Dialog DA9063L System pmic for mobile and automotive application Datasheet

DA9063L
System PMIC for Mobile and Automotive Applications
General Description
DA9063L is a high current system PMIC suitable for dual- and quad-core processors used in
smartphones, tablets, ultra-books, and other handheld and automotive applications that require up to
5 A core processor supply.
DA9063L contains six DC-DC buck converters designed for small external 1 µH inductors capable of
supplying in total up to 12 A continuous output (0.3 V to 3.3 V). The buck converters do not require
external Schottky diodes. They dynamically optimize their efficiency depending on the load current
using an Automatic Sleep mode. The bucks incorporate pin and s/w controlled Dynamic Voltage
Control (DVC) to support processor load adaptive adjustment of the supply voltage. One buck can
also be used in a DDR memory termination mode.
TM
Five SmartMirror programmable LDO regulators are incorporated, rated up to 300 mA. All support
remote capacitor placement and can support operation from a low 1.5 V/1.8 V input voltage: this
allows the linear regulators to be cascaded with a suitable buck supply to improve overall system
efficiency.
Current limited switches provide support for external peripherals such as external accessory or
memory cards.
There are four distinct operating modes consuming < 20 µA. A system monitor watchdog can be
enabled in ACTIVE mode.
The DA9063L provides an OTP start-up sequencing engine that offers autonomous hardware system
start-up or software controlled start-up and configurable power modes. The on key detects the button
press time and offers configurable key lock and application shutdown functions. Up to 16 freely
configurable GPIO pins can perform system functions, including: keypad supervision, application
wakeup, and timing controlled external regulator, power switch, or other IC enable.
An integrated 9-channel ADC includes advanced voltage monitoring, internal temperature
supervision, three general-purpose channels with programmable high/low thresholds, an integrated
current source for resistive measurements, and system voltage monitoring with a programmable lowvoltage warning. The ADC has 8-bit resolution in AUTO mode and 10-bit resolution in manual
conversion mode.
Three RGB-LED driver pins are provided with PWM control.
LDO8 can be configured as a 6-bit, PWM-controlled, vibration motor driver with automatic battery
voltage correction.
Key Features
■ Input voltage 2.8 V to 5.5 V
■ 6 buck converters, 0.3 V to 3.34 V up to
2.5 A
□
□
□
□
Dual-phase mode up to 5 A
■
■
■
■
System supply monitoring
Junction temperature monitoring
Watchdog timer
Merged mode up to 3 A
Up to 16 flexible GPIO pins for enhanced
wakeup and peripheral control
DDR VTT supply mode
■ RGB-LED driver (PWM) with autonomous
flashing
DVS support
■ 3 MHz switching frequency allows use of
low profile 1 µH inductors
■ PWM vibrator driver
■ 10-bit ADC with nine channels and
configurable alarm thresholds
■ Integrated power switches
■ 5 LDO regulators, 0.9 V to 3.6 V up to
■ Two package variants:
□ 100 VFBGA, 8.0 mm x 8.0 mm x 1.0 mm,
300 mA
0.8 mm pitch, 0.30 mm balls
□ 1 low-noise
□ 1 with DVS
□ 4 with current-limited switch option
Datasheet
CFR0011-120-00
□ 100 TFBGA, 8.0 mm x 8.0 mm x 1.2 mm,
0.8 mm pitch, 0.45 mm balls
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
Key Features continued…
■ I2C serial interface for system
■
■ Automotive AEC-Q100 Grade 3 available
communication and control
Programmable power manager
(DA9063L-A)
Applications
■ Portable industrial and medical devices
■ TV dongle
■ Supply for single-, dual- and quad-core
application processors, for example the
TM
i.MX families
Datasheet
CFR0011-120-00
■
■
■
■
eReaders
Power supply for FPGAs
Automotive infotainment/dashboard
IoT devices
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DA9063L
System PMIC for Mobile and Automotive Applications
Contents
General Description ............................................................................................................................ 1
Key Features ........................................................................................................................................ 1
Key Features continued… .................................................................................................................. 2
Applications ......................................................................................................................................... 2
Contents ............................................................................................................................................... 3
1
References ..................................................................................................................................... 6
2
Block Diagram ............................................................................................................................... 6
3
Regulator Overview ....................................................................................................................... 7
4
Package Information ..................................................................................................................... 9
4.1 Package Outlines .................................................................................................................. 9
4.2 Pinout .................................................................................................................................. 11
5
Electrical Characteristics ........................................................................................................... 16
5.1 Absolute Maximum Ratings ................................................................................................ 16
5.2 Recommended Operating Conditions ................................................................................. 16
5.2.1
Power Derating Curves........................................................................................ 17
5.3 Typical Current Consumption ............................................................................................. 19
5.4 Digital I/O Characteristics.................................................................................................... 19
5.5 Watchdog ............................................................................................................................ 20
5.6 HS 2-Wire Control Bus ........................................................................................................ 21
5.7 LDO Voltage Regulators ..................................................................................................... 22
5.7.1
LDO3.................................................................................................................... 22
5.7.2
LDO7.................................................................................................................... 24
5.7.3
LDO8.................................................................................................................... 26
5.7.4
LDO9.................................................................................................................... 28
5.7.5
LDO11.................................................................................................................. 29
5.7.6
LDOCORE ........................................................................................................... 31
5.8 DC/DC Buck Converters ..................................................................................................... 32
5.8.1
BUCKCORE1 and BUCKCORE2 ........................................................................ 32
5.8.2
BUCKPRO ........................................................................................................... 35
5.8.3
BUCKMEM .......................................................................................................... 39
5.8.4
BUCKIO ............................................................................................................... 41
5.8.5
BUCKPERI .......................................................................................................... 42
5.8.6
Typical Characteristics ......................................................................................... 44
5.9 General Purpose ADC ........................................................................................................ 47
5.10 Internal Oscillator ................................................................................................................ 48
5.11 POR, Reference Generation, and Voltage Supervision ...................................................... 48
5.12 Thermal Supervision ........................................................................................................... 48
6
Functional Description ............................................................................................................... 49
6.1 Power Manager IO Ports..................................................................................................... 50
6.1.1
On/Off Port (nONKEY) ......................................................................................... 50
6.1.2
Wakeup Port (CHG_WAKE) ................................................................................ 51
Datasheet
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DA9063L
System PMIC for Mobile and Automotive Applications
6.1.3
Hardware Reset (nOFF, nSHUTDOWN, nONKEY, GPIO14, GPIO15,
WATCHDOG) ...................................................................................................... 51
6.1.4
Reset Output (nRESET) ...................................................................................... 51
6.1.5
System Enable (SYS_EN) ................................................................................... 52
6.1.6
Power Enable (PWR_EN).................................................................................... 52
6.1.7
Power1 Enable (PWR1_EN) ............................................................................... 52
6.1.8
GP_FB1, General Purpose Signal 1 (EXT_WAKEUP/READY) .......................... 52
6.1.9
GP_FB2, General Purpose Signal 2 (PWR_OK/KEEP_ACT)............................. 53
6.1.10 GP_FB3, General Purpose Signal 3 (nVIB_BRAKE) .......................................... 53
6.1.11 Supply Rail Fault (nVDD_FAULT) ....................................................................... 53
6.1.12 Interrupt Request (nIRQ) ..................................................................................... 54
6.1.13 IO Supply Voltage (VDD_IO1 and VDD_IO2) ..................................................... 54
6.2 Operating Modes ................................................................................................................. 55
6.2.1
ACTIVE Mode ...................................................................................................... 55
6.2.2
POWERDOWN Mode .......................................................................................... 55
6.2.3
RESET Mode ....................................................................................................... 56
6.2.4
DELIVERY Mode ................................................................................................. 57
6.2.5
NO-POWER Mode ............................................................................................... 57
6.2.6
Power Commander Mode .................................................................................... 57
6.3 Start-Up from NO-POWER Mode ....................................................................................... 59
6.3.1
Power-On-Reset (nPOR) ..................................................................................... 59
6.4 Exiting Reset Mode and Application Wakeup ..................................................................... 59
6.5 Power Supply Sequencer.................................................................................................... 61
6.5.1
Powering Up ........................................................................................................ 61
6.5.2
Power-Up Timing ................................................................................................. 64
6.5.3
Programmable Slot Delays .................................................................................. 64
6.5.4
Powering Down .................................................................................................... 65
6.5.5
User Programmable Delay .................................................................................. 65
6.6 System Monitor (Watchdog) ............................................................................................... 67
6.7 GPIO Extender .................................................................................................................... 67
6.8 Control Interface.................................................................................................................. 71
6.9 Voltage Regulators .............................................................................................................. 74
6.9.1
Regulators Controlled by Software ...................................................................... 74
6.9.2
Regulators Controlled by Hardware .................................................................... 75
6.9.3
Power Sequencer Control of LDOs ..................................................................... 75
6.9.4
Dynamic Voltage Control ..................................................................................... 76
6.9.5
Pull-Down Resistor .............................................................................................. 76
6.9.6
Bypass Mode and Current Limit .......................................................................... 77
6.9.7
LDO Supply from Buck Converter ....................................................................... 77
6.9.8
LDO Sleep Mode for Reduced IOUT ..................................................................... 77
6.9.9
Vibration Motor Driver .......................................................................................... 78
6.9.10 Core Regulator LDOCORE.................................................................................. 78
6.10 DC/DC Buck Converters ..................................................................................................... 79
6.10.1 BUCKCORE1, BUCKCORE2, and BUCKPRO ................................................... 81
6.10.2 BUCKPRO in DDR Memory Bus Termination Mode ........................................... 82
6.10.3 BUCKMEM and BUCKIO in Merged Mode ......................................................... 82
6.11 General Purpose ADC ........................................................................................................ 83
Datasheet
CFR0011-120-00
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DA9063L
System PMIC for Mobile and Automotive Applications
6.12
6.13
6.14
6.15
6.11.1 ADC Overview ..................................................................................................... 83
6.11.2 ADC Input MUX ................................................................................................... 83
6.11.3 Manual Conversion Mode .................................................................................... 84
6.11.4 Automatic Measurements Scheduler ................................................................... 84
6.11.5 Fixed Threshold Comparator ............................................................................... 88
Adjustable Frequency Internal Oscillator ............................................................................ 89
Reference Voltage Generation: VREF, VLNREF ............................................................... 89
Thermal Supervision ........................................................................................................... 89
Main System Rail Voltage Supervision ............................................................................... 89
7
Register Map ................................................................................................................................ 90
8
Application Information .............................................................................................................. 94
8.1 Capacitor Selection ............................................................................................................. 94
8.2 Inductor Selection ............................................................................................................... 95
8.3 Resistors ............................................................................................................................. 96
8.4 Layout Guidelines ............................................................................................................... 96
8.4.1
General Recommendations ................................................................................. 96
8.4.2
LDOs and Switched Mode Supplies .................................................................... 96
8.4.3
Thermal Connection, Land Pad, and Stencil Design ........................................... 96
9
Definitions .................................................................................................................................... 97
9.1 Power Dissipation and Thermal Design .............................................................................. 97
9.2 Regulator Parameter - Dropout Voltage ............................................................................. 98
9.3 Regulator Parameter - Power Supply Rejection ................................................................. 98
9.4 Regulator Parameter - Line Regulation .............................................................................. 98
9.5 Regulator Parameter - Load Regulation ............................................................................. 99
10 Ordering Information ................................................................................................................ 100
Appendix A Register Descriptions ................................................................................................ 101
A.1 Register Page Control ....................................................................................................... 101
A.2 Register Page 0 ................................................................................................................ 101
A.2.1
Power Manager Control and Monitoring ............................................................ 101
A.2.2
GPIO Control ..................................................................................................... 110
A.2.3
Regulator Control ............................................................................................... 116
A.2.4
GPADC .............................................................................................................. 123
A.2.5
ADC Results ...................................................................................................... 124
A.3 Register Page 1 ................................................................................................................ 126
A.3.1
Power Sequencer .............................................................................................. 126
A.3.2
Regulator Settings ............................................................................................. 131
A.3.3
High Power GPO PWM ..................................................................................... 154
A.3.4
GPADC Thresholds ........................................................................................... 155
A.4 Register Page 2 ................................................................................................................ 157
A.4.1
OTP.................................................................................................................... 157
A.4.2
Customer Trim and Configuration ..................................................................... 158
A.5 Register Page 3 ................................................................................................................ 172
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
1
References
Dialog Semiconductor technical documentation is available on the support site:
www.dialog-semiconductor.com/support.
[1]
[2]
[3]
2
AN-PM-068, Application Note, VBBAT Current in RTC or DELIVERY Modes, Dialog
Semiconductor.
AN-PM-024, Application Note, DA9063 Voltage Monitoring, Dialog Semiconductor.
AN-PM-010, Application Note, PCB Layout Guidelines, Dialog Semiconductor.
Block Diagram
Figure 1: Block Diagram
Datasheet
CFR0011-120-00
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DA9063L
System PMIC for Mobile and Automotive Applications
3
Regulator Overview
Table 1: Regulators
Regulator
Supplied Pins
Supplied
Voltage
(V)
Supplied
Max.
Current
(mA)
External
Component
Notes
BUCKCORE1
VBUCKCORE1
0.3 to
1.57
1250/
2500
(full-current
mode)
Note 1
1.0 µH/
44 µF /
88 µF
● GPIO and host interfacecontrolled DVC with
variable slew rate (10 mV in
[0.5, 1.0, 2.0, 4.0] µs)
● 10 mV steps
● < 0.7 V PFM mode only
● 2500 mA in full-current
mode (double pass device
and current limit)
● Provides dual-phase buck
with up to 5 A if combined
with BUCKCORE2
BUCKCORE2
VBUCKCORE2
0.3 to
1.57
1250/
2500
(full-current
mode)
Note 1
1.0 µH/
44/88 µF
● GPIO and host interfacecontrolled DVC with
variable slew rate (10 mV in
[0.5/1.0/2.0/4.0] µs)
● 10 mV steps
● < 0.7 V PFM mode only
● 2500 mA in full-current
mode (double pass device
and current limit)
● Provides dual-phase Buck
if combined with
BUCKCORE1
BUCKPRO
VBUCKPRO
0.53 to
1.80
1250/
2500
(full-current
mode)
Note 1
1.0 µH/
44/88 µF
● GPIO and host interfacecontrolled DVC with
variable slew rate, (10 mV
in [0.5/1.0/2.0/4.0] µs)
● 10 mV steps and VTT
regulator mode
● < 0.7 V PFM mode only
● 2500 mA in full-current
mode (double pass device
and current limit)
BUCKMEM
VBUCKMEM
0.8 to
3.34
1500
Note 1
1.0 µH/
44 µF
● GPIO and host interfacecontrolled DVC with
variable slew rate (10 mV in
[0.5/1.0/2.0/4.0] µs)
● 20 mV steps
● Can be merged with
BUCK_IO towards single
buck with up to 3 A output
current
BUCKIO
VBUCKIO
0.8 to
3.34
1500
Note 1
1.0 µH/
44 µF
● GPIO and host interfacecontrolled DVC with
variable slew rate (10 mV in
[0.5/1.0/2.0/4.0] µs)
● 20 mV steps, can be
merged with BUCK_MEM
Datasheet
CFR0011-120-00
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DA9063L
System PMIC for Mobile and Automotive Applications
Regulator
Supplied Pins
Supplied
Voltage
(V)
Supplied
Max.
Current
(mA)
External
Component
Notes
BUCKPERI
VBUCKPERI
0.8 to
3.34
1500
Note 1
1.0 µH/
44 µF
● GPIO and host interfacecontrolled DVC with
variable slew rate (10 mV in
[0.5/1.0/2.0/4.0] µs)
● 20 mV steps
LDO3
VLDO3
0.9 to
3.44
200
2.2 µF
● Bypass mode
● GPIO and host interfacecontrolled DVC with
variable slew rate (10 mV in
[0.5/1.0/2.0/4.0] µs)
● 20 mV steps
LDO7
VLDO7
0.9 to 3.6
200
2.2 µF
● Bypass mode
● 50 mV steps
● Common supply with LDO8
LDO8
VLDO8
0.9 to 3.6
200
2.2 µF
● Bypass and switching
vibration motor driver mode
● 50 mV steps
● Common supply with LDO7
LDO9
VLDO9
0.95 to
3.6
200
2.2 µF
● Low noise
● 50 mV steps
● OTP trimmed
LDO11
VLDO11
0.9 to 3.6
300
2.2 µF
● Bypass mode
● 50 mV steps
LDOCORE
Internal PMIC
supply
2.5 ± 2 %
accuracy
4
2.2 µF
● Internal LDO
● OTP trimmed
Note 1
For short durations to meet peak current requirements IOUT can be operated at up to 10 % higher than
the specified maximum operating condition. The part should not be operated in this mode for extended
periods and is not guaranteed for continuous operation.
Datasheet
CFR0011-120-00
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DA9063L
System PMIC for Mobile and Automotive Applications
4
4.1
Package Information
Package Outlines
Figure 2: Package Outline Drawing 100 VFBGA 0.3 mm Ball Diameter
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
Figure 3: Package Outline Drawing 100 TFBGA 0.45 mm Ball Diameter
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
4.2
Pinout
Figure 4: Connection Diagram
Table 2: Pin Type Definition
Pin Type
Description
Pin Type
Description
DI
Digital input
AI
Analog input
DO
Digital output
AO
Analog output
DIO
Digital input/output
AIO
Analog input/output
PWR
Power supply
GND
Ground connection
Datasheet
CFR0011-120-00
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System PMIC for Mobile and Automotive Applications
Table 3: Pin Description
Pin
Pin name
Alternate
Function
Type
(Table 2)
Description
Power Manager
A9
nVDD_FAULT
B6
CHG_WAKE
B7
nIRQ
DO
IRQ line for host
B8
nSHUTDOWN
DI
Active-low input from switch or host to initiate
shutdown
B9
SYS_EN
GPIO8
DI/DIO
Hardware enable of power domain
SYSTEM/GPIO8
B10
PWR1_EN
GPIO10
DI/DIO
Hardware enable of power domain
POWER1/GPIO10 with high power output / input
for power sequencer WAIT ID
C3
VDD_IO2
PWR
Alternate supply I/O voltage
C4
VDD_IO1
PWR
First supply I/O voltage rail
C8
GP_FB2
DO/DI
PWR_OK status indicator: all supervised
regulators are in-range / HW input for watchdog
supervision / dual-phase BUCKCORE voltage
sense at output capacitor
C9
PWR_EN
DI/DIO
Hardware enable of power domain power /
sequencer controlled GPO
D3
GPIO7
DIO
Sequencer controlled GPO
D5
TP
DIO
Test pin: enables power commander boot mode
and supply pin for OTP fusing voltage
D9
nRESET
DO
Active low reset for host
E8
GP_FB1
E9
GPIO11
DIO
H9
GP_FB3
DI
nVIB_BREAK control signal for vibration motor
driver (LDO8)
J4
nOFF
DI
Active-low input from error indication line to
initiate fast emergency shutdown
J7
nONKEY
DI
On/off key with optional long press shutdown
Datasheet
CFR0011-120-00
GPIO12
GPIO9
GPIO13
DO/DIO
Indication for low supply voltage / GPIO12 /
VDD_MON controlled GPO
DI/PWR
Wakeup signal from companion charger to
trigger a start-up and temporary supply voltage
for PMIC (VBUS_PROT in case of an inserted
supply until charger Buck provides power to
VSYS).
Connect to GND if not used.
DO/DIO
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Status indication for host of a valid wakeup
event (EXT_WAKEUP) / indicator for on-going
power mode transition (READY) / GPIO13,
regulator HW control
GPIO11 with high power output and blinking
feature
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Pin
Pin name
Alternate
Function
Type
(Table 2)
Description
2-Wire Interface
A4
A5
Connect to ground
A7
DATA
GPIO14
DIO
A8
CLK
GPIO15
DI
HS 2-WIRE data / GPIO14 (optional reset if long
press in parallel with GPI15) with high power
output and blinking feature
HS 2-WIRE clock / GPIO15 (optional reset if
long press in parallel with GPI14) with high
power output and blinking feature
B3
Connect to ground
B4
Connect to ground
Voltage Regulators
A3
VSYS
PWR
Supply voltage for PMIC and input for voltage
supervision
(decouple with 1.0 µF)
A6
VDDCORE
AO
Regulated supply for internal circuitry
(2.2 V/2.5 V)
(decouple with 2.2 µF)
C1
VLDO11
AO
Output voltage from LDO11
D1
D2
VDD_LDO11
PWR
Supply voltage for LDO11
E1
VLDO9
AO
Output voltage from LDO9
E2
VDD_LDO7_8
PWR
Supply voltage for LDO7 and LDO8
E3
VDD_LDO9
PWR
Supply voltage for LDO9
F1
VLDO8
AO
Output voltage from LDO8
F2
VLDO7
AO
Output voltage from LDO7
F3
Connect to ground
G1
G2
G3
Connect to ground
VDD_LDO3
PWR
G4
Supply voltage for LDO3
Connect to ground
H1
H2
Connect to ground
H3
Connect to ground
J1
K1
VLDO3
AO
Output voltage from LDO3
K2
K3
Datasheet
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System PMIC for Mobile and Automotive Applications
Pin
Pin name
Alternate
Function
Type
(Table 2)
Description
DC/DC Buck Converters
A1
A2
Connect to ground
VREF
AIO
Filter node for internal reference voltage
(decouple with 2.2 µF)
A10
B1
Connect to ground
B2
VLNREF
Filter node for LN (low noise)
(decouple with 2.2 µF)
B5
VTTR
C2
IREF
C5
ADCIN2
GPIO1
AI/DIO
Connection to GPADC channel 2 with 1.2 V HW
comparator IRQ/GPIO1, regulator HW control
C6
ADCIN3
GPIO2
AI/DIO
Connection to GPADC channel 3/GPIO2,
regulator HW control
C7
ADCIN1
GPIO0
AI/DIO
Connection to GPADC auto channel 1 with
threshold IRQ and resistor measurement
option/GPIO0
D4
VDDQ
E_GPI2
AI/DO
BUCKPRO target voltage sense port / state of
E_GPI2 controlled GPO
D8
PERI_SWS
GPIO6
AI/DIO
BUCKPERI sense node/GPIO6
D10
SWBUCKPRO_B
AO
Switching node for BUCKPRO (full-current)
E10
SWBUCKPRO_A
AO
Switching node for BUCKPRO (half-current)
F8, F9
VDD_BUCKPRO
PWR
CMP1V2
AO/DO
AO
Memory bus termination reference voltage
(50 % of VDDQ), COMP1V2 controlled GPO
Connection for bias setting
(configure with high precision 200 kΩ resistor)
C10
F10
SWBUCKCORE2_A
AO
G8, G9
VDD_BUCKCORE2
PWR
G10
SWBUCKCORE2_B
AO
H4
VDD_BUCKPERI
PWR
Supply voltage for buck
To be connected to VSYS
Switching node for BUCKCORE2 (half-current)
Supply voltage for buck
To be connected to VSYS
Switching node for BUCKCORE2 (full-current)
Supply voltage for buck
To be connected to VSYS
H5
VDD_BUCKMEM
PWR
Supply voltage for buck
To be connected to VSYS
H6
VDD_BUCKIO
PWR
Supply voltage for buck
To be connected to VSYS
H7, H8
VDD_BUCKCORE1
PWR
Supply voltage for buck
To be connected to VSYS
H10
SWBUCKCORE1_A
AO
Switching node for BUCKCORE1 (half-current)
J2
VBUCKPERI
AI
Sense node for BUCKPERI
J3
VBUCKMEM
AI
Sense node for DC/DC BUCKMEM
J5
GPIO5
Datasheet
CFR0011-120-00
DIO
DA9063L_2v1
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GPIO5
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DA9063L
System PMIC for Mobile and Automotive Applications
Pin
Pin name
J6
GPIO3
J8
CORE_SWS
J10
Alternate
Function
Type
(Table 2)
DIO
GPIO4
Description
GPIO3
AI/DIO
BUCKCORE sense node from output capacitor
of dual-phase BUCKCORE1/2 connection of
internal switch to the output of GPIO4
SWBUCKCORE1_B
AO
Switching node for BUCKCORE1 (full-current)
K4
VBUCKIO
AI
Sense node for BUCKIO
K5
SWBUCKPERI
AO
Switching node for BUCKPERI
K6
SWBUCKMEM
AO
Switching node for BUCKMEM
K7
SWBUCKIO
AO
Switching node for BUCKIO
To be connected to SWBUCKMEM for buck
merge
K8
VBUCKCORE1
AI
Sense node for BUCKCORE1
K9
VBUCKCORE2
AI
Sense node for BUCKCORE2
K10
VBUCKPRO
AI
Sense node for BUCKPRO
J9
Connect to ground
VSS
D6 to
D7, E4,
F4
GND
GND
VSS_LDO, VSS_ADC, VSS_CORE, VSUB
E5 to
E7, F5
to F7,
G5 to
G7
GND
GND
VSS_BUCKCORE1_A, VSS_BUCKCORE1_B,
VSS_BUCKCORE2_A, VSS_BUCKCORE2_B,
VSS_BUCK_PRO_A, VSS_BUCK_PRO_B,
VSS_BUCK_IO, VSS_BUCK_MEM,
VSS_BUCK_PERI
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
5
Electrical Characteristics
5.1
Absolute Maximum Ratings
Stresses beyond those listed under Absolute maximum ratings may cause permanent damage to the
device. These are stress ratings only, so functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specification are not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 4: Absolute Maximum Ratings
Parameter
Symbol/Pin
Storage temperature
TSTG
Junction temperature
TJ
Supply voltage
Conditions
Note 1
VSYS,
CHG_WAKE
All other
pins
ESD protection Human Body Model
(HBM)
VESD_HBM
ESD protection Charged Device Model
(CDM)
VESD_CDM
Note 2
Min
Typ
Max
Unit
-65
+150
°C
-40
+150
°C
-0.3
5.5
V
-0.3
VDDREF + 0.3
V
2000
Corner pins
750
All other pins
500
V
V
Note 1
See Section 5.12 and Section 6.14.
Note 2
Maximum VDDREF = 5.5 V. An internal node VDDREF is defined as the higher rail of CHG_WAKE and
VSYS.
5.2
Recommended Operating Conditions
All voltages are referenced to VSS unless otherwise stated. Currents flowing into DA9063L are
deemed positive; currents flowing out are deemed negative. All parameters are valid over the
recommended temperature range and power supply range unless otherwise stated. Please note that
the power dissipation must be limited to avoid overheating of DA9063L.
Table 5: Recommended Operating Conditions
Parameter
Junction temperature
Supply voltage
Supply voltage IO
Symbol/Pin
Conditions
Min
Typ
Max
Unit
TJ
-40
+125
°C
VSYS,
CHG_WAKE
0
5.5
V
1.2
3.6
V
VDD_IO1/2
Note 1
BUCKCORE1,
BUCKCORE2,
BUCKPRO
IOUT
Note 2
2500
mA
BUCKMEM,
BUCKIO,
BUCKPERI
IOUT
Note 2
1500
mA
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Thermal resistance
junction to ambient
Symbol/Pin
Conditions
JA
100 VFBGA package
Min
Typ
Max
Unit
27.7
°C/W
26.1
°C/W
2000
mW
2100
mW
Note 3
100 TFBGA package
Note 3
Maximum power
dissipation, see
Section 5.2.1
PD
100 VFBGA
Derating factor above
TA = 70 °C:
36.1 mW/°C (1/θJA)
100 TFBGA
Derating factor above
TA = 70 °C:
38.3 mW/°C (1/θJA)
Note 1
VDDIO1/2 must not exceed VDDREF.
Note 2
For short durations to meet peak current requirements I OUT can be operated at up to 10 % higher than
the specified maximum operating condition. The part should not be operated in this mode for extended
periods and is not guaranteed for continuous operation.
Note 3
Obtained from package thermal simulations, JEDEC 2S2P four layer board (76.2 mm x 114 mm x
1.6 mm), 70 μm (2 oz) copper thickness power planes, 35 μm (1 oz) copper thickness signal layer
traces, natural convection (still air), see Section 4.14.1.
5.2.1
Power Derating Curves
Figure 5: 100 VFBGA Power Derating Curve
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
Table 6: Typical Temperatures
TA = 70 °C
TA = 85 °C
TA = 105 °C
TJ_WARN
PD = 1.99 W
PD = 1.44 W
PD = 0.72 W
TJ_CRIT
PD = 2.53 W
PD = 1.99 W
PD = 1.26 W
Figure 6:100 TFBGA Power Derating Curve
Table 7: Typical Temperatures
TA = 70 °C
TA = 85 °C
TA = 105 °C
TJ_WARN
PD = 2.11 W
PD = 1.53 W
PD = 0.77 W
TJ_CRIT
PD = 2.68 W
PD = 2.11 W
PD = 1.34 W
Datasheet
CFR0011-120-00
DA9063L_2v1
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DA9063L
System PMIC for Mobile and Automotive Applications
5.3
Typical Current Consumption
Table 8: Typical Current Consumption
Operating Mode
Conditions (Note 1)
Battery
Unit
NO-POWER mode (POR)
2.4 V > VDDREF > 1.5 V
16
µA
DELIVERY mode
VDDREF > 1.5 V
1.8
µA
RESET mode
VDDREF > 2.2 V, supplies off (except
LDOCORE), pulsed mode
18
µA
LOW-POWER mode
VSYS > VDD_FAULT_LOWER, supplies
off (except LDOCORE), all blocks in
POWERDOWN mode, pulsed mode with
limited parametric compliance
12
µA
POWERDOWN mode (Hibernate)
VSYS > VDD_FAULT_LOWER, supplies
off (except LDOCORE), all blocks in
POWERDOWN mode
28
µA
POWERDOWN mode (Standby)
BUCKCORE, LDOCORE, and LD03, 8, 11
enabled, GPIO unit on (Note 2)
60
µA
ACTIVE mode
All supplies, GPIO, and GPADC off
200
µA
ACTIVE mode
All supplies, GPIO, and GPADC on
390
µA
Note 1
nONKEY/CHG_WAKE/VDDREF detection circuit is enabled in all modes.
Note 2
Regulators are running in sleep mode.
5.4
Digital I/O Characteristics
Table 9: Digital I/O Electrical Characteristics, TJ = -40 ºC to +125 ºC
Parameter
GPI0 to GPI15, CLK,
DATA, nOFF,
nSHUTDOWN
SYS_EN, PWR_EN,
PWR1_EN
Input High Voltage
Symbol
Test Conditions
Min
VDDCORE mode
1.0
Typ
Max
VSYS
VIH
V
VDD_IO2 mode
GPI0 to GPI15, CLK,
DATA, nOFF,
nSHUTDOWN
SYS_EN, PWR_EN,
PWR1_EN
Input Low Voltage
VIL
nONKEY, CHG_WAKE
Input High Voltage
Unit
VDDCORE mode
0.7*VDD_IO2
VSYS
-0.3
0.4
V
-0.3
0.3*VDD_IO2
VIH
1.0
VSYS
V
nONKEY, CHG_WAKE
Input Low Voltage
VIL
-0.3
0.4
V
GPO0 to GPO15,
nVDD_FAULT, nRESET,
nIRQ, E_GPI_2,
COMP1V2
Output High Voltage
VOH = 1 mA
VDD_IOx ≥
1.5 V
Datasheet
CFR0011-120-00
VDD_IO2 mode
VDD_IO1 mode
0.8*VDD_IO1
V
VDD_IO2 mode
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DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
GPO1, 3 to 6, 10, and 12
to 15, DATA, nRESET,
nIRQ, PWR_OK (open
drain mode)
Output High Voltage
VOH
Open drain
GPO0 to GPO15,
nVDD_FAULT, nRESET
(Note 1), nIRQ (Note 1),
PWR_OK, E_GPI_2,
COMP1V2,
Output Low Voltage
CLK, DATA
Input Capacitance
Max
Unit
VDDREF
V
VOL = 1 mA
0.3
V
CIN
10
pF
Sink current capability
VGPIO = 0.5 V
GPO 10, 11, 14, 15
Note 2
Min
11
VGPIO =
0.8*VDD_IO1/2
Note 2
Source current capability
GPO 10, 11,14,15
Sink current capability
GPO 0 to 9, 12, 13
VGPIO = 0.3 V
Source current capability
GPO 0 to 9, 12, 13
VGPIO =
0.8*VDD_IO1/2
Note 3
GPI pull-down resistor
GPO pull-up resistor
Note 4
Typ
mA
-4
mA
1
mA
-1
mA
50
100
250
VDD_IO1/2 =
1.5 V
60
180
310
VDD_IO1/2 =
1.8 V
45
120
190
VDD_IO1/2 =
3.3 V
20
40
60
kΩ
kΩ
Note 1
Electrical characteristics are guaranteed down to VDDREF = 2.0 V (VPOR_LOWER). For lower voltages
the port continues operating with reduced performance.
Note 2
At low VDDREF values and high temperatures, the sink current capability is reduced.
Note 3
For VDD_IO1/2 < 1.5 V the source current capability is reduced.
Note 4
V(PAD) = 0 V.
