STMicroelectronics L9950XPTR Door actuator driver Datasheet

L9950
L9950XP
Door actuator driver
Features
■
One full bridge for 6A load (Ron=150 mΩ )
■
Two half bridges for 3A load (Ron=300 mΩ )
■
Two half bridges for 1.5A load (Ron=800 mΩ )
■
One highside driver for 6A load (Ron=100 mΩ )
■
Four highside drivers for 1.5 A load
(Ron=800 mΩ )
■
Programmable softstart function to drive loads
with higher inrush currents (i.e. current
>6 A,>3 A,>1.5 A)
PowerSO-36
■
Very low current consumption in standby mode
(IS < 6 μA typ; ICC <25 μA typ; Tj ≤ 85 °C)
■
All outputs short circuit protected
■
Current monitor output for 300 mΩ, 150 mΩ
and 100 m highside drivers
■
All outputs over temperature protected
■
Open load diagnostic for all outputs
■
Overload diagnostic for all outputs
■
Seperated half bridges for door lock motor
■
PWM control of all outputs
■
Charge pump output for reverse polarity
protection
Table 1.
PowerSSO-36
Applications
■
Door actuator driver with bridges for door lock
and safe lock, mirror axis control, mirror fold
and highside driver for mirror defroster and four
10W-light bulbs.
Description
The L9950 and L9950XP are microcontroller
driven multifunctional door actuator driver for
automotive applications.Up to five DC motors and
five grounded resistive loads can be driven with
six half bridges and five highside drivers. The
integrated standard serial peripheral interface
(SPI) controls all operation modes (forward,
reverse, brake and high impedance). All
diagnostic informations are available via SPI.
Device summary
Order codes
Package
June 2009
Part number (tube)
Part number (tape and reel)
PowerSO-36
L9950
L9950TR
PowerSSO-36
L9950XP
L9950XPTR
Doc ID 10311 Rev 10
1/39
www.st.com
1
Contents
L9950 - L9950XP
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
2/39
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . 10
2.5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.6
SPI - electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1
Dual power supply: VS and VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3
Inductive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4
Diagnostic functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5
Overvoltage and under voltage detection . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.6
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . 21
3.7
Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.8
Over load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.9
Current monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.10
PWM inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.11
Cross current protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.12
Programmable soft start function to drive loads with higher inrush current .
22
Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2
Chip Select Not (CSN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3
Serial Data In (DI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4
Serial Data Out (DO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.5
Serial clock (CLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.6
Input data register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 10311 Rev 10
L9950 - L9950XP
Contents
4.7
Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.8
Test mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5
Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7
6.1
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.2
PowerSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.3
PowerSSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.4
PowerSO-36 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.5
PowerSSO-36 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Doc ID 10311 Rev 10
3/39
List of tables
L9950 - L9950XP
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
4/39
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Overvoltage and under voltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current monitor output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Charge pump output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
OUT1 - OUT11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Delay time from standby to active mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Inputs: CSN, CLK, PWM1/2 and DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DO timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CSN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Test mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SPI - input data and status registers 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SPI - input data and status registers 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PowerSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Doc ID 10311 Rev 10
L9950 - L9950XP
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPI - transfer timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
SPI - input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SPI - DO valid data delay time and valid time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SPI - DO enable and disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI - driver turn-on/off timing, minimum csn hi time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI - timing of status bit 0 (fault condition) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Example of programmable soft start function for inductive loads . . . . . . . . . . . . . . . . . . . . 23
Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PowerSO-36 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PowerSSO-36 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
PowerSO-36 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PowerSO-36 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
PowerSSO-36 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
PowerSSO-36 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Doc ID 10311 Rev 10
5/39
Block diagram and pin description
1
L9950 - L9950XP
Block diagram and pin description
Figure 1.
Block diagram
* Note: Value of capacitor has to be choosen carefully to limit the VS
voltage below absolute maximum ratings in case of an unexpected
VBAT
Reverse
Polarity
Protection
100k
10k
freewheeling condition of inductive loads (e.g. TSD, POR)
*
VS
100µF
VREG
CP
100nF
OUT1
Charge
Pump
EMC
Optimization
+ 10
100
VCC
DI
DO
CLK
CSN
SPI
Interface
100nF
** 1k
** 1k
** 1k
** 1k
PWM1
**1k
OUT2
OUT3
OUT4
Driver Interface & Diagnostic
VCC
OUT5
OUT6
OUT7
OUT8
OUT9
µC
OUT10
OUT11
CM / PWM2
**1k
xy-Mirror
Motors
M
M
M
Lock
Safe Lock
M
Folder
M
Exterior Light
Footstep Light
Safety Light
Turn Indicator
Defroster
MUX
5
GND ** Note: Resistors between µC and L9950 are recommended to limit currents
for negative voltage transients at VBAT (e.g. ISO type 1 pulse)
+ Note: Using a ferrite instead of 10ohm will additionally improve EMC behavior
Table 2.
Pin definitions and functions
Pin
1, 18, 19, 36
2, 35
6/39
Symbol
Function
GND
Ground.
Reference potential.
Important: for the capability of driving the full current at the outputs all
pins of GND must be externally connected.
OUT11
Highside driver output 11.
The output is built by a highside switch and is intended for resistive
loads, hence the internal reverse diode from GND to the output is
missing. For ESD reason a diode to GND is present but the energy
which can be dissipated is limited. The highside driver is a power
DMOS transistor with an internal parasitic reverse diode from the
output to VS (bulk-drain-diode). The output is over-current and open
load protected.
Important: for the capability of driving the full current at the outputs both
pins of OUT11 must be externally connected.
Doc ID 10311 Rev 10
L9950 - L9950XP
Block diagram and pin description
Table 2.
Pin definitions and functions (continued)
Pin
3
4
5
6, 7, 14, 15,
23, 24, 25, 28,
29, 32
8
9
Symbol
Function
OUT1
OUT2
OUT3
Hal bridge output 1,2,3.
The output is built by a highside and a lowside switch, which are
internally connected. The output stage of both switches is a power
DMOS transistor. Each driver has an internal parasitic reverse diode
(bulk-drain-diode: highside driver from output to VS, lowside driver from
GND to output). This output is over-current and open load protected.
VS
Power supply voltage (external reverse protection required.
For this input a ceramic capacitor as close as possible to GND is
recommended.
Important: for the capability of driving the full current at the outputs all
pins of VS must be externally connected.
DI
Serial data input.
The input requires CMOS logic levels and receives serial data from the
microcontroller. The data is an 24bit control word and the least
significant bit (LSB, bit 0) is transferred first.
Current monitor output/PWM2 input.
Depending on the selected multiplexer bits of Input Data Register this
output sources an image of the instant current through the
CM/PWM2 corresponding highside driver with a ratio of 1/10.000. This pin is
bidirectional. The microcontroller can overdrive the current monitor
signal to provide a second PWM input for the outputs OUT9 and
OUT10.
CSN
Chip select not input/test mode.
