Datasheet Comparators Input Full Swing, Open Drain Output Low Supply Current CMOS Comparators BU7250G BU7250SG BU7253F BU7253SF General Description Key Specifications Operating Supply Voltage: Single Supply Split Supply Supply Current: BU7250G/BU7250SG BU7253F/BU7253SF Temperature Range: BU7250G/BU7253F BU7250SG/BU7253SF Input Offset Current: Input Bias Current: BU7250G/BU7253F are low supply current and open drain output comparators. BU7250SG/BU7253SF have an expanded operating temperature range. These features low operating supply voltage of +1.8V to +5.5V, Low supply current and extremely low input bias current. Features Low Operating Supply Voltage Low Supply Current High Speed Operation Input Full Swing Open Drain Output Type Wide Operating Temperature Range Packages +1.8V to +5.5V ±0.9V to ±2.75V 15µA 35µA -40°C to +85°C -40°C to +105°C 1pA (Typ) 1pA (Typ) jW(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm SSOP5 SOP8 Applications Battery Monitor Mobile Equipments Limit Comparator Consumer Electronics Pin Configuration BU7250G, BU7250SG: SSOP5 INVSS 5 1 VDD ‐ 2 + IN+ 3 4 OUT Pin No. Pin Name 1 IN- 2 VSS 3 IN+ 4 OUT 5 VDD Pin No. Pin Name 1 OUT1 BU7253F, BU7253SF: SOP8 OUT1 1 IN1- 2 IN1+ 3 8 VDD CH1 - + + 7 OUT2 CH2 + - VSS 4 6 IN25 IN2+ ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 2 IN1- 3 IN1+ 4 VSS 5 IN2+ 6 IN2- 7 OUT2 8 VDD ○This product has no designed protection against radioactive rays. 1/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Package SSOP5 SOP8 BU7250G BU7250SG BU7253F BU7253SF Ordering Information B U 7 2 5 x Part Number BU7250G BU7250SG BU7253F BU7253SF x x - Package G : SSOP5 F : SOP8 x x Packaging and Forming Specification TR: Embossed Tape and Reel (SSOP5) E2: Embossed tape and reel (SOP8) Line-up Topr -40°C to +85°C -40°C to +105°C Channels Package Orderable Part Number 1ch SSOP5 Reel of 3000 BU7250G-TR 2ch SOP8 Reel of 2500 BU7253F-E2 1ch SSOP5 Reel of 3000 BU7250SG-TR 2ch SOP8 Reel of 2500 BU7253SF-E2 Absolute Maximum Ratings (TA=25°C) Parameter Supply Voltage Power Dissipation Symbol Rating BU7250G BU7253F BU7250SG VDD-VSS SSOP5 PD SOP8 BU7253SF +7 0.54 (Note 1,3) - 0.55 Unit V 0.54 (Note 2,3) (Note 1,3) - 0.55 (Note 2,3) W Differential Input Voltage (Note 4) VID VDD - VSS V Input Common-mode Voltage Range VICM (VSS - 0.3) to (VDD + 0.3) V II ±10 mA Vopr +1.8 to +5.5 ±0.9 to ±2.75 V Input Current (Note 5) Operating Supply Voltage Operating Temperature Storage Temperature Maximum Junction Temperature Topr -40 to +85 -40 to +105 °C Tstg -55 to +125 °C TJmax +125 °C (Note 1) (Note 2) (Note 3) (Note 4) To use at temperature above TA=25C reduce 5.4mW/C. To use at temperature above TA=25C reduce 5.5mW/C. Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 5) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Electrical Characteristics ○BU7250G, BU7250SG（Unless otherwise specified VDD=+3V, VSS=0V, TA=25°C） Limit Temperature Parameter Symbol Range Min Typ Max Unit Conditions Input Offset Voltage (Note 6) VIO 25°C - 1 11 mV - Input Offset Current (Note 6) IIO 25°C - 1 - pA - Input Bias Current (Note 6) IB 25°C - 1 - pA - Supply Current (Note 7) IDD Maximum Output Voltage(High) 25°C - 15 35 Full range - - 50 VOH 25°C VDD-0.1 - Maximum Output Voltage(Low) VOL 25°C - Large Signal Voltage Gain AV 25°C VICM Common-mode Rejection Ratio Power Supply Rejection Ratio μA RL=∞ - V RL=10kΩ, VRL=3V - VSS+0.1 V RL=10kΩ - 90 - dB RL=10kΩ 25°C 0 - 3 V VSS to VDD CMRR 25°C - 80 - dB - PSRR 25°C - 80 - dB - ISINK 25°C 3 6 - mA tF 25°C - 20 - ns Propagation Delay Time (L to H) tPLH 25°C - 0.75 - µs Propagation Delay Time (H to L) tPHL 25°C - 0.25 - µs Input Common-mode Voltage Range Output Sink Current (Note 8) Output Fall Time OUT=VSS+0.4V RL=10kΩ, VRL=3V CL=15pF, IN-=1.5V 100mV Overdrive RL=10kΩ, VRL=3V CL=15pF, IN-=1.5V 100mV Overdrive RL=10kΩ, VRL=3V CL=15pF, IN-=1.5V 