5.5
Watchdog
Table 10: Watchdog, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Minimum Watchdog time
Maximum Watchdog time
Datasheet
CFR0011-120-00
Test Conditions
Min
Typ
Max
Unit
TWDMIN
0.18
0.256
0.33
s
TWDMAX
1.44
2.048
2.64
s
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DA9063L
System PMIC for Mobile and Automotive Applications
5.6
HS 2-Wire Control Bus
CLKL
CLKH
CLK/SK
STH
DST
DHT
TSS
DATA/SI
Figure 7: 2-Wire Bus Timing
Table 11: HS 2-Wire Control Bus Electrical Characteristics, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Bus free time STOP to START
Bus line capacitive load
Min
Typ
Max
0.5
Cb
Unit
µs
150
pF
1000
kHz
Standard/Fast/Fast+ Mode
CLK clock frequency
Note 1
0
Bus free time STOP to START
0.5
µs
Start condition set-up time
0.26
µs
Start condition hold time
STH
0.26
µs
CLK low time
CLKL
0.5
µs
CLK high time
CLKH
0.26
µs
2-WIRE CLK and DATA rise
time
(input requirement)
1000
ns
2-WIRE CLK and DATA fall
time
(input requirement)
300
ns
Data set-up time
DST
50
ns
Data hold-time
DHT
0
ns
Data valid time
0.45
µs
Data valid time acknowledge
0.45
µs
Stop condition set-up time
TSS
0.26
µs
High Speed Mode
Requires VDDIO ≥ 1.8 V
CLK clock frequency
0
3400
kHz
Note 1
Start condition set-up time
160
ns
Start condition hold time
STH
160
ns
CLK low time
CLKL
160
ns
CLK high time
CLKH
60
ns
2-WIRE CLKH and SDAH
rise/fall time
Datasheet
CFR0011-120-00
Input requirement
DA9063L_2v1
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ns
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DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Data set-up time
DST
10
ns
Data hold-time
DHT
0
ns
Stop condition set-up time
TSS
160
ns
Note 1
5.7
Test Conditions
Min
Typ
Max
Unit
Minimum clock frequency is 10 kHz if 2WIRE_TO is enabled
LDO Voltage Regulators
5.7.1
LDO3
Table 12: LDO3, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Input voltage
VDD
Output voltage
Test Conditions
Min
VDD = VSYS
2.8
If supplied from buck
VLDO
Output accuracy
(1.5)
Note 1
0.9
VDD = VSYS = 2.8V to 5.5 V
IOUT = 200 mA
Including static line/load
regulation
COUT
Including voltage and
temperature coefficient at
configured VLDO3
-55%
Output capacitor
ESR
RCOUT_ESR
f > 1 MHz including wiring
parasitics
0
Output current
IOUT_max
VDD = VSYS = 2.8 V to 5.5 V
200
Short circuit current
ISHORT
Maximum forced
sleep mode current
ISLEEP
Dropout voltage
VDROPOUT
Static line
regulation
VS_LINE
VDD = VSYS = 3.0 V to 5.5 V
IOUT = 200 mA
Static load
regulation
VS_LOAD
IOUT = 1 mA to 200 mA
Line transient
response
VTR_LINE
Load transient
response
PSRR
CFR0011-120-00
Note 2
-3
Stabilisation
capacitor
Datasheet
Typ
2.2
Max
Unit
5.5
V
3.44
V
+3
%
+35%
µF
300
mΩ
mA
400
VDD ≥ 1.8 V
mA
20
mA
VDD = VSYS > 2.8 V
100
150
mV
1
5
mV
5
10
VDD = VSYS = 3.0 V to 3.6 V
IOUT = 100 mA
tr = tf = 10 µs
5
10
mV
VTR_LOAD
VDD = 3.6 V
IOUT = 1 mA to 200 mA
tr = tf = 1 µs
30
50
mV
PSRR
Note 3
f = 10 Hz to 10 kHz , RT
VDD = 3.6 V, IOUT = IMAX/2
VDD – VLDO ≥ 0.6 V
IOUT = 100 mA
(VDD = 1.5 V, IOUT = IMAX/3)
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DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Output noise
N
VDD = VSYS = 3.6 V,
VLDO = 2.8 V
IOUT = 5 mA to IMAX
f = 10 Hz to 100 kHz , RT
Quiescent current
in ON mode
IQ_ON
Note 4
Quiescent current
forced sleep mode
IQ_SLEEP
Quiescent current
OFF mode
IQ_OFF
Min
Typ
Unit
70
μV
rms
9+
0.45% of
IOUT
μA
1.5 +
1.0% of
IOUT
μA
1
μA
300
10 to 90%
Turn-on time
Max
μs
tON
SLEEP mode
Turn off time
tOFF
90 % to 10 %
Pull-down resistor enabled
Pull-down
resistance in OFF
mode
ROFF
Can be disabled via
LDO3_PD_DIS
390
1
ms
Ω
100
Bypass mode
Bypass onresistance
RON
Current limit in
Bypass mode
ILIM
Quiescent current
in Bypass mode
IQ_BYPASS
VDD > 2.2 V
0.5
VDD > 1.8 V
300
50
Max output current is 30 % when the input voltage is 1.5 V
Note 2
Programmable in 20 mV voltage steps
Note 3
Measured at point of load
Note 4
Internal regulator current flowing to ground
CFR0011-120-00
Ω
1.0
Note 1
Datasheet
0.7
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mA
100
μA
05-Apr-2017
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DA9063L
System PMIC for Mobile and Automotive Applications
5.7.2
LDO7
Table 13: LDO7, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Input voltage
VDD
Output voltage
Test Conditions
Min
VDD = VSYS
2.8
If supplied from buck
VLDO
Typ
1.5
Note 1
0.9
Note 2
Max
Unit
5.5
V
3.6
V
+3
%
+35 %
µF
300
mΩ
VDD = VSYS = 2.8 V to 5.5 V
IOUT = 200 mA
Including static line/load
regulation
Output accuracy
Stabilisation
capacitor
COUT
ESR of capacitor
Including voltage and
temperature coefficient at
configured VLDO7
-55 %
f > 1 MHz
Including track impedance
0
VDD = VSYS = 2.8 V to 5.5 V
200
Maximum output
current
IOUT_max
Short circuit
current
ISHORT
Maximum forced
sleep mode
current
ISLEEP
Dropout voltage
VDROPOUT
Static line
regulation
VS_LINE
VDD = VSYS = 3.0V to 5.5 V
IOUT = 200 mA
Static load
regulation
VS_LOAD
IOUT = 1 mA to 200 mA
Line transient
response
VTR_LINE
VDD = VSYS = 3.0 V to 3.6 V
IOUT = 100 mA
tr = tf = 10 µs
Load transient
response
VTR_LOAD
VDD = 3.6 V
IOUT = 1 mA to 200 mA
tr = tf = 1 µs
PSRR
PSRR
Note 3
f = 10 Hz to 10 kHz , RT
VDD = 3.6 V, IOUT = IMAX/2
VDD – VLDO ≥ 0.6 V
Output noise
N
Quiescent current
in ON mode
IQ_ON
Quiescent current
forced sleep mode
IQ_SLEEP
Quiescent current
OFF mode
IQ_OFF
Datasheet
CFR0011-120-00
-3
2.2
mA
400
VDD ≥ 1.8 V
mA
30
mA
VDD = VSYS > 2.8 V
IOUT = 200 mA
(VDD = 1.5 V, IOUT = IMAX/3)
VDD = Vsys = 3.6 V,
VLDO = 2.8 V
IOUT = 5 mA to IMAX
f = 10 Hz to 100 kHz , RT
Note 4
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40
100
150
mV
1
5
mV
5
10
5
10
30
50
50
mV
mV
mV
dB
μV
rms
70
9+0.4% of
IOUT
μA
1.5+1.0%
of IOUT
μA
1
μA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Turn-on time
TON
Turn off time
TOFF
Pull-down
resistance in OFF
mode
ROFF
Test Conditions
Min
Typ
Max
10 % to 90 %
300
SLEEP mode
390
90 % to 10 %
1
Pull-down resistor enabled
Can be disabled via
LDO7_PD_DIS
Unit
μs
ms
Ω
100
Bypass mode
Bypass onresistance
RON
Current limit in
Bypass mode
ILIM
Quiescent current
IQBypass
VDD > 2.2 V
0.5
VDD > 1.8 V
300
50
Max output current is 30 % when the input voltage is 1.5 V
Note 2
Programmable in 50 mV voltage steps
Note 3
Measured at point of load
Note 4
Internal regulator current flowing to ground
CFR0011-120-00
Ω
1.0
Note 1
Datasheet
0.7
DA9063L_2v1
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600
mA
100
μA
05-Apr-2017
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DA9063L
System PMIC for Mobile and Automotive Applications
5.7.3
LDO8
Table 14: LDO8, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Input voltage
VDD
Output voltage
Test Conditions
Min
VDD = VSYS
2.8
If supplied from buck
VLDO
Typ
1.5
Note 1
0.9
Note 2
Max
Unit
5.5
V
3.6
V
+3
%
+35 %
µF
300
mΩ
VDD = VSYS = 2.8 V to 5.5 V
IOUT = 200 mA
Including static line/load
regulation
Output accuracy
Stabilisation
capacitor
COUT
ESR of capacitor
Maximum output
current
IOUT_max
Short circuit
current
ISHORT
Maximum forced
sleep mode
current
ISLEEP
Dropout voltage
VDROPOUT
Static line
regulation
-3
Including voltage and
temperature coefficient at
configured VLDO8
-55 %
f > 1 MHz
Including track impedance
0
VDD = VSYS = 2.8 V to 5.5 V
200
2.2
mA
400
VDD ≥ 1.8 V
mA
30
mA
VDD = VSYS > 2.8 V
IOUT = 200 mA
(VDD = 1.5 V, IOUT = IMAX/3)
100
150
VS_LINE
VDD = VSYS = 3.0 V to 5.5 V
IOUT = 200 mA
1
5
Static load
regulation
VS_LOAD
IOUT = 1 mA to 200 mA
5
10
Line transient
response
VTR_LINE
VDD = VSYS = 3.0 V to 3.6 V
IOUT = 100 mA
tr = tf = 10 µs
5
10
Load transient
response
VTR_LOAD
VDD = 3.6 V
IOUT = 1 mA to 200 mA
tr = tf = 1 µs
30
50
PSRR
PSRR
Note 3
f = 10 Hz to 10 kHz , RT
VDD = 3.6 V, IOUT = IMAX/2
VDD – VLDO ≥ 0.6 V
Output noise
N
Quiescent current
in ON mode
IQ_ON
Quiescent current
forced sleep mode
IQ_SLEEP
Datasheet
CFR0011-120-00
VDD = VSYS = 3.6 V,
VLDO = 2.8 V
IOUT = 5 mA to IMAX
f = 10 Hz to 100 kHz , RT
Note 4
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40
50
mV
mV
mV
mV
mV
dB
μV
rms
70
9 + 0.4 %
of IOUT
μA
1.5 +
1.0 % of
IOUT
μA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Quiescent current
OFF mode
IQ_OFF
Turn-on time
TON
Test Conditions
Min
Typ
Max
μA
1
10 % to 90 %
300
SLEEP mode
390
Turn off time
TOFF
90 % to 10 %
Pull-down resistor enabled
Pull-down
resistance in OFF
mode
ROFF
Can be disabled via
LDO8_PD_DIS
Unit
1
μs
ms
Ω
100
Vibration Motor Driver Mode
Output voltage
(average)
VIB_SET
Maximum output
current
IMAX
Short circuit
current
ISHORT
Load resistance
RLOAD
Load impedance
RLOAD
200
µH
Pull-up resistor
Ron
0.5
Ω
Pull-down resistor
Roff
5
Ω
6-bit resolution
0
3
V
300
mA
400
8
10
mA
10000
Ω
Bypass Mode
Bypass onresistance
RON
Current limit in
Bypass mode
ILIM
Quiescent current
in Bypass mode
IQBypass
VDD > 2.2 V
0.5
VDD > 1.8 V
300
50
Note 1
Max output current is 30 % when the input voltage is 1.5 V
Note 2
Programmable in 50 mV voltage steps
Note 3
Measured at point of load
Note 4
Internal regulator current flowing to ground
Datasheet
CFR0011-120-00
DA9063L_2v1
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0.7
1.0
Ω
600
mA
100
μA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
5.7.4
LDO9
Table 15: LDO9, TJ = -40 ºC to +125 ºC
Parameter
Input voltage
Output voltage
Symbol
VDD
Test Conditions
Min
VDD = VSYS
2.8
If supplied from buck
VLDO
Typ
1.5
Max
Unit
5.5
V
3.6
V
+3
%
+35 %
µF
300
mΩ
Note 1
0.95
Note 2
VDD = VSYS = 2.8 V to 5.5 V
IOUT = 200 mA
Including static line/load
regulation
Note 3
Output accuracy
Stabilisation
capacitor
COUT
ESR of capacitor
Including voltage and
temperature coefficient at
configured VLDO9
f > 1 MHz
Maximum output
current
IOUT_max
Short circuit
current
ISHORT
Maximum forced
sleep mode
current
ISLEEP
Dropout voltage
VDROPOUT
Static line
regulation
-3
-55 %
2.2
0
VDD = VSYS = 2.8 V to 5.5 V
200
mA
400
VDD ≥ 1.8 V
mA
30
mA
VDD = VSYS > 2.8 V
IOUT = 200 mA
(VDD = 1.5 V, IOUT = IMAX/3)
100
150
VS_LINE
VDD = VSYS = 3.0 V to 5.5 V
IOUT = 200 mA
1
5
Static load
regulation
VS_LOAD
IOUT = 1 mA to 200 mA
5
10
Line transient
response
VTR_LINE
VDD = VSYS = 3.0 V to 3.6 V
IOUT = 100 mA
tr = tf = 10 µs
5
10
Load transient
response
VTR_LOAD
VDD = 3.6 V
IOUT = 1 mA to 200 mA
tr = tf = 1 µs
30
50
PSRR
PSRR
Note 4
f = 10 Hz to 10 kHz , RT
VDD = 3.6 V, IOUT = IMAX/2
VDD – VLDO ≥ 0.6 V
Output noise
N
Quiescent current
in ON mode
IQ_ON
Quiescent current
forced sleep mode
IQ_SLEEP
Quiescent current
OFF mode
IQ_OFF
Datasheet
CFR0011-120-00
VDD = Vsys = 3.6 V,
VLDO = 2.8 V
IOUT = 5 mA to IMAX
f = 10 Hz to 100 kHz , RT
Note 5
DA9063L_2v1
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40
50
mV
mV
mV
mV
mV
dB
μV
rms
35
9+0.4% of
IOUT
μA
2+1.0% of
IOUT
μA
1
μA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Turn-on time
TON
Turn off time
TOFF
Pull-down
resistance in OFF
mode
ROFF
Test Conditions
Typ
Max
10 % to 90 %
200
SLEEP mode
260
90 % to 10 %
1
Pull-down resistor enabled
Can be disabled via
LDO9_PD_DIS
Note 1
Max output current is 30 % when the input voltage is 1.5 V
Note 2
Programmable in 50 mV voltage steps
Note 3
At trimmed output voltage
Note 4
Measured at point of load
Note 5
Internal regulator current flowing to ground
5.7.5
Min
Unit
μs
ms
Ω
100
LDO11
Table 16: LDO11, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Input voltage
VDD
Output voltage
Test Conditions
Min
VDD = VSYS
2.8
If supplied from buck
VLDO
Typ
1.5
Max
Unit
5.5
V
3.6
V
+3
%
+35 %
µF
300
mΩ
Note 1
0.9
Note 2
VDD = VSYS = 2.8V to 5.5 V
IOUT = 200 mA
Including static line/load
regulation
Output accuracy
Stabilisation
capacitor
COUT
ESR of capacitor
Including voltage and
temperature coefficient at
configured VLDO11
-55 %
f > 1 MHz
Including track impedance
0
VDD = VSYS = 2.8 V to 5.5 V
300
Maximum output
current
IOUT_max
Short circuit
current
ISHORT
Maximum sleep
mode current
ISLEEP
Dropout voltage
VDROPOUT
Static line
regulation
VS_LINE
VLDO = 1.86 V
IOUT = 300 mA
Static load
regulation
VS_LOAD
IOUT = 1 mA to 300 mA
Datasheet
CFR0011-120-00
-3
2.2
mA
600
VDD ≥ 1.8 V
mA
30
VDD = VSYS > 2.8 V
IOUT = 300 mA
(VDD = 1.5 V, IOUT = IMAX/3)
VDD = VSYS = 2.8 V to 5.5 V
DA9063L_2v1
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mA
100
150
2
15
5
20
mV
mV
mV
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Min
Typ
Max
VLDO = 1.86 V
IOUT = 300 mA
tr = tf = 10 µs
5
10
30
50
Unit
VDD = VSYS = 2.8 V to 5.5 V
Line transient
response
VTR_LINE
Load transient
response
VTR_LOAD
VDD = 3.6 V
IOUT = 1 mA to 300 mA
tr = tf = 1 µs
PSRR
PSRR
Note 3
f = 10 Hz to 10 kHz , RT
VDD = 3.6 V, IOUT = IMAX/2
VDD – VLDO ≥ 0.6 V
Output noise
N
Quiescent current
in ON mode
IQ_ON
Quiescent current
forced sleep mode
IQ_SLEEP
Quiescent current
OFF mode
IQ_OFF
Turn-on time
TON
40
VDD = VSYS = 3.6 V,
VLDO = 2.8 V
IOUT = 5 mA to IMAX
f = 10 Hz to 100 kHz , RT
50
μV
rms
9+
0.45 %
of IOUT
μA
2+
0.7 % of
IOUT
μA
1
μA
10 % to 90 %
200
SLEEP mode
260
Turn off time
TOFF
90 % to 10 %
Pull-down resistor enabled
Pull-down
resistance in OFF
mode
ROFF
Can be disabled via
LDO11_PD_DIS
mV
dB
70
Note 4
mV
1
μs
ms
Ω
100
Bypass Mode
Bypass onresistance
RON
Current limit in
Bypass mode
ILIM
Quiescent current
in Bypass mode
IQBypass
VDD > 2.2 V
0.3
VDD > 1.8 V
300
50
Max output current is 30 % when the input voltage is 1.5 V
Note 2
Programmable in 50 mV voltage steps
Note 3
Measured at point of load
Note 4
Internal regulator current flowing to ground
CFR0011-120-00
Ω
1.0
Note 1
Datasheet
0.7
DA9063L_2v1
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600
mA
100
μA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
5.7.6
LDOCORE
Table 17: LDOCORE, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Output voltage
VDDCORE
Note 1
2.45
2.5
2.55
V
RESET mode
Stabilisation capacitor
COUT
Including voltage and
temperature coefficient
Output capacitor ESR
RCOUT_ESR
f > 1 MHz
Including wiring parasitics
Dropout voltage
VDROPOUT
Note 2
2.2
-55 %
2.2
0
50
V
+35 %
µF
300
mΩ
100
mV
Note 1
Setting VDD_FAULT_LOWER ≥ 2.65 V avoids LDOCORE dropout, see Section 5.11.
Note 2
The LDOCORE supply, VSYS or CHG_WAKE, must be maintained above VDDCORE + VDROPOUT.
Note
LDOCORE is only used to supply internal circuits.
Datasheet
CFR0011-120-00
DA9063L_2v1
31 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
5.8
DC/DC Buck Converters
5.8.1
BUCKCORE1 and BUCKCORE2
Table 18: BUCKCORE1 and BUCKCORE2, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Input voltage
VDD
VDD = VSYS
2.8
Typ
Max
Unit
5.5
V
Including voltage and
temperature coefficient
Output capacitor
COUT
Half-current mode
µF
2 x 22
-50 %
Full-current mode
+30 %
2 x 47
Including wiring parasitics
f > 100 kHz
Half-current mode
Output capacitor
ESR
50
7.5
25
1.0
1.3
µH
55
100
mΩ
0.3
1.57
V
-1
+1
-1.5
+1.5
Full-current mode
COUT = 2 * 47 μF
Inductor value
LBUCK
Inductor resistance
LESR
Including current and
temperature dependence
mΩ
15
COUT = 2 * 22 μF
0.7
PWM Mode
Output voltage
VBUCK
Programmable in 10 mV
steps
Note 1
Excluding static line/load
regulation and voltage
ripple
TA = 25 °C
VDD = 4.2 V
VBUCK = 1.03 V
Excluding static line/load
regulation and voltage
ripple
TA = -40 °C to +85 °C
Output voltage
accuracy
VDD = 4.2 V
VBUCK = 1.03 V
Including static line/load
regulation and voltage
ripple
IOUT = IMAX
VBUCK = 1.03 V
LBUCK, LESR = Typ
Including static line/load
regulation and voltage
ripple
%
-2
+2
-3
+3
IOUT = IMAX
Note 2
Datasheet
CFR0011-120-00
DA9063L_2v1
32 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
+4
%
3
mV
VDD = 3.6 V
Load regulation
transient
VTR_LD
VBUCK = 1.2 V
IOUT = 200 mA / 0.8 * IMAX
dI/dt = 3 A/µs
LBUCK = 1.0 µH
-4
Note 3
VDD = 3.0 V to 3.6 V
IOUT = 500 mA
tr = tf = 10 µs
0.2
Parasitic track
resistance
From output capacitor to
sense connection at pointof-load
10
mΩ
Parasitic track
inductance
From output capacitor to
sense connection at pointof-load
5
nH
Line regulation
transient
VTR_LINE
Feedback
Comparator input
impedance
RFB
Output current
IMAX
Current limit
(programmable)
ILIM
Note 4
Quiescent current
in OFF mode
IQ_OFF
Quiescent current
in PWM mode
Switching
frequency
IQ_ON
f
kΩ
500
Half-current mode
1250
Full-current mode
2500
BCORE1_ILIM=0000
-20 %
500
+20 %
mA
BCORE1_ILIM=1111
-20 %
2000
+20 %
mA
1
µA
mA
Half-current mode
IOUT = 0 mA
9.0
Full-current mode
11.0
OSC_FRQ = 0000
mA
2.85
3
3.15
MHz
84
%
0.37
1.2
ms
80
200
Ω
Note 5
Switching duty
cycle
D
10.5
VBUCK = 1.15 V
Turn on time
TON
BUCK_SLOWSTART =
disabled
SLEW_RATE = 10
mV/1 µs
BUCK<x>_ILIM = 1500 mA
Output pull-down
resistor
PMOS ON
resistance
RPD
VBUCK = 0.5 V
Can be disabled via
BCORE1_PD_DIS
RPMOS
Half-current mode
Including pin and routing
VSYS = 3.6 V
Full-current mode
Including pin and routing
160
mΩ
80
VSYS = 3.6 V
Datasheet
CFR0011-120-00
DA9063L_2v1
33 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
NMOS ON
resistance
RNMOS
Half-current mode
Min
Including pin and routing
VSYS = 3.6 V
Typ
Max
Unit
60
mΩ
Full-current mode
Including pin and routing
30
VSYS = 3.6 V
VDD = 3.6 V
Efficiency
Note 6
η
VBUCK = 1.2 V
IOUT = 0.1 to 0.7 * IMAX
84
%
PFM Mode
Programmable in 10 mV
steps
Output voltage
VBUCK
0.3
1.57
V
Typical automatic
mode switching
current
IAUTO_THR
260
mA
Output current
IOUT_PFM
300
mA
Current limit
ILIM_PFM
600
mA
IOUT = 0
Quiescent current
IQ_PFM
Forced PFM mode
27
32
AUTO mode
35
42
Frequency of
operation
0
3
µA
MHz
VDD = 3.6 V
Efficiency
Note 6
η
VBUCK = 1.2 V
IOUT = 10 mA
86
%
Note 1
If BUCK<x>_MODE = 10 (synchronous) then the buck operates in PFM mode when VBUCK < 0.7 V.
For complete control of the buck mode (PWM versus PFM) use BUCK<x>_MODE = 00.
Note 2
Minimum tolerance 35 mV
Note 3
Measured at COUT, depends on parasitics of PCB and external components when remote sensing
Note 4
Current limit values are doubled in full-current mode
Note 5
Generated from internal 6 MHz oscillator and can be adjusted by ± 10 % via control OSC_FRQ
Note 6
Depends on external components and PCB routing
Datasheet
CFR0011-120-00
DA9063L_2v1
34 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
5.8.2
BUCKPRO
Table 19: BUCKPRO, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Input voltage
VDD
VDD = VSYS
2.8
Typ
Max
Unit
5.5
V
Including voltage and
temperature coefficient
Output capacitor
COUT
Half-current mode
µF
2 * 22
-50 %
Full-current mode
+30 %
2 * 47
Including wiring parasitics
f > 100 kHz
Half-current mode
Output capacitor ESR
50
7.5
25
1.0
1.3
µH
55
100
mΩ
0.53
1.8
V
-3
+3
Full-current mode
COUT = 2 * 47 μF
Inductor value
LBUCK
Inductor resistance
LESR
Including current and
temperature dependence
mΩ
15
COUT = 2 * 22 μF
0.7
PWM Mode
Output voltage
VBUCK
Programmable in 10 mV
steps
Note 1
Including static line/load
regulation and voltage
ripple
IOUT = IMAX
Note 2
Output voltage accuracy
%
Excluding static line/load
regulation and voltage
ripple
TA = 25 °C
VBUCK > 1 V
-1
+1
VDD = 5 V
VDD = 3.6 V
Transient load regulation
VTR_LD
VBUCK = 1.2 V
IOUT = 200 mA / 0.8 * IMAX
dI/dt = 3 A/µs
LBUCK = 1.0 µH
20
50
mV
0.2
3
mV
Note 3
Transient line regulation
VTR_LINE
Output current
IMAX
Current limit
(programmable)
Datasheet
CFR0011-120-00
ILIM
VDD = 3.0 V to 3.6 V
IOUT = 500 mA
tr = tf = 10 µs
Half-current mode
1250
Full-current mode
2500
BPRO_ILIM=0000
-20 %
500
+20 %
mA
BPRO_ILIM=1111
-20 %
2000
+20 %
mA
mA
DA9063L_2v1
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05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Min
Typ
Quiescent current in
OFF mode
IQ_OFF
Quiescent current in
PWM mode
IQ_ON
Switching frequency
Note 4
f
Switching duty cycle
D
Output pull-down resistor
RPD
Can be disabled via
BPRO_PD_DIS
80
PMOS ON resistance
RPMOS
Half-current mode
160
Half-current mode
9.0
Full-current mode
11.0
Max
Unit
1
µA
mA
OSC_FRQ = 0000
2.85
3
10.6
3.15
MHz
84
%
200
Ω
@ VOUT = 0.5 V
mΩ
Including pin and routing
VSYS = 3.6 V
Full-current mode
Including pin and routing
80
VSYS = 3.6 V
NMOS ON resistance
RNMOS
Half-current mode
mΩ
60
Including pin and routing
VSYS = 3.6 V
Full-current mode
30
Including pin and routing
VSYS = 3.6 V
Efficiency
Note 5
VDD = 3.6 V
η
VBUCK = 1.2 V
IOUT = 0.1 mA to 0.7 * IMAX
84
%
PFM Mode
Programmable in 10 mV
steps
Output voltage
VBUCK
0.53
1.8
V
Typical automatic mode
switching current
IAUTO_THR
260
mA
Output current
IOUT_PFM
300
mA
Current limit
ILIM
600
mA
IOUT = 0 mA
Quiescent current
Frequency of operation
Efficiency
Note 5
Datasheet
CFR0011-120-00
IQ_PFM
Forced PFM mode
22
25
AUTO mode
30
35
f
0
3
µA
MHz
VDD = 3.6 V
η
VBUCK = 1.2 V
IOUT = 10 mA
DA9063L_2v1
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86
%
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Min
Input voltage
VDD
VDD = VSYS
2.8
Output capacitor
COUT
Including voltage and
temperature coefficient
Output capacitor ESR
RCOUT_ESR
ESR of COUT
@ f > 100 kHz + track
impedance
Inductor value
LBUCK
Including current and
temperature dependence
Inductor resistance
LESR
Output voltage
VBUCK
VBUCK = VDDQ/2
Output voltage accuracy
VBUCK_ACC
Relative to VTTR
Including static line and
load regulation
Output voltage ripple
VBPRO_RPL
IOUT = 1 A
CESR
Typ
Max
Unit
5.5
V
2 * 47
+30 %
µF
7.5
25
mΩ
1.0
1.3
µH
55
100
mΩ
0.675
1.3
V
-3
4
%
10
30
mV
20
40
20
40
VTT Mode
-50 %
0.7
Half-current mode
VDD = 3.6 V
VBUCK = 0.7 V
IOUT = 10 mA to 1 A
IOUT = -750 mA to -10 mA
LBUCK = 0.24 µH
dI/dt = 3 A/µs
Full-current mode
VDD = 3.6 V
VBUCK = 0.75 V
IOUT = 10 mA to 1.4 A
IOUT = -10 mA to -1.4 A
LBUCK = 0.24 µH
dI/dt = 3 A/µs
Transient load regulation
VTR_LD
mV
Full-current mode
VDD = 3.6 V
VBUCK = 0.7 V
IOUT = 10 mA to 1.1 A
20
40
20
40
IOUT = -10 mA to -1.1 A
LBUCK = 0.24 µH
dI/dt = 3 A/µs
Full-current mode
VDD = 3.6 V
VBUCK = 0.675 V
IOUT = 10 mA to 900 mA
IOUT = -10 mA to -900 mA
LBUCK = 0.24 µH
dI/dt = 3 A/µs
Half-current mode
Maximum output current
IMAX
VBUCK = 0.7 V
Full-current mode
VBUCK = 0.75
Datasheet
CFR0011-120-00
DA9063L_2v1
37 of 173
-550
1250
mA
-1400
2500
mA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Full-current mode
VBUCK = 0.7 V
Full-current mode
VBUCK = 0.675 V
Min
Max
-1100
2500
-900
2500
tON
VBUCK = 0.75 V
BUCK_SLOWSTART =
disabled
SLEW_RATE =
10 mV/1 µs
BUCK4_ILIM = 1500 mA
Feedback voltage
VDDQ
VDD = VSYS
1.35
Output voltage
VVTTR
IOUT = 0 mA to IVTTR
0.675
Voltage accuracy
VVTTR_ACC
VVTTR_ACC related to VDDQ
input voltage
Output capacitor
COUT
Including voltage and
temperature coefficient
Sink/source current
IOUT
Turn-on time
Typ
0.33
Unit
1.2
ms
2.6
V
VDDQ/2
1.3
V
-1
VDDQ/2
+1
%
-50 %
0.1
+30 %
µF
10
mA
VTTR Buffer
-10
Note 1
If BUCK<x>_MODE = 10 (synchronous) then the buck operates in PFM mode when VBUCK < 0.7 V.
For complete control of the buck mode (PWM versus PFM) use BUCK<x>_MODE = 00.
Note 2
Minimum tolerance 35 mV
Note 3
Measured at COUT, depends on parasitics of PCB and external components when remote sensing
Note 4
Generated from internal 6 MHz oscillator and can be adjusted by ± 10 % via control OSC_FRQ
Note 5
Depends on external components and PCB routing
Datasheet
CFR0011-120-00
DA9063L_2v1
38 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
5.8.3
BUCKMEM
Table 20: BUCKMEM, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Input voltage
VDD
VDD = VSYS
2.8
COUT
Including voltage and
temperature coefficient
Output capacitor
Typ
Max
Unit
5.5
V
+30 %
µF
2 * 22
-50 %
Merged mode
2 * 47
Including wiring parasitics
f > 100 kHz
Output capacitor ESR
Inductor value
LBUCK
Inductor resistance
LESR
Output voltage
VBUCK
COUT = 2 * 22 μF
15
50
COUT = 2 * 47 μF
7.5
25
1.0
1.3
µH
55
100
mΩ
0.8
3.34
V
-3
+3
Including current and
temperature dependence
Programmable in 20 mV
steps
Including static line/load
regulation and voltage
ripple
IOUT = IMAX
0.7
mΩ
Note 1
Output voltage accuracy
%
Excluding static line/load
regulation and voltage
ripple
TA = 25 °C
VDD = 5 V
-2
+2
-4
+4
%
3
mV
VBUCK > 1 V
VDD = 3.6 V
VBUCK = 1.2 V
Transient load regulation
VTR_LD
IOUT = 200 mA / 0.8 * IMAX
dI/dt = 3 A/µs
Note 2
VDD = 3.0 V to 3.6 V
Transient line regulation
VTR_LINE
Output current
IMAX
Current limit
(programmable)
ILIM
Note 3
Quiescent current in
OFF mode
IQ_OFF
Quiescent current in
PWM mode
IQ_ON
IOUT = 0 mA
f
OSC_FRQ = 0000
Switching frequency
Note 4
Switching duty cycle
Output pull-down resistor
Datasheet
CFR0011-120-00
IOUT = 500 mA
tr = tf = 10 µs
0.2
1500
mA
BMEM_ILIM = 0000
-20 %
1500
+20 %
mA
BMEM_ILIM = 1111
-20 %
3000
+20 %
mA
1
µA
D
9
2.85
3
14.5
VBUCK = 0.5 V
DA9063L_2v1
39 of 173
80
mA
3.15
MHz
100
%
200
Ω
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Disabled via
BMEM_PD_DIS
PMOS ON resistance
RPMOS
Including pin and routing
VSYS = 3.6 V
160
mΩ
NMOS ON resistance
RNMOS
Including pin and routing
VSYS = 3.6 V
60
mΩ
Efficiency
Note 5
η
83
%
VDD = 3.6 V
VBUCK = 1.2 V
IOUT = 0.1 mA to 0.7 * IMAX
PFM Mode
Output voltage
VBUCK
Programmable in 20 mV
steps
0.8
Typical automatic mode
switching current
3.34
V
260
mA
Output current
IMAX
300
mA
Current limit
ILIM
600
mA
IOUT = 0 mA
Quiescent current
IQ_PFM
Forced PFM mode
22
25
AUTO mode
30
35
µA
Frequency of operation
f
Efficiency
Note 5
η
0
VDD = 3.6 V
VBUCK = 1.2 V
3
MHz
86
%
IOUT = 10 mA
Note 1
Minimum tolerance 35 mV
Note 2
Measured at COUT, depends on parasitics of PCB and external components when remote sensing
Note 3
The current limits are automatically doubled when BUCKMEM is merged with BUCKIO
Note 4
Generated from internal 6 MHz oscillator and can be adjusted by ± 10 % via control OSC_FRQ
Note 5
Depends on external components and PCB routing
Datasheet
CFR0011-120-00
DA9063L_2v1
40 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
5.8.4
BUCKIO
Table 21: BUCKIO, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Input voltage
VDD
VDD = VSYS
2.8
Output capacitor
COUT
Including voltage and
temperature coefficient
-50%
f > 100 kHz
All caps + track impedance
Output capacitor ESR
Inductor value
LBUCK
Inductor resistance
LESR
Including current and
temperature dependence
0.7
Typ
Max
Unit
5.5
V
2x22
+30%
µF
15
50
mΩ
1.0
1.3
µH
55
100
mΩ
3.34
Note 2
V
PWM Mode
Output voltage
VBUCK
Output voltage
accuracy
Programmable in 20 mV
steps
Note 1
0.8
Including static line/load
regulation and voltage
ripple @ IOUT = IMAX
-3
TA = 25 °C
IOUT = 0
VOUT > 1 V
VDD = 5 V
Note 3
+3
%
-2
Load regulation
transient
VTR_LD
IOUT = 200 mA/0.8 * IMAX
dI/dt = 3 A/µs
Line regulation
transient
VTR_LINE
VDD = 3.0 V to 3.6 V
IOUT = 500 mA
tr = tf = 10 µs
Output current
IMAX
Current limit
(programmable)
ILIM
Quiescent current in
OFF mode
IQ_OFF
Quiescent current in
PWM mode
IQ_ON
Switching frequency
f
2.85
Switching duty cycle
D
14.5
-4
+2
Note 4
+4
%
0.2
3
mV
1500
mA
BIO_ILIM=0000
-20 %
1500
20 %
mA
BIO_ILIM=1111
-20 %
3000
20 %
mA
1
µA
9
3
mA
3.15
MHz
100
%
200
Ω
VOUT = 0.5 V
Output pull-down
resistor
Can be disabled via
BIO_PD_DIS
80
PMOS ON resistance
RPMOS
Including pin and routing
VSYS = 3.6 V
160
mΩ
NMOS ON resistance
RNMOS
Including pin and routing
VSYS = 3.6 V
60
mΩ
87
%
Efficiency
Note 5
Datasheet
CFR0011-120-00
VDD = 3.6 V
η
VBUCK = 1.8 V
IOUT = 0.1 to 0.7 * IMAX
DA9063L_2v1
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Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
PFM Mode
Typical automatic
mode switching
current
260
mA
Output current
IMAX
300
mA
Current limit
ILIM
600
mA
Quiescent current in
PFM mode
IQ_PFM
IOUT = 0
Frequency of
operation
22
0
25
Note 6
µA
3
MHz
VDD = 3.6 V
Efficiency
Note 5
η
VBUCK = 1.8 V
IOUT = 10 mA
90
%
Note 1
If BUCK<x>_MODE = 10 (synchronous) then the buck operates in PFM mode when V BUCK < 0.7 V.
For complete control of the buck mode (PWM versus PFM) use BUCK<x>_MODE = 00.
Note 2
Maximum VDD to 0.7 V
Note 3
Minimum tolerance 35 mV
Note 4
Measured at COUT, depends on parasitics of PCB and external components when remote sensing
Note 5
Depends on external components and PCB routing
Note 6
<35 µA with automatic mode switching enabled
5.8.5
BUCKPERI
Table 22: BUCKPERI, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Input voltage
VDD
VDD = VSYS
2.8
Output capacitor
COUT
Including voltage and
temperature coefficient
-50 %
f > 100 kHz
All caps + track impedance
Output capacitor ESR
Inductor value
LBUCK
Inductor resistance
LESR
Output voltage
VBUCK
Including current and
temperature dependence
Programmable in 20 mV
steps
0.7
Typ
Max
Unit
5.5
V
2 x 22
+30 %
µF
15
50
mΩ
1.0
1.3
µH
55
100
mΩ
3.34
Note 2
V
0.8
Note 1
Including static line/load
regulation and voltage ripple
IOUT = IMAX
Output voltage
accuracy
-3
Note 3
+3
TA = 25 °C
IOUT = 0
VOUT > 1 V
%
-2
+2
VDD = 5 V
Datasheet
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DA9063L
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Parameter
Symbol
Load regulation
transient
VTR_LD
Test Conditions
IOUT = 200 mA/0.8 * IMAX
dI/dt = 3 A/µs
Min
Typ
Max
Unit
-4
Note 4
+4
%
0.2
3
mV
VDD = 3.0 V to 3.6 V
Line regulation
transient
VTR_LINE
Output current
IMAX
Current limit
(programmable)
ILIM
Quiescent current in
OFF mode
IOUT = 500 mA
tr = tf = 10 µs
1500
mA
BPERI_ILIM = 0000
-20%
1500
+20%
mA
BPERI_ILIM = 1111
-20%
3000
+20%
mA
IQ_OFF
1
µA
Quiescent current in
PWM mode
IQ_ON
9
Switching frequency
f
2.85
Switching duty cycle
D
14.5
VOUT = 0.5 V
Can be disabled via
BPERI_PD_DIS
Output pull-down
resistor
3
80
mA
3.15
MHz
100
%
200
Ω
PMOS ON resistance
RPMOS
Including pin and routing
VSYS = 3.6 V
160
mΩ
NMOS ON resistance
RNMOS
Including pin and routing
VSYS = 3.6 V
60
mΩ
Efficiency
Note 5
η
91
%
260
mA
VDD = 3.6 V
VBUCK = 2.86 V
IOUT = 0.1 to 0.7 * IMAX
PFM Mode
Typical automatic
mode switching current
Output current
IMAX
300
mA
Current limit
ILIM
600
mA
Quiescent current in
PFM mode
IQ_PFM
IOUT = 0
22
Frequency of operation
0
25
Note 6
µA
3
MHz
VDD = 3.6 V
Efficiency
Note 5
η
VBUCK = 2.86 V
IOUT = 10 mA
93
%
Note 1
If BUCK<x>_MODE = 10 (synchronous) then the buck operates in PFM mode when V BUCK < 0.7 V.
For complete control of the buck mode (PWM versus PFM) use BUCK<x>_MODE = 00.
Note 2
Maximum VDD to 0.7 V
Note 3
Minimum tolerance 35 mV
Note 4
Measured at COUT, depends on parasitics of PCB and external components when remote sensing
Note 5
Depends on external components and PCB routing
Note 6
<35 µA with automatic mode switching enabled
Datasheet
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5.8.6
Typical Characteristics
Figure 8: BUCKCORE1 Efficiency in AUTO Mode, VOUT = 1.2 V
Figure 9: BUCKCORE2 Efficiency in AUTO Mode, VOUT = 1.2 V
Datasheet
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DA9063L
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Figure 10: BUCKPRO Efficiency in AUTO Mode, VOUT = 1.2 V
Figure 11: BUCKMEM Efficiency in AUTO Mode, VOUT = 1.2 V
Datasheet
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DA9063L
System PMIC for Mobile and Automotive Applications
Figure 12: BUCKIO Efficiency in AUTO Mode, VOUT = 1.8 V
Figure 13: BUCKPERI Efficiency in AUTO Mode, VOUT = 2.86 V
Datasheet
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5.9
General Purpose ADC
Table 23: General Purpose ADC, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
ADC reference voltage
VDD
VDD = VDDCORE
2.45
2.5
2.55
V
1
µA
Off current
ADC resolution
10
bit
ADC integral non
linearity
±2
LSB
± 0.8
LSB
ADC differential non
linearity
ADC absolute accuracy
13
Maximum source
impedance
RSRC
Note 1
Input capacitance
CIN
Total input capacitance
15
mV
120
kΩ
10.5
pF
VSYS minus VDDCORE
VSYS voltage range
Channel 0
ADCIN1 to 3 voltage
range
Channel 1 to 3
Vsys = 3.125*(ADC/255)+2.5
(Auto)
2.5
5.5
V
0
2.5
V
Vsys = 3.125*(ADC/1023)+2.5
(Man)
Vin= (ADC*2.5)/255 (Auto)
Vin= (ADC*2.5)/1023 (Man)
Internal temperature
Sensor voltage range
Channel 4
TJ = -0.398 * ADC +330
0
0.833
V
Regulator monitor
voltage range
Channel 8 to 10
Vreg = (ADC*5)/255
0
5.0
V
Inter channel isolation
Note 2
60
ADCIN1,2 current source
Note 3
-3%
COMP1V2 comparator
level
Channel 2
1.2
Note 1
RSRC is the impedance of the external source the ADC is sampling
Note 2
80 dB for channel A2 (ADC_IN2)
Note 3
Variance guaranteed for 10 µA to 40 µA and up to 2 V output voltage
Datasheet
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V
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5.10 Internal Oscillator
Table 24: Internal Oscillator, TJ = -40 ºC to +125 ºC
Parameter
Symbol
Internal oscillator
frequency
Test Conditions
Min
After trimming
Typ
5.7
6.0
Max
6.3
Unit
MHz
5.11 POR, Reference Generation, and Voltage Supervision
Table 25: POR, Reference Generation and Voltage/Temperature Supervision, TJ = -40 ºC to
+125 ºC
Test
Conditions
Parameter
Symbol
Min
Typ
Deep discharge
lockout lower
threshold
VPOR_LOWER
2.0
V
Deep discharge
lockout upper
threshold
VPOR_UPPER
2.3
V
Under-voltage
lower threshold
VDD_FAULT_LOWER
Note 1
Under-voltage
lower threshold
accuracy
VDD_FAULT_LOWER
Accuracy
±2
%
Under-voltage
upper threshold
VDD_FAULT_UPPER
Note 2
VDD_FAULT_LOWER
+ VDD_HST_ADJ
V
Reference
voltage
VREF
2.5
Max
2.8
-1%
3.25
1.2
+1%
Unit
V
V
VREF decoupling
capacitor
2.2
uF
VLNREF
decoupling
capacitor
2.2
uF
Reference current
resistor
IREF
-1%
200
+1%
kΩ
Note 1
During production VDD_FAULT_LOWER voltage is configured via OTP over the range 2.5 V to 3.25 V
in 50 mV steps.
Note 2
During production the hysteresis between VDD_FAULT_LOWER and VDD_FAULT_UPPER is
configured via OTP over the range 100 mV to 450 mV in 50 mV steps, the hysteresis can be further
changed through control VDD_HYST_ADJ.
5.12 Thermal Supervision
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Thermal warning
TEMP_WARN
Note 1
110
125
140
°C
Thermal shutdown
TEMP_CRIT
Note 1
125
140
155
°C
Thermal POR threshold
TEMP_POR
Note 1
135
150
165
°C
Note 1
Thermal thresholds are non-overlapping.
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DA9063L
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6
Functional Description
The DA9063L provides separate power domains for the host processor, memory, and peripherals to
nable a flexible low-power system design. Multiple low-power modes permit varying combinations of
peripherals to be powered off to conserve battery power. Other system components, such as DRAM
and FLASH memory, RF transceivers, audio codec, and companion chips, are supplied from
optimized regulators designed for dedicated power requirements. The DA9063L power supplies can
be programmed to default voltages via OTP and provide system-configuration flexibility by selecting
the power-up sequence of the regulators and switching converters.
Figure 14: Control Ports and Interface
Datasheet
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6.1
Power Manager IO Ports
The power manager input ports are supplied from either the internal rail VDDCORE or VDD_IO2,
selected via PM_I_V. The output ports are supplied from VDD_IO1 or VDD_IO2, selected via
PM_O_V (nVDD_FAULT, GP_FB1 via GPIO controls). During the initial start-up sequence all power
manager IO ports (with the exception of nRESET and nIRQ) are in a high impedance (tri-state) mode
until they are configured from OTP prior to reaching POWERDOWN mode. Output ports are pushpull except for nRESET and nIRQ, which can also be configured as open-drain via PM_O_TYPE.
6.1.1
On/Off Port (nONKEY)
The nONKEY signal is a wakeup interrupt/event intended to power-on the application supplied by
DA9063L. The level of the debounced signal is provided by status flag nONKEY (asserted at low
level). The nONKEY unit is always enabled so that the application can be powered-on when the
GPIO extender is disabled. The IRQ assertion and wakeup event can be suppressed via the interrupt
mask M_nONKEY.
nONKEY provides four modes of operation selected by field nONKEY_PIN in register CONFIG_I.
Table 26: nONKEY_PIN Settings
nONKEY_PIN
Description
00
An E_nONKEY event is generated when the debounced signal from port nONKEY goes low
(asserting edge). If not masked, an interrupt is signaled to the host via nIRQ (with wakeup
during POWERDOWN mode).
01
If (after powering up from POWERDOWN mode) the debounced signal from port nONKEY is
low after an asserting edge for less than the key-press time (selected by KEY_DELAY, default
2 s), an E_nONKEY event is generated at the releasing edge. If the signal is low for longer
than selected by KEY_DELAY, the DA9063L asserts the event E_nONKEY plus control
nONKEY_LOCK when it reaches the selected key-press time.
10
If (after powering up from POWERDOWN mode) the debounced signal from port nONKEY is
low after an asserting edge for less than the key-press time (selected by KEY_DELAY, default
2 s), an E_nONKEY event is generated at the releasing edge. If the signal is low for longer
than selected by KEY_DELAY, the DA9063L asserts the event E_nONKEY plus control
nONKEY_LOCK when it reaches the selected key-press time and powers down by clearing
control SYSTEM_EN.
11
If (after powering up from POWERDOWN mode) the debounced signal from port nONKEY is
low after an asserting edge for less than the key-press time (selected by KEY_DELAY, default
2 s), an E_nONKEY event is generated at the releasing edge. Control SYSTEM_EN is cleared
and STANDBY asserted, which triggers a partial power down from a short press. If the signal is
low for longer than selected by KEY_DELAY, the DA9063L asserts the event E_nONKEY plus
control nONKEY_LOCK and clear SYSTEM_EN plus STANDBY when it reaches the selected
pressing time (powers down to full POWERDOWN from a long press).
For nONKEY_PIN settings other than ‘00’, the wakeup is not suppressed by an asserted
M_nONKEY. With an asserted nONKEY_LOCK, the wakeup is only executed if the debounced
nONKEY signal is asserted for more than the key-press time (selected by KEY_DELAY, default 2 s).
This behaves similarly to a keypad lock since any short (unintended) pressing of nONKEY does not
wake the application. If the application also has wakeup from a short nONKEY press, the host has to
clear nONKEY_LOCK before entering POWERDOWN mode. In mode ‘10’ when nONKEY key press
is longer than the time selected by KEY_DELAY, SYSTEM_EN is re-asserted in mode ‘11’.
SYSTEM_EN is re-asserted from any consecutive pressing of nONKEY. nONKEY_LOCK is
automatically cleared by the DA9063L when powering up from POWERDOWN mode.
POWERDOWN mode is described in Section 6.2.2.
Note
During DELIVERY mode, the functionality of nONKEY is restricted to a termination of this mode. To enable this
feature, the pull-up resistor of nONKEY has to be connected to VSYS. Asserting nONKEY stops the DELIVERY
mode and triggers a start-up of the DA9063L.
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6.1.2
Wakeup Port (CHG_WAKE)
The CHG_WAKE signal is a rising edge sensitive, wakeup interrupt/event intended to wake the
DA9063L from an event on the companion charger (for example, supply insertion). The CHG_WAKE
port is always enabled so that the application can be powered-on with a disabled GPIO extender.
The IRQ assertion and wakeup event can be suppressed via the interrupt mask M_WAKE. During
DELIVERY mode, asserting CHG_WAKE terminates this mode.
