Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 ADS54J20 Dual-Channel, 12-Bit, 1.0-GSPS, Analog-to-Digital Converter 1 Features 3 Description • • • The ADS54J20 is a low-power, wide-bandwidth, 12bit, 1.0-GSPS, dual-channel, analog-to-digital converter (ADC). Designed for high signal-to-noise ratio (SNR), the device delivers a noise floor of –157 dBFS/Hz for applications aiming for highest dynamic range over a wide instantaneous bandwidth. The device supports the JESD204B serial interface with data rates up to 10 Gbps, supporting two or four lanes per ADC. The buffered analog input provides uniform input impedance across a wide frequency range and minimizes sample-and-hold glitch energy. Optionally, each ADC channel can be connected to a wideband digital down-converter (DDC) block. The ADS54J20 provides excellent spurious-free dynamic range (SFDR) over a large input frequency range with very low power consumption. 1 • • • • • • • • • 12-Bit Resolution, Dual-Channel, 1-GSPS ADC Noise Floor: –157 dBFS/Hz Spectral Performance (fIN = 170 MHz at –1 dBFS): – SNR: 67.8 dBFS – NSD: –155 dBFS/Hz – SFDR: 86 dBc (Including Interleaving Tones) – SFDR: 89 dBc (Except HD2, HD3, and Interleaving Tones) Spectral Performance (fIN = 350 MHz at –1 dBFS): – SNR: 65.6 dBFS – NSD: –152.6 dBFS/Hz – SFDR: 75 dBc – SFDR: 85 dBc (Except HD2, HD3, and Interleaving Tones) Channel Isolation: 100 dBc at fIN = 170 MHz Input Full-Scale: 1.9 VPP Input Bandwidth (3 dB): 1.2 GHz On-Chip Dither Integrated Wideband DDC Block JESD204B Interface with Subclass 1 Support: – 2 Lanes per ADC at 10.0 Gbps – 4 Lanes per ADC at 5.0 Gbps – Support for Multi-Chip Synchronization Power Dissipation: 1.35 W/Ch at 1 GSPS Package: 72-Pin VQFNP (10 mm × 10 mm) The JESD204B interface reduces the number of interface lines, allowing high system integration density. An internal phase-locked loop (PLL) multiplies the ADC sampling clock to derive the bit clock that is used to serialize the 12-bit data from each channel. Device Information PART NUMBER ADS54J20 FFT for 170-MHz Input Signal 0 SNR = 67.8 dBFS SFDR = 86 dBc Non HD2,HD3 Spur = 89 dBc -20 Amplitude (dBFS) Radar and Antenna Arrays Broadband Wireless Cable CMTS, DOCSIS 3.1 Receivers Communications Test Equipment Microwave Receivers Software Defined Radios (SDRs) Digitizers Medical Imaging and Diagnostics BODY SIZE (NOM) 10.00 mm × 10.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • • • • • • • PACKAGE VQFNP (72) -40 -60 -80 -100 -120 0 100 200 300 Input Frequency (MHz) 400 500 D000 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 8 1 1 1 2 3 3 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 6 Electrical Characteristics........................................... 7 AC Characteristics .................................................... 8 Digital Characteristics ............................................. 11 Timing Characteristics............................................. 12 Typical Characteristics ............................................ 14 Typical Characteristics: Contour ........................... 23 Detailed Description ............................................ 24 8.1 Overview ................................................................. 24 8.2 8.3 8.4 8.5 9 Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Register Maps ......................................................... 24 25 32 43 Application and Implementation ........................ 66 9.1 Application Information............................................ 66 9.2 Typical Application .................................................. 71 10 Power Supply Recommendations ..................... 73 11 Layout................................................................... 73 11.1 Layout Guidelines ................................................. 73 11.2 Layout Example .................................................... 74 12 Device and Documentation Support ................. 75 12.1 12.2 12.3 12.4 12.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 75 75 75 75 75 13 Mechanical, Packaging, and Orderable Information ........................................................... 75 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (May 2016) to Revision A • 2 Page Released to production .......................................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 5 Device Comparison Table DEVICE SPEED GRADE (MSPS) RESOLUTION (Bits) CHANNEL ADS54J60 1000 16 Dual ADS54J40 1000 14 Dual ADS54J42 625 14 Dual ADS54J20 1000 12 Dual ADS54J69 500 16 Dual 6 Pin Configuration and Functions DB2P DB2M IOVDD DB1P DB1M DGND DB0P DB0M IOVDD SYNC DA0M DA0P DGND DA1M DA1P IOVDD DA2M DA2P 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 RMP Package 72-Pin VQFNP Top View DB3M 1 54 DA3M DB3P 2 53 DA3P DGND 3 52 DGND IOVDD 4 51 IOVDD SDIN 5 50 PDN SCLK 6 49 RES SEN 7 48 RESET DVDD 8 47 DVDD AVDD 9 Thermal 46 AVDD AVDD3V 10 Pad 45 AVDD3V SDOUT 11 44 AVDD AVDD 12 43 AVDD INBP 13 42 INAP 35 36 AGND 32 AGND AVDD 31 AVDD3V 34 30 AVDD 33 29 AGND SYSREFP 28 CLKINM SYSREFM 27 CLKINP AGND 26 37 25 18 AVDD AGND AGND AVDD 24 38 AVDD3V 17 23 AVDD AGND AVDD3V 22 39 21 16 NC AVDD3V VCM AVDD 20 INAM 40 NC 41 15 19 14 NC INBM AVDD Not to scale Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 3 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Pin Functions PIN NAME NO. I/O DESCRIPTION CLOCK, SYSREF CLKINM 28 I Negative differential clock input for the ADC CLKINP 27 I Positive differential clock input for the ADC SYSREFM 34 I Negative external SYSREF input SYSREFP 33 I Positive external SYSREF input PDN 50 I/O RESET 48 I Hardware reset; active high. This pin has an internal 20-kΩ pulldown resistor. SCLK 6 I Serial interface clock input SDIN 5 I Serial interface data input SDOUT 11 O Serial interface data output. Can be configured as a fast overrange output for channel B via the SPI. SEN 7 I Serial interface enable DA0M 62 O DA1M 59 O DA2M 56 O DA3M 54 O DA0P 61 O DA1P 58 O DA2P 55 O DA3P 53 O DB0M 65 O DB1M 68 O DB2M 71 O DB3M 1 O DB0P 66 O DB1P 69 O DB2P 72 O DB3P 2 O SYNC 63 I Synchronization input for the JESD204B port INAM 41 I Differential analog negative input for channel A INAP 42 I Differential analog positive input for channel A INBM 14 I Differential analog negative input for channel B INBP 13 I Differential analog positive input for channel B VCM 22 O Common-mode voltage, 2.1 V. Note that analog inputs are internally biased to this pin through 600 Ω (effective), no external connection from the VCM pin to the INxP or INxM pin is required. AGND 18, 23, 26, 29, 32, 36, 37 I Analog ground AVDD 9, 12, 15, 17, 25, 30, 35, 38, 40, 43, 44, 46 I Analog 1.9-V power supply CONTROL, SERIAL Power-down. Can be configured via an SPI register setting. Can be configured as a fast overrange output for channel A via the SPI. DATA INTERFACE JESD204B serial data negative output for channel A JESD204B serial data positive output for channel A JESD204B serial data negative output for channel B JESD204B serial data positive output for channel B INPUT, COMMON MODE POWER SUPPLY AVDD3V 10, 16, 24, 31, 39, 45 I Analog 3.0-V power supply for the analog buffer DGND 3, 52, 60, 67 I Digital ground DVDD 8, 47 I Digital 1.9-V power supply IOVDD 4, 51, 57, 64, 70 I Digital 1.15-V power supply for the JESD204B transmitter 19, 20, 21 — 49 I NC, RES NC RES 4 Unused pin, do not connect Reserved pin. Connect to DGND. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range MIN MAX AVDD3V –0.3 3.6 AVDD –0.3 2.1 DVDD –0.3 2.1 IOVDD –0.2 1.4 Voltage between AGND and DGND Voltage applied to input pins –0.3 0.3 INAP, INBP, INAM, INBM –0.3 3 CLKINP, CLKINM –0.3 AVDD + 0.3 SYSREFP, SYSREFM –0.3 AVDD + 0.3 SCLK, SEN, SDIN, RESET, SYNC, PDN –0.2 2.1 –65 150 Storage temperature, Tstg (1) UNIT V V V °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±1000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V HBM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 5 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) AVDD3V Supply voltage range Analog inputs NOM MAX 2.85 3.0 3.6 AVDD 1.8 1.9 2.0 DVDD 1.7 1.9 2.0 IOVDD 1.1 1.15 1.2 1.9 VPP 2.0 V Maximum analog input frequency for a 1.9-VPP input amplitude (3) (4) 400 MHz Input clock amplitude differential (VCLKP – VCLKM) LVPECL, ac-coupled 250 (5) Operating free-air, TA 1000 0.75 1.5 0.8 1.6 45% 50% LVDS, ac-coupled Input device clock duty cycle (1) (2) (3) (4) (5) (6) V Input common-mode voltage Sine wave, ac-coupled Temperature UNIT Differential input voltage range Input clock frequency, device clock frequency Clock inputs MIN VPP 0.7 –40 Operating junction, TJ MHz 55% 85 105 (6) 125 ºC SYSREF must be applied for the device to initialize; see the SYSREF Signal section for details. After power-up, always use a hardware reset to reset the device for the first time; see Table 66 for details. Operating 0.5 dB below the maximum-supported amplitude is recommended to accommodate gain mismatch in interleaving ADCs. At high frequencies, the maximum supported input amplitude reduces; see Figure 36 for details. See Table 9 and Table 11. Prolonged use above the nominal junction temperature can increase the device failure-in-time (FIT) rate. 7.4 Thermal Information ADS54J20 THERMAL METRIC (1) RMP (VQFNP) UNIT 72 PINS RθJA Junction-to-ambient thermal resistance 22.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 5.1 °C/W RθJB Junction-to-board thermal resistance 2.4 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 2.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.4 °C/W (1) 6 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 7.5 Electrical Characteristics typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS differential input (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 1000 MSPS GENERAL ADC sampling rate Resolution 12 Bits POWER SUPPLIES AVDD3V 3.0-V analog supply 2.85 3.0 3.6 V AVDD 1.9-V analog supply 1.8 1.9 2.0 V DVDD 1.9-V digital supply 1.7 1.9 2.0 V IOVDD 1.15-V SerDes supply 1.1 1.15 1.2 V IAVDD3V 3.0-V analog supply current VIN = full-scale on both channels 334 360 mA IAVDD 1.9-V analog supply current VIN = full-scale on both channels 359 510 mA 8 lanes active (LMFS = 8224) 197 260 mA 4 lanes active (LMFS = 4222), 2X decimation 197 mA 2 lanes active (LMFS = 2221), 4X decimation 176 mA 8 lanes active (LMFS = 8224) 566 4 lanes active (LMFS = 4222), 2X decimation 593 mA 2 lanes active (LMFS = 2221), 4X decimation 562 mA 8 lanes active (LMFS = 8224) 2.71 4 lanes active (LMFS = 4222), 2X decimation 2.74 W 2 lanes active (LMFS = 2221), 4X decimation 2.66 W IDVDD IIOVDD PD 1.9-V digital supply current 1.15-V SerDes supply current Total power dissipation (1) Global power-down power dissipation 139 920 3.1 315 mA W mW ANALOG INPUTS (INAP, INAM, INBP, INBM) Differential input full-scale voltage 1.9 VIC Common-mode input voltage 2.0 VPP V RIN Differential input resistance At 170-MHz input frequency 0.6 kΩ CIN Differential input capacitance At 170-MHz input frequency 4.7 pF Analog input bandwidth (3 dB) 50-Ω source driving ADC inputs terminated with 50 Ω 1.2 GHz 1.15 V CLOCK INPUT (CLKINP, CLKINM) Internal clock biasing (1) CLKINP and CLKINM are connected to internal biasing voltage through 400 Ω See the Power-Down Mode section for details. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 7 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 7.6 AC Characteristics typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input amplitude, and 0-dB digital gain (unless otherwise noted) PARAMETER TEST CONDITIONS Signal-to-noise ratio fIN = 100 MHz, AIN = –1 dBFS 68.3 67.4 67.0 fIN = 300 MHz, AIN = –1 dBFS 66.7 fIN = 370 MHz, AIN = –1 dBFS 65.8 fIN = 470 MHz, AIN = –3 dBFS 66.3 AIN = –6 dBFS AIN = –6 dBFS, gain = 5 dB SINAD Signal-to-noise and distortion ratio fIN = 100 MHz, AIN = –1 dBFS 155.3 Spurious-free dynamic range (excluding IL spurs) 154.4 154.0 fIN = 300 MHz, AIN = –1 dBFS 153.7 fIN = 370 MHz, AIN = –1 dBFS 152.8 fIN = 470 MHz, AIN = –3 dBFS 153.3 AIN = –6 dBFS 152.5 AIN = –6 dBFS, gain = 5 dB 148.5 fIN = 10 MHz, AIN = –1 dBFS 68.3 fIN = 100 MHz, AIN = –1 dBFS 68.1 63.2 67.2 fIN = 270 MHz, AIN = –1 dBFS 66.7 fIN = 300 MHz, AIN = –1 dBFS 66.3 fIN = 370 MHz, AIN = –1 dBFS 65.0 fIN = 470 MHz, AIN = –3 dBFS 65.7 AIN = –6 dBFS 64.7 AIN = –6 dBFS, gain = 5 dB 60.8 fIN = 10 MHz, AIN = –1 dBFS 85.0 fIN = 100 MHz, AIN = –1 dBFS 83.0 74 dBFS 86.0 fIN = 230 MHz, AIN = –1 dBFS 85.0 fIN = 270 MHz, AIN = –1 dBFS 81.0 fIN = 300 MHz, AIN = –1 dBFS 78.0 fIN = 370 MHz, AIN = –1 dBFS 73.0 fIN = 470 MHz, AIN = –3 dBFS 72.0 AIN = –6 dBFS 68.0 AIN = –6 dBFS, gain = 5 dB 69.0 Submit Documentation Feedback dBFS/Hz 67.7 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz 8 154.8 fIN = 270 MHz, AIN = –1 dBFS fIN = 170 MHz, AIN = –1 dBFS SFDR 151 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz dBFS 61.5 155.4 fIN = 170 MHz, AIN = –1 dBFS UNIT 65.5 fIN = 10 MHz, AIN = –1 dBFS fIN = 720 MHz MAX 67.8 fIN = 270 MHz, AIN = –1 dBFS fIN = 170 MHz, AIN = –1 dBFS Noise spectral density 64 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz NSD TYP 68.4 fIN = 170 MHz, AIN = –1 dBFS SNR MIN fIN = 10 MHz, AIN = –1 dBFS dBc Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 AC Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input amplitude, and 0-dB digital gain (unless otherwise noted) PARAMETER TEST CONDITIONS Second-order harmonic distortion fIN = 100 MHz, AIN = –1 dBFS 90.0 85.0 81.0 fIN = 300 MHz, AIN = –1 dBFS 81.0 fIN = 370 MHz, AIN = –1 dBFS 76.0 fIN = 470 MHz, AIN = –3 dBFS 72.0 AIN = –6 dBFS 68.0 AIN = –6 dBFS, gain = 5 dB 69.0 fIN = 10 MHz, AIN = –1 dBFS 85.0 fIN = 100 MHz, AIN = –1 dBFS 83.0 87.0 fIN = 270 MHz, AIN = –1 dBFS 81.0 fIN = 300 MHz, AIN = –1 dBFS 78.0 fIN = 370 MHz, AIN = –1 dBFS 73.0 fIN = 470 MHz, AIN = –3 dBFS 70.0 AIN = –6 dBFS 77.0 AIN = –6 dBFS, gain = 5 dB 79.0 fIN = 10 MHz, AIN = –1 dBFS 94.0 fIN = 100 MHz, AIN = –1 dBFS 97.0 fIN = 170 