Material Content Data Sheet Sales Product Name BSZ0908ND Issued MA# MA000987418 Package PG-WISON-8-1 Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% tin gold silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver 7440-31-5 7440-57-5 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 23.08 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.011 0.05 456 0.041 0.18 1770 0.214 0.93 0.003 0.01 0.012 0.05 499 0.230 1.00 9980 9.354 40.52 41.58 405246 415850 0.274 1.19 1.19 11877 11877 0.025 0.11 1.16 9258 2. 3. 1084 1.288 5.58 11.195 48.49 54.18 484993 55815 541892 0.360 1.56 1.56 15603 15603 0.076 0.33 0.33 3294 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 11484 125 Important Remarks: 1. Sum [ppm] 3294 1000000