This input is low active and requires CMOS logic levels. The serial data
transfer between L9950 and micro controller is enabled by pulling the
input CSN to low level. If an input voltage of more than 7.5V is applied
to CSN pin the L9950 will be switched into a test mode.
11
DO
Serial data output.
The diagnosis data is available via the SPI and this tristate output. The
output will remain in tristate, if the chip is not selected by the input CSN
(CSN = high).
12
VCC
Logic supply voltage.
For this input a ceramic capacitor as close as possible to GND is
recommended.
13
CLK
Serial clock input.
This input controls the internal shift register of the SPI and requires
CMOS logic levels.
16,17, 20,21,
22
OUT4
OUT5
OUT6
Half bridge output 4,5,6: see OUT1 (pin 3).
Important: for the capability of driving the full current at the outputs both
pins of OUT4 (OUT5, respectively) must be externally connected.
26
CP
Charge pump output.
This output is provided to drive the gate of an external n-channel power
MOS used for reverse polarity protection
10
Doc ID 10311 Rev 10
7/39
Block diagram and pin description
Table 2.
L9950 - L9950XP
Pin definitions and functions (continued)
Pin
Symbol
27
PWM1
PWM1 input.
This input signal can be used to control the drivers OUT1-OUT8 and
OUT11 by an external PWM signal.
OUT7,
OUT8,
OUT9,
OUT10
Highside driver output 7,8,9,10.
The output is built by a highside switch and is intended for resistive
loads, hence the internal reverse diode from GND to the output is
missing. For ESD reason a diode to GND is present but the energy
which can be dissipated is limited. The highside driver is a power
DMOS transistor with an internal parasitic reverse diode from the
output to VS (bulk-drain-diode). The output is over-current and open
load protected.
30
31
33
34
Figure 2.
Function
Configuration diagram (top view)
GND 1
OUT11 2
OUT1 3
36 GND
Power SO36
34 OUT10
OUT2 4
33 OUT9
OUT3 5
32 VS
VS 6
31 OUT8
VS 7
30 OUT7
DI 8
CM/PWM2 9
29 VS
Chip
CSN 10
28 VS
27 PWM1
DO 11
26 CP
VCC 12
25 VS
CLK 13
24 VS
VS 14
23 VS
VS 15
22 OUT6
OUT4 16
OUT4 17
Leadframe
GND 18
8/39
35 OUT11
21 OUT5
20 OUT5
19 GND
Doc ID 10311 Rev 10
L9950 - L9950XP
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
-0.3 to 28
V
40
V
-0.3 to 5.5
V
Digital input/output voltage
-0.3 to VCC + 0.3
V
VCM
Current monitor output
-0.3 to VCC + 0.3
V
VCP
Charge pump output
-25 to VS + 11
V
DC supply voltage
VS
Single pulse tmax < 400 ms
Stabilized supply voltage, logic supply
VCC
VDI, VDO, VCLK,
VCSN, Vpwm1
2.2
IOUT1,2,3,6,7,8,9,10
Output current
±5
A
IOUT4,5,11
Output current
±10
A
ESD protection
Table 4.
ESD protection
Parameter
Value
Unit
All pins
±4 (1)
kV
(2)
kV
Output pins: OUT1 - OUT11
±8
1. HBM according to CDF-AEC-Q100-002.
2. HBM with all unzapped pins grounded.
2.3
Thermal data
Table 5.
Thermal data
Symbol
Parameter
Value
Unit
Tj
Operating junction temperature
-40 to 150
°C
Doc ID 10311 Rev 10
9/39
Electrical specifications
2.4
L9950 - L9950XP
Temperature warning and thermal shutdown
Table 6.
Temperature warning and thermal shutdown
Symbol
Parameter
Typ.
Max.
Unit
TjTW ON
Temperature warning threshold junction
temperature
Tj
increasing
-
-
150
°C
TjTW OFF
Temperature warning threshold junction
temperature
Tj
decreasing
130
-
-
°C
-
5
-
°K
TjTW HYS Temperature warning hysteresis
TjSD ON
Thermal shutdown threshold junction
temperature
Tj
increasing
-
-
170
°C
TjSD OFF
Thermal shutdown threshold junction
temperature
Tj
decreasing
150
-
-
°C
-
5
-
°K
TjSD HYS Thermal shutdown hysteresis
2.5
Min.
Electrical characteristics
VS = 8 to 16 V, VCC = 4.5 to 5.3 V, Tj = - 40 to 150 °C, unless otherwise specified.
The voltages are referred to GND and currents are assumed positive, when the current
flows into the pin.
Table 7.
Symbol
VS
Supply
Parameter
Test condition
Operating supply voltage
range
IS + ICC
10/39
Typ.
Max.
Unit
7
-
28
V
VS DC supply current
VS = 16 V, VCC = 5.3 V
active mode
OUT1 - OUT11 floating
-
7
20
mA
VS quiescent supply current
VS = 16 V, VCC = 0 V
standby mode
OUT1 - OUT11 floating
Ttest =-40 °C, 25 °C
-
4
12
µA
VCC DC supply current
VS = 16 V, VCC = 5.3 V
CSN = VCC , active mode
-
1
3
mA
VCC quiescent supply
current
VS = 16 V, VCC = 5.3 V
CSN = VCCstandby mode
OUT1 - OUT11 floating
Ttest =-40 °C, 25 °C
-
25
50
µA
Sum quiescent supply
current
VS = 16 V, VCC = 5.3 V
CSN = VCC
standby mode
OUT1 - OUT11 floating
Ttest =-40 °C, 25 °C
-
31
75
µA
IS
ICC
Min.
Doc ID 10311 Rev 10
L9950 - L9950XP
Table 8.
Symbol
Electrical specifications
Overvoltage and under voltage detection
Parameter
Test condition
Min.
Typ.
Max.
Unit
VSUV ON VS UV-threshold voltage
VS increasing
5.9
-
7.2
V
VSUV OFF VS UV-threshold voltage
VS decreasing
5.5
-
6.5
V
VSUV hyst VS UV-hysteresis
VSUV ON - VSUV OFF
-
0.5
-
V
VSOV OFF VS OV-threshold voltage
VS increasing
18
-
24.5
V
VSOV ON VS OV-threshold voltage
VS decreasing
17.5
-
22
V
VSOV hyst VS OV-hysteresis
VSOV OFF - VSOV ON
-
1
-
V
VPOR OFF Power-on-reset threshold
VCC increasing
-
-
4.4
V
VPOR ON Power-on-reset threshold
VCC decreasing
3.1
-
-
V
VPOR hyst Power-on-reset hysteresis
VPOR OFF - VPOR ON
-
0.3
-
V
Max.
Unit
4
V
Table 9.
Symbol
Current monitor output
Parameter
Test condition
Min.
Typ.
VCM
Functional voltage range VCC = 5 V
0
ICM,r
Current monitor output
ratio:
ICM / IOUT1,4,5,6,11
-
1 ----------------10.000
-
-
-
4% +
1%FS
8% +
2%FS
-
ICM acc
Table 10.