6.1.3
Hardware Reset (nOFF, nSHUTDOWN, nONKEY, GPIO14, GPIO15,
WATCHDOG)
The DA9063L nOFF port is an active-low input (no debouncing) typically initiated by an asserted
error detection line. It asserts nSHUTDOWN in the fault register. The sequencer asserts port
nRESET, and all domains and supplies of the DA9063L except LDOCORE are disabled in a fast
emergency shutdown.
The DA9063L nSHUTDOWN port is an active-low input typically asserted from a host processor (or a
push button switch). It asserts nSHUTDOWN in the fault register. The sequencer asserts port
nRESET and then powers down all domains in reverse sequencer order down to slot 0 and all
supplies of the DA9063L except LDOCORE are disabled. HOST_SD_MODE determines if normal
power sequence timing or a fast shutdown is implemented.
The DA9063L includes a third hardware reset trigger that follows the debounced nONKEY signal
after being asserted for a period greater than KEY_DELAY + SHUT_DELAY. The same can be
achieved by a long parallel connection of GPI14 and GPI15 to ground. The long nONKEY shutdown
and GPIO14/15 shutdown are enabled by the power manager control register bits nONKEY_SD and
GPI14_15_SD.
If the hardware reset was initiated by a (debounced) press of nONKEY (or GPIO14 and GPIO15
together) longer than SD_DELAY, the DA9063L initially only asserts control bit KEY_RESET in the
fault register and signals a non-maskable interrupt allowing the host to clear the armed reset
sequence within 1 s. If the host does not clear KEY_RESET then a shutdown to RESET mode is
executed. KEY_SD_MODE determines if normal power sequence timing or a fast shutdown is
implemented.
The DA9063L then waits for a valid wakeup event (for example, a key press) or starts the power
sequencer automatically if AUTO_BOOT is configured.
If the WATCHDOG has been disabled, this hardware reset can be used to turn off the application in
the event of a software lock-up without removing the battery. This type of reset should only be used
for severe hardware or software problems as it will completely reset the processor and could result in
data loss.
6.1.4
Reset Output (nRESET)
The nRESET signal is an active-low output signal from DA9063L to the host processor that can
either be push-pull or open drain (selected via PM_O_TYPE), which tells the host to enter the reset
state. nRESET is always asserted at the beginning of a DA9063L cold start from NO-POWER and
DELIVERY modes. It is asserted in ACTIVE mode before the DA9063L starts powering down to
RESET mode (triggered from user, host, or an error condition detected by the DA9063L). nRESET
may also be asserted (depending on nRES_MODE setting) as a soft reset before the sequencer
starts powering down without progressing to RESET mode.
An assertion of nRESET from voltage supervised regulators being out-of-range can be enabled via
control MON_RES (minimum assertion time 1 ms).
After being asserted, nRESET remains low until the reset timer has been started from the selected
trigger signal and expires. The reset release timer trigger signal can be selected via RESET_EVENT
to be EXT_WAKEUP, SYS_UP, PWR_UP, or leaving PMIC RESET state. The expiry time can be
configured via RESET_TIMER from 1 ms to 1 s.
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6.1.5
System Enable (SYS_EN)
SYS_EN is an input signal from the host processor to the DA9063L that enables the regulators in
domain SYSTEM. The feature is enabled using GPIO8_PIN and configured as active-low or -high by
GPIO8_TYPE. It asserts SYSTEM_EN and simultaneously generates an IRQ. It also triggers a
wakeup event in POWERDOWN mode if enabled via GPIO8_WEN. De-asserting SYS_EN (changing
from active to passive state) clears control SYSTEM_EN which triggers a power down sequence into
hibernate/standby mode (without IRQ assertion or wakeup event trigger). By setting nRES_MODE,
the port SYS_EN can be used as a soft reset input with the assertion of nRESET before powering
down. With the exception of supplies that have the xxxx_CONF control bit asserted, all regulators in
power domains POWER1, POWER, and SYSTEM are sequentially disabled in reverse order.
Regulators with the <x>_CONF bit set remain on but change the active voltage control registers from
V<x>_A to V<x>_B (if V<x>_B is not already selected).
The control register bit SYSTEM_EN can also be used to power down domain SYSTEM by a
software command. It can be read and changed via the control interfaces and can be initialized from
OTP when leaving POWERDOWN mode. The DA9063L will not process any changes on port
SYS_EN or register control SYSTEM_EN until the sequencer has stopped processing IDs.
6.1.6
Power Enable (PWR_EN)
PWR_EN is an input signal from the host processor to the DA9063L. The input signal can be
configured as active-high or -low via GPIO9_TYPE, and to trigger a wakeup event from
POWERDOWN mode if configured via GPIO9_WEN. Initialization, IRQ assertion and the direct
control via register bit POWER_EN is similar to the function of SYS_EN in domain SYSTEM as
described in Section 6.1.5. To ensure correct sequencing, SYSTEM_EN (SYS_EN) must be active
before asserting PWR_EN/POWER_EN. When de-asserting PWR_EN/POWER_EN, the sequencer
sequentially powers down POWER1 and POWER domains.
6.1.7
Power1 Enable (PWR1_EN)
PWR1_EN is an input signal from a host to the DA9063L. The input signal can be configured as
active-high or -low via GPIO10_TYPE, and to trigger a wakeup event in POWERDOWN mode if
enabled via GPIO10_WEN. Initialization, IRQ assertion and the direct control via register bit
POWER1_EN is similar to the function of SYS_EN in domain SYSTEM as described in Section 6.1.5.
POWER1 is a general purpose power domain.
6.1.8
GP_FB1, General Purpose Signal 1 (EXT_WAKEUP/READY)
This port supports two different modes selected by the control PM_FB1_PIN.
Table 27: PM_FB1_PIN Settings
PM_FB1_PIN
Description
0
EXT_WAKEUP. This output signal to the host processor indicates a valid wakeup event during
POWERDOWN mode. External signals that can trigger wakeup events are debounced before
the EXT_WAKEUP signal is asserted. EXT_WAKEUP is released when register control
SYSTEM_EN is asserted (minimum pulse duration = 500 µs).
1
READY. The READY signal indicates on-going DVC or power sequencer activities. The
READY signal is asserted (typically active-low) from the DA9063L power sequencer when the
processing of IDs commences, and is released when the target power state (final sequencer
slot) has been reached. READY is also asserted during DVC voltage transitions.
The active level is configured via the control GPIO13_MODE. The logical threshold voltage is
selected by GPIO13_TYPE.
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6.1.9
GP_FB2, General Purpose Signal 2 (PWR_OK/KEEP_ACT)
The GP_FB2 port supports two different modes selected by the control PM_FB2_PIN.
Table 28: PM_FB2_PIN Settings
PM_FB2_PIN
Description
0
PWR_OK. In this mode the port is a regulator status indicator. The port is an open drain output
asserted if none of the selected regulators are out-of-range. The regulator monitoring via ADC
must be enabled and all regulators to be monitored must have supervision enabled with the
selected persistence, and mask bit M_REG_UVOV must be asserted. In case at least one of
the supervised regulators is out-of-range or regulator monitoring is disabled, the PWR_OK
signal is low.
1
KEEP_ACT. If enabled, every assertion of the port (rising to active level edge sensitive) sets
the watchdog trigger, similar to writing to bit WATCHDOG via the power manager bus. The
host has to release KEEP_ACT before the next assertion during continuous watchdog
supervision (if enabled). The minimum assertion and de-assertion cycle time is 150 µs.
The output active level (and driver type) can be configured via GP_FB2_TYPE.
Alternatively, with BCORE_MERGE = 1, FB in register BCORE1_CFG set to 0b000 and
MERGE_SENSE = 0, the GP_FB2 pin becomes a voltage feedback signal for BUCKCORE.
6.1.10
GP_FB3, General Purpose Signal 3 (nVIB_BRAKE)
The GP_FB3 port supports two different modes selected by the control PM_FB3_PIN.
Table 29: PM_FB3_PIN Settings
PM_FB3_PIN
Description
0
nVIB_BRAKE disabled.
1
nVIB_BRAKE enabled. If LDO8 is configured as a vibrator motor driver, GP_FB3 can be
configured to provide an external brake signal. The vibrator motor can be started or stopped by
a change in the level on the nVIB_BRAKE signal. If the port is not used as a brake command,
the vibration motor runs continuously at the speed configured by VIB_SET.
GP_FB3_TYPE defines the active level.
6.1.11
Supply Rail Fault (nVDD_FAULT)
nVDD_FAULT is a signal to the host processor to indicate a supply voltage (VSYS) low status.
Asserting nVDD_FAULT indicates that the main supply input voltage is low
(VSYS < VDD_FAULT_UPPER) and therefore informs the host processor that the power will shut
down soon. The event control E_VDD_WARN is asserted and the nIRQ line is asserted (if not
masked). During POWER_DOWN mode a wakeup is generated. After that the processor may
operate for a limited time from the remaining battery capacity or the processor may enter a standby
mode. As long as VSYS does not recover, the host can re-enable the nIRQ line by asserting
M_VDD_WARN or clearing E_VDD_WARN. The DA9063L starts a fault power down sequence. If
VSYS drops below VDD_FAULT_LOWER, the DA9063L enters RESET mode. The
VDD_FAULT_LOWER threshold and the hysteresis on VDD_FAULT_UPPER are OTP configurable.
The nVDDFAULT port can alternatively be controlled by the state of the debounced VSYS monitor
inside the ADC (selected via GPIO12_PIN). The signal is asserted when the ADC detects three
consecutive results below the configurable threshold VSYS_MON (it becomes passive after three
consecutive results above VSYS_MON). This provides a variable power good signal to trigger boot
activities on external ICs.
The active level/debounce, wakeup, and IO supply voltage can be selected via the controls
GPIO12_MODE, GPIO12_WEN and GPIO12_TYPE, respectively.
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6.1.12
Interrupt Request (nIRQ)
The nIRQ is an output signal that can either be push-pull or open drain (selected via PM_O_TYPE).
If an active high IRQ signal is required, it can be achieved by asserting control IRQ_TYPE
(recommended for push-pull mode). This port indicates that an interrupt-causing event has occurred
and that event/status information is available in the EVENT and STATUS registers. Events are
triggered by a status change at the monitored signals. When an event bit is set, the nIRQ signal is
asserted (unless this interrupt is masked by a bit in the IRQ mask register). The nIRQ is not released
until all event registers with asserted bits have been read and cleared. New events that occur during
reading an event register are held until the event register is cleared, ensuring that the host processor
does not miss them. The same happens to all events occurring while the sequencer processes time
slots (that is, the generation of interrupts is delayed).
6.1.13
IO Supply Voltage (VDD_IO1 and VDD_IO2)
VDD_IO1 and VDD_IO2 are two independent IO supply rail inputs of the DA9063L that can be
individually assigned to the power manager interfaces (see control bit GPI_V), power manager IOs
(see control bits PM_O_V, PM_I_V) and GPIOs (bits GPIOx_TYPE). The rail assignment determines
the IO voltage levels and logical thresholds, see Section 5.4. The selection of the supply rail for
GPIOs is also partially used for their alternate functions, see Table 3. As an example, GPIO13_TYPE
determines the supply rail when this pin is configured as the GP_FB1 output.
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6.2
6.2.1
Operating Modes
ACTIVE Mode
A running application is typically in ACTIVE mode. The DA9063L transitions to ACTIVE mode after
the host processor performs at least one initial ‘alive’ watchdog write (or alternatively an initial
assertion of the KEEP_ACT port) inside the target time window. If the WATCHDOG function is
disabled by setting TWDSCALE to zero, the DA9063L transitions to ACTIVE mode when all of the
sequencer IDs in the POWER domain are complete.
In ACTIVE mode, the PMIC core functions as LDOCORE and internal oscillator are running.
Typically additional features are enabled, such as the GPADC. The DA9063L can send interrupt
requests to the host via a dedicated interrupt port (nIRQ) and status information can be read from the
host processor via the power manager interface. Temperature and voltages inside and outside the
DA9063L can be monitored and fault conditions can be flagged to the host processor.
6.2.2
POWERDOWN Mode
The DA9063L is in POWERDOWN mode when the power domain SYSTEM is disabled (even
partially). This can be achieved when progressing from NO-POWER/DELIVERY mode or by
returning from ACTIVE mode. A return from ACTIVE mode is initiated by low power mode
instructions from the host (for example, releasing signal SYS_EN or clearing register bit
SYSTEM_EN), from the user by asserting nONKEY (if nONKEY_PIN=‘1x’) or as an interim state
during a shutdown to RESET mode.
During POWERDOWN mode LDOCORE, VREF reference voltage, the nONKEY pin, CHG_WAKE
port, and the calendar counter are active. Dedicated power supplies can be kept enabled during
POWERDOWN mode if their xxx_CONF bits are asserted (supply voltage settings are taken from the
respective Vxxx_B registers).
GPIO ports, the GPADC, and the control interfaces also remain active in POWERDOWN mode if not
configured otherwise via register PD_DIS. Disabling these blocks during POWERDOWN mode
reduces quiescent current, especially if all blocks that require an oscillator clock are disabled
(HS2WIRE_DIS, GPADC_PAUSE,GPI_DIS, PMCONT_DIS). If required, the application supervision
by the WATCHDOG timer can be continued in POWERDOWN mode via WATCHDOG_PD. If the
host will not communicate with the DA9063L during POWERDOWN mode, then the control interfaces
may also be temporarily disabled (see controls HS2WIRE_DIS).
If the sequencer pointer has stopped at position PART_DOWN (inside domain SYSTEM) it results in
a partial power down. When on the way down the sequencer pointer reaches position 0, relevant
regulators with corresponding position 0 IDs that have cleared control
Bxxx_CONF/LDOxx_CONF/xxx_SW_CONF are disabled, otherwise the regulator voltages change to
the values defined in VBxxx_B/VLDOxx_B when control DEF_SUPPLY is asserted. When
DEF_SUPPLY is released, slot 0 is not processed by the sequencer, hence regulators with an ID
pointing to slot 0 remain unchanged. Following the next wakeup event Vxxx_A voltage levels and the
sequencer power domain controls/timers are set to their default OTP values if OTPREAD_EN is
asserted.
When nONKEY_SD is asserted and the key is continuously pressed for longer than the time selected
by KEY_DELAY + SHUT_DELAY, it asserts KEY_RESET to indicate that the transition to RESET
mode was triggered by a long nONKEY, see Section 6.1.1.
When the device is in POWERDOWN or RESET mode, asserting ECO_MODE enables low power.
This is achieved internally by using a pulsed mode for VDDCORE and reference voltage generation.
This maintains basic functionality but full parametric compliance is no longer guaranteed (as it affects
ADC precision, buck performance, LDO voltage resolution, and so on). The pulsed mode is driven
from a (free-running) low-power on-chip oscillator.
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6.2.3
RESET Mode
The DA9063L is in RESET mode when a complete application shutdown is required. The RESET
mode can be triggered by the user, a host processor or by an action on the DA9063L, as outlined
below:
● By the user:
○ from a long press of nONKEY (interruptible by host)
○ from a long parallel assertion of GPIO14 and GPIO15 (interruptible by host)
● By pressing a reset switch connected to port nSHUTDOWN (non-interruptible)
● Forced from the host processor (non-interruptible) by:
○ asserting port nSHUTDOWN (falling edge)
○ writing to register bit SHUTDOWN
● By an error condition that forces a RESET mode (non-interruptible):
○ no WATCHDOG write (KEEP_ACT signal assertion) from the host inside the watchdog time
window (if watchdog was enabled)
○ an under-voltage detected at VSYS (VSYS < VDD_FAULT_LOWER)
○ an internal die over-temperature
● Forced by the error detection line (non-interruptible):
○ by asserting port nOFF (falling edge)
The controls INT_SD_MODE, HOST_SD_MODE, and KEY_SD_MODE can be used to individually
configure the shutdown sequences from an internal fault, host or user trigger. In each case, the
sequence can be configured to implement either the reverse timing of the power-up sequence or an
immediate transition into RESET mode, skipping any delay from the sequencer or dummy slot timers.
Asserting nOFF always triggers a fast emergency shutdown. To allow the host to determine the
reason for the reset, the source is recorded in FAULT_LOG (as either the KEY_RESET or
nSHUT_DOWN bit). The host processor clears FAULT_LOG by writing asserted bits with a 1.
Note
● KEY_SD_MODE = 1 enables a full POR following a long press of ONKEY or a long assertion of GPIO14 and
15.
● In the case of an aborted OTP read, the DA9063L enters RESET mode without asserting any bits in
FAULT_LOG.
A shutdown to RESET mode begins with the DA9063L asserting the nRESET port. Then domain
SYSTEM is completely powered down (sequencer position 0) at which time the device has reached
RESET mode: this is a low current consumption state. The only circuits in RESET mode remaining
active are LDOCORE (at a reduced level of 2.2 V), the control interfaces and GPIOs, the VREF
reference, and the comparators for over-temperature and VSYS level. Regulators and blocks are
automatically disabled to avoid draining the battery. During the DA9063L RESET mode, the host
processor can be held in a RESET state via port nRESET.
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When entering RESET mode, all user and system events are cleared. When leaving RESET mode,
the complete DA9063L register configuration is reloaded from OTP (with the exception of
AUTO_BOOT in case of a VDD_START fault).
Note
FAULT_LOG, GP_ID_10 to GP_ID_19 and other non-OTP loaded registers remain unchanged when leaving
RESET mode.
nRESET is always asserted low after a cold start from NO-POWER or DELIVERY mode and can also be
asserted (depending on configuration of nRES_MODE) before the sequencer starts to power down towards
POWERDOWN mode.
Some reset conditions such as shutdown via register write, watchdog error, or over-temperature
automatically expire (that is, are automatically cleared by the device as it shuts down). Other RESET
triggers such as via port nOFF or nSHUTDOWN need to be released before the DA9063L can move
from RESET to POWERDOWN mode. In the case that the application requires regulators to
discharge in advance of a consecutive power-up sequence, a minimum duration of the RESET mode
can be selected via RESET_DUR.
If the reset was initiated by user action from a long nONKEY key-press (or GPI14 and GPI15), bit
KEY_RESET is set and the nIRQ port asserted. After 1 s the shutdown sequence is started, unless
this is inhibited by the host clearing KEY_RESET within this 1 s period (by writing a 1 to the related
bit in register FAULT_LOG). When the RESET condition has been removed, the DA9063L requires
the presence of a good supply (VSYS > VDD_FAULT_UPPER and able to provide enough power)
before it can start-up again and move into POWERDOWN mode.
6.2.4
DELIVERY Mode
The DELIVERY mode provides the lowest possible quiescent current, allowing connected precharged batteries to maintain charge prior to the end-user starting the device for the first time. During
DELIVERY mode, only the nONKEY, CHG_WAKE, and the VDDREF detection circuitry is enabled.
6.2.5
NO-POWER Mode
The DA9063L enters NO-POWER mode when VDDCORE drops below the VPOR_LOWER
threshold. As long as VDDCORE stays below the VPOR_UPPER threshold, an internal power-onreset (nPOR) signal remains asserted. In this mode, only the VDDCORE threshold comparator is
active. This comparator simply checks for a condition that allows the DA9063L to turn on again.
When a good supply is subsequently available again on VDDREF (> 2.4 V), VDDCORE is able to rise
above VPOR_UPPER and the DA9063L leaves NO-POWER mode.
6.2.6
Power Commander Mode
This is a special mode for evaluation and configuration development. In Power Commander mode,
the DA9063L is configured to load the control register default values from the HS 2-WIRE interface,
instead of from the OTP cells, so that un-programmed DA9063L samples will power up, allowing
evaluation and verification of a proposed user configuration.
Power Commander mode is enabled by connecting TP to a 3.3 V to 5.0 V voltage.
Note
In Power Commander mode, GPI14 and 15 are configured for HS 2-WIRE interface operation (with VDDCORE
as the supply) and GPO12 is configured as an output for nVDD_FAULT. Any register writes or OTP loads which
can change this configuration are ignored until DA9063L has exited from Power Commander mode.
After leaving the POR state, the DA9063L informs the system that it is waiting for a programming
sequence by driving nVDD_FAULT low. The software running on the PC monitors nVDD_FAULT and
responds by downloading the values into the configuration registers within DA9063L. nVDD_FAULT
is automatically released after the download is complete.
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There are two programming sequences performed in Power Commander mode. The first takes place
between RESET and POWERDOWN mode and the second between POWERDOWN and SYSTEM
mode.
Note
To correctly configure DA9063L, addresses 0x0A to 0x36, 0x82 to 0xCF, and 0x104 to 0x12E should be
programmed during the first sequence. Registers 0x0E, 0x82, and 0xA3 to 0xB3 should be programmed during
the second sequence.
When the first programming sequence is complete, DA9063L will be in POWERDOWN mode.
Progression from this mode is determined by the values programmed for SYS_EN and
AUTO_BOOT. If DA9063L has been directed to progress from POWERDOWN mode then it drives
pin nVDD_FAULT low for a second time to request that the SW performs the second programming
sequence.
Once the second programming sequence is complete, the progress of the power-up sequence is
controlled by the values loaded during the programming sequence.
The programmed configuration can be identified by reading the fuse register CONFIG_ID.
Note
During Power Commander mode, the fault detection status bit VDD_FAULT and the level at the related pin
nVDD-FAULT do not match and do not indicate a low voltage level at VDDOUT. An enabled shutdown from a
5 s assertion of GPIO14/15 will be ignored during POWER Commander mode. Any nIRQ and event assertion
when accessing the HS 2-WIRE interface (E_GPI14) is suppressed in this mode.
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6.3
6.3.1
Start-Up from NO-POWER Mode
Power-On-Reset (nPOR)
The DA9063L generates an internal power-on-reset nPOR (active low) following the initial connection
of a supply to VDDREF .
While the VDDCORE voltage is below the threshold VPOR_UPPER, the internal signal nPOR is
driven low and the DA9063L will not start-up. This is NO-POWER mode. When the VDDCORE
voltage rises above VPOR_UPPER, the following occur:
●
●
●
●
●
The nPOR is driven high (flagged by the POR bit being set in register FAULT_LOG).
The oscillator is enabled.
The VREF reference is enabled.
The complete OTP block is read and stored in the register bank.
The DA9063L progresses into POWERDOWN mode.
From POWERDOWN mode, the DA9063L continues through the power-up sequence if either:
● the power domain SYSTEM was enabled by the input port, SYS_EN, or,
● the power domain SYSTEM was enabled in OTP settings and AUTO_BOOT was enabled.
With AUTO_BOOT disabled and the power domain SYSTEM enabled in OTP settings, a nonsuppressed wakeup event allows the DA9063L to continue through the power-up sequence.
6.4
Exiting Reset Mode and Application Wakeup
DA9063L offers two types of wakeup event, user events and system events (see Table 30). Nonsuppressed user events (for example, nONKEY, CHG_WAKE or from GPIOs) are always processed
and trigger a wakeup.
To exit RESET mode, the DA9063L requires either VSYS to rise above the threshold
VDD_FAULT_UPPER, or a user event. However, if the previous power-up sequence terminated with
a shutdown to RESET mode that was caused by a VDD_START fault, VSYS must rise instead above
the higher threshold of VDD_FAULT_UPPER + 250 mV. If the consecutive power-up sequence is
also terminated with an under-voltage error, this threshold increases further to
VDD_FAULT_UPPER + 500 mV. From then on, AUTO_BOOT and wakeup from non-user events are
temporarily disabled. AUTO_BOOT and wakeup from non-user events are re-enabled after the
application has successfully powered up to ACTIVE mode for a time > 16 s: this also resets the startup threshold (to VDD_FAULT_UPPER + 0 mV).
During a VDD_START fault with VSYS > ~3.7 V, the DA9063L requires a user event to leave the
RESET mode. Until the host has been booted, an OTP-enabled flashing LED may be driven from
GPIO11, 14, or 15 to indicate to the user that the device is supplied with (insufficient) power. When
CHG_WAKE is connected to a charger, the VDDSTART-triggered LED flashing continues as long as
an external supply is charging the battery. The flashing LED can be configured via controls
RESET_BLINKING, BLINK_DUR, and BLINK_FRQ. After the application is running, the blinking LED
can be stopped via a host register write.
Wakeup events can be individually suppressed by setting the related nIRQ mask bit. When
nONKEY_LOCK is asserted a wakeup requires the debounced signal from nONKEY to be low for a
time longer than the configured KEY_DELAY. It is not recommended to mask system events, instead
disable the unwanted event sources (for example, GPIs, GPADC, 1.2 V comparator). The wakeup
from GPIOs (or selected alternate features that use a shared GPI event) has to be enabled via
GPI<x>_WEN.
After a valid wakeup condition is detected, a subset of the OTP configuration is read and the values
are used to reconfigure the regulator voltage registers Vxxx_A, the power domain enable settings (if
not suppressed via SYSTEM_EN_RD) and the sequencer timer.
DA9063L then asserts the EXT_WAKEUP signal towards the host processors and configures
regulators with an ID pointing at slot 0 to their target state. If the power domains are not pre-enabled
from OTP settings, the host processor must control further application start-up (via the power domain
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enable ports, SYS_EN, PWR_EN and PWR1_EN). Alternatively the DA9063L continues powering-up
the OTP-enabled domains via the power domain sequencer, but the power sequencer will not start to
enable the system supplies unless SYSTEM_EN is asserted.
Progression to ACTIVE mode requires assertion of POWER_EN from the host via port PWR_EN, a
register write, or enabled in OTP. After starting the WATCHDOG timer the host processor must
assert the WATCHDOG bit within the configured time window. If this does not happen, the statemachine terminates ACTIVE mode and returns to RESET mode.
Table 30: Wakeup Events
Signal : Event
Wakeup
VSYS monitor : E_VDD_MON
User
Event
System
Event
IRQ
X
X
X
VDD_FAULT pre-warning : E_VDD_WARN
X
X
X
Voltage comparator flipped : E_COMP1V2
X
X
X
Pressed On key : E_nONKEY
X
X
X
Wakeup from companion charger : E_WAKE
X
X
X
LDO over current detect : E_LDO_LIM
X
X
X
Regulator voltage out-of-range : E_REG_UVOV
X
X
X
Critical junction temperature : E_TEMP
X
X
X
Power sequencing ready : E_SEQ_RDY
X
X
Voltage ramping ready : E_DVC_RDY
X
X
Manual ADC result ready : E_ADC_RDY
X
X
GPIOs passive to active transition : E_GPIx
X
ADC 1, 2, 3 threshold : via GPI0, 1, 2
X
X
X
SYS_EN, PWR_EN, PWR1_EN (passive to active transition) :
via GPIO8, 9, 10
X
X
X
HS 2-WIRE interface : via GPIO14
X
X
X
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6.5
Power Supply Sequencer
The DA9063L power supplies are enabled with a sequencer that contains a programmable step
timer, a programmable ID array of slot pointers, and four predefined pointers (SYSTEM_END,
POWER_END, MAX_COUNT, and PART_DOWN), as illustrated by Figure 15. The sequencer is
able to control up to 32 IDs (6 bucks, 5 LDOs, 5 external FET/IC controls, a Wait ID (GPI10), and an
ID to activate power down settings), which can be grouped to three power domains.
The power domains have configurable size and their borders are described by the location pointers
SYSTEM_END, POWER_END, and MAX_COUNT.
The lowest level power domain SYSTEM starts at step 1 and ends at the step that is described by
the location pointer SYSTEM_END. The second level domain POWER starts at the successive step
and ends at POWER_END. The third level domain POWER1 starts at the consecutive step and ends
at MAX_COUNT. The values of pointer SYSTEM_END, POWER_END, and MAX_COUNT are
predefined in OTP registers and should be configured as SYSTEM_END < POWER_END <
MAX_COUNT.
The domain system can be thought of as the minimum set of supplies required to enable the core of
the target system.
If the control OTPREAD_EN is enabled, the regulator voltages, sequence domain enables (if not
suppressed via control SYSTEM_EN_RD), and the sequence timer are reset to their OTP values
during the transition from power down to system.
The second level domain POWER includes supplies that are required on top to trigger the application
and set the DA9063L into ACTIVE mode. POWER1 can be understood as one of the POWER
domains that can be used for further sequenced control of supply blocks during ACTIVE mode (for
example, for a sub-application like WLAN or a baseband chipset).
Note
It is recommended that the system is configured to reach ACTIVE mode before running applications.
6.5.1
Powering Up
All buck converters and LDOs of DA9063L have a unique sequencer ID. The power-up sequence is
defined by an OTP register bank that contains a series of supplies (and other features), each of
which point to a selected sequencer time slot. Several supplies can point to the same time slot which
is therefore enabled in parallel by the sequencer. Time slots that have no IDs pointing at them are
dummy steps that do nothing but insert a configurable time delay (marked in Figure 15 as D).
Supplies/IDs that do not point to a sequencer time slot between 1 and MAX_COUNT are not enabled
by the power sequencer but can be controlled individually by the host (via the power manager
interface).
During power-up, the sequencer starts at slot 0. If DEF_SUPPLY is asserted, it checks all regulators
for an ID pointing to slot 0. Cleared LDOxx_AUTO/ BUCKxxx_AUTO/xxx_SW_AUTO bits are
configured by setting the related control Bxxx_CONF/LDOxx_CONF/xxx_SW_CONF, otherwise the
regulator is enabled. To minimize inrush currents, it is recommended to enable no more than a single
default regulator via DEF_SUPPLY. During power-up, the regulator output voltage is taken from the
VBxxx_A/VLDOxx_A registers. During power-down, regulators with a cleared control in
Bxxx_CONF/LDOxx_CONF/ xxx_SW_CONF are disabled, otherwise the regulator voltage is
changed to VBxxx_B/VLDOxx_B when entering slot 0. When DEF_SUPPLY is released, slot 0 is not
processed by the sequencer (regulators with an ID pointing at slot 0 remain unchanged).
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The progression of the sequencer to slot 1 is dependent on certain conditions:
● If AUTO_BOOT and SYSTEM_EN are both asserted (via port, by register write or in OTP), the
sequencer asserts the READY signal (if GP_FB1 is so configured) and then continues by
processing slot 1.
● If AUTO_BOOT is not asserted, the sequencer remains in a holding start state, waiting for either:
○ the assertion of SYSTEM_EN, or,
○ any other wakeup event if SYSTEM_EN is already enabled.
All supplies (and other sequenced features) that are pointing at slot 1 are then processed. This is
similar to the processing of slot 0 with the exception that DEF_SUPPLY has no effect on slots apart
from slot 0. From slot 1, the sequencer progresses until it reaches the position of pointer
SYSTEM_END. At this point, all IDs of the first power domain SYSTEM are enabled and, if
POWER_EN is not asserted, the DA9063L releases the READY signal (in combination with optional
assertion of E_SEQ_RDY).
Figure 15: Assignment of Actions to Sequencer Slot IDs
Table 31: Power Sequencer Controlled Actions
Datasheet
CFR0011-120-00
Action
Sequencer Time Slot
Control LDO3
LDO3_STEP
Control LDO7
LDO7_STEP
Control LDO8
LDO8_STEP
Control LDO9
LDO9_STEP
Control LDO11
LDO11_STEP
Control BUCKCORE1
BUCKCORE1_STEP
Control BUCKCORE2
BUCKCORE2_STEP
Control BUCKPRO
BUCKPRO_STEP
Control BUCKIO
BUCK_IO_STEP
Control BUCKMEM
BUCKMEM_STEP
Control BUCKPERI
BUCKPERI_STEP
Assert/Release GPIO2
GP_RISE1_STEP
Release/Assert GPIO2
GP_FALL1_STEP
Assert/Release GPIO7
GP_RISE2_STEP
Release/Assert GPIO7
GP_FALL2_STEP
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Action
Sequencer Time Slot
Assert/Release GPIO8
GP_RISE3_STEP
Release/Assert GPIO8
GP_FALL3_STEP
Assert/Release GPIO9
GP_RISE4_STEP
Release/Assert GPIO9
GP_FALL4_STEP
Assert/Release GPIO11
GP_RISE5_STEP
Release/Assert GPIO11
GP_FALL5_STEP
Wait for active state at GPI 10
WAIT_STEP
PD_DIS
PD_DIS_STEP
On completion of domain SYSTEM, the sequencer waits for POWER_EN to be asserted (via the
PWR_EN port, a register write or in OTP). When POWER_EN is asserted, the signal READY is
asserted (if not already asserted) and regulators/IDs of domain POWER are enabled sequentially.
The sequencer stops at the position of pointer POWER_END. At this point it also: releases the
READY signal (if POWER1_EN is not asserted); optionally asserts E_SEQ_RDY; enables the initial
WATCHDOG timer and waits for the first associated alive feedback from the host processor. After
this, the start-up of the DA9063L progresses into ACTIVE mode.
A third power domain, POWER1, can be enabled via POWER1_EN (asserted by PWR1_EN port,
register write or in OTP). It enables all consecutive IDs until the position of pointer MAX_COUNT has
been reached. The READY signal is asserted as long as IDs are processed (if enabled) and
E_SEQ_RDY is asserted when reaching MAX_COUNT.
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6.5.2
Power-Up Timing
nPOR_UPPER
VDDREF
VDD_FAULT_UPPER
VSYS
Registers Loaded From OTP
VDDCORE
nVDD_FAULT
nONKEY
Debouncing
(10ms
default)
EXT_WAKEUP
SYSTEM_EN
POWER_EN
POWER1_EN
Wait for SYS_EN
POWER-UP
SEQ1+SEQ2+SEQ3=15step
Wait for PWR_EN
SEQ1
Wait for PWR1_EN
SEQ2
SEQ3
SYS_UP (int)
PWR_UP (int)
1ms to 1s
nRESET
Start Reset Time
Figure 16: Power-Up Timing
6.5.3
Programmable Slot Delays
The delay between the slots of a sequence is controlled via the programmable value of SEQ_TIME in
register SEQ_TIMER. This has a default delay of 128 µs per slot (min. 32 µs, max. 8 ms). The delay
time between individual supplies can be extended by leaving a consecutive slot(s) with no IDs
pointing to it: these are dummy slots. The dummy slots have an independent delay configured by
SEQ_DUMMY. These delay times, in register SEQ_TIMER, are (re-)loaded from OTP every time
domain SYSTEM begins to power-up.
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6.5.4
Powering Down
When the DA9063L is powering down, the sequencer disables the supplies in reverse order and
timing, asserts READY during sequencing, and triggers E_SEQ_RDY on reaching the target
sequencer slot. Supplies that are configured to stay on (LDO<x>_CONF, B<x>_CONF,
xxx_SW_CONF bit is set) are not disabled and are configured with the voltage setting from register
VB<x>_B/VLDO<x>_B when the related time slot/ID is processed. The state of the regulators that
are enabled for GPI control will not be changed by the sequencer when processing the related ID.
This also applies for the selection of the related V<x>_A or V<x>_B voltage control register in case a
regulator is enabled for GPI voltage selection.
If powering down is initiated by clearing POWER1_EN, the sequencer stops controlling IDs before
the domain pointer POWER_END is reached. If POWER_EN is cleared, the domain POWER1 is
powered down followed by POWER before the sequencer reaches pointer SYSTEM_END. These
modes are used to temporarily disable optional features of a running application for reduced power
(sleep mode).
If SYSTEM_EN is cleared the sequencer processes all IDs lower than the pointer position down to
slot 0. The sequencer can be forced to stop the intended power down sequence prior to maturity at
pointer position PART_DOWN via an asserted control STANDBY (PART_DOWN has to point into
domain SYSTEM). In these cases the power sequencer has reached the application’s
POWERDOWN mode (hibernate/standby), which enables the option to reset regulator settings for
the consecutive power-up sequence from OTP (enabled by OTPREAD_EN).
Wakeup events are enabled when the sequencer reaches slot 0 or pointer PART_DOWN (ignored
outside of POWERDOWN mode). The assertion of nIRQ from events during POWERDOWN mode
may be delayed until ACTIVE mode is reached the next time if configured by nIRQ_MODE. During
processing slot 0, all supplies pointing into this step with a cleared control
Bxxx_CONF/LDOxx_CONF/xxx_SW_CONF are disabled, otherwise the regulator voltage is changed
to VBxxx_B/VLDOxx_B (if bit DEF_SUPPLY is asserted). Asserting control register bit SHUTDOWN
first powers down to slot 0 and then forces the DA9063L into RESET mode. Autonomous features
such as the Auto-ADC measurement can be disabled temporarily for POWERDOWN mode via
register PD_DIS. The timing for processing PD_DIS can be defined by selecting a step inside the
sequence. Features asserted in PD_DIS are (re-)enabled when PD_DIS is processed during a
power-up sequence.
Control nRES_MODE enables the assertion of nRESET before executing a power-down sequence
and starting the reset timer during the consecutive powering up. This is also true for partial
POWERDOWN mode, when the sequencer powers down to pointer position PART_DOWN. The
reset timer starts to run from the selected RESET_EVENT and releases the nRESET port after the
reset timer expires.
6.5.5
User Programmable Delay
A conditional mode transition can be achieved using ID WAIT_STEP. If pointing into the power
sequence the progress of an initiated mode transition can be synchronized, for example with the
state of a host. This is indicated by toggling the signal at GPI10 to its configured active state. A safety
timeout of 500 ms can be selected in TIME_OUT to trigger a power-down to RESET mode (including
the assertion of WAIT_SHUT inside register FAULT_LOG) if E_GPI10 is not asserted in time. The ID
WAIT_STEP provides an alternate timer mode, selected by WAIT_MODE and configured by
WAIT_TIME, which provides a delay timer for a selected sequencer step. To enable symmetric
sequence behavior, ID WAIT_STEP should not share a sequencer slot with other IDs. In the case of
a shutdown sequence to RESET mode any waiting/delay at ID WAIT_STEP is skipped.
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DA9063L
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Figure 17: Power Mode Transitions
Datasheet
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DA9063L
System PMIC for Mobile and Automotive Applications
6.6
System Monitor (Watchdog)
After powering up domain POWER, the DA9063L can initiate a watchdog monitor function. The host
processor must write a 1 within a configured TWDMAX time into control WATCHDOG, thereby
indicating that the host is alive. If the host does not write 1 to this watchdog bit within the TWDMAX
time, the DA9063L asserts TWD_ERROR in the FAULT_LOG register and powers down to RESET
mode.
After this first write, the host must continue to write to this watchdog bit within the configured time or
DA9063L powers down as described above. The time window has a minimum time TWDMIN fixed at
256 ms and a maximum time TWDMAX, nominally 2.048 s. The TWDMAX value can be extended by
multiplying the nominal TWDMAX by the value of register bits TWDSCALE. TWDSCALE is used to
extend the TWDMAX time by x1, x2, x4, x8, x16, x32, or x64.
Once in the ACTIVE state, the DA9063L continues to monitor the system unless it is disabled by
setting TWDSCALE to zero. When powering down from ACTIVE mode, the watchdog monitor is
stopped unless it enters POWERDOWN mode via WATCHDOG_PD.
If the WATCHDOG register bit is set to a 1 within the time window, the watchdog monitor resets the
timer, sets the watchdog bit back to zero (this bit is always read as zero) and waits for the next
watchdog signal. The watchdog trigger can also be asserted from the host by asserting KEEP_ACT
in hardware. This mode is selected with control PM_FB2_PIN and removes the above requirement
for the periodic setting of the watchdog bit.
The watchdog feature can be disabled by setting TWDSCALE to zero.
6.7
GPIO Extender
The DA9063L includes a GPIO extender that provides up to 16 VDDREF -tolerant general purpose
input/output ports, each controlled via registers from the host, see Table 32 and Figure 18.
The GPIO ports are pin-shared with ports from GPADC, HS 2-WIRE-interface and signals from the
power manager. Configuration settings and events from GPIx ports are also shared with alternative
features. For example, if GPIO1_PIN is configured to be ADCIN2, exceeding the configured ADC
thresholds triggers a GPI1 event that generates a maskable GPI1 interrupt. The GPI active High/Low
setting from the GPIOx_TYPE register and the selection of pull-up resistor is also applicable to the
alternative port functions selected via GPIOx_PIN (for example, SYS_EN, PWR_EN and
PWR1_EN). This is also true for GPIOx_WEN, which is used to enable triggering of a wakeup event
(ADCIN1, ADCIN2, ADCIN3, SYS_EN, PWR_EN, PWR1_EN, HS 2-WIRE interface). When GPI
ports are enabled (including being enabled by changing the setting of GPIOx_PIN), the GPI status
bits are set to their non-active state. This ensures that any signals that are already active are
detected and immediately generate any appropriate events.
In ACTIVE and POWERDOWN mode, the GPIO extender can continuously monitor the level of ports
that are selected as general purpose inputs. GPIs are supplied from the internal rail VDDCORE or
VDD_IO2 (selected via GPI_V) and can be configured to trigger events in active-high or active-low
mode. The input signals can optionally be debounced (configurable via control DEBOUNCING,
10 ms default) and the resulting signal level is reflected by the status register GPIx. When the status
has changed to its configured active state (edge sensitive) the assigned event register is set and the
nIRQ signal is asserted (unless this nIRQ is masked). GPIs can be individually configured to
generate a system wakeup via GPIxx_WEN.