100mV Overdrive (Note 6) Absolute value (Note 7) Full range: BU7250G: TA=-40°C to +85°C BU7250SG: TA=-40°C to +105°C (Note 8) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Electrical Characteristics - continued ○BU7253F, BU7253SF（Unless otherwise specified VDD=+3V, VSS=0V, TA=25°C） Limit Temperature Parameter Symbol Range Min Typ Max Unit Conditions Input Offset Voltage (Note 9) VIO 25°C - 1 11.5 mV - Input Offset Current (Note 9) IIO 25°C - 1 - pA - Input Bias Current (Note 9) IB 25°C - 1 - pA - Supply Current (Note 10) IDD Maximum Output Voltage(High) 25°C - 35 65 Full range - - 130 VOH 25°C VDD-0.1 - Maximum Output Voltage(Low) VOL 25°C - Large Signal Voltage Gain AV 25°C VICM Common-mode Rejection Ratio Power Supply Rejection Ratio μA RL=∞ All Comparators - V RL=10kΩ, VRL=3V - VSS+0.1 V RL=10kΩ - 90 - dB RL=10kΩ 25°C 0 - 3 V VSS to VDD CMRR 25°C - 80 - dB - PSRR 25°C - 80 - dB - ISINK 25°C 3 6 - mA tF 25°C - 20 - ns Propagation Delay Time (L to H) tPLH 25°C - 0.75 - µs Propagation Delay Time (H to L) tPHL 25°C - 0.25 - µs Input Common-mode Voltage Range Output Sink Current (Note 11) Output Fall Time OUT=VSS+0.4V RL=10kΩ, VRL=3V CL=15pF, IN-=1.5V 100mV Overdrive RL=10kΩ, VRL=3V CL=15pF, IN-=1.5V 100mV Overdrive RL=10kΩ, VRL=3V CL=15pF, IN-=1.5V 100mV Overdrive (Note 9) Absolute value (Note 10) Full range: BU7253F: TA=-40°C to +85°C BU7253SF: TA=-40°C to +105°C (Note 11) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F BU7253SF Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute Maximum Ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical Characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (7) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) (10) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (11) Output Fall Time (tF) Indicates the time required for an output voltage step to change from 90% to 10% of its final value. (12) Propagation Delay Time (L to H) / Propagation Delay Time (H to L) (tPLH / tPHL) Indicates the time to reach 50% of the output voltage after the step voltage is applied at the input pin. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] ○BU7250G, BU7250SG BU7250G 0.4 BU7250SG 0.4 0.2 0.2 0.0 0.0 0 25 85 50 75 100 Ambient Temperature [°C] 0 125 Figure 1. Power Dissipation vs Ambient Temperature (Derating Curve) 25 105 50 75 100 Ambient Temperature [°C] 125 Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 35 35 105°C 30 30 25 Supply Current [μA] Supply Current [μA] 85°C 25°C 20 15 -40°C 10 25 5.5V 20 3.0V 15 1.8V 10 5 5 0 0 1 2 3 4 Supply Voltage [V] 5 6 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 4. Supply Current vs Ambient Temperature Figure 3. Supply Current vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7250G: -40C to +85C BU7250SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7250G, BU7250SG 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105°C 85°C 25°C 3 -40°C 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 5. Maximum Output Voltage (High) vs Supply Voltage (RL=10kΩ, VRL=3V) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 6. Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ, VRL=3V) 30 30 25 105°C 85°C Maximum Output Voltage (Low) [mV] Maximum Output Voltage (Low) [mV] 5.5V 5 25°C 20 15 -40°C 10 5 2 3 4 Output Voltage [V] 5 5.5V 20 15 3.0V 1.8V 10 5 0 -50 0 1 25 6 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 8. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10kΩ) Figure 7. Maximum Output Voltage (Low) vs Supply Voltage (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7250G: -40C to +85C BU7250SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7250G, BU7250SG 30 20 -40°C 16 Output Sink Current [mA] Output Sink Current [mA] 25 25°C 20 85°C 15 105°C 10 5.5V 12 3.0V 8 1.8V 4 5 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 7.5 7.5 5.0 5.0 Input Offset Voltage [mV] 10.0 Input Offset Voltage [mV] 10.0 2.5 105°C 0.0 25°C 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 10. Output Sink Current vs Ambient Temperature (OUT=VSS-0.4V) Figure 9. Output Sink Current vs Output Voltage (VDD=3 V) 85°C -25 -40°C -2.5 -5.0 -7.5 2.5 5.5V 0.0 1.8V 3.0V -2.5 -5.0 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 6 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 12. