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HDC2010
SNAS693 – JULY 2017
HDC2010 Low Power Humidity and Temperature Digital Sensors
1 Features
3 Description
•
•
•
•
The HDC2010 is an integrated humidity and
temperature sensor that provides high accuracy
measurements with very low power consumption, in
an ultra-compact WLCSP (Wafer Level Chip Scale
Package). The sensing element of the HDC2010 is
placed on the bottom part of the device, which makes
the HDC2010 more robust against dirt, dust, and
other environmental contaminants. The capacitivebased sensor includes new integrated digital features
and a heating element to dissipate condensation and
moisture. The HDC2010 digital features include
programmable interrupt thresholds to provide
alerts/system
wakeups
without
requiring
a
microcontroller to be continuously monitoring the
system. This, combined with programmable sampling
intervals, low inherent power consumption, and
support for 1.8V supply voltage, make the HDC2010
well suited for battery-operated systems.
1
•
•
•
•
•
Relative Humidity Range 0% to 100%
Humidity Accuracy ±2%
Sleep Current 50nA
Average Supply Current (1 measurement per
second)
– RH only (11 bit) 300nA
– RH (11 bit) + Temperature (11 bit) 550nA
Temperature Range:
– Operating: –40°C to 85°C
– Functional: –40°C to 125°C
Temperature Accuracy: ±0.2°C typ.
Supply Voltage: 1.62 V to 3.6 V
Automatic Sampling Rate (5 Hz, 2 Hz, 1 Hz, 0.2
Hz, 0.1 Hz, 1/60 Hz, 1/120 Hz) or On Demand
I2C Interface
2 Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Smart Thermostats
Smart Home Assistants
Refrigerators
Refrigerated Transport
Washer/Dryers
HVAC Systems
Gas Sensing
Communications Equipment
Environmental Tags
Smoke and Heat Detectors
Inkjet Printers
Surveillance Cameras
CPAP Machines
Wearables
The HDC2010 provides high accuracy measurement
capability for a wide range of environmental
monitoring applications and Internet of Things (IoT)
such as smart thermostats, smart home assistants
and wearables. The HDC2010 can also be used to
provide critical temperature and humidity data for cold
chain transportation and storage of perishable goods
to help ensure products like food and pharmaceuticals arrive fresh.
The HDC2010 is factory-calibrated to 0.2°C
temperature accuracy and 2% relative humidity
accuracy and includes a heating element to burn
away condensation and moisture for increased
reliability. The HDC2010 supports operation from
-40°C to 125°C and from 0% to 100% relative
humidity.
Device Information(1)
PART NUMBER
PACKAGE
HDC2010
BODY SIZE (NOM)
1.5 mm x 1.5 mm x
0.675 mm
DSBGA (6-bump)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
RH Accuracy
10
Typical
9
Accuracy (r%RH)
8
7
6
5
4
3
2
1
0
0
10
20
30
40
50
60
70
80
90
100
RH (%RH)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
HDC2010
SNAS693 – JULY 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
4
4
6
6
7
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
I2C Interface Electrical Characteristics .....................
I2C Interface Timing Requirements...........................
Typical Characteristics ..............................................
7.5 Programming .......................................................... 15
7.6 Register Maps ......................................................... 16
8
8.1 Application Information............................................ 25
8.2 Typical Application ................................................. 25
8.3 Do's and Don'ts ...................................................... 26
9
Power Supply Recommendations...................... 28
9.1 Average Current Consumption Calculation............. 28
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Layout Example .................................................... 28
11 Device and Documentation Support ................. 30
11.1
11.2
11.3
11.4
11.5
11.6
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
Application and Implementation ........................ 25
Overview ................................................................... 8
Functional Block Diagram ......................................... 8
Feature Description................................................... 8
Device Functional Modes........................................ 14
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
30
30
30
30
30
30
12 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
2
DATE
REVISION
NOTES
July 2017
*
Initial release.
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5 Pin Configuration and Functions
WLCSP (DSBGA)
6 Pin YPA
Top View
Pin Functions
PIN
I/O TYPE (1)
DESCRIPTION
NAME
NO.
VDD
A1
P
Positive Supply Voltage
ADDR
B1
I
Address select pin – hardwired to VDD or GND.