MHz, AIN = –1 dBFS Spurious-free dynamic range (excluding HD2, HD3, and IL spur) 95.0 fIN = 270 MHz, AIN = –1 dBFS 95.0 fIN = 300 MHz, AIN = –1 dBFS 91.0 fIN = 370 MHz, AIN = –1 dBFS 85.0 fIN = 470 MHz, AIN = –3 dBFS 88.0 AIN = –6 dBFS 80.0 AIN = –6 dBFS, gain = 5 dB 83.0 fIN = 10 MHz, AIN = –1 dBFS 11.1 fIN = 100 MHz, AIN = –1 dBFS 11.0 fIN = 170 MHz, AIN = –1 dBFS Effective number of bits 10.2 10.9 fIN = 270 MHz, AIN = –1 dBFS 10.8 fIN = 300 MHz, AIN = –1 dBFS 10.7 fIN = 370 MHz, AIN = –1 dBFS 10.5 fIN = 470 MHz, AIN = –3 dBFS 10.6 AIN = –6 dBFS AIN = –6 dBFS, gain = 5 dB Product Folder Links: ADS54J20 dBFS Bits 10.5 9.8 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated dBc 11.0 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz dBc 93.0 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz ENOB 77 UNIT 86.0 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz Non HD2, HD3 74 MAX 92.0 fIN = 270 MHz, AIN = –1 dBFS fIN = 170 MHz, AIN = –1 dBFS Third-order harmonic distortion 74 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz HD3 TYP 85.0 fIN = 170 MHz, AIN = –1 dBFS HD2 MIN fIN = 10 MHz, AIN = –1 dBFS 9 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com AC Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input amplitude, and 0-dB digital gain (unless otherwise noted) PARAMETER TEST CONDITIONS Total harmonic distortion fIN = 100 MHz, AIN = –1 dBFS 80.0 82.0 78.0 fIN = 300 MHz, AIN = –1 dBFS 75.0 fIN = 370 MHz, AIN = –1 dBFS 70.0 fIN = 470 MHz, AIN = –3 dBFS 71.0 AIN = –6 dBFS 67.0 AIN = –6 dBFS, gain = 5 dB 69.0 fIN = 10 MHz, AIN = –1 dBFS 84.0 fIN = 100 MHz, AIN = –1 dBFS 85.0 Crosstalk isolation between channel A and B 83.0 fIN = 270 MHz, AIN = –1 dBFS 82.0 fIN = 300 MHz, AIN = –1 dBFS 81.0 fIN = 370 MHz, AIN = –1 dBFS 81.0 fIN = 470 MHz, AIN = –3 dBFS 78.0 10 AIN = –6 dBFS 79.0 AIN = –6 dBFS, gain = 5 dB 82.0 fIN1 = 185 MHz, fIN2 = 190 MHz, AIN = –7 dBFS 85 fIN1 = 365 MHz, fIN2 = 370 MHz, AIN = –7 dBFS 79 fIN1 = 465 MHz, fIN2 = 470 MHz, AIN = –7 dBFS 75 Full-scale, 170-MHz signal on aggressor, idle channel is victim Submit Documentation Feedback UNIT dBc 84.0 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz Two-tone, third-order intermodulation distortion 69 MAX 83.0 fIN = 270 MHz, AIN = –1 dBFS fIN = 170 MHz, AIN = –1 dBFS IMD3 72 fIN = 230 MHz, AIN = –1 dBFS fIN = 720 MHz SFDR_IL Interleaving spur TYP 82.0 fIN = 170 MHz, AIN = –1 dBFS THD MIN fIN = 10 MHz, AIN = –1 dBFS 100 dBc dBFS dB Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 7.7 Digital Characteristics typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS differential input (unless otherwise noted) PARAMETER DIGITAL INPUTS (RESET, SCLK, SEN, SDIN, SYNC, PDN) TEST CONDITIONS MIN 0.8 VIH High-level input voltage All digital inputs support 1.2-V and 1.8-V logic levels VIL Low-level input voltage All digital inputs support 1.2-V and 1.8-V logic levels IIH High-level input current IIL Low-level input current TYP MAX UNITS (1) V 0.4 SEN 0 RESET, SCLK, SDIN, PDN, SYNC 50 SEN 50 RESET, SCLK, SDIN, PDN, SYNC V µA µA 0 DIGITAL INPUTS (SYSREFP, SYSREFM) VD Differential input voltage V(CM_DIG) Common-mode voltage for SYSREF (2) 0.35 0.45 1.4 V 1.3 V DVDD V DIGITAL OUTPUTS (SDOUT, PDN (2)) VOH High-level output voltage VOL Low-level output voltage DVDD – 0.1 0.1 V DIGITAL OUTPUTS (JESD204B Interface: DxP, DxM) (3) VOD Output differential voltage VOC Output common-mode voltage Transmitter short-circuit current zos (2) (3) Transmitter pins shorted to any voltage between –0.25 V and 1.45 V Single-ended output impedance Output capacitance (1) With default swing setting Output capacitance inside the device, from either output to ground 700 mVPP 450 mV –100 100 mA 50 Ω 2 pF The RESET, SCLK, SDIN, and PDN pins have a 20-kΩ (typical) internal pulldown resistor to ground, and the SEN pin has a 20-kΩ (typical) pullup resistor to IOVDD. When functioning as an OVR pin for channel B. 100-Ω differential termination. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 11 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 7.8 Timing Characteristics typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS differential input (unless otherwise noted) MIN TYP MAX UNITS SAMPLE TIMING Aperture delay 0.75 Aperture delay matching between two channels on the same device 1.6 ±70 Aperture delay matching between two devices at the same temperature and supply voltage ns ps ±270 ps 120 fS rms Wake-up time to valid data after coming out of global power-down 150 µs Data latency (1): ADC sample to digital output 134 Input clock cycles 62 Input clock cycles 4 ns Aperture jitter WAKE-UP TIMING LATENCY OVR latency: ADC sample to OVR bit tPD Propagation delay: logic gates and output buffers delay (does not change with fS) SYSREF TIMING tSU_SYSREF Setup time for SYSREF, referenced to the input clock falling edge 300 tH_SYSREF Hold time for SYSREF, referenced to the input clock falling edge 100 900 ps ps JESD OUTPUT INTERFACE TIMING CHARACTERISTICS Unit interval 100 400 ps Serial output data rate 2.5 6.25 Gbps Total jitter for BER of 1E-15 and lane rate = 6.25 Gbps 26 Random jitter for BER of 1E-15 and lane rate = 6.25 Gbps tR, tF (1) 0.75 ps ps rms Deterministic jitter for BER of 1E-15 and lane rate = 6.25 Gbps 12 ps, pk-pk Data rise time, data fall time: rise and fall times are measured from 20% to 80%, differential output waveform, 2.5 Gbps ≤ bit rate ≤ 6.25 Gbps 35 ps Overall ADC latency = data latency + tPDI. Sample N tH_SYSREF tSU_SYSREF CLKIN 1.0 GSPS SYSREF Figure 1. SYSREF Timing 12 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 N+1 N+2 N N+3 Sample tPD Data Latency: 134 Clock Cycles CLKINM CLKINP DA0P, DA0M, DB0P, DB0M D 20 Sample N-1 DA1P, DA1M, DB1P, DB1M Sample N-1 D 11 D 20 Sample N D 10 D 11 D 20 Sample N+1 D 1 D 10 Sample N Sample N+2 D 1 Sample N+1 D 10 Sample N+2 Figure 2. Sample Timing Requirements Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 13 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 7.9 Typical Characteristics 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) -40 -60 -80 -40 -60 -80 -100 -100 -120 -120 0 100 200 300 Input Frequency (MHz) 400 0 500 SNR = 68.4 dBFS, SINAD = 68.3 dBFS, THD = 84 dBc, IL spur = 89 dBc, SFDR = 87 dBc, non HD2, HD3 spur = 93 dBc 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 400 500 D002 Figure 4. FFT for 140-MHz Input Signal 0 -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 100 200 300 Input Frequency (MHz) 400 500 0 100 D003 SNR = 67.8 dBFS, SINAD = 67.7 dBFS, SFDR = 86 dBc, THD = 81 dBc, IL spur = 88 dBc, non HD2, HD3 spur = 89 dBc -20 -20 Amplitude (dBFS) 0 -60 -80 -100 400 500 D004 Figure 6. FFT for 230-MHz Input Signal 0 -40 200 300 Input Frequency (MHz) SNR = 67.4 dBFS, SINAD = 67.2 dBFS, IL spur = 87 dBc, SFDR = 84 dBc, THD = 82 dBc, non HD2, HD3 spur = 90 dBc Figure 5. FFT for 170-MHz Input Signal Amplitude (dBFS) 200 300 Input Frequency (MHz) SNR = 67.9 dBFS, SINAD = 67.8 dBFS, SFDR = 87 dBc, THD = 85 dBc, IL spur = 88 dBc, non HD2, HD3 spur = 96 dBc Figure 3. FFT for 10-MHz Input Signal -40 -60 -80 -100 -120 -120 0 100 200 300 Input Frequency (MHz) 400 500 0 D005 SNR = 66.7 dBFS, SINAD = 66.3 dBFS, IL spur = 85 dBc, SFDR = 77 dBc, THD = 76 dBc, non HD2, HD3 spur = 92 dBc 100 200 300 Input Frequency (MHz) 400 500 D006 SNR = 65.8 dBFS, SINAD = 65 dBFS, SFDR = 74 dBc, THD = 72 dBc, IL spur = 85 dBc, non HD2, HD3 spur = 86 dBc Figure 7. FFT for 300-MHz Input Signal 14 100 D001 Submit Documentation Feedback Figure 8. FFT for 370-MHz Input Signal Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Typical Characteristics (continued) 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) -40 -60 -80 -100 -80 -120 0 100 200 300 Input Frequency (MHz) 400 500 0 100 D007 SNR = 66.3 dBFS, SINAD = 65.7 dBFS, SFDR = 72 dBc, THD = 71 dBc, IL spur = 81 dBc, non HD2, HD3 spur = 90 dBc 200 300 Input Frequency (MHz) 400 500 D008 fIN1 = 185 MHz, fIN2 = 190 MHz, each tone at –7 dBFS, IMD = 85 dBFS Figure 9. FFT for 470-MHz Input Signal Figure 10. FFT for Two-Tone Input Signal (–7 dBFS) 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) -60 -100 -120 -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 100 200 300 Input Frequency (MHz) 400 500 0 100 D009 fIN1 = 185 MHz, fIN2 = 190 MHz, each tone at –36 dBFS, IMD = 103 dBFS -20 -20 Amplitude (dBFS) 0 -60 -80 -100 400 500 D010 Figure 12. FFT for Two-Tone Input Signal (–7 dBFS) 0 -40 200 300 Input Frequency (MHz) fIN1 = 370 MHz, fIN2 = 365 MHz, each tone at –7 dBFS, IMD = 80 dBFS Figure 11. FFT for Two-Tone Input Signal (–36 dBFS) Amplitude (dBFS) -40 -40 -60 -80 -100 -120 0 100 200 300 Input Frequency (MHz) 400 500 -120 0 D011 fIN1 = 370 MHz, fIN2 = 365 MHz, each tone at –36 dBFS, IMD = 109 dBFS Figure 13. FFT for Two-Tone Input Signal (–36 dBFS) 100 200 300 Input Frequency (MHz) 400 500 D012 fIN1 = 470 MHz, fIN2 = 465 MHz, each tone at –7 dBFS, IMD = 74.9 dBFS Figure 14. FFT for Two-Tone Input Signal (–7 dBFS) Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 15 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Typical Characteristics (continued) 0 -80 -20 -84 -40 -88 IMD (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) -60 -92 -80 -96 -100 -100 -120 0 100 200 300 Input Frequency (MHz) 400 500 -104 -35 -31 D013 -11 -7 D014 fIN1 = 185 MHz, fIN2 = 190 MHz fIN1 = 470 MHz, fIN2 = 465 MHz, each tone at –36 dBFS, IMD = 109.2 dBFS Figure 15. FFT for Two-Tone Input Signal (–36 dBFS) -27 -23 -19 -15 Each Tone Amplitude (dBFS) Figure 16. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) -76 -70 -74 -80 -78 -82 IMD (dBFS) IMD (dBFS) -84 -88 -92 -86 -90 -94 -96 -98 -100 -104 -35 -102 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -106 -35 -7 -31 D015 fIN1 = 365 MHz, fIN2 = 370 MHz -11 -7 D016 fIN1 = 465 MHz, fIN2 = 470 MHz Figure 17. Intermodulation Distortion vs Input Amplitude (365 MHz and 370 MHz) Figure 18. Intermodulation Distortion vs Input Amplitude (465 MHz and 470 MHz) 95 90 AIN = -6 dBFS AIN = -3 dBFS AIN = -1 dBFS 90 86 Interleaving Spur (dBc) 85 SFDR (dBc) -27 -23 -19 -15 Each Tone Amplitude (dBFS) 80 75 70 65 82 78 74 60 55 70 0 100 200 300 400 500 Input Frequency (MHz) 600 700 Figure 19. Spurious-Free Dynamic Range vs Input Frequency 16 0 D043 40 80 120 160 200 240 280 320 360 400 440 480 Input Frequency (MHz) D018 Figure 20. Interleaving Spur vs Input Frequency Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Typical Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) 71 71 AIN = -6 dBFS AIN = -3 dBFS AIN = -1 dBFS 70 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 70.5 AVDD = 1.95 V AVDD = 2 V SNR (dBFS) SNR (dBFS) 70 69 68 67 69.5 69 68.5 68 66 67.5 67 -40 65 0 100 200 300 400 500 Input Frequency (MHz) 600 700 -15 D042 10 35 Temperature (°C) 60 85 D020 fIN = 170 MHz Figure 21. Signal-to-Noise Ratio vs Input Frequency Figure 22. Signal-to-Noise Ratio vs AVDD Supply and Temperature 72 94 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 90 70 88 69 86 84 67 66 80 65 -15 10 35 Temperature (°C) 60 64 -40 85 -15 D021 fIN = 170 MHz 10 35 Temperature (°C) 60 85 D022 fIN = 350 MHz Figure 23. Spurious-Free Dynamic Range vs AVDD Supply and Temperature Figure 24. Signal-to-Noise Ratio vs AVDD Supply and Temperature 71 79 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 78 DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V AVDD = 1.95 V AVDD = 2 V 70.2 77 SNR (dBFS) SFDR (dBc) AVDD = 1.95 V AVDD = 2 V 68 82 78 -40 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 71 SNR (dBFS) SFDR (dBc) 92 AVDD = 1.95 V AVDD = 2 V 76 DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V 69.4 68.6 75 67.8 74 73 -40 -15 10 35 Temperature (°C) 60 85 67 -40 D023 fIN = 350 MHz -15 10 35 Temperature (°C) 60 85 D024 fIN = 170 MHz Figure 25. Spurious-Free Dynamic Range vs AVDD Supply and Temperature Figure 26. Signal-to-Noise Ratio vs DVDD Supply and Temperature Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 17 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Typical Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) 70 92 DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V 69 SNR (dBFS) SFDR (dBc) 90 DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V 88 86 DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V 68 67 66 84 82 -40 65 -15 10 35 Temperature (°C) 60 64 -40 85 -15 D025 fIN = 170 MHz 60 85 D026 fIN = 350 MHz Figure 27. Spurious-Free Dynamic Range vs DVDD Supply and Temperature Figure 28. Signal-to-Noise Ratio vs DVDD Supply and Temperature 70 82 DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V 69.5 SNR (dBFS) 80 SFDR (dBc) 10 35 Temperature (°C) 78 76 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 69 68.5 68 74 72 -40 67.5 -15 10 35 Temperature (°C) 60 67 -40 85 -15 D027 fIN = 350 MHz D028 71 AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V 92 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 69 88 86 67 66 82 65 10 35 Temperature (°C) 60 85 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 68 84 -15 AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V 70 SNR (dBFS) 90 SFDR (dBc) 85 Figure 30. Signal-to-Noise Ratio vs AVDD3V Supply and Temperature 94 64 -40 D029 -15 10 35 Temperature (°C) 60 85 D030 fIN = 350 MHz fIN = 170 MHz Figure 31. Spurious-Free Dynamic Range vs AVDD3V Supply and Temperature 18 60 fIN = 170 MHz Figure 29. Spurious-Free Dynamic Range vs DVDD Supply and Temperature 80 -40 10 35 Temperature (°C) Submit Documentation Feedback Figure 32. Signal-to-Noise Ratio vs AVDD3V Supply and Temperature Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Typical Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) 79 82 AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V Gain = 0 dB Gain = 2 dB Gain = 4 dB 76 Gain = 6 dB Gain = 8 dB Gain = 10 dB Gain = 12 dB 73 SNR (dBFS) SFDR (dBc) 80 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 78 76 70 67 64 61 74 58 72 -40 -15 10 35 Temperature (°C) 60 55 10 85 102 194 286 Input Frequency (MHz) D031 378 470 D053 fIN = 350 MHz Figure 33. Spurious-Free Dynamic Range vs AVDD3V Supply and Temperature Figure 34. Signal-to-Noise Ratio vs Gain and Input Frequency 110 2 SFDR (dBc) 100 Gain = 6 dB Gain = 8 dB Gain = 10 dB Gain = 12 dB Fundamental Amplitude (dBFS) Gain = 0 dB Gain = 2 dB Gain = 4 dB 105 95 90 85 80 75 0 -2 -4 -6 -8 70 65 10 -10 194 286 Input Frequency (MHz) 378 470 0 Figure 35. Spurious-Free Dynamic Range vs Gain and Input Frequency 69 90 67 60 65 30 63 -70 -50 -40 -30 Amplitude (dBFS) -20 -10 0 800 900 1000 D046 210 SNR (dBFS) SFDR (dBc) 180 SFDR (dBFS) 72 0 -60 300 400 500 600 700 Input Frequency (MHz) 73.5 SNR (dBFS) SNR (dBFS) 71 200 Figure 36. Maximum Supported Amplitude vs Frequency 150 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 120 SFDR (dBc,dBFS) 73 100 D054 70.5 150 69 120 67.5 90 66 60 64.5 30 63 -70 D032 fIN = 170 MHz SFDR (dBc,dBFS) 102 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 0 D033 fIN = 350 MHz Figure 37. Performance vs Input Amplitude Figure 38. Performance vs Input Amplitude Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 19 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Typical Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) 74 100 75 125 90 70 80 68 70 66 60 50 2.