Rohm BD49E23G Standard cmos voltage detector ic Datasheet

Datasheet
Voltage Detector IC Series
Standard CMOS
Voltage Detector IC
BD48Exxx-M series BD49Exxx-M series (for Automotive Accessories)
●Key Specifications
Detection voltage:
●General Description
ROHM’s BD48Exxx-M and BD49Exxx-M series are
highly accurate, low current consumption Voltage
Detector IC series. The line up includes BD48xxx
devices with N-channel open drain output and BD49xxx
devices with CMOS output. The devices are available for
specific detection voltages ranging from 2.3V to 6.0V in
increments of 0.1V.
2.3V to 6.0V (Typ.),
0.1V steps
High accuracy detection voltage:
±1.0%
Ultra-low current consumption:
0.9µA (Typ.)
Operating temperature range:
●Package
SSOP5:
●Features
High accuracy detection
Ultra-low current consumption
Two output types (N-ch open drain and CMOS
output)
Wide Operating temperature range
Very small and low height package
Package SSOP5 is similar to SOT-23-5(JEDEC)
-40°C to +105°C
2.90mm x 2.80mm x 1.25mm
●Applications
Circuits using microcontrollers or logic circuits that
require a reset.
●Typical Application Circuit
VDD1
VDD2
VDD1
RL
RST
BD48Exxx-M
BD49Exxx-M
Micro
Controller
RST
CL
CL
( Capacitor for
noise filtering )
( Capacitor for
noise filtering)
GND
(Open Drain Output type)
BD48Exxx-M series
Micro
Controller
GND
(CMOS Output type)
BD49Exxx-M series
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Connection Diagram
N.C.
SSOP5
N.C.
Marking
Lot. No
VOUT VDD GND
TOP VIEW
●Pin Descriptions
SSOP5
PIN No.
Symbol
Function
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
3
GND
GND
4
N.C.
Unconnected Terminal
5
N.C.
Unconnected Terminal
Ordering Information
B
D
x
Part
Number
x
E
x
Output Type
48 : Open Drain
49 : CMOS
x
x
-
M
Reset Voltage Value Package
23 : 2.3V
G : SSOP5
0.1V step
60 : 6.0V
T
R
Automotive Accessories Packaging and
forming specification
TR : Embossed tape
and reel
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6 °
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
0.05±0.05
1.1±0.05
1.25Max.
)
+0.05
0.42 −0.04
0.95
0.1
Direction of feed
Reel
(Unit : mm)
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∗ Order quantity needs to be multiple of the minimum quantity.
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Lineup
Output Type
Open Drain
Detection Voltage Marking
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
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TSZ22111・15・001
Cm
Ck
Ch
Cg
Cf
Ce
Cd
Cc
Cb
Ca
By
Br
Bp
Bn
Bm
Bk
Bh
Bg
Bf
Be
Bd
Bc
Bb
Ba
Ay
Ar
Ap
An
Am
Ak
Ah
Ag
Af
Ae
Ad
Ac
Ab
Aa
CMOS
Part Number
Marking
Part Number
BD48E60
BD48E59
BD48E58
BD48E57
BD48E56
BD48E55
BD48E54
BD48E53
BD48E52
BD48E51
BD48E50
BD48E49
BD48E48
BD48E47
BD48E46
BD48E45
BD48E44
BD48E43
BD48E42
BD48E41
BD48E40
BD48E39
BD48E38
BD48E37
BD48E36
BD48E35
BD48E34
BD48E33
BD48E32
BD48E31
BD48E30
BD48E29
BD48E28
BD48E27
BD48E26
BD48E25
BD48E24
BD48E23
Ff
Fe
Fd
Fc
Fb
Fa
Ey
Er
Ep
En
Em
Ek
Eh
Eg
Ef
Ee
Ed
Ec
Eb
Ea
Dy
Dr
Dp
Dn
Dm
Dk
Dh
Dg
Df
De
Dd
Dc
Db
Da
Cy
Cr
Cp
Cn
BD49E60
BD49E59
BD49E58
BD49E57
BD49E56
BD49E55
BD49E54
BD49E53
BD49E52
BD49E51
BD49E50
BD49E49
BD49E48
BD49E47
BD49E46
BD49E45
BD49E44
BD49E43
BD49E42
BD49E41
BD49E40
BD49E39
BD49E38
BD49E37
BD49E36
BD49E35
BD49E34
BD49E33
BD49E32
BD49E31
BD49E30
BD49E29
BD49E28
BD49E27
BD49E26
BD49E25
BD49E24
BD49E23
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Absolute Maximum Ratings
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
Output Current
*1*2
Power Dissipation SSOP5
Operating Temperature
Ambient Storage Temperature
Symbol
VDD-GND
VOUT
Io
Pd
Topr
Tstg
Limits
-0.3 to +10
GND-0.3 to +10
GND-0.3 to VDD+0.3
70
540
-40 to +105
-55 to +125
Unit
V
V
mA
mW
°C
°C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to 105°C)
Parameter
Symbol
Condition
RL=470kΩ, VDD=H L
Ta=+25°C
VDET=2.5V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
VDET=3.0V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Detection Voltage
VDET
Ta=+25°C
VDET=3.3V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
VDET=4.2V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
VDET=4.8V
Ta=-40°C to 85°C
Ta=85°C to 105°C
CL=100pF RL=100kΩ
Output Delay Time “L H”
tPLH
Vout=GND 50%
VDET=2.3-3.1V
VDET=3.2-4.2V
*1
Circuit Current when ON
ICC1
VDD=VDET-0.2V
VDET=4.3-5.2V
VDET=5.3-6.0V
VDET=2.3-3.1V
VDET=3.2-4.2V
*1
Circuit Current when OFF
ICC2
VDD=VDET+2.0V
VDET=4.3-5.2V
VDET=5.3-6.0V
VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(VDET typ.-0.5V) (VDET typ.+0.5V)
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*1
Min.