GND: slave address: 1000000
VDD: slave address: 1000001
GND
C1
G
Ground
SDA
A2
I/O
Serial data line for I2C, open-drain; requires a pull-up resistor to VDD
SCL
B2
I
Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD
DRDY / INT
C2
O
Data ready/Interrupt
(1)
P=Power, G=Ground, I=Input, O=Output
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6 Specifications
6.1 Absolute Maximum Ratings (1)
MIN
MAX
UNIT
VDD
Input Voltage
-0.3
3.9
V
GND
Input Voltage
-0.3
3.9
V
ADDR
Input Voltage
-0.3
3.9
V
SCL
Input Voltage
-0.3
3.9
V
SDA
Input Voltage
-0.3
3.9
V
Tstg
Storage temperature
-65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN
VDD
Voltage Supply
NOM
1.62
MAX
UNIT
3.6
V
6.4 Thermal Information
HDC2010
THERMAL METRIC
(1)
DSBGA (YPA)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
114.8
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
0.8
°C/W
Junction-to-board thermal resistance
35.2
°C/W
ΨJT
Junction-to-top characterization parameter
0.6
°C/W
ΨJB
Junction-to-board characterization parameter
35.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ELECTRICAL SPECIFICATION
VDD
4
Supply Voltage
Operating Range
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1.62
3.6
V
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Electrical Characteristics (continued)
at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
RH measurement
MIN
(1)
650
890
550
730
Sleep Mode
0.05
0.1
0.3
Average at 1 measurement every 10 seconds, RH (11
bit) + temperature (11 bit) (1) (2)
Heater (3)
μA
0.55
Average at 1 measurement every 2 seconds, RH (11
bit) + temperature (11 bit) (1) (2)
IDDHEAT
UNIT
0.3
Average at 1 measurement/second, RH (11 bit) +
temperature (11 bit) (1) (2)
Supply current
MAX
Temperature measurement (1)
Average at 1 measurement/second, RH or temperature
only (1) (2)
IDD
TYP
0.105
Startup (average on startup time)
80
VDD = 3.3 V
90
mA
RELATIVE HUMIDITY SENSOR
RHACC
Accuracy (4)
RHREP
Repeatability (7)
RHHYS
Hysteresis (8)
RHRT
RHCT
RHOR
RHLTD
(5) (6)
Response Time
(9)
Conversion-time (7)
Operating range
Long-term Drift
±2
14 bit resolution
t63% step
(10)
%RH
%RH
8
s
275
11 bit accuracy
400
14 bit accuracy
660
Non-condensing (11)
%RH
±1
9 bit accuracy
0
(12)
±3
±0.1
µs
100
±0.25
%RH
%RH/yr
TEMPERATURE SENSOR
TEMPOR
Operating range
TEMPACC
Accuracy (7)
5°C < TA < 60°C
-40
±0.2
TEMPREP
Repeatability (7)
14 bit resolution
±0.1
9 bit accuracy
225
TEMPCT
Conversion-time (7)
11 bit accuracy
350
14 bit accuracy
610
125
°C
±0.4
°C
°C
µs
(1)
(2)
(3)
(4)
(5)
I2C read/write communication and pull up resistors current through SCL, SDA not included.
Average current consumption while conversion is in progress.
Heater operating range – 40°C to 85°C.
Excludes hysteresis and long-term drift.
Excludes the impact of dust, gas phase solvents and other contaminants such as vapors from packaging materials, adhesives, or tapes,
etc.
(6) Limits apply over the humidity operating range 20 to 80% RH (non-condensing) from 0 to 60°C.
(7) This parameter is specified by design and/or characterization and is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 20 to 80% RH (non-condensing) over 0 to 60°C. Prolonged operation beyond these ranges
may result in a shift of sensor reading, with slow recovery time.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents,
outgassing tapes, adhesives, packaging materials, etc.
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Electrical Characteristics (continued)
at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HUMIDITY AND TEMPERATURE
On demand
5
2
ODR
Output Data Rate
1
Selectable Output data rate
0.2
Hz
0.1
1/60
1/120
6.6 I2C Interface Electrical Characteristics
At TA = 30°C, VDD = 3.3 V (unless otherwise noted)
PARAMETER
VIH
Input High Voltage
VIL
Input Low Voltage
VOL
Output Low Voltage
TEST CONDITIONS
MIN
TYP
MAX
0.7 x
VDD
V
Sink current 3 mA
0.3 x
VDD
V
0.4
V
0.1 x
VDD
HYS
Hysteresis
CIN
Input Capacitance on all digital pins
UNIT
V
0.5
pF
6.7 I2C Interface Timing Requirements
At TA = 30°C, VDD = 1.8 V (unless otherwise noted)
MIN
NOM
MAX
UNIT
400
kHz
fSCL
Clock Frequency
10
tLOW
Clock Low Time
1.3
µs
tHIGH
Clock High Time
0.6
µs
tSP
Pulse width of spikes that be suppressed by input filter
tSTART
Shutdown entry delay
(1)
(1)
10
50
ns
15
ms
This parameter is specified by design and/or characterization and it is not tested in production.
SDA
tLOW
tSP
SCL
tHIGH
START
REPEATED
START
STOP
START
Figure 1. I2C Timing
6
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6.8 Typical Characteristics
Unless otherwise noted. TA = 30°C, VDD = 1.8V.
1
10
Typical
9
0.9
8
0.8
7
0.7
Accuracy (r°C)
Accuracy (r%RH)
Typical
6
5
4
0.6
0.5
0.4
3
0.3
2
0.2
1
0.1
0
-40
0
0
10
20
30
40
50
60
70
80
90
100
-25
-10
5
20
T = -40°C
T = -20°C
T = 0°C
T = 25°C
T = 85°C
T = 125°C
700
750
700
IDD (nA)
IDD (nA)
80
95
110
125
VDD = 1.62V
VDD = 1.8V
VDD = 2.5V
VDD = 3V
VDD = 3.3V
VDD = 3.6V
650
650
600
600
550
550
500
500
450
450
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
400
-40
3.6
-15
10
35
60
85
110
125
Temp (°C)
VDD (V)
Figure 4. Supply Current vs. Supply Voltage, Average at 1
measurement/second, RH (11bit) + temperature (11 bit)
Figure 5. Supply Current vs. Temperature, Average at 1
measurement/second, RH (11bit) +temperature (11 bit)
400
400
T = -40°C
T = -20°C
T = 0°C
T = 25°C
T = 50°C
T = 85°C
T = 125°C
350
300
350
300
VDD = 1.62V
VDD = 1.8V
VDD = 2.5V
VDD = 3V
VDD = 3.3V
VDD = 3.6V
250
IDD (nA)
250
IDD (nA)
65
800
750
200
200
150
150
100
100
50
50
0
1.6
50
Figure 3. Temperature Accuracy vs. Temperature
Figure 2. RH Accuracy vs. RH
800
400
1.6
35
Temp (°C)
RH (%RH)
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
0
-40
-15
10
35
60
85
110
125
Temp (°C)
VDD (V)
Figure 6. Supply Current vs. Supply Voltage, Sleep Mode
Figure 7. Supply Current vs. Temperature, Sleep Mode
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7 Detailed Description
7.1 Overview
The HDC2010 is a digital humidity sensor with integrated temperature sensor that provides excellent
measurement accuracy over the long term and at very low power. Measurement results can be read out through
the I2C compatible interface. Resolution is based on the measurement time and can be 9, 11, or 14 bits for
humidity; 11 or 14 bits for temperature.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Power Consumption
One of the key features of the HDC2010 is its low power consumption, which makes the device suitable in
battery or power harvesting applications. In these applications the HDC2010 spends most of the time in sleep
mode: with a typical 50nA of current consumption in sleep mode, the averaged current consumption is minimal.