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) 100 69 75 66 50 63 25 60 0.2 D034 fIN = 170 MHz 71 Figure 40. Performance vs Sampling Clock Amplitude (Differential) 71 95 90 69 85 68 80 67 75 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SNR (dBFS) 70 SFDR (dBc) SNR (dBFS) SNR SFDR 35 70 70 70 88 SNR SFDR 84 69 80 68 76 67 72 66 68 65 64 64 30 35 40 D036 fIN = 170 MHz 45 50 55 60 Input Clock Duty Cycle (%) 65 60 70 D037 fIN = 350 MHz Figure 41. Performance vs Clock Duty Cycle Figure 42. Performance vs Clock Duty Cycle -10 0 PSRR with 25-mVpp Signal on AVDD PSRR with 50-mVpp Signal on AVDD3V -15 -20 -20 Amplitude (dBFS) -25 PSRR (dB) D035 fIN = 350 MHz Figure 39. Performance vs Sampling Clock Amplitude 66 30 0 2.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) SFDR (dBc) 64 0.2 72 SFDR (dBc) 72 SNR (dBFS) SNR SFDR SFDR (dBc) SNR (dBFS) SNR SFDR -30 -35 -40 -40 -60 -80 -45 -100 -50 -55 -120 -60 0 0 50 100 150 200 250 Frequency of Signal on Supply (MHz) 300 D038 Figure 43. Power-Supply Rejection Ratio vs Supply Signal 20 100 200 300 Input Frequency (MHz) 400 500 D039 SNR = 66.7 dBFS, SINAD = 65.7 dBFS, SFDR = 79 dBc, fIN = 170.1 MHz, fPSRR = 5 MHz, non HD2, HD3 spur = 84 dBc Figure 44. Power-Supply Rejection Ratio FFT for Test Signals on the AVDD Supply Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Typical Characteristics (continued) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) -20 0 -25 -20 Amplitude (dBFS) -35 -40 -45 -40 -60 -80 -100 -50 -55 -120 0 50 100 150 200 250 Frequency of Input Common-Mode Signal (MHz) 300 0 Figure 45. Common-Mode Rejection Ratio vs Signal Frequency 400 500 D041 800 IAVDD,IDVDD,IAVDD3,IIOVDD (mA) 3.5 3 2.5 2 1.5 1 500 550 600 650 700 750 800 850 Sampling Speed (MSPS) 900 950 1000 2.78 I DVDD (mA) I AVDD (mA) I IOVDD (mA) 700 500 2.72 400 2.7 300 2.68 200 2.66 100 -40 -15 10 35 Temperature (°C) -20 -20 Amplitude (dBFS) 0 -80 -100 2.64 85 60 D045 Figure 48. Power vs Temperature 0 -60 2.76 2.74 D042 -40 I AVDD3 (mA) Total Power (W) 600 Figure 47. Power Consumption vs Sampling Speed Amplitude (dBFS) 200 300 Input Frequency (MHz) Figure 46. Common-Mode Rejection Ratio FFT 4 Power Consumption (W) 100 D040 Total Power (W) CMRR (dB) -30 -40 -60 -80 -100 -120 -120 0 25 50 75 Input Frequency (MHz) 100 125 0 D047 SNR = 70.5 dBFS, SINAD = 69.9 dBFS, fS = 250 MHz, fIN = 60 MHz, SFDR = 88.6 dBc, THD = 83 dBc, non HD2, HD3 spur = 99.96 dBc Figure 49. FFT for 60-MHz Input Signal in Decimate-by-4 Mode 25 50 75 Input Frequency (MHz) 100 125 D048 SNR = 70.2 dBFS, SINAD = 69.6 dBFS, fS = 250 MHz, fIN = 170 MHz, SFDR = 87 dBc, non HD2, HD3 spur = 90.42 dBc Figure 50. FFT for 170-MHz Input Signal in Decimate-by-4 Mode Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 21 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Typical Characteristics (continued) 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 25 50 75 Input Frequency (MHz) 100 125 0 SNR = 69.3 dBFS, SINAD = 68.6 dBFS, fS = 250 MHz, fIN = 300 MHz, SFDR = 86 dBc, non HD2, HD3 spur = 94.42 dBc 100 125 D050 Figure 52. FFT for 450-MHz Input Signal in Decimate-by-4 Mode 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 50 75 Input Frequency (MHz) SNR = 67.6 dBFS, SINAD = 66.8 dBFS, fS = 250 MHz, fIN = 450 MHz, SFDR = 83 dBc, non HD2, HD3 spur = 90.44 dBc Figure 51. FFT for 300-MHz Input Signal in Decimate-by-4 Mode -40 -60 -80 -40 -60 -80 -100 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 50 D051 SNR = 68.9 dBFS, SINAD = 68.2 dBFS, fS = 500 MHz, fIN = 170 MHz, SFDR = 86 dBc, non HD2, HD3 spur = 81.94 dBc Figure 53. FFT for 170-MHz Input Signal in Decimate-by-2 Mode 22 25 D049 100 150 Input Frequency (MHz) 200 250 D052 SNR = 66.7 dBFS, SINAD = 65.9 dBFS, fS = 500 MHz, fIN = 350 MHz, SFDR = 80 dBc, non HD2, HD3 spur = 80.83 dBc Figure 54. FFT for 350-MHz Input Signal in Decimate-by-2 Mode Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 7.10 Typical Characteristics: Contour typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital gain (unless otherwise noted) 6 9 .0 6 8 .5 950 6 8 .0 900 6 7 .5 850 6 7 .0 6 6 .5 800 6 6 .0 750 700 6 5 .5 0 50 100 150 200 250 300 350 In p u t Fre q u e n c y (MHz) 400 450 Figure 55. Signal-to-Noise-Ratio with 0-dB Digital Gain 6 5 .0 1000 Sa m p lin g Fre q u e n c y (MSPS) Sa m p lin g Fre q u e n c y (MSPS) 1000 90 87 950 84 900 81 850 78 75 800 72 750 700 69 0 50 100 150 200 250 300 350 In p u t Fre q u e n c y (MHz) 400 450 66 Figure 56. Spurious-Free Dynamic Range with 0-dB Digital Gain Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 23 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8 Detailed Description 8.1 Overview The ADS54J20 is a low-power, wide-bandwidth, 12-bit, 1.0-GSPS, dual-channel, analog-to-digital converter (ADC). The ADS54J20 employs four interleaving ADCs for each channel to achieve a noise floor of –157 dBFS/Hz. The ADS54J20 uses TI's proprietary interleaving and dither algorithms to achieve a clean spectrum with a high spurious-free dynamic range (SFDR). The device also offers various programmable decimation filtering options for systems requiring higher signal-to-noise ratio (SNR) and SFDR over a wide range of frequencies. Analog input buffers isolate the ADC driver from glitch energy generated from sampling process, thereby simplifying the driving network on-board. The JESD204B interface reduces the number of interface lines with two-lane and four-lane options, allowing for a high system integration density. The JESD204B interface operates in subclass 1, enabling multi-chip synchronization with the SYSREF input. 8.2 Functional Block Diagram ADC ADC ADC ADC INAP, INAM Interleaving Correction DA2P, DA2M, DA3P, DA3M PLL: x20 x40 Divideby-4 CLKINP, CLKINM SYSREFP, SYSREFM Buffer INBP, INBM SYNC DDC Block: 2X, 4X Decimation Mixer: fS / 16, fS / 4 Digital Block ADC ADC ADC ADC DA0P, DA0M, DA1P, DA1M DDC Block: 2X, 4X Decimation Mixer: fS / 16, fS / 4 Digital Block JESD204B Interface Buffer DB0P, DB0M, DB1P, DB1M Interleaving Correction DB2P, DB2M, DB3P, DB3M FOVR Control and SPI Common Mode 24 SDIN SCLK SEN RESET PDN TI Device SDOUT VCM Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.3 Feature Description 8.3.1 Analog Inputs The ADS54J20 analog signal inputs are designed to be driven differentially. The analog input pins have internal analog buffers that drive the sampling circuit. Resulting from the analog buffer, the input pins present a high impedance input across a very wide frequency range to the external driving source that enables great flexibility in the external analog filter design as well as excellent 50-Ω matching for RF applications. The buffer also helps isolate the external driving circuit from the internal switching currents of the sampling circuit, resulting in a more constant SFDR performance across input frequencies. The common-mode voltage of the signal inputs is internally biased to VCM using 600-Ω resistors, allowing for accoupling of the input drive network. Each input pin (INP, INM) must swing symmetrically between (VCM + 0.475 V) and (VCM – 0.475 V), resulting in a 1.9-VPP (default) differential input swing. The input sampling circuit has a 3-dB bandwidth that extends up to 1.2 GHz. An equivalent analog input network diagram is shown in Figure 57. 0.77 : 2 nH 0.6 : 500 fF 150 fF 150 fF 1: 200 fF 3.3 : 3 pF 375 fF INP 40 : 0.77 : 1: 150 fF 200 fF 3.3 : 600 : 3 pF 375 fF VCM 40 : 600 : 0.77 : 150 fF 2 nH 0.6 : 500 fF 150 fF 1: 200 fF 3.3 : 3 pF 375 fF INM 40 : 0.77 : 1: 150 fF 200 fF 3.3 : 3 pF 375 fF 40 : TI Device Copyright © 2016, Texas Instruments Incorporated Figure 57. Analog Input Network Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 25 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Feature Description (continued) The input bandwidth shown in Figure 58 is measured with respect to a 50-Ω differential input termination at the ADC input pins. Output Power/Input Power (dB) 0 -3 -6 -9 -12 -15 -18 0 200 400 600 800 1000 1200 1400 1600 1800 2000 Input Frequency (MHz) D056 Figure 58. Transfer Function versus Frequency 8.3.2 DDC Block The ADS54J20 has an optional digital down-converter (DDC) block that can be enabled via an SPI register write. Each ADC channel is followed by a DDC block consisting of three different decimate-by-2 and decimate-by-4 finite impulse response (FIR) half-band filter options. The different decimation filter options can be selected via SPI programming. Figure 59 shows the signal processing done inside the DDC block of the ADS54J20. Default 12-Bit Data (At 1.0 GSPS) Decimate-by-2 Data (At 500 MSPS) LPF 2 BPF 4 Decimate-by-4 Data (At 250 MSPS) Interleaving Engine, Digital Features Ch X 1.0 GSPS Data, x(n) To JESD Encoder 4 LPF Decimate-by-4, I-Data (At 250 MSPS) cos(2 n Œ fmix / fS)(1) sin(2 n Œ fmix / fS)(1) LPF Decimate-by-4 Q-Data (At 250 MSPS) 4 Mode Selection Using DECFIL MODE[3:0] Register Bits Copyright © 2016, Texas Instruments Incorporated (1) In IQ decimate-by-4 mode, the mixer frequency is fixed at fmix = fS / 4. For fS = 1.0 GSPS and fmix = 250 MHz. Figure 59. DDC Block 26 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Feature Description (continued) 8.3.2.1 Decimate-by-2 Filter This decimation filter has 41 taps. The stop-band attenuation is approximately 90 dB and the pass-band flatness is ±0.05 dB. Table 1 shows corner frequencies for the low-pass and high-pass filter options. Table 1. Corner Frequencies for the Decimate-by-2 Filter CORNERS (dB) LOW PASS HIGH PASS –0.1 0.202 × fS 0.298 × fS –0.5 0.210 × fS 0.290 × fS –1 0.215 × fS 0.285 × fS –3 0.227 × fS 0.273 × fS Figure 60 and Figure 61 show the frequency response of the decimate-by-2 filter from dc to fS / 2. 5 0.5 0 -20 Magnitude (dB) Magnitude (dB) -0.5 -45 -70 -1 -1.5 -2 -95 -2.5 -120 -3 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 Frequency Response 0.4 0.45 0.5 0 D013 Figure 60. Decimate-by-2 Filter Response 0.05 0.1 0.15 Frequency Response 0.2 0.25 D014 Figure 61. Decimate-by-2 Filter Response (Zoomed) Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 27 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.3.2.2 Decimate-by-4 Filter Using a Digital Mixer This band-pass decimation filter consists of a digital mixer and three concatenated FIR filters with a combined latency of approximately 28 output clock cycles. The alias-band attenuation is approximately 55 dB and the passband flatness is ±0.1 dB. By default after reset, the band-pass filter is centered at fS / 16. Using the SPI, the center frequency can be programmed at N × fS / 16 (where N = 1, 3, 5, or 7). Table 2 shows corner frequencies for two extreme options. Table 2. Corner frequencies for the Decimate-by-4 Filter CORNERS (dB) CORNER FREQUENCY AT LOWER SIDE (Center Frequency fS / 16) CORNER FREQUENCY AT HIGHER SIDE (Center Frequency fS / 16) –0.1 0.011 × fS 0.114 × fS –0.5 0.010 × fS 0.116 × fS –1 0.008 × fS 0.117 × fS –3 0.006 × fS 0.120 × fS Figure 62 and Figure 63 show the frequency response of the decimate-by-4 filter for center frequencies fS / 16 and 3 × fS / 16 (N = 1 and N = 3, respectively). 10 0.2 0.1 0 0 -0.1 -20 Magnitude (dB) Magnitude (dB) -10 -30 -40 -50 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -60 -0.8 -70 -0.9 -80 -1 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 Frequency Response 0.4 0.45 0.5 0 D015 Figure 62. Decimate-by-4 Filter Response 0.05 0.1 0.15 Frequency Response 0.2 0.25 D016 Figure 63. Decimate-by-4 Filter Response (Zoomed) 8.3.2.3 Decimate-by-4 Filter with IQ Outputs In this configuration, the DDC block includes a fixed digital fS / 4 mixer. Thus, the IQ pass band is approximately ±0.11 fS, centered at fS / 4. This decimation filter has 41 taps with a latency of approximately ten output clock cycles. The stop-band attenuation is approximately 90 dB and the pass-band flatness is ±0.05 dB. Table 3 shows the corner frequencies for a low-pass, decimate-by-4 IQ filter. Table 3. Corner Frequencies for a Decimate-by-4 IQ Output Filter 28 CORNERS (dB) LOW PASS –0.1 0.107 × fS –0.5 0.112 × fS –1 0.115 × fS –3 0.120 × fS Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Figure 64 and Figure 65 show the frequency response of a decimate-by-4 IQ output filter from dc to fS / 2. 