0.10
6
8
5.00
4.00
VS = 3.3V
3.00
2.00
VS = 5V
VS = 8V
1.00
0.00
0
0.00
10 12 14 16 18 20 22
0
2
4
6
8
10 12 14 16 18 20 22
GC CAPACITANCE (nF)
GC CAPACITANCE (nF)
Turn-Off Time vs. GC Capacitance
VIN = 1.05V
Turn-Off Time vs. GC Capacitance
VIN = 3.3V
0.12
0.09
VS = 3.3V
8.00
6.00
VS = 5V
4.00
2.00
VS = 8V
0.10
0.08
0.07
VS = 3.3V
0.06
VS = 5V
0.05
0.04
0.03
0.02
2
4
6
8
10 12 14 16 18 20 22
VS = 5V
0.04
0.02
0.00
0
2
GC CAPACITANCE (nF)
4
6
8
10 12 14 16 18 20 22
0
2
4
GC CAPACITANCE (nF)
6
8
10 12 14 16 18 20 22
GC CAPACITANCE (nF)
Initial Peak Inrush Current (input)
vs. GC Capacitance
VIN = 1.05V, CLOAD = 100µF
Turn-Off Time vs. GC Capacitance
VIN = 5V
0.09
VS = 3.3V
0.06
VS = 8V
0.00
0
0.08
VS = 8V
0.01
0.00
TURN-OFF TIME (ms)
10.00
TURN-OFF TIME (ms)
12.00
TURN-ON TIME (ms)
VS = 8V
TURN-ON TIME (ms)
600
TURN-ON TIME (ms)
VS SUPPLY CURRENT (µA)
800
Turn-On Time vs. GC Capacitance
VIN = 3.3V
Turn-On Time vs. GC Capacitance
VIN = 1.05V
35.0
12.0
Initial Peak Inrush Current (input)
vs. GC Capacitance
VIN = 3.3V CLOAD = 100µF
0.06
0.05
VIN = 3.3V
VIN = 5V
0.04
VIN = 8V
0.03
0.02
0.01
0.00
0
2
4
6
8
10 12 14 16 18 20 22
GC CAPACITANCE (nF)
October 30, 2014
30.0
10.0
8.0
VS = 8V
6.0
4.0
VS = 5V
2.0
VS = 3.3V
PEAK INRUSH CURRENT (A)
TURN-OFF TIME (ms)
0.07
PEAK INRUSH CURRENT(A)
0.08
25.0
20.0
15.0
VS = 8V
10.0
VS = 3.3V
5.0
VS = 5V
0.0
0.0
0
2
4
6
8
10 12 14 16 18 20 22
GC CAPACITANCE (nF)
5
0
2
4
6
8
10 12 14 16 18 20 22
GC CAPACITANCE (nF)
Revision 1.0
Micrel, Inc.
MIC95410
Typical Characteristics (Continued)
35.0
30.0
25.0
20.0
VS = 8V
15.0
VS = 3.3V
10.0
5.0
RDS(ON) vs. VS Supply Voltage
10.0
9.5
45.0
9.0
40.0
RDS(ON) (mΩ)
40.0
VS = 5V
Device Temperature (top of
package) vs. Load Current
VIN = 5V, VVS = 5V
50.0
DEVICE TEMPERATURE (℃)
PEAK INRUSH CURRENT (A)
45.0
Initial Peak Inrush Current (input)
vs. GC Capacitance
VIN = 5V CLOAD = 100µF
35.0
30.0
8.5
8.0
7.5
3.3V
5V
7.0
25.0
6.5
1.05V
6.0
20.0
0.0
0
2
4
6
8
10 12 14 16 18 20 22
GC CAPACITANCE (nF)
0
1
3
2
4
5
LOAD CURRENT (A)
6
7
2
3
4
5
6
7
8
9
VS SUPPLY VOLTAGE (V)
RDS(ON) vs. VIN Voltage
7.3
7.2
RDS(ON) (mΩ)
7.1
7.0
6.9
VS = 3.3V
6.8
6.7
VS = 5V
6.6
0
1
2
3
4
5
VIN VOLTAGE (V)
October 30, 2014
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Micrel, Inc.
MIC95410
Functional Characteristics
October 30, 2014
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Micrel, Inc.
MIC95410
Functional Diagram
Functional Description
Gate Control
The charge pump output is connected directly to the GC
output. The charge pump is active only when CTL is high.
When CTL is low, Q3 is turned on by the second inverter
and discharges the gate of Q4 to force it off.