Its low consumption in measurement mode minimizes any self-heating.
7.3.2 Heater
The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off the
sensor. The heater can be activated using HEAT_EN, bit 3 in the Reset and DRDY/INT Configuration Register
(0x0E). The heater helps in reducing the accumulated offset after long exposure at high humidity conditions. The
current consumption of the heater is typically 130mA, allowing a temperature increase of about 80°C.
8
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Feature Description (continued)
7.3.3 Interrupt Description
DataReady or interrupt can be generated based on different events and or conditions.
Register 0x07 Interrupt Configuration enable and disable the interrupt/dataready generation based output data
and threshold values.
INT/DRDY pins behaviors is related to the interrupt/dataready generation and the 0x0E configuration bits
DRDY/INT_EN, INT_POL and INT_MODE
DRDY/INT_EN put in High impedance or enables the INT pin.
INT_POL and INT_MODE define the polarity and the behaviors of the INT signal.
7.3.3.1 DRDY
When DRDY_MASK is set and a humidity and /or temperature conversion is completed the DRDY_STATUS bit
is set to 1. Based on the Configuration register settings the DRDY/INT pin behaves in different way. To enable
the DRDY pin the DRDY/INT_EN bit (0x0E bit[2]) has to be set to 1 otherwise the pin is put in high impedance.
Bit INT_POL defines the polarity of the DRDY/INT pin.
DRDY_STATUS
Previous Data
New Data Available
0
1
INT_POL = 1
DRDY/INT
Figure 8. Data Ready Interrupt - Active High (INT_POL = 1)
DRDY_STATUS
Previous Data
New Data Available
0
1
INT_POL = 0
DRDY/INT
Figure 9. Data Ready Interrupt - Active Low (INT_POL = 0)
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Feature Description (continued)
7.3.4 INTERRUPT on Threshold
7.3.4.1 Temperature High
When TH_MASK is set and the temperature is over the threshold value program in the Temperature Threshold
HIGH register the TH_STATUS bit is set to 1. The TH_STATUS bit and the DRDY/INT pin behave based on the
INT_POL and INT_MODE bits.
When INT_MODE set to 1 the TH_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT pin
is set by INT_POL.
When INT_MODE set to 0 the TH_STATUS bit is based on the current temperature value. The polarity of the
DRDY/INT pin is set by INT_POL
T[°C]
Temperature Threshold High
Time
TH_STATUS bit read
INT_MODE = µ0¶
TH_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
0
1
INT_MODE = µ1¶
TH_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
1
0
Figure 10. INTERRUPT on Threshold - Temperature High
10
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Feature Description (continued)
7.3.4.2 Temperature Low
When TL_MASK is set and the temperature is under the threshold value program in the Temperature Threshold
LOW register the TL_STATUS bit is set to 1. The TL_STATUS bit and the DRDY/INT pin behave based on the
INT_POL and INT_MODE bits.
When INT_MODE set to 1 the TL_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT pin
is set by INT_POL.
When INT_MODE set to 0 the TL_STATUS bit is based on the current temperature value. The polarity of the
DRDY/INT pin is set by INT_POL.
T[°C]
Temperature Threshold Low
Time
TL_STATUS bit read
INT_MODE = µ0¶
TL_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
0
1
INT_MODE = µ1¶
TL_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
1
0
Figure 11. INTERRUPT on Threshold - Temperature Low
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Feature Description (continued)
7.3.4.3 Humidity High
When HH_MASK is set and the humidity is over the threshold value program in the Humidity Threshold HIGH
register the HH_STATUS bit is set to 1. The HH_STATUS bit and the DRDY/INT pin behave based on the
INT_POL and INT_MODE bits.
When INT_MODE set to 1 the HH_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT pin
is set by INT_POL.
When INT_MODE set to 0 the HH_STATUS bit is based on the current humidity value. The polarity of the
DRDY/INT pin is set by INT_POL.
H[%RH]
Humidity Threshold High
Time
HH_STATUS bit read
INT_MODE = µ0¶
HH_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
0
1
INT_MODE = µ1¶
HH_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
1
0
Figure 12. INTERRUPT on Threshold - Humidity High
12
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Feature Description (continued)
7.3.4.4 Humidity Low
When HL_MASK is set and the humidity is over the threshold value program in the Humidity Threshold LOW
register the HL_STATUS bit is set to 1. The HL_STATUS bit and the DRDY/INT pin behave based on the
INT_POL and INT_MODE bits.
When INT_MODE set to 1 the HL_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT pin
is set by INT_POL.
When INT_MODE set to 0 the HL_STATUS bit is based on the current humidity value. The polarity of the
DRDY/INT pin is set by INT_POL.