5 0.5 0 -20 Magnitude (dB) Magnitude (dB) -0.5 -45 -70 -1 -1.5 -2 -95 -2.5 -120 -3 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 Frequency Response 0.4 0.45 0.5 0 0.025 D011 Figure 64. Decimate-by-4 IQ Output Filter Response 0.05 0.075 Frequency Response 0.1 0.125 D012 Figure 65. Decimate-by-4 IQ Output Filter Response (Zoomed) 8.3.3 SYSREF Signal The SYSREF signal is a periodic signal that is sampled by the ADS54J20 device clock and used to align the boundary of the local multiframe clock inside the data converter. SYSREF is required to be a sub-harmonic of the local multiframe clock (LMFC) internal timing. To meet this requirement, the timing of SYSREF is dependent on the device clock frequency and the LMFC frequency, as determined by the selected DDC decimation and frames per multiframe settings. The SYSREF signal is recommended to be a low-frequency signal in the range of 1 MHz to 5 MHz to reduce coupling to the signal path both on the printed circuit board (PCB) as well as internal to the device. The external SYSREF signal must be a sub-harmonic of the internal LMFC clock, as shown in Equation 1 and Table 4. SYSREF = LMFC / 2N where • N = 0, 1, 2, and so forth (1) Table 4. LMFSC Clock Frequency (1) (2) LMFS CONFIGURATION DECIMATION LMFC CLOCK (1) (2) 4211 — fS / K 4244 — (fS / 4) / K 8224 — (fS / 4) / K 4222 2X (fS / 4) / K 2242 2X (fS / 4) / K 2221 4X (fS / 4) / K 2441 4X (IQ) (fS / 4) / K 4421 4X (IQ) (fS / 4) / K 1241 4X (fS / 4) / K K = Number of frames per multiframe (JESD digital page 6900h, address 06h, bits 4-0). fS = sampling (device) clock frequency. For example, if LMFS = 8224, the default value of K is 8 + 1 = 9 (the actual value for K = the value set in the SPI register + 1). If the device clock frequency is fS = 1.0 GSPS, then the local multiframe clock frequency becomes (1000 / 4) / 9 = 27.778 MHz. The SYSREF signal frequency can be chosen as LMFC frequency / 8 = 3.47222 MHz. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 29 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.3.4 Overrange Indication The ADS54J20 provides a fast overrange indication that can be presented in the digital output data stream via SPI configuration. Alternatively, if not used, the SDOUT (pin 11) and PDN (pin 50) pins can be configured via the SPI to output the fast OVR indicator. The JESD 8b, 10b encoder receives 16-bit data that are formed by 12-bit ADC data padded with four 0s as LSBs. When the FOVR indication is embedded in the output data stream, the LSB of the 16-bit data stream going to the 8b, 10b encoder is replaced, as shown in Figure 66. 16-Bit Data Output (12-Bit ADC Data Padded with Four 0s) D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 D0, OVR 16-Bit Data Going to 8b, 10b Encoder Figure 66. Overrange Indication in a Data Stream 8.3.4.1 Fast OVR The fast OVR is triggered if the input voltage exceeds the programmable overrange threshold and is presented after only seven clock cycles, thus enabling a quicker reaction to an overrange event. The input voltage level that the overload is detected at is referred to as the threshold. The threshold is programmable using the FOVR THRESHOLD bits, as shown in Figure 67. The FOVR is triggered seven output clock cycles after the overload condition occurs. 0 FOVR Threshold (dBFS) -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 0 32 64 96 128 160 192 Threshold Decimal Value 224 255 D055 Figure 67. Programming Fast OVR Thresholds The input voltage level that the fast OVR is triggered at is defined by Equation 2: Full-Scale × [Decimal Value of the FOVR Threshold Bits] / 255) (2) The default threshold is E3h (227d), corresponding to a threshold of –1 dBFS. In terms of full-scale input, the fast OVR threshold can be calculated as Equation 3: 20log (FOVR Threshold / 255) 30 (3) Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.3.5 Power-Down Mode The ADS54J20 provides a highly-configurable power-down mode. Power-down can be enabled using the PDN pin or SPI register writes. A power-down mask can be configured that allows a trade-off between wake-up time and power consumption in power-down mode. Two independent power-down masks can be configured: MASK 1 and MASK 2, as shown in Table 5. See the master page registers in Table 14 for further details. Table 5. Register Addresses for Power-Down Modes REGISTER ADDRESS REGISTER DATA COMMENT A[7:0] (Hex) 7 6 5 4 3 2 0 0 1 0 MASTER PAGE (80h) 20 21 23 24 MASK 1 MASK 2 PDN ADC CHA PDN BUFFER CHB PDN ADC CHA PDN BUFFER CHB 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PDN MASK 0 0 0 0 OVERRIDE PDN PIN PDN MASK SEL 53 0 MASK SYSREF 55 0 0 CONFIG 0 PDN ADC CHB PDN BUFFER CHA GLOBAL PDN 26 PDN ADC CHB PDN BUFFER CHA To save power, the device can be put in complete power-down by using the GLOBAL PDN register bit. However, when JESD is required to remain active when putting the device in power-down, the ADC and analog buffer can be powered down by using the PDN ADC CHx and PDN BUFFER CHx register bits after enabling the PDN MASK register bit. The PDN MASK SEL register bit can be used to select between MASK 1 or MASK 2. Table 6 shows the power consumption for different combinations of the GLOBAL PDN, PDN ADC CHx, and PDN BUFF CHx register bits. Table 6. Power Consumption in Different Power-Down Settings REGISTER BIT COMMENT IAVDD3V (mA) IAVDD (mA) IDVDD (mA) IIOVDD (mA) TOTAL POWER (W) Default After reset, with a full-scale input signal to both channels 247 260 137 382 1.94 GBL PDN = 1 The device is in a complete power-down state 3 6 23 192 0.28 GBL PDN = 0, PDN ADC CHx = 1 (x = A or B) The ADC of one channel is powered down 206 166 97 367 1.54 GBL PDN = 0, PDN BUFF CHx = 1 (x = A or B) The input buffer of one channel is powered down 195 258 137 381 1.78 GBL PDN = 0, PDN ADC CHx = 1, PDN BUFF CHx = 1 (x = A or B) The ADC and input buffer of one channel are powered down 152 166 97 363 1.37 GBL PDN = 0, PDN ADC CHx = 1, PDN BUFF CHx = 1 (x = A and B) The ADC and input buffer of both channels are powered down 55 70 56 356 0.81 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 31 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.4 Device Functional Modes 8.4.1 Device Configuration The ADS54J20 can be configured by using a serial programming interface, as described in the Serial Interface section. In addition, the device has one dedicated parallel pin (PDN) for controlling the power-down mode. The ADS54J20 supports a 24-bit (16-bit address, 8-bit data) SPI operation and uses paging (see the Register Maps section) to access all register bits. 8.4.1.1 Serial Interface The ADC has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock), and SDIN (serial interface data) pins, as shown in Figure 68. SPI bits in Figure 68 are explained in Table 7. Serially shifting bits into the device is enabled when SEN is low. Serial data on SDIN are latched at every SCLK rising edge when SEN is active (low). The interface can function with SCLK frequencies from 2 MHz down to very low speeds (of a few hertz) and also with a non-50% SCLK duty cycle. Register Address[11:0] SDIN R/W M P CH A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 tDH tSCLK tDSU SCLK tSLOADS tSLOADH SEN RESET Figure 68. SPI Timing Diagram Table 7. SPI Timing Diagram Legend SPI BITS BIT SETTINGS Read/write bit 0 = SPI write 1 = SPI read back M SPI bank access 0 = Analog SPI bank (master and ADC pages) 1 = JESD SPI bank (main digital, JESD analog, and JESD digital pages) P JESD page selection bit 0 = Page access 1 = Register access SPI access for a specific channel of the JESD SPI bank 0 = Channel A 1 = Channel B By default, both channels are being addressed. A[11:0] SPI address bits — D[7:0] SPI data bits — R/W CH 32 DESCRIPTION Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Table 8 shows the timing requirements for the serial interface signals in Figure 68. Table 8. SPI Timing Requirements MIN TYP MAX UNIT 2 MHz fSCLK SCLK frequency (equal to 1 / tSCLK) > dc tSLOADS SEN to SCLK setup time 100 ns tSLOADH SCLK to SEN hold time 100 ns tDSU SDIN setup time 100 ns tDH SDIN hold time 100 ns 8.4.1.2 Serial Register Write: Analog Bank The analog SPI bank contains two pages (the master and ADC pages). The internal register of the ADS54J20 analog SPI bank can be programmed by: 1. Driving the SEN pin low. 2. Initiating a serial interface cycle specifying the page address of the register whose content must be written. – Master page: write address 0011h with 80h. – ADC page: write address 0011h with 0Fh. 3. Writing the register content as shown in Figure 69. When a page is selected, multiple writes into the same page can be done. SDIN 0 0 0 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 69. Serial Register Write Timing Diagram Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 33 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.4.1.3 Serial Register Readout: Analog Bank The content from one of the two analog banks can be read out by: 1. Driving the SEN pin low. 2. Selecting the page address of the register whose content must be read. – Master page: write address 0011h with 80h. – ADC page: write address 0011h with 0Fh. 3. Setting the R/W bit to 1 and writing the address to be read back. 4. Reading back the register content on the SDOUT pin, as shown in Figure 70. When a page is selected, multiple read backs from the same page can be done. SDIN 1 0 0 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] = XX A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET SDOUT SDOUT[7:0] Figure 70. Serial Register Read Timing Diagram 8.4.1.4 JESD Bank SPI Page Selection The JESD SPI bank contains three pages (main digital, JESD digital, and JESD analog pages). The individual pages can be selected by: 1. Driving the SEN pin low. 2. Setting the M bit to 1 and specifying the page with two register writes. Note that the P bit must be set to 0, as shown in Figure 71. – Write address 4003h with 00h (LSB byte of the page address). – Write address 4004h with the MSB byte of the page address. – For the main digital page: write address 4004h with 68h. – For the JESD digital page: write address 4004h with 69h. – For the JESD analog page: write address 4004h with 6Ah. SDIN 0 1 0 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 71. SPI Page Selection 34 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.4.1.5 Serial Register Write: JESD Bank The ADS54J20 is a dual-channel device and the JESD204B portion is configured individually for each channel by using the CH bit. Note that the P bit must be set to 1 for register writes. 1. Drive the SEN pin low. 2. Select the JESD bank page. Note that the M bit = 1 and the P bit = 0. – Write address 4003h with 00h. – Write address 4005h with 01h to enable separate control for both channels. – For the main digital page: write address 4004h with 68h. – For the JESD digital page: write address 4004h with 69h. – For the JESD analog page: write address 4004h with 6Ah. 3. Set the M and P bits to 1, select channel A (CH = 0) or channel B (CH = 1), and write the register content as shown in Figure 72. When a page is selected, multiple writes into the same page can be done. SDIN 0 1 1 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 72. JESD Serial Register Write Timing Diagram 8.4.1.5.1 Individual Channel Programming By default, register writes are applied to both channels. To enable individual channel writes, write address 4005h with 01h (default is 00h). 8.4.1.6 Serial Register Readout: JESD Bank The content from one of the pages of the JESD bank can be read out by: 1. Driving the SEN pin low. 2. Selecting the JESD bank page. Note that the M bit = 1 and the P bit = 0. – Write address 4003h with 00h. – Write address 4005h with 01h to enable separate control for both channels. – For the main digital page: write address 4004h with 68h. – For the JESD digital page: write address 4004h with 69h. – For the JESD analog page: write address 4004h with 6Ah. 3. Setting the R/W, M, and P bits to 1, selecting channel A or channel B, and writing the address to be read back. 4. Reading back the register content on the SDOUT pin; see Figure 73. When a page is selected, multiple read backs from the same page can be done. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 35 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 SDIN 1 1 1 0 R/W M P CH www.ti.com Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] = XX A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET SDOUT SDOUT[7:0] Figure 73. JESD Serial Register Read Timing Diagram 8.4.2 JESD204B Interface The ADS54J20 supports device subclass 1 with a maximum output data rate of 6.25 Gbps for each serial transmitter. An external SYSREF signal is used to align all internal clock phases and the local multiframe clock to a specific sampling clock edge, allowing synchronization of multiple devices in a system and minimizing timing and alignment uncertainty. The SYNC input is used to control the JESD204B SerDes blocks. Depending on the ADC output data rate, the JESD204B output interface can be operated with either two or four lanes per single ADC, as shown in Figure 74. The JESD204B setup and configuration of the frame assembly parameters is controlled via the SPI interface. SYSREF SYNC INA JESD204B JESD204B DA[3:0] INB JESD204B JESD204B DB[3:0] Sample Clock Figure 74. ADS54J20 Block Diagram 36 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 The JESD204B transmitter block shown in Figure 75 consists of the transport layer, the data scrambler, and the link layer. The transport layer maps the ADC output data into the selected JESD204B frame data format. The link layer performs the 8b, 10b data encoding as well as the synchronization and initial lane alignment using the SYNC input signal. Optionally, data from the transport layer can be scrambled. JESD204B Block Transport Layer Link Layer 8b, 10b Encoding Frame Data Mapping Scrambler 1 + x14 + x15 D[3:0] Comma Characters, Initial Lane Alignment SYNC Figure 75. JESD204B Transmitter Block 8.4.2.1 JESD204B Initial Lane Alignment (ILA) The initial lane alignment process is started when the receiving device deasserts the SYNC signal, as shown in Figure 76. When a logic low is detected on the SYNC input pin, the ADS54J20 starts transmitting comma (K28.5) characters to establish a code group synchronization. When synchronization is complete, the receiving device asserts the SYNC signal and the ADS54J20 starts the initial lane alignment sequence with the next local multiframe clock boundary. The ADS54J20 transmits four multiframes, each containing K frames (K is SPI programmable). Each of the multiframes contains the frame start and end symbols and the second multiframe also contains the JESD204 link configuration data. SYSREF LMFC Clock LMFC Boundary Multi Frame SYNC Transmit Data xxx K28.5 Code Group Synchronization K28.5 ILA Initial Lane Alignment ILA DATA DATA Data Transmission Figure 76. Lane Alignment Sequence Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 37 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.4.2.2 JESD204B Test Patterns There are three different test patterns available in the transport layer of the JESD204B interface. The ADS54J20 supports a clock output, encoded, and a PRBS (215 – 1) pattern. These test patterns can be enabled via an SPI register write and are located in the JESD digital page of the JESD bank. 8.4.2.3 JESD204B Frame The JESD204B standard defines the following parameters: • L is the number of lanes per link. • M is the number of converters per device. • F is the number of octets per frame clock period, per lane. • S is the number of samples per frame per converter. 