If enabled via regulator controls LDOx_GPI/Bxxx_GPI, the ports GPI1, GPI2, and GPI13 can be used
to enable/disable regulators (that is, controlling LDOx_EN/Bxxx_EN). The GPI active level is selected
via the related GPIxx_TYPE control. GPI ports that are selected for this hardware control of one or
more regulators do not generate events (nIRQ). GPI1, 2, and 13 can alternatively be selected to
toggle the VLDOx_SEL/VBxxxx_SEL. Apart from changing the regulator output voltage, this feature
also allows hardware control of regulator mode (sync/sleep mode) via selection of the settings
contained in xxxx_SL_A and xxxx_SL_B (but only for those bucks configured with Bxxxx_MODE =
00). When a regulator is controlled via GPI, its enable and voltage register selection are no longer
controlled by the power sequencer (processing the related ID only affects non-GPI controlled
functionality). However, these settings can still be changed via register writes from the control
interface.
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Events on GPI10 can be used to control the progress of the power sequencer. Processing ID
WAIT_STEP causes the sequencer to wait until GPI10 changes into its active state.
Note
Supplies directly enabled/disabled from GPI1, 2, or 13 have to be excluded from the power sequencer control
(IDs of these supplies should point into a slot higher than MAX_COUNT)
If defined as an output, GPO0, 1, 3 to 6, 10 to 11, and 13 to 15 can be configured to be open-drain
instead of push-pull. The supply rail can be individually selected from either VDD_IO1 or VDD_IO2.
By disabling the internal 120 kΩ pull-up resistor when in open-drain mode, the GPO can also be
supplied from an external rail (see registers CONFIG_K and CONFIG_L). The GPO output state
reflects the respective register bit GPIOx_MODE.
When configured as outputs, GPO 2, 7, 8, 9, and 11 can be controlled by the DA9063L power
sequencer. Five pairs of level asserting and level releasing IDs (GP_RISE1_STEP/
GP_FALL1_STEP to GP_RISE5_STEP/GP_FALL5_STEP) may be assigned individually to slots of
the power sequencer, which trigger the configured level transition on the GPOs when processing the
related ID during powering up (see Table 31 for assignments). The configured level change is
inverted when processing the IDs during powering down. These are intended for use as enable
signals either for external regulators or other devices in the system.
When the GPIO unit is off (POR), all ports are configured as open drain output with high level (pass
device switched off, high impedance state). When leaving POR, the pull-up or pull-down resistors are
configured from registers CONFIG_K and CONFIG_L. When the GPIO unit is temporarily disabled by
the power sequencer (via GPI_DIS or PMCONT_DIS) level transitions on inputs are no longer
detected and I/O drivers keep their configuration and programmed levels.
GPO12 can be driven by the state of VDD_MON to provide an active high ‘Power good’ signal
(selected via GPIO12_PIN).
GPO10, 11, 14, and 15 are extended power GPO ports, where the maximum sink current is 11 mA
and the maximum source current is 4 mA. This enables driving LEDs. The output ports GPO11,
GPO14, and GPO15 can be toggled with a configurable periodic pulse configured via BLINK_FRQ
and BLINK_DUR and include an optional PWM control. The generated PWM signals have a duty
cycle from 0 % to 100 % with a repetition frequency of 21 kHz and 95 steps (using one 2 MHz clock
for each step). The duty cycle is set by the controls GPO11_PWM, GPO14_PWM, and
GPO15_PWM, with any value larger than 0 enabling the PWM mode of operation. The PWM control
can also be made to dim the brightness between its current value and a new value at a rate of 32 ms
per step. Selection of this mode is set by GPO11_DIM, GPO14_DIM, and GPO15_DIM. When set to
zero the PWM ratio immediately changes. This creates a common anode tricolor LED brightness
control. Flashing is driven from the crystal oscillator when control CRYSTAL has been asserted;
otherwise an auxiliary on-chip oscillator is used.
LEDs are recommended to be low-side driven (using the GPIOs in sink mode) which is configured by
setting GPIOx_MODE = 1.
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Table 32: GPIO Overview
GPIO
Alternate Port
Alternate Port Shared
Resources
GPI Wakeup
0
ADCIN1
E_GPI0, M_GPI0,
GPIO0_MODE
x
1
ADCIN2
E_GPI1, M_GPI1,
GPIO1_MODE
Regulator control
x (in other modes)
Auto measure ADC/1.2V
comparator, HW control of
regulator
2
ADCIN3
E_GPI2, M_GPI2,
GPIO2_MODE
Regulator control
x (in other modes)
Auto measure ADC, HW
control of regulator/ power
sequencer controlled GPO
3
4
Auto measure ADC
x
CORE_SWS
x
5
6
Remark
Buck remote feedback voltage
sense
x
PERI_SWS
7
x
Buck remote feedback voltage
sense
x
Power sequencer controlled
GPO
8
SYS_EN
E_GPI8, M_GPI8,
GPIO8_TYPE, GPIO8_WEN,
GPIO8_MODE
x
Power sequencer controlled
GPO
9
PWR_EN
E_GPI9, M_GPI9,
GPIO9_TYPE, GPIO9_WEN,
GPIO9_MODE
x
Power sequencer controlled
GPO
10
PWR1_EN
E_GPI10, M_GPI10,
GPIO10_TYPE,
GPIO10_WEN,
GPIO10_MODE
x
High power GPO, input signal
for ID WAIT
x
High power GPO (LED
flashing/PWM), Power
Sequencer controlled GPO
VDD_MON state controlled
GPO (POWER_GOOD)
11
12
nVDD_FAULT
GPIO12_TYPE,
GPIO12_WEN,
GPIO12_MODE
x
13
GP_FB1
GPIO13_TYPE,
GPIO13_MODE
Regulator control
x (in other modes)
14
DATA
E_GPI14, M_GPI14,
GPIO14_TYPE,
GPIO14_MODE
x
High power GPO (LED
flashing/PWM), Reset via long
assertion in parallel with
GPI15, 2nd 2-WIRE or DVC
Control Interface
15
CLK
x
High power GPO (LED
flashing/PWM), Reset via long
assertion in parallel with
GPI14, 2nd 2-WIRE or DVC
Control Interface
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HW control of regulator
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DA9063L
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GP-ADC_SEQ
Interrupt mask:
M_GPI_0
ADCIN4_I_EN
GPIO_0_WEN:
on/off
Wake-up
15 uA
GPIO_0_MODE:
Debounce on/off
GPIO_0_TYPE:
Active high/low
2x true
(same limit)
AUTO4_LOW
AUTO4_HIGH
Status register
AND
...
Comparator
GP-ADC
NOR
OR
ADCIN4
GPI
GPI_0
E_GPI_0
Rising or
Falling edge
Debounce
GP-ADC_SEQ
GPIO_0_PIN
OR
Event register
nIRQ
Reset
VDDIO1 VDDIO2
...
Event register write
GPIO_0_TYPE:
VDDIO selection
NOR
GPIO0_PUPD
GPIO0_PUPD
100kΩ
120kΩ
GPO (Open drain)
VDDIO1
VDDIO2
GPO_0_MODE:
0 or 1
GPIO_0_TYPE:
VDDIO selection
GPO (Push-pull)
VDDIO1
...
VDDIO2
GPIO_13_TYPE:
VDDIO selection
GPIO13_PUPD
120kΩ
GPIO_13_WEN:
on/off
Interrupt mask:
M_GPI_13
VDDIO1 VDDIO2
GPIO_13_TYPE:
VDDIO selection
Status of
GP_FB1:
GPIO_13_TYPE:
Active high/low
AND
Event register
Status register
No regulator HW
control
NOR
GPI_13
GPIO_13_MODE:
Debounce on/off
GP_FB1
Debounce
GPIO_13_PIN
E_GPI_13
Rising or
Falling edge
GPI
Reset
Event register write
Regulator HW control
GPIO13_PUPD
Regulator
configure
100kΩ
GPI_13
Rising and
Falling edge
XOR
xxxx_ EN
VDDIO1 VDDIO2
GPIO_13_TYPE:
VDDIO selection
GPO (Push-pull)
GPO_13_MODE
0 or 1
GPIO_13_TYPE:
Active high/low
...
Figure 18: GPIO Principal Block Diagram (Example Paths)
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6.8
Control Interface
The DA9063L is register controlled by the host software. Data is shifted into or out from DA9063L
under the control of the host processor that also provides the serial clock. The interface is usually
only configured once from OTP values, which are loaded during the initial start-up. The interface
configuration can be changed by the host. However, care must be taken that changes are not made
while the interface is active. If enabled, IF_RESET forces a reset of all control interfaces when port
nSHUTDOWN is asserted.
The HS 2-WIRE interface is the serial control bus. It consists of DATA (data line) and CLK (clock line)
and can be used as an independent control interface for data transactions between the DA9063L and
a second host processor. The DA9063L HS 2-WIRE interface has a configurable 8-bit write address
(default 0xB4) and a configurable read address (default 0xB5). For details of configurable addresses
see control IF_BASE_ADDR in Section A.4.2 The interface is enabled if DATA was selected via
configuration control GPIO14_PIN. The bus lines have to be pulled high by external pull-up resistors
(2 kΩ to 20 kΩ). GPIO14_TYPE defines the supply rail of the interface (used for input logic levels and
the internal pull-up resistors). The controls GPIO15_PIN and GPIO15_WEN are disabled when
enabling the interface via GPIO14_PIN.
When the interface receives a read or write command that includes a matching slave address, the
DA9063L can trigger the assertion of nIRQ and an optional wakeup event (enabled via
GPIO14_WEN). If the nIRQ assertion from interface access is enabled (E_GPI14), it should be
masked as long as the HS 2-WIRE is in use. This nIRQ cannot be cleared via the HS 2-WIRE
interface because every interface access triggers a re-assertion.
High speed mode at 3.4 MHz can be enabled either via master code or continuously via
HS_IF_HSM, but it does not support slope control for minimum tfDA specification.
The 2-wire interface is open-drain, supporting multiple devices on a single line. The bus lines must
be pulled high by external pull-up resistors (2 kΩ to 20 kΩ). The attached devices only drive the bus
lines low by connecting them to ground. As a result, two devices cannot conflict if they drive the bus
simultaneously. In standard/fast mode, the highest frequency of the bus is 400 kHz. The exact
frequency can be determined by the application and does not have any relation to the DA9063L
internal clock signals. The DA9063L follows the host clock speed within the described limitations and
does not initiate any clock arbitration or slow down. Control TWOWIRE_TO enables an automatic
interface RESET that is triggered when the clock signal ceases to toggle for >35 ms (compatible with
SMBus TTIMEOUT).
The interface supports operation compatible with Standard, Fast, Fast-Plus and High Speed modes
2
of the I C-bus specification Rev 03 (UM10204_3). Bus clear, in the case of the DATA signal being
stuck low, is achieved after receiving 9 clock pulses. Operation in High Speed mode at 3.4 MHz
requires a minimum interface supply voltage of 1.8 V and a mode change in order to enable spike
2
suppression and slope control characteristics compatible with the I C-bus specification. The high
speed mode can be enabled on a transfer-by-transfer basis by sending the master code
(0000 1XXX) at the beginning of the transfer. The DA9063L does not make use of clock stretching
and delivers read data without additional delay up to 3.4 MHz.
Communication on the 2-wire bus always takes place between two devices, one acting as the master
and the other as the slave. The DA9063L only operates as a slave. The 2-wire interface has direct
access to two pages of the DA9063L register map (up to 256 addresses). The register at address
zero on each page is used as a page control register (with the 2-wire bus ignoring the LSB of control
REG_PAGE). Writing to the page control register changes the active page for all subsequent
read/write operations unless an automatic return to page 0 was selected by asserting control
REVERT. Unless REVERT was asserted after modifying the active page, a read-back of the page
control register is recommended to ensure that future data exchange is accessing the intended
registers.
The DA9063L offers an alternative method to access register pages 2 and 3. These pages can be
accessed directly by incrementing the device address by one (default read address 0xB2; write
address 0xB3). This removes the need to write to the page register before access to pages 2 and 3,
thus reducing the traffic on the 2-wire bus.
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6.8.1.1
Details of the 2-wire control bus protocol
All data is transmitted across the 2-bus in groups of 8 bits. To send a bit, the DATA line is driven at
the intended state while the CLK is LOW (a low on DATA indicates a zero bit). Once the DATA has
settled, the CLK line is brought high and then low. This pulse on CLK clocks the DATA bit into the
receiver’s shift register, see Figure 19.
A two byte serial protocol is used containing one byte for address and one byte data. Data and
address transfer is MSB transmitted first for both read and write operations. Transmission begins
with the START condition from the master while the bus is idle. It is initiated by a high-to-low
transition on the DATA line while the CLK is in the high state (a STOP condition is indicated by a lowto-high transition on the DATA line while the CLK is in the high state).
CLK
DATA
Figure 19: Timing of START and STOP Condition
The 2-WIRE bus is monitored by the DA9063L for a valid slave address when the interface is
enabled. It responds immediately when it receives its own slave address. This ‘Acknowledge’ is done
by pulling the DATA line low during the following clock cycle (see the white blocks marked A in
Figure 20 to Figure 24).
The protocol for a register write from master to slave consists of a start condition, a slave address
with read/write bit and the 8-bit register address followed by 8 bits of data terminated by a STOP
condition (all bytes responded by DA9063L with Acknowledge), as illustrated in Figure 20.
S
SLAVEadr
W
7 bits
1 bit
A
REGadr
DATA
8 bits
Master to slave
S = START condition
P = STOP condition
A
A
P
8 bits
Slave to master
A = Acknowledge (low)
W = Write (low)
Figure 20: Byte Write (DATA Line)
When the host reads data from a register, it first has to write access the DA9063L with the target
register address and then read access the DA9063L with a Repeated START or alternatively a
second START condition. After receiving the data, the host sends Not Acknowledge and terminates
the transmission with a STOP condition (Figure 21).
S
S
SLAVEadr
W
7 bits
1 bit
SLAVEadr
W
7 bits
1 bit
A
REGadr
A
Sr
SLAVEadr
R
7 bits
1 bit
8 bits
A
REGadr
A
P
S
8 bits
Master to slave
A
DATA
A*
P
8 bits
SLAVEadr
R
7 bits
1 bit
A
DATA
A*
P
8 bits
Slave to master
S = START condition
Sr = Repeated START condition
P = STOP condition
A = Acknowledge (low)
A* = No Acknowledge
W = Write (low)
R = Read (high)
Figure 21: Examples of Byte Read (DATA Line)
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Consecutive (page) read mode is initiated from the master by sending an Acknowledge instead of
Not Acknowledge after receipt of the data word. The 2-wirecontrol block then increments the address
pointer to the next 2-wireaddress and sends the data to the master. This enables an unlimited read of
data bytes until the master sends a Not Acknowledge directly after the receipt of data, followed by a
subsequent STOP condition. If a non-existent 2-wire address is read then the DA9063L returns code
zero (Figure 22).
S
S
SLAVEadr
W
7 bits
1 bit
SLAVEadr
W
7 bits
1 bit
A
REGadr
A
Sr
8 bits
A
REGadr
A
SLAVEadr
R
7 bits
1 bit
P
S
8 bits
Master to slave
A
DATA
A
DATA
8 bits
SLAVEadr
R
7 bits
1 bit
A
DATA
8 bits
A
DATA
A
8 bits
A*
P
8 bits
DATA
A*
P
8 bits
Slave to master
S = START condition
Sr = Repeated START condition
P = STOP condition
A = Acknowledge (low)
A* = No Acknowledge
W = Write (low)
R = Read (high)
Figure 22: Examples of Page Read (DATA Line)
The slave address after the Repeated START condition must be the same as the previous slave
address.
For enhanced data transfer efficiency, the DA9063L supports two write modes: Page Write mode and
Repeated Write mode.
Page Write mode is used where the host has multiple bytes of data to be written to consecutive
register addresses. It is selected by setting the WRITE MODE control to 0. For Page Write mode the
master sends a device address followed by a register address then multiple data bytes. The 2-wire
interface automatically increments the register address pointer after each data byte is received. The
slave acknowledges each received byte of data until the master sends the STOP condition (Figure
23).
S
SLAVEadr
W
7 bits
1 bit
A
REGadr
A
8 bits
Master to slave
DATA
A
8 bits
DATA
A
8 bits
DATA
A
8 bits
……...
A
P
Repeated writes
Slave to master
S = START condition
P = STOP condition
A = Acknowledge (low)
W = Write (low)
Figure 23: Page Write (DATA Line)
Repeated Write mode is used where the host has multiple bytes of data to be sent to nonconsecutive registers. It is selected by setting the WRITE MODE control to 1. For Repeated Write
mode the master sends a device address followed by multiple address-data pairs. The slave
acknowledges each received byte until the master sends the STOP condition (Figure 24).
S
SLAVEadr
W
7 bits
1 bit
Master to slave
S = START condition
P = STOP condition
A
REGadr
A
8 bits
DATA
A
8 bits
REGadr
8 bits
A
DATA
8 bits
A
……...
A
P
Repeated writes
Slave to master
A = Acknowledge (low)
W = Write (low)
Figure 24: Repeated Write (DATA Line)
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6.9
Voltage Regulators
Three types of low drop-out regulators (LDOs) are integrated on the DA9063L: for sensitive analog
rails (for example, RF transceiver supply), the low noise regulators offer high PSRR across a wide
frequency range; the LDOs provide an optimized PSRR and noise performance with lowest
quiescent current. Quiescent current has been optimized for the always-on type regulators.
The regulators employ Dialog Semiconductor’s Smart Mirror™ dynamic biasing that guarantees
PSRR to be maintained across the full current range. Quiescent current consumption is dynamically
adjusted to the load, which improves efficiency at light load conditions. Furthermore, Dialog
Semiconductor’s Smart Mirror™ technology allows the capacitor to be placed close to the load.
Note
When placing an LDO capacitor remotely from the DA9063L, the voltage drop (= load current * parasitic PCB
impedance) needs to be considered when configuring the LDO output voltage.
Table 33: Regulator Control
Regulator
Type
VOUT
Steps
(mV)
Mode
Output
Voltage
(V)
Supplied
Max.
Current
(mA)
Current
Limit
LDO/
Bypass
(mA)
VOUT Control
LDO3
Standard
20
Bypass
0.9 to 3.44
200
400/200
DVC variable
slew rate
LDO7
Standard
50
Bypass
0.9 to 3.6
200
400/300
VOUT
programmable
LDO8
Standard
50
Bypass
0.9 to 3.6
200
400/300
VOUT
programmable
LDO9
Low noise
50
0.95 to 3.6
200
400
VOUT
programmable
LDO11
Standard
50
0.9 to 3.6
300
400/300
VOUT
programmable
LDOCORE
Always-on
2.5
±2%
accuracy
4
6.9.1
Bypass
VOUT nonprogrammable
Notes
Switching
vibration
motor driver,
common
supply with
LDO7
Internal LDO
Regulators Controlled by Software
The regulators can be programmed via the power manager interface. All regulators can be enabled
or disabled by a write command to the enable bit LDOxx_EN. Each LDO has two voltage registers for
output voltage A and B. The appropriate values are stored in the registers VLDOxx_A and
VLDOxx_B. The specific output voltage is selected with the bit VLDOxx_SEL. Changes to this control
result in immediate output voltage changes on non-DVC regulators and ramped voltage transitions
on DVC-enabled regulators. The output voltage can also be changed by directly re-programming the
voltage control register. The sequencer also uses these registers and may write to them: their
contents can therefore be found to differ from previous write commands.
For security reasons, the re-programming of registers that may cause damage when being
incorrectly programmed (for example, voltage settings) can be disabled with control V_LOCK. This
disables write access to registers with an address higher than 0x7F.
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6.9.2
Regulators Controlled by Hardware
All regulators can be enabled or disabled under hardware control using GPIO1, 2, or 13. The GPIO
port used is defined in register LDOxx_GPI. The output voltages can be switched by the GPIO port
between the A and B voltage. The specific GPIO port is defined in register VLDOxx_GPI. After
detecting a rising or falling edge at the GPI, the DA9063L configures the related regulators with the
status of GPI1, GPI2, or GPI13 (the event bit E_GPI1, E_GPI2, or E_GPI13 is automatically cleared).
A parallel write access to the regulator control registers is delayed and later overrides the hardware
configuration. The sequencer does not affect regulators controlled via GPIOs.
6.9.3
Power Sequencer Control of LDOs
The power sequencer can control the LDOs. The specific time slot of each LDO is defined with bit
LDOx_STEP in register bank starting at address 0x83. The sequencer enables and disables each
LDO individually depending on the setting of each LDO’s bit LDOx_CONF and LDOx_AUTO. To limit
the inrush current, it is recommended to enable a maximum of one regulator (including bucks) per
time slot.
If the control OTPREAD_EN is set, the regulator control registers are reloaded from OTP before
leaving POWERDOWN mode. During power-up, the sequencer always takes output voltage A
(defined in register VLDOxx_A). Therefore it also clears all VLDOxx_SEL bits.
When powering down, the sequencer disables all LDOs, but the LDOs can be configured to remain
on by setting bit LDOxx_CONF. In this case the output voltage B is always selected (value
programmed in register VLDOxx_B). The related bit VLDOxx_SEL is set by the sequencer
accordingly.
Table 34: LDO Power Sequence Voltage
LDO Output Voltage During Power-Up Sequencing
LDOx_CONF
LDOx_AUTO
LDO
Output Voltage
-
1
gets enabled
A
1
0
gets enabled
A
disabled
-
0
LDO Output Voltage During Power-Down Sequencing
LDOx_CONF
LDOx_AUTO
LDO
Output Voltage
1
-
remains enabled
B
gets disabled
-
0
The bit DEF_SUPPLY defines the sequencer action for time slot 0. If Bit DEF_SUPPLY is set, all
LDOs configured to time slot 0 are enabled or disabled during power-up according to Table 34. If bit
DEF_SUPPLY is not set, the LDOs configured to time slot 0 are disabled.
Note
When control bit LDOxx_SL_B is asserted, the LDO enters a forced sleep mode with the lowest quiescent
current, but with a reduced maximum output current. The maximum current is reduced because a smaller output
driver is used (a partial pass device). Asserting LDOxx_SL_A results in the same forced sleep mode for an LDO
when using the type A voltage register. Before wakeup from POWERDOWN mode (processing time slots from
domain SYSTEM), the sequencer can configure all regulators with default voltage values from OTP: this allows
any previously altered VLDOxx_A and LDOxx_SL_A settings to be reset.
Entering RESET mode automatically disables all regulators.
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6.9.4
Dynamic Voltage Control
LDO3 includes DVC:
● The output voltage can be programmed in 20 mV steps.
● If the feedback signal GP_FB1 is configured to be READY (by asserting PM_FB1_PIN), this port
is asserted while slewing and asserts E_DVC_RDY after all voltage and buck regulators have
completed slewing.
DVC voltage transitions are handled by the following registers:
● Output voltage setting registers VLDO3_A/VLDO3_B.
When writing into a selected voltage control register the output voltage is immediately ramped to
the new value. When writing into the non-selected voltage register the ramping is delayed until
this register is selected by toggling VLDO3_SEL.
● The voltage selection registers VLDO3_SEL activate a pre-configured transition to the alternate
output voltage. These controls have been grouped together in registers DVC_1 and DVC_2 to
better enable synchronized ramping of supply voltages.
● The DVC slew rate for all DVC-enabled regulators can be configured as 10 mV per (0.5, 1.0, 2.0,
or 4.0) µs via control SLEW_RATE. Under light load conditions (< 10 mA), the slew rate is less
than the programmed value when the output is close to the start and end of the slope This is
especially the case for the fastest slew rate settings. The negative slew rate is load dependent
and might be lower than the one mentioned above.
6.9.5
Pull-Down Resistor
All LDOs have a pull-down resistor at the output when they are disabled. The pull-down resistor can
be disabled with bit LDOxx_PD_DIS, and is required when LDOs are used in parallel with another
supply. Otherwise the output is pulled to GND.
If an over-voltage occurs (LDO3: VOUT > 109 % of nominal VOUT, LDO7 to 9, and 11: VOUT > 106 % of
nominal VOUT), the voltage regulators enable an internal load to discharge the output back to its
configured voltage. This can be disabled via LDOxx_PD_DIS.
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6.9.6
Bypass Mode and Current Limit
All LDOs feature a current limiting function. For LDOs with a bypass mode (LDO3, 7, 8, and 11), an
over-current is indicated with an interrupt. When at least one of these LDOs reaches the current limit
for more than 10 ms, an interrupt is raised to the host (during POWERDOWN mode a wakeup
sequence is initiated) and the event bit E_LDO_LIM is set. The interrupt IRQ can be suppressed via
the mask bit M_LDO_LIM.
If the current limit condition persists for more than 200 ms (indicating a probable short circuit
condition), the related LDO is disabled and its LDOx_EN bit is de-asserted. The LDO remains
disabled until a new enable occurs (via hardware or software activation). The automatic shutdown of
the LDO can be disabled via bit LDO_SD. The host processor can distinguish if the IRQ is related to
a temporary over-current or to a permanent shutdown by polling the related bit LDOx_ILIM or
checking LDO3_EN, LDO7_EN, LDO8_EN, and LDO11_EN.
If the current limit is hit for more than 10 ms but less than 200 ms, the IRQ is generated but the
related LDO is not disabled. If the current limit is hit for more than 200 ms and the involved LDO is
shut down, the LDO<x>_EN bit is de-asserted. If the over-current spike has stopped before the host
is able to read the xx_LIM bits, the LDO that has been in current limit cannot be evaluated.
Changing from LDO to bypass mode and back triggers a change of the output voltage with some
over/undershoot during the transition phase.
6.9.7
LDO Supply from Buck Converter
The LDOs can optionally be supplied from a buck output (VDD < 2.8 V). In this mode some
specification parameters change:
● at VDD = 1.8 V, the dropout voltage at Imax increases by 70 %
● for a supply voltage less than 1.8 V, the LDO dropout voltage is valid only for 1/3 of the standard
Imax and the current capability decreases with the provided supply voltage.
LDO11 may be supplied from a rail higher than VSYS/CHG_WAKE (for example, the output of a 5 V
boost) as long as VDD < 5.5 V.
6.9.8
LDO Sleep Mode for Reduced IOUT
If the required output current is < 10 % of IMAX, the quiescent power can be reduced by setting an
LDO into sleep mode. In this mode, the output driver current capability is reduced to 10 % of IMAX.
Sleep mode can be set independently for the output voltage A and B by setting bit LDOxx_SL_A or
bit LDOxx_SL_B. During LDO sleep mode, the over-current limit of the LDOs with a bypass function
(LDO3, 7, 8, and 11) is reduced to 50 %. As a benefit of Dialog Semiconductor’s Smart Mirror™
technology, sleep mode is typically not required because the quiescent current taken by the regulator
is automatically minimized when operating at low current demands.
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6.9.9
Vibration Motor Driver
LDO8 provides a third mode dedicated to drive vibration motors selected via bit LDO8_MODE. In this
mode, the voltage regulation circuitry is disabled and no external stabilization capacitor is needed. In
comparison to LDO mode, the PWM control is more efficient and allows an instant on and off for the
vibrator signal.
VSUP
PWM
VLDO8
Vibrator
motor
BRAKE
GND
Figure 25: Vibration Motor Driver
The vibrator motor driver is a half-bridge PWM-controlled motor driver, with an automatic battery
supply correction of the PWM duty cycle (Figure 25). The PWM base frequency can be selected by
PWM_CLK to be either 1.0 MHz or 2.0 MHz (resulting in a PWM repetition rate of 15.6 kHz or
31.25 kHz). The vibration motor speed is determined by the effective output voltage which is set via
control VIB_SET (6 bits giving 64 programmable speeds). Setting the output voltage to 0 turns on a
braking NMOS transistor to stop the vibration motor immediately.
The motor can also be stopped and started by a level on port nVIB_BRAKE, if enabled via bit
PM_FB3_PIN.
The PWM duty cycle is corrected automatically before it is enabled and after each breaking period. It
is also automatically corrected every 10 s when it is running for longer periods. These corrections are
done via autonomous VSYS measurement via the internal GPADC (overrides control setting of
AUTO_VSYS_EN). The duty cycle, D, is given by D = VIB_SET / VSYS.
Note
The half-bridge driver transistors have an internal current limit of approximately 400 mA
6.9.10
Core Regulator LDOCORE
The LDOCORE is a 2.5 V supply dedicated for the internal logic of DA9063L. It is used for running
the state machine, GPIO pins with comparators, bias, reference, GPADC, OTP, and power manager
registers. It is supplied from internal rail VDDREF , powered from either CHG_WAKE or VSYS. When
LDOCORE is supplied in RESET mode, its output voltage is temporarily reduced to 2.2 V. In general,
LDOCORE is an always-on supply (remaining enabled during RESET mode), but for lowest
dissipation power LDOCORE can also be disabled when progressing towards DELIVERY mode.
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6.10 DC/DC Buck Converters
DA9063L includes six DC/DC buck converters with DVC.
VDD ( 2.8 ... 5.5 V)
DCDC CONVERTER
( 3 MHz )
Isense
1. 0 uH
VBUCK
DRV
CNTRL
V FB
DAC
CTRL
REF
COUT
SLEEP _ EN
POWER-EN
Figure 26: DC-DC Buck Converter
The converters are high efficiency synchronous step-down regulators, operating at a high frequency
(3 MHz), supplying individual output voltages with ± 3 % accuracy. The default output voltage is
loaded from OTP and can be set in 10 mV steps. To limit in-rush current from VSYS, the buck
converters perform a soft-start for up to 3 ms, when enabled via control SOFT_START. During this
3 ms period, the output current of the buck is limited.
The DVC controller allows the following features:
● The buck converter output voltage is programmable over the power manager bus in 10 mV steps.
● If the feedback port GP_FB1 is configured as READY, this port is asserted while slewing and
asserts E_DVC_RDY after all voltage and buck regulators have stopped slewing.
● Output voltages below 0.7 V are only supported in Pulse Frequency Modulation (PFM) mode.
During a voltage reduction below 0.7 V, the slew rate control ends at 0.7 V and the buck mode is
automatically changed to PFM mode.
The DVC control is handled by the following registers:
● Output voltage setting register VBxxxx_A/VBxxxx_B.
When writing to the voltage control register that is in use by an enabled buck, the output
immediately ramps to the new setting. When writing to the voltage control register that is not in
use, the ramping is delayed until this register is selected by toggling VBxxxx_SEL.
● The voltage register selection VBxxxx_SEL.
This activates a pre-configured transition to the alternate output voltage. These controls are
grouped into registers DVC_1 and DVC_2 to better enable synchronized ramping of supply
voltages.
● The DVC slew rate is programmable as at 10 mV per (4, 2, 1, or 0.5) µs via control SLEW_RATE.
During PFM mode, the negative slew rate is load-dependent and might be lower than the
programmed rate.
The supply current during PWM (synchronous) operation is in the order of 3.5 mA (quiescent current
and charge/discharge current) and drops to <1 µA in shutdown. Switching frequency is chosen to be
high enough (3 MHz) to allow the use of a small 1.0 µH inductor.
The operating mode of the buck converter is selected via the buck control register bits B<x>_MODE.
The buck converter can be forced to operate in either PWM or PFM mode. Additionally, the buck
converter has an automatic mode where it switches between PWM and PFM modes depending on
the load current.
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The switching converters can be enabled/disabled/configured via the power manager and HS 2WIRE interface. Writing to Bxxxx_EN/VBxxxx_SEL unconditionally configures the regulator to the
selected mode (enabled/disabled). Reading Bxxxx_EN/VBxxxx_SEL provides the actual state, which
may differ from a previous write (in the case where the regulator state is changed from GPIO or
power sequencer control). All bucks can be controlled with an ID from the power sequencer. If
enabled in DEF_SUPPLY, supplies can be configured to default settings when the sequencer passes
slot 0.
To limit the inrush current, it is recommended to select individual regulators (including LDOs) only
with xxxx_DEF settings.
When powering up, the power sequencer clears VBxxxx_SEL for a buck when it has an ID pointing
to the time slot being processed. This forces the regulator to ramp the output voltage to the value
programmed inside the related register VBxxxx_A.
When powering down (for example, to POWERDOWN mode), sequencer-controlled supplies are
usually disabled but can be configured to remain on by setting Bxxxx_CONF. In the latter case, the
sequencer sets VBxxxx_SEL so that the regulator output voltage is ramped to the value programmed
inside the related register VBxxxx_B. Disabled bucks can switch off their pull-down resistor. Before
wakeup from POWERDOWN mode (processing time slots from domain SYSTEM), the sequencer
can configure the bucks with default voltage values from OTP and reset any changed VBxxxx_A
settings.
All buck converters provide an optional hardware enable/disable via GPIO1, 2, and 13. A regulator
that has to be enabled/disabled from a GPI port selects this feature via its control Bxxxx_GPI. A
change of the output voltage from the state of a GPI is enabled via control VBxxxx_GPI. After
detecting a rising or falling edge at the GPI, the DA9063L configures the enabled regulators with the
status of GPI1, GPI2, or GPI13 (the event bit E_GPI1, E_GPI2 or E_GPI13 is automatically cleared).
A parallel write access to the regulator control registers is delayed and later overrides the HW
configuration. The sequencer does not change regulator settings enabled for GPI control. Powering
down to RESET mode automatically disables all buck converters. When the output of a buck
converter is combined with a parallel low power LDO, its pull-down resistor needs to be disabled via
Bxxxx_PD_DIS. Otherwise its output is discharged to GND when being disabled.
To allow DVC transitions under load, the buck current limit should be configured at least 40% higher
than the required maximum continuous output current. See Table 35 as a guide to determining this
limit.
Table 35: Selection of Buck Current Limit from Coil Parameters
Min. ISAT
(mA)
Frequency
(MHz)
Buck Current Limit
(mA)
Max. Output Current
(mA)
3800
3
3400
2400
3100
3
2800
2000
2400
3
2100
1500
1700
3
1700
1200
To ensure correct regulation, the buck converters require the supply voltage to be 0.7 V higher than
the output voltage. As this is not always possible at higher output voltage settings, the converters
BUCKMEM, BUCKIO, and BUCKPERI provide a follower mode where the electrical characteristics of
the DC-DC converter no longer apply, but instead the PMOS output driver is fully-on and the output
voltage simply follows the dropping input voltage. There will be a voltage drop between the buck
VDD supply and the output which results from the on-resistance of the buck PMOS driver and the
coil, with the voltage drop magnitude being depending on load current. Bucks running in follower
mode will temporarily stop switching and by that process will generate PWM mode 3 MHz subharmonics.
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6.10.1
BUCKCORE1, BUCKCORE2, and BUCKPRO
BUCKCORE1, BUCKCORE2, and BUCKPRO include a full-current (previously overdrive) mode,
individually enabled via control BCORE1_OD, BCORE2_OD, and BPRO_OD.
In full-current mode:
● The maximum current capability is 2500 mA
● The selected current limits are automatically doubled
● The quiescent current increases due to the increased switching losses
For full-current mode, the application requires two 47 µF output capacitors and an appropriate
inductor that can sustain higher currents without heating up or suffering from inductance degradation.
BUCKCORE1 and 2 can also be merged as a dual-phase BUCKCORE with up to 5000 mA
maximum output current. If enabled in OTP via BCORE_MERGE, the register controls of
BUCKCORE2 (except BCORE2_PD_DIS) are automatically disabled and the output from both coils
must be routed together. The feedback signal for both phases is taken from the sense node switch
matrix of BUCKCORE1 (the VBUCKCORE2 pin may be left floating if the internal pull-down resistor
is enabled by setting BCORE2_PD_DIS = 0). With BCORE1_FB programmed in OTP to 0b000, a
differential remote sensing at the point-of-load can be enabled, using VBUCKCORE2 as a GND
sense port. In this mode, the BUCKCORE output capacitor voltage has to be routed to port
CORE_SWS or GP_FB_2 (selected via control MERGE_SENSE). Depending on the settings of
BCORE1_OD, the dual-phase buck provides a maximum 2500 mA or 5000 mA, requiring two or four
47 µF output capacitors, respectively.
BUCKCORE2 always runs on the inverted clock (anti-phase) of BUCKCORE1. The switching node
output of both phases must be connected symmetrically on the PCB (with matched routing
inductances and resistances).
GP_FB2 or CORE_SWS
VSYS
VBUCK_CORE1
1µH
ZT
Load
BUCK
CORE1
VSYS
3x22/47µF
VBUCK_CORE2
1µH
ZT
1x22/47µF
BUCK
CORE2
ZT = resistance of PCB traces
Figure 27: BUCKCORE1 and BUCKCORE2 in Dual-Phase Remote Sense Mode
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6.10.2
BUCKPRO in DDR Memory Bus Termination Mode
VTTR
VDDQ
If enabled via BPRO_VTT_EN, BUCKPRO offers an alternative mode to provide VTT bus termination
for DDR memory. In this mode, its output voltage tracks 50 % of the VDDQ sense port voltage
(Figure 28). In this mode, BUCKPRO must be set to sync mode either by the host or by OTP
configuration. If enabled via BPRO_VTTR_EN, a second VTTR output provides the same voltage for
a DDR VTTR reference rail, buffered with ± 10 mA source/sink capability (requires 0.1 µF
stabilization capacitor). With BPRO_VTTR_EN being asserted in combination with BPRO_VTT_EN
released, the DA9063L provides a VTTR reference buffer with BUCKPRO running in a normal output
voltage control mode. If memory termination is not required (BPRO_VTTR_EN = 0), port VDDQ
provides the state of event E_GPI2 and port VTTR provides the state of the 1.2 V comparator.
VTT = VBUCKPRO
+
VSYS
SWBUCKPRO
BUCK
PRO
VSS
Figure 28: BUCKPRO Memory Bus Termination Mode
6.10.3
BUCKMEM and BUCKIO in Merged Mode
The converter BUCKMEM can be merged with BUCKIO via control BUCK_MERGE to form a single
DC-DC converter with a maximum output current of 3000 mA (Figure 29). The routing of the switcher
output pins to the common inductor must be symmetrical. The VBUCKIO feedback pin may be left
floating in merged mode if its internal pull-down resistor is enabled by setting BIO_PD_DIS = 0. The
inductor (1.0 µH) and the output capacitor have to be selected according to the increased output
current configuration controls of BUCKIO are disabled by asserting the bit BUCK_MERGE; the
selected current limits of BUCKMEM are automatically doubled.
SWBUCKIO
Symmetrical
wiring required
40uF
SWBUCKMEM
VBUCKMEM
Figure 29: BUCKMEM Merged With BUCKIO
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6.11 General Purpose ADC
6.11.1
ADC Overview
The Analog to Digital Converter (ADC) uses a sample and hold successive approximation switched
capacitor architecture. It is supplied from VDDCORE (2.5 V). Configured via control ADC_MODE, it
can be used either in high-speed mode with measurement sequences repeated every 1 ms or in
economy mode with sequences repeated every 10 ms.
6.11.2
ADC Input MUX
The DA9063L provides an ADC with 10-bit resolution and track and hold circuitry combined with an
analog input multiplexer (Figure 30). The analog input multiplexer allows conversion of up to nine
different inputs. The track and hold circuit ensures stable input voltages at the input of the ADC
during the conversion.
The ADC is used to measure the following inputs:
●
●
●
●
●
●
●
●
●
Channel 0: VSYS_RES – measurement of the system VDD (2.5 V to 5.5 V)
Channel 1: ADCIN1_RES – high impedance input (0 to 2.5 V)
Channel 2: ADCIN2_RES – high impedance input (0 to 2.5 V)
Channel 3: ADCIN3_RES – high impedance input (0 to 2.5 V)
Channel 4: TJ – measurement of internal temperature sensor
Channel 5: Reserved
Channel 8: MON_A8_RES – group 1 internal regulators voltage (0 to 5.0 V)
Channel 9: MON_A9_RES – group 2 internal regulators voltage (0 to 5.0 V)
Channel 10: MON_A10_RES – group 3 internal regulators voltage (0 to 5.0 V)
Figure 30: ADC Block Diagram
The MUX selects from and isolates the nine inputs, and presents the channel to be measured to the
ADC input. When selected, an input amplifier on the VSYS channel subtracts the VDDCORE reference
voltage and scales the signal to the correct value for the ADC.
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6.11.3
Manual Conversion Mode
Manual measurements by the ADC are initiated by an ADC_MAN bit register write. The ADC powers
up, one conversion is done on the channel specified by ADC_MUX and the 10-bit result is stored in
the ADC_RES_H and ADC_RES_L registers. After the conversion is completed, the ADC powers
down again, ADC_MAN bit is reset and an IRQ event flag is set (E_ADC_RDY). The generation of
this IRQ can be masked by the IRQ mask M_ADC_RDY.
6.11.4
Automatic Measurements Scheduler
The automatic measurement scheduler allows monitoring of the system voltage VSYS, the auxiliary
channels ADCIN1 to 3 and the output voltage supervision of embedded regulators. The results are
automatically compared with upper and lower thresholds set by power manager registers to give an
nIRQ event if a measurement is outside these levels. All measurements are handled by the
scheduler system detailed below.
The scheduler performs a sequence of 10 slots continually repeated according to the configured
mode. A slot requires 100 µs. The pattern of measurements over the 10 slots depends upon the
enabled automatic measurements. Additional manual measurement opportunities are available in
slots where automatic measurements have been disabled by control bits in ADC_CONT. Automatic
measurements only store the eight MSBs of the ADC measurement.
Figure 31 shows (with typical configurations) how the different measurements are scheduled.