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) Figure 11. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7250G: -40C to +85C BU7250SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7250G, BU7250SG 160 10.0 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 105°C 2.5 85°C 0.0 25°C -40°C -2.5 -5.0 140 85°C 25°C 120 100 -40°C 105°C 80 -7.5 60 -10.0 -1 0 1 2 Supply Voltage [V] 3 1 4 3 4 Supply Voltage [V] 5 6 Figure 14. Large Signal Voltage Gain vs Supply Voltage Figure 13. Input Offset Voltage vs Supply Voltage (VDD=3V) 160 120 Common-mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 2 140 5.5V 120 3.0V 100 1.8V 80 100 25°C -40°C 80 60 85°C 105°C 40 20 0 60 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 1 125 Figure 15. Large Signal Voltage Gain vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 16. Common-mode Rejection Ratio vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7250G: -40C to +85C BU7250SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued 120 120 100 100 Power Supply Rejection Ratio [dB] Common-mode Rejection Ratio [dB] ○BU7250G, BU7250SG 5.5V 3.0V 80 60 1.8V 40 20 80 60 40 20 0 -50 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 17. Common-mode Rejection Ratio vs Ambient Temperature 100 125 1.5 Propagation Delay Time(H to L) [µs] Propagation Delay Time(L to H) [µs] 0 25 50 75 Ambient Temperature [°C] Figure 18. Power Supply Rejection Ratio vs Ambient Temperature 2.5 2.0 1.5 1.8V 1.0 0.5 -25 5.5V 3.0V 1.2 0.9 0.6 1.8V 5.5V 0.3 3.0V 0.0 -50 0.0 -25 0 25 50 75 Ambient Temperature [°C] 100 125 -50 Figure 19. Propagation Delay Time (L to H) vs Ambient Temperature (RL=10kΩ, VRL=3V, CL=15pF IN-=1.5V, 100mV Overdrive) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 20. Propagation Delay Time (H to L) vs Ambient Temperature (RL=10kΩ, VRL=3V, CL=15pF IN-=1.5V, 100mV Overdrive) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7250G: -40C to +85C BU7250SG: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] ○BU7253F, BU7253SF BU7253F 0.4 0.2 BU7253SF 0.4 0.2 0.0 0 25 0.0 85 50 75 100 Ambient Temperature [°C] 125 0 Figure 21. Power Dissipation vs Ambient Temperature (Derating Curve) 25 50 75 100 Ambient Temperature [°C] 105 125 Figure 22. Power Dissipation vs Ambient Temperature (Derating Curve) 80 80 105°C 60 Supply Current [μA] Supply Current [μA] 60 85°C 25°C 40 -40°C 20 5.5V 40 3.0V 1.8V 20 0 0 1 2 3 4 Supply Voltage [V] 5 6 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 24. Supply Current vs Ambient Temperature Figure 23. Supply Current vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7253F: -40C to +85C BU7253SF: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7253F, BU7253SF 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105°C 85°C 25°C 3 -40°C 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 6 -50 Figure 25. Maximum Output Voltage (High) vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 26. Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) 30 30 25 105°C 85°C Maximum Output Voltage (Low) [mV] Maximum Output Voltage (Low) [mV] 5.5V 5 25°C 20 15 -40°C 10 5 25 5.5V 20 15 3.0V 1.8V 10 0 -50 0 1 2 3 4 Supply Voltage [V] 5 5 6 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 28. