Low ESR Tantalum Chip Capacitors FEATURES • Low ESR and High Ripple Current Ratings • Values from 10μF to 470μF • Suitable for Flow and Reflow Soldering Processes • Available in EIA B, C and D Case Sizes NTC-L Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details SPECIFICATIONS Capacitance Range Capacitance Tolerance 10μF to 470μF ±10% (K) -55°C ~ +125°C (voltage derating above 85°C, see table below) See Part Number & Specifications Table -55°C +85°C +125°C ΔC -10% ΔC +10% ΔC +12% Operating Temperature Range Dissipation Factor @ 120Hz/25°C Capacitance Change Versus Temperature Soldering Heat Resistance (+260°C for 5~10 sec.) Moisture Resistance (500 hours; 90~95% RH @ 40°C Load Life Test @at Rated Voltage 2,000 hours @ 85°C Base Failure Rate (1.0Ω/Volt) ΔC ±10% Max., Leakage Current and Dissipation Factor will be less than value specified below. 1%/1000 hours at 60% confidence level (+85°C) STANDARD RATINGS AND CASE SIZE Rated Voltage @ 85°C 6.3Vdc 10Vdc 16Vdc 20Vdc 25Vdc 35Vdc Surge Voltage @ 85°C 8 13 20 26 32 45 Derated Voltage @125°C 4 6.3 10 13 16 22 Capacitance (μF) Code Case Size Case Size Case Size Case Size Case Size Case Size 10 15 22 33 47 68 100 150 220 330 470 106 156 226 336 476 686 107 157 227 337 477 B C C D D D D D B C C D D D D D D - B C D D D D - C C D D D - D D D - D D D - PART NUMBER SYSTEM NTC-L 106 K 16 TR B F RoHS Compliant Case Code Packaging: TR=Tape/Reel Voltage Tolerance Code: K=±10% Capacitance Code Series PRECAUTIONS Please review the notes on correct use, safety and precautions found on our website at www.niccomp.com/tantpc If in doubt or uncertainty, please review your specific application - process details with NIC’s technical support personnel: [email protected] NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com 1 Low ESR Tantalum Chip Capacitors NTC-L Series PART NUMBER AND SPECIFICATIONS TABLE Cap. (μF) 22 33 47 100 150 220 330 470 15 22 33 47 68 100 150 220 330 10 22 33 47 68 100 10 15 22 33 47 15 22 33 10 15 22 Part Number NTC-L226K6.3TRBF NTC-L336K6.3TRCF NTC-L476K6.3TRCF NTC-L107K6.3TRDF NTC-L157K6.3TRDF NTC-L227K6.3TRDF NTC-L337K6.3TRDF NTC-L477K6.3TRDF NTC-L156K10TRBF NTC-L226K10TRCF NTC-L336K10TRCF NTC-L476K10TRDF NTC-L686K10TRDF NTC-L107K10TRDF NTC-L157K10TRDF NTC-L227K10TRDF NTC-L337K10TRDF NTC-L106K16TRBF NTC-L226K16TRCF NTC-L336K16TRDF NTC-L476K16TRDF NTC-L686K16TRDF NTC-L107K16TRDF NTC-L106K20TRCF NTC-L156K20TRCF NTC-L226K20TRDF NTC-L336K20TRDF NTC-L476K20TRDF NTC-L156K25TRDF NTC-L226K25TRDF NTC-L336K25TRDF NTC-L106K35TRDF NTC-L156K35TRDF NTC-L226K35TRDF Voltage (Vdc) Dissipation Factor @ 120Hz/20°C 0.06 0.06 0.06 0.08 0.08 0.10 0.10 0.18 0.06 0.06 0.06 0.06 0.06 0.08 0.08 0.10 0.18 0.06 0.06 0.06 0.06 0.06 0.08 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 6.3 10 16 20 25 35 Leakage Current (μA) @ 25°C 1.4 2.1 3.0 6.3 9.5 14 20.8 32.9 1.5 2.2 3.3 4.7 6.8 10 15 22 33 1.6 3.5 5.3 7.5 11 16 2.0 3.0 4.4 6.6 9.4 3.8 5.5 8.3 3.5 5.3 7.7 ESR (ohms) @ 100KHz/20°C 0.50 0.35 0.35 0.15 0.10 0.10 0.10 0.20 0.60 0.50 0.35 0.25 0.20 0.10 0.10 0.10 0.15 0.60 0.40 0.25 0.20 0.15 0.10 0.60 0.50 0.35 0.30 0.20 0.30 0.30 0.30 0.30 0.30 0.50 Ripple Current Rating (mA) @ 100KHz/25°C 440 530 530 890 1,100 1,100 1,100 770 400 440 530 690 770 1,100 1,100 1,100 890 400 500 690 770 890 1,100 400 440 580 630 830 630 630 630 630 630 490 CASE DIMENSIONS (mm) Case Code L ±0.2 W ±0.2 B C D 3.4 5.8 7.3 2.6 3.2 4.3±0.3 HL I1 I2 ±0.2 ±0.2 ±0.2 a ±0.2 b ±0.2 c ±0.2 1.9 2.5 2.8 2.0 2.2 2.4 0.7 0.7 1.2 2.2 2.4 3.3 1.4 2.4 3.8 0.8 1.3 1.3 W1 L W1 L H H + c b b a I2 l1 + c l2 b a b I2 B and C Case Size l1 l2 D Case Size Terminations: 100% Sn (Lead-Free) Standard 2 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com Low ESR Tantalum Chip Capacitors NTC-L Series TAPING SPECIFICATIONS (mm) Case Code A ±0.1 B ±0.1 C ±03 D ±0.1 E ±0.1 F ±0.1 G ±0.1 H ±0.1 J ±0.1 K max. t max. Reel Qty B C D 3.1 3.7 4.8 3.8 6.3 7.7 8.0 12.0 12.0 3.5 5.5 5.5 1.75 1.75 1.75 4.0 8.0 8.0 2.0 2.0 2.0 4.0 4.0 4.0 1.5 1.5 1.5 2.5 3.0 3.4 0.2 0.3 0.3 2000 500 500 G H T J E Cover tape D C B A K F Anode 2.0 ± 0.5 178 ± 2.0 13.0 ± 0.5 60.0 ± 0.5 21.0 ± 0.8 9.0 ± 0.3 RECOMMENDED SOLDERING PROFILES Note: To avoid thermal shock a preheating stage, 130°C ~ 160°C for 1 minute, should be incorporated into the soldering process Flow Soldering - Permitted Temperature/Time Range 40 20 0 210 200 190 220 240 230 250 260 Temperature (deg. C) Temperature (deg. C) 300 200 100 0 30 60 90 100 125 30 20 B Case 10 C&D 0 200 250 240 230 220 210 260 Temperature (deg. C) Reflow Soldering - Recommended Profile Maximum Temperature/Time: 260°C/10 Sec. 0 Time (Seconds) 40 60 135 150 Temperature (deg. C) Time (Seconds) Reflow Soldering - Permitted Temperature/Time Range 160 Flow Soldering - Recommended Profile Maximum Temperature/Time: 245°C/5 Sec. 300 250 200 150 100 50 0 5 Sec. 0 30 60 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com 90 100 125 135 150 160 Time (Seconds) Time (Seconds) www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com 3