Figure 31: ADC Sequence
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6.11.4.1
A0: VSYS Voltage nIRQ Measurement Mode
VSYS is measured, stored in VSYS_RES and compared with the VSYS_MON threshold. If the result
of the comparison is different to its previous state (being either lower or higher) for three consecutive
readings, an E_VDD_MON event is generated. Glitches of a duration less than three consecutive
measurements do not update the state; events are triggered at rising and falling edges of the state
signal. This multiple reading debounces the VSYS voltage before issuing an nIRQ. After the nIRQ
assertion, the automatic measurement of channel VSYS is paused for reading. The host must clear the
associated event flag to re-enable the supervision of VSYS. The event-causing value is kept in the
result register.
If selected via GPIO12_PIN, the debounced comparator state can be indicated via the GPO12 port,
representing a power good signal that can be used, for example, to trigger boot activities on external
ICs. If no action is taken to restore the VSYS voltage (that is, discharging of the battery continues), the
host may consider switching off optional always-on blocks to save energy later on. VSYS
measurements are enabled via control AUTO_VSYS_EN.
Figure 32: VSYS Monitor Persistence Behavior
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6.11.4.2
A1, A2, A3: Automatic Measurement and High/Low Threshold Warning nIRQ Mode
The automatic measurement result of channel ADC_IN1 is stored in the ADCIN1_RES register. If a
reading of A1 is less than AUTO1_LOW or greater than AUTO1_HIGH, then the event flag E_GPI0 is
set. If nIRQ is asserted, the automatic measurement of channel ADC_IN1 is paused until the host
has cleared the associated event flag (the event-causing value is kept in the result register). The
assertion of nIRQ can be masked by IRQ mask M_GPI0, which also disables the pausing of
automatic measurements. If debouncing is selected via ADCIN1_DEB the event is only asserted if
two consecutive measurements override the same threshold. The automatic measurement is
enabled by register AUTO_AD1_EN. In addition, it is possible to use ADCIN_1 with a 1 μA to 40 μA
current source that allows automatic measurement of a resistor value (programmed via
ADCIN1_CUR). The current source is enabled by AD1_ISRC_EN. During automatic measurements
the enabled current source is dynamically switched off at the end of the conversion and switched on
one slot prior to the next ADCIN_1 measurement (to enable minimum current consumption, and
allow any external capacitance voltage to settle); otherwise its status is static.
A similar functionality is available at ADC_IN2 and ADC_IN3. ADC_IN2 provides notification to the
processor via a fixed voltage comparator (also available when ADC is powered down) but the
ADCIN2 current source is static (no dynamic switch-off at the end of automatic conversion). The
input selection switch of ADC_IN2 provides an enhanced isolation (80 dB typ.) between the
externally-connected circuit and the internal ADC block (for example, allowing the DC supervision of
noise sensitive audio lines).
Figure 33: A1, A2, A3 Persistence Behavior
Datasheet
CFR0011-120-00
DA9063L_2v1
86 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
6.11.4.3
A8, A9, A10: Automatic Regulator Monitor with Under- or Over-Voltage Shutdown
DA9063L provides the capability to monitor the output voltage of internal regulators. In case of a
catastrophic failure, the related regulator is disabled. This feature is enabled using control
MON_MODE. Each internal regulator is assigned to a GPADC input channel and can be individually
enabled for monitoring via controls BCORE1_MON_EN to LDO11_MON_EN. For example, if ADC
channel A8 is connected to an enabled regulator and it is also enabled for monitoring, the ADC
automatically measures the regulator output voltage every 1 ms (10 ms in ADC economy mode).
Simultaneously, two relative thresholds are calculated from the regulator nominal output voltage
(supporting DVC). If the regulator is out of range, the voltage measurement is stored inside
MON_A8_RES, the regulator ID is recorded inside the index MON_A8_IDX and the event flag
E_REG_UVOV is set. To secure a stable output voltage, the monitoring is delayed after regulators
are switched on and when changing their voltage level to a new target (that is, during DVC slewing,
after writing into the active regulator voltage register, or when the active voltage control register is
changing between Vxxx_A and Vxxx_B). This delay is programmable using control UVOV_DELAY.
If debouncing is selected via MON_DEB, an event is only created if two consecutive measurements
exceed the same threshold. The feature is also available for channels A9 and A10.
Table 36: Assignment of Regulators for Voltage Monitoring
ADC channel
Regulator
Enable
A8
BUCKCORE1
BUCKCORE2
BUCKPRO
LDO3
LDO11
BCORE1_MON_EN
BCORE2_MON_EN
BPRO_MON_EN
LDO3_MON_EN
LDO11_MON_EN
A9
BUCKIO
BUCKMEM
BUCKPERI
BIO_MON_EN
BMEM_MON_EN
BPERI_MON_EN
A10
LDO7
LDO8
LDO9
LDO7_MON_EN
LDO8_MON_EN
LDO9_MON_EN
If more than one regulator is assigned to A8, A9, or A10, the regulator measurements are
sequentially multiplexed on this channel (elongates the measurement period of 1 ms or 10 ms by
each additional assigned regulator). In the case of an E_REG_UVOV event, the regulator monitoring
continues and shuts down rails facing catastrophic failure (voltage and IDX controls contain
information for determining the cause of the most recently detected under- or over-voltage). When
clearing E_REG_UVOV via a host write, the related regulator index controls are reset. In the unlikely
case in which several regulators from a sequenced ADC channel have triggered an under- or overvoltage condition before the host was able to read the related controls, all monitored supplies may be
checked for their actual state (enabled or shutdown) to detect if further supplies have also been shut
down in addition to the one captured by the index control.
The assertion of nIRQ can be masked by IRQ mask M_REG_UVOV. With a masked nIRQ from
regulator supervision, the setting of MON_RES determines whether an out-of-range detection
disables the related regulator or triggers the assertion of port nRESET. In the latter case, nRESET is
asserted for 1 ms and continues to be asserted until the regulator returns to being in range
(regulators that are not enabled but are selected for monitoring do not trigger the assertion of
nRESET). With a masked nIRQ, GP_FB2 can be configured to flag PWR_OK, indicating that all
monitored regulator voltages are in-range. Selecting disabled regulators for monitoring suppresses
the assertion of PWR_OK.
Datasheet
CFR0011-120-00
DA9063L_2v1
87 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
The regulator monitor unit provides alternative modes selected via MON_MODE. In measurementonly mode, the event flag E_REG_UVOV is set for every automatic measurement result being
available on either A8, A9, or A10 (with a maximum of one regulator per channel being enabled for
measurements). When enabled, an auto-measurement on A8, A9, or A10 allows the host to get its
actual output voltage from registers MON_A8_RES to MON_A10_RES. When multiple ADC
channels are enabled for automatic regulator voltage measurements, the burst measurement mode
may reduce the control interface traffic and number of nIRQ assertions. When the ADC time slot of
A10 has finished, the event flag E_REG_UVOV is set (independent of A10 being enabled for automeasurements). The host can then read the measurement results stored inside MON_A8_RES MON_A10_RES as a block. During measurement modes, there are no threshold comparisons or
regulator shutdowns. If the nIRQ line was asserted, automatic measurements on channels A8 (A9
and A10) are paused until the host has cleared the associated event flag (the event-causing value is
kept in the result registers). During measurement modes, E_REG_UVOV is cleared by writing the
read value into register EVENT_B. To sequentially measure other regulators on ADC input channels
A8, A9, and A10, the host has to set the monitor enable for the next measurement slot to the
required regulator before clearing the event. The assertion of nIRQ can be masked by IRQ mask
M_REG_UVOV, which also disables the pausing of automatic measurements. For further information
about voltage monitoring, please see DA9063 Voltage Monitoring [2].
Note
Voltage monitoring function cannot be used for any LDO in bypass mode.
6.11.4.4
A4: Manual Measurement TJ
The 10-bit result of manual measurements is stored in the registers ADC_RES_L and ADC_RES_H.
Channel 4 (TJ) is used to measure the output of the internal temperature sensor (generated from a
proportional to absolute temperature (PTAT) current using a bandgap reference circuit). The ADC
measurement result and the T_OFFSET value can be used by the host to calculate the internal
junction temperature, defined by the following formula:
TJ [°C] = -0.398 * (ADC - T_OFFSET) + 330
Manual measurements on A8 to A10 are possible, but require disabling the automatic measurements
on these channels and also ensuring that only one regulator is connected to each of these ADC
channels.
NOTE
The T_OFFSET value is stored in the T_OFFSET register at address 0x104 during manufacture.
6.11.5
Fixed Threshold Comparator
A comparator with a threshold of 1.2 V is connected to the input of ADC channel 2. The comparator
is asserted when the input voltage exceeds or drops below 1.2 V for at least 10 ms (debouncing).
After being enabled via COMP1V2_EN, the status flag COMP1V2 indicates the actual state and a
maskable interrupt request E_COMP1V2 is generated at the falling and rising edge state transitions.
The comparator may be disabled via COMP1V2_EN when auto-measurements with high resolution
are executed on ADCIN2.
Datasheet
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DA9063L_2v1
88 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
6.12 Adjustable Frequency Internal Oscillator
An internal oscillator provides a nominal 6.0 MHz clock that is divided down to 3.0 MHz for the buck
converters. It is divided down to 2.0 MHz to control the digital core, timers, PWM units, charge pump
and ADC. The frequency of the internal oscillator is adjusted during the initial start-up sequence of
the DA9063L to within 5 % of the nominal 6.0 MHz. It can be adjusted further within ±10 % via
register control OSC_FRQ. The tolerance of this frequency affects most absolute timer values and
PWM repetition rates (for example, LED and vibrator mode drivers) of the DA9063L.
6.13 Reference Voltage Generation: VREF, VLNREF
The DA9063L includes a temperature-independent voltage reference circuit which is derived from an
internal band-gap reference and OTP-trimmed buffer amplifier. The output voltage on VREF is
trimmed to 1.2 V and the reference is decoupled by an external capacitor on the VREF pin. A lower
voltage instance of VREF is provided at VLNREF (0.9 V) and used for the LDOs. These pins must
not be loaded. The IREF pin provides the internally used accurate current bias and requires an
external 200 kΩ precision resistor.
6.14 Thermal Supervision
The application must ensure that the DA9063L junction temperature does not exceed 125 °C. To
protect the DA9063L from damage due to excessive power dissipation, the internal temperature is
continuously monitored. Whenever the junction temperature is higher than TEMP_WARN = 125 °C,
an E_TEMP event is asserted and an IRQ is generated for the host. If this occurs during
POWERDOWN mode, a wakeup is triggered.
The host may then check the exact junction temperature by a manual measurement on GPADC
channel 4. An 8-bit OTP register (T_OFFSET) can be used to store its offset at a known temperature
(for example 50 °C) to improve the absolute accuracy, which should then be ±7 °C of the measured
silicon die junction temperature. This T_OFFSET can be used by the host to calculate the absolute
die temperature.
The absolute die junction temperature can be calculated by the host using the result from the ADC
channel 4 measurement result and the T_OFFSET trim values.
When the junction temperature exceeds 125 °C, it is recommended to shut down optional functions
of the application allowing the DA9063L to cool. When the junction temperature increases further,
exceeding TEMP_CRIT = 140 °C, the fault flag TEMP_CRIT is asserted in the FAULT_LOG register
and the DA9063L immediately shuts down to RESET mode. The fault condition remains as long as
the junction temperature is higher than TEMP_WARN. The TEMP_CRIT flag can be evaluated by the
application after the next power up. Whenever the junction temperature exceeds TEMP_POR =
150 °C, a POR to the digital core is immediately asserted and this stops all functions of the DA9063L.
This is necessary to prevent the possibility of permanent device damage.
6.15 Main System Rail Voltage Supervision
The supervision of the system supply VSYS is performed by two comparators. One monitors the
under-voltage level VDD_FAULT_LOWER (fault condition indicator); the other,
VDD_FAULT_UPPER, indicates a good (valid) battery/external supply. The high-to-low transition of
the VDD_FAULT_UPPER signal is also used as a low system supply warning indicator, informing the
host via event E_VDD_WARN (or the assertion of port nVDDFAULT) that the system rail may soon
drop below the under-voltage threshold.
The VDD_FAULT_LOWER threshold is OTP-configurable and can be set via the VDD_FAULT_ADJ
control bits from 2.5 V to 3.25 V in steps of 50 mV. The VDD_FAULT_UPPER level is also OTPconfigurable and can be set via the VDD_HYST_ADJ from 100 to 450 mV higher than the
programmed VDD_FAULT_LOWER threshold.
Datasheet
CFR0011-120-00
DA9063L_2v1
89 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
7
Register Map
This section provides an overview of the registers. A description of each register is provided in
Appendix A.
This section gives an overview of all user accessible registers in the Register map table. Detailed
descriptions are given in Register description tables, which are grouped per functional block.
Optionally, use bookmarks in the table title to create hyperlinks between entries in the Register map
table and the related Register description table.
Datasheet
CFR0011-120-00
DA9063L_2v1
90 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
PAGE 0
(Hex)
00
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
3F
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
P A GE_CON
Revert
WRITE_M ODE
Reserved
Reserved
REG_P A GE
Reserved
System Control and Event Registers (SYSMON)
STA TUS_A
WA KE
nONKEY
STA TUS_B
GP I7
GP I6
GP I5
GP I4
GP I3
GP I2
GP I1
GP I0
STA TUS_C
GP I15
GP I14
GP I13
GP I12
GP I11
GP I10
GP I9
GP I8
STA TUS_D
LDO11_LIM
LDO8_LIM
LDO7_LIM
LDO4_LIM
LDO3_LIM
Reserved
Reserved
Reserved
WA IT_SHUT
nSHUTDOWN
FA ULT_LOG
Reserved
Reserved
Reserved
Reserved
KEY_RESET
COM P 1V2
DVC_B USY
TEM P _CRIT
VDD_STA RT
VDD_FA ULT
P OR
TWD_ERROR
EVENT_A
EVENTS_D
EVENTS_C
EVENTS_B
E_SEQ_RDY
E_A DC_RDY
E_TICK
E_A LA RM
E_nONKEY
EVENT_B
E_VDD_WA RN
E_VDD_M ON
E_DVC_RDY
E_REG_UVOV
E_LDO_LIM
E_COM P _1V2
E_TEM P
E_WA KE
EVENT_C
E_GP I7
E_GP I6
E_GP I5
E_GP I4
E_GP I3
E_GP I2
E_GP I1
E_GP I0
EVENT_D
E_GP I15
E_GP I14
E_GP I13
E_GP I12
E_GP I11
E_GP I10
E_GP I9
E_GP I8
IRQ_M A SK_A
R e s e rv e d
R e s e rv e d
R e s e rv e d
M _SEQ_R D Y
M _A D C _R D Y
M _ T IC K
M _ A LA R M
M _ nO N KE Y
IRQ_M A SK_B
M _ V D D _ WA R N
M _VD D _M ON
M _D VC _R D Y
M _ R E G _ UV O V
M _ LD O _ LIM
M _ C O M P _ 1V 2
M _T EM P
M _ WA KE
M _ G P I0
IRQ_M A SK_C
M _ G P I7
M _ G P I6
M _ G P I5
M _ G P I4
M _ G P I3
M _ G P I2
M _ G P I1
IRQ_M A SK_D
M _ G P I15
M _ G P I14
M _ G P I13
M _ G P I12
M _ G P I11
M _ G P I10
M _ G P I9
M _ G P I8
CONTROL_A
C P _EN
M _P OWER1_EN
M _P OWER_EN
M _SYSTEM _EN
ST A N D B Y
P O WE R 1_ E N
P O WE R _ E N
SYST EM _EN
CONTROL_B
B UC K_ S LO WS T A R T
R e s e rv e d
R e s e rv e d
nO N KE Y _ LO C K
nR E S _ M O D E
R E S E T _ B LIN KIN G
WA T C H D O G _ D IS
C H G_SEL
CONTROL_C
D E F _ S UP P LY
OT P R EA D _EN
A UT O _ B O O T
S LE W_ R A T E
B LIN K_ D UR
CONTROL_D
D E B O UN C IN G
B LIN K_ F R Q
T WD S C A LE
CONTROL_E
V _ LO C K
P M _ F B 3 _ P IN
P M _ F B 2 _ P IN
P M _ F B 1_ P IN
EC O_M OD E
R T C _EN
R T C _M OD E_SD
R T C _M OD E_P D
CONTROL_F
Reserved
Reserved
Reserved
Reserved
Reserved
WA KE_UP
SHUTDOWN
WA TCHDOG
P D_DIS
P M C O N T _ D IS
O UT 3 2 K_ P A US E
B B A T _ D IS
R e s e rv e d
H S 2 IF _ D IS
P M IF _ D IS
G P A D C _ P A US E
G P I_ D IS
GPIO Control Registers (GPIO)
GP IO0-1
G P IO 1_ WE N
G P IO 1_ T Y P E
G P IO 1_ P IN
G P IO 0 _ WE N
G P IO 0 _ T Y P E
G P IO 0 _ P IN
GP IO2-3
G P IO 3 _ WE N
G P IO 3 _ T Y P E
G P IO 3 _ P IN
G P IO 2 _ WE N
G P IO 2 _ T Y P E
G P IO 2 _ P IN
GP IO4-5
G P IO 5 _ WE N
G P IO 5 _ T Y P E
G P IO 5 _ P IN
G P IO 4 _ WE N
G P IO 4 _ T Y P E
G P IO 4 _ P IN
GP IO6-7
G P IO 7 _ WE N
G P IO 7 _ T Y P E
G P IO 7 _ P IN
G P IO 6 _ WE N
G P IO 6 _ T Y P E
G P IO 6 _ P IN
GP IO8-9
G P IO 9 _ WE N
G P IO 9 _ T Y P E
G P IO 9 _ P IN
G P IO 8 _ WE N
G P IO 8 _ T Y P E
G P IO 8 _ P IN
GP IO10-11
G P IO 11_ WE N
G P IO 11_ T Y P E
G P IO 11_ P IN
G P IO 10 _ WE N
G P IO 10 _ T Y P E
G P IO 10 _ P IN
GP IO12-13
G P IO 13 _ WE N
G P IO 13 _ T Y P E
G P IO 13 _ P IN
G P IO 12 _ WE N
G P IO 12 _ T Y P E
G P IO 12 _ P IN
GP IO14-15
G P IO 15 _ WE N
G P IO 15 _ P IN
G P IO 15 _ T Y P E
G P IO 14 _ WE N
G P IO 14 _ P IN
G P IO 14 _ T Y P E
GP IO_M ODE0-7
G P IO 7 _ M O D E
G P IO 6 _ M O D E
G P IO 5 _ M O D E
G P IO 4 _ M O D E
G P IO 3 _ M O D E
G P IO 2 _ M O D E
G P IO 1_ M O D E
G P IO 0 _ M O D E
GP IO_M ODE8-15
G P IO 15 _ M O D E
G P IO 14 _ M O D E
G P IO 13 _ M O D E
G P IO 12 _ M O D E
G P IO 11_ M O D E
G P IO 10 _ M O D E
G P IO 9 _ M O D E
G P IO 8 _ M O D E
SWITCH_CONT
C P _EN _M OD E
C O R E _ S W_ IN T
S WIT C H _ S R
P E R I_ S W_ G P I
C O R E _ S W_ G P I
Regulator Control Registers (REG)
B CORE2_CONT
R e s e rv e d
VB C OR E2_GP I
Reserved
B C OR E2_C ON F
B C OR E2_GP I
B CORE2_EN
B CORE1_CONT
C O R E _ S W_ C O N F
V B C O R E 1_ G P I
CORE_SW_EN
B C O R E 1_ C O N F
B C O R E 1_ G P I
B CORE1_EN
B P RO_CONT
R e s e rv e d
VB P R O_GP I
Reserved
B P R O_C ON F
B P R O_GP I
B P RO_EN
B M EM _CONT
R e s e rv e d
VB M EM _GP I
Reserved
B M EM _C ON F
B M EM _GP I
B M EM _EN
B IO_CONT
R e s e rv e d
V B IO _ G P I
Reserved
B IO _ C O N F
B IO _ G P I
B IO_EN
B P ERI_CONT
P E R I_ S W_ C O N F
V B P E R I_ G P I
P ERI_SW_EN
B P E R I_ C O N F
B P E R I_ G P I
B P ERI_EN
LDO1_CONT
LD O 1_ C O N F
V LD O 1_ G P I
Reserved
LD O 1_ P D _ D IS
LD O 1_ G P I
LDO1_EN
LDO2_CONT
LD O 2 _ C O N F
V LD O 2 _ G P I
Reserved
LD O 2 _ P D _ D IS
LD O 2 _ G P I
LDO2_EN
LDO3_CONT
LD O 3 _ C O N F
V LD O 3 _ G P I
Reserved
LD O 3 _ P D _ D IS
LD O 3 _ G P I
LDO3_EN
LDO4_CONT
LD O 4 _ C O N F
V LD O 4 _ G P I
Reserved
LD O 4 _ P D _ D IS
LD O 4 _ G P I
LDO4_EN
LDO5_CONT
LD O 5 _ C O N F
V LD O 5 _ G P I
VLDO5_SEL
LD O 5 _ P D _ D IS
LD O 5 _ G P I
LDO5_EN
LDO6_CONT
LD O 6 _ C O N F
V LD O 6 _ G P I
VLDO6_SEL
LD O 6 _ P D _ D IS
LD O 6 _ G P I
LDO6_EN
LDO7_CONT
LD O 7 _ C O N F
V LD O 7 _ G P I
VLDO7_SEL
LD O 7 _ P D _ D IS
LD O 7 _ G P I
LDO7_EN
LDO8_CONT
LD O 8 _ C O N F
V LD O 8 _ G P I
VLDO8_SEL
LD O 8 _ P D _ D IS
LD O 8 _ G P I
LDO9_CONT
LD O 9 _ C O N F
V LD O 9 _ G P I
VLDO9_SEL
LD O 9 _ P D _ D IS
LD O 9 _ G P I
LDO9_EN
LDO10_CONT
LD O 10 _ C O N F
V LD O 10 _ G P I
VLDO10_SEL
LD O 10 _ P D _ D IS
LD O 10 _ G P I
LDO10_EN
LDO11_CONT
LD O 11_ C O N F
V LD O 11_ G P I
LDO8_EN
LD O 11_ G P I
VLDO11_SEL
LD O 11_ P D _ D IS
VB P ERI_SEL
VB M EM _SEL
VB P RO_SEL
VB CORE2_SEL
VB CORE1_SEL
LDO11_EN
Reserved
Reserved
Reserved
Reserved
VB IO_SEL
A UT O _ A D 3 _ E N
A UT O _ A D 2 _ E N
A UT O _ A D 1_ E N
A UT O _ V S Y S _ E N
Reserved
Reserved
Reserved
V IB _ S E T
VIB
R e s e rv e d
R e s e rv e d
DVC_1
VLDO3_SEL
VLDO2_SEL
VLDO1_SEL
DVC_2
VLDO4_SEL
Reserved
Reserved
GP-ADC Control Registers (GPADC)
A DC_M A N
R e s e rv e d
R e s e rv e d
A D C _M OD E
A DC_M A N
A DC_CONT
C O M P 1V 2 _ E N
A D 3 _ IS R C _ E N
A D 2 _ IS R C _ E N
A D 1_ IS R C _ E N
A D C _ M UX
VSYS_M ON
VSYS_M ON
A DC_RES_LSB
A DC_RES_L
Reserved
Reserved
Reserved
A DC_RES_H
A DC_RES_M SB
VSYS_RES
VSYS_RES
A DCIN1_RES
A DCIN1_RES
A DCIN2_RES
A DCIN2_RES
A DCIN3_RES
A DCIN3_RES
M ON1_RES
M ON1_RES
M ON2_RES
M ON2_RES
M ON3_RES
M ON3_RES
RTC Calendar and Alarm Registers (RTC)
COUNT_SEC
COUNT_S
RTC_REA D
Reserved
COUNT_M I
Reserved
Reserved
COUNT_H
Reserved
Reserved
Reserved
COUNT_D
Reserved
Reserved
Reserved
COUNT_M O
Reserved
Reserved
Reserved
COUNT_Y
Reserved
M ONITOR
COUNT_M IN
COUNT_HOUR
COUNT_DA Y
COUNT_M ONTH
Reserved
COUNT_YEA R
A LA RM _TYP E
A LA RM _S
A LA RM _SEC
A LA RM _M IN
A LA RM _M I
Reserved
Reserved
A LA RM _H
Reserved
Reserved
Reserved
A LA RM _D
Reserved
Reserved
Reserved
A LA RM _M O
Reserved
Reserved
TICK_WA KE
A LA RM _Y
TICK_ON
A LA RM _ON
A LA RM _HOUR
A LA RM _DA Y
A LA RM _M ONTH
TICK_TYP E
A LA RM _YEA R
SECOND_A
SECONDS_A
SECOND_B
SECONDS_B
SECOND_C
SECONDS_C
SECOND_D
SECONDS_D
Datasheet
CFR0011-120-00
DA9063L_2v1
91 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
PAGE 1
80
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
C0
C1
C2
C3
C4
C4
C5
C5
C6
C7
C8
C8
C9
CA
CB
CC
CD
CE
CF
P A GE_CON
Revert
WRITE_M ODE
Reserved
Reserved
REG_P A GE
Reserved
Sequencer Control Registers (SEQ)
SEQ
NXT_SEQ_STA RT
SEQ_TIM ER
S E Q _ D UM M Y
S E Q _ T IM E
ID_2_1
LD O 2 _ S T E P
SEQ_P OINTER
LD O 1_ S T E P
ID_4_3
LD O 4 _ S T E P
LD O 3 _ S T E P
ID_6_5
LD O 6 _ S T E P
LD O 5 _ S T E P
ID_8_7
LD O 8 _ S T E P
LD O 7 _ S T E P
ID_10_9
LD O 10 _ S T E P
LD O 9 _ S T E P
ID_12_11
P D _ D IS _ S T E P
LD O 11_ S T E P
ID_14_13
B UC KC O R E 2 _ S T E P
B UC KC O R E 1_ S T E P
ID_16_15
B UC KIO _ S T E P
B UC KP R O _ S T E P
ID_18_17
B UC KP E R I_ S T E P
B UC KM E M _ S T E P
P E R I_ S W_ S T E P
C O R E _ S W_ S T E P
ID_20_19
ID_22_21
G P _ F A LL1_ S T E P
G P _ R IS E 1_ S T E P
ID_24_23
G P _ F A LL2 _ S T E P
G P _ R IS E 2 _ S T E P
ID_26_25
G P _ F A LL3 _ S T E P
G P _ R IS E 3 _ S T E P
ID_28_27
G P _ F A LL4 _ S T E P
G P _ R IS E 4 _ S T E P
ID_30_29
G P _ F A LL5 _ S T E P
G P _ R IS E 5 _ S T E P
ID_32_31
E N 3 2 K_ S T E P
WA IT _ S T E P
Reserved
R e s e rv e d
R e s e rv e d
Reserved
R e s e rv e d
R e s e rv e d
SEQ_A
P O WE R _ E N D
SYST EM _EN D
SEQ_B
P A R T _ D O WN
M A X _ C O UN T
WA IT _ D IR
WA IT
EN_32K
RESET
O UT _ 3 2 K_ E N
R T C _ C LO C K
T IM E _ O UT
WA IT _ M O D E
WA IT _ T IM E
WA IT _ T IM E
O UT _ C LO C K
D E LA Y _ M O D E
C R YST A L
S T A B ILIS A T IO N _ T IM E
R ESET _EVEN T
R E S E T _ T IM E R
Regulator Setting Registers (REG)
B UCK_ILIM _A
B M E M _ ILIM
B IO _ ILIM
B UCK_ILIM _B
B P E R I_ ILIM
B P R O _ ILIM
B C O R E 2 _ ILIM
B UCK_ILIM _C
B C O R E 1_ ILIM
B CORE2_CONF
B C OR E2_M OD E
B C O R E 2 _ P D _ D IS
R e s e rv e d
R e s e rv e d
B C OR E2_F B
B CORE1_CONF
B C O R E 1_ M O D E
B C O R E 1_ P D _ D IS
R e s e rv e d
R e s e rv e d
B C O R E 1_ F B
B P RO_CONF
B P R O_M OD E
B P R O _ P D _ D IS
B P R O_VT T _EN
B P R O_VT T R _EN
B IO_CONF
B IO _ M O D E
B IO _ P D _ D IS
R e s e rv e d
R e s e rv e d
B IO _ F B
B M EM _CONF
B M EM _ M OD E
B M E M _ P D _ D IS
R e s e rv e d
R e s e rv e d
B M EM _F B
B P ERI_CONF
B P E R I_ M O D E
B P E R I_ P D _ D IS
R e s e rv e d
R e s e rv e d
B P E R I_ F B
VB CORE2_A
B C O R E 2 _ S L_ A
VB C OR E2_A
VB CORE1_A
B C O R E 1_ S L_ A
V B C O R E 1_ A
VB P RO_A
B C P R O _ S L_ A
VB P R O_A
VB M EM _A
B M E M _ S L_ A
VB M EM _A
VB IO_A
B IO _ S L_ A
V B IO _ A
VB P ERI_A
B P E R I_ S L_ A
V B P E R I_ A
VLDO1_A
LD O 1_ S L_ A
R e s e rv e d
VLDO2_A
LD O 2 _ S L_ A
R e s e rv e d
VLDO3_A
LD O 3 _ S L_ A
VLDO4_A
LD O 4 _ S L_ A
VLDO5_A
B P R O_F B
V LD O 1_ A
V LD O 2 _ A
V LD O 3 _ A
V LD O 4 _ A
LD O 5 _ S L_ A
R e s e rv e d
V LD O 5 _ A
VLDO6_A
LD O 6 _ S L_ A
R e s e rv e d
V LD O 6 _ A
VLDO7_A
LD O 7 _ S L_ A
R e s e rv e d
V LD O 7 _ A
VLDO8_A
LD O 8 _ S L_ A
R e s e rv e d
VLDO9_A
V LD O 8 _ A
LD O 9 _ S L_ A
R e s e rv e d
V LD O 9 _ A
VLDO10_A
LD O 10 _ S L_ A
R e s e rv e d
V LD O 10 _ A
VLDO11_A
LD O 11_ S L_ A
R e s e rv e d
V LD O 11_ A
VB CORE2_B
B C O R E 2 _ S L_ B
VB C OR E2_B
VB CORE1_B
B C O R E 1_ S L_ B
V B C O R E 1_ B
VB P RO_B
B C P R O _ S L_ B
VB P R O_B
VB M EM _B
B M E M _ S L_ B
VB M EM _B
VB IO_B
B IO _ S L_ B
V B IO _ B
VB P ERI_B
B P E R I_ S L_ B
V B P E R I_ B
VLDO1_B
LD O 1_ S L_ B
R e s e rv e d
V LD O 1_ B
VLDO2_B
LD O 2 _ S L_ B
R e s e rv e d
V LD O 2 _ B
VLDO3_B
LD O 3 _ S L_ B
VLDO4_B
LD O 4 _ S L_ B
VLDO5_B
LD O 5 _ S L_ B
R e s e rv e d
V LD O 5 _ B
VLDO6_B
LD O 6 _ S L_ B
R e s e rv e d
V LD O 6 _ B
VLDO7_B
LD O 7 _ S L_ B
R e s e rv e d
V LD O 7 _ B
VLDO8_B
LD O 8 _ S L_ B
R e s e rv e d
V LD O 3 _ B
V LD O 4 _ B
V LD O 8 _ B
VLDO9_B
LD O 9 _ S L_ B
R e s e rv e d
V LD O 9 _ B
VLDO10_B
LD O 10 _ S L_ B
R e s e rv e d
V LD O 10 _ B
VLDO11_B
LD O 11_ S L_ B
R e s e rv e d
V LD O 11_ B
Backup Battery Charger Control Registers (BBAT)
B C H G _ IS E T
B B A T_CONT
B C H G_VSET
GPIO PWM (LED)
GP O11_LED
G P O 11_ D IM
G P O 11_ P WM
GP O14_LED
G P O 14 _ D IM
G P O 14 _ P WM
GP O15_LED
G P O 15 _ D IM
A DC_CONT
A D C IN 3 _ D E B
G P O 15 _ P WM
GP-ADC Threshold Registers (GPADC)
A D C IN 2 _ D E B
A D C IN 1_ D E B
A D C IN 3 _ C UR
A UTO1_LOW
A UT O 1_ LO W
A UTO2_HIGH
A UT O 2 _ H IG H
A UTO2_LOW
A UT O 2 _ LO W
A UTO3_HIGH
A UT O 3 _ H IG H
A UTO3_LOW
A UT O 3 _ LO W
Datasheet
CFR0011-120-00
A D C IN 1_ C UR
A D C IN 1_ C UR
A UT O 1_ H IG H
A UTO1_HIGH
DA9063L_2v1
92 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
PAGE 2
100
100
101
102
103
04F
104
105
106
107
108
109
10A
10B
10C
10D
10E
10F
110
111
112
113
114
115
116
117
118
119
11A
11B
11C
11D
11E
11F
11E
11E
11F
120
121
122
123
124
125
126
127
128
129
12A
12B
12C
12D
12E
12F
130
131
132
132
133
134
135
136
137
138
139
13A
13B
13C
13D
P A GE_CON
Revert
WRITE_M ODE
Reserved
Reserved
REG_P A GE
Reserved
OTP (OTP)
OTP _CONT
G P _ WR IT E _ D IS
O T P _ C O N F _ LO C K
O T P _ A P P S _ LO C K
O T P _ G P _ LO C K
P C_DONE
OTP _A DDR
OTP _A DDR
OTP _DA TA
OTP _DA TA
OTP _A P P S_RD
OTP _GP _RD
OTP _TIM
Customer Trim and Configuration Registers (APPS)
T _OF F SET
T_OFFSET
IF _ B A S E _ A D D R
INTERFA CE
P M _ IF _ H S M
P M _ IF _ F M P
P M _ IF _ V
R / W_ P O L
CP HA
C P OL
nC S _ P O L
IR Q _ T Y P E
P M _O_T YP E
P M _O_V
P M _ I_ V
CONFIG_A
IF _ T Y P E
CONFIG_B
C H G _ C LK_ M O D E
CONFIG_C
B P E R I_ C LK_ IN V
B IO _ C LK_ IN V
B M E M _ C LK_ IN V
B P R O _ C LK_ IN V
B C O R E 1_ C LK_ IN V
B UC K_ D IS C H G
CONFIG_D
GP _F B 3_T YP E
GP _F B 2_T YP E
F OR C E_R ESET
H S _ IF _ H S M
H S _ IF _ F M P
SYST EM _EN _R D
nIR Q _ M O D E
G P I_ V
CONFIG_E
P E R I_ S W_ A UT O
C O R E _ S W_ A UT O
B P E R I_ A UT O
B IO _ A UT O
B M E M _ A UT O
B P P R O _ A UT O
B C O R E 2 _ A UT O
B C O R E 1_ A UT O
CONFIG_F
LD O 11_ B Y P
LD O 8 _ B Y P
LD O 7 _ B Y P
LD O 4 _ B Y P
LD O 3 _ B Y P
LD O 11_ A UT O
LD O 10 _ A UT O
LD O 9 _ A UT O
LD O 1_ A UT O
VD D _H YST _A D J
V D D _ F A ULT _ A D J
LD O 1_ T R A C K
CONFIG_G
LD O 8 _ A UT O
LD O 7 _ A UT O
LD O 6 _ A UT O
LD O 5 _ A UT O
LD O 4 _ A UT O
LD O 3 _ A UT O
LD O 2 _ A UT O
CONFIG_H
B UC K_ M E R G E
B C O R E 1_ O D
B C OR E2_OD
B P R O_OD
B C OR E_M ER GE
M ER GE_SEN SE
LD O 8 _ M O D E
CONFIG_I
LD O _ S D
IN T _ S D _ M O D E
CONFIG_J
IF _ R E S E T
IF _ T O
H OST _SD _M OD E
KE Y _ S D _ M O D E
G P I14 _ 15 _ S D
R E S E T _ D UR A T IO N
P WM _ C LK
nO N KE Y _ P IN
nO N KE Y _ S D
S H UT _ D E LA Y
KE Y _ D E LA Y
CONFIG_K
G P I7 _ P UP D
G P I6 _ P UP D
G P I5 _ P UP D
G P I4 _ P UP D
G P I3 _ P UP D
G P IO 2 _ P UP D
G P IO 1_ P UP D
G P IO 0 _ P UP D
CONFIG_L
G P IO 15 _ P UP D
G P IO 14 _ P UP D
G P IO 13 _ P UP D
G P IO 12 _ P UP D
G P IO 11_ P UP D
G P IO 10 _ P UP D
G P IO 9 _ P UP D
G P IO 8 _ P UP D
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
M ON _D EB
M ON _R ES
OSC _F R EQ
CONFIG_M
CONFIG_N
R e s e rv e d
R e s e rv e d
UV O V _ D E LA Y
M ON_REG_1
M ON _M OD E
M ON_REG_2
LD O 8 _ M O N _ E N
LD O 7 _ M O N _ E N
M ON_REG_3
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
R e s e rv e d
LD O 11_ M O N _ E N
LD O 10 _ M O N _ E N
LD O 9 _ M O N _ E N
M ON_REG_4
R e s e rv e d
R e s e rv e d
B P E R I_ M O N _ E N
B M EM _M ON _EN
B IO _ M O N _ E N
B P R O_M ON _EN
B C OR E2_M ON _EN
B C O R E 1_ M O N _ E N
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
M ON_REG_5
Reserved
M ON_REG_6
Reserved
LD O 6 _ M O N _ E N
LD O 5 _ M O N _ E N
LD O 4 _ M O N _ E N
R e s e rv e d
M ON _T H R ES
M ONA 9_IDX
Reserved
Reserved
Reserved
LD O 3 _ M O N _ E N
LD O 2 _ M O N _ E N
Reserved
M ONA 8_IDX
Reserved
M ONA 10_IDX
LD O 1_ M O N _ E N
T R IM _ C LD R
TRIM _CLDR
General Purpose Registers (GP)
GP _0
GP _ID_0
GP _ID_1
GP _1
GP _ID_2
GP _2
GP _ID_3
GP _3
GP _ID_4
GP _4
GP _ID_5
GP _5
GP _ID_6
GP _6
GP _ID_7
GP _7
GP _ID_8
GP _8
GP _ID_9
GP _9
GP _ID_10
G P _ 10
GP _ID_11
G P _ 11
GP _ID_12
G P _ 12
GP _ID_13
G P _ 13
GP _ID_14
G P _ 14
GP _ID_15
G P _ 15
GP _ID_16
G P _ 16
GP _ID_17
G P _ 17
GP _ID_18
G P _ 18
G P _ 19
GP _ID_19
Debug Registers (DEB)
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
M ISC_SUP P
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
CRYSTA L_OK
OTP _CLK_ON
Most register bits are reset to defaults (zero in most cases) when powering up from RESET mode.
An exceptions is for example FAULT_LOG that is not loaded from OTP. Register fields shown in
BOLD are loaded from OTP.
PAGE 3
180
180
181
182
183
184
P A GE_CON
Revert
WRITE_M ODE
Reserved
Reserved
REG_P A GE
Reserved
Chip ID, Trim and Production Test (PROD)
DEVICE_ID
VARIANT_ID
DEV_ID
M RC
VR C
CUSTOMER_ID
C US T _ ID
CONFIG_ID
C O N F IG _ R E V
Datasheet
CFR0011-120-00
DA9063L_2v1
93 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
8
Application Information
The following recommended components are examples selected from requirements of a typical
application. The electrical characteristics (for example, supported voltage/current range) have to be
cross-checked and component types may need to be adapted from the individual needs of the target
circuitry.
8.1
Capacitor Selection
Ceramic capacitors are used as bypass capacitors at all VDD and output rails. When selecting a
capacitor, especially for types with high capacitance at smallest physical dimension, the DC bias
characteristic has to be taken into account. On the VSYS main supply rail a minimum distributed
capacitance of 40 μF (actual capacitance after voltage and temperature derating) is required. For
example, a typical design might use:
● 22 μF within 1.5 mm of each BUCKCORE1, BUCKCORE2 and BUCKPRO supply pin.
● 10 μF within 1.5 mm of each BUCKPERI, BUCKIO and BUCKMEM supply pin or 1 μF x 22 μF if
all are attached to a PCB power/split plane.
● 2 μF x 1 μF shared by all VDD_LDOx pins if they are all close together, for example, all attached
to a power/split plane.
● 1 μF close to the VSYS pin.
● Buck output capacitors should be close to the buck inductors.
The amount of decoupling required will be dependent on the specific application.
Table 37: Recommended Capacitor Types
Application
Value
Tol.
(%)
Size
Height
(mm)
Temp.
Char.
Rated
Voltage
(V)
VDDCORE,
VLDO3,
VLDO7,
VLDO8,
VLDO9,
VLDO11,
VREF,
VLNREF,
VSYS
2.2 µF
± 20
0402
0.55
X5R ±15 %
6.3
GRM155R60J225ME95
± 20
0805
0.95
X5R ±15 %
6.3
GRM219R60J226M***
± 20
0402
0.5
X5R ±15 %
4.0
CL05A226MR5NZNC
± 20
0805
0.95
X5R ±15 %
4.0
GRM219R60G476M***
± 20
0603
0.8
X5R ±15 %
4.0
CL10A476MR8NZN
± 20
0603
1.0
X5R ±15 %
6.3
GRM188R60J226MEA0
Note 1
± 20
0402
0.5
X5R ±15 %
4.0
CL05A226MR5NZNC
± 20
0805
0.95
X5R ±15 %
4.0
GRM219R60G476M***
± 20
0805
1.45
X5R ±15 %
4.0
GRM21BR60G476ME15
± 20
0603
0.8
X5R ±15 %
4.0
CL10A476MR8NZN
10 µF
± 20
0603
0.95
X5R ±15 %
6.3
GRM188R60J106ME84
1.0 µF
± 10
0402
0.55
X5R ±15 %
10
GRM155R61A105KE15
2.2 µF
± 20
0402
0.55
X5R ±15 %
6.3
GRM155R60J225ME95
VBUCKPER,
VBUCKIO,
VBUCKMEM,
VSYS
VBUCKCORE1
and 2,
VBUCKPRO
(using fullcurrent mode)
Type (Murata/Samsung)
22 µF
47 µF
22 µF
47 µF
VSYS
VDDCORE,
VREF, VLNREF
Datasheet
CFR0011-120-00
DA9063L_2v1
94 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Application
Value
Tol.