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10kΩ) Figure 27. Maximum Output Voltage (Low) vs Supply Voltage (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7253F: -40C to +85C BU7253SF: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7253F, BU7253SF 30 30 -40°C 25 Output Sink Current [mA] Output Sink Current [mA] 25 25°C 20 85°C 15 105°C 10 20 15 5.5V 3.0V 10 1.8V 5 5 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 29. Output Sink Current vs Output Voltage (VDD=3 V) 7.5 5.0 5.0 Input Offset Voltage [mV] 7.5 Input Offset Voltage [mV] 10.0 2.5 105°C 0.0 25°C -2.5 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 30. Output Sink Current vs Ambient Temperature (OUT=VDD-0.4V) 10.0 85°C -25 -40°C -5.0 2.5 5.5V 0.0 1.8V 3.0V -2.5 -5.0 -7.5 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 -50 6 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 32. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) Figure 31. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7253F: -40C to +85C BU7253SF: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7253F, BU7253SF 10.0 160 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 105°C 2.5 85°C 0.0 25°C -40°C -2.5 -5.0 140 85°C 120 25°C 100 105°C -40°C 80 -7.5 60 -10.0 -1 0 1 2 Supply Voltage [V] 3 1 4 3 4 Supply Voltage [V] 5 6 Figure 34. Large Signal Voltage Gain vs Supply Voltage Figure 33. Input Offset Voltage vs Supply Voltage (VDD=3V) 120 Common-mode Rejection Ratio [dB] 160 Large Signal Voltage Gain [dB] 2 140 5.5V 120 3.0V 100 1.8V 80 100 85°C 105°C 80 60 -40°C 25°C 40 20 0 60 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 1 125 Figure 35. Large Signal Voltage Gain vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 36. Common-mode Rejection Ratio vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7253F: -40C to +85C BU7253SF: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Typical Performance Curves - continued ○BU7253F, BU7253SF 120 100 Power Supply Rejection Ratio [dB] Common-mode Rejection Ratio [dB] 120 3.0V 5.5V 80 60 1.8V 40 20 100 80 60 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 0 -50 125 Figure 37. Common-mode Rejection Ratio vs Ambient Temperature 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 38. Power Supply Rejection Ratio vs Ambient Temperature 1.5 Propagation Delay Time(H to L) [µs] 2.5 Propagation Delay Time(L to H) [µs] -25 2.0 1.5 5.5V 1.0 1.8V 0.5 3.0V 1.2 0.9 0.6 3.0V 1.8V 0.3 5.5V 0.0 -50 0.0 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 125 Figure 39. Propagation Delay Time (L to H) vs Ambient Temperature (RL=10kΩ, VRL=3V, CL=15pF IN-=1.5V, 100mV Overdrive) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 40. Propagation Delay Time (H to L) vs Ambient Temperature (RL=10kΩ, VRL=3V, CL=15pF IN-=1.5V, 100mV Overdrive) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7253F: -40C to +85C BU7253SF: -40C to +105C www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Application Information NULL Method Conditions for Test Circuit 1 VDD, VSS, EK, VICM Unit: V Parameter Input Offset Voltage VF SW1 SW2 SW3 VDD VSS EK VICM Calculation VF1 ON ON OFF 3 0 -0.1 3 1 ON ON ON 3 0 0.3 2 ON ON OFF 3 0 -0.1 ON ON OFF 0 -0.1 VF2 Large Signal Voltage Gain VF3 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF5 VF6 Power Supply Rejection Ratio VF7 1.8 5.5 - Calculation 1. Input Offset Voltage (VIO) VIO = 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR = 20Log 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log VDD × (1+ RF/RS) |VF7 - VF6| |VF1| 1 + RF/RS -0.3 -2.7 0 3 3 0.3 4 [V] EK × (1+RF/RS) |VF3 - VF2| [dB] VICM × (1+RF/RS) |VF5 - VF4| [dB] [dB] 0.47μF RF=50kΩ SW1 RS=50Ω 500kΩ VDD 15V EK RI=1MΩ 0.01μF Vo 500kΩ 0.1μF 0.1μF DUT SW3 RS=50Ω RI=1MΩ NULL RL VICM 50kΩ SW2 VRL VSS V VF -15V Figure 41. Test Circuit 1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Application Information - continued Switch Conditions for Test Circuit 2 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 Supply Current OFF ON ON OFF OFF OFF OFF OFF Maximum