8.4.2.4 JESD204B Frame Table 9 lists the available JESD204B formats and valid ranges for the ADS54J20 when the decimation filter is not used. The ranges are limited by the SerDes lane rate and the maximum ADC sample frequency. NOTE The 16-bit data going to the JESD 8b, 10b encoder are formed by padding four 0s as LSBs into the 12-bit ADC data. Table 9. Default Interface Rates MINIMUM RATES MAXIMUM RATES L M F S DECIMATION SAMPLING RATE (MSPS) SERDES BIT RATE (Gbps) SAMPLING RATE (MSPS) SERDES BIT RATE (Gbps) 4 2 1 1 Not used 250 2.5 1000 10.0 4 2 4 4 Not used 250 2.5 1000 10.0 8 2 2 4 Not used 500 2.5 1000 5.0 NOTE In the LMFS = 8224 row of Table 10, the sample order on the lanes is DA2, DA3, DA1, and DA0 for channel A. Similarly for channel B, the sample order on the lanes is DB2, DB3, DB1, and DB0. The detailed frame assembly is shown in Table 10. Table 10. Default Frame Assembly (1) OUTPUT LANE LMFS = 4211 LMFS = 4244 LMFS = 8224 DA0 A3[11:4] A3[3:0], 0000 DA1 A0[3:0], 0000 A2[11:4] A2[3:0], 0000 A3[11:4] A3[3:0], 0000 A2[11:4] A2[3:0], 0000 DA2 A0[11:4] A0[11:4] A0[3:0], 0000 A1[11:4] A1[3:0], 0000 A0[11:4] A0[3:0], 0000 DA3 A1[11:4] A1[3:0], 0000 DB0 B3[11:4] B3[3:0], 0000 DB1 B0[3:0], 0000 B2[11:4] B2[3:0], 0000 B3[11:4] B3[3:0], 0000 B2[11:4] B2[3:0], 0000 DB2 B0[11:4] B0[11:4] B0[3:0], 0000 B1[11:4] B1[3:0], 0000 B0[11:4] B0[3:0], 0000 B1[11:4] B1[3:0], 0000 DB3 (1) 38 Blue shading indicates channel A and yellow shading indicates channel B. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.4.2.5 JESD204B Frame Assembly with Decimation Table 11 lists the available JESD204B formats and valid ranges for the ADS54J20 when enabling the decimation filter. The ranges are limited by the SerDes lane rate (2.5 Gbps to 10.0 Gbps) and the ADC sample frequency (300 MSPS to 1000 MSPS). Table 11. Interface Rates with Decimation Filter MINIMUM RATES DEVICE CLOCK FREQUENCY (MSPS) OUTPUT SAMPLE RATE (MSPS) MAXIMUM RATES SERDES BIT RATE (Gbps) DEVICE CLOCK FREQUENCY (MSPS) OUTPUT SAMPLE RATE (MSPS) SERDES BIT RATE (Gbps) 5 L M F S DECIMATION 4 4 2 1 4X (IQ) 500 125 2.5 1000 250 4 2 2 2 2X 500 250 2.5 1000 500 5 2 2 4 2 2X 300 150 3 1000 500 10 2 2 2 1 4X 500 125 2.5 1000 250 5 2 4 4 1 4X (IQ) 300 75 3 1000 250 10 1 2 4 1 4X 300 75 3 1000 250 10 Table 12 lists the detailed frame assembly with different decimation options. Table 12. Frame Assembly with Decimation Filter (1) OUTPUT LANE LMFS = 4222, 2X DECIMATION DA0 A1 [11:4] A1 [3:0], 0000 DA1 A0 [11:4] A0 [3:0], 0000 DB0 B1 [11:4] B1 [3:0], 0000 DB1 B0 [11:4] B0 [3:0], 0000 LMFS = 2242, 2X DECIMATION A0 [11:4] A0 [3:0], 0000 A1 [11:4] LMFS = 2221, 4X DECIMATION A1 [3:0], 0000 A0 [11:4] A0 [3:0], 0000 LMFS = 2441, 4X DECIMATION (IQ) AI0 [11:4] AI0 [3:0], 0000 AQ0 [11:4] LMFS = 4421, 4X DECIMATION (IQ) AQ0 [3:0], 0000 AQ0 [11:4] AQ0 [3:0], 0000 AI0 [11:4] AI0 [3:0], 0000 BQ0 [11:4] BQ0 [3:0], 0000 BI0 [11:4] BI0 [3:0], 0000 LMFS = 1241, 4X DECIMATION A0 [11:4] A0 [3:0], 0000 B0 [11:4] B0 [3:0], 0000 DA2 DA3 B0 [11:4] B0 [3:0], 0000 B1 [11:4] B1 [3:0], 0000 B0 [11:4] B0 [3:0], 0000 BI0 [11:4] BI0 [3:0], 0000 BQ0 [11:4] BQ0 [3:0], 0000 DB2 DB3 (1) Blue shading indicates channel A and yellow shading indicates channel B. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 39 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Appropriate register bits must be programmed to enable different options when the decimation filter is enabled. Table 13 summarizes all the decimation filter options available in the DDC block, the corresponding JESD link parameters (L, M, F, and S), and the register bits required to be programmed for each option. Table 13. Program Summary of DDC Modes and JESD Link Configuration (1) (2) LMFS OPTIONS DDC MODES PROGRAMMING DEC MODE EN, DECFIL EN (3) JESD LINK (LMFS) PROGRAMMING L M F S DECIMATION OPTIONS 4 2 1 1 No decimation 00 00 000 100 10 0 00h 00h 0 0 4 2 4 4 No decimation 00 00 000 010 10 0 00h 00h 0 0 00 00 000 001 00 0 00h 00h 0 0 DECFIL MODE[3:0] (4) JESD FILTER (5) JESD MODE (6) JESD PLL MODE (7) LANE SHARE (8) DA_BUS_ REORDER (9) DB_BUS_ REORDER (10) BUS_REORDER EN1 (11) BUS_REORDER EN2 (12) 8 2 2 4 No decimation (Default after reset) 4 4 2 1 4X (IQ) 11 0011 (LPF with fS / 4 mixer) 111 001 00 0 0Ah 0Ah 1 1 4 2 2 2 2X 11 0010 (LPF) or 0110 (HPF) 110 001 00 0 0Ah 0Ah 1 1 2 2 4 2 2X 11 0010 (LPF) or 0110 (HPF) 110 010 10 0 0Ah 0Ah 1 1 100 001 00 0 0Ah 0Ah 1 1 2 2 2 1 4X 11 0000, 0100, 1000, or 1100 (all BPFs with different center frequencies). 2 4 4 1 4X (IQ) 11 0011 (LPF with an fS / 4 mixer) 111 010 10 0 0Ah 0Ah 1 1 1 2 4 1 4X 11 0000, 0100, 1000, or 1100 (all BPFs with different center frequencies) 100 010 10 1 0Ah 0Ah 1 1 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) 40 Keeping the same LMFS settings for both channels is recommended. The PULSE RESET register bit must be pulsed after the registers in the main digital page are programmed. The DEC MODE EN and DECFIL EN register bits are located in the main digital page, register 04Dh (bit 3) and register 041h (bit 4). The DECFIL MODE[3:0] register bits are located in the main digital page, register 041h (bits 5 and 2-0). The JESD FILTER register bits are located in the JESD digital page, register 001h (bits 5-3). The JESD MODE register bits are located in the JESD digital page, register 001h (bits 2-0). The JESD PLL MODE register bits are located in the JESD analog page, register 016h (bits 1-0). The LANE SHARE register bit is located in the JESD digital page, register 016h (bit 4). The DA_BUS_REORDER register bits are located in the JESD digital page, register 031h (bits 7-0). The DB_BUS_REORDER register bits are located in the JESD digital page, register 032h (bits 7-0). The BUS_REORDER EN1 register bit is located in the main digital page, register 052h (bit 7). The BUS_REORDER EN2 register bit is located in the main digital page, register 072h (bit 3). Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.4.2.5.1 JESD Transmitter Interface Each of the 6.25-Gbps SerDes JESD transmitter outputs require ac-coupling between the transmitter and receiver. The differential pair must be terminated with 100-Ω resistors as close to the receiving device as possible to avoid unwanted reflections and signal degradation, as shown in Figure 77. 0.1 PF DA[3:0]P, DB[3:0]P R t = ZO Transmission Line, Zo VCM Receiver R t = ZO DA[3:0]M, DB[3:0]M 0.1 PF Figure 77. Output Connection to Receiver Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 41 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.4.2.5.2 Eye Diagrams Figure 78 to Figure 81 show the serial output eye diagrams of the ADS54J20 at 5.0 Gbps and 10 Gbps with default and increased output voltage swing against the JESD204B mask. 42 Figure 78. Eye Diagram at 5-Gbps Bit Rate with Default Output Swing Figure 79. Eye Diagram at 5-Gbps Bit Rate with Increased Output Swing Figure 80. Eye Diagram at 10-Gbps Bit Rate with Default Output Swing Figure 81. Eye Diagram at 10-Gbps Bit Rate with Increased Output Swing Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5 Register Maps Figure 82 shows a conceptual diagram of the serial registers. Initiate an SPI Cycle R/W, M, P, CH, Bits Decoder M=0 M=1 Analog Bank JESD Bank General Register (Address 00h, Keep M = 0, P = 0) Analog Bank Page Selection (Address 011h, Keep M = 0, P = 0) Value 80h Addr 20h Keep M = 0, P = 0 Addr 59h Value 6800h Value 0Fh Addr 0h Addr 5Fh Master Page (PDN, OVR, DC Coupling) JESD Bank Page Selection (Address 003h and Address 004h, Keep M = 1, P = 0) General Register (Address 005h, Keep M = 1, P = 0) Keep M = 0, P = 0 Addr F7h Value 6A00h Value 6900h Addr 0h Main Digital Page ADC Page (Fast OVR) Unused Registers (Address 01h, Address 02h. Keep M = 1, P = 0) Addr 12h (Nyquist Zone, Gain, OVR, Filter) (JESD Configuration) JESD Analog Page (PLL Configuration, Output Swing, Pre-Emphasis) Keep M = 1, P=1 Keep M = 1, P=1 Keep M = 1, P=1 JESD Digital Page Addr 32h Addr 1Bh Figure 82. Serial Interface Registers Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 43 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.1 Detailed Register Information The ADS54J20 contains two main SPI banks. The analog SPI bank provides access to the ADC analog blocks and the digital SPI bank controls the interleaving engine and anything related to the JESD204B serial interface. The analog SPI bank is divided into two pages (master and ADC) and the digital SPI bank is divided into three pages (main digital, JESD digital, and JESD analog). Table 14 lists a register map for the ADS54J20. Table 14. Register Map REGISTER ADDRESS REGISTER DATA A[11:0] (Hex) 7 6 5 RESET 0 0 4 3 2 1 0 0 0 0 0 RESET 0 0 DISABLE BROADCAST 0 0 GENERAL REGISTERS 0 3 JESD BANK PAGE SEL[7:0] 4 JESD BANK PAGE SEL[15:8] 5 0 0 0 11 0 0 ANALOG BANK PAGE SEL MASTER PAGE (80h) 20 21 PDN ADC CHA PDN BUFFER CHB 23 24 PDN ADC CHB PDN BUFFER CHA 0 0 PDN ADC CHA PDN BUFFER CHB PDN ADC CHB PDN BUFFER CHA PDN MASK SEL 0 0 0 0 0 0 0 0 0 0 26 GLOBAL PDN OVERRIDE PDN PIN 39 HIGH FREQ 1 HIGH FREQ 0 0 0 0 0 0 3A 0 HIGH FREQ 2 0 0 0 0 0 0 4F 0 0 0 0 0 0 0 EN INPUT DC COUPLING 53 0 MASK SYSREF 0 0 0 0 EN SYSREF DC COUPLING 0 55 0 0 0 PDN MASK 0 0 0 0 56 0 0 0 0 0 HIGH FREQ 3 0 0 0 ALWAYS WRITE 1 0 0 0 0 0 0 0 PULSE RESET 59 FOVR CHB ADC PAGE (0Fh) 5F FOVR THRESHOLD PROG MAIN DIGITAL PAGE (6800h) 0 44 0 0 0 0 0 DECFIL EN 0 41 0 0 DECFIL MODE[3] 42 0 0 0 0 0 43 0 0 0 0 0 44 0 DECFIL MODE[2:0] NYQUIST ZONE 0 0 FORMAT SEL DIGITAL GAIN 4B 0 0 FORMAT EN 0 0 0 0 0 4D 0 0 0 0 DEC MODE EN 0 0 0 4E CTRL NYQUIST 0 0 0 0 0 0 0 52 BUS_ REORDER EN1 0 0 0 0 0 0 DIG GAIN EN 72 0 0 0 0 BUS_ REORDER EN2 0 0 0 0 AB 0 0 0 0 0 0 AD 0 0 0 0 0 0 F7 0 0 0 0 0 0 Submit Documentation Feedback LSB SEL EN LSB SELECT 0 DIG RESET Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Table 14. Register Map (continued) REGISTER ADDRESS A[11:0] (Hex) REGISTER DATA 7 6 5 4 3 2 1 0 0 TESTMODE EN FLIP ADC DATA LANE ALIGN FRAME ALIGN TX LINK DIS JESD DIGITAL PAGE (6900h) 0 CTRL K 0 1 SYNC REG SYNC REG EN JESD FILTER LINK LAYER TESTMODE LINK LAYER RPAT 2 3 FORCE LMFC COUNT 5 SCRAMBLE EN 0 0 6 0 0 0 7 0 0 16 1 0 JESD MODE LMFC MASK RESET 0 LMFC COUNT INIT 0 0 RELEASE ILANE SEQ 0 0 0 0 0 SUBCLASS 0 LANE SHARE 0 0 0 0 0 0 0 0 0 FRAMES PER MULTI FRAME (K) 31 DA_BUS_REORDER[7:0] 32 DB_BUS_REORDER[7:0] JESD ANALOG PAGE (6A00h) 12 SEL EMP LANE 1 0 0 13 SEL EMP LANE 0 0 0 14 SEL EMP LANE 2 0 0 15 SEL EMP LANE 3 0 0 16 0 0 0 0 0 0 17 0 PLL RESET 0 0 0 0 0 0 1A 0 0 0 0 0 0 FOVR CHA 0 0 FOVR CHA EN 0 0 0 1B JESD SWING JESD PLL MODE Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 45 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.2 Example Register Writes This section provides three different example register writes. Table 15 describes a global power-down register write, Table 16 describes the register writes when the default lane setting (eight active lanes per device) is changed to four active lanes (LMFS = 4211), and Table 17 describes the register writes for 2X decimation with four active lanes (LMFS = 4222). Table 15. Global Power Down ADDRESS (Hex) DATA (Hex) 0-011h 80h Set the master page COMMENT 0-026h C0h Set the global power-down Table 16. Two Lanes per Channel Mode (LMFS = 4211) ADDRESS (Hex) DATA (Hex) 4-004h 69h Select the JESD digital page COMMENT 4-003h 00h Select the JESD digital page 6-001h 02h Select the digital to 40X mode 4-004h 6Ah Select the JESD analog page 6-016h 02h Set the SerDes PLL to 40X mode Table 17. 2X Decimation (LPF for Both Channels) with Four Active Lanes (LMFS = 4222) ADDRESS (Hex) DATA (Hex) 4-004h 68h Select the main digital page (6800h) 4-003h 00h Select the main digital page (6800h) 6-041h 12h Set decimate-by-2 (low-pass filter) 6-04Dh 08h Enable decimation filter control 6-072h 08h BUS_REORDER EN2 6-052h 80h BUS_REORDER EN1 6-000h 01h 6-000h 00h 4-004h 69h Select the JESD digital page (6900h) 4-003h 00h Select the JESD digital page (6900h) 6-031h 0Ah Output bus reorder for channel A 6-032h 0Ah Output bus reorder for channel B 6-001h 31h Program the JESD MODE and JESD FILTER register bits for LMFS = 4222. 46 COMMENT Pulse the PULSE RESET bit (so that register writes to the main digital page go into effect). Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3 Register Descriptions 8.5.3.1 General Registers 8.5.3.1.1 Register 0h (address = 0h) Figure 83. Register 0h 7 RESET W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 RESET W-0h LEGEND: W = Write only; -n = value after reset Table 18. Register 0h Field Descriptions Bit 7 6-1 0 Field Type Reset Description RESET W 0h 0 = Normal operation 1 = Internal software reset, clears back to 0 0 W 0h Must write 0 RESET W 0h 0 = Normal operation 1 = Internal software reset, clears back to 0 8.5.3.1.2 Register 3h (address = 3h) Figure 84. Register 3h 7 6 5 4 3 JESD BANK PAGE SEL[7:0] R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 19. Register 3h Field Descriptions Bit Field Type Reset Description 7-0 JESD BANK PAGE SEL[7:0] R/W 0h Program these bits to access the desired page in the JESD bank. 6800h = Main digital page selected 6900h = JESD digital page selected 6A00h = JESD analog page selected 8.5.3.1.3 Register 4h (address = 4h) Figure 85. Register 4h 7 6 5 4 3 JESD BANK PAGE SEL[15:8] R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 20. Register 4h Field Descriptions Bit Field Type Reset Description 7-0 JESD BANK PAGE SEL[15:8] R/W 0h Program these bits to access the desired page in the JESD bank. 6800h = Main digital page selected 6900h = JESD digital page selected 6A00h = JESD analog page selected Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 47 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.1.4 Register 5h (address = 5h) Figure 86. Register 5h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 DISABLE BROADCAST R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 21. Register 5h Field Descriptions Bit Field Type Reset Description 7-1 0 W 0h Must write 0 DISABLE BROADCAST R/W 0h 0 = Normal operation; channel A and B are programmed as a pair 1 = Channel A and B can be individually programmed based on the CH bit 0 8.5.3.1.5 Register 11h (address = 11h) Figure 87. Register 11h 7 6 5 4 3 ANALOG PAGE SELECTION R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 22. Register 11h Field Descriptions Bit Field Type Reset Description 7-0 ANALOG BANK PAGE SEL R/W 0h Program these bits to access the desired page in the analog bank. Master page = 80h ADC page = 0Fh 8.5.3.2 Master Page (080h) Registers 8.5.3.2.1 Register 20h (address = 20h), Master Page (080h) Figure 88. Register 20h 7 6 5 4 3 PDN ADC CHA R/W-0h 2 1 0 PDN ADC CHB R/W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 23. Registers 20h Field Descriptions 48 Bit Field Type Reset Description 7-4 PDN ADC CHA R/W 0h 3-0 PDN ADC CHB R/W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register bit 5 in address 26h. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.2.2 Register 21h (address = 21h), Master Page (080h) Figure 89. Register 21h 7 6 PDN BUFFER CHB R/W-0h 5 4 PDN BUFFER CHA R/W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 24. Register 21h Field Descriptions Bit Field Type Reset Description 7-6 PDN BUFFER CHB R/W 0h 5-4 PDN BUFFER CHA R/W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register address 26h, bit 5. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. 3-0 0 W 0h Must write 0. 8.5.3.2.3 Register 23h (address = 23h), Master Page (080h) Figure 90. Register 23h 7 6 5 4 3 2 PDN ADC CHA R/W-0h 1 0 PDN ADC CHB R/W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 25. Register 23h Field Descriptions Bit Field Type Reset Description 7-4 PDN ADC CHA R/W 0h 3-0 PDN ADC CHB R/W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register address 26h, bit 5. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. 8.5.3.2.4 Register 24h (address = 24h), Master Page (080h) Figure 91. Register 24h 7 6 PDN BUFFER CHB R/W-0h 5 4 PDN BUFFER CHA R/W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 26. Register 24h Field Descriptions Bit Field Type Reset Description 7-6 PDN BUFFER CHB R/W 0h 5-4 PDN BUFFER CHA R/W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register address 26h, bit 5. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. 3-0 0 W 0h Must write 0. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 49 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.2.5 Register 26h (address = 26h), Master Page (080h) Figure 92. Register 26h 7 GLOBAL PDN R/W-0h 6 OVERRIDE PDN PIN R/W-0h 5 PDN MASK SEL R/W-0h 4 3 2 1 0 0 0 0 0 0 W-0h W-0h W-0h W-0h W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 27. Register 26h Field Descriptions Bit Field Type Reset Description 7 GLOBAL PDN R/W 0h Bit 6 (OVERRIDE PDN PIN) must be set before this bit can be programmed. 0 = Normal operation 1 = Global power-down via the SPI 6 OVERRIDE PDN PIN R/W 0h This bit ignores the power-down pin control. 0 = Normal operation 1 = Ignores inputs on the power-down pin 5 PDN MASK SEL R/W 0h This bit selects power-down mask 1 or mask 2. 0 = Power-down mask 1 1 = Power-down mask 2 0 W 0h Must write 0 4-0 8.5.3.2.6 Register 39h (address = 39h), Master Page (080h) Figure 93. Register 39h 7 HIGH FREQ 1 R/W-0h 6 HIGH FREQ 0 R/W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 28. Register 39h Field Descriptions Bit Field Type Reset Description 7 HIGH FREQ 1 R/W 0h 6 HIGH FREQ 0 R/W 0h Set these bits (and the HIGH FREQ[3:2] bits) high when the input frequency > 400 MHz. 0 W 0h 5-0 Must write 0 8.5.3.2.7 Register 3Ah (address = 3Ah), Master Page (080h) Figure 94. Register 3Ah 7 0 W-0h 6 HIGH FREQ 2 R/W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 29. Register 3Ah Field Descriptions Bit Field Type Reset Description 7 0 W 0h Must write 0 6 HIGH FREQ 2 R/W 0h Set this bit (and the HIGH FREQ 3 and HIGH FREQ[1:0] bits) high when the input frequency > 400 MHz. 0 W 0h Must write 0 5-0 50 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.2.8 Register 4Fh (address = 4Fh), Master Page (080h) Figure 95. Register 4Fh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 EN INPUT DC COUPLING R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 30. Register 4Fh Field Descriptions Bit Field Type Reset Description 7-1 0 W 0h Must write 0 EN INPUT DC COUPLING R/W 0h This bit enables dc-coupling between the analog inputs and the driver by changing the internal biasing resistor between the analog inputs and VCM from 600 Ω to 5 kΩ. 0 = The dc-coupling support is disabled 1 = The dc-coupling support is enabled 0 8.5.3.2.9 Register 53h (address = 53h), Master Page (080h) Figure 96. Register 53h 7 6 MASK SYSREF R/W-0h 0 W-0h 5 4 3 2 0 0 0 0 W-0h W-0h W-0h W-0h 1 EN SYSREF DC COUPLING R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 31. Register 53h Field Descriptions Bit Field Type Reset Description 7 0 W 0h Must write 0 6 MASK SYSREF R/W 0h 0 = Normal operation 1 = Ignores the SYSREF input 5-2 0 W 0h Must write 0 1 EN SYSREF DC COUPLING R/W 0h This bit enables a higher common-mode voltage input on the SYSREF signal (up to 1.6 V). 0 = Normal operation 1 = Enables a higher SYSREF common-mode voltage support 0 0 W 0h Must write 0 8.5.3.2.10 Register 55h (address = 55h), Master Page (080h) Figure 97. Register 55h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 PDN MASK R/W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 32. Register 55h Field Descriptions Bit Field Type Reset Description 7-5 0 W 0h Must write 0 PDN MASK R/W 0h This bit enables power-down via a register bit. 0 = Normal operation 1 = Power-down is enabled by powering down the internal blocks as specified in the selected power-down mask 0 W 0h Must write 0 4 3-0 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 51 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.2.11 Register 56h (address = 56h), Master Page (080h) Figure 98. Register 56h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 HIGH FREQ 3 R/W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 33. Register 56h Field Descriptions Bit Field Type Reset Description 7-3 0 W 0h Must write 0 HIGH FREQ 3 R/W 0h Set this bit (and the HIGH FREQ[2:0] bits) high when the input frequency > 400 MHz. 0 W 0h Must write 0 2 1-0 8.5.3.2.12 Register 59h (address = 59h), Master Page (080h) Figure 99. Register 59h 7 FOVR CHB W-0h 6 0 W-0h 5 ALWAYS WRITE 1 R/W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 34. Register 59h Field Descriptions Bit Field Type Reset Description 7 FOVR CHB W 0h This bit outputs the FOVR signal for channel B on the SDOUT pin. 0 = Normal operation 1 = The FOVR signal is available on the SDOUT pin 6 0 W 0h Must write 0 5 ALWAYS WRITE 1 R/W 0h Must write 1 0 W 0h Must write 0 4-0 8.5.3.3 ADC Page (0Fh) Register 8.5.3.3.1 Register 5F (addresses = 5F), ADC Page (0Fh) Figure 100. Register 5F 7 6 5 4 3 FOVR THRESHOLD PROG R/W-E3h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 35. Register 5F Field Descriptions 52 Bit Field Type Reset Description 7-0 FOVR THRESHOLD PROG R/W E3h Program the fast OVR thresholds together for channel A and B, as described in the Overrange Indication section. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.4 Main Digital Page (6800h) Registers 8.5.3.4.1 Register 0h (address = 0h), Main Digital Page (6800h) Figure 101. Register 0h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 PULSE RESET R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 36. Register 0h Field Descriptions Bit Field Type Reset Description 7-1 0 W 0h Must write 0 PULSE RESET R/W 0h This bit must be pulsed after power-up or after configuring registers in the main digital page of the JESD bank. Any register bits in the main digital page (6800h) take effect only after this bit is pulsed; see the Start-Up Sequence section for the correct sequence. 0 = Normal operation 0 → 1 → 0 = This bit is pulsed 0 8.5.3.4.2 Register 41h (address = 41h), Main Digital Page (6800h) Figure 102. Register 41h 7 0 W-0h 6 0 W-0h 5 DECFIL MODE[3] R/W-0h 4 DECFIL EN R/W-0h 3 0 W-0h 2 1 DECFIL MODE[2:0] R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 37. Register 41h Field Descriptions Bit Field Type Reset Description 7-6 0 W 0h Must write 0 5 DECFIL MODE[3] R/W 0h This bit selects the decimation filter mode. Table 38 lists the bit settings. The decimation filter control (DEC MODE EN, register 4Dh, bit 3) and decimation filter enable (DECFIL EN, register 41h, bit 4) must be enabled. 4 DECFIL EN R/W 0h This bit enables the digital decimation filter. 0 = Normal operation, full rate output 1 = Digital decimation enabled 3 0 W 0h Must write 0 DECFIL MODE[2:0] R/W 0h These bits select the decimation filter mode. Table 38 lists the bit settings. The decimation filter control (DEC MODE EN, register 4Dh, bit 3) and decimation filter enable (DECFIL EN, register 41h, bit 4) must be enabled. 2-0 Table 38. DECFIL MODE Bit Settings BITS (5, 2-0) FILTER MODE DECIMATION 0000 Band-pass filter centered on 3 × fS / 16 4X 0100 Band-pass filter centered on 5 × fS / 16 4X 1000 Band-pass filter centered on 1 × fS / 16 4X 1100 Band-pass filter centered on 7 × fS / 16 4X 0010 Low-pass filter 2X 0110 High-pass filter 0011 Low-pass filter with fS / 4 mixer 2X 4X (IQ) Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 53 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.4.3 Register 42h (address = 42h), Main Digital Page (6800h) Figure 103. Register 42h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 1 NYQUIST ZONE R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 39. Register 42h Field Descriptions Bit Field Type Reset Description 7-3 0 W 0h Must write 0 2-0 NYQUIST ZONE R/W 0h The Nyquist zone must be selected for proper interleaving correction. Nyquist refers to the device clock / 2. For a 1.0GSPS device clock, the Nyquist frequency is 500 MHz. The CTRL NYQUIST register bit (register 4Eh, bit 7) must also be set. 000 = First Nyquist zone (0 MHz to 500 MHz) 001 = Second Nyquist zone (500 MHz to 1000 MHz) 010 = Third Nyquist zone (1000 MHz to 1500 MHz) All others = Not used 8.5.3.4.4 Register 43h (address = 43h), Main Digital Page (6800h) Figure 104. Register 43h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 FORMAT SEL R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 40. Register 43h Field Descriptions Bit Field Type Reset Description 7-1 0 W 0h Must write 0 FORMAT SEL R/W 0h This bit changes the output format. Set the FORMAT EN bit to enable control using this bit. 0 = Twos complement 1 = Offset binary 0 8.5.3.4.5 Register 44h (address = 44h), Main Digital Page (6800h) Figure 105. Register 44h 7 0 R/W-0h 6 5 4 3 DIGITAL GAIN R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 41. Register 44h Field Descriptions Bit 7 6-0 54 Field Type Reset Description 0 R/W 0h Must write 0 DIGITAL GAIN R/W 0h These bits set the digital gain setting. The DIG GAIN EN register bit (register 52h, bit 0) must be enabled to use these bits. Gain in dB = 20log (digital gain / 32). 7Fh = 127 equals a digital gain of 9.5 dB. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.4.6 Register 4Bh (address = 4Bh), Main Digital Page (6800h) Figure 106. Register 4Bh 7 0 W-0h 6 0 W-0h 5 FORMAT EN R/W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 42. Register 4Bh Field Descriptions Bit Field Type Reset Description 7-6 0 W 0h Must write 0 FORMAT EN R/W 0h This bit enables control for data format selection using the FORMAT SEL register bit. 0 = Default, output is in twos complement format 1 = Output is in offset binary format after the FORMAT SEL bit is set 0 W 0h Must write 0 5 4-0 8.5.3.4.7 Register 4Dh (address = 4Dh), Main Digital Page (6800h) Figure 107. Register 4Dh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 DEC MOD EN R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 43. Register 4Dh Field Descriptions Bit Field Type Reset Description 7-4 0 W 0h Must write 0 DEC MOD EN R/W 0h This bit enables control of the decimation filter mode via the DECFIL MODE[3:0] register bits. 0 = Default 1 = Decimation mode control is enabled 0 W 0h Must write 0 3 2-0 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 55 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.4.8 Register 4Eh (address = 4Eh), Main Digital Page (6800h) Figure 108. Register 4Eh 7 CTRL NYQUIST R/W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 44. Register 4Eh Field Descriptions Bit 7 6-0 Field Type Reset Description CTRL NYQUIST R/W 0h This bit enables selecting the Nyquist zone using register 42h, bits 2-0. 