(%)
Size
Height
(mm)
Temp.
Char.
Rated
Voltage
(V)
XIN, XOUT
12 pF
±5
0402
0.55
U2J
50
GRM1557U1H120JZ01
V_CP
47 nF
± 10
0402
0.55
X7R ±15 %
10
GRM155R71A473KA01
Note 1
8.2
Type (Murata/Samsung)
For output voltages > 1.4 V Murata GRM219R60J226M*** is recommended.
Inductor Selection
Inductors should be selected based upon the following parameters:
● Rated maximum current: Usually a coil provides two current limits: ISAT of an Inductor specifies
the current required to cause a reduction in the Inductance by a specified amount, typically 30 %,
IRMS of an Inductor specifies the current required to affect a temperature rise of a maximum
specified amount.
● DC resistance: Critical to converter efficiency at high current and should therefore be minimized.
● ESR at the buck switching frequency: Critical to converter efficiency in PFM mode and should
therefore be minimized.
● Inductance: Given by converter electrical characteristics; 1.0 µH for all DA9063L switched-mode
step-down converters.
Table 38: Recommended Inductor Types
Application
BUCKPERI,
BUCKMEM,
BUCKIO,
BUCKCORE1,
BUCKCORE2
BUCKPRO,
BUCKCORE1
and 2 using fullcurrent mode or
merged
BUCKMEM/
BUCKIO
Datasheet
CFR0011-120-00
Value
(µH)
1.0
1.0
Tol.
(%)
ISAT
(A)
IRMS
(A)
DCR
(Typ.)
(mΩ)
Size (mm)
Type
±30
2.7
2.3
55
2.0x1.6x1.0
Toko
1285AS-H-1R0N
±20
2.65
2.45
60
2.0x1.6x1.0
Tayo Yuden
MAKK2016T1R0M
(Reference)
±20
2.9
2.2
60
2.0x1.6x1.0
TDK
TFM201610ALM-1R0M
±30
3.4
3.0
60
2.5x2.0x1.0
Toko
1269AS-H-1R0N
±20
3.6
3.1
45
2.5x2.0x1.2
Tayo Yuden
MAMK2520T1R0M
±20
3.8
3.5
45
2.5x2.0x1.2
Toko
1239AS-H-1R0N
(Reference)
±30
3.9
3.1
48
3.2x2.5x1.0
Toko
1276AS-H-1R0N
±20
3.5
2.5
54
2.5x2.0x1.0
TDK
TFM252010ALM-1R0M
±20
3.35
2.5
52
3.0x3.0x1.2
Cyntec
PST031B-1R0MS
±20
5.4
11.0
11
4.0x4.0x2.1
Coilcraft
XFL4020-102ME (Ref.high
current)
DA9063L_2v1
95 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
8.3
Resistors
Table 39: Recommended Resistor Types
Application
Value
Size
Tolerance
PMAX
IREF bias current reference
200 kΩ
0402
±1%
100 mW
8.4
Type
Panasonic
ERJ2RKF2003x
Layout Guidelines
8.4.1
General Recommendations
● Appropriate trace width and quantity of vias should be used for all power supply paths.
Too high trace resistances can prevent the system from achieving the best performance, for
example, the efficiency and the current ratings of switch-mode converters and charger might be
degraded. Furthermore, the PCB may be exposed to thermal hot spots, which can lead to critical
overheating due to the positive temperature coefficient of copper.
Special care must be taken with the DA9063L pad connections. The traces of the outer row
should be connected with the same width as the pads and should become wider as soon as
possible. For supply pins in the second row, connection to an inner board layer is recommended
(depending on the maximum current two or more vias might be required).
● A common ground plane should be used, which allows proper electrical and thermal
performance. Noise sensitive references such as the VREF/VLNREF capacitors and IREF
resistor should be referred to a silent ground which is connected at a star point underneath or
close to the DA9063L main ground connection.
● Generally, all power tracks with discontinuous/high currents should be kept as short as possible.
● Noise sensitive analog signals such as feedback lines or crystal connections should be kept
away from traces carrying pulsed analog or digital signals. This can be achieved by separation
(distance) or shielding with quiet signals or ground traces.
8.4.2
LDOs and Switched Mode Supplies
● The placement of the distributed capacitors on the VSYS rail must ensure that all VDD inputs –
and especially to the VSYS pin, the buck converters and LDOs – are connected to a bypass
capacitor close to the pads. It is recommended placing at least two 1 µF capacitors close to the
LDO supply pads and at least one 10 µF close to the buck VDD rail.
Using a local power plane underneath the chip for VSYS might be considered.
● Transient current loops in the area of the switched mode converters should be minimised.
● The common references (IREF resistor, VREF/VLNREF capacitors) should be placed close to
the DA9063L and cross coupling to any noisy digital or analog trace must be avoided.
● Output capacitors of the LDOs can be placed close to the input pins of the supplied devices
(remote from the DA9063L).
● Care must be taken with trace routing to ensure that no current is carried on feedback lines of the
buck output voltages VBUCK.
● The inductor placement is less critical since parasitic inductances have negligible effect.
8.4.3
Thermal Connection, Land Pad, and Stencil Design
● The DA9063L provides a central ground area of balls, which are soldered to the PCB’s central
ground pad. This PCB ground pad must be connected with as many vias and as direct as
possible to the PCB’s main ground plane in order to achieve good thermal performance.
● Solder mask openings for the ball landing pads must be arranged to prohibit solder balls flowing
into vias.
For further PCB layout guidance, see PCB Layout Guidelines [3].
Datasheet
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DA9063L
System PMIC for Mobile and Automotive Applications
9
9.1
Definitions
Power Dissipation and Thermal Design
When designing with the DA9063L, consideration must be given to power dissipation as the level of
integration of the device can result in high power when all functions are operating with high battery
voltages. Exceeding the package power dissipation capabilities results in the internal thermal sensor
shutting down the device until it has sufficiently cooled.
The package includes a thermal management paddle to improve heat spreading into the PCB.
For Linear Regulators:
Linear regulators operating with a high current and high differential voltage between input and output
dissipate the following power:
(
)
Example: a regulator supplying 150 mA at 2.8 V from a fully-charged lithium battery (VDD=4.1 V):
(
)
For Switching Regulators:
Therefore,
(
)
(
)
Example: an 85 % efficient buck converter supplying 1.2 V at 400 mA:
(
)
As the DA9063L has multiple regulators, each supply must be separately considered and their
powers summed to give the total device dissipation (current drawn from the reference and control
circuitry can be considered negligible in these calculations).
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9.2
Regulator Parameter - Dropout Voltage
In the DA9063L, a regulator’s dropout voltage is defined as the minimum voltage differential between
the input and output voltages whilst regulation still takes place. Within the regulator, voltage control
takes place across a PMOS pass transistor and, when entering the dropout condition, the transistor
is fully turned on and therefore cannot provide any further voltage control. When the transistor is fully
turned on, the output voltage tracks the input voltage and regulation ceases. As the DA9063L is a
CMOS device and uses a PMOS pass transistor, the dropout voltage is directly related to the onresistance of the device. In the device, the pass transistors are sized to provide the optimum balance
between required performance and silicon area. By employing a 0.25 µm process, Dialog
Semiconductor is able to achieve very small pass transistor sizes for superior performance.
When defining dropout voltage, it is specified in relation to a minimum acceptable change in output
voltage. For example, all Dialog Semiconductor regulators have dropout voltage defined as the point
at which the output voltage drops 10 mV below the output voltage at the minimum guaranteed
operating voltage. The worst case conditions for dropout are high temperature (highest on-resistance
for the internal pass device) and maximum current load.
9.3
Regulator Parameter - Power Supply Rejection
Power supply rejection (PSRR) is especially important in the supplies to the RF and audio parts of
the telephone. In a TDMA system such as GSM, the 217 Hz transmit burst from the power amplifier
results in significant current pulses being drawn from the battery. These can peak at up to 2 A before
reaching a steady state of 1.4 A (see below). Due to the battery having a finite internal resistance
(typically 0.5 Ω), these current peaks induce ripple on the battery voltage of up to 500 mV. Since the
supplies to the audio and RF are derived from this supply, it is essential that this ripple is removed
otherwise it would show as a 217 Hz tone in the audio and could also affect the transmit signal.
Power supply rejection should always be specified under worst case conditions – when the battery is
at its minimum operating voltage and when there is minimum headroom available due to dropout.
9.4
Regulator Parameter - Line Regulation
Static line regulation is a measurement that indicates a change in the regulator output voltage, ∆Vreg
(regulator operating with a constant load current), in response to a change in the input voltage, ∆Vin.
Transient line regulation is a measurement of the peak change, ∆Vreg, in regulated voltage seen
when the line input voltage changes.
Vin
4.6ms TDMA frame rate
Vbat
Vreg
static
Vreg
transient
577µS
Vreg
Figure 34: Line Regulation
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System PMIC for Mobile and Automotive Applications
9.5
Regulator Parameter - Load Regulation
Static load regulation is a measurement that indicates a change in the regulator output voltage,
∆Vreg, in response to a change in the regulator loading, ∆load, whilst the regulator input voltage
remains constant. Transient load regulation is a measurement of the peak change in regulated
voltage, ∆Vreg, seen when the regulator load changes.
Iload max
Vreg
static
Vreg
transient
Iload min
Vreg
Figure 35: Load Regulation
Please contact Dialog Semiconductor for latest application information on the DA9063L and other
power management devices.
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10 Ordering Information
The ordering number consists of the part number followed by a suffix indicating the packing method.
For details and availability, please consult Dialog Semiconductor’s customer portal or your local sales
representative.
Table 40: Ordering Information
Part Number
Package
Shipment Form
Pack Quantity
Consumer: 0.30 mm ball diameter, RT production testing
DA9063L-xxHK1
100 VFBGA, 8.0 mm x 8.0 mm x 1.0 mm,
0.8 mm pitch, Pb-free/green
Tray
260
DA9063L-xxHK2
100 VFBGA, 8.0 mm x 8.0 mm x 1.0 mm,
0.8 mm pitch, Pb-free/green
T&R
3000
Automotive AEC-Q100 Grade 3: 0.45 mm ball diameter, RT production testing
DA9063L-xxHO1-A
100 TFBGA, 8.0 mm x 8.0 mm x 1.2 mm,
0.8 mm pitch, Pb-free/green
Tray
260
DA9063L-xxHO2-A
100 TFBGA, 8.0 mm x 8.0 mm x 1.2 mm,
0.8 mm pitch, Pb-free/green
T&R
3000
Automotive AEC-Q100 Grade 3: 0.45 mm ball diameter, HT production testing
DA9063L-xxHO1-AT
100 TFBGA, 8.0 mm x 8.0 mm x 1.2 mm,
0.8 mm pitch, Pb-free/green
Tray
260
DA9063L-xxHO2-AT
100 TFBGA, 8.0 mm x 8.0 mm x 1.2 mm,
0.8 mm pitch, Pb-free/green
T&R
3000
Variants Ordering Information
DA9063L supports delivery of variants indicated by xx in the Part number above, please contact your
local Dialog Semiconductor office or representative to discuss requirements.
All Dialog automotive power management products that are AEC-Q100 qualified have an -A or -AT
suffix for dual temperature production test.
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Appendix A Register Descriptions
This appendix describes the registers summarized in Section 7.
A.1
Register Page Control
Table 41: PAGE_CON
Register Address
Bit
Type
Label
0x00
PAGE_CON
7
R/W
REVERT
6
R/W
WRITE_MODE
Description
Resets REG_PAGE to 00 after read/write
access has finished
2-WIRE multiple write mode
0: Page Write Mode
1: Repeated Write Mode
5:3
R/W
Reserved
2:0
R/W
REG_PAGE
000: Selects Register 0x01 to 0x3F
001: Selects Register 0x81 to 0xCF
010: Selects Register 0x101 to 0x13F
011: Reserved for production and test
The PAGE_CON register is located at address 0x00 of each register page (0x00 and 0x80). The
control interface provides an individual instance of the PAGE_CON register.
A.2
A.2.1
Register Page 0
Power Manager Control and Monitoring
The STATUS register reports the current value of the various signals at the time that it is read out. All
the status bits have the same polarity as their corresponding signals.
Table 42: STATUS_A
Register Address
Bit
Type
Label
0x01
STATUS_A
7:4
R
Reserved
3
R
COMP1V2
2
R
DVC
1
R
WAKE
0
R
nONKEY
Description
Output state of 1.2 V comparator
Asserted as long as at least one DVC supply
performs voltage ramping
CHG_WAKE level
Asserted as long nONKEY is pressed (low
level)
Table 43: STATUS_B
Register Address
Bit
Type
Label
0x02
STATUS_B
7
R
GPI7
GPI7 level
6
R
GPI6
GPI6 level
5
R
GPI5
GPI5 level
4
R
GPI4
GPI4 level
3
R
GPI3
GPI3 level
2
R
GPI2
GPI2 level or ADCIN3 threshold indicator (1
when overriding high limit)
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Description
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DA9063L
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Register Address
Bit
Type
Label
Description
1
R
GPI1
GPI1 level or ADCIN2 threshold indicator (1
when overriding high limit)
0
R
GPI0
GPI0 level or ADCIN1 threshold indicator (1
when overriding high limit)
Table 44: STATUS_C
Register Address
Bit
Type
Label
Description
0x03
STATUS_C
7
R
GPI15
GPI15 level
6
R
GPI14
GPI14 level
5
R
GPI13
GPI13/ EXT_WAKEUP/READY level
4
R
GPI12
GPI12/nVDD_FAULT/VDD_MON level
3
R
GPI11
GPI11 level
2
R
GPI10
GPI10/PWR1_EN level
1
R
GPI9
GPI9/PWR_EN level
0
R
GPI8
GPI8/SYS_EN level
Table 45: STATUS_D
Register Address
Bit
Type
Label
Description
0x04
STATUS_D
7
R/W
LDO11_LIM
Asserted as long LDO11 hits its over-current
limit
6
R/W
LDO8_LIM
Asserted as long LDO8 hits its over-current
limit
5
R/W
LDO7_LIM
Asserted as long LDO7 hits its over-current
limit
4
R/W
Reserved
3
R/W
LDO3_LIM
2:0
R/W
Reserved
Type
Label
Asserted as long LDO3 hits its over-current
limit
Table 46: FAULT_LOG
Register Address
Bit
Description
Note 1
0x05
FAULT_LOG
Datasheet
CFR0011-120-00
7
R
WAIT_SHUT
Power down by time out of ID WAIT
6
R
nSHUT_DOWN
5
R
KEY_RESET
Power down from a long press of nONKEY or
GPIO14/15
4
R
TEMP_CRIT
Junction over-temperature detected
3
R
VDD_START
Power down by VSYS under-voltage detect before or
within 16 seconds after entering ACTIVE mode
2
R
VDD_FAULT
Power down by VSYS under-voltage detect
1
R
POR
0
R
TWD_ERROR
Power down by assertion of port nOFF,
nSHUTDOWN
DA9063L starts up from NO-POWER or DELIVERY
mode
Watchdog time violated
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Note 1
Cleared from the host by writing back the read value.
The EVENT registers hold information about events that have occurred in the DA9063L. Events are
triggered by a change in the status registers that contains the status of monitored signals. When an
EVENT bit is set in the event register the nIRQ signal is asserted (unless the nIRQ is to be masked
by a bit in the IRQ mask register). The nIRQ is also masked during the power-up sequence and is
not released until the event registers have been cleared. The IRQ triggering event register is cleared
from the host by writing back its read value. The event registers may be read in page/repeated mode.
New events that occur during clearing are delayed before they are passed to the event register,
ensuring that the host controller does not miss them.
Table 47: EVENT_A
Register Address
Bit
Type
Label
0x06
EVENT_A
7
R
EVENTS_D
Asserted when register EVENT_B to EVENT_D have
at least one event bit asserted
6
R
EVENTS_C
Asserted when register EVENT_B to EVENT_C have
at least one event bit asserted
5
R
EVENTS_B
Asserted when register EVENT_B has at least one
event bit asserted
R
E_SEQ_RDY
Sequencer reached final position caused event
ADC manual conversion result ready caused event
4
Description
Note 1
Note 1
3
R
Note 1
E_ADC_RDY
2:1
R
Note 1
Reserved
0
R
Note 1
E_nONKEY
nONKEY caused event
Cleared from the host by writing back the read value.
Table 48: EVENT_B
Register Address
Bit
Type
Note 1
Label
0x07
EVENT_B
7
R
E_VDD_WARN
6
R
E_VDD_MON
VSYS less or higher than VSYS_MON threshold
caused event
5
R
E_DVC_RDY
Finish of all DVC voltage ramping event
4
R
E_REG_UVOV
Event triggered from a monitored regulator
voltage being out of selected range or from
new regulator voltage measurement being
available (depends on settings of
MON_MODE)
3
R
E_LDO_LIM
LDO3, 7, 8 or 11 current limit exceeded for
more than 10 ms
2
R
E_COMP1V2
1.2 V comparator caused event
1
R
E_TEMP
Junction high temp caused event
0
R
E_WAKE
Detected rising edge on CHG_WAKE
Note 1
Description
VSYS dropped below VDD_FAULT_UPPER
threshold
Cleared from the host by writing back the read value.
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Table 49: EVENT_C
Register Address
Bit
Type
Note 1
Label
0x08
EVENT_C
7
R
E_GPI7
GPI event according to active state setting
6
R
E_GPI6
GPI event according to active state setting
5
R
E_GPI5
GPI event according to active state setting
4
R
E_GPI4
GPI event according to active state setting
3
R
E_GPI3
GPI event according to active state setting
2
R
E_GPI2
GPI event according to active state setting /
ADCIN3 high / low threshold exceeded caused
event
1
R
E_GPI1
GPI event according to active state setting /
ADCIN2 high / low threshold exceeded caused
event
0
R
E_GPI0
GPI event according to active state setting /
ADCIN1 high / low threshold exceeded caused
event
Note 1
Description
Cleared from the host by writing back the read value.
Table 50: EVENT_D
Register Address
Bit
Type
Label
Description
Note 1
0x09
EVENT_D
Note 1
7
R
E_GPI15
GPI event according to active state setting
6
R
E_GPI14
GPI event according to active state
setting/Event caused from host addressing HS
2-WIRE interface
5
R
E_GPI13
GPI event according to active state setting
4
R
E_GPI12
GPI event according to active state setting
3
R
E_GPI11
GPI event according to active state setting
2
R
E_GPI10
GPI/PWR1_EN event according to active state
setting
1
R
E_GPI9
GPI/PWR_EN event according to active state
setting
0
R
E_GPI8
GPI/SYS_EN event according to active state
setting
Cleared from the host by writing back the read value.
The nIRQ line is released only when all events have been cleared from the host processor by writing
the read value into all registers with an asserted event bit.
Table 51: IRQ_MASK_A
Register Address
Bit
Type
Label
0x0A
IRQ_MASK_A
7:5
R/W
Reserved
4
R/W
M_SEQ_RDY
Mask nIRQ from finishing power sequencing
3
R/W
M_ADC_RDY
Mask ADC manual conversion result ready
caused nIRQ
2:1
R/W
Reserved
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Description
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DA9063L
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Register Address
Bit
Type
Label
0
R/W
M_nONKEY
Description
Mask nONKEY caused nIRQ
Table 52: IRQ_MASK_B
Register Address
Bit
Type
Label
Description
0x0B
IRQ_MASK_B
7
R/W
M_VDD_WARN
6
R/W
M_VDD_MON
Mask VSYS caused nIRQ
5
R/W
M_DVC_RDY
Mask DVC voltage ramping triggered event
4
R/W
M_REG_UVOV
3
R/W
M_LDO_LIM
Mask LDO current limit exceeded caused
nIRQ
2
R/W
M_COMP1V2
Mask 1.2 V comparator caused nIRQ
1
R/W
M_TEMP
Mask junction over temp caused nIRQ
0
R/W
M_WAKE
Mask companion charger caused event
Mask VDDFAULT _UPPER comparator
triggered event
Mask events generated from regulator output
voltage monitoring
Table 53: IRQ_MASK_E
Register Address
Bit
Type
Label
Description
0x0C
IRQ_MASK_E
7
R/W
M_GPI7
Mask GPI caused nIRQ
6
R/W
M_GPI6
Mask GPI caused nIRQ
5
R/W
M_GPI5
Mask GPI caused nIRQ
4
R/W
M_GPI4
Mask GPI caused nIRQ
3
R/W
M_GPI3
Mask GPI caused nIRQ
2
R/W
M_GPI2
Mask GPI caused / ADCIN3 high / low
threshold exceeded caused nIRQ
1
R/W
M_GPI1
Mask GPI caused / ADCIN2 high / low
threshold exceeded caused nIRQ
0
R/W
M_GPI0
Mask GPI caused / ADCIN1 high / low
threshold exceeded caused nIRQ
Table 54: IRQ_MASK_F
Register Address
Bit
Type
Label
0x0D
IRQ_MASK_F
7
R/W
M_GPI15
Mask GPI caused nIRQ
6
R/W
M_GPI14
Mask GPI/HS 2-WIRE caused nIRQ
5
R/W
M_GPI13
Mask GPI caused nIRQ
4
R/W
M_GPI12
Mask GPI caused nIRQ
3
R/W
M_GPI11
Mask GPI caused nIRQ
2
R/W
M_GPI10
Mask GPI/PWR1_EN caused nIRQ
1
R/W
M_GPI9
Mask GPI/PWR_EN caused nIRQ
0
R/W
M_GPI8
Mask GPI/SYS_EN caused nIRQ
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Table 55: CONTROL_A
Register Address
Bit
Type
Label
Description
0xE
CONTROL_A
7
R/W
Reserved
6
R/W
M_POWER1_EN
Mask the update of POWER1_EN when
writing to CONTROL_A
5
R/W
M_POWER_EN
Mask the update of POWER_EN when writing
to CONTROL_A
4
R/W
M_SYSTEM_EN
Mask the update of SYSTEM_EN when
writing to CONTROL_A
3
R/W
STANDBY
2
R/W
POWER1_EN
Target status of power domain POWER1:
controlled from OTP/PM interface and port
PWR1_EN
1
R/W
POWER_EN
Target status of power domain POWER:
controlled from OTP/PM interface and port
PWR_EN
0
R/W
SYSTEM_EN
Target status of power domain SYSTEM:
controlled from OTP/PM interface and port
SYS_EN
Clearing SYSTEM_EN/releasing port
SYS_EN press will
0: completely power down to Slot 0
(Hibernate)
1: stop powering down at pointer
PART_DOWN (Standby)
Table 56: CONTROL_B
Register Address
Bit
Type
Label
Description
0xF
CONTROL_B
7
R/W
BUCK_SLOWSTART
Enables soft-start for buck converters
(recommended for application instant-on
with discharged battery and weak external
supply)
Note 1
Datasheet
CFR0011-120-00
6:5
R/W
Reserved
4
R/W
nONKEY_LOCK
3
R/W
nRES_MODE
2
R/W
RES_BLINKING
Enables (time limited) VDD_START triggered
GPO11/4/15 flashing in case of no connected
external supply
1
R/W
WATCHDOG_PD
0: Discontinue Watchdog timer during
POWERDOWN mode
1: Watchdog timer continues during
POWERDOWN mode
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0: Half-current POWERDOWN mode
1: Wakeup from POWERDOWN mode
requires the nONKEY signal being low for
longer than selected in KEY_DELAY
(automatically cleared during power-up
sequence)
0: No assertion of nRESET for power down
sequence
1: Assert nRESET before starting power
down sequence (release after leaving
POWERDOWN mode in case
RESET_EVENT < ‘11’)
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DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
0
R/W
CHG_SEL
Description
Port CHG_WAKE is connected to
0: Dialog charger WAKE port
1: Charger SAFE_OUT
Note 1
Increases buck start-up time up to 3 ms.
Table 57: CONTROL_C
Register Address
Bit
Type
Label
Description
0x10
CONTROL_C
7
R/W
DEF_SUPPLY
When asserted all supplies (except
LDOCORE) are enabled/disabled from OTP
default mode when entering sequencer Slot 0.
6:5
R/W
SLEW_RATE
DVC slewing (bucks and LDOs) is executed
at
00: 10 mV every 4.0 µs
01: 10 mV every 2.0 µs
10: 10 mV every 1.0 µs
11: 10 mV every 0.5 µs
4
R/W
OTPREAD_EN
0: OTP read after POWERDOWN mode
disabled
1: Power supplies are configured with OTP
values when leaving POWERDOWN mode
3
R/W
AUTO_BOOT
0: Start-up of power sequencer after
progressing from RESET mode requires a
valid wakeup event
1: PMIC automatically starts power sequencer
after progressing from RESET mode
2:0
R/W
DEBOUNCING
GPI, nONKEY and nSHUTDOWN debounce
time
000: no debounce time
001: 0.1 ms
010: 1.0 ms
011: 10.2 ms
100: 51.2 ms
101: 256 ms
110: 512 ms
111: 1024 ms
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Table 58: CONTROL_D
Register Address
Bit
Type
Label
0x11
CONTROL_D
7:6
R/W
BLINK_DUR
Description
GPO10/GPO11 flashing on-time
00: 10 ms
01: 20 ms
10: 40 ms
11: 20 ms double stroke (180 ms period)
5:3
R/W
BLINK_FRQ
GPO11/4/15 flashing frequency
000: no blinking (GPO11/14/15 state selected
via GPIOxx_MODE)
001: every second
010: every two seconds
011: every four seconds
100: every 180 ms (flicker mode)
101: every two seconds enabled by
VDD_START
110: every four seconds enabled by
VDD_START
111: every 180 ms enabled by VDD_START
Note 1
2:0
Note 1
R/W
TWDSCALE
000: Watchdog disabled
001: 1x scaling applied to TWDMAX period
010: 2x
011: 4x
100: 8x
101: 16x
110: 32x
111: 64x
Blinking from OTP settings 001 to 100 continues as long as an active charger is connected to port
CHG_WAKE. In the absence of a battery charger a time limited blinking can be enabled via
RES_BLINKING.
Table 59: CONTROL_E
Register Address
Bit
Type
Label
Description
0x12
CONTROL_E
7
R/W
V_LOCK
0: Allows host writes into registers 0x81 to
0x120
1: Disables register 0x81 to 0x120 reprogramming from host interfaces
6
R/W
PM_FB3_PIN
0: nVIB_BRAKE disabled
1: nVIB_BRAKE enabled. Feedback pin is
used as an input signal to stop and start the
vibration motor (active low nVIB_BRAKE)
5
R/W
PM_FB2_PIN
0: Feedback pin indicates the status of
regulators being selected for voltage
supervision (PWR_OK)
1: Feedback pin is used as KEEP_ACT signal
for the Watchdog unit
4
R/W
PM_FB1_PIN
0: Feedback pin indicates the detection of
a wakeup event (EXT_WAKEUP)
1: Feedback pin is used as an indicator,
signaling via low level ongoing power mode
transitions (power sequencer and DVC)
(READY)
3
R/W
ECO_MODE
When asserted DA9063L is armed for the
pulsed mode when entering RESET
Datasheet
CFR0011-120-00
DA9063L_2v1
108 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
2:0
R/W
Reserved
Description
Table 60: CONTROL_F
Register Address
Bit
Type
Label
Description
0x13
CONTROL_F
7:3
R/W
Reserved
2
R/W
WAKE_UP
If set to 1 PMU wakes up from
POWERDOWN mode. The bit is cleared back
to 0 automatically 16 sec after entering
ACTIVE mode
1
R/W
SHUTDOWN
If set to 1 the sequencer powers down to
RESET mode. The bit is cleared back to 0
automatically when entering the RESET mode
0
R/W
WATCHDOG
If set to 1 watchdog timer is reset. The bit is
cleared back to 0 automatically.
Register Address
Bit
Type
Label
Description
0x14
PD_DIS
7
R/W
PMCONT_DIS
0: SYS_EN, PWR_EN, PWR1_EN enabled
during power down
1: Auto-Disable of SYS_EN, PWR_EN and
PWR1_EN during POWERDOWN mode and
force the detection hidden transition when reenabling the control from ports
Table 61: PD_DIS
Reserved
6:4
Note 1
3
R/W
HS2WIRE_DIS
0: HS 2-WIRE not disabled during power
down
1: Auto-disable of HS 2-WIRE interface during
POWERDOWN mode
2
R/W
Reserved
1
R/W
GPADC_PAUSE
0: ADC measurements continue during power
down as configured
1: Auto-PAUSE auto measurements on A0,
A1, A2 and A3 and manual measurement
during POWERDOWN mode; if no
autonomous auto-measurements are
required (VSYS from vibration motor driver)
switch off the ADC completely
0
R/W
GPI_DIS
0: GPIO extender enabled during power
down
1: Auto-disable of features configured as GPI
pins during POWERDOWN mode and force
the detection hidden transition when reenabling the pin
When the related ID is configured to be 1 < PD_DIS_STEP ≤ MAX_COUNT the value of the above
controls define whether functions are switched on when entering POWERDOWN mode from POR or
wait until ID PD_DIS_STEP is processed.
Datasheet
CFR0011-120-00
DA9063L_2v1
109 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
A.2.2
GPIO Control
Table 62: GPIO0-1
Register Address
Bit
Type
Label
Description
0x15
GPIO0-1
7
R/W
GPIO1_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO1_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
5:4
R/W
GPIO1_PIN
PIN assigned to
00: ADCIN2/1.2 V comparator
01: GPI (optional regulator HW control)
10: GPO mode controlled (Open drain)
11: GPO mode controlled (Push-pull)
3
R/W
GPIO0_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO0_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
1:0
R/W
GPIO0_PIN
Register Address
Bit
Type
Label
0x16
GPIO2-3
7
R/W
GPIO3_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO3_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
5:4
R/W
GPIO3_PIN
PIN assigned to
00: Reserved
01: GPI
10: GPO mode controlled (Open drain)
11: GPO mode controlled (Push-pull)
3
R/W
GPIO2_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO2_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
PIN assigned to
00: ADCIN1
01: GPI
10: GPO mode controlled (Open drain)
11: GPO mode controlled (Push-pull)
Table 63: GPIO2-3
Datasheet
CFR0011-120-00
DA9063L_2v1
110 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
1:0
R/W
GPIO2_PIN
Register Address
Bit
Type
Label
0x17
GPIO4-5
7
R/W
GPIO5_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO5_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
5:4
R/W
GPIO5_PIN
PIN assigned to
00: Reserved
01: GPI
10: GPO mode controlled (Open drain)
11: GPO mode controlled (Push-pull)
3
R/W
GPIO4_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO4_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
PIN assigned to
00: ADCIN3
01: GPI (optional regulator HW control)
10: GPO Sequencer controlled (Push-pull)
11: GPO mode controlled (Push-pull)
Table 64: GPIO4-5
Description
1: GPI: active high
GPO: supplied from VDD_IO2
1:0
R/W
GPIO4_PIN
Register Address
Bit
Type
Label
0x18
GPIO6-7
7
R/W
GPIO7_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO7_TYPE
0: GPI: active low
GPO: supplied from VDD_IO1
PIN assigned to
00: CORE_SWS
01: GPI
10: GPO mode controlled (Open drain)
11: GPO mode controlled (Push-pull)
Table 65: GPIO6-7
Description
1: GPI: active high
GPO: supplied from VDD_IO2
Datasheet
CFR0011-120-00
5:4
R/W
GPIO7_PIN
3
R/W
GPIO6_WEN
DA9063L_2v1
111 of 173
PIN assigned to
00: Reserved
01: GPI
10: GPO Sequencer controlled (Push-pull)
11: GPO mode controlled (Push-pull)
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
2
R/W
GPIO6_TYPE
1:0
R/W
GPIO6_PIN
Register Address
Bit
Type
Label
0x19
GPIO8-9
7
R/W
GPIO9_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO9_TYPE
0: GPI/PWR_EN: active low
GPO: supplied from VDD_IO1
0: GPI: active low
GPO: supplied from VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
PIN assigned to
00: PERI_SWS
01: GPI
10: GPO mode controlled (Open drain)
11: GPO mode controlled (Push-pull)
Table 66: GPIO8-9
Description
1: GPI/PWR_EN: active high
GPO: supplied from VDD_IO2
5:4
R/W
GPIO9_PIN
PIN and status register bit assigned to
00: GPI with PWR_EN
01: GPI
10: GPO Sequencer controlled (Push-pull)
11: GPO mode controlled (Push-pull)
3
R/W
GPIO8_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO8_TYPE
0: GPI/SYS_EN: active low
GPO: supplied from external/VDD_IO1
1: GPI/SYS_EN: active high
GPO: supplied from VDD_IO2
1:0
R/W
GPIO8_PIN
PIN and status register bit assigned to
00: GPI with SYS_EN
01: GPI
10: GPO Sequencer controlled (Push-pull)
11: GPO mode controlled (Push-pull)
Table 67: GPIO10-11
Register Address
Bit
Type
Label
Description
0x1A
GPIO10-11
7
R/W
GPIO11_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO11_TYPE
0: GPI: active low
GPO: supplied from external/VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
5:4
Datasheet
CFR0011-120-00
R/W
GPIO11_PIN
DA9063L_2v1
112 of 173
PIN assigned to
00: GPO (Open drain, with optional blinking)
01: GPI
10: GPO Sequencer controlled (Push-pull)
11: GPO mode controlled (Push-pull)
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
3
R/W
GPIO10_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO10_TYPE
0: GPI/PWR1_EN: active low
GPO: supplied from external/VDD_IO1
1: GPI/PWR1_EN: active high
GPO: supplied from VDD_IO2
1:0
R/W
GPIO10_PIN
PIN and status register bit assigned to
00: GPI with PWR1_EN
01: GPI
10: GPO (Open drain)
11: GPO mode controlled (Push-pull )
Register Address
Bit
Type
Label
0x1B
GPIO12-13
7
R/W
GPIO13_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO13_TYPE
0: GPI: active low
GPO/GP_FB1: supplied from
external/VDD_IO1
Table 68: GPIO12-13
Description
1: GPI: active high
GPO/GP_FB1: supplied from VDD_IO2
5:4
R/W
GPIO13_PIN
PIN and status register bit assigned to
00: GPO controlled by state of GP_FB1
(EXT_WAKEUP/READY) (Push-pull)
01: GPI (optional regulator HW control)
10: GPO controlled by state of GP_FB1
(EXT_WAKEUP/READY) (Open drain)
11: GPO mode controlled (Push-pull)
3
R/W
GPIO12_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO12_TYPE
0: GPI: active low
GPO/ nVDD_FAULT/VSYS monitor:
supplied from VDD_IO1
1: GPI: active high
GPO/DD_FAULT/VSYS monitor: supplied
from VDD_IO2
1:0
Datasheet
CFR0011-120-00
R/W
GPIO12_PIN
DA9063L_2v1
113 of 173
PIN assigned to
00: nVDD_FAULT (Push-pull)
01: GPI
10: GPO controlled by the state of VSYS
monitor (Push-pull)
11: GPO mode controlled (Push-pull)
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 69: GPIO14-15
Register Address
Bit
Type
Label
Description
0x1C
GPIO14-15
7
R/W
GPIO15_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
6
R/W
GPIO15_TYPE
0: GPI: active low
GPO: supplied from external/VDD_IO1
1: GPI: active high
GPO: supplied from VDD_IO2
5:4
R/W
GPIO15_PIN
PIN assigned to
00: GPO (Open drain, with optional blinking)
01: GPI
10: CLK (configured via GPIO14_PIN)
11: GPO mode controlled (Open drain)
Note 1
3
R/W
GPIO14_WEN
0: Passive to active transition triggers a
wakeup
1: Wakeup suppressed
2
R/W
GPIO14_TYPE
0: GPI: active low
GPO: supplied from external/VDD_IO1
DATA/CLK supplied from VDD_IO1
(Note 1)
1: GPI: active high
GPO: supplied from VDD_IO2
DATA/CLK supplied from VDD_IO2
(Note 1)
1:0
R/W
GPIO14_PIN
PIN assigned to
00: GPO(Open drain, with optional blinking)
01: GPI
10: DATA (assigns GPIO15_PIN to CLK)
11: GPO mode controlled (Push-pull)
When using as HS 2-WIRE interface input logic levels are derived from VDDCORE.
Table 70: GPIO_MODE0_7
Register Address
Bit
Type
Label
Description
0x1D
GPIO_MODE0_7
7
R/W
GPIO7_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active low for
sequencer control)
1: GPI: debouncing on
GPO: Sets output to high level (active high
for sequencer control)
6
R/W
GPIO6_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active low for
sequencer control)
1: GPI: debouncing on
GPO: Sets output to high level (active high
for sequencer control)
5
Datasheet
CFR0011-120-00
R/W
GPIO5_ MODE
DA9063L_2v1
114 of 173
0: GPI: debouncing off
GPO: Sets output to low level
1: GPI: debouncing on
GPO: Sets output to high level
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
4
R/W
GPIO4_ MODE
Description
0: GPI: debouncing off
GPO: Sets output to low level(active low for
sequencer control)
1: GPI: debouncing on
GPO: Sets output to high level (active high
for sequencer control)
3
R/W
GPIO3_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active low for
sequencer control)
1: GPI: debouncing on
GPO: Sets output to high level (active high
for sequencer control)
2
R/W
GPIO2_MODE
0: GPI: debouncing off
GPO: Sets output to low level
1: GPI: debouncing on
GPO: Sets output to high level
1
R/W
GPIO1_ MODE
0: GPI: debouncing off
GPO: Sets output to low level
1: GPI: debouncing on
GPO: Sets output to high level
0
R/W
GPIO0_ MODE
0: GPI: debouncing off
GPO: Sets output to low level
1: GPI: debouncing on
GPO: Sets output to high level
Table 71: GPIO_MODE8_15
Register Address
Bit
Type
Label
Description
0x1E
GPIO_MODE8_15
7
R/W
GPIO15_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active high for
blinking)
1: GPI: debouncing on
GPO: Sets output to high level (active low for
blinking)
6
R/W
GPIO14_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active high for
blinking)
1: GPI:debouncing on
GPO: Sets output to high level (active low for
blinking)
5
R/W
GPIO13_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active low for
GP_FB1)
1: GPI: debouncing on
GPO: Sets output to high level (active high
for GP_FB1)
4
R/W
GPIO12_ MODE
0: GPI: debouncing off
GPO: Sets output to low level (active low for
nVDD_FAULT, VSYS monitor state)
1: GPI: debouncing on
GPO: Sets output to high level (active high
for nVDD_FAULT, VSYS monitor state)
Datasheet
CFR0011-120-00
DA9063L_2v1
115 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
3
R/W
GPIO11_ MODE
0: GPI: : debouncing off
GPO: Sets output to low level (active high for
blinking)
1: GPI: : debouncing on
GPO: Sets output to high level (active low for
blinking)
2
R/W
GPIO10_ MODE
0: GPI/PWR1_EN: debouncing off
GPO: Sets output to low level
1: GPI/PWR1_EN: debouncing on
GPO: Sets output to high level
1
R/W
GPIO9_ MODE
0: GPI/PWR_EN: debouncing off
GPO: Sets output to low level (active low for
sequencer control)
1: GPI/PWR_EN debouncing on
GPO: Sets output to high level (active high
for sequencer control)
0
R/W
GPIO8_ MODE
0: GPI/SYS_EN: debouncing off
GPO: Sets output to low level
1: GPI/SYS_EN: debouncing on
GPO: Sets output to high level
Table 72: Reserved
Register Address
Bit
0x1F
7:0
A.2.3
Type
Label
Description
Reserved
Regulator Control
Table 73: BCORE2_CONT
Register Address
Bit
Type
Label
0x20
BCORE2_CONT
Note 1
7
R/W
Reserved
6:5
R/W
VBCORE2_GPI
4
R/W
Reserved
3
R/W
BCORE2_CONF
2:1
R/W
BCORE2_GPI
GPIO enables BUCKCORE2 on passive to
active state transition, disables
BUCKCORE2 on active to passive state
transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
BCORE2_EN
0: BUCKCORE2 disabled
1: BUCKCORE2 enabled
Datasheet
CFR0011-120-00
DA9063L_2v1
116 of 173
Description
GPIO select target voltage VBCORE2_A on
passive to active transition, selects target
voltage VBCORE2_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
Sequencer target state of BCORE2_EN
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Note 1
Disabled in BUCKCORE dual-phase mode.