The MIC95410 is a non-inverting device. Applying a
logic-high signal to control input (CTL) turns on an
internal N-channel MOSFET switch (Q4). The gate
control (GC) output can be used to reduce the turn-on
speed of the MOSFET by connecting a capacitor from
GC to ground.
If CTL is high, and the voltage applied to VS drops to
zero, the gate output will be floating and unpredictable.
Supply
Supply (VS) is rated for +2.7V to +9V. An external 4.7µF
capacitor (minimum) is recommended.
ESD Protection
D1 and D2 clamp positive and negative ESD voltages.
R1 isolates the gate of Q2 from sudden changes on the
CTL input. Zener D3 also clamps ESD voltages for the
GC output. D4 protects the gate of Q4 from ESD on the
GC pin.
ON/OFF Control
Control (CTL) is a TTL-compatible input. CTL must be
forced high or low by an external signal. A floating input
may cause unpredictable operation.
A high input turns on Q2, which sinks the output of
current source I1, and makes the input of the first inverter
low. The inverter output becomes high, enabling the
charge pump.
Charge Pump
The charge pump is enabled when CTL is logic high. The
charge pump is powered from VS and consists of an
oscillator and a 4x voltage multiplier . Output voltage is
limited to 16V by an internal Zener diode. The charge
pump output current raises the voltage on the GC pin and
causes the internal MOSFET Q4 to be turned on. The
gate-source voltage of Q4 is internally limited by R3 and
D5.
The charge pump oscillator operates from approximately
70kHz to approximately 100kHz depending upon the
supply voltage and temperature.
October 30, 2014
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Micrel, Inc.
MIC95410
For example, if CGC = 10nF, COUT = 100µF (no additional
DC load), ISTAGE2 = 27µA (see IGC parameter in the
Electrical Characteristics table) then we obtain ICHARGE =
0.27A. This calculation is in reasonable agreement with
the measurement shown in Figure 1.
Application Information
Turn-On
The MIC95410 is turned on by setting CTL ≥2.0V. The
CTL pin enables the MIC95410 which releases the pulldown on GC and starts the charge pump. When the
charge pump is turned on, the OUT waveform will exhibit a
two-stage rise-time. In the first stage, a higher drive
current causes GC to rise rapidly, while in the second
phase a lower drive current causes GC to rise more
slowly. This is shown in Figure 1 below. With a purely
capacitive load COUT, the current exhibits an initial peak
(IPEAK) during the first stage and a limiting, flattening value
ICHARGE in the second stage.
Note that for very low input voltages, the duration of the
turn-on transition is likely to be dominated by the first
stage, where the IGC current is much stronger than in the
second stage. In this case, an increase of the CGC
capacitance could be needed.
Also note that during turn-on the internal power switch can
instantaneously dissipate a large amount of power due to
the transition through the linear region. Depending upon
the instantaneous values of load current and voltage,
make sure the turn-on V-I trajectory stays within the Safe
Operating Area plot shown in section Power Switch SOA.
Turn-Off
The turn-off of the MIC95410 is started by taking CTL to a
logic low where the GC pin is pulled to GND with a
resistive MOSFET switch of approximately 2kΩ (see
MOSFET Q3 in the Functional Diagram). Pulling GC to
GND will cause the power MOSFET to be turned off (see
MOSFET Q4 in the Functional Diagram). Further, the
diode D4 between the OUT pin and the GC pin turns on
and discharges OUT with a controlled discharge path (D4Q3).
Power Dissipation Considerations
The junction temperature (TJ) can be estimated from
power dissipation, ambient temperature, and the junctionto-ambient thermal resistance (θJA).
Figure 1. OUT voltage and inrush current waveform during
turn-on (IN current scale is 500mA/div)
An analytical prediction of IPEAK is complicated because it
involves many factors. For an estimation of IPEAK, and
selection of the GC capacitor, the user can refer to the
corresponding Typical Performance Characteristics plots
(given for COUT = 100µF), and scale the values in
proportion to the actual capacitive load. Note that these
plots do not include any additional DC loads because large
load capacitances are the most important factor to
consider in initial peak inrush current estimation. DC
contributions are either negligible at very low output
voltage (e.g. resistive load) or typically activated when the
OUT voltage has already approached its final value.
TJ = PDISS × θ JA + TA
2
For steady-state condition, PDISS is calculated as IIN ×
RON(max). θJA is found in the Operating Ratings section of
the datasheet. This is the value of θJA measured in still air
on the evaluation kit board. Note that the actual θJA in the
final application is strongly dependent on the PCB layout,
on the PCB thermal properties, as well as cooling
techniques (e.g. forced convection vs. still air). Therefore,
the θJA value given for the evaluation kit board should be
used with caution when trying to estimate TJ in the end
user application.