Symbol
VCP
ICP
0 V ≤ VCM ≤ 4 V, VCC=5 V
0 V ≤ VCM ≤ 3.8 V,
VCC = 5 V, IOut,min=500 mA,
Current monitor accuracy IOut4,5,11,max = 5.9 A
IOut1,6,max = 2.9 A
(FS = full scale= 600 µA)
Charge pump output
Parameter
Charge pump output
voltage
Charge pump output
current
Test condition
Min.
Typ.
Max.
Unit
VS = 8 V, ICP = -60 µA
6
-
13
V
VS = 10 V, ICP = -80 µA
8
-
13
V
VS ≥ 12 V, ICP = -100 µA
10
-
13
V
VCP = VS+10 V, VS =13.5 V
95
150
300
µA
Doc ID 10311 Rev 10
11/39
Electrical specifications
Table 11.
Symbol
rON OUT1,
rON OUT6
rON OUT2,
rON OUT3
rON OUT4,
rON OUT5
rON OUT7,
rON OUT8,
rON OUT9 ,
rON OUT10
rON OUT11
12/39
L9950 - L9950XP
OUT1 - OUT11
Parameter
On-resistance to supply or
GND
On-resistance to supply or
GND
On-resistance to supply or
GND
On-resistance to supply
On-resistance to supply
Test condition
Min.
Typ.
Max.
Unit
VS = 13.5 V, Tj = 25 °C,
IOUT1,6 = ± 1.5A
-
300
400
mΩ
VS = 13.5 V, Tj = 125 °C,
IOUT1,6 = ± 1.5 A
-
450
600
mΩ
VS = 8.0 V, Tj = 25 °C,
IOUT1,6 = ± 1.5 A
-
300
400
mΩ
VS = 13.5 V, Tj = 25 °C,
IOUT2,3 = ± 0.8A
-
800
1100
mΩ
VS = 13.5 V, Tj = 125 °C,
IOUT2,3 = ± 0.8 A
-
1250
1700
mΩ
VS = 8.0 V, Tj = 25 °C,
IOUT2,3 = ± 0.8 A
-
800
1100
mΩ
VS = 13.5 V, Tj = 25 °C,
IOUT4,5 = ± 3.0 A
-
150
200
mΩ
VS = 13.5 V, Tj = 125 °C,
IOUT4,5 = ± 3.0 A
-
225
300
mΩ
VS = 8.0 V, Tj = 25 °C,
IOUT4,5 = ± 3.0 A
-
150
200
mΩ
VS = 13.5 V, Tj = 25 °C,
IOUT7,8,9,10 = -0.8 A
-
800
1100
mΩ
VS = 13.5 V, Tj = 125 °C,
IOUT7,8,9,10 = -0.8 A
-
1250
1700
mΩ
VS = 8.0 V, Tj = 25 °C,
IOUT7,8,9,10 = -0.8 A
-
800
1100
mΩ
VS = 13.5 V, Tj = 25 °C,
IOUT11 = - 3.0 A
-
100
150
mΩ
VS = 13.5 V, Tj = 125 °C,
IOUT11 = - 3.0A
-
150
200
mΩ
VS = 8.0 V, Tj = 25 °C,
IOUT11 = - 3.0 A
-
100
150
mΩ
|IOUT1|,
|IOUT6|
Output current limitation to
supply or GND
Sink and source,
VS=13.5V
3
-
5
A
|IOUT2|,
|IOUT3|
Output current limitation to
supply or GND
Sink and source,
VS = 13.5V
1.5
-
2.5
A
|IOUT4|,
|IOUT5|
Output current limitation to
supply or GND
Sink and source,
VS = 13.5V
6
-
10
A
|IOUT7|,
|IOUT8|,
|IOUT9|,
|IOUT10|
Output current limitation to
GND
Source, VS = 13.5V
1.5
-
2.5
A
Doc ID 10311 Rev 10
L9950 - L9950XP
Table 11.
Symbol
Electrical specifications
OUT1 - OUT11 (continued)
Parameter
Test condition
Min.
Typ.
Max.
Unit
|IOUT11|
Output current limitation to
GND
Source, VS = 13.5V
6
-
10
A
td ON H
Output delay time,
highside driver on
VS = 13.5 V,
corresponding lowside
driver is not active
20
40
80
µs
td OFF H
Output delay time,
highside driver off
VS = 13.5 V
50
150
300
µs
td ON L
Output delay time,
lowside driver on
VS = 13.5 V,
corresponding highside
driver is not active
15
30
70
µs
td OFF L
Output delay time,
lowside driver off
VS = 13.5 V
80
150
300
µs
tD HL
Cross current protection time,
td ON L - td OFF H,
source to sink
-
200
400
µs
tD LH
Cross current protection time,
td ON H - td OFF L
sink to source
-
200
400
µs
0
-2
-5
µA
IQLH
Switched-off output current
highside drivers of OUT1-11
-40
-15
0
µA
0
110
180
µA
-40
-15
0
µA
IQLL
Switched-off output current
lowside drivers of OUT1-6
VOUT1-11=0 V, standby
mode
VOUT1-11=0 V, active
mode
VOUT1-6 = VS, standby
mode
VOUT1-6 = VS, active mode
IOLD1
Open load detection current
of OUT1
5
30
80
mA
IOLD23
Open load detection current
of OUT2, OUT3
15
40
60
mA
IOLD45
Open load detection current
of OUT4 and OUT5
60
150
300
mA
IOLD6
Open load detection current
of OUT6
30
70
150
mA
IOLD78910
Open load detection current
of OUT7, OUT8, OUT9,
OUT10
15
40
60
mA
IOLD11
Open load detection current
of OUT11
30
150
300
mA
tdOL
Minimum duration of open
load condition to set the
status bit
500
-
3000
µs
tISC
Minimum duration of overcurrent condition to switch off
the driver
10
-
100
µs
Doc ID 10311 Rev 10
13/39
Electrical specifications
Table 11.
Symbol
2.6
L9950 - L9950XP
OUT1 - OUT11 (continued)
Parameter
Test condition
Min.
Typ.
Max.
Unit
dVOUT16/dt Slew rate of OUT1,OUT6
VS =13.5 V
Iload = ±1.5 A
0.1
0.2
0.4
V/µs
dVOUT23/dt, Slew rate of OUT2/3 and
dVOUT78910/dt OUT7-OUT10
VS = 13.5 V
Iload = -0.8 A
0.09
0.2
0.4
V/µs
dVOUT45/dt Slew rate of OUT4, OUT5
VS = 13.5 V
Iload = ±3.0 A
0.1
0.2
0.4
V/µs
dVOUT11/dt Slew rate of OUT11
VS = 13.5 V
Iload = 3.0 A
0.1
0.2
0.4
V/µs
SPI - electrical characteristics
VS = 8 to 16 V, VCC = 4.5 to 5.3 V, Tj = - 40 to 150 °C, unless otherwise specified. The
voltages are referred to GND and currents are assumed positive, when the current flows into
the pin.
Table 12.