Table 74: BCORE1_CONT
Register Address
Bit
Type
Label
Description
0x21
BCORE1_CONT
7
R/W
CORE_SW_CONF
6:5
R/W
VBCORE1_GPI
GPIO select target voltage VBCORE1_A on
passive to active transition, selects target
voltage VBCORE1_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
CORE_SW_EN
0: CORE_SW opened
1: CORE_SW closed
3
R/W
BCORE1_CONF
Sequencer target state of BCORE1_EN
2:1
R/W
BCORE1_GPI
GPIO enables BUCKCORE1 on passive to
active state transition, disables
BUCKCORE1 on active to passive state
transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
BCORE1_EN
0: BUCKCORE1 disabled
1: BUCKCORE1 enabled
Sequencer target state of CORE_SW_EN
Table 75: BPRO_CONT
Register Address
Bit
Type
Label
0x22
BPRO_CONT
7
R/W
Reserved
6:5
R/W
VBPRO_GPI
4
R/W
Reserved
3
R/W
BPRO_CONF
2:1
R/W
BPRO_GPI
GPIO enables BUCKPRO on passive to
active state transition, disables BUCKPRO
on active to passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
BPRO_EN
0: BUCKPRO disabled
1: BUCKPRO enabled
Datasheet
CFR0011-120-00
DA9063L_2v1
117 of 173
Description
GPIO select target voltage VBPRO_A on
passive to active transition, selects target
voltage VBPRO_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
Sequencer target state of BPRO_EN
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 76: BMEM_CONT
Register Address
Bit
Type
Label
Description
0x23
BMEM_CONT
7
R/W
Reserved
6:5
R/W
VBMEM_GPI
4
R/W
Reserved
3
R/W
BMEM_CONF
2:1
R/W
BMEM_GPI
GPIO enables BUCKMEM on passive to
active state transition, disables BUCKMEM
on active to passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
BMEM_EN
0: BUCKMEM disabled
1: BUCKMEM enabled
Register Address
Bit
Type
Label
0x24
BIO_CONT
7
R/W
Reserved
6:5
R/W
VBIO_GPI
4
R/W
Reserved
3
R/W
BIO_CONF
2:1
R/W
BIO_GPI
GPIO enables BUCKIO on passive to active
state transition, disables BUCKIO on active
to passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
BIO_EN
0: BUCKIO disabled
1: BUCKIO enabled
GPIO select target voltage VBMEM_A on
passive to active transition, selects target
voltage VBMEM_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
Sequencer target state of BMEM_EN in
case of being a default supply)
Table 77: BIO_CONT
Datasheet
CFR0011-120-00
DA9063L_2v1
118 of 173
Description
GPIO select target voltage VBIO_A on
passive to active transition, selects target
voltage VBIO_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
Sequencer target state of BIO_EN
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 78: BPERI_CONT
Register Address
Bit
Type
Label
Description
0x25
BPERI_CONT
7
R/W
PERI_SW_CONF
Sequencer target state of PERI_SW_EN
6:5
R/W
VBPERI_GPI
GPIO select target voltage VBPERI_A on
passive to active transition, selects target
voltage VBPERI_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
PERI_SW_EN
0: PERI_SW opened
1: PERI_SW closed
3
R/W
BPERI_CONF
Sequencer target state of BPERI_EN
2:1
R/W
BPERI_GPI
GPIO enables BUCKPERI on passive to
active state transition, disables BUCKPERI
on active to passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
BPERI_EN
0: BUCKPERI disabled
1: BUCKPERI enabled
Register Address
Bit
Type
Label
0x26, 0x27
7:0
R/W
Reserved
Table 79: Reserved
Description
Table 80: LDO3_CONT
Register Address
Bit
Type
Label
0x28
LDO3_CONT
7
R/W
LDO3_CONF
Sequencer target state of LDO3_EN
6:5
R/W
VLDO3_GPI
GPIO select target voltage VLDO3_A on
passive to active transition, selects target
voltage VLDO3_B on active to passive
transition (ramping)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
Reserved
3
R/W
LDO3_PD_DIS
Datasheet
CFR0011-120-00
DA9063L_2v1
119 of 173
Description
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
2:1
R/W
LDO3_GPI
GPIO enables LDO3 on passive to active
state transition, disables LDO3 on active to
passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
LDO3_EN
0: LDO3 disabled
1: LDO3 enabled
Register Address
Bit
Type
Label
0x29 to 0x2B
7:0
R/W
Reserved
Table 81: Reserved
Description
Table 82: LDO7_CONT
Register Address
Bit
Type
Label
0x2C
LDO7_CONT
7
R/W
LDO7_CONF
Sequencer target state of LDO7_EN
6:5
R/W
VLDO7_GPI
GPIO select target voltage VLDO7_A on
passive to active transition, selects target
voltage VLDO7_B on active to passive
transition (immediate voltage change)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
VLDO7_SEL
LDO7 voltage is selected from (immediate
change):
0: VLDO7_A
1: VLDO7_B
3
R/W
LDO7_PD_DIS
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
2:1
R/W
LDO7_GPI
GPIO enables LDO7 on passive to active
state transition, disables LDO7 on active to
passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
LDO7_EN
0: LDO7 disabled
1: LDO7 enabled
Datasheet
CFR0011-120-00
DA9063L_2v1
120 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 83: LDO8_CONT
Register Address
Bit
Type
Label
Description
0x2D
LDO8_CONT
7
R/W
LDO8_CONF
Sequencer target state of LDO8_EN
6:5
R/W
VLDO8_GPI
GPIO select target voltage VLDO8_A on
passive to active transition, selects target
voltage VLDO8_B on active to passive
transition (immediate voltage change)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
VLDO8_SEL
LDO8 voltage is selected from (immediate
change):
0: VLDO8_A
1: VLDO8_B
3
R/W
LDO8_PD_DIS
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
2:1
R/W
LDO8_GPI
GPIO enables LDO8 on passive to active
state transition, disables LDO8 on active to
passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
LDO8_EN
0: LDO8 disabled
1: LDO8 enabled
Register Address
Bit
Type
Label
0x2E
LDO9_CONT
7
R/W
LDO9_CONF
Sequencer target state of LDO9_EN
6:5
R/W
VLDO9_GPI
GPIO select target voltage VLDO9_A on
passive to active transition, selects target
voltage VLDO9_B on active to passive
transition (immediate voltage change)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
VLDO9_SEL
LDO9 voltage is selected from (immediate
change):
0: VLDO9_A
1: VLDO9_B
3
R/W
LDO9_PD_DIS
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
Table 84: LDO9_CONT
Datasheet
CFR0011-120-00
DA9063L_2v1
121 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
2:1
R/W
LDO9_GPI
GPIO enables LDO9 on passive to active
state transition, disables LDO9 on active to
passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
LDO9_EN
0: LDO9 disabled
1: LDO9 enabled
Register Address
Bit
Type
Label
0x2F
7:0
R/W
Reserved
Table 85: Reserved
Description
Table 86: LDO11_CONT
Register Address
Bit
Type
Label
Description
0x30
LDO11_CONT
7
R/W
LDO11_CONF
Sequencer target state of LDO11_EN
6:5
R/W
VLDO11_GPI
GPIO select target voltage VLDO11_A on
passive to active transition, selects target
voltage VLDO11_B on active to passive
transition (immediate voltage change)
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
4
R/W
VLDO11_SEL
LDO11 voltage is selected from (immediate
change):
0: VLDO11_A
1: VLDO11_B
3
R/W
LDO11_PD_DIS
2:1
R/W
LDO11_GPI
GPIO enables LDO11 on passive to active
state transition, disables LDO11 on active to
passive state transition
00: Not controlled by GPIO (sequencer
control)
01: GPIO1 controlled
10: GPIO2 controlled
11: GPIO13 controlled
0
R/W
LDO11_EN
0: LDO11 disabled
1: LDO11 enabled
Register Address
Bit
Type
Label
0x31
VIB
7:6
R/W
Reserved
5:0
R/W
VIB_SET
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
Table 87: VIB
Datasheet
CFR0011-120-00
DA9063L_2v1
122 of 173
Description
000000: OFF-BREAK, NMOS on, PMOS off
000001: 47.55 mV
000010: 95.1 mV
…
Average output level set in a range of 0 to
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
3 V in steps of 3 V/63
…
…
111111: 3.0 V
Table 88: DVC_1
Register Address
Bit
Type
Label
Description
0x32
DVC_1
7
R/W
VLDO3_SEL
6:5
R/W
Reserved
4
R/W
VBPERI_SEL
BUCKPERI voltage is selected from
(ramping):
0: VBPERI_A
1: VBPERI_B
3
R/W
VBMEM_SEL
BUCKMEM voltage is selected from
(ramping):
0: VBMEM_A
1: VBMEM_B
2
R/W
VBPRO_SEL
BUCKPRO voltage is selected from
(ramping):
0: VBPRO_A
1: VBPRO_B
1
R/W
VBCORE2_SEL
BUCKCORE2 voltage is selected from
(ramping):
0: VBCORE2_A
1: VBCORE2_B
0
R/W
VBCORE1_SEL
BUCKCORE1 voltage is selected from
(ramping):
0: VBCORE1_A
1: VBCORE1_B
Register Address
Bit
Type
Label
0x33
DVC_2
7:1
R/W
Reserved
0
R/W
VBIO_SEL
BUCKIO voltage is selected from (ramping):
0: VBIO_A
1: VBIO_B
Register Address
Bit
Type
Label
Description
0x34
ADC_MAN
7:6
R/W
Reserved
5
R/W
ADC_MODE
0: Measurement sequence interval 10 ms
(economy mode)
1: Measurement sequence interval 1 ms
4
R/W
ADC_MAN
Perform manual conversion. Bit is reset to 0
when conversion is complete.
LDO3 voltage is selected from (ramping):
0: VLDO3_A
1: VLDO3_B
Table 89: DVC_2
A.2.4
Description
GPADC
Table 90: ADC_MAN
Datasheet
CFR0011-120-00
DA9063L_2v1
123 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
3:0
R/W
ADC_MUX
Description
Manual measurement selects:
0000: VSYS port
0001: ADCIN1
0010: ADCIN2
0011: ADCIN3
0100: internal T-Sense
0101: reserved0110: reserved
0111: reserved
1000: Group 1 regulators voltage
1001: Group 2 regulators voltage
1010: Group 3 regulators voltage
> 1010: reserved
Table 91: ADC_CONT
Register Address
Bit
Type
Label
Description
0x35
ADC_CONT
7
R/W
COMP1V2_EN
0: Disable 1.2 V comparator at ADCIN2
1: Enable 1.2 V comparator
6
R/W
AD3_ISRC_EN
0: Disable ADCIN3 current source
1: Enable ADCIN3 current source
5
R/W
AD2_ISRC_EN
0: Disable ADCIN2 current source
1: Enable ADCIN2 current source
4
R/W
AD1_ISRC_EN
0: Disable ADCIN1 current source
1: Enable ADCIN1 current source
3
R/W
AUTO_AD3_EN
0: ADCIN3 auto-measurements disabled
1: ADCIN3 auto-measurements enabled
2
R/W
AUTO_AD2_EN
0: ADCIN2 auto-measurements disabled
1: ADCIN2 auto-measurements enabled
1
R/W
AUTO_AD1_EN
0: ADCIN1 auto-measurements disabled
1: ADCIN1 auto-measurements enabled
0
R/W
AUTO_VSYS_EN
0: VSYS auto-measurements disabled
when charger/vibration motor driver is
off
1: VSYS auto-measurements enabled
Table 92: VSYS_MON
Register Address
Bit
Type
Label
0x36
VSYS_MON
7:0
R/W
VSYS_MON
A.2.5
Description
VSYS_MON threshold setting (8-bit).
00000000 corresponds to 2.5 V
11111111 corresponds to 5.5 V
ADC Results
Table 93: ADC_RES_L
Register Address
Bit
Type
Label
0x37
ADC_RES_L
7:6
R
ADC_RES_LSB
5:0
R
Reserved
Datasheet
CFR0011-120-00
DA9063L_2v1
124 of 173
Description
10-bit manual conversion result (2 LSBs)
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 94: ADC_RES_H
Register Address
Bit
Type
Label
0x38
ADC_RES_H
7:0
R
ADC_RES_MSB
Description
10-bit manual conversion result (8 MSBs)
Table 95: VSYS_RES
Register Address
Bit
Type
Label
0x39
VSYS_RES
7:0
R
VSYS_RES
Description
0x00 – 0xFF: Auto VSYS conversion result
(A0)
0x00 corresponds to 2.5 V
0xFF corresponds to 5.5 V
Table 96: ADCIN1_RES
Register Address
Bit
Type
Label
0x3A
ADCIN1_RES
7:0
R
ADCIN1_RES
Description
0x00 – 0xFF: Auto ADC ADCIN1 conversion
result
Table 97: ADCIN2_RES
Register Address
Bit
Type
Label
0x3B
ADCIN2_RES
7:0
R
ADCIN2_RES
Description
0x00 – 0xFF: Auto ADC ADCIN2 conversion
result
Table 98: ADCIN3_RES
Register Address
Bit
Type
Label
0x3C
ADCIN3_RES
7:0
R
ADCIN3_RES
Description
0x00 – 0xFF: Auto ADC ADCIN3 conversion
result
Table 99: MON_A8_RES
Register Address
Bit
Type
Label
0x3D
MON_A8_RES
7:0
R
MON_A8_RES
Description
0x00 – 0xFF: Regulator output voltage
monitor 1 (A8) conversion result
0x00 corresponds to 0.0 V
0xFF corresponds to 5.0 V
Table 100: MON_A9_RES
Register Address
Bit
Type
Label
0x3E
MON_A9_RES
7:0
R
MON_A9_RES
Description
0x00 – 0xFF: Regulator output voltage
monitor 2 (A9) conversion result
0x00 corresponds to 0.0 V
0xFF corresponds to 5.0 V
Table 101: MON_A10_RES
Register Address
Bit
Type
Label
0x3F
MON_A10_RES
7:0
R
MON_A10_RES
Datasheet
CFR0011-120-00
DA9063L_2v1
125 of 173
Description
0x00 – 0xFF: Regulator output voltage
monitor 3 (A10) conversion result
0x00 corresponds to 0.0 V
0xFF corresponds to 5.0 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 102: Reserved
Register Address
Bit
0x40 to 0x4F
7:0
Type
Label
Description
Reserved
Table 103: Copmic_S to Copmic_E
Register Address
Bit
Type
Label
Description
0x50
CoPMIC_S
7:0
R
Reserved
Reserved for Co-PMIC
0x67
CoPMIC_E
7:0
R
Reserved
Reserved for Co-PMIC
Table 104: CHG_Co_S to CHG_Co_E
Register Address
Bit
Type
Label
0x68
CHG_Co_S
7:0
R
Reserved
Reserved for companion charger
0x7F
CHG_Co_E
7:0
R
Reserved
Reserved for companion charger
A.3
Description
Register Page 1
Table 105: PAGE_CON
Register Address
Bit
Type
Label
0x80
PAGE_CON
7
RW
REVERT
6
RW
WRITE_MODE
5:3
RW
Reserved
2:0
RW
REG_PAGE
A.3.1
Description
See register 0x00, Table 41
Power Sequencer
Table 106: SEQ
Register Address
Bit
Type
Label
Description
0x81
SEQ
7:4
R/W
NXT_SEQ_START
Start time slot for first sequencing after being
modified via register write
3:0
R
SEQ_POINTER
Datasheet
CFR0011-120-00
DA9063L_2v1
126 of 173
Actual pointer position (time slot) of power
sequencer
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 107: SEQ_TIMER
Register Address
Bit
Type
Label
Description
0x82
SEQ_TIMER
7:4
R/W
SEQ_DUMMY
0000: 32 µs
0001: 64 µs
0010: 96 µs
0011: 128 µs
0100: 160 µs
0101: 192 µs
0110: 224 µs
0111: 256 µs
1000: 288 µs
1001: 384 µs
1010: 448 µs
1011: 512 µs
1100: 1.024 ms
1101: 2.048 ms
1110: 4.096 ms
1111: 8.192 ms
3:0
R/W
SEQ_TIME
0000: 32 µs
0001: 64 µs
0010: 96 µs
0011: 128 µs
0100: 160 µs
0101: 192 µs
0110: 224 µs
0111: 256 µs
1000: 288 µs
1001: 384 µs
1010: 448 µs
1011: 512 µs
1100: 1.024 ms
1101: 2.048 ms
1110: 4.096 ms
1111: 8.192 ms
Table 108: Reserved
Register Address
Bit
Type
Label
0x83
7:0
R/W
Reserved
Register Address
Bit
Type
Label
0x84
ID_4_3
7:4
R/W
Reserved
3:0
R/W
LDO3_STEP
Type
Label
Description
Table 109: ID_4_3
Description
Power sequencer time slot for LDO3 control
Table 110: Reserved
Register Address
Bit
0x85
7:0
Description
Reserved
Table 111: ID_8_7
Register Address
Bit
Type
Label
0x86
ID_8_7
7:4
R/W
LDO8_STEP
Power sequencer time slot for LDO8 control
3:0
R/W
LDO7_STEP
Power sequencer time slot for LDO7 control
Datasheet
CFR0011-120-00
DA9063L_2v1
127 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 112: ID_10_9
Register Address
Bit
Type
Label
0x87
ID_10_9
7:4
R/W
Reserved
3:0
R/W
LDO9_STEP
Description
Power sequencer time slot for LDO9 control
Table 113: ID_12_11
Register Address
Bit
Type
Label
Description
0x88
ID_12_11
7:4
R/W
PD_DIS_STEP
Power sequencer time slot for control of
blocks to be disabled/paused during
POWERDOWN mode
3:0
R/W
LDO11_STEP
Power sequencer time slot for LDO11 control
Table 114: ID_14_13
Register Address
Bit
Type
Label
Description
0x89
ID_14_13
7:4
R/W
BUCKCORE2_STEP
Power sequencer time slot for control of
BUCKCORE2 (disabled in BUCKCORE dual
phase mode)
3:0
R/W
BUCKCORE1_STEP
Power sequencer time slot for control of
BUCKCORE1
Table 115: ID_16_15
Register Address
Bit
Type
Label
Description
0x8A
ID_16_15
7:4
R/W
BUCK_IO_STEP
Power sequencer time slot for control of
BUCKPRO
3:0
R/W
BUCKPRO_STEP
Power sequencer time slot for control of
BUCKPRO
Table 116: ID_18_17
Register Address
Bit
Type
Label
Description
0x8B
ID_18_17
7:4
R/W
BUCKPERI_STEP
Power sequencer time slot for control of
BUCKPERI
3:0
R/W
BUCKMEM_STEP
Power sequencer time slot for control of
BUCKMEM
Table 117: Reserved
Register Address
Bit
Type
Label
0x8C
7:0
R/W
Reserved
Description
Table 118: ID_22_21
Register Address
Bit
Type
Label
0x8D
ID_22_21
7:4
R/W
GP_FALL1_STEP
Power sequencer time slot for falling edge
control of GPO2
3:0
R/W
GP_RISE1_STEP
Power sequencer time slot for rising edge
control of GPO2
Datasheet
CFR0011-120-00
DA9063L_2v1
128 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 119: ID_24_23
Register Address
Bit
Type
Label
Description
0x8E
ID_24_23
7:4
R/W
GP_FALL2_STEP
Power sequencer time slot for falling edge
control of GPO7
3:0
R/W
GP_RISE2_STEP
Power sequencer time slot for rising edge
control of GPO7
Table 120: ID_26_25
Register Address
Bit
Type
Label
Description
0x8F
ID_26_25
7:4
R/W
GP_FALL3_STEP
Power sequencer time slot for falling edge
control of GPO8
3:0
R/W
GP_RISE3_STEP
Power sequencer time slot for rising edge
control of GPO8
Table 121: ID_28_27
Register Address
Bit
Type
Label
Description
0x90
ID_28_27
7:4
R/W
GP_FALL4_STEP
Power sequencer time slot for falling edge
control of GPO9
3:0
R/W
GP_RISE4_STEP
Power sequencer time slot for rising edge
control of GPO9
Table 122: ID_30_29
Register Address
Bit
Type
Label
Description
0x91
ID_30_29
7:4
R/W
GP_FALL5_STEP
Power sequencer time slot for falling edge
control of GPO11
3:0
R/W
GP_RISE5_STEP
Power sequencer time slot for rising edge
control of GPO11
Table 123: ID_32_31
Register Address
Bit
Type
Label
0x92
ID_32_31
7:4
R/W
Reserved
3:0
R/W
WAIT_STEP
Description
Power sequencer time slot that gates the
progress with state of GPI10 (or used a
dedicated delay timer)
Table 124: Reserved
Register Address
Bit
Type
Label
Description
0x93, 0x94
7:0
R/W
Reserved
Register Address
Bit
Type
Label
0x95
SEQ_A
7:4
R/W
POWER_END
OTP pointer to last supply of domain
POWER
3:0
R/W
SYSTEM_END
OTP pointer to last supply of domain
SYSTEM
Table 125: SEQ_A
Datasheet
CFR0011-120-00
DA9063L_2v1
129 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 126: SEQ_B
Register Address
Bit
Type
Label
Description
0x96
SEQ_B
7:4
R/W
PART_DOWN
OTP pointer for partial POWERDOWN mode
3:0
R/W
MAX_COUNT
OTP pointer to last supply of domain
POWER1
Register Address
Bit
Type
Label
0x97
WAIT
7:6
R/W
WAIT_DIR
00: No wait during power sequencing
01: Wait during power-up sequence
10:: Wait during power-down sequence
11: Wait during power-up and power-down
sequence
5
R/W
TIME_OUT
0: No time limit
1: 500 ms time out for waiting GPIO10 to get
active
4
R/W
WAIT_MODE
3:0
R/W
WAIT_TIME
Table 127: WAIT
Description
0: Wait for GPIO10 to be active
1: Timer mode (start timer and wait for
expire)
0000: 0.0 µs
0001: 512 µs
0010: 1.0 ms
0011: 2.0 ms
0100: 4.1 ms
0101: 8.2 ms
0110: 16.4 ms
0111: 32.8 ms
1000: 65.5 ms
1001: 128 ms
1010: 256 ms
1011: 512 ms
1100: 1.0 s
1101: 2.1 s
1110: 4.2 s
1111: 8.4 s
Table 128: Reserved
Register Address
Bit
Type
Label
0x98
7:0
R/W
Reserved
Description
Table 129: RESET
Register Address
Bit
Type
Label
0x99
RESET
7:6
R/W
RESET_EVENT
Datasheet
CFR0011-120-00
DA9063L_2v1
130 of 173
Description
RESET timer started by
00: EXT_WAKEUP
01: SYS_UP
10: PWR_UP
11: leaving PMIC RESET state (do not use
in combination with nRES_MODE = 1)
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
A.3.2
Bit
Type
Label
5:0
R/W
RESET_TIMER
Description
000000: 0.000 ms
000001: 1.024 ms
000010: 2.048 ms
000011: 3.072 ms
000100: 4.096 ms
000101: 5.120 ms
….
011110: 30.720 ms
011111: 31.744 ms
100000: 32.768 ms
100001: 65.536 ms
100010: 98.304 ms
…..
111101: 983.040 ms
111110: 1015.808 ms
111111: 1048.576 ms
Regulator Settings
Table 130: BUCK_ILIM_A
Register Address
Bit
Type
Label
0x9A
BUCK_ILIM_A
7:4
R/W
BMEM_ILIM
3:0
R/W
BIO_ILIM
Datasheet
CFR0011-120-00
DA9063L_2v1
131 of 173
Description
BUCKMEM current limit (all limits x2 in
MERGE mode)
0000:1500 mA
0001:1600 mA
0010:1700 mA
0011:1800 mA
0100:1900 mA
0101:2000 mA
0110:2100 mA
0111:2200 mA
1000:2300 mA
1001:2400 mA
1010:2500 mA
1011:2600 mA
1100:2700 mA
1101:2800 mA
1110:2900 mA
1111:3000 mA
BUCKIO current limit
0000:1500 mA
0001:1600 mA
0010:1700 mA
0011:1800 mA
0100:1900 mA
0101:2000 mA
0110:2100 mA
0111:2200 mA
1000:2300 mA
1001:2400 mA
1010:2500 mA
1011:2600 mA
1100:2700 mA
1101:2800 mA
1110:2900 mA
1111:3000 mA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 131: BUCK_ILIM_B
Register Address
Bit
Type
Label
Description
0x9B
BUCK_ILIM_B
7:4
R/W
BPERI_ILIM
BUCKPERI current limit
0000:1500 mA
0001:1600 mA
0010:1700 mA
0011:1800 mA
0100:1900 mA
0101:2000 mA
0110:2100 mA
0111:2200 mA
1000:2300 mA
1001:2400 mA
1010:2500 mA
1011:2600 mA
1100:2700 mA
1101:2800 mA
1110:2900 mA
1111:3000 mA
3:0
R/W
BPRO_ILIM
BUCKPRO current limit (all limits x2 in fullcurrent mode)
0000:500 mA
0001:600 mA
0010:700 mA
0011:800 mA
0100:900 mA
0101:1000 mA
0110:1100 mA
0111:1200 mA
1000:1300 mA
1001:1400 mA
1010:1500 mA
1011:1600 mA
1100:1700 mA
1101:1800 mA
1110:1900 mA
1111:2000 mA
Table 132: BUCK_ILIM_C
Register Address
Bit
Type
Label
0x9C
BUCK_ILIM_C
7:4
R/W
BCORE2_ILIM
Datasheet
CFR0011-120-00
DA9063L_2v1
132 of 173
Description
BUCKCORE2 current limit (all limits x2 in
full-current mode)
0000:500 mA
0001:600 mA
0010:700 mA
0011:800 mA
0100:900 mA
0101:1000 mA
0110:1100 mA
0111:1200 mA
1000:1300 mA
1001:1400 mA
1010:1500 mA
1011:1600 mA
1100:1700 mA
1101:1800 mA
1110:1900 mA
1111:2000 mA
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
3:0
R/W
BCORE1_ILIM
Description
BUCKCORE1 current limit (all limits x2 in
full-current mode)
0000:500 mA
0001:600 mA
0010:700 mA
0011:800 mA
0100:900 mA
0101:1000 mA
0110:1100 mA
0111:1200 mA
1000:1300 mA
1001:1400 mA
1010:1500 mA
1011:1600 mA
1100:1700 mA
1101:1800 mA
1110:1900 mA
1111:2000 mA
Table 133: BCORE2_CONF
Register Address
Bit
Type
Label
Description
0x9D
BCORE2_CONF
7:6
R/W
BCORE2_MODE
00: Sleep/Synchronous mode controlled via
voltage A and B registers
01: BUCKCORE2 always operates in Sleep
mode
10: BUCKCORE2 always operates in
Synchronous mode
11: BUCKCORE2 operates in Automatic
mode
5
R/W
BCORE2_PD_DIS
Reserved
4:3
2:0
0: Enable pull-down resistor
(automatically disabled in dual-phase
mode)
1: No pull-down resistor in disabled mode
R/W
BCORE2_FB
BUCKCORE2 feedback signal is created
out of:
xx1: VBUCKCORE2
x1x: CORE_SWS
1xx: PERI_SWS
Each switch connected to the output of the
buck may be selected; setting 0b000 is
invalid
Table 134: BCORE1_CONF
Register Address
Bit
Type
Label
Description
0x9E
BCORE1_CONF
7:6
R/W
BCORE1_MODE
00: Sleep/Synchronous mode controlled via
voltage A and B registers
01: BUCKCORE1 always operates in Sleep
mode
10: BUCKCORE1 always operates in
Synchronous mode
11: BUCKCORE1 operates in Automatic
mode
5
R/W
BCORE1_PD_DIS
Datasheet
CFR0011-120-00
DA9063L_2v1
133 of 173
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Description
Reserved
4:3
2:0
Label
R/W
BCORE1_FB
BUCKCORE feedback signal is created out
of:
000:
BCORE_MERGE= 0: VBUCKCORE1
BCORE_MERGE= 1: Differential remote
sensing via VBUCKCORE1 –
VBUCKCORE2 and output capacitor
voltage sense via port CORE_SWS or
GP_FB_2
xx1: VBUCKCORE1
x1x: CORE_SWS
1xx: PERI_SWS
Each switch connected to the output of the
buck may be selected; setting 0b000
disables sense voltage mixer for
BUCKCORE
Table 135: BPRO_CONF
Register Address
Bit
Type
Label
Description
0x9F
BPRO_CONF
7:6
R/W
BPRO_MODE
00: Sleep/Synchronous mode controlled via
voltage A and B registers
10: BUCKPRO always operates in Sleep
mode
10: BUCKPRO always operates in
Synchronous
11: BUCKPRO operates in Automatic
mode
5
R/W
BPRO_PD_DIS
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
4
R/W
BPRO_VTT_EN
0: Buck voltage mode
1: VTT mode, buck target voltage tracks
50% of VDDQ sense port (requires
BPRO_VTTR_EN to be asserted as well)
3
R/W
BPRO_VTTR_EN
0: VTTR port is assigned to E_CMP1V2,
port VDDQ provides status of E_GPI2
1: VTTR port provides 50% of VDDQ
voltage
2:0
R/W
BPRO_FB
BUCKPRO feedback signal is created out
of:
xx1: VBUCKPRO
x1x: CORE_SWS
1xx: PERI_SWS
Each switch connected to the output of the
buck may be selected; setting 0b000 is
invalid
Datasheet
CFR0011-120-00
DA9063L_2v1
134 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 136: BIO_CONF
Register Address
Bit
Type
Label
Description
0xA0
BIO_CONF
7:6
R/W
BIO_MODE
00: Sleep/Synchronous mode controlled via
voltage A and B registers
10: BUCKIO always operates in Sleep
mode
10: BUCKIO always operates in
Synchronous
11: BUCKIO operates in Automatic mode
5
R/W
BIO_PD_DIS
Reserved
4:3
2:0
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
R/W
BIO_FB
BUCKIO feedback signal is created out of:
xx1: VBUCKBIO
x1x: CORE_SWS
1xx: PERI_SWS
Each switch connected to the output of the
buck may be selected; setting 0b000 is
invalid
Table 137: BMEM_CONF
Register Address
Bit
Type
Label
Description
0xA1
BMEM_CONF
7:6
R/W
BMEM_ MODE
00: Sleep/Synchronous mode controlled via
voltage A and B registers
01: BUCKMEM always operates in Sleep
mode
10: BUCKMEM always operates in
Synchronous mode
11: BUCKMEM operates in Automatic
mode
5
R/W
BMEM_PD_DIS
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
Reserved
4:3
2:0
R/W
BMEM_FB
BUCKMEM feedback signal is created out
of:
xx1: VBUCKMEM
x1x: CORE_SWS
1xx: PERI_SWS
Each switch connected to the output of the
buck may be selected; setting 0b000 is
invalid
Datasheet
CFR0011-120-00
DA9063L_2v1
135 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 138: BPERI_CONF
Register Address
Bit
Type
Label
Description
0xA2
BPERI_CONF
7:6
R/W
BPERI_ MODE
00: Sleep/Synchronous mode controlled via
voltage A and B registers
01: BUCKPERI always operates in Sleep
mode
10: BUCKPERI always operates in
Synchronous mode
11: BUCKPERI operates in Automatic
mode
5
R/W
BPERI_PD_DIS
0: Enable pull-down resistor
1: No pull-down resistor in disabled mode
Reserved
4:3
2:0
R/W
BPERI_FB
BUCKPERI feedback signal is created out
of:
xx1: VBUCKPERI
x1x: CORE_SWS
1xx: PERI_SWS
Each switch connected to the output of the
buck may be selected; setting 0b0000 is
invalid
Table 139: VBCORE2_A
Register Address
Bit
Type
Label
Description
0xA3
VBCORE2_A
7
R/W
BCORE2_SL_A
0: Configures BUCKCORE2 to
Synchronous mode, when selecting A
voltage settings
1: Configures BUCKCORE2 to Sleep mode,
when selecting A voltage settings
6:0
R/W
VBCORE2_A
0000000: 0.30 V
0000001: 0.31 V
0000010: 0.32 V
0000011: 0.33 V
0000100: 0.34 V
0000101: 0.35 V
…
0100101: 0.67 V
0100110: 0.68 V
0100111: 0.69 V
0101000: 0.70 V
0101001: 0.71 V
…
1010000: 1.10 V
…
1110011: 1.45 V
1110100: 1.46 V
1110101: 1.47 V
1110110: 1.48 V
1110111: 1.49 V
1111000: 1.50 V
1111001: 1.51 V
1111010: 1.52 V
1111011: 1.53 V
1111100: 1.54 V
1111101: 1.55 V
1111110: 1.56 V
1111111: 1.57 V
Datasheet
CFR0011-120-00
DA9063L_2v1
136 of 173
PWM mode voltage
range
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 140: VBCORE1_A
Register Address
Bit
Type
Label
Description
0xA4
VBCORE1_A
7
R/W
BCORE1_SL_A
0: Configures BUCKCORE1 to
Synchronous mode, when selecting A
voltage settings
1: Configures BUCKCORE1 to Sleep mode,
when selecting A voltage settings
6:0
R/W
VBCORE1_A
0000000: 0.30 V
0000001: 0.31 V
0000010: 0.32 V
0000011: 0.33 V
0000100: 0.34 V
0000101: 0.35 V
…
0100101: 0.67 V
0100110: 0.68 V
0100111: 0.69 V
0101000: 0.70 V
0101001: 0.71 V
…
1010000: 1.10 V
…
1110011: 1.45 V
1110100: 1.46 V
1110101: 1.47 V
1110110: 1.48 V
1110111: 1.49 V
1111000: 1.50 V
1111001: 1.51 V
1111010: 1.52 V
1111011: 1.53 V
1111100: 1.54 V
1111101: 1.55 V
1111110: 1.56 V
1111111: 1.57 V
Datasheet
CFR0011-120-00
DA9063L_2v1
137 of 173
PWM mode voltage
range
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 141: VBPRO_A
Register Address
Bit
Type
Label
Description
0xA5
VBPRO_A
7
R/W
BPRO_SL_A
0: Configures BUCKPRO to Synchronous
mode, when selecting A voltage settings
1: Configures BUCKPRO to Sleep mode,
when selecting A voltage settings
6:0
R/W
VBPRO_A
0000000: 0.53 V
0000001: 0.54 V
0000010: 0.55 V
0000011: 0.56 V
0000100: 0.57 V
0000101: 0.58 V
…
0010000: 0.69 V
0010001: 0.70 V
0010010: 0.71 V
0010011: 0.72 V
0010100: 0.73 V
0010101: 0.74 V
0010110: 0.75 V
…
1000011: 1.20 V
…
1110011: 1.68 V
1110100: 1.69 V
1110101: 1.70 V
1110110: 1.71 V
1110111: 1.72 V
1111000: 1.73 V
1111001: 1.74 V
1111010: 1.75 V
1111011: 1.76 V
1111100: 1.77 V
1111101: 1.78 V
1111110: 1.79 V
1111111: 1.80 V
PWM mode voltage
range
Table 142: VBMEM_A
Register Address
Bit
Type
Label
Description
0xA6
VBMEM_A
7
R/W
BMEM_SL_A
0: Configures BUCKMEM to Synchronous
mode, when selecting A voltage settings
1: Configures BUCKMEM to Sleep mode,
when selecting A voltage settings
6:0
R/W
VBMEM_A
Datasheet
CFR0011-120-00
DA9063L_2v1
138 of 173
0000000: 0.80 V
0000001: 0.82 V
0000010: 0.84 V
…
0010100: 1.20 V
...
0111100: 2.00 V
0111101: 2.02 V
0111110: 2.04 V
0111111: 2.06 V
…
1111111: 3.34 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 143: VBIO_A
Register Address
Bit
Type
Label
Description
0xA7
VBIO_A
7
R/W
BIO_SL_A
0: Configures BUCKIO to Synchronous
mode, when selecting A voltage settings
1: Configures BUCKIO to Sleep mode, when
selecting A voltage settings
6:0
R/W
VBIO_A
0000000: 0.80 V
0000001: 0.82 V
0000010: 0.84 V
…
0010100: 1.20 V
...
0111100: 2.00 V
0111101: 2.02 V
0111110: 2.04 V
0111111: 2.06 V
…
1111111: 3.34 V
Table 144: VBPERI_A
Register Address
Bit
Type
Label
Description
0xA8
VBPERI_A
7
R/W
BPERI_SL_A
0: Configures BUCKPERI to Synchronous
mode, when selecting A voltage settings
1: Configures BUCKPERI to Sleep mode,
when selecting A voltage settings
6:0
R/W
VBPERI_A
Register Address
Bit
Type
Label
0xA9, 0xAA
7:0
R/W
Reserved
0000000: 0.80 V
0000001: 0.82 V
0000010: 0.84 V
…
0110010: 1.80 V
...
0111100: 2.00 V
0111101: 2.02 V
0111110: 2.04 V
0111111: 2.06 V
…
1111111: 3.34 V
Table 145: Reserved
Datasheet
CFR0011-120-00
DA9063L_2v1
139 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 146: VLDO3_A
Register Address
Bit
Type
Label
0xAB
VLDO3_A
7
R/W
LDO3_SL_A
6:0
R/W
VLDO3_A
Datasheet
CFR0011-120-00
DA9063L_2v1
140 of 173
Description
0: Configures LDO to half-current mode,
when selecting A voltage settings
1: Configures LDO to Sleep mode, when
selecting A voltage settings
0000000: 0.90 V
0000001: 0.92 V
0000010: 0.94 V
0000011: 0.96 V
0000100: 0.98 V
0000101: 1.00 V
0000110: 1.02 V
0000111: 1.04 V
0001000: 1.06 V
0001001: 1.08 V
0001010: 1.10 V
0001011: 1.12 V
0001100: 1.14 V
0001101: 1.16 V
0001110: 1.18 V
0001111: 1.20 V
0010000: 1.22 V
0010001: 1.24 V
0010010: 1.26 V
0010011: 1.28 V
0010100: 1.30 V
0010101: 1.32 V
...
1110000: 3.14 V
1110001: 3.16 V
1110010: 3.18 V
1110011: 3.20 V
1110100: 3.22 V
1110101: 3.24 V
1110110: 3.26 V
1110111: 3.28 V
1111000: 3.30 V
1111001: 3.32 V
1111010: 3.34 V
1111011: 3.36 V
1111100: 3.38 V
1111101: 3.40 V
1111110: 3.42 V
1111111: 3.44 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 147: Reserved
Register Address
Bit
Type
Label
0xAC to 0xAE
7:0
R/W
Reserved
Description
Table 148: VLDO7_A
Register Address
Bit
Type
Label
0xAF
VLDO7_A
7
R/W
LDO7_SL_A
6
R/W
Reserved
5:0
R/W
VLDO7_A
Datasheet
CFR0011-120-00
DA9063L_2v1
141 of 173
Description
0: Configures LDO to half-current mode,
when selecting A voltage settings
1: Configures LDO to Sleep mode, when
selecting A voltage settings
000000: 0.90 V
000001: 0.90 V
000010: 0.90 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 149: VLDO8_A
Register Address
Bit
Type
Label
0xB0
VLDO8_A
7
R/W
LDO8_SL_A
6
R/W
Reserved
5:0
R/W
VLDO8_A
Datasheet
CFR0011-120-00
DA9063L_2v1
142 of 173
Description
0: Configures LDO to half-current mode,
when selecting A voltage settings
1: Configures LDO to Sleep mode, when
selecting A voltage settings
000000: 0.90 V
000001: 0.90 V
000010: 0.90 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 150: VLDO9_A
Register Address
Bit
Type
Label
0xB1
VLDO9_A
7
R/W
LDO9_SL_A
6
R/W
Reserved
5:0
R/W
VLDO9_A
Register Address
Bit
Type
Label
0xB2
7:0
R/W
Reserved
Description
0: Configures LDO to half-current mode,
when selecting A voltage settings
1: Configures LDO to Sleep mode, when
selecting A voltage settings
000000: not used
000001: 0.95 V
000010: 0.95 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
Table 151: Reserved
Datasheet
CFR0011-120-00
DA9063L_2v1
143 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 152: VLDO11_A
Register Address
Bit
Type
Label
0xB3
VLDO11_A
7:4
R/W
LDO11_SL_A
6
R/W
Reserved
5:0
R/W
VLDO11_A
Datasheet
CFR0011-120-00
DA9063L_2v1
144 of 173
Description
0: Configures LDO to half-current mode,
when selecting A voltage settings
1: Configures LDO to Sleep mode, when
selecting A voltage settings
000000: 0.90 V
000001: 0.90 V
000010: 0.90 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 153: VBCORE2_B
Register Address
Bit
Type
Label
Description
0xB4
VBCORE2_B
7
R/W
BCORE2_SL_B
0: Configures BUCKCORE2 to
Synchronous mode, when selecting B
voltage settings
1: Configures BUCKCORE2 to Sleep mode,
when selecting B voltage settings
6:0
R/W
VBCORE2_B
0000000: 0.30 V
0000001: 0.31 V
0000010: 0.32 V
0000011: 0.33 V
0000100: 0.34 V
0000101: 0.35 V
…
0100101: 0.67 V
0100110: 0.68 V
0100111: 0.69 V
0101000: 0.70 V
0101001: 0.71 V
…
0111100: 0.90 V
…
1110011: 1.45 V
1110100: 1.46 V
1110101: 1.47 V
1110110: 1.48 V
1110111: 1.49 V
1111000: 1.50 V
1111001: 1.51 V
1111010: 1.52 V
1111011: 1.53 V
1111100: 1.54 V
1111101: 1.55 V
1111110: 1.56 V
1111111: 1.57 V
Datasheet
CFR0011-120-00
DA9063L_2v1
145 of 173
PWM mode voltage
range
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 154: VBCORE1_B
Register Address
Bit
Type
Label
Description
0xB5
VBCORE1_B
7
R/W
BCORE1_SL_B
0: Configures BUCKCORE1 to Synchronous
mode, when selecting B voltage settings
1: Configures BUCKCORE1 to Sleep
mode, when selecting B voltage settings
6:0
R/W
VBCORE1_B
0000000: 0.30 V
0000001: 0.31 V
0000010: 0.32 V
0000011: 0.33 V
0000100: 0.34 V
0000101: 0.35 V
…
0100101: 0.67 V
0100110: 0.68 V
0100111: 0.69 V
0101000: 0.70 V
0101001: 0.71 V
…
0111100: 0.90 V
…
1110011: 1.45 V
1110100: 1.46 V
1110101: 1.47 V
1110110: 1.48 V
1110111: 1.49 V
1111000: 1.50 V
1111001: 1.51 V
1111010: 1.52 V
1111011: 1.53 V
1111100: 1.54 V
1111101: 1.55 V
1111110: 1.56 V
1111111: 1.57 V
Datasheet
CFR0011-120-00
DA9063L_2v1
146 of 173
PWM mode voltage
range
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 155: VBPRO_B
Register Address
Bit
Type
Label
0xB6
VBPRO_B
7
R/W
BPRO_SL_B
6:0
R/W
VBPRO_B
Description
0: Configures BUCKPRO to Synchronous
mode, when selecting B voltage settings
1: Configures BUCKPRO to Sleep mode,
when selecting B voltage settings
0000000: 0.53 V
0000001: 0.54 V
0000010: 0.55 V
0000011: 0.56 V
0000100: 0.57 V
0000101: 0.58 V
…
0010000: 0.69 V
0010001: 0.70 V
0010010: 0.71 V
0010011: 0.72 V
0010100: 0.73 V
0010101: 0.74 V
0010110: 0.75 V
…
1000011: 1.20 V
…
1110011: 1.68 V
1110100: 1.69 V
1110101: 1.70 V
1110110: 1.71 V
1110111: 1.72 V
1111000: 1.73 V
1111001: 1.74 V
1111010: 1.75 V
1111011: 1.76 V
1111100: 1.77 V
1111101: 1.78 V
1111110: 1.79 V
1111111: 1.80 V
PWM mode voltage
range
Table 156: VBMEM_B
Register Address
Bit
Type
Label
0xB7
VBMEM_B
7
R/W
BMEM_SL_B
6:0
R/W
VBMEM_B
Datasheet
CFR0011-120-00
DA9063L_2v1
147 of 173
Description
0: Configures BUCKMEM to Synchronous
mode, when selecting B voltage settings
1: Configures BUCKMEM to Sleep mode,
when selecting B voltage settings
0000000: 0.80 V
0000001: 0.82 V
0000010: 0.84 V
…
0010100: 1.20 V
...