0 = Selection disabled 1 = Selection enabled 0 W 0h Must write 0 8.5.3.4.9 Register 52h (address = 52h), Main Digital Page (6800h) Figure 109. Register 52h 7 BUS_REORDER EN1 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 DIG GAIN EN R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 45. Register 52h Field Descriptions Bit 7 6-1 0 Field Type Reset Description BUS_REORDER EN1 R/W 0h Must write 1 in DDC mode only. 0 W 0h Must write 0 DIG GAIN EN R/W 0h This bit enables selecting the digital gain for register 44h. 0 = Digital gain disabled 1 = Digital gain enabled 8.5.3.4.10 Register 72h (address = 72h), Main Digital Page (6800h) Figure 110. Register 72h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 BUS_REORDER EN2 W-0h 2 0 W-0h 1 0 W-0h 0 0 R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 46. Register 72h Field Descriptions Bit Field Type Reset Description 7-4 0 W 0h Must write 0 BUS_REORDER EN2 R/W 0h Must write 1 in DDC mode only. 0 W 0h Must write 0 3 2-0 56 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.4.11 Register ABh (address = ABh), Main Digital Page (6800h) Figure 111. Register ABh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 LSB SEL EN R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 47. Register ABh Field Descriptions Bit Field Type Reset Description 7-1 0 W 0h Must write 0 LSB SEL EN R/W 0h This bit enables control for the LSB SELECT register bit. 0 = Default 1 = LSB of the 16-bit data (12-bit ADC data padded with four 0s as the LSBs) can be programmed as fast OVR using the LSB SELECT register bit. 0 8.5.3.4.12 Register ADh (address = ADh), Main Digital Page (6800h) Figure 112. Register ADh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 LSB SELECT R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 48. Register ADh Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1-0 LSB SELECT R/W 0h These bits enable the output of the FOVR flag instead of the output data LSB. Ensure that the LSB SEL EN register bit is set to 1. 00 = Output is 16-bit data (12-bit ADC data padded with four 0s as the LSBs) 11 = The LSB of the 16-bit output data is replaced by the FOVR information for each channel 8.5.3.4.13 Register F7h (address = F7h), Main Digital Page (6800h) Figure 113. Register F7h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 DIG RESET W-0h LEGEND: W = Write only; -n = value after reset Table 49. Register F7h Field Descriptions Bit Field Type Reset Description 7-1 0 W 0h Must write 0 DIG RESET W 0h This bit is the self-clearing reset for the digital block and does not include interleaving correction. 0 = Normal operation 1 = Digital reset 0 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 57 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.5 JESD Digital Page (6900h) Registers 8.5.3.5.1 Register 0h (address = 0h), JESD Digital Page (6900h) Figure 114. Register 0h 7 6 5 CTRL K 0 0 R/W-0h W-0h W-0h 4 TESTMODE EN R/W-0h 3 FLIP ADC DATA R/W-0h 2 1 0 LANE ALIGN FRAME ALIGN TX LINK DIS R/W-0h R/W-0h R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 50. Register 0h Field Descriptions Bit 7 6-5 58 Field Type Reset Description CTRL K R/W 0h This bit is the enable bit for a number of frames per multiframe. 0 = Default is five frames per multiframe 1 = Frames per multiframe can be set in register 06h 0 W 0h Must write 0 4 TESTMODE EN R/W 0h This bit generates the long transport layer test pattern mode, as per section 5.1.6.3 of the JESD204B specification. 0 = Test mode disabled 1 = Test mode enabled 3 FLIP ADC DATA R/W 0h 0 = Normal operation 1 = Output data order is reversed: MSB to LSB. 2 LANE ALIGN R/W 0h This bit inserts the lane alignment character (K28.3) for the receiver to align to the lane boundary, as per section 5.3.3.5 of the JESD204B specification. 0 = Normal operation 1 = Inserts lane alignment characters 1 FRAME ALIGN R/W 0h This bit inserts the lane alignment character (K28.7) for the receiver to align to the lane boundary, as per section 5.3.3.5 of the JESD204B specification. 0 = Normal operation 1 = Inserts frame alignment characters 0 TX LINK DIS R/W 0h This bit disables sending the initial link alignment (ILA) sequence when SYNC is deasserted. 0 = Normal operation 1 = ILA disabled Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.5.2 Register 1h (address = 1h), JESD Digital Page (6900h) Figure 115. Register 1h 7 SYNC REG R/W-0h 6 SYNC REG EN R/W-0h 5 4 JESD FILTER R/W-0h 3 2 1 JESD MODE R/W-01h 0 LEGEND: R/W = Read/Write; -n = value after reset Table 51. Register 1h Field Descriptions Bit Field Type Reset Description 7 SYNC REG R/W 0h This bit is the register control for the sync request. 0 = Normal operation 1 = ADC output data are replaced with K28.5 characters; the SYNC REG EN register bit must also be set to 1 6 SYNC REG EN R/W 0h This bit enables register control for the sync request. 0 = Use the SYNC pin for sync requests 1 = Use the SYNC REG register bit for sync requests 5-3 JESD FILTER R/W 0h These bits and the JESD MODE bits set the correct LMFS configuration for the JESD interface. The JESD FILTER setting must match the configuration in the decimation filter page. 000 = Filter bypass mode See Table 52 for valid combinations for register bits JESD FILTER along with JESD MODE. 2-0 JESD MODE R/W 01h These bits select the number of serial JESD output lanes per ADC. The JESD PLL MODE register bit located in the JESD analog page must also be set accordingly. 001 = Default after reset(Eight active lanes) See Table 52 for valid combinations for register bits JESD FILTER along with JESD MODE. Table 52. Valid Combinations for JESD FILTER and JESD MODE Bits NUMBER OF ACTIVE LANES PER DEVICE REGISTER BIT JESD FILTER REGISTER BIT JESD MODE DECIMATION FACTOR 000 100 No decimation Four lanes are active 000 010 No decimation Four lanes are active 000 001 No decimation (default after reset) Eight lanes are active 111 001 4X (IQ) Four lanes are active 110 001 2X Four lanes are active 110 010 2X Two lanes are active 100 001 4X Two lanes are active 111 010 4X (IQ) Two lanes are active 100 010 4X One lane is active Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 59 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.5.3 Register 2h (address = 2h), JESD Digital Page (6900h) Figure 116. Register 2h 7 6 5 LINK LAYER TESTMODE R/W-0h 4 LINK LAYER RPAT R/W-0h 3 LMFC MASK RESET R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 53. Register 2h Field Descriptions Bit Field Type Reset Description 7-5 LINK LAYER TESTMODE R/W 0h These bits generate a pattern as per section 5.3.3.8.2 of the JESD204B document. 000 = Normal ADC data 001 = D21.5 (high-frequency jitter pattern) 010 = K28.5 (mixed-frequency jitter pattern) 011 = Repeat initial lane alignment (generates a K28.5 character and continuously repeats lane alignment sequences) 100 = 12-octet RPAT jitter pattern All others = Not used 4 LINK LAYER RPAT R/W 0h This bit changes the running disparity in the modified RPAT pattern test mode (only when the link layer test mode = 100). 0 = Normal operation 1 = Changes disparity 3 LMFC MASK RESET R/W 0h This bit masks the LMFC reset coming to the digital block. 0 = LMFC reset is not masked 1 = Ignore the LMFC reset request 0 W 0h Must write 0 2-0 60 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.5.4 Register 3h (address = 3h), JESD Digital Page (6900h) Figure 117. Register 3h 7 FORCE LMFC COUNT R/W-0h 6 5 4 LMFC COUNT INIT R/W-0h 3 2 1 0 RELEASE ILANE SEQ R/W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 54. Register 3h Field Descriptions Bit Field Type Reset Description FORCE LMFC COUNT R/W 0h This bit forces the LMFC count. 0 = Normal operation 1 = Enables using a different starting value for the LMFC counter 6-2 MASK SYSREF R/W 0h When SYSREF transmits to the digital block, the LMFC count resets to 0 and K28.5 stops transmitting when the LMFC count reaches 31. The initial value that the LMFC count resets to can be set using LMFC COUNT INIT. In this manner, the receiver can be synchronized early because the LANE ALIGNMENT SEQUENCE is received early. The FORCE LMFC COUNT register bit must be enabled. 1-0 RELEASE ILANE SEQ R/W 0h These bits delay the generation of the lane alignment sequence by 0, 1, 2, or 3 multiframes after the code group synchronization. 00 = 0 01 = 1 10 = 2 11 = 3 7 8.5.3.5.5 Register 5h (address = 5h), JESD Digital Page (6900h) Figure 118. Register 5h 7 SCRAMBLE EN R/W-Undefined 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 55. Register 5h Field Descriptions Bit 7 6-0 Field Type Reset Description SCRAMBLE EN R/W Undefined This bit is the scramble enable bit in the JESD204B interface. 0 = Scrambling disabled 1 = Scrambling enabled 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 61 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.5.6 Register 6h (address = 6h), JESD Digital Page (6900h) Figure 119. Register 6h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 3 2 1 FRAMES PER MULTI FRAME (K) R/W-8h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 56. Register 6h Field Descriptions Bit Field Type Reset Description 7-5 0 W 0h Must write 0 4-0 FRAMES PER MULTI FRAME (K) R/W 8h These bits set the number of multiframes. Actual K is the value in hex + 1 (that is, 0Fh is K = 16). 8.5.3.5.7 Register 7h (address = 7h), JESD Digital Page (6900h) Figure 120. Register 7h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 SUBCLASS R/W-1h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 57. Register 7h Field Descriptions Bit Field Type Reset Description 7-4 0 W 0h Must write 0 SUBCLASS R/W 1h This bit sets the JESD204B subclass. 000 = Subclass 0 is backward compatible with JESD204A 001 = Subclass 1 deterministic latency using the SYSREF signal 0 W 0h Must write 0 3 2-0 8.5.3.5.8 Register 16h (address = 16h), JESD Digital Page (6900h) Figure 121. Register 16h 7 1 W-1h 6 0 W-0h 5 0 R/W-0h 4 LANE SHARE W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 58. Register 16h Field Descriptions Bit Field Type Reset Description 7 1 W 1h Must write 1 6-5 0 W 0h Must write 0 LANE SHARE R/W 0h When using decimate-by-4, the data of both channels are output over one lane (LMFS = 1241). 0 = Normal operation (each channel uses one lane) 1 = Lane sharing is enabled, both channels share one lane (LMFS = 1241) 0 W 0h Must write 0 4 3-0 62 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.5.9 Register 31h (address = 31h), JESD Digital Page (6900h) Figure 122. Register 31h 7 6 5 4 3 DA_BUS_REORDER[7:0] R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 59. Register 31h Field Descriptions Bit Field Type Reset Description 7-0 DA_BUS_REORDER[7:0] R/W 0h Use these bits to program output connections between data streams and output lanes in decimate-by-2 and decimate-by-4 mode. Table 13 lists the supported combinations of these bits. 8.5.3.5.10 Register 32h (address = 32h), JESD Digital Page (6900h) Figure 123. Register 32h 7 6 5 4 3 DB_BUS_REORDER[7:0] R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 60. Register 32h Field Descriptions Bit Field Type Reset Description 7-0 DB_BUS_REORDER[7:0] R/W 0h Use these bits to program output connections between data streams and output lanes in decimate-by-2 and decimate-by-4 mode. Table 13 lists the supported combinations of these bits. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 63 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.6 JESD Analog Page (6A00h) Registers 8.5.3.6.1 Registers 12h-5h (addresses = 12h-5h), JESD Analog Page (6A00h) Figure 124. Register 12h 7 6 5 4 SEL EMP LANE 1 R/W-0h 3 2 1 0 W-0h 0 0 W-0h 2 1 0 W-0h 0 0 W-0h 2 1 0 W-0h 0 0 W-0h 2 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Figure 125. Register 13h 7 6 5 4 SEL EMP LANE 0 R/W-0h 3 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Figure 126. Register 14h 7 6 5 4 SEL EMP LANE 2 R/W-0h 3 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Figure 127. Register 15h 7 6 5 4 SEL EMP LANE 3 R/W-0h 3 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 61. Registers 12h-15h Field Descriptions 64 Bit Field Type Reset Description 7-2 SEL EMP LANE x (where x = 1, 0, 2, or 3) R/W 0h These bits select the amount of de-emphasis for the JESD output transmitter. The de-emphasis value in decibels (dB) is measured as the ratio between the peak value after the signal transition to the settled value of the voltage in one bit period. 0 = 0 dB 1 = –1 dB 3 = –2 dB 7 = –4.1 dB 15 = –6.2 dB 31 = –8.2 dB 63 = –11.5 dB 1-0 0 W-0h 0h Must write 0 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 8.5.3.6.2 Register 16h (address = 16h), JESD Analog Page (6A00h) Figure 128. Register 16h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 JESD PLL MODE R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 62. Register 16h Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1-0 JESD PLL MODE R/W 0h These bits select the JESD PLL multiplication factor and must match the JESD MODE setting. 00 = 20X mode 01 = Not used 10 = 40X mode 11 = Not used See Table 13 for a programming summary of the DDC modes and JESD link configuration. 8.5.3.6.3 Register 17h (address = 17h), JESD Analog Page (6A00h) Figure 129. Register 17h 7 0 W-0h 6 PLL RESET W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 63. Register 17h Field Descriptions Bit Field Type Reset Description 7 0 W 0h Must write 0 6 PLL RESET R/W 0h Pulse this bit after powering up the device; see Table 66. 0 = Default 0 → 1 → 0 = The PLL RESET bit is pulsed. 0 W 0h Must write 0 5-0 8.5.3.6.4 Register 1Ah (address = 1Ah), JESD Analog Page (6A00h) Figure 130. Register 1Ah 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 FOVR CHA R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 64. Register 1Ah Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 FOVR CHA R/W 0h This bit outputs the FOVR signal for channel A on the PDN pin. FOVR CHA EN (register 1Bh, bit 3) must be enabled for this bit to function. 