H[%RH]
Humidity Threshold Low
Time
HL_STATUS bit read
INT_MODE = µ0¶
HL_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
0
1
INT_MODE = µ1¶
HL_STATUS
INT_POL = µ1¶
DRDY/INT
INT_POL = µ0¶
DRDY/INT
0
1
0
Figure 13. INTERRUPT on Threshold - Humidity Low
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Feature Description (continued)
7.3.5 INTERRUPT MODE
Two possible selectable Interrupt Mode are available.
7.3.5.1 Comparator mode
When INT_MODE is set to 1 is possible to activate one or more thresholds at the same time.
The HL_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT pin is set by INT_POL.
7.3.5.2 Level Mode
When INT_MODE is set to 0 is possible to activate only one threshold at time
The HL_STATUS bit is based on the current humidity value. The polarity of the DRDY/INT pin is set by
INT_POL.
7.4 Device Functional Modes
The HDC2010 has two modes of operation: sleep mode and measurement mode. After power up, the HDC2010
is in sleep mode. In this mode, the HDC2010 waits for I2C inputs including commands to configure the
conversion times, trigger a measurement, set the ODR and read measurements. Once it receives a command to
trigger a measurement, the HDC2010 moves from sleep mode to measurement mode. In measurement mode,
the HDC2010 acquires the configured measurements and sets the DRDY/INT pin. After completing the
measurement, the HDC2010 returns to sleep mode.
HDC2010 has two measurement trigger modes: On-Demand and automatic Output Data Rate.
In the On-Demand mode an I2C command triggers the conversion. In the automatic Output Data Rate a
conversion frequency is configured among 7 different possibilities (from 5 samples per second down to 1 sample
every 2 minutes). HDC2010 moves from sleep to measurement mode automatically based on the selected data
rate. At the end of the conversion, the new data overwrites the previous output data.
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7.5 Programming
7.5.1 I2C Serial Bus Address Configuration
To communicate with the HDC2010, the master must first address slave devices through a slave address byte.
The slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a
read or write operation. The HDC2010 features an address pin to allow up to 2 devices to be addressed on a
single bus. Table 1 describes the pin logic levels used to connect up to two devices. ADDR must be set before
any activity on the interface occurs and remain constant while the device is powered up.
Table 1. HDC2010 I2C Slave Address
ADR0
ADDRESS (7-BIT ADDRESS)
0
1000000
1
1000001
7.5.2 I2C Interface
The HDC2010 operates only as a slave device on the I2C bus interface. It is not allowed to have multiple devices
on the same I2C bus with the same address. Connection to the bus is made through the open-drain I/O lines,
SDA, and SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to
minimize the effects of input spikes and bus noise. After power-up, the sensor needs at most 3 ms, to be ready
to start RH and temperature measurement. After the power-up the sensor is in the sleep mode until a
communication or measurement is performed. All data bytes are transmitted MSB first.
7.5.3 Serial Bus Address
To communicate with the HDC2010, the master must first address slave devices through a slave address byte.
The slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a
read or write operation.
7.5.4 Read and Write Operations
To access a particular register on the HDC2010, by writing the appropriate value to the register address. The
register address value is the first byte transferred after the device slave address byte with the R/W bit low. Every
write operation to the HDC2010 requires a value for the register address (refer to Table 2).
When reading from the HDC2010, the last value stored in the register address by a write operation is used to
determine which register is read by a read operation. To change the address for a read operation, a new value
must be written to the pointer. This transaction is accomplished by issuing the slave address byte with the R/W
bit low, followed by the pointer byte. No additional data is required (refer to Table 3).
The master can then generate a START condition and send the slave address byte with the R/W bit high to
initiate the read command. The address value is incremented automatically enabling the multibyte read and write
operation (refer to Table 4 and Table 5). Note that register bytes are sent MSB first, followed by the LSB. A write
operation in a read-only register such as (DEVICE ID, MANUFACTURER ID, SERIAL ID) returns a NACK after
each data byte; read/write operation to unused address returns a NACK after the pointer; a read/write operation
with incorrect I2C address returns a NACK after the I2C address.