VDET(T)
×0.99
2.475
2.418
2.404
2.970
2.901
2.885
3.267
3.191
3.173
4.158
4.061
4.039
4.752
4.641
4.616
Limit
Typ.
2.5
3.0
3.3
4.2
4.8
-
Max.
VDET(T)
×1.01
2.525
2.584
2.597
3.030
3.100
3.117
3.333
3.410
3.428
4.242
4.341
4.364
4.848
4.961
4.987
-
-
100
0.95
1.20
0.51
0.56
0.60
0.66
0.75
0.80
0.85
0.90
-
1.53
1.68
1.80
1.98
2.25
2.40
2.55
2.70
-
VDET(T)
Unit
V
*2
µs
µA
µA
V
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to 105°C) - continued
Parameter
Symbol
‘Low’Output Voltage (Nch)
VOL
‘High’Output Voltage (Pch)
(BD49Exxx-M Series)
VOH
VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V)
VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V)
VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V)
Leak Current when OFF
Ileak
VDD=VDS=10V
(BD48Exxx-M Series)
Detection Voltage
Ta=-40°C to 105°C
VDET/∆T
Temperature coefficient
(Designed Guarantee)
Hysteresis Voltage
∆VDET VDD=L H L, RL=470kΩ
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
Rl: Pull-up resistor to be connected between Vout and power supply.
Cl: Capacitor to be connected between Vout and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
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TSZ22111・15・001
Limit
Condition
5/14
*1
Unit
Min.
VDD-0.5
VDD-0.5
VDD-0.5
Typ.
-
Max.
0.5
0.5
-
-
-
0.1
µA
-
±100
±360
ppm/°C
VDET×0.03 VDET×0.05 VDET×0.08
V
V
V
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Block Diagrams
VDD
VOUT
Vref
GND
Fig.1 BD48Exxx-M series
VDD
VOUT
Vref
GND
Fig.2 BD49Exxx-M series
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Typical Performance Curves
"LOW" OUTPUT CURRENT : IOL [mA]
2.0
CIRCUIT CURRENT : IDD[µA]
【
BD48E42G-M】
【BD4842G/FVE
】
【BD49E42G-M】
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
7
8
9
10
20
BD4842G/FVE
【
】】
【BD48E42G-M
【BD49E42G-M】
15
10
VDD =2.4V
5
VDD =1.2V
0
0.0
1.0
1.5
2.0
2.5
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD[V]
Fig.3 Circuit Current
Fig.4 “Low” Output Current
45
9
BD4942G/FVE
【BD49E42G-M
【
】】
40
OUTPUT VOLTAGE: VOUT [V]
"HIGH" OUTPUT CURRENT : IOH[mA]
0.5
35
30
25
20
VDD=8.0V
15
VDD=6.0V
10
5
VDD=4.8V
0
8
BD4842G/FVE】
【
【BD48E42G-M
】
7
【BD49E42G-M】
6
5
4
3
1
0
0
1
2
3
4
5
6
Ta=25℃
2
Ta=25℃
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD [V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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Datasheet
BD48Exxx-M series BD49Exxx-M series
1.0
【BD49E42G-M】
0.8
BD4842G/FVE
【【BD48E42G-M
BD48x42x 】】
】
5.4
【BD48E42G-M
【 BD48x42x】
】】
【BD4842G/FVE
DETECTION VOLTAGE: VDET[V]
OUTPUT VOLTAGE
: VOUT [V]
●Typical Performance Curves – continued
0.6
0.4
0.2
【BD49E42G-M】
5.0
Low to High(VDET+∆VDET)
4.6
4.2
3.8
High to Low(VDET)
3.4
0.0
0
0.5
1
1.5
2
3.0
2.5
~
~
-40
CIRCUIT CURRENT WHEN OFF : I DD2[μA]
CIRCUIT CURRENT WHEN ON : IDD1[μA]
1.5
BD4842G/FVE
BD48x42x 】 】
】
【【BD48E42G-M
【BD49E42G-M】
1.0
0.5
0
20
40
60
40
80
Ta[℃]
Fig.8 Detection Voltage
Release Voltage
Fig.7 Operating Limit Voltage
0.0
-40 -20
0
TEMPERATURE :
SUPPLY VOLTAGE: [V]
80 100
1.5
BD48x42x 】】】
【BD4842G/FVE
【BD48E42G-M
【
【BD49E42G-M】
1.0
0.5
0.0
-40 -20
0
20
40
60
80 100
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
Fig.9 Circuit Current when ON
Fig.10 Circuit Current when OFF
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Typical Performance Curves – continued
MINIMUM OPERATION VOLTAGE : VOPL[V]
1.5
BD4842G/FVE
【
【 BD48x42x 】 】
【BD48E42G-M】
【BD49E42G-M】
1.0
0.5
0.0
-40 -20
0
20
40
60
80
100
TEMPERATURE : Ta[℃]
Fig.11 Operating Limit Voltage
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Application Information
Explanation of Operation
For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical
Characteristics for information on hysteresis. Because the BD48Exxx-M series uses an open drain output type, it is
necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this
case becomes VDD or the voltage of the other power supply].