Symbol
Parameter
tset
Delay time
Table 13.
Symbol
Min.
Typ.
Max.
Unit
-
160
300
µs
Test condition
Min.
Typ.
Max.
Unit
Switching from standby to active mode.
Time until output drivers are enabled
after CSN going to high.
Inputs: CSN, CLK, PWM1/2 and DI
Parameter
Input low level
VCC = 5 V
1.5
2.0
-
V
VinH
Input high level
VCC = 5 V
-
3.0
3.5
V
VinHyst
Input hysteresis
VCC = 5 V
0.5
-
-
V
ICSN in
Pull up current at input CSN
VCSN = 3.5 V VCC = 5 V
-40
-20
-8
µA
ICLK in
Pull down current at input CLK
VCLK = 1.5 V
10
25
50
µA
VDI = 1.5 V
10
25
50
µA
VPWM = 1.5 V
10
25
50
µA
VCC = 0 to 5.3 V
-
10
15
pF
IPWM1 in
Cin
14/39
Test condition
VinL
IDI in
Note:
Delay time from standby to active mode
Pull down current at input DI
Pull down current at input
PWM1
Input capacitance at input
CSN, CLK, DI and PWM1/2
Value of input capacity is not measured in production test. Parameter guaranteed by design.
Doc ID 10311 Rev 10
L9950 - L9950XP
Table 14.
Electrical specifications
DI timing
Symbol
Note:
Parameter
Test condition
Min.
Typ.
Max.
Unit
tCLK
Clock period
VCC = 5 V
1000
-
-
ns
tCLKH
Clock high time
VCC = 5 V
400
-
-
ns
tCLKL
Clock low time
VCC = 5 V
400
-
-
ns
tset CSN
CSN setup time, CSN low
before rising edge of CLK
VCC = 5 V
400
-
-
ns
tset CLK
CLK setup time, CLK high
before rising edge of CSN
VCC = 5 V
400
-
-
ns
tset DI
DI setup time
VCC = 5 V
200
-
-
ns
thold time
DI hold time
VCC = 5 V
200
-
-
ns
tr in
Rise time of input signal DI,
CLK, CSN
VCC = 5 V
-
-
100
ns
tf in
Fall time of input signal DI,
CLK, CSN
VCC = 5 V
-
-
100
ns
Min.
Typ.
Max.
Unit
-
0.2
0.4
V
-
V
DI timing parameters tested in production by a passed/failed test:
Tj=-40 °C/+25 °C: SPI communication @2 MHZ.
Tj=+125 °C: SPI communication @1.25 MHZ.
Table 15.
Symbol
DO
Parameter
Test condition
VDOL
Output low level
VCC = 5 V, ID = -2 mA
VDOH
Output high level
VCC = 5 V, ID = 2 mA
IDOLK
Tristate leakage current
VCSN = VCC,
0 V < VDO < VCC
-10
-
10
µA
CDO(1)
Tristate input
capacitance
VCSN = VCC,
0 V < VCC < 5.3 V
-
10
15
pF
VCC -0.4 VCC-0.2
1. Value of input capacity is not measured in production test. Parameter guaranteed by design.
Doc ID 10311 Rev 10
15/39
Electrical specifications
Table 16.
L9950 - L9950XP
DO timing
Symbol
Parameter
Test condition
Min.
Typ.
Max. Unit
tr DO
DO rise time
CL = 100 pF, Iload = -1 mA
-
80
140
ns
tf DO
DO fall time
CL = 100 pF, Iload = 1 mA
-
50
100
ns
ten DO tri L
DO enable time
from tristate to low level
CL = 100 pF, Iload = 1 mA
pull-up load to VCC
-
100
250
ns
tdis DO L tri
DO disable time
from low level to tristate
CL = 100 pF, Iload = 4 mA
pull-up load to VCC
-
380
450
ns
ten DO tri H
DO enable time
CL =100 pF, Iload = -1 mA
from tristate to high level pull-down load to GND
-
100
250
ns
tdis DO H tri
DO disable time
CL = 100 pF, Iload = -4 mA
from high level to tristate pull-down load to GND
-
380
450
ns
-
50
250
ns
td DO
VDO < 0.3 VCC, VDO > 0.7 VCC,
CL = 100 pF
DO delay time
Table 17.
CSN timing
Symbol
Parameter
Test condition
Min.
Typ.
Max.
Unit
tCSN_HI,stb
Minimum CSN HI time,
Transfer of SPI command
switching from standby mode to Input Register
-
20
50
µs
tCSN_HI,min
Maximum CSN HI time,
active mode
-
2
4
µs
Figure 3.
Transfer of SPI command
to input register
SPI - transfer timing diagram
CSN high to low: DO enabled
CSN
time
CLK
0
1
2
3
4
5
6
7
X
18 19
X
0
20 21 22 23
time
DI: data will be accepted on the rising edge of CLK signal
DI
0
1
2
3
4
5
6
7
X
X
18 19
0
20 21 22 23
DO: data will change on the falling edge of CLK signal
DO
0
1
2
3
fault bit
Input
Data
Register
16/39
4
5
6
7
X
X
18 19
20 21 22
23
1
time
0
1
time
CSN low to high: actual data is
transfered to output power switches
old data
1
new data
time
Doc ID 10311 Rev 10
L9950 - L9950XP
Electrical specifications
Figure 4.
SPI - input timing
0.8 VCC
CSN
0.2 VCC
t
t
set CSN
t
CLKH
se t CLK
0.8 VCC
CLK
0.2 VCC
t
t
set DI
hold DI
t
CLKL
0.8 VCC
Valid
DI
Valid
0.2 VCC
Figure 5.
SPI - DO valid data delay time and valid time
t f in
t r in
0.8 VCC
0.5 VCC
0.2 VCC
CLK
t r DO
DO
(low to high)
0.8 VCC
0.2 VCC
t d DO
t f DO
0.8 VCC
DO
(high to low)
0.2 VCC
Doc ID 10311 Rev 10
17/39
Electrical specifications
Figure 6.
L9950 - L9950XP
SPI - DO enable and disable time
tf in
tr in
0.8 VCC
50%
0.2 VCC
CSN
50%
DO
pull-up load to VCC
C L = 100 pF
ten DO tri L
t dis DO L tri
50%
DO
pull-down load to GND
C L = 100 pF
ten DO tri H
Figure 7.
t dis DO H tri
SPI - driver turn-on/off timing, minimum csn hi time
CSN low to high: data from shift register
is transferred to output power switches
t r in
t f in
tCSN_HI,min
80%
50%
20%
CSN
tdOFF
output current
of a driver
ON state
OFF state
80%
50%
20%
t OFF
tdON
t ON
output current
of a driver
18/39
OFF state
Doc ID 10311 Rev 10
ON state
80%
50%
20%
L9950 - L9950XP
Figure 8.