Table 2. Write Single Byte
Master
START
Slave address (W)
Address
Slave
DATA
ACK
ACK
STOP
ACK
Table 3. Write Multi Byte
Master
Slave
START
Slave address (W)
Address
ACK
DATA
ACK
DATA
ACK
ACK
………
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Table 4. Read Single Byte
Master
START
Slave address (W)
Slave
Address
Start
ACK
Slave address (W)
NACK
ACK
ACK
STOP
DATA
Table 5. Read Multi Byte
Master START
Slave
address (W)
Slave
Address
ACK
Start
Slave
address (W)
ACK
ACK
ACK
ACK
DATA
……
NACK
STOP
DATA
7.6 Register Maps
The HDC2010 contains data registers that hold configuration information, temperature and humidity
measurement results, and status information
Table 6. Register Map
ADDRESS (HEX)
NAME
RESET VALUE
DESCRIPTION
0x00
TEMPERATURE LOW
0
Temperature [7:0]
0x01
TEMPERATURE HIGH
0
Temperature [15:8]
0x02
HUMIDITY LOW
0
Humidity [7:0]
0x03
HUMIDITY HIGH
0
Humidity [15:8]
0x04
INTERRUPT/DRDY
0
DataReady and interrupt configuration
0x05
TEMPERATURE MAX
0
Max temperature value measured (peak detector
0x06
HUMIDITY MAX
0
Max humidity value measured (peak detector)
0x07
INTERRUPT MASK
0
Interrupt Mask
0x08
TEMP_OFFSET_ADJUST
0
Temperature offset adjustment
0x09
HUM_OFFSET_ADJUST
0
Humidity offset adjustment
0x0A
TEMP_THR_L
11111111
Temperature Threshold Low
0x0B
TEMP_THR_H
0
Temperature Threshold High
0x0C
RH_THR_L
11111111
Humidity threshold Low
0x0D
RH_THR_H
0
Humidity threshold High
0x0E
RESET&DRDY/INT CONF
0
Soft Reset and Interrupt Configuration
0x0F
MEASUREMENT CONF
0
Measurement configuration
0xFC
MANUFACTURER ID LOW
01001001
Manufacturer ID Low
0xFD
MANUFACTURER ID HIGH
01010100
Manufacturer ID High
0xFE
DEVICE ID LOW
11010000
Device ID Low
0xFF
DEVICE ID HIGH
00000111
Device ID High
7.6.1 Address 0x00 Temperature LSB
Table 7. Address 0x00 Temperature LSB Register
7
6
5
4
3
2
1
0
TEMP[7:0]
Table 8. Address 0x00 Temperature LSB Field Descriptions
16
BIT
FIELD
[7:0]
TEMPERATURE [7:0]
TYPE
R
RESET
00000000
DESCRIPTION
Temperature LSB
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7.6.2 Address 0x01 Temperature MSB
Table 9. Address 0x01 Temperature MSB Register
7
6
5
4
3
2
1
0
TEMP[15:8]
Table 10. Address 0x01 Temperature MSB Field Descriptions
BIT
FIELD
[15:8]
TYPE
TEMPERATURE [15:8]
RESET
R
00000000
DESCRIPTION
Temperature MSB
The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The
result of the acquisition is always a 14 bit value, while the resolution is related to one selected in Measurement
Configuration register. The temperature can be calculated from the output data with:
Temperature (qC)
§ TEMPERATURE [15 : 0] ·
¨
¸ u 165 40
©
¹
216
(1)
7.6.3 Address 0x02 Humidity LSB
Table 11. Address 0x02 Humidity LSB Register
7
6
5
4
3
2
1
0
HUMIDITY[7:0]
Table 12. Address 0x02 Humidity LSB Field Descriptions
BIT
FIELD
[7:0]
TYPE
HUMIDITY [7:0]
R
RESET
00000000
DESCRIPTION
Humidity LSB
7.6.4 Address 0x03 Humidity MSB
Table 13. Address 0x03 Humidity MSB Register
7
6
5
4
3
HUMIDITY[15:8]
2
1
0
Table 14. Address 0x03 Temperature MSB Field Descriptions
BIT
[15:8]
FIELD
HUMIDITY[15:8]
TYPE
R
RESET
00000000
DESCRIPTION
Humidity MSB
The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result
of the acquisition is always a 14 bit value, while the resolution is related to one selected in Measurement
Configuration register. The humidity can be calculated from the output data with:
Humidity (%RH)
§ HUMIDITY [15 : 0] ·
¨
¸ u 100
216
©
¹
(2)
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7.6.5 Address 0x04 Interrupt DRDY
Table 15. Address 0x04 Interrupt DRDY Register
7
DRDY_STATU
S
6
HH_STATUS
5
HL_STATUS
4
TH_STATUS
3
TL_STATUS
2
RES
1
RES
0
RES
Table 16. Address 0x04 Humidity MSB Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
DRDY_STATUS
R/W
0
DataReady bit status
0 = Data Not Ready
1 = Data Ready
DRDY_STAUS is cleared to 0 when read
6
HH_STATUS
R/W
0
Temperature threshold HIGH Interrupt status
0 = No interrupt
1 = Interrupt
TH_STATUS is cleared to 0 when read
5
HL_STATUS
R/W
0
Temperature threshold LOW Interrupt status
0 = No interrupt
1 = Interrupt
TL_STATUS is cleared to 0 when read
4
TH_STATUS
R/W
0
Humidity threshold HIGH Interrupt status
0 = No interrupt
1 = Interrupt
HH_STATUS is cleared to 0 when read
3
TL_STATUS
R/W
0
Humidity threshold LOW Interrupt status
0 = No interrupt
1 = Interrupt
HL_STATUS is cleared to 0 when read
2
RES
0
Reserved
1
RES
0
Reserved
0
RES
0
Reserved
DRDY_STATUS indicates that temperature and/or humidity conversion is terminated. This bit is cleared when the
Interrupt/DRDY register is read or the output registers TEMPERATURE_HIGH, TEMPERATURE_LOW,
HUMIDITY_HIGH and HUMIDITY_LOW are read.
The TL_STATUS indicates that the Temperature Threshold LOW value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
The TH_STATUS indicates that the Temperature Threshold HIGH value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
The HH_STATUS indicates that the Humidity Threshold HIGH value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
The HL_STATUS indicates that the Humidity Threshold LOW value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
DRDY/INT pin behaves like the STATUS bits based on the 0x0E Configuration register value.
18
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7.6.6 Address 0x05 Temperature MAX
Table 17. Address 0x05 Temperature MAX Register
7
6
5
4
3
TEMPERATUREMAX[7:0]
2
1
0
Table 18. Address 0x05 Temperature Max Field Descriptions
BIT
FIELD
[7:0]
TYPE
TEMPERATUREMAX[7:0]
R/W
RESET
00000000
DESCRIPTION
Temperature max value measured (peak detection)
Write 0x00 to erase the last value
The temperature can be calculated from the output data with:
(3)
This register implements temperature peak detector function. It stores the highest temperature value converted
after the power up. Value is reset at power up and/or with soft reset procedure.
