Material Content Data Sheet Sales Product Name BSZ120P03NS3 G MA# MA001321032 Package PG-TSDSON-8-2 Issued 23. January 2015 Weight* 38.42 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 1.346 3.50 0.002 0.01 0.008 0.02 218 0.168 0.44 4364 6.808 17.72 18.19 177201 181838 0.050 0.13 0.13 1309 1309 0.035 0.09 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.50 35025 35025 55 901 1.783 4.64 15.495 40.34 45.07 403327 450644 0.387 1.01 1.01 10077 10077 0.963 2.51 2.51 25056 25056 0.037 0.10 0.030 0.08 1.426 3.71 0.001 0.00 0.004 0.01 112 0.086 0.22 2244 3.501 9.11 0.002 0.00 0.008 0.02 196 0.151 0.39 3928 6.127 15.95 46416 972 777 3.89 37123 9.34 91134 2. 3. 16.36 159488 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 93518 49 Important Remarks: 1. 38872 28 163661 1000000