Electrical specifications
SPI - timing of status bit 0 (fault condition)
CSN high to low and CLK stays low: status information of data bit 0 (fault condition) is transfered to DO
CSN
time
CLK
time
DI
time
DI: data is not accepted
DO
0time
DO: status information of data bit 0 (fault condition) will stay as long as CSN is low
Doc ID 10311 Rev 10
19/39
Application information
L9950 - L9950XP
3
Application information
3.1
Dual power supply: VS and VCC
The power supply voltage VS supplies the half bridges and the highside drivers. An internal
charge-pump is used to drive the highside switches. The logic supply voltage VCC (stabilized
5 V) is used for the logic part and the SPI of the device.
Due to the independent logic supply voltage the control and status information will not be
lost, if there are temporary spikes or glitches on the power supply voltage. In case of poweron (VCC increases from under voltage to VPOR OFF = 4.2 V) the circuit is initialized by an
internally generated power on reset (POR). If the voltage VCC decreases under the
minimum threshold (VPOR ON = 3.4 V), the outputs are switched to tristate (high impedance)
and the status registers are cleared.
3.2
Standby mode
The standby mode of the L9950 is activated by clearing the bit 23 of the Input Data
Register 0. All latched data will be cleared and the inputs and outputs are switched to high
impedance. In the standby mode the current at VS (VCC) is less than 6 µA (50 µA) for
CSN = high (DO in tristate). By switching the VCC voltage a very low quiescent current can
be achieved. If bit 23 is set, the device will be switched to active mode.
3.3
Inductive loads
Each half bridge is built by an internally connected highside and a lowside power DMOS
transistor. Due to the built-in reverse diodes of the output transistors, inductive loads can be
driven at the outputs OUT1 to OUT6 without external free wheeling diodes. The highside
drivers OUT7 to OUT11 are intended to drive resistive loads. Hence only a limited energy
(E<1 mJ) can be dissipated by the internal ESD diodes in freewheeling condition. For
inductive loads (L>100 µH) an external free wheeling diode connected to GND and the
corresponding output is needed.
3.4
Diagnostic functions
All diagnostic functions (over/open load, power supply over-/undervoltage, temperature
warning and thermal shutdown) are internally filtered and the condition has to be valid for at
least 32 µs (open load: 1 ms, respectively) before the corresponding status bit in the status
registers will be set. The filters are used to improve the noise immunity of the device. Open
load and temperature warning function are intended for information purpose and will not
change the state of the output drivers. On contrary, the overload and thermal shutdown
condition will disable the corresponding driver (overload) or all drivers (thermal shutdown),
respectively. Without setting the over-current recovery bits in the Input Data register, the
microcontroller has to clear the over-current status bits to reactivate the corresponding
drivers.
20/39
Doc ID 10311 Rev 10
L9950 - L9950XP
3.5
Application information
Overvoltage and under voltage detection
If the power supply voltage VS rises above the overvoltage threshold VSOV OFF (typical
21 V), the outputs OUT1 to OUT11 are switched to high impedance state to protect the load.
When the voltage VS drops below the under voltage threshold VSUV OFF (UV switch OFF
voltage), the output stages are switched to the high impedance to avoid the operation of the
power devices without sufficient gate driving voltage (increased power dissipation). If the
supply voltage VS recovers to normal operating voltage the outputs stages return to the
programmed state (input register 0: bit 20=0).
If the under voltage/overvoltage recovery disable bit is set, the automatic turn-on of the
drivers is deactivated. The microcontroller needs to clear the status bits to reactivate the
drivers. It is recommended to set bit 20 to avoid a possible high current oscillation in case of
a shorted output to GND and low battery voltage.
3.6
Temperature warning and thermal shutdown
If junction temperature rises above Tj TW a temperature warning flag is set and is detectable
via the SPI. If junction temperature increases above the second threshold Tj SD, the thermal
shutdown bit will be set and power DMOS transistors of all output stages are switched off to
protect the device. In order to reactivate the output stages the junction temperature must
decrease below Tj SD - Tj SD HYS and the thermal shutdown bit has to be cleared by the
microcontroller.
3.7
Open-load detection
The open load detection monitors the load current in each activated output stage. If the load
current is below the open load detection threshold for at least 1 ms (tdOL) the corresponding
open load bit is set in the status register. Due to mechanical/electrical inertia of typical loads
a short activation of the outputs (e.g. 3ms) can be used to test the open load status without
changing the mechanical/electrical state of the loads.
3.8
Over load detection
In case of an over-current condition a flag is set in the status register in the same way as
open load detection. If the over-current signal is valid for at least tISC = 32 µs, the overcurrent flag is set and the corresponding driver is switched off to reduce the power
dissipation and to protect the integrated circuit. If the over-current recovery bit of the output
is zero the microcontroller has to clear the status bits to reactivate the corresponding driver.
Doc ID 10311 Rev 10
21/39
Application information
3.9
L9950 - L9950XP
Current monitor
The current monitor output sources a current image at the current monitor output which has
a fixed ratio (1/10000) of the instantaneous current of the selected highside driver. The bits
18 and 19 of the Input Data Register 0 control which of the outputs OUT1, OUT4, OUT5,
OUT6 and OUT11 will be multiplexed to the current monitor output. The current monitor
output allows a more precise analysis of the actual state of the load rather than the detection
of an open or overload condition. For example this can be used to detect the motor state
(starting, free running, stalled). Moreover, it is possible to regulate the power of the defroster
more precise by measuring the load current. The current monitor output is bidirectional (c.f.
PWM inputs).
3.10
PWM inputs
Each driver has a corresponding PWM enable bit which can be programmed by the SPI
interface. If the PWM enable bit is set, the output is controlled by the logically AND
combination of the PWM signal and the output control bit in Input Data Register. The outputs
OUT1-OUT8 and OUT11 are controlled by the PWM1 input and the outputs OUT9/10 are
controlled by the bidirectional input CM/PMW2. For example, the two PWM inputs can be
used to dim two lamps independently by external PWM signals.
3.11
Cross current protection
The six half brides of the device are cross current protected by an internal delay time. If one
driver (LS or HS) is turned off the activation of the other driver of the same half bridge will be
automatically delayed by the cross current protection time. After the cross current protection
time is expired the slew rate limited switch off phase of the driver will be changed to a fast
turn-off phase and the opposite driver is turned on with slew rate limitation. Due to this
behavior it is always guaranteed that the previously activated driver is totally turned off
before the opposite driver will start to conduct.
3.12
Programmable soft start function to drive loads with higher
inrush current
Loads with start-up currents higher than the over-current limits (e.g. inrush current of lamps,
start current of motors and cold resistance of heaters) can be driven by using the
programmable soft start function (i.e. overcurrent recovery mode). Each driver has a
corresponding over-current recovery bit. If this bit is set, the device will automatically switchon the outputs again after a programmable recovery time. The duty cycle in over-current
condition can be programmed by the SPI interface to be about 12% or 25%. The PWM
modulated current will provide sufficient average current to power up the load (e.g. heat up
the bulb) until the load reaches operating condition.
