CSD17483F4 www.ti.com SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 30 V, N-Channel FemtoFET™ MOSFET Check for Samples: CSD17483F4 PRODUCT SUMMARY FEATURES 1 • • • • 2 • • • • Low On Resistance Low Qg and Qgd Low Threshold Voltage Ultra-Small Footprint (0402 Case Size) – 1.0 mm x 0.6 mm Ultra-Low Profile – 0.35 mm Height Integrated ESD Protection Diode – Rated > 4 kV HBM – Rated > 2 kV CDM Pb and Halogen Free RoHS Compliant VDS Drain-to-Source Voltage Qg Gate Charge Total (4.5 V) Qgd Gate Charge Gate to Drain RDS(on) VGS(th) • • V pC 130 Drain-to-Source On Resistance pC VGS = 1.8 V 370 VGS = 2.5 V 240 VGS = 4.5 V 200 Threshold Voltage mΩ 0.85 V Text Added For Spacing ORDERING INFORMATION Device Qty Media CSD17483F4 3000 7-Inch Reel CSD17483F4T 250 7-Inch Reel APPLICATIONS • • 30 1010 Optimized for Load Switch Applications Optimized for General Purpose Switching Applications Single-Cell Battery Applications Handheld and Mobile Applications DESCRIPTION The FemtoFET™ MOSFET technology has been designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size. . Package Ship Femto(0402) 1.0 mm x 0.6 mm SMD Lead Less Tape and Reel Text Added For Spacing ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise stated VALUE UNIT VDS Drain-to-Source Voltage 30 V VGS Gate-to-Source Voltage 12 V ID Continuous Drain Current, TA = 25°C(1) 1.5 A IDM Pulsed Drain Current, TA = 25°C(2) PD Power Dissipation(1) 5 A 500 mW 4 kV 2 kV –55 to 150 °C 2.7 mJ Human Body Model (HBM) ESD Rating Charged Device Model (CDM) TJ, TSTG Operating Junction and Storage Temperature Range EAS Avalanche Energy, single pulse ID = 7.4 A, L = 0.1 mH, RG = 25 Ω (1) Typical RθJA = 90°C/W on 1-inch2 (6.45-cm2), 2-oz. (0.071mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB. (2) Pulse duration ≤300 μs, duty cycle ≤2% Typical Part Dimensions Top View m D 60 1. 0. 00 m m 5m 0.3 m m G S . . 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FemtoFET is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated CSD17483F4 SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain-to-Source Voltage VGS = 0 V, IDS = 250 μA IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = 24 V IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = 10 V VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, IDS = 250 μA RDS(on) gfs Drain-to-Source On Resistance Transconductance 30 0.65 V 1 μA 100 nA 0.85 1.10 V VGS = 1.8 V, IDS =0.5 A 370 550 mΩ VGS = 2.5 V, IDS =0.5 A 240 310 mΩ VGS = 4.5 V, IDS = 0.5 A 200 260 mΩ VGS = 8 V, IDS =0.5 A 185 240 mΩ VDS = 15 V, IDS = 0.5 A 2.4 S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance RG Series Gate Resistance Qg Gate Charge Total (4.5 V) Qgd Gate Charge Gate to Drain Qgs Gate Charge Gate to Source Qg(th) Gate Charge at Vth Qoss Output Charge td(on) tr td(off) Turn Off Delay Time tf Fall Time 145 190 pF 42 55 pF 2 3 pF 1300 pC VGS = 0 V, VDS = 15 V, f = 1 MHz Ω 23 1010 130 pC 220 pC 145 pC 1095 pC Turn On Delay Time 3.3 ns Rise Time 1.3 ns 10.6 ns 3.4 ns VDS = 15 V, IDS = 0.5 A VDS = 15 V, VGS = 0 V VDS = 0 V, VGS = 4.5 V, IDS = 0.5 A,RG = 2 Ω Diode Characteristics VSD Diode Forward Voltage Qrr Reverse Recovery Charge trr Reverse Recovery Time ISD = 0.5 A, VGS = 0 V VDS= 15 V, IF = 0.5 A, di/dt = 300 A/μs 0.73 0.9 V 1475 pC 5.5 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER RθJA (1) (2) 2 Thermal Resistance Junction to Ambient Typical Values (1) Thermal Resistance Junction to Ambient (2) 2 UNIT 90 °C/W 250 °C/W 2 Device mounted on FR4 material with 1-inch (6.45-cm ), 2-oz. (0.071-mm thick) Cu. Device mounted on FR4 material with minimum Cu mounting area. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: CSD17483F4 CSD17483F4 www.ti.com SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 TYPICAL MOSFET CHARACTERISTICS (TA = 25°C unless otherwise stated) Figure 1. Transient Thermal Impedance TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 2.2 3.2 IDS - Drain-to-Source Current (A) IDS - Drain-to-Source Current (A) 3.6 2.8 2.4 2 1.6 1.2 0.8 VGS =8V VGS =4.5V 0.4 0 0 0.1 VGS =2.5V VGS =1.8V 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VDS - Drain-to-Source Voltage (V) 0.9 1 VDS = 5V 2 1.8 1.6 1.4 1.2 1 0.8 0.6 TC = 125°C TC = 25°C TC = −55°C 0.4 0.2 0 0 G001 Figure 2. Saturation Characteristics 0.4 0.8 1.2 1.6 VGS - Gate-to-Source Voltage (V) 2 Product Folder