VDD
VDD
R1
R1
RL
Vref
Vref
Q2
VOUT
VOUT
R2
R2
Q1
Q1
R3
R3
GND
GND
Fig.12 (BD48Exxx-M series Internal Block Diagram)
Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
Part Number
tPLH (µs)
BD48E45G-M
BD49E45G-M
Fig.13 (BD49Exxx-M series Internal Block Diagram)
tPHL (µs)
39.5
32.4
87.8
52.4
VDD=4.3V 5.1V
VDD=5.1V 4.3V
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveform
Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the
input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig.12 and 13).
1
VDD
VDET+ΔVDET
VDET
⑤
VOPL
0V
VOUT
VOH
tPHL
tPLH
tPLH
tPHL
VOL
①
②
③
④
Fig.14 Timing Waveform
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TSZ22111・15・001
When the power supply is turned on, the output is unstable
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not valid when the
rise time of VDD is faster than tPHL.
2 When V
DD is greater than VOPL, but less than the reset release
voltage (VDET + ∆VDET), the output voltages will switch to Low.
3 If V
DD exceeds the reset release voltage (VDET + ∆VDET), then,
VOUT switches from L to H.
4 If V
DD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply
fluctuation, VOUT switches to L (with a delay of tPHL).
5 The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET).
The system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
the
malfunctions due to noise.
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Circuit Applications
1) Examples of a common power supply detection reset circuit.
VDD2
VDD1
RL
BD48Exxx-M
RST
Micro
Controller
Application examples of BD48Exxx-M series (Open
Drain output type) and BD49Exxx-M series (CMOS
output type) are shown on the left.
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD48xxx-M) device with
a load resistance RL attached as shown in figure 15.
CL
( Capacitor is for
noise filtering )
GND
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BD49xxx-M) device or an
open drain device with a pull up resistor between output
and VDD1.
Fig.15 Open Drain Output Type
VDD1
Micro
RST Controller
BD49Exxx-M
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (VOUT).
CL
( Capacitor is for
filtering)
The Electrical characteristics were measured using
RL= 470kΩ and CL = 100pF.
GND
Fig.16 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BD48Exxx-M
BD48Exxx-M
Microcontroller
RST
GND
Fig.17
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD48Exxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the
microcontroller (VDD3) as shown in Fig. 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is
possible.
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Datasheet
BD48Exxx-M series BD49Exxx-M series
3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into
the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that
flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause
malfunction in the systems operation such as output oscillations, etc.
V1
R2
I1
VDD
BD48Exxx-M
BD49Exxx-M
R1
CIN
VOUT
CL
GND
Fig.18
When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
IDD
Through Current
0
VDD
VDET
Fig.19 Current Consumption vs. Power Supply Voltage
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
Lower than the mininum input voltage puts
condition.
the VOUT in high impedance state, and it must be VDD in pull up (VDD)
10) External parameters
The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.
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Datasheet
BD48Exxx-M series BD49Exxx-M series
●Revision History
Date
Revision
Changes
30.Mar.2012
001
14.Dec.2012
002
22.May.2013
003
New Release
Updated General Description, Features, Applications, Absolute maximum ratings, Explanation
of Operation, Timing Waveform, Circuit Applications, and Operational Notes.
Changed Lineup table format.
Add Io in Absolute Maximum Rating table
Add limits for VDET specifically at VDET=2.5V,3.0V,3.3V,4.2V,4.8V
Change parameter in electrical characteristics from IOL to VOL and IOH to VOH
Add circuits application numbers 2 and 3
Added Revision History.
Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V
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Datasheet
Notice
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Other Precaution
1.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
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