The device itself cannot distinguish between a real overload and a non linear load like a light
bulb. A real overload condition can only be qualified by time. As an example the
microcontroller can switch on light bulbs by setting the over-current Recovery bit for the first
50ms. After clearing the recovery bit the output will be automatically disabled if the overload
condition still exits.
22/39
Doc ID 10311 Rev 10
L9950 - L9950XP
Figure 9.
Application information
Example of programmable soft start function for inductive loads
Doc ID 10311 Rev 10
23/39
Functional description of the SPI
L9950 - L9950XP
4
Functional description of the SPI
4.1
Serial Peripheral Interface (SPI)
This device uses a standard SPI to communicate with a microcontroller. The SPI can be
driven by a microcontroller with its SPI peripheral running in following mode: CPOL = 0 and
CPHA = 0.
For this mode, input data is sampled by the low to high transition of the clock CLK, and
output data is changed from the high to low transition of CLK.
This device is not limited to microcontroller with a build-in SPI. Only three CMOS-compatible
output pins and one input pin will be needed to communicate with the device. A fault
condition can be detected by setting CSN to low. If CSN = 0, the DO pin will reflect the
status bit 0 (fault condition) of the device which is a logical or of all bits in the status registers
0 and 1. The microcontroller can poll the status of the device without the need of a full SPI
communication cycle.
Note:
In contrast to the SPI standard the least significant bit (LSB) will be transferred first
(see Figure 3).
4.2
Chip Select Not (CSN)
The input pin is used to select the serial interface of this device. When CSN is high, the
output pin (DO) will be in high impedance state. A low signal will activate the output driver
and a serial communication can be started. The state when CSN is going low until the rising
edge of CSN will be called a communication frame. If the CSN input pin is driven above
7.5V, the L9950 will go into a test mode. In the test mode the DO will go from tri state to
active mode.
4.3
Serial Data In (DI)
The input pin is used to transfer data serial into the device. The data applied to the DI will be
sampled at the rising edge of the CLK signal and shifted into an internal 24 bit shift register.
At the rising edge of the CSN signal the contents of the shift register will be transferred to
Data Input Register. The writing to the selected Data Input Register is only enabled if exactly
24 bits are transmitted within one communication frame (i.e. CSN low). If more or less clock
pulses are counted within one frame the complete frame will be ignored. This safety function
is implemented to avoid an activation of the output stages by a wrong communication frame.
Note:
24/39
Due to this safety functionality a daisy chaining of SPI is not possible. Instead, a parallel
operation of the SPI bus by controlling the CSN signal of the connected ICs is
recommended.
Doc ID 10311 Rev 10
L9950 - L9950XP
4.4
Functional description of the SPI
Serial Data Out (DO)
The data output driver is activated by a logical low level at the CSN input and will go from
high impedance to a low or high level depending on the status bit 0 (fault condition). The first
rising edge of the CLK input after a high to low transition of the CSN pin will transfer the
content of the selected status register into the data out shift register. Each subsequent
falling edge of the CLK will shift the next bit out.
4.5
Serial clock (CLK)
The CLK input is used to synchronize the input and output serial bit streams. The data input
(DI) is sampled at the rising edge of the CLK and the data output (DO) will change with the
falling edge of the CLK signal.
4.6
Input data register
The device has two input registers. The first bit (bit 0) at the DI input is used to select one of
the two Input Registers. All bits are first shifted into an input shift register. After the rising
edge of CSN the contents of the input shift register will be written to the selected Input Data
Register only if a frame of exact 24 data bits are detected. Depending on bit 0 the contents
of the selected status register will be transferred to DO during the current communication
frame. Bit 1-17 controls the behavior of the corresponding driver.
If bit 23 is zero, the device will go into the standby mode. The bits 18 and 19 are used to
control the current monitor multiplexer. Bit 22 is used to reset all status bits in both status
registers. The bits in the status registers will be cleared after the current communication
frame (rising edge of CSN).
4.7
Status register
This devices uses two status registers to store and to monitor the state of the device. Bit 0 is
used as a fault bit and is a logical NOR combination of bits 1-22 in both status registers. The
state of this bit can be polled by the microcontroller without the need of a full SPI
communication cycle. If one of the over-current bits is set, the corresponding driver will be
disabled. If the over-current recovery bit of the output is not set the microcontroller has to
clear the over-current bit to enable the driver. If the thermal shutdown bit is set, all drivers
will go into a high impedance state. Again the microcontroller has to clear the bit to enable
the drivers.
Doc ID 10311 Rev 10
25/39
Functional description of the SPI
4.8
L9950 - L9950XP
Test mode
The test mode can be entered by rising the CSN input to a voltage higher than 7.0 V. In the
test mode the inputs CLK, DI, PWM1/2 and the internal 2 MHz CLK can be multiplexed to
data output DO for testing purpose. Furthermore the over-current thresholds are reduced by
a factor of 4 to allow EWS testing at lower current. For EWS testing a special test pad is
available to measure the internal bandgap voltage, the TW and TSD thresholds.
The internal logic prevents that the Hi-Side and Lo-Side driver of the same half-bridge can
be switched on at the same time. In the test mode this combination is used to multiplex the
desired signals according to following table:
Table 18.
Test mode
LS1 HS1 LS2 HS2 LS3 HS3
26/39
DO
LS3 HS3 LS4 HS4 LS5 HS5
Test pad
! (both HI)
! (both HI)
! (both HI)
No error
! (both HI)
! (both HI)
! (both HI)
5µA Iref
both HI
! (both HI)
! (both HI)
DI
both HI
! (both HI)
! (both HI)
Tsens1
! (both HI)
both HI
! (both HI)
CLK
! (both HI)
both HI
! (both HI)
Tsens2
both HI
both HI
! (both HI)
INT_CLK
both HI
both HI
! (both HI)
Tsens3
! (both HI)
! (both HI)
both HI
PWM1
! (both HI)
! (both HI)
both HI
Tsens4
both HI
! (both HI)
both HI
PWM2
both HI
! (both HI)
both HI
Tsens5
! (both HI)
both HI
both HI
Tsens6
both HI
both HI
both HI
Vbandgap
Doc ID 10311 Rev 10
L9950 - L9950XP
Functional description of the SPI
Table 19.
SPI - input data and status registers 0
Input register 0 (write)
Status register 0 (read)
Bit
23
22
Name
Comment
Enable bit
If Enable Bit is set the
device will be switched in
active mode. If Enable Bit
is cleared device go into
standby mode and all bits
are cleared. After poweron reset device starts in
standby mode.
Reset bit
If Reset Bit is set both
status registers will be
cleared after rising edge
of CSN input.
OC recovery
duty cycle
21
0: 12%
1:
25%
20
19
Depending on
combination of bit 18 and
19 the current image
(1/10.000) of the selected
HS output will be multiplexed to the CM output:
Current monitor
select bits
Comment
Always 1
A broken VCC or SPI
connection of the L9950 can
be detected by the
microcontroller, because all 24
bits low or high is not a valid
frame.