7.6.7 Address 0x06 Humidity MAX
Table 19. Address 0x06 Humidity MAX Register
7
6
5
4
3
HUMIDITYMAX[7:0]
2
1
0
Table 20. Address 0x06 Humidity MAX Field Descriptions
BIT
[7:0]
FIELD
HUMIDITYMAX[7:0]
TYPE
R/W
RESET
00000000
DESCRIPTION
Humidity max value measured (peak detection)
Write 0x00 to erase the last value
The humidity can be calculated from the output data with:
(4)
This register implements humidity peak detector function. It stores the highest humidity value converted after the
power up. Value is reset at power up and/or with soft reset procedure.
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7.6.8 Address 0x07 Interrupt Configuration
Table 21. Address 0x07 Interrupt Configuration Register
7
DRDY_MASK
6
TH_MASK
5
TL_MASK
4
HH_MASK
3
HL_MASK
2
RES
1
RES
0
RES
Table 22. Address 0x07 Humidity MSB Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
DRDY_MASK
R/W
0
DataReady Interrupt mask
0 = DataReady Interrupt generator disable
1 = DaReady Interrupt generator enable
6
TH_MASK
R/W
0
Temperature threshold HIGH Interrupt mask
0 = Temperature high Interrupt generator enable
1 = Temperature high Interrupt generator disable
5
TL_MASK
R/W
0
Temperature threshold LOW Interrupt mask
0 = Temperature low Interrupt generator enable
1 = Temperature low Interrupt generator disable
4
HH_MASK
R/W
0
Humidity threshold HIGH Interrupt mask
0 = Humidity high Interrupt generator enable
1 = Humidity high Interrupt generator disable
3
HL_MASK
R/W
0
Humidity threshold LOW Interrupt mask
0 = Humidity low Interrupt generator enable
1 = Humidity Low Interrupt generator disable
2
RES
0
Reserved
1
RES
0
Reserved
0
RES
0
Reserved
7.6.9 Address 0x08 Temperature Offset Adjustment
Table 23. Address 0x08 Temperature Offset Adjustment Register
7
6
5
4
3
TEMP_OFFSET_ADJUST[7:0]
2
1
0
Table 24. Address 0x08 Temperature Offset Adjustment Field Descriptions
BIT
FIELD
[7:0]
TYPE
TEMP_OFFSET_ADJUST [7:0]
R/W
RESET
00000000
DESCRIPTION
Temperature offset adjustment. Added to the converted
Temperature value
The temperature can be adjusted adding the following values that are enable settings the equivalents bits:
7
–20.62
6
10.32
5
5.16
4
2.58
3
1.28
2
0.64
1
0.32
0
0.16
The value is added to the converted temperature value for offset adjustment.
Converted Value
+
Temperature Output
User Temperature Offset
Figure 14. Temperature Offset
20
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7.6.10 Address 0x09 Humidity Offset Adjustment
Table 25. Address 0x09 Humidity Offset Adjustment Register
7
6
5
4
3
HUM_OFFSET_ADJUST [7:0]
2
1
0
Table 26. Address 0x09 Humidity Offset Adjustment Field Descriptions
BIT
FIELD
[7:0]
TYPE
HUM_OFFSET_ADJUST [7:0]
R/W
RESET
00000000
DESCRIPTION
Humidity offset adjustment. Added to the converted Humidity
value
The humidity can be adjusted adding the following values that are enable settings the equivalents bits:
7
–25
6
12.5
5
6.3
4
3.1
3
1.6
+
Converted Value
2
0.8
1
0.4
0
0.2
1
0
Humidity Output
User Humidity Offset
Figure 15. Humidity Offset
7.6.11 Address 0x0A Temperature Threshold HIGH
Table 27. Address 0x0A Temperature Threshold HIGH Register
7
6
5
4
3
TEMP_THRES_HIGH[7:0]
2
Table 28. Address 0x0A Temperature Threshold HIGH Field Descriptions
BIT
FIELD
[7:0]
TYPE
TEMP_THRES_HIGH[7:0]
Temperature threshold high (qC)
R/W
RESET
11111111
DESCRIPTION
Temperature threshold HIGH value
§ TEMP_THRES_HIGH [7 : 0] ·
¨
¸ u 165 40
©
¹
28
(5)
7.6.12 Address 0x0B Temperature Threshold LOW
Table 29. Address 0x0B Temperature Threshold LOW Register
7
6
5
4
3
TEMP_THRES_LOW[7:0]
2
1
0
Table 30. Address 0x0B Temperature Threshold LOW Field Descriptions
BIT
[7:0]
FIELD
TYPE
TEMP_THRES_LOW[7:0]
Temperature threshold low (qC)
R/W
RESET
00000000
DESCRIPTION
Temperature threshold LOW value
§ TEMP_THRES_LOW [7 : 0] ·
¨
¸ u 165 40
28
©
¹
(6)
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7.6.13 Address 0x0C Humidity Threshold HIGH
Table 31. Address 0x0C Humidity Threshold HIGH Register
7
6
5
4
3
HUMI_THRES_HIGH[7:0]
2
1
0
Table 32. Address 0x0C Humidity Threshold HIGH Field Descriptions
BIT
FIELD
[7:0]
TYPE
HUMI_THRES_HIGH[7:0]
Humidity threshold high (%RH)
R/W
RESET
DESCRIPTION
11111111
Humidity threshold HIGH value
§ HUMI_THRES_HIGH [7 : 0] ·
¨
¸ u 100
©
¹
28
(7)
7.6.14 Address 0x0D Humidity Threshold LOW
Table 33. Address 0x0D Humidity Threshold LOW Register
7
6
5
4
3
HUMI_THRES_LOW[7:0]
2
1
0
Table 34. Address 0x0D Humidity Threshold LOW Field Descriptions
BIT
FIELD
[7:0]
TYPE
HUMI_THRES_LOW[7:0]
Humidity threshold low (qC)
R/W
RESET
DESCRIPTION
00000000
Humidity threshold LOW value
§ HUMI_THRES_LOW [7 : 0] ·
¨
¸ u 100
28
©
¹
(8)
7.6.15 Address 0x0E Reset and DRDY/INT Configuration Register
Table 35. Address 0x0E Reset and DRDY/INT Configuration Register
7
SOFT_RES
