MSWSH-040-30 PIN Diode Shunt Switch Element Rev. V1 Features Supports up to 40 W Power Low Insertion Loss: 0.10 dB to 2.7 GHz 0.25 dB to 6.0 GHz High Isolation: 25 dB to 6.0 GHz RoHS* Compliant Description A broadband, high linearity, medium power shunt switch element in a 1.9 x 1.1 mm DFN package. This device is designed for wireless telecommunications infrastructure and test instrument applications. It is also suited for other applications in 0.05 ~ 6 GHz. Pin Out / Schematic Ordering Information Part Number Package MSWSH-040-30 3000 piece reel Electrical Specifications: TA = +25°C 1 Parameter Test Conditions Units Min. Typ. Max. Breakdown Voltage (VB) IR = 10 µA V 500 — — Total Capacitance (CT) VR = -50 V, 1 MHz pF — 0.42 — Series Resistance (RS) IF = 100 mA, 500 MHz Ω — 0.36 — I-Region (W) I-Layer mm — 40 — Insertion Loss (IL) VR = 10 V 2.7 GHz <6.0 GHz dB — 0.10 0.30 0.30 0.50 Isolation (ISO) IF = 100 mA 2.7 GHz <6.0 GHz dB 29 24 32 36 — Input / Output Return Loss (RL) VR = 10 V 2.7 GHz <6.0 GHz dB 18 13 22 15 — Minority Carrier Lifetime (TL) IF = 10 mA, IR = 6 mA, @ 50% ns — 600 — * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MSWSH-040-30 PIN Diode Shunt Switch Element Rev. V1 Absolute Maximum Ratings Parameter Absolute Maximum Breakdown Voltage 500 V Forward Current 500 mA Thermal Resistance 10°C/W Junction Temperature +175°C Storage Temperature -65°C to +150°C Assembly Temperature +260°C Per JEDEC STD-J-20C Junction Temperature vs. Power Mounted on Heatsink, +25°C, 1.3 GHz Insertion Loss Isolation Input Return Loss Series Resistance vs. Bias, 500 MHz 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MSWSH-040-30 PIN Diode Shunt Switch Element Rev. V1 Printed Circuit Board Layout NOTE: If possible, use copper filled vias underneath pin 3 for better thermals; otherwise, use vias that are plated through, filled and plated over. Solder mask should provide a 60 um clearance between copper pad and soldermask. Rounded pkg pads should have matching rounded solder mask openings. Use circles or squares for the thermal land stencil such that only get 50% to 80% solder paste coverage. Outline (2012) 3 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MSWSH-040-30 PIN Diode Shunt Switch Element Rev. V1 MACOM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. 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