1 of 3 Creation Date : December 11, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ4C2C0G1H331J060AA TDK item description CGJ4C2C0G1H331JT**** Applications Feature Series High Reliability Grade General General (Up to 50V) AEC-Q200 AEC-Q200 CGJ4(2012) [EIA 0805] Status Production (Not Recommended for New Design) Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 0.60mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 330pF ±5% Rated Voltage 50VDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : December 11, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ4C2C0G1H331J060AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGJ4C2C0G1H331J060AA ESR CGJ4C2C0G1H331J060AA Capacitance CGJ4C2C0G1H331J060AA CGJ4C2C0G1H331J060AA Temperature Characteristic CGJ4C2C0G1H331J060AA(No Bias) DC Bias Characteristic CGJ4C2C0G1H331J060AA(DC Bias = 25V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors CGJ4C2C0G1H331J060AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : December 11, 2017 (GMT)