6
ODR[2]
5
ODR[1]
4
ODR[0]
3
HEAT_EN
2
DRDY/INT_EN
1
INT_POL
0
INT_MODE
Table 36. Address 0x0E Reset and DRDY/INT Configuration Field Descriptions
BIT
FIELD
7
22
TYPE
RESET
DESCRIPTION
SOFT_RES
R/W
0
0 = Normal Operation mode, this bit is self-clear
1 = Soft Reset
EEPROM value reload and registers reset
[6:4]
ODR[2:0]
R/W
000
Output Data Rate
000 = No repeated measurements. Trigger on demand
001 = 1/120Hz (1 samples every 2 minutes)
010 = 1/60Hz (1 samples every minute)
011 = 0.1Hz (1 samples every 10 seconds)
100 = 0.2 Hz (1 samples every 5 second)
101 = 1Hz (1 samples every second)
110 = 2Hz (2 samples every second)
111 = 5Hz (5 samples every second)
3
HEAT_EN
R/W
0
0 = Heater off
1 = Heater on
2
DRDY/INT_EN
R/W
0
DRDY/INT_EN pin configuration
0 = High Z
1 = Enable
1
INT_POL
R/W
0
Interrupt polarity
0 = Active Low
1 = Active High
0
INT_MODE
0
Interrupt mode
0 = Level sensitive
1 = Comparator mode
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7.6.16 Address 0x0F Measurement Configuration
Table 37. Address 0x0F Measurement Configuration Register
7
TRES[1]
6
TRES[0]
5
HRES[1]
4
HRES[0]
3
RES
2
1
MEAS_CONF[1 MEAS_CONF[0
]
]
0
MEAS_TRIG
Table 38. Address 0x0F Measurement Configuration Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
7:6
TRES[1:0]
R/W
00
Temperature resolution
00: 14 bit
01: 11 bit
10: 9 bit
11: NA (TBC)
5:4
HRES[1:0]
R/W
00
Humidity resolution
00: 14 bit
01: 11 bit
10: 9 bit
11: NA (TBC)
RES
R/W
0
Reserved
MEAS_CONF[1:0]
R/W
00
Measurement configuration
00: Humidity + Temperature
01: Temperature only
10: Humidity Only
11: NA
MEAS_TRIG
R/W
0
Measurement trigger
0: no action
1: Start measurement
Self-cleaning bit when measurement completed
3
2:1
0
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7.6.17 Manufacturer ID Low
Table 39. Manufacturer ID Low Register
7
6
5
4
3
MANUFACTURER ID[7:0]
2
1
0
Table 40. Address 0xFC Manufacturer ID Low Field Descriptions
BIT
FIELD
[7:0]
TYPE
MANUFACTURER ID [7:0]
RESET
R
01001001
DESCRIPTION
Manufacturer ID LOW value
7.6.18 Manufacturer ID High
These registers contain a factory-programmable identification value that identifies this device as being
manufactured by Texas Instruments. These registers distinguish this device from other devices that are on the
same I2C bus. The manufacturer ID reads 0x5449
Table 41. Manufacturer ID High Register
7
6
5
4
3
MANUFACTURER ID[15:8]
2
1
0
Table 42. Address 0xFD Manufacturer ID High Field Descriptions
BIT
FIELD
[7:0]
TYPE
MANUFACTURER ID [15:8]
RESET
R
01010100
DESCRIPTION
Manufacturer ID HIGH value
7.6.19 Device ID Low
Table 43. Device ID Low Register
7
6
5
4
3
2
1
0
DEVICE ID[7:0]
Table 44. Address 0xFE Device ID Low Field Descriptions
BIT
FIELD
[7:0]
TYPE
DEVICE ID [7:0]
R
RESET
11010000
DESCRIPTION
Device ID LOW value
7.6.20 Device ID High
These registers contain a factory-programmable identification value that identifies this device as a HDC2010.
These registers distinguish this device from other devices that are on the same I2C bus. The Device ID for the
HDC2010 is 0x07D0
Table 45. Device ID High Register
7
6
5
4
3
DEVICE ID[15:8]
2
1
0
Table 46. Address 0xFF Device ID High Field Descriptions
BIT
FIELD
[7:0]
24
DEVICE ID [15:8]
TYPE
R
RESET
00000111
DESCRIPTION
Device ID HIGH value
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
An HVAC system thermostat control is based on environmental sensors and a micro-controller. The
microcontroller acquires data from humidity sensors and temperature sensors and controls the heating/cooling
system. The collected data are then shown on a display that can be easily controlled by the micro controller.
Based on data from the humidity and temperature sensor, the heating/cooling system then maintains the
environment at customer-defined preferred conditions.
8.2 Typical Application
In a battery-powered HVAC system thermostat, one of the key parameters in the selection of components is the
power consumption. The HDC2010, with 550nA of current consumption (average consumption over 1s for RH
and Temperature measurements), in conjunction with an MSP430, represents an excellent choice for low power
consumption, which extends the battery life. A system block diagram of a battery powered thermostat is shown in
Figure 16
Figure 16. Typical Application Schematic HVAC
8.2.1 Design Requirements
In order to correctly sense the ambient temperature and humidity, the HDC2010 must be positioned away from
heat sources on the PCB. It must not be close to the LCD and battery. Moreover, to minimize any self-heating of
the HDC2010 it is recommended to acquire at a maximum sample rate of 1sps (RH + Temp). In home systems,
humidity and the temperature monitoring rates of less than 1sps (even 0.5sps or 0.2sps) can be still effective.