Links: CSD17483F4 G001 Figure 3. Transfer Characteristics Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated 2.4 3 CSD17483F4 SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 www.ti.com TYPICAL MOSFET CHARACTERISTICS (continued) (TA = 25°C unless otherwise stated) TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 1000 Ciss = Cgd + Cgs Coss = Cds + Cgd Crss = Cgd ID = 0.5A VDS =15V 9 8 C − Capacitance (pF) VGS - Gate-to-Source Voltage (V) 10 7 6 5 4 3 100 10 2 1 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Qg - Gate Charge (nC) 1.8 2 1 2.2 0 3 6 G001 Figure 4. Gate Charge TEXT ADDED FOR SPACING G001 TEXT ADDED FOR SPACING RDS(on) - On-State Resistance (mΩ) VGS(th) - Threshold Voltage (V) 30 400 ID = 250uA 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 −75 −25 25 75 125 TC - Case Temperature (ºC) TC = 25°C Id = 0.5A TC = 125ºC Id = 0.5A 360 320 280 240 200 160 120 80 175 0 2 G001 Figure 6. Threshold Voltage vs. Temperature TEXT ADDED FOR SPACING G001 TEXT ADDED FOR SPACING ID =0.5A 1.3 1.2 1.1 1 0.9 0.8 0.7 −75 12 10 VGS = 1.8V VGS = 8V ISD − Source-to-Drain Current (A) 1.4 4 6 8 10 VGS - Gate-to- Source Voltage (V) Figure 7. On-State Resistance vs. Gate-to-Source Voltage 1.5 Normalized On-State Resistance 27 Figure 5. Capacitance 1.2 −25 25 75 125 TC - Case Temperature (ºC) 175 TC = 25°C TC = 125°C 1 0.1 0.01 0.001 0.0001 0 0.2 0.4 0.6 0.8 VSD − Source-to-Drain Voltage (V) G001 Figure 8. Normalized On-State Resistance vs. Temperature 4 9 12 15 18 21 24 VDS - Drain-to-Source Voltage (V) 1 G001 Figure 9. Typical Diode Forward Voltage Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: CSD17483F4 CSD17483F4 www.ti.com SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 TYPICAL MOSFET CHARACTERISTICS (continued) (TA = 25°C unless otherwise stated) TEXT ADDED FOR SPACING TEXT ADDED FOR SPACING 100 1ms 10ms 100ms 1s DC 10 1 0.1 Single Pulse Typical RthetaJA =250ºC/W(min Cu) 0.01 0.01 TC = 25ºC TC = 125ºC IAV - Peak Avalanche Current (A) IDS - Drain-to-Source Current (A) 100 0.1 1 10 VDS - Drain-to-Source Voltage (V) 10 1 0.1 0.001 50 0.01 0.1 TAV - Time in Avalanche (mS) G001 Figure 10. Maximum Safe Operating Area 1 G001 Figure 11. Single Pulse Unclamped Inductive Switching TEXT ADDED FOR SPACING IDS - Drain- to- Source Current (A) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Typical RthetaJA =90ºC/W(max Cu) 0.0 −50 −25 0 25 50 75 100 125 TA - AmbientTemperature (ºC) 150 175 G001 Figure 12. Maximum Drain Current vs. Temperature Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: CSD17483F4 5 CSD17483F4 SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 www.ti.com MECHANICAL DATA 0402 Mechanical Dimensions (1) All linear dimensions are in millimeters (dimensions and tolerancing per AME T14.5M-1994). (2) This drawing is subject to change without notice. (3) This package is a PB-free solder land design. Recommended Minimum PCB Layout (1) 6 All dimensions are in millimeters. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: CSD17483F4 CSD17483F4 www.ti.com SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 Recommended Stencil Pattern (1) All dimensions are in millimeters. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: CSD17483F4 7 CSD17483F4 SLPS447A – JULY 2013 – REVISED NOVEMBER 2013 www.ti.com CSD17483F4 Embossed Carrier Tape Dimensions (1) Pin 1 is oriented in the top-right quadrant of the tape enclosure (quadrant 2), closest to the carrier tape sprocket holes. REVISION HISTORY Changes from Original (July 2013) to Revision A Page • Updated title .......................................................................................................................................................................... 1 • Removed jumbo reel info and included small reel info ......................................................................................................... 1 8 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: CSD17483F4 PACKAGE OPTION ADDENDUM www.ti.com 15-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CSD17483F4 ACTIVE PICOSTAR YJC 3 3000 Green (RoHS & no Sb/Br) Call TI Level-1-250C-UNLIM -55 to 150 CSD17483F4R PREVIEW PICOSTAR YJC 3 18000 TBD Call TI Call TI -55 to 150 DP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Nov-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: CSD17483F4