Vishay OMM02040E2FB1 Thin film mini-melf resistor Datasheet

SMM0204
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Vishay Draloric
Thin Film Mini-MELF Resistors
FEATURES
• Advanced metal film technology
• AEC-Q200 qualified
• Approval acc. EN 140401-803 available on
request
• Excellent stability in different environmental
conditions
SMM 0204 thin film MELF resistors are the perfect choice
for most fields of modern electronics where reliability and
stability are of major concern. The typical applications in the
fields of automotive, industrial and medical equipment
reflect the outstanding level of proven reliability.
• Best in class pulse load capability
• Intrinsic sulfur resistance
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Telecommunication
• Industrial
• Medical equipment
TECHNICAL SPECIFICATIONS
DESCRIPTION
SMM0204
DIN size
0204
Metric size code
RC 3715M
Resistance range
0.22 Ω to 10 MΩ
Resistance tolerance
± 5 %; ± 1 %; ± 0.5 %; ± 0.25 %; ± 0.1 %
Temperature coefficient
± 100 ppm/K; ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K
Rated dissipation P70 (1)
0.4 W
Operating voltage, Umax. ACRMS/DC
Permissible film temperature, ϑF max.
200 V
(1)
155 °C
Operating temperature range (1)
-55 °C to 155 °C
Permissible voltage against ambient (insulation):
1 min; Uins
Failure rate: FITobserved
Zero-Ohm-Resistor: OMM0204
300 V
≤ 0.1 x 10-9/h
Rmax. = 10 mΩ; Imax. = 3 A
Notes
• The IECQ-CECC approved product versions SMM0204 EN803 E0 and OMM0204 EN803 E0 respectively feature a quality factor πQ = 3 for
the purpose of system MTBF calculations, compared with πQ = 10 for the standard versions.
(1) Please refer to APPLICATION INFORMATION below.
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime
Revision: 09-Dec-15
Document Number: 20004
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MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE
Rated dissipation, P70
PRECISION
STANDARD
POWER
0.07 W
0.25 W
0.4 W
-10 °C to 85 °C
-55 °C to 125 °C
-55 °C to 155 °C
85 °C
125 °C
155 °C
10 Ω to 1 MΩ
0.22 Ω to 1 MΩ
0.22 Ω to 10 MΩ
1000 h
≤ 0.05 %
≤ 0.15 %
≤ 0.25 %
8000 h
≤ 0.1 %
≤ 0.3 %
≤ 0.5 %
225 000 h
≤ 0.25 %
≤ 0.75 %
-
SMM0204
Operating temperature range
Permissible film temperature, ϑF max.
SMM0204
Max. resistance change at P70 for
resistance range, |ΔR/R| after:
Note
• The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
TOLERANCE
RESISTANCE
E-SERIES
± 100 ppm/K
±5%
0.22 Ω to 10 MΩ
E24
±1%
0.82 Ω to 10 MΩ
E24; E96
± 0.5 %
10 Ω to 1.65 MΩ
E24; E192
± 0.5 %
10 Ω to 1.65 MΩ
± 0.25 %
22 Ω to 1.65 MΩ
± 0.1 %
22 Ω to 1.65 MΩ
± 0.5 %
10 Ω to 221 kΩ
± 0.25 %
22 Ω to 221 kΩ
± 0.1 %
43 Ω to 221 kΩ
≤ 10 mΩ
0Ω
± 50 ppm/K
± 25 ppm/K
SMM0204
± 15 ppm/K
Jumper, Imax. = 3 A
E24; E192
E24; E192
Notes
• The color of the body coating is light green for jumpers and for a temperature coefficient of ± 50 ppm/K or ± 100 ppm/K, pink for ± 25 ppm/K,
or violet for ± 15 ppm/K.
• Zero ohm jumper are marked with one centered black band.
PACKAGING
TYPE / SIZE
SMM0204
OMM0204
SMM0204 EN803 E0
OMM0204 EN803 E0
CODE
QUANTITY
B1 (1)
1000 (1)
B3
3000
B0
10 000
B1
1000
B3
3000
B0
10 000
PACKAGING
STYLE
WIDTH
PITCH
8 mm
4 mm
PACKAGING
DIMENSIONS
Ø 180 mm/7"
Ø 330 mm/13"
Antistatic blister tape acc.
IEC 60286-3, Type 2a
Ø 180 mm/7"
8 mm
4 mm
Ø 330 mm/13"
Note
(1) Package of 1000 pieces, code B1, is available only for products with TCR ± 25 ppm/K or ± 15 ppm/K, and with tolerance ± 0.25 % or ± 0.1 %.