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Typical Application (continued)
8.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in Figure 16 a small circuit board is possible.
The accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of the
sensing system. The HDC2010 samples relative humidity and temperature in its immediate environment, it is
therefore important that the local conditions at the sensor match the monitored environment. Use one or more
openings in the physical cover of the thermostat to obtain a good airflow even in static conditions. Refer to the
layout (Figure 19) for a PCB layout which minimizes the thermal mass of the PCB in the region of the HDC2010,
which can improve measurement response time and accuracy.
8.2.3 Application Curves
The data shown was acquired with the HDC2010EVM. A humidity chamber was used to control the environment.
Figure 17. RH vs. Time
8.3 Do's and Don'ts
8.3.1 Soldering
For soldering HDC2010, standard reflow soldering ovens may be used. The sensor is qualified to withstand
soldering profile according to IPC/JEDEC J-STD-020 with peak temperatures at 260 °C. Refer to the document
SNVA009 for more details on the DSBGA package. In the document refer to DSBGA package with bump size
0.5mm pitch and 0.32mm diameter.
Only no clean solder paste may be used when soldering the HDC2010 and no liquid based cleaning or board
wash can be used. The HDC2010 must be limited to a single IR reflow and no rework is recommended.
Immediately after solder reflow the sensor will generally output a shifted relative humidity. This RH shift will
disappear over time as the sensor is exposed to typical indoor ambient conditions (room temperature, 3055%RH). After 1-3 days at ambient conditions the device will return to the specified RH accuracy.
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Do's and Don'ts (continued)
8.3.2 Ambient Exposure, Storage and Handling
The HDC2010 has an exposed humidity sensor which needs to be handled with more care than standard
semiconductor circuit components. Long exposures to UV light, visible light or high concentration chemical
vapors for prolonged periods may shift the RH output and should be avoided. Exposure to high concentrations of
out-gassed solvent vapors for long times should be avoided during manufacturing, transport and operation.
Package materials which can produce significant out-gassing include: some adhesives (tapes or dispensed),
ESD foils, ESD foams, etc.
8.3.3 High Temperature and Humidity Exposure
Long exposure outside the recommended operating conditions may temporarily offset the RH output. Table 47
shows the RH offset values that can be expected for exposure to 85 °C and 85 % RH for durations between 12
and 500 hours (continuous).
Table 47. Induced RH Offset Due to Extended Exposure to High Humidity and High Temperature
(85°C/85% RH)
85°C/85% RH Duration (hours)
12
24
168
500
RH Offset (%)
3
6
12
15
When the sensor is exposed to less severe conditions, Figure 18 shows the typical RH offset at other
combinations of temperature and RH.
100
90
±3%
RH (%RH)
80
70
60
50
±2%
40
30
20
10
±3%
0
0
10
20
30
40
50
Temperature (°C)
60
70
Figure 18. Relative Humidity Accuracy vs Temperature
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9 Power Supply Recommendations
The HDC2010 requires a voltage supply within 1.62 V and 3.6 V. TI recommends a multilayer ceramic
bypass X7R capacitor of 0.1µF between the VDD and GND pins.
9.1 Average Current Consumption Calculation
HDC2010 average current consumption is function of selected parameters:
• Resolution;
• Output data rate;
Average current consumption takes in account the following specifications:
• Current consumption during conversion;
• Data conversion duration (RHCTand TEMPCT);
• Current consumption in stand-by (IDD-SLEEP)
Average current calculation
Average current = {[(H_Conv_Time* H_Conv_Cur) + (T_Conv_Time* T_Conve_Corr )]+[(ODR-(T_Conv_Time +
T_Conve_Corr ))* Sleep )]}/ODR
Example:
• Resolution = 11bit for both Humidity and Temperature
• Output Data Rate: ODR = 1Hz (1sec = 1000000us)
• Humidity conversion time: H_Conv_Time = 400us (for 11 bit resolution)
• Temperature conversion time: T_Conv_Time = 350 us (for 11 bit resolution)
• Humidity conversion current consumption: H_Conv_Cur = 650uA
• Temperature conversion current consumption: T_Conve_Corr = 550uA
• Sleep current: Sleep = 0.05uA
Average
0.502uA
current
=
{[(400us*650uA)+(350us*550uA)]+[(1000000us-(400us+350us))*0.05uA)]}/1000000us
=
10 Layout
10.1 Layout Guidelines
The Relative Humidity sensor element is located on the top side of the package.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device
(GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.
10.2 Layout Example
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent
on the temperature, the HDC2010 must be positioned away from hot spots present on the board, such as a
battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a
quicker response for environmental changes.
28
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Layout Example (continued)
Figure 19. Layout
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
HDC2010EVM User's Guide
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
30
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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23-Jul-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
HDC2010YPAR
ACTIVE
DSBGA
YPA
6
3000
Green (RoHS
& no Sb/Br)
SAC405 SNAGCU
Level-1-260C-UNLIM
-40 to 85
L
HDC2010YPAT
ACTIVE
DSBGA
YPA
6
250
Green (RoHS
& no Sb/Br)
SAC405 SNAGCU
Level-1-260C-UNLIM
-40 to 85
L
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
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Addendum-Page 2
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