0 = Normal operation 1 = The FOVR signal of channel A is available on the PDN pin 0 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 65 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 8.5.3.6.5 Register 1Bh (address = 1Bh), JESD Analog Page (6A00h) Figure 131. Register 1Bh 7 6 JESD SWING R/W-0h 5 4 0 W-0h 3 FOVR CHA EN R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 65. Register 1Bh Field Descriptions Bit Field Type Reset Description 7-5 JESD SWING R/W 0h These bits select the output amplitude VOD (mVPP) of the JESD transmitter (for all lanes). 0 = 860 mVPP 1 = 810 mVPP 2 = 770 mVPP 3 = 745 mVPP 4 = 960 mVPP 5 = 930 mVPP 6 = 905 mVPP 7 = 880 mVPP 4 0 W 0h Must write 0 3 FOVR CHA EN R/W 0h This bit enables overwrites of the PDN pin with the FOVR signal from channel A. 0 = Normal operation 1 = PDN is overwritten 0 W 0h Must write 0 2-0 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Start-Up Sequence The steps described in Table 66 are recommended as the power-up sequence with the ADS54J20 in 20X mode (LMFS = 8224). 66 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Table 66. Initialization Sequence STEP 1 SEQUENCE Power-up the device PAGE BEING PROGRAMMED DESCRIPTION Bring up the supplies to IOVDD = 1.15 V, DVDD = AVDD = 1.9 V, and AVDD3V = 3.0 V. Hardware reset Reset the device These supplies can be brought up in any order. — Apply a hardware reset by pulsing pin 48 (low → high → low). A hardware reset clears all registers to their default values. Register writes are equivalent to a hardware reset. — Write address 0-000h with 81h. 2 General register Write address 4-001h with 00h and address 4-002h with 00h. Unused page Write address 4-003h with 00h and address 4-004h with 68h. — Main digital page (JESD bank) Write address 6-000h with 01h, then address 6-000h with 00h. Write address 0-011h with 80h. This bit is a self-clearing bit. Clear any unwanted content from the unused pages of the JESD bank. Select the main digital page of the JESD bank. This bit is a self-clearing bit. Pulse the PULSE RESET register bit for channel A. — Write address 0-059h with 20h. Performance modes Reset registers in the ADC and master pages of the analog bank. Use the DIG RESET register bit to reset all pages in the JESD bank. Write address 6-0F7h with 01h for channel A. 3 COMMENT Select the master page of the analog bank. Set the ALWAYS WRITE 1 bit. Master page (analog bank) Write address 0-039h with C0h. Write address 0-03Ah with 40h. Write address 0-056h with 04h. HIGH FREQ[3:0]. Set these register bits for better SFDR when input frequency > 400 MHz. Default register writes for DDC modes and JESD link configuration (LMFS = 8224). Write address 4-003h with 00h and address 4-004h with 69h. Write address 6-000h with 80h. JESD link is configured with LMFS = 8224 by default with no decimation. Write address 4-003h with 00h and address 4-004h with 6Ah. 4 Program desired registers for decimation options and JESD link configuration JESD link is configured with LMFS = 8224 by default with no decimation. Write address 6-017h with 40h. — JESD digital page (JESD bank) — JESD analog page (JESD bank) Write address 6-017h with 00h. Select the JESD digital page. Set the CTRL K bit for both channels by programming K according to the SYSREF signal later on in the sequence. See Table 13 for configuring the JESD digital page registers for the desired LMFS and programming appropriate DDC mode. Select the JESD analog page. See Table 13 for configuring the JESD analog page registers for the desired LMFS and programming appropriate DDC mode. PLL reset. PLL reset. Write address 4-003h with 00h and address 4-004h with 68h. JESD link is configured with LMFS = 8224 by default with no decimation. Write address 6-000h with 01h and address 6-000h with 00h. — Main digital page (JESD bank) Select the main digital page. See Table 13 for configuring the main digital page registers for the desired LMFS and programming appropriate DDC mode. Pulse the PULSE RESET register bit. All settings programmed in the main digital page take effect only after this bit is pulsed. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 67 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Table 66. Initialization Sequence (continued) STEP SEQUENCE 5 Set the value of K and the SYSREF signal frequency accordingly 6 JESD lane alignment PAGE BEING PROGRAMMED DESCRIPTION Write address 4-003h with 00h and address 4-004h with 69h. Write address 6-006h with XXh (choose the value of K). — JESD digital page (JESD bank) Pull the SYNCB pin (pin 63) low. 68 Pull the SYNCB pin high. COMMENT Select the JESD digital page. See the SYSREF Signal section to choose the correct frequency for SYSREF. Transmit K28.5 characters. — Submit Documentation Feedback After the receiver is synchronized, initiate an ILA phase and subsequent transmissions of ADC data. Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 9.1.2 Hardware Reset Figure 132 and Table 67 show the timing for a hardware reset. Power Supplies tPU RESET tRST tWR SEN Figure 132. Hardware Reset Timing Diagram Table 67. Timing Requirements for Figure 132 MIN tPU Power-on delay from power-up to an active high RESET pulse tRST tWR TYP MAX UNIT 1 ms Reset pulse duration: active high RESET pulse duration 10 ns Register write delay from RESET disable to SEN active 100 ns 9.1.3 SNR and Clock Jitter The signal-to-noise ratio (SNR) of the ADC is limited by three different factors: quantization noise, thermal noise, and jitter, as shown in Equation 4. The quantization noise is typically not noticeable in pipeline converters and is 74 dBFS for a 12-bit ADC. The thermal noise limits SNR at low input frequencies and the clock jitter sets SNR for higher input frequencies. (4) The SNR limitation resulting from sample clock jitter can be calculated by Equation 5: (5) The total clock jitter (TJitter) has two components: the internal aperture jitter (130 fS) is set by the noise of the clock input buffer and the external clock jitter. TJitter can be calculated by Equation 6: (6) External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input. A faster clock slew rate also improves the ADC aperture jitter. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 69 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com The ADS54J20 has a thermal noise of approximately 71.1 dBFS and an internal aperture jitter of 120 fS. SNR, depending on the amount of external jitter for different input frequencies, is shown in Figure 133. 71 35 fs 50 fs 100 fs 150 fs 200 fs SNR (dBFS) 69 67 65 63 10 100 Input Frequency (MHz) 500 D057 Figure 133. SNR versus Input Frequency and External Clock Jitter 70 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 9.2 Typical Application The ADS54J20 is designed for wideband receiver applications demanding excellent dynamic range over a large input frequency range. A typical schematic for an ac-coupled receiver is shown in Figure 134. DVDD 10 k 5: 50 : Driver 0.1 PF 0.1 PF 2 pF 50 : SPI Master 5: GND GND 0.1 PF GND 0.1 PF IOVDD 0.1 PF 100 : SYSREFM AVDD AVDD AGND 3 DB3M AGND SYSREFP 4 DB3P 0.1 PF GND 5 DGND AVDD3V AVDD3V 6 IOVDD AVDD 7 SDIN GND 0.1 PF Low-Jitter Clock Generator 8 SCLK AGND 9 SEN CLKINM DVDD CLKINP 10 AVDD AGND 11 AVDD3V AVDD AVDD 0.1 PF GND 12 SDOUT 10 nF AVDD3V 13 AVDD GND 0.1 PF AVDD3V 14 INBP AGND 15 INBM 0.1 PF 16 AVDD VCM DVDD AVDD3V NC NC AVDD AGND NC 17 10nF AVDD AVDD3V 18 GND 0.1 PF AVDD3V AVDD 2 100-: Differential 1 10 nF DB2P 19 72 20 71 21 70 22 69 DB2M IOVDD IOVDD 10 nF DB1P 10 nF GND DB1M 23 68 24 67 25 66 DGND DB0P 10 nF GND DB0M 26 65 IOVDD 27 64 GND Pad (Back Side) 28 IOVDD 0.1 PF SYNC 63 GND DA0M 29 62 30 61 31 60 32 59 FPGA DA0P DGND DA1M 10 nF GND DA1P 33 58 34 57 IOVDD 35 IOVDD 10 nF 10 nF DA2M 56 GND DA2P 36 55 GND 37 38 39 40 42 43 44 45 46 47 49 51 52 53 10 nF 54 DA3M DA3P DGND IOVDD PDN RES RESET AVDD3V GND 50 100-: Differential 10 nF DVDD AVDD AVDD 48 DVDD AVDD AVDD3V AVDD AVDD INAP INAM AVDD AVDD3V AVDD AGND AVDD3V 41 0.1 PF GND 0.1 PF GND 0.1 PF IOVDD GND 5: 50 : Driver 0.1 PF 0.1 PF 50 : GND 2 pF 5: Copyright © 2016, Texas Instruments Incorporated NOTE: GND = AGND and DGND are connected in the PCB layout. Figure 134. AC-Coupled Receiver Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 71 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com Typical Application (continued) 9.2.1 Design Requirements 9.2.1.1 Transformer-Coupled Circuits Typical applications involving transformer-coupled circuits are discussed in this section. Transformers (such as ADT1-1WT or WBC1-1) can be used up to 300 MHz to achieve good phase and amplitude balances at the ADC inputs. When designing dc-driving circuits, the ADC input impedance must be considered. Figure 135 and Figure 136 show the impedance (ZIN = RIN || CIN) across the ADC input pins. 5 Differential Input Capacitance (pF) Differential Input Resistance (k:) 1.4 1.2 1 0.8 0.6 0.4 0.2 4.75 4.5 4.25 4 3.75 3.5 3.25 3 2.75 2.5 2.25 0 0 100 200 300 400 500 600 700 Frequency (MHz) 800 0 900 1000 100 200 D103 Figure 135. RIN vs Input Frequency 300 400 500 600 700 Frequency (MHz) 800 900 1000 D102 Figure 136. CIN vs Input Frequency By using the simple drive circuit of Figure 137, uniform performance can be obtained over a wide frequency range. The buffers present at the analog inputs of the device help isolate the external drive source from the switching currents of the sampling circuit. 0.1 F T1 T2 0.1 F 5 CHx_INP 25 0.1 F RIN 0.1 F 1:1 CIN 25 5 CHx_INM 1:1 TI Device Copyright © 2016, Texas Instruments Incorporated Figure 137. Input Drive Circuit 9.2.2 Detailed Design Procedure For optimum performance, the analog inputs must be driven differentially. This architecture improves commonmode noise immunity and even-order harmonic rejection. A small resistor (5 Ω to 10 Ω) in series with each input pin is recommended to damp out ringing caused by package parasitics, as shown in Figure 137. 72 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 Typical Application (continued) 9.2.3 Application Curves 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) Figure 138 and Figure 139 show the typical performance at 170 MHz and 230 MHz, respectively. -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 100 200 300 Input Frequency (MHz) 400 500 0 D003 100 200 300 Input Frequency (MHz) 400 500 D004 SNR = 67.8 dBFS, SINAD = 67.7 dBFS, SFDR = 86 dBc, THD = 81 dBc, IL spur = 88 dBc, non HD2, HD3 spur = 89 dBc SNR = 67.4 dBFS, SINAD = 67.2 dBFS, IL spur = 87 dBc, SFDR = 84 dBc, THD = 82 dBc, non HD2, HD3 spur = 90 dBc Figure 138. FFT for 170-MHz Input Signal Figure 139. FFT for 230-MHz Input Signal 10 Power Supply Recommendations The device requires a 1.9-V nominal supply for DVDD, a 1.9-V nominal supply for AVDD, and a 3.0-V nominal supply for AVDD3V. There is no specific sequence for power-supply requirements during device power-up. AVDD, DVDD, and AVDD3V can power-up in any order. 11 Layout 11.1 Layout Guidelines The device evaluation module (EVM) layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 140. The ADS54J20EVM User's Guide (SLAU687), provides a complete layout of the EVM. Some important points to remember during board layout are: • Analog inputs are located on opposite sides of the device pinout to ensure minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs must exit the pinout in opposite directions, as illustrated in the reference layout of Figure 140 as much as possible. • In the device pinout, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 140 as much as possible. • Keep digital outputs away from the analog inputs. When these digital outputs exit the pinout, the digital output traces must not be kept parallel to the analog input traces because this configuration can result in coupling from the digital outputs to the analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs)] must be matched in length to avoid skew among outputs. • At each power-supply pin (AVDD, DVDD, or AVDDD3V), keep a 0.1-µF decoupling capacitor close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 73 ADS54J20 SBAS766A – MAY 2016 – REVISED MAY 2016 www.ti.com 11.2 Layout Example Copyright © 2016, Texas Instruments Incorporated Figure 140. ADS54J20EVM Layout 74 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 ADS54J20 www.ti.com SBAS766A – MAY 2016 – REVISED MAY 2016 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation ADS54J20EVM User's Guide, SLAU687 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS54J20 75 PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS54J20IRMP ACTIVE VQFN RMP 72 168 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ54J20 ADS54J20IRMPT ACTIVE VQFN RMP 72 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ54J20 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OUTLINE RMP0072A VQFN - 0.9 mm max height SCALE 1.700 VQFN 10.1 9.9 B A PIN 1 ID 10.1 9.9 0.9 MAX 0.05 0.00 C 0.08 C (0.2) SEATING PLANE 4X (45 X0.42) 19 36 18 4X 8.5 37 SYMM 8.5 0.1 PIN 1 ID (R0.2) 1 68X 0.5 54 55 72 SYMM 72X 0.5 0.3 72X 0.30 0.18 0.1 0.05 C B C A 4221047/B 02/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RMP0072A VQFN - 0.9 mm max height VQFN ( 8.5) SYMM 72X (0.6) SEE DETAILS 55 72 1 54 72X (0.24) (0.25) TYP (9.8) SYMM (1.315) TYP 68X (0.5) ( 0.2) TYP VIA 37 18 19 36 (1.315) TYP (9.8) LAND PATTERN EXAMPLE SCALE:8X 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) METAL SOLDER MASK DEFINED SOLDER MASK DETAILS 4221047/B 02/2014 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN RMP0072A VQFN - 0.9 mm max height VQFN (9.8) 72X (0.6) (1.315) TYP 72 55 1 54 72X (0.24) (1.315) TYP (0.25) TYP SYMM (1.315) TYP (9.8) 68X (0.5) METAL TYP 37 18 ( 0.2) TYP VIA 19 36 36X ( 1.115) (1.315) TYP SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 62% PRINTED SOLDER COVERAGE BY AREA SCALE:8X 4221047/B 02/2014 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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