Output Voltage (RL=10kΩ) OFF ON ON ON OFF OFF ON OFF Output Current OFF OFF OFF OFF OFF ON OFF OFF Response Time ON OFF ON OFF ON OFF OFF ON SW No. VDD + SW1 SW2 SW4 SW3 SW5 SW6 SW7 SW8 VIN VSS RL CL IN+ IN- VRL OUT Figure 42. Test Circuit 2 Input Voltage Input Voltage 1.6V 1.6V 1.5V 1.5V 100mV Overdrive Vre 100mV Overdrive 1.4V 1.4V t t Input Wave Input Wave Output Voltage (L-H) Output Voltage (H-L) tPLH tF 3V 3V 50% 1.5V 90% 50% 1.5V 10% 10% 0V 0V Output Wave t tPHL Output Wave t Figure 43. Response Time Input and Output Wave www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 44(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax-TA) / PD °C/W The Derating curve in Figure 44(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 44(c) to (f) shows the derating curve for BU7250G, BU7250SG, BU7253F and BU7253SF. Power dissipation of LSI [W] PDmax θJA=(TJmax-TA)/PD C/W Power dissipation of IC P2 Ambient temperature TA[ C ] θJA2 <θJA1 P1 θJA2 TJmax θJA1 0 Chip surface temperature TJ [C] 25 75 100 125 (b) Derating curve (a) Thermal resistance 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] 50 Ambient temperature TA[C] BU7250G (Note 12) 0.4 0.2 BU7250SG (Note 12) 0.4 0.2 0.0 0.0 0 85 25 50 75 100 Ambient Temperature [°C] (c) BU7250G www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 105 0 125 25 50 75 100 Ambient Temperature [°C] 125 (d) BU7250SG 18/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250SG BU7253F Datasheet BU7253SF 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] BU7250G BU7253F (Note 13) 0.4 0.2 BU7253SF (Note 13) 0.4 0.2 0.0 0.0 0 85 25 50 75 100 Ambient Temperature [°C] 0 125 (e) BU7253F 105 25 50 75 100 Ambient Temperature [°C] 125 (f) BU7253SF Figure 44. Thermal Resistance and Derating Curve (Note 12) (Note 13) Unit 5.4 5.5 mW/°C When using the unit above TA =25°C, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Operational Notes – continued 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Unused Circuits When there are unused comparators, it is recommended that they are connected as in Figure 45, setting the non-inverting input terminal to a potential within the in-phase input voltage range (VICM). 14. Input Voltage Applying VDD +0.3V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. VDD VSS Figure 45. Example of Application Circuit for Unused Comparator 15. Power Supply(single/dual) The voltage comparator operates when the voltage supplied is between VDD and VSS. Therefore, the single supply voltage comparator can be used as dual supply voltage comparator as well. 16. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1µF between output pin and VSS pin. 17. Oscillation by Output Capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 18. Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. 19. Open Drain Output Please connect and use a pull-up resistor to the output since this IC has an open-drain output. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Physical Dimensions, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 22/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Physical Dimensions, Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 23/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 BU7250G BU7250SG BU7253F Datasheet BU7253SF Marking Diagram SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number Product Name BU7250 BU7250S BU7253 BU7253S Package Type G SSOP5 F SOP8 Marking Ｈ3 Ｈ4 7253 7253S Land Pattern Data All dimensions in mm Land pitch e Land space MIE Land length ≧ℓ 2 SSOP5 0.95 2.4 1.0 0.6 SOP8 1.27 4.60 1.10 0.76 Package SSOP5 e Land width b2 SOP8 e ℓ 2 e MIE MIE ? b2 b2 ℓ 2 Revision History Date Revision 4.Dec.2013 001 Changes New Release www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/24 TSZ02201-0RFR1G200450-1-2 4.Dec.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001