The input current during the second (flattening) stage can
be estimated as shown in Equation 1:
I CHARGE =
I STAGE 2 × COUT
CGC
October 30, 2014
Eq. 2
Eq. 1
9
Revision 1.0
Micrel, Inc.
MIC95410
Power Switch SOA
The safe operating area (SOA) curve shown in Figure 2
represents the boundary of maximum safe operating
current and voltage for transient operation.
Ensure that the V-I trajectory stays within recommended
SOA boundaries during the turn-on and turn-off transients.
Also note that the SOA plot does not provide safe
operating limits for continuous operation and it is only
applicable for transient operation. For continuous (DC)
operation, the allowable power dissipation limit is dictated
by the ambient temperature TA and the actual θJA of the
device in the end user application as follows:
100
10
IIN (A)
PDISS ( MAX ) =
1
TJ ( MAX ) − TA
θ JA
Eq. 3
where TJ(MAX) = 125°C.
0.1
0.1
1
VIN-VOUT (V)
10
Figure 2. MIC95410 Power Switch Safe Operating Area
October 30, 2014
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Micrel, Inc.
MIC95410
Typical Application Schematic
Bill of Materials
Item
C1
C2
C3
Part Number
C1005X5R1A475M050BC
GRM185R61A475ME11
C1005X5R1A105M050BB
GRM155R61A105ME01
C1005X5R1E104M050BC
GRM155R61E104MA87
Manufacturer
(9)
TDK
(10)
Murata
TDK
Murata
TDK
Murata
C4
U1
MIC95410YFL
(11)
Micrel, Inc.
Description
Qty.
4.7µF, 10V, X5R, 20% size 0402 ceramic capacitor
4.7µF, 10V, X5R, 20% size 0603 ceramic capacitor
1
1µF, 10V, X5R, 20% size 0402 ceramic capacitor
1
100nF, 25V, X5R, 20% size 0402 ceramic capacitor
1
1nF to 100nF, 10%, size 0402 ceramic capacitor – optional
(for inrush current control)
6.6mΩ RDS(ON), 7A, 5.5VIN Load Switch in 1.2mm × 2.0mm
QFN Package
1
1
Notes:
9. TDK: www.global.tdk.com
10. Murata: www.murata.com
11. Micrel, Inc.: www.micrel.com
October 30, 2014
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Revision 1.0
Micrel, Inc.
MIC95410
PCB Layout Recommendations
The IN and OUT traces should be made as wide as
possible because the main heat-sinking action will be
performed by heat removal through the IN/E1 and OUT/E2
connections on the top layer. The traces should widen up
as soon as space constraints allow it. In Figure 3 is a
routing example of top layer connections.
used, it is recommended to keep internal planes as solid
as possible and to extend them under the MIC95410 and
its vicinity (in special the IN and OUT top traces) in order
to increase vertical, then lateral, heat transfer.
Another method is to copy the IN and OUT traces on the
bottom layer and to stitch them through many thermal vias
to the top layers IN and OUT connections, in particular in
the immediate vicinity of the MIC95410 IC.
Note that a two-layer routing is adequate for a very
compact solution. In case multiple internal planes are
Figure 3. Top Layer Routing Example
October 30, 2014
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Micrel, Inc.
MIC95410
PCB Layout Recommendations (Continued)
Top Layer
Mid Layer 1
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Micrel, Inc.
MIC95410
PCB Layout Recommendations (Continued)
Mid Layer 2
Bottom Layer (Top View)
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Micrel, Inc.
MIC95410
Package Information(12)
10-Pin FQFN (FL)
Note:
12. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com.
October 30, 2014
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Revision 1.0
Micrel, Inc.
MIC95410
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel, Inc. is a leading global manufacturer of IC solutions for the worldwide high performance linear and power, LAN, and timing & communications
markets. The Company’s products include advanced mixed-signal, analog & power semiconductors; high-performance communication, clock
management, MEMs-based clock oscillators & crystal-less clock generators, Ethernet switches, and physical layer transceiver ICs. Company customers
include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products.
Corporation headquarters and state-of-the-art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and
advanced technology design centers situated throughout the Americas, Europe, and Asia. Additionally, the Company maintains an extensive network
of distributors and reps worldwide.
Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this datasheet. This
information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability
whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties
relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
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