In case of an overvoltage or
VS overvoltage undervoltage event the
corresponding bit is set and
the outputs are deactivated. If
This bit defines in
VS voltage recovers to normal
combination with the overoperating conditions outputs
current recovery bit (Input
VS undervoltage are reactivated automatically
Register 1) the duty cycle
(if Bit 20 of status register 0 is
in over-current condition
not set).
of an activated driver.
If this bit is set the
microcontroller has to
Overvoltage/Un clear the status register
dervoltage
after
recovery disable undervoltage/overvoltage
event to enable the
outputs.
18
Name
Bit
19
Bit
18
Output
0
0
OUT11
1
0
OUT1/OUT
6
0
1
OUT5
1
1
OUT4
Thermal
shutdown
In case of an thermal
shutdown all outputs are
switched off.
The microcontroller has to
clear the TSD bit by setting the
Reset Bit to reactivate the
outputs.
Temperature
warning
This bit is for information
purpose only. It can be used
for a thermal management by
the microcontroller to avoid a
thermal shutdown.
Not ready bit
After switching the device from
standby mode to active mode
an internal timer is started to
allow charge pump to settle
before the outputs can be
activated. This bit is cleared
automatically after start up
time has finished. Since this
bit is controlled by internal
clock it can be used for
synchronizing testing events
(e.g. measuring filter times).
HS driver of OUT1 is only
selected if HS driver
OUT1 is switched on and
HS driver OUT6 is not
activated.
Doc ID 10311 Rev 10
27/39
Functional description of the SPI
Table 19.
L9950 - L9950XP
SPI - input data and status registers 0 (continued)
Input register 0 (write)
Status register 0 (read)
Bit
Name
Name
17
OUT11 – HS
on/off
OUT11 – HS
over-current
16
OUT10 – HS
on/off
OUT10 – HS
over-current
15
OUT9 – HS
on/off
OUT9 – HS
over-current
14
OUT8 – HS
on/off
OUT8 – HS
over-current
13
OUT7 – HS
on/off
12
OUT6 – HS
on/off
11
OUT6 – LS
on/off
10
OUT5 – HS
on/off
9
OUT5 – LS
on/off
8
OUT4 – HS
on/off
7
OUT4 – LS
on/off
6
OUT3 – HS
on/off
5
OUT3 – LS
on/off
4
OUT2 – HS
on/off
OUT2 – HS
over-current
3
OUT2 – LS
on/off
OUT2 – LS
over-current
2
OUT1 – HS
on/off
OUT1 – HS
over-current
1
OUT1 – LS
on/off
OUT1 – LS
over-current
0
28/39
Comment
If a bit is set the selected
output driver is switched
on. If the corresponding
PWM enable bit is set
(Input Register 1) the
driver is only activated if
PWM1 (PWM2) input
signal is high. The outputs
of OUT1-OUT6 are half
bridges. If the bits of HSand LS driver of the same
half bridge are set, the
internal logic prevents that
both drivers of this output
stage can be switched on
simultaneously in order to
avoid a high internal
current from VS to GND.
In test mode (CSN>7.5 V)
this bit combinations are
used to multiplex internal
signals to the DO output.
Comment
OUT7 – HS
over-current
OUT6 – HS
over-current
OUT6 – LS
over-current
OUT5 – HS
over-current
OUT5 – LS
over-current
OUT4 – HS
over-current
OUT4 – LS
over-current
OUT3 – HS
over-current
In case of an over-current
event the corresponding
status bit is set and the output
driver is disabled. If the overcurrent Recovery Enable bit is
set (Input Register 1) the
output will be automatically
reactivated after a delay time
resulting in a PWM modulated
current with a programmable
duty cycle (Bit 21).
If the over-current recovery bit
is not set the microcontroller
has to clear the over-current
bit (Reset Bit) to reactivate the
output driver.
OUT3 – LS
over-current
0
No error bit
Doc ID 10311 Rev 10
A logical NOR combination of
all bits 1 to 22 in both status
registers.
L9950 - L9950XP
Functional description of the SPI
Table 20.
Bit
SPI - input data and status registers 1
Input register 1 (write)
Status register 1 (read)
Name
Comment
23
Enable bit
If Enable bit is set the device
will be switched in active mode.
If Enable Bit is cleared device
go into standby mode and all
bits are cleared. After poweron reset device starts in
standby mode.
22
OUT11 OC
Recovery
Enable
VS overvoltage
21
OUT10 OC
Recovery
Enable
VS undervoltage
20
19
18
OUT9 OC
Recovery
Enable
OUT8 OC
Recovery
Enable
In case of an over-current
event the over-current status
bit (Status Register 0) is set
and the output is switched off.
If the over-current Recovery
Enable bit is set the output will
be automatically reactivated
after a delay time resulting in a
PWM modulated current with a
programmable duty cycle (Bit
21 of Input Data Register 0).
Depending on occurrence of
Overcurrent Event and internal
clock phase it is possible that
one recovery cycle is executed
even if this bit is set to zero.
OUT7 OC
Recovery
enable
Doc ID 10311 Rev 10
Name
Comment
Always 1
A broken VCC or SPI
connection of the L9950
can be detected by the
microcontroller, because
all 24 bits low or high is
not a valid frame.
In case of an overvoltage
or undervoltage event
the corresponding bit is
set and the outputs are
deactivated. If VS
voltage recovers to
normal operating
conditions outputs are
reactivated automatically.
In case of an thermal
shutdown all outputs are
switched off. The
Thermal shutdown microcontroller has to
clear the TSD bit by
setting the Reset Bit to
reactivate the outputs.
Temperature
warning
This bit is for information
purpose only. It can be
used for a thermal
management by the
microcontroller to avoid a
thermal shutdown.
Not ready bit
After switching the
device from standby
mode to active mode an
internal timer is started
to allow charge pump to
settle before the outputs
can be activated. This bit
is cleared automatically
after start up time has
finished. Since this bit is
controlled by internal
clock it can be used for
synchronizing testing
events(e.g. measuring
filter times).
29/39
Functional description of the SPI
Table 20.
Bit
SPI - input data and status registers 1 (continued)
Input register 1 (write)
Name
Comment
Status register 1 (read)
Name
17
OUT6 OC
Recovery
Enable
OUT11 – HS
open load
16
OUT5 OC
Recovery
Enable
OUT10 – HS
open load
15
OUT4 OC
Recovery
Enable
14
OUT3 OC
Recovery
Enable
13
OUT2 OC
Recovery
Enable
OUT7 – HS
open load
12
OUT1 OC
Recovery
Enable
OUT6 – HS
open load
11
OUT11 PWM1
Enable
OUT6 – LS
open load
10
OUT10 PWM2
Enable
OUT5 – HS
open load
9
OUT9 PWM2
Enable
OUT5 – LS
open load
8
OUT8 PWM1
Enable
OUT4 – HS
open load
7
OUT7 PWM1
Enable
6
OUT6 PWM1
Enable
5
OUT4 PWM1
Enable
4
OUT4 PWM1
Enable
3
OUT3 PWM1
Enable
OUT2– LS
open load
2
OUT4 PWM1
Enable
OUT1 – HS
open load
1
OUT4 PWM1
Enable
OUT1 – LS
open load
0
30/39
L9950 - L9950XP
After 50 ms the bit can be
cleared. If over-current
condition still exists, a wrong
load can be assumed.