0111100: 2.00 V
0111101: 2.02 V
0111110: 2.04 V
0111111: 2.06 V
…
1111111: 3.34 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 157: VBIO_B
Register Address
Bit
Type
Label
Description
0xB8
VBIO_B
7
R/W
BIO_SL_B
0: Configures BUCKIO to Synchronous
mode, when selecting B voltage settings
1: Configures BUCKIO to Sleep mode, when
selecting B voltage settings
6:0
R/W
VBIO_B
0000000: 0.80 V
0000001: 0.82 V
0000010: 0.84 V
…
0010100: 1.20 V
...
0111100: 2.00 V
0111101: 2.02 V
0111110: 2.04 V
0111111: 2.06 V
…
1111111: 3.34 V
Table 158: VBPERI_B
Register Address
Bit
Type
Label
0xB9
VBPERI_B
7
R/W
BPERI_SL_B
6:0
R/W
VBPERI_B
Register Address
Bit
Type
Label
0xBA, 0xBB
7:0
R/W
Reserved
Register Address
Bit
Type
Label
0xBC
VLDO3_B
7
R/W
LDO3_SL_B
6:0
R/W
VLDO3_B
Description
0: Configures BUCKPERI to Synchronous
mode, when selecting A voltage settings
1: Configures BUCKPERI to Sleep mode,
when selecting B voltage settings
0000000: 0.80 V
0000001: 0.82 V
0000010: 0.84 V
…
0110010: 1.80 V
...
0111100: 2.00 V
0111101: 2.02 V
0111110: 2.04 V
0111111: 2.06 V
…
1111111: 3.34 V
Table 159: Reserved
Description
Table 160: VLDO3_B
Datasheet
CFR0011-120-00
DA9063L_2v1
148 of 173
Description
0: Configures LDO to half-current mode,
when selecting B voltage settings
1: Configures LDO to Sleep mode, when
selecting B voltage settings
0000000: 0.90 V
0000001: 0.92 V
0000010: 0.94 V
0000011: 0.96 V
0000100: 0.98 V
0000101: 1.00 V
0000110: 1.02 V
0000111: 1.04 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
0001000: 1.06 V
0001001: 1.08 V
0001010: 1.10 V
0001011: 1.12 V
0001100: 1.14 V
0001101: 1.16 V
0001110: 1.18 V
0001111: 1.20 V
0010000: 1.22 V
0010001: 1.24 V
0010010: 1.26 V
0010011: 1.28 V
0010100: 1.30 V
0010101: 1.32 V
...
1110000: 3.14 V
1110001: 3.16 V
1110010: 3.18 V
1110011: 3.20 V
1110100: 3.22 V
1110101: 3.24 V
1110110: 3.26 V
1110111: 3.28 V
1111000: 3.30 V
1111001: 3.32 V
1111010: 3.34 V
1111011: 3.36 V
1111100: 3.38 V
1111101: 3.40 V
1111110: 3.42 V
1111111: 3.44 V
Table 161: Reserved
Register Address
Bit
Type
Label
0xBD to 0xBF
7:0
R/W
Reserved
Register Address
Bit
Type
Label
0xC0
VLDO7_B
7
R/W
LDO7_SL_B
6
R/W
Reserved
Description
Table 162: VLDO7_B
Datasheet
CFR0011-120-00
DA9063L_2v1
149 of 173
Description
0: Configures LDO to half-current mode,
when selecting B voltage settings
1: Configures LDO to Sleep mode, when
selecting B voltage settings
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Datasheet
CFR0011-120-00
Bit
Type
Label
5:0
R/W
VLDO7_B
DA9063L_2v1
150 of 173
Description
000000: 0.90 V
000001: 0.90 V
000010: 0.90 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 163: VLDO8_B
Register Address
Bit
Type
Label
0xC1
VLDO8_B
7
R/W
LDO8_SL_B
6
R/W
Reserved
5:0
R/W
VLDO8_B
Datasheet
CFR0011-120-00
DA9063L_2v1
151 of 173
Description
0: Configures LDO to half-current mode,
when selecting B voltage settings
1: Configures LDO to Sleep mode, when
selecting B voltage settings
000000: 0.90 V
000001: 0.90 V
000010: 0.90 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 164: VLDO9_B
Register Address
Bit
Type
Label
0xC2
VLDO9_B
7
R/W
LDO9_SL_B
6
R/W
Reserved
5:0
R/W
VLDO9_B
Register Address
Bit
Type
Label
0xC3
7:0
R/W
Reserved
Description
0: Configures LDO to half-current mode,
when selecting B voltage settings
1: Configures LDO to Sleep mode, when
selecting B voltage settings
000000: 0.95 V
000001: 0.95 V
000010: 0.95 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001000: 1.20 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
Table 165: Reserved
Datasheet
CFR0011-120-00
DA9063L_2v1
152 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 166: VLDO11_B
Register Address
Bit
Type
Label
0xC4
VLDO11_B
7:4
R/W
LDO1_SL_B
6
R/W
Reserved
5:0
R/W
VLDO11_B
Datasheet
CFR0011-120-00
DA9063L_2v1
153 of 173
Description
0: Configures LDO to half-current mode,
when selecting B voltage settings
1: Configures LDO to Sleep mode, when
selecting B voltage settings
000000: 0.90 V
000001: 0.90 V
000010: 0.90 V
000011: 0.95 V
000100: 1.00 V
000101: 1.05 V
000110: 1.10 V
000111: 1.15 V
001001: 1.25 V
001010: 1.30 V
001011: 1.35 V
001100: 1.40 V
001101: 1.45 V
001110: 1.50 V
001111: 1.55 V
010000: 1.60 V
010001: 1.65 V
010010: 1.70 V
010011: 1.75 V
010100: 1.80 V
010101: 1.85 V
...
100010: 2.50 V
100011: 2.55 V
100100: 2.60 V
100101: 2.65 V
100110: 2.70 V
100111: 2.75 V
101000: 2.80 V
101001: 2.85 V
101010: 2.90 V
101011: 2.95 V
101100: 3.00 V
101101: 3.05 V
101110: 3.10 V
101111: 3.15 V
110000: 3.20 V
110001: 3.25 V
110010: 3.30 V
110011: 3.35 V
110100: 3.40 V
110101: 3.45 V
110110: 3.50 V
110111: 3.55 V
111000: 3.60 V
>111000: 3.60 V
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
A.3.3
High Power GPO PWM
Table 167: GPO11_LED
Register Address
Bit
Type
Label
0xC6
GPO11_LED
7
R/W
GPO11_DIM
6:0
R/W
GPO11_PWM
Description
0: PWM ratio changes instantly
1: GPO ramps between changes in PWM
ratio with 32 ms per step
GPO11 LED on-time (low level at GPIO 11,
period 21 kHz = 95 cycles of 0.5 µs)
0000000: off
0000001: 1%
0000010: 2% (1 µs bursts)
0000011: 3%
0000100: 4%
0000101: 5%
0000110: 6%
0000111: 7%
0001000: 8%
0001001: 9%
0001010: 10%
0001011: 11%
0001100: 12%
0001101: 13%
0001110: 14%
0001111: 15%
0010000: 16%
....
1011111: 100%
>1011111: 100%
Table 168: GPO14_LED
Register Address
Bit
Type
Label
0xC7
GPO14_LED
7
R/W
GPO14_DIM
6:0
R/W
GPO14_PWM
Datasheet
CFR0011-120-00
DA9063L_2v1
154 of 173
Description
0: PWM ratio changes instantly
1: GPO ramps between changes in PWM
ratio with 32 ms per step
GPO14 LED on-time (low level at GPIO 14,
period 21 kHz = 95 cycles of 0.5 µs)
0000000: off
0000001: 1%
0000010: 2% (1 µs bursts)
0000011: 3%
0000100: 4%
0000101: 5%
0000110: 6%
0000111: 7%
0001000: 8%
0001001: 9%
0001010: 10%
0001011: 11%
0001100: 12%
0001101: 13%
0001110: 14%
0001111: 15%
0010000: 16%
....
1011111: 100%
>1011111: 100%
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 169: GPO15_LED
Register Address
Bit
Type
Label
0xC8
GPO15_LED
7
R/W
GPO15_DIM
6:0
R/W
GPO15_PWM
GPO15 LED on-time (low level at GPIO 15,
period 21 kHz = 95 cycles of 0.5 µs)
0000000: off
0000001: 1%
0000010: 2% (1 µs bursts)
0000011: 3%
0000100: 4%
0000101: 5%
0000110: 6%
0000111: 7%
0001000: 8%
0001001: 9%
0001010: 10%
0001011: 11%
0001100: 12%
0001101: 13%
0001110: 14%
0001111: 15%
0010000: 16%
....
1011111: 100%
>1011111: 100%
Description
A.3.4
Description
0: PWM ratio changes instantly
1: GPO ramps between changes in PWM
ratio with 32 ms per step
GPADC Thresholds
Table 170: ADC_CFG
Register Address
Bit
Type
Label
0xC9
ADC_CFG
7
R/W
ADCIN3_DEB
0: ADCIN3: debouncing off
1: ADCIN3: debouncing on
6
R/W
ADCIN2_DEB
0: ADCIN2: debouncing off
1: ADCIN2: debouncing on
5
R/W
ADCIN1_DEB
0: ADCIN1: debouncing off
1: ADCIN1: debouncing on
4
R/W
ADCIN3_CUR
ADCIN3 current source:
0: 10 µA
1: 40 µA
3:2
R/W
ADCIN2_CUR
ADCIN2 current source:
00: 1 µA
01: 2.5 µA
10: 10 µA
11: 40 µA
1:0
R/W
ADCIN1_CUR
ADCIN1 current source:
00: 1 µA
01: 2.5 µA
10: 10 µA
11: 40 µA
Datasheet
CFR0011-120-00
DA9063L_2v1
155 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 171: AUTO1_HIGH
Register Address
Bit
Type
Label
0xCA
AUTO1_HIGH
7:0
R/W
AUTO1_HIGH
Description
00000000 – 11111111: ADCIN1 high level
threshold
Table 172: AUTO1_LOW
Register Address
Bit
Type
Label
0xCB
AUTO1_LOW
7:0
R/W
AUTO1_LOW
Description
00000000 – 11111111: ADCIN1 low level
threshold
Table 173: AUTO2_HIGH
Register Address
Bit
Type
Label
0xCC
AUTO2_HIGH
7:0
R/W
AUTO2_HIGH
Description
00000000 – 11111111: ADCIN2 high level
threshold
Table 174: AUTO2_LOW
Register Address
Bit
Type
Label
0xCD
AUTO2_LOW
7:0
R/W
AUTO2_LOW
Description
00000000 – 11111111: ADCIN2 low level
threshold
Table 175: AUTO3_HIGH
Register Address
Bit
Type
Label
0xCE
AUTO3_HIGH
7:0
R/W
AUTO3_HIGH
Description
00000000 – 11111111: ADCIN3 high level
threshold
Table 176: AUTO3_LOW
Register Address
Bit
Type
Label
0xCF
AUTO3_LOW
7:0
R/W
AUTO3_LOW
Description
00000000 – 11111111: ADCIN3 low level
threshold
Table 177: Copmic_S to Copmic_E
Register Address
Bit
Type
Label
Description
0xD0
CoPMIC_S
7:0
R
Reserved
Reserved for Co-PMIC
0xDF
CoPMIC_E
7:0
R
Reserved
Reserved for Co-PMIC
Table 178: CHG_Co_S to CHG_Co_E
Register Address
Bit
Type
Label
0xE0
CHG_Co_S
7:0
R
Reserved
Reserved for companion charger
0xFF
CHG_Co_E
7:0
R
Reserved
Reserved for companion charger
Datasheet
CFR0011-120-00
DA9063L_2v1
156 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
A.4
Register Page 2
Table 179: PAGE_CON
Register
Address
Bit
Type
Label
0x100
PAGE_CON
7
RW
REVERT
6
RW
WRITE_MODE
5:3
RW
Reserved
2:0
RW
REG_PAGE
A.4.1
Description
See register 0x00, Table 41
OTP
Table 180: OTP_CONT
Register
Address
Bit
Type
Label
0x101
OTP_CONT
7
R
GP_WRITE_DIS
6
R
OTP_CONF_LOCK
0: Registers 0x0A to 0x36 and 0x82 to 0xCF are not
locked for OTP programming (only for evaluation
samples)
1: OTP registers 0x0A to 0x36 and 0x82 to 0xCF
are locked in OTP (set for all mass production
parts, no further fusing possible)
5
R
OTP_APPS_LOCK
0: Registers 0x104 to 0x117are not locked for OTP
programming (only for evaluation samples)
1: OTP registers 0x104 to 0x117 are locked in OTP
(set for all mass production parts, no further
fusing possible)
4
R
OTP_GP_LOCK
3
R/W
PC_DONE
2
R/W
OTP_APPS_RD
1
R/W
OTP_GP_RD
0
R/W
OTP_TIM
Datasheet
CFR0011-120-00
Description
0: Enables write access to GP_ID registers
1: GP_ID_0to GP_ID_9 registers are ‘read only’
0: Registers 0x120 to 0x134 are not locked for
OTP programming
1: Registers 0x120 to 0x134 are locked in OTP (no
further fusing possible if once fused with 1)
Asserted from PowerCommander SW after emulated
OTP read has finished (control shared with Co-PMIC),
automatically cleared when leaving emulated OTP
read
Reads on assertion application specific registers
(0x104 to 0x117 and OTP_APPS_LOCK) from OTP
Reads on assertion device specific registers 0x120 to
0x134 (plus GP_WRITE_DIS and OTP_GP_LOCK)
from OTP
OTP read timing
0: normal read
1: marginal read (for OTP fuse verification)
DA9063L_2v1
157 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 181: OTP_ADDR
Register Address
Bit
Type
Label
0x102
OTP_ADDR
7:0
R/W
OTP_ADDR
Description
OTP Array address (shared with Companion
ICs)
Table 182: OTP_DATA
Register Address
Bit
Type
Label
Description
0x103
OTP_DATA
7:0
R/W
OTP_DATA
OTP read/write data (shared with Companion
ICs)
OTP_DATA written to OTP_ADDR selects
the IC and accepts unlock sequence (1 + 3
bytes)
A.4.2
Customer Trim and Configuration
Table 183: T_OFFSET
Register Address
Bit
Type
Label
0x104
T_OFFSET
7:0
R
T_OFFSET
Description
10000000 – 01111111: signed two’s
complement calibration offset for junction
temperature measurement (loaded from the
OTP memory, must be programmed during
production)
Table 184: INTERFACE
Register Address
Bit
Type
Note 1
Label
0x105
INTERFACE
7:4
R
IF_BASE_ADDR
Description
4 MSB of 2-WIRE control interfaces base
address
XXXX0000
10110100 = 0xB4 write address of HS 2WIRE interface (page 0 and 1)
10110101 = 0xB5 read address of HS 2WIRE interface (page 0 and 1)
10110110 = 0xB6 write address of HS 2WIRE interface (page 2 and 3)
10110111 = 0xB7 read address of HS 2WIRE interface (page 2 and 3)
Code ‘0000’ is reserved for unprogrammed
OTP (triggers start-up with hardware default
interface address)
3:0
Note 1
R
Reserved
The interface configuration can be written/modified only for unmarked samples which do not have the
control OTP_APPS_LOCK asserted/fused.
Table 185: CONFIG_A
Register Address
Bit
Type
Label
0x106
CONFIG_A
7:4
R/W
Reserved
3
R/W
IRQ_TYPE
nIRQ output is:
0: Active low
1: Active high (invert signal)
2
R/W
PM_O_TYPE
nRESET, nIRQ output are:
Datasheet
CFR0011-120-00
DA9063L_2v1
158 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
0: Push-pull
1: Open drain (requires external pull-up
resistor)
1
R/W
PM_O_V
E_GPI_2, COMP1V2, nRESET, nIRQ are
supplied from:
0: VDD_IO1
1: VDD_IO2
0
R/W
PM_I_V
nONKEY, nOFF, nSHUTDOWN, SYS_EN,
PWR_EN, PWR1_EN, KEEP_ACT,
nVIB_BRAKE are supplied from:
0: VDDCORE
1: VDD_IO2
Table 186: CONFIG_B
Register Address
Bit
Type
Label
Description
0x107
CONFIG_B
7
R/W
Reserved
6:4
R/W
VDD_HYST_ADJ
Hysteresis adjust of VDD_FAULT comparator
(VDD_FAULT_UPPER) in 50 mV steps
000: 100 mV
001: 150 mV
…
111: 450 mV
3:0
R/W
VDD_FAULT_ADJ
Setting of VDD_FAULT_LOWER comparator
in 50 mV steps
0000: 2.50 V
0001: 2.55 V
…
0110: 2.80 V
…
1110: 3.20 V
1111: 3.25 V
Description
Table 187: CONFIG_C
Register Address
Bit
Type
Label
0x108
CONFIG_C
7
R/W
BPERI_CLK_INV
BUCKPERI clock polarity
0: Normal
1: Inverted
6
R/W
BIO_CLK_INV
5
R/W
BMEM_CLK_INV
BUCKIO clock polarity
0: Normal
1: Inverted
BUCKMEM clock polarity
0: Normal
1: Inverted
4
R/W
BPRO_CLK_INV
BUCKPRO clock polarity (should be
configured opposite to BUCKMEM clock
polarity)
0: Normal
1: Inverted
3
R/W
BCORE1_CLK_INV
BUCKCORE1 clock polarity (BUCKCORE2
always runs on opposite clock polarity)
0: Normal
1: Inverted
Datasheet
CFR0011-120-00
DA9063L_2v1
159 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
2
R/W
BUCK_DISCHG
1:0
R/W
Reserved
Description
Enable active discharge of buck rails
Table 188: CONFIG_D
Register Address
Bit
Type
Label
Description
0x109
CONFIG_D
7
R/W
GP_FB3_TYPE
GP_FB3 output is:
0: Active low
1: Active high (invert signal)
6
R/W
GP_FB2_TYPE
GP_FB2 output is:
0: Active low (invert signal, push-pull for
PWR_OK)
1: Active high (open drain for PWR_OK)
5
R/W
FORCE_RESET
4
R/W
HS_IF_HSM
Enables continuous High Speed mode on HS
2-WIRE IF (no master code required)
3
R/W
HS_IF_FMP
Selects fast-mode+ timings for HS 2-WIRE IF
if asserted
2
R/W
SYSTEM_EN_RD
1
R/W
nIRQ_MODE
0
R/W
GPI_V
Asserts port nRESET in case of being set
During second OTP read control
SYSTEM_EN is
0: updated from OTP
1: not changed
nIRQ will be asserted from events during
POWERDOWN mode (and modes lower than
ACTICE)
0: immediately
1: after powering up to ACTIVE mode
GPIs (not configured as Power Manager
control inputs) and HS 2-WIRE IF are
supplied from:
0: VDDCORE
1: VDD_IO2
Table 189: CONFIG_E
Register Address
Bit
Type
Label
Description
0x10A
CONFIG_E
7
R/W
PERI_SW_AUTO
Selects PERI_SW (during powering up):
0: configured from PERI_SW_CONF
1: enabled
6
R/W
CORE_SW_AUTO
Selects CORE_SW (during powering up):
0: configured from CORE_SW_CONF
1: enabled
5
R/W
BPERI_AUTO
Selects BUCKPERI (during powering up):
0: configured from BPERI_CONF
1: enabled
4
R/W
BIO_AUTO
3
R/W
BMEM_AUTO
Selects BUCKIO (during powering up):
0: configured from BIO_CONF
1: enabled
Selects BUCKMEM (during powering up):
0: configured from BMEM_CONF
1: enabled
Datasheet
CFR0011-120-00
DA9063L_2v1
160 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
2
R/W
BPRO_AUTO
Description
Selects BUCKPRO (during powering up):
0: configured from BPRO_CONF
1: enabled
1
R/W
BCORE2_AUTO
Selects BUCKCORE2 (during powering up):
0: configured from BCORE2_CONF
1: enabled
0
R/W
BCORE1_AUTO
Selects BUCKCORE1 (during powering up):
0: configured from BCORE1_CONF
1: enabled
Table 190: CONFIG_F
Register Address
Bit
Type
Label
Description
0x10B
CONFIG_F
7
R/W
LDO11_BYP
0: LDO11 is configured for regulator mode
1: LDO11 bypass mode enabled
6
R/W
LDO8_BYP
0: LDO8 is configured for regulator mode
1: LDO8 bypass mode enabled
5
R/W
LDO7_BYP
0: LDO7 is configured for regulator mode
1: LDO7 bypass mode enabled
4
R/W
Reserved
3
R/W
LDO3_BYP
2
R/W
LDO11_AUTO
0: LDO3 is configured for regulator mode
1: LDO3 bypass mode enabled
Selects LDO11 (during powering up):
0: configured from LDO11_CONF
1: enabled
1
R/W
Reserved
0
R/W
LDO9_AUTO
Selects LDO9 (during powering up):
0: configured from LDO9_CONF
1: enabled
Table 191: CONFIG_G
Register Address
Bit
Type
Label
0x10C
CONFIG_G
7
R/W
LDO8_AUTO
Description
Selects LDO8 (during powering up):
0: configured from LDO8_CONF
1: enabled
6
R/W
LDO7_AUTO
Selects LDO7 (during powering up):
0: configured from LDO7_CONF
1: enabled
5:3
R/W
Reserved
2
R/W
LDO3_AUTO
Selects LDO3 (during powering up):
0: configured from LDO3_CONF
1: enabled
1:0
Datasheet
CFR0011-120-00
R/W
Reserved
DA9063L_2v1
161 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 192: CONFIG_H
Register Address
Bit
Type
Label
Description
0x10D
CONFIG_H
7
R/W
BUCK_MERGE
6
R/W
BCORE1_OD
If set, BUCKCORE1 changes to full-current
mode (double pass device and current limit)
5
R/W
BCORE2_OD
If set, BUCKCORE2 changes to full-current
mode (double pass device and current limit)
4
R/W
BPRO_OD
If set, BUCKPRO changes to full-current
mode (double pass device and current limit)
3
R/W
BCORE_MERGE
Has to be set if the outputs of BUCKCORE1
and BUCKCORE2 are merged towards a
dual phase buck; the control from
BUCKCORE2 registers is disabled
2
R/W
MERGE_SENSE
In case BUCKCORE is merged and
configured for remote sensing the output
capacitor voltage rail is routed to port:
0: GP_FB_2 (setting disables normal
GP_FB_2 functionality)
1: CORE_SWS
Note: In case MERGE_SENSE is asserted all
Bxxx_FB control settings 0bx1x are invalid
1
R/W
LDO8_MODE
0: LDO mode (external capacitor required)
1: Vibration motor driver (no external
capacitor)
0
R/W
PWM_CLK
0: 2.0 MHz (31.25 kHz repetition frequency)
1: 1.0 MHz (15.6 kHz repetition frequency)
Description
Has to be set if the outputs of BUCKMEM
and BUCKIO are merged towards a single
coil; the control from BUCKIO registers is
disabled
Table 193: CONFIG_I
Register Address
Bit
Type
Label
0x10E
CONFIG_I
7
R/W
LDO_SD
If asserted LDO3, 7, 8 and 11 will shut down
after current limit was hit for more than
200 ms
6
R/W
INT_SD_MODE
Shut down sequence from internal fault
condition is:
0: Normal
1: Fast (skipping seq and dummy slot timers)
5
R/W
HOST_SD_MODE
Shut down sequence from SHUTDOWN
(register bit or port nSHUTDOWN) is:
0: Normal
1: Fast (skipping seq and dummy slot
timers)
4
Datasheet
CFR0011-120-00
R/W
KEY_SD_MODE
DA9063L_2v1
162 of 173
User triggered (nONKEY, GPIO14/15)
shutdown sequence is:
0: Normal
1: PMU POR: triggers an instant disable of all
regulators incl. LDOCORE (FAULTLOG
registers remain unchanged). After leaving
POR automatically the RESET_DURATION
timer must expire before starting a power-up
sequence.
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
Description
3
R/W
GPI14_15_SD
0: Disables shutdown via parallel
assertion of GPI14 and GPI15
1: Enables shutdown via GPI14 & GPI15
2
R/W
nONKEY_SD
nONKEY is configured
0: without shutdown via long press of
nONKEY
1: with shutdown via long press of nONKEY
1:0
R/W
nONKEY_PIN
nONKEY is configured to
00: Port mode
01: Key mode with key lock during SW
triggered POWERDOWN mode
10: Key mode with key locked autonomous
powering down (multi-functional key)
11: Key mode with autonomous powering
down to partial or key locked full
POWERDOWN mode (dedicated power key)
Details: see Section 6.1.1
Table 194: CONFIG_J
Register Address
Bit
Type
Label
Description
0x10F
CONFIG_J
7
R/W
IF_RESET
6
R/W
TWOWIRE_TO
Enables automatic reset of 2-WIRE-IF in
case of clock ceases to toggle for >19 ms
5:4
R/W
RESET_DURATION
Power controller stays in RESET mode for
minimum duration of
Enables automatic reset of all control
interfaces when port nSHUTDOWN is
asserted
00: 20 ms
01: 100 ms
10: 500 ms
11: 1000 ms
3:2
R/W
SHUT_DELAY
Long press time threshold for shutdown
feature from nONKEY and GPIO14/15:
00: KEY_DELAY + 0 s
01: KEY_DELAY + 4 s
10: KEY_DELAY + 5 s
11: KEY_DELAY + 6 s
1:0
R/W
KEY_DELAY
Long press threshold for nONKEY lock:
00: nONKEY_LOCK after 1 s
01: nONKEY_LOCK after 1.5 s
10: nONKEY_LOCK after 2 s
11: nONKEY_LOCK after 7 s
Note 1
This setting may trigger glidges on regulator outputs and disable the automatic RESET/POR of slave
PMUs).
Table 195: CONFIG_K
Register Address
Bit
Type
Label
0x110
CONFIG_K
7
R/W
GPIO7_PUPD
Description
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
Datasheet
CFR0011-120-00
DA9063L_2v1
163 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Register Address
Bit
Type
Label
6
R/W
GPIO6_PUPD
Description
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
5
R/W
GPIO5_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
4
R/W
GPIO4_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
3
R/W
GPIO3_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
2
R/W
GPIO2_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
1
R/W
GPIO1_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
0
R/W
GPIO0_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
Datasheet
CFR0011-120-00
DA9063L_2v1
164 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 196: CONFIG_L
Register Address
Bit
Type
Label
0x111
CONFIG_L
7
R/W
GPIO15_PUPD
Description
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
6
R/W
GPIO14_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
5
R/W
GPIO13_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
4
R/W
GPIO12_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
3
R/W
GPIO11_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
2
R/W
GPIO10_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
1
R/W
GPIO9_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
0
R/W
GPIO8_PUPD
0: GPI: pull-down resistor disabled
GPO (open drain): pull-up resistor
disabled (external pull-up resistor)
1: GPI: pull-down resistor enabled
GPO (open drain): pull-up resistor enabled
(supply rail selected via GPIOx_TYPE)
Datasheet
CFR0011-120-00
DA9063L_2v1
165 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 197: CONFIG_M
Register Address
Bit
Type
Label
0x112
CONFIG_M
7:4
R/W
OSC_FRQ
Description
Offset for internal HF oscillator frequency
0x8: -10.67%
…
0xF: -1.33%
0x0: 0.00%
0x1: 1.33%
…
0x7: 9.33%
3:0
R/W
Reserved
Table 198: Reserved
Register Address
Bit
Type
Label
0x113
7:0
R/W
Reserved
Description
Table 199: MON_REG_1
Register Address
Bit
Type
Label
0x114
MON_REG_1
7:6
R/W
UVOV_DELAY
Description
Range comparison is enabled after regulator
enable:
00: immediately
01: with one measurement delay
10: with two measurements delay
11: with four measurements delay
5:4
R/W
MON_MODE
Regulator monitor executes
00: Under-voltage/Over-voltage lockout
with an E_REG_UVOV event (nIRQ
assertion) and regulator shutdown from
an output voltage being out of the
selected range
01: Normal auto measurement with an
E_REG_UVOV event (nIRQ assertion) from
any finished auto measurement on A8, A9
and A10
10: Burst auto measurement with an
E_REG_UVOV event (nIRQ assertion)
generated after the time slot of A10 has been
processed
11: reserved
3
R/W
MON_DEB
0: Regulator monitor (A8, 9, 10): debouncing
off
1: Regulator monitor (A8, 9, 10):
debouncing on
2
R/W
MON_RES
Control requires M_REG_UVOV = 1:
1: Enables assertion of nRESET from out-ofrange detection
Note: It is not recommended to assert this
control inside OTP
1:0
R/W
MON_THRES
Regulator Monitor Threshold
00: Approx = 25 %
01: Approx = 12.5 %
10: Approx = 6.25 %
11: Approx = 3.125 %
Datasheet
CFR0011-120-00
DA9063L_2v1
166 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 200: MON_REG_2
Register Address
Bit
Type
Label
Description
0x115
MON_REG_2
7
R/W
LDO8_MON_EN
Enable LDO8 regulator monitoring
6
R/W
LDO7_MON_EN
Enable LDO7 regulator monitoring
5:3
R/W
Reserved
2
R/W
LDO3_MON_EN
1:0
R/W
Reserved
Enable LDO3 regulator monitoring
Table 201: MON_REG_3
Register Address
Bit
Type
Label
0x116
MON_REG_3
7:3
R/W
Reserved
2
R/W
LDO11_MON_EN
1
R/W
Reserved
0
R/W
LDO9_MON_EN
Description
Enable LDO11 regulator monitoring
Enable LDO9 regulator monitoring
Table 202: MON_REG_4
Register Address
Bit
Type
Label
Description
0x117
MON_REG_4
7
R/W
BPERI_MON_EN
Enable BUCKPERI regulator monitoring
6
R/W
BMEM_MON_EN
Enable BUCKMEM regulator monitoring
5
R/W
BIO_MON_EN
4
R/W
BPRO_MON_EN
3
R/W
BCORE2_MON_EN
Enable BUCKCORE2 regulator monitoring
2
R/W
BCORE1_MON_EN
Enable BUCKCORE1 regulator monitoring
1:0
R/W
Reserved
Enable BUCKIO regulator monitoring
Enable BUCKPRO regulator monitoring
Table 203: MON_REG_5
Register Address
Bit
Type
Label
0x11E
MON_REG_5
7
R
Reserved
6:4
R
MON_A9_IDX
3
R
Reserved
2:0
R
MON_A8_IDX
Description
Latest measurement at channel A9 was:
000: none
001: BUCKIO
010: BUCKMEM
011: BUCKPERI
> 011: reserved
Latest measurement at channel A8 was:
000: none
001: BUCKCORE1
010: BUCKCORE2
011: BUCKPRO
100: LDO3
101: Reserved
110: LDO11
> 110: reserved
Datasheet
CFR0011-120-00
DA9063L_2v1
167 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 204: MON_REG_6
Register Address
Bit
Type
Label
0x11F
MON_REG_6
7:3
R
Reserved
2:0
R
MON_A10_IDX
Description
Latest measurement at channel A10 was:
000: none
001: Reserved
010: LDO7
011: LDO8
100: LDO9
> 100: reserved
Table 205: Reserved
Register Address
Bit
Type
Label
0x120
7:0
R/W
Reserved
Description
Table 206: GP_ID_0
Register Address
Bit
Type
Label
0x121
GP_ID_0
7:0
R/W
GP_0
Note 1
Description
Data from fuse array (OTP)
Note 1
Write access can be disabled by OTP if required.
Table 207: GP_ID_1
Register Address
Bit
0x122
GP_ID_1
7:0
Note 1
Type
Label
R/W
GP_1
Description
Data from fuse array (OTP)
Note 1
Write access can be disabled by OTP if required.
Table 208: GP_ID_2
Register Address
Bit
Type
Label
0x123
GP_ID_2
7:0
R/W
Note 1
GP_2
Note 1
Description
Data from fuse array (OTP)
Write access can be disabled by OTP if required.
Table 209: GP_ID_3
Register Address
Bit
Type
Label
0x124
GP_ID_3
7:0
R/W
Note 1
GP_3
Note 1
Description
Data from fuse array (OTP)
Write access can be disabled by OTP if required.
Table 210: GP_ID_4
Register Address
Bit
Type
Label
0x125
GP_ID_4
7:0
R/W
GP_4
Note 1
Description
Data from fuse array (OTP)
Note 1
Write access can be disabled by OTP if required.
Datasheet
CFR0011-120-00
DA9063L_2v1
168 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 211: GP_ID_5
Register Address
Bit
0x126
GP_ID_5
7:0
Note 1
Type
Label
R/W
GP_5
Description
Data from fuse array (OTP)
Note 1
Write access can be disabled by OTP if required.
Table 212: GP_ID_6
Register Address
Bit
Type
Label
0x127
GP_ID_6
7:0
R/W
GP_6
Note 1
Description
Data from fuse array (OTP)
Note 1
Write access can be disabled by OTP if required.
Table 213: GP_ID_7
Register Address
Bit
Type
Label
0x128
GP_ID_7
7:0
R/W
Note 1
GP_7
Note 1
Description
Data from fuse array (OTP)
Write access can be disabled by OTP if required.
Table 214: GP_ID_8
Register Address
Bit
Type
Label
0x129
GP_ID_8
7:0
R/W
Note 1
GP_8
Note 1
Description
Data from fuse array (OTP)
Write access can be disabled by OTP if required.
Table 215: GP_ID_9
Register Address
Bit
0x12A
GP_ID_9
7:0
Note 1
Type
Label
R/W
GP_9
Description
Data from fuse array (OTP)
Note 1
Write access can be disabled by OTP if required.
Table 216: GP_ID_10
Register Address
Bit
Type
Label
0x12B
GP_ID_10
7:0
R/W
GP_10
Description
Data from fuse array (OTP), no OTP reload
after powering up from NO-POWER mode
Table 217: GP_ID_11
Register Address
Bit
Type
Label
0x12C
GP_ID_11
7:0
R/W
GP_11
Description
Data from fuse array (OTP)
Table 218: GP_ID_12
Register Address
Bit
Type
Label
0x12D
GP_ID_12
7:0
R/W
GP_12
Datasheet
CFR0011-120-00
DA9063L_2v1
169 of 173
Description
Data from fuse array (OTP)
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 219: GP_ID_13
Register Address
Bit
Type
Label
0x12E
GP_ID_13
7:0
R/W
GP_13
Description
Data from fuse array (OTP)
Table 220: GP_ID_14
Register Address
Bit
Type
Label
0x12F
GP_ID_14
7:0
R/W
GP_14
Description
Data from fuse array (OTP)
Table 221: GP_ID_15
Register Address
Bit
Type
Label
0x130
GP_ID_15
7:0
R/W
GP_15
Description
Data from fuse array (OTP)
Table 222: GP_ID_16
Register Address
Bit
Type
Label
0x131
GP_ID_16
7:0
R/W
GP_16
Description
Data from fuse array (OTP)
Table 223: GP_ID_17
Register Address
Bit
Type
Label
0x132
GP_ID_17
7:0
R/W
GP_17
Description
Data from fuse array (OTP)
Table 224: GP_ID_18
Register Address
Bit
Type
Label
0x133
GP_ID_18
7:0
R/W
GP_18
Description
Data from fuse array (OTP)
Table 225: GP_ID_19
Register Address
Bit
Type
Label
0x134
GP_ID_19
7:0
R/W
GP_19
Description
Data from fuse array (OTP)
Table 226: Copmic_S to Copmic_E
Register Address
Bit
Type
Label
0x140
CoPMIC_S
7:0
R
Reserved
Reserved for Co-PMIC
0x14F
CoPMIC_E
7:0
R
Reserved
Reserved for Co-PMIC
Datasheet
CFR0011-120-00
DA9063L_2v1
170 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Table 227: CHG_Co_S to CHG_Co_E
Register Address
Bit
Type
Label
0x150
CHG_Co_S
7:0
R
Reserved
Reserved for companion charger
0x17F
CHG_Co_E
7:0
R
Reserved
Reserved for companion charger
Datasheet
CFR0011-120-00
DA9063L_2v1
171 of 173
Description
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
A.5
Register Page 3
Table 228: PAGE_CON
Register Address
Bit
Type
Label
0x180
PAGE_CON
7
RW
REVERT
6
RW
WRITE_MODE
5:3
RW
Reserved
2:0
RW
REG_PAGE
Description
See register 0x00, Table 41
Table 229: DEVICE_ID
Register Address
Bit
Type
Label
0x181
DEVICE_ID
7:0
R
DEVICE_ID
Description
Read back of chip ID
Table 230: VARIANT_ID
Register Address
Bit
Type
Label
Description
0x182
VARIANT_ID
7:4
R
MRC
Read back of mask revision code (MRC)
3:0
R
VRC
Read back of package variant code (VRC)
Table 231: CUSTOMER_ID
Register Address
Bit
Type
Label
Description
0x183
CUSTOMER_ID
7:0
R
CUSTOMER_ID
ID for customer and target application
platform, written during production of variant
Table 232: CONFIG_ID
Register Address
Bit
Type
Label
Description
0x184
CONFIG_ID
7:0
R
CONFIG_REV
ID for revision of OTP settings, written during
production of variant
00000000 – OTP unprogrammed
(RESERVED)
> 00000000 – OTP configuration revision xxx
Table 233: PMIC_STATUS
Register Address
Bit
Type
Label
0x1A8
PMIC_STATUS
7
R
PC_DONE
6:5
R/W
Reserved
4:0
R
STATUS
Datasheet
CFR0011-120-00
DA9063L_2v1
172 of 173
Description
Power Commander download complete
Decimal Decode:
03 = RESET (Shutdown)
28 = SYSTEM
25 = POWER
23 = POWER-DOWN
20 = POWER1
17 = ACTIVE
05-Apr-2017
© 2017 Dialog Semiconductor
DA9063L
System PMIC for Mobile and Automotive Applications
Status Definitions
Revision
Datasheet Status
Product Status
Definition
1.<n>
Target
Development
This datasheet contains the design specifications for product development.
Specifications may be changed in any manner without notice.
2.<n>
Preliminary
Qualification
This datasheet contains the specifications and preliminary characterization
data for products in pre-production. Specifications may be changed at any
time without notice in order to improve the design.
3.<n>
Final
Production
This datasheet contains the final specifications for products in volume
production. The specifications may be changed at any time in order to
improve the design, manufacturing and supply. Major specification changes
are communicated via Customer Product Notifications. Datasheet changes
are communicated via www.dialog-semiconductor.com.
4.<n>
Obsolete
Archived
This datasheet contains the specifications for discontinued products. The
information is provided for reference only.
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Datasheet
CFR0011-120-00
DA9063L_2v1
173 of 173
05-Apr-2017
© 2017 Dialog Semiconductor
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