RoHS HFCLR03 High Frequency Low Resistance Inductor 0.020±0.004 (0.5±0.10) 0.039±0.004 (1.0±0.10) 0.020±0.004 (0.51±0.10) Dimensions: Inches (mm) 0.010±0.004 (0.25±0.10) 0.016 (0.41) 0.016 (0.41) Q Min. SRF Typical (MHz) RDC Max. (Ω) IDC Max. (mA) 0.3nH 0.3nH 8 8 0.05 0.06 300 0.8 0.3nH 8 HFCLR03-1N0S-RC 1.0 0.3nH 8 10000 10000 10000 10000 0.06 0.07 300 300 300 HFCLR03-1N1S-RC 1.1 0.3nH 8 6000 0.09 300 HFCLR03-1N2S-RC 1.2 0.3nH 8 6000 0.09 300 HFCLR03-1N3S-RC 1.3 0.3nH 8 6000 0.09 300 HFCLR03-1N5S-RC 1.5 0.3nH 8 6000 0.10 300 HFCLR03-1N6S-RC 1.6 0.3nH 8 6000 0.10 300 HFCLR03-1N8S-RC 1.8 8 6000 0.10 HFCLR03-2N0S-RC 2.0 0.3nH 0.3nH 8 6000 0.10 HFCLR03-2N2S-RC 2.2 2.4 2.7 3.0 0.3nH 0.3nH 0.3nH 0.3nH 8 8 8 8 6000 6000 6000 6000 0.12 0.15 0.15 0.17 300 300 300 300 300 300 3.3 0.3nH 8 6000 0.17 300 3.6 0.3nH 8 6000 3.9 4.3 0.3nH 0.3nH 8 8 6000 6000 0.18 0.18 0.18 300 HFCLR03-4N7S-RC 4.7 0.3nH 8 6000 0.18 300 HFCLR03-5N1S-RC 5.1 0.3nH 8 5300 0.20 300 HFCLR03-5N6S-RC 5.6 0.3nH 8 4500 0.20 300 HFCLR03-6N2S-RC 6.2 0.3nH 8 4500 0.22 300 HFCLR03-6N8_-RC 6.8 5, 10 8 4500 0.24 300 HFCLR03-7N5_-RC 7.5 5, 10 8 4200 0.24 300 HFCLR03-8N2_-RC 8.2 5, 10 8 3700 0.24 300 HFCLR03-9N1_-RC 9.1 5, 10 8 3400 0.26 300 • 0402 EIA size for high board density applications. • Excellent Q and SRF characteristics for high frequency applications. • Cost effective monolithic construction Allied Part Number Inductance (nh) @100MHz Tolerance (%) HFCLR03-0N3S-RC HFCLR03-0N5S-RC 0.3 0.5 HFCLR03-0N8S-RC Electrical Features Inductance range: .3nh to 82nh Tolerance: use S for ± .3nh, J for 5%, K for 10% Test Frequency: Inductance and Q tested at 100MHz, 200mv with HP4291A Impedance Analyzer Inductance vs Freq. Characteristics measured on HP4291A Q vs Frequency Characteristics measured on HP4291A SRF measured on HPE4991 & HP87530 DCR measured on Chen Hwa CH502BC or HP4338B Mechanical Operating Temperature: -55ºC-125ºC Storage Temperature: -55ºC to +125ºC after mounting to PCB, -5ºC to +40ºC @ 40% to 70% humidity before mounting to PCB Solderability: 90% terminal coverage Test Condition: Pre heat:150ºC. 1min. Solder composition: Sn/Ag3.0/Cu.0.5 (Pb free) Solder temp: 245ºC±5ºC (pb Free) Immersion time: 4 ± 1 sec. Resistance to solder heat: No damage to part Test Condition Pre heat: 150ºC. 1min. Solder composition: Sn/Ag3.0/Cu.0.5 (Pb free) Solder temp: 260ºC±5ºC (pb Free) Immersion time: 10 ± 1 sec. Physical Packaging: 10000 pieces per 7 inch reel. All specifications subject to change without notice. 714-665-1140 HFCLR03-2N4S-RC HFCLR03-2N7S-RC HFCLR03-3N0S-RC HFCLR03-3N3S-RC HFCLR03-3N6S-RC HFCLR03-3N9S-RC HFCLR03-4N3S-RC 300 300 HFCLR03-10N_-RC 10 5, 10 8 3400 0.26 300 HFCLR03-12N_-RC 12 5, 10 8 3000 0.28 300 HFCLR03-15N_-RC 15 5, 10 8 2500 0.32 300 HFCLR03-18N_-RC HFCLR03-22N_-RC 18 22 5, 10 5, 10 8 8 2200 1900 0.36 0.42 300 300 HFCLR03-27N_-RC 27 5, 10 8 1700 0.46 300 1600 0.58 200 HFCLR03-33N_-RC 33 5, 10 8 HFCLR03-39N_-RC 39 5, 10 8 1200 0.65 200 HFCLR03-47N_-RC 47 5, 10 8 1000 0.72 200 HFCLR03-56N_-RC 56 5, 10 8 800 0.82 200 HFCLR03-68N_-RC 68 5, 10 8 800 0.92 180 HFCLR03-82N_-RC 82 5, 10 8 700 1.20 150 Note: Insert desired tolerance here “_” Tolerance Values J= ±5%, K= ±10% ALLIED COMPONENTS INTERNATIONAL 05/20/10 www.alliedcomponents.com