If the PWM1/2 Enable Bit is set
and the output is enabled
(Input Register 0) the output is
switched on if PWM1/2 input is
high and switched off if
PWM1/2 input is low. OUT9
and OUT10 is controlled by
PWM2 input all other outputs
are controlled by PWM1 input.
1
OUT9 – HS
open load
OUT8 – HS
open load
OUT4 – LS
open load
OUT3 – HS
open load
OUT3 – LS
open load
OUT2 –HS
open load
No Error bit
Doc ID 10311 Rev 10
Comment
The open load detection
monitors the load current
in each activated output
stage. If the load current
is below the open load
detection threshold for at
least 1 ms (tdOL) the
corresponding open load
bit is set. Due to
mechanical/electrical
inertia of typical loads a
short activation of the
outputs (e.g. 3 ms) can
be used to test the open
load status without
changing the
mechanical/electrical
state of the loads.
The open load detection
monitors the load current
in each activated output
stage. If the load current
is below the open load
detection threshold for at
least 1 ms (tdOL) the
corresponding open load
bit is set. Due to
mechanical/electrical
inertia of typical loads a
short activation of the
outputs (e.g. 3 ms) can
be used to test the open
load status without
changing the
mechanical/electrical
state of the loads.
A logical NOR
combination of all bits 1
to 22 in both status
registers.
L9950 - L9950XP
5
Packages thermal data
Packages thermal data
Figure 10. Packages thermal data
Doc ID 10311 Rev 10
31/39
Package and packing information
L9950 - L9950XP
6
Package and packing information
6.1
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
6.2
PowerSO-36 package information
Figure 11.
32/39
PowerSO-36 package dimensions
Doc ID 10311 Rev 10
L9950 - L9950XP
Package and packing information
Table 21.
PowerSO-36 mechanical data
Millimeters
Symbol
Min.
Typ.
Max.
A
-
-
3.60
a1
0.10
-
0.30
a2
-
-
3.30
a3
0
-
0.10
b
0.22
-
0.38
c
0.23
-
0.32
D*
15.80
-
16.00
D1
9.40
-
9.80
E
13.90
-
14.5
E1 *
10.90
-
11.10
E2
-
-
2.90
E3
5.80
-
6.20
e
-
0.65
-
e3
-
11.05
-
G
0
-
0.10
H
15.50
-
15.90
h
-
-
1.10
L
0.8
-
1.10
M
-
-
-
N
-
-
10 deg
R
-
-
-
s
-
-
8 deg
Doc ID 10311 Rev 10
33/39
Package and packing information
6.3
L9950 - L9950XP
PowerSSO-36 package information
Figure 12. PowerSSO-36 package dimensions
Table 22.
PowerSSO-36 mechanical data
Symbol
34/39
Millimeters
Min.
Typ.
Max.
A
2.15
-
2.45
A2
2.15
-
2.35
a1
0
-
0.10
b
0.18
-
0.36
c
0.23
-
0.32
D(1)
10.10
-
10.50
E
7.4
-
7.6
e
-
0.5
-
e3
-
8.5
-
F
-
2.3
-
G
-
-
0.1
G1
-
-
0.06
H
10.1
-
10.5
h
-
-
0.4
k
0°
-
8°
Doc ID 10311 Rev 10
L9950 - L9950XP
Package and packing information
Table 22.
PowerSSO-36 mechanical data (continued)
Symbol
Millimeters
Min.
Typ.
Max.
L
0.55
-
0.85
M
-
4.3
-
N
-
-
10°
O
-
1.2
-
Q
-
0.8
-
S
-
2.9
-
T
-
3.65
-
U
-
1
-
X
4.3
-
5.2
Y
6.9
-
7.5
1. “D” and “E” do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.15 mm
per side (0.006”).
6.4
PowerSO-36 packing information
Figure 13. PowerSO-36 tube shipment (no suffix)
Doc ID 10311 Rev 10
35/39
Package and packing information
L9950 - L9950XP
Figure 14. PowerSO-36 tape and reel shipment (suffix “TR”)
TAPE DIMENSIONS
A0
B0
K0
K1
F
P1
W
15.20 ± 0.1
16.60 ± 0.1
3.90 ± 0.1
3.50 ± 0.1
11.50 ± 0.1
24.00 ± 0.1
24.00 ± 0.3
All dimensions are in mm.
36/39
Doc ID 10311 Rev 10
REEL DIMENSIONS
Base qty
Bulk qty
A (max)
B (min)
C (±0.2)
D (min)
G (+2 / -0)
N (min)
T (max)
600
600
330
1.5
13
20.2
24.4
60
30.4
L9950 - L9950XP
6.5
Package and packing information
PowerSSO-36 packing information
Figure 15. PowerSSO-36 tube shipment (no suffix)
C
Base qty
Bulk qty
Tube length (±0.5)
A
B
C (±0.1)
B
49
1225
532
3.5
13.8
0.6
All dimensions are in mm.
A
Figure 16. PowerSSO-36 tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base qty
Bulk qty
A (max)
B (min)
C (±0.2)
F
G (+2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
24.4
100
30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape hole spacing
Component spacing
Hole diameter
Hole diameter
Hole position
Compartment depth
Hole spacing
W
P0 (±0.1)
P
D (±0.05)
D1 (min)
F (±0.1)
K (max)
P1 (±0.1)
24
4
12
1.55
1.5
11.5
2.85
2
End
All dimensions are in mm.
Start
Top
cover
tape
No components Components
500mm min
No components
500mm min
Empty components pockets
sealed with cover tape.
User direction of feed
Doc ID 10311 Rev 10
37/39
Revision history
7
L9950 - L9950XP
Revision history
Table 23.
Document revision history
Date
Revision
Apr-2004
1
First Issue
Jun-2004
2
Changed maturity from product preview to final;
Changed values in the Table 4: ESD protection
Jul-2004
3
Minor changes
Jun-2005
4
PowerSSO-36 package insertion
Jul-2005
5
Figure 1 modification
Sep-2005
6
Features modification;
Table 7 modification (ICC; IS + ICC);
Figure 10 modification;
IQLL modification.
14-Nov-2007
7
Document restructured and reformatted.
Added PowerSO-36 packing information and PowerSSO-36 packing
information.
05-Nov-2008
8
Updated Table 22: PowerSSO-36 mechanical data.
30-Mar-2009
9
Changed Section : Application on cover page
Changed Section 6.1: ECOPACK®
10
Table 22: PowerSSO-36 mechanical data:
– Changed A (max) value from 2.50 to 2.45
– Changed A2 (max) value from 2.40 to 2.35
– Changed L (max) value from 0.90 to 0.85
09-Jun-2009
38/39
Description of changes
Doc ID 10311 Rev 10
L9950 - L9950XP
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Doc ID 10311 Rev 10
39/39