Bulk case acc. IEC 60286-6 available on request.
Revision: 09-Dec-15
Document Number: 20004
2
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SMM0204
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Vishay Draloric
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: SMM02040C5620FB000
Part Number: SMM0204VC5620FB000
Part Number: OMM02040000000B000
S
M
M
0
2
0
4
0
C
5
6
2
0
F
B
0
0
0
O
M
M
0
2
0
4
0
0
0
0
0
0
0
B
0
0
0
TYPE / SIZE
VERSION
TCR
RESISTANCE
TOLERANCE
PACKAGING
SMM0204
OMM0204
0 = Neutral
V = EN 140401-803,
version A, nominal
failure rate level E0
E = ± 15 ppm/K
D = ± 25 ppm/K
C = ± 50 ppm/K
B = ± 100 ppm/K
0 = jumper
3 digit value
1 digit multiplier
0000 = Jumper
MULTIPLIER
7 = *10-3 2 = *102
8 = *10-2 3 = *103
9 = *10-1 4 = *104
0 = *100 5 = *105
1 = *101
B = ± 0.1 %
C = ± 0.25 %
D = ± 0.5 %
F=±1%
J=±5%
0 = jumper
B1
B3
B0
Product Description: SMM0204 50 562R 1 % B0
Product Description: SMM0204 50 562R 1 % B0 EN803 E0
Product Description: OMM0204 0R0 B0
SMM0204
50
562R
1%
B0
-
OMM0204
-
0R0
-
B0
-
TYPE / SIZE
TCR
RESISTANCE
TOLERANCE
PACKAGING
VERSION
SMM0204
OMM0204
± 15 ppm/K
± 25 ppm/K
± 50 ppm/K
± 100 ppm/K
100R = 100 Ω
2M21 = 2.21 MΩ
0R0 = jumper
± 0.1 %
± 0.25 %
± 0.5 %
±1%
±5%
B1
B3
B0
Notes
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
• Products according to EN 140401-803 can be ordered by using the related ordering code "SMM0204V...".
Revision: 09-Dec-15
Document Number: 20004
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DESCRIPTION
MATERIALS
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic body (Al2O3) and conditioned to achieve the
desired temperature coefficient. Nickel plated steel
termination caps are firmly pressed on the metallized rods.
A special laser is used to achieve the target value by
smoothly cutting a helical groove in the resistive layer
without damaging the ceramic. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure matte tin on nickel and copper plating for
enhanced temperature cycling stability. Four or five color
code rings designate the resistance value and tolerance in
accordance with IEC 60062 (1).
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual resistors. This includes full screening for the
elimination of products with a potential risk of early field
failures (feasible for R ≥ 10 Ω) according to EN 140401-803,
2.1.2.2. Only accepted products are laid directly into the
blister tape in accordance with IEC 60286-3, Type 2a (1).
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are completely lead (Pb)-free, the pure matte
tin plating provides compatibility with lead (Pb)-free and
lead containing soldering processes. Solderability is
specified for 2 years after production or requalification,
however, excellent solderability is proven after extended
storage in excess of 10 years. The permitted storage time is
20 years. The immunity of the plating against tin whisker
growth has been proven under extensive testing.
APPROVALS
The resistors are qualified according to AEC-Q200.
Resistors approved according to EN 140401-803 are
available by using the related ordering code.
RELATED PRODUCTS
MELF resistors of other sizes are available:
Thin Fim Micro-MELF Resistors SMM0102
(www.vishay.com/doc?20003)
Thin Fim MELF Resistors SMM0207
(www.vishay.com/doc?20005)
Resistors are available with established reliability in
accordance with EN 140401-803 Version E. Please refer to
datasheet “MELF Resistors with Established Reliability”
(www.vishay.com/doc?28707).
MS1 .... ESCC high-reliability thin film MINI-MELF resistors
are the premium choice for design and manufacture of
equipment, where matured technology and proven reliability
are of utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems.
Approval of the MS1 .... ESCC products is granted by the
European Space Components Coordination and registered
in the ESCC Qualified Parts List, REP005.
(www.vishay.com/doc?28790).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
Revision: 09-Dec-15
Document Number: 20004
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SMM0204
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Power Dissipation P
FUNCTIONAL PERFORMANCE
0.5
W
0.4
0.3
0.2
0.1
0
-50
0
50
70
85
100
130
°C
160
Ambient Temparature ϑ amb
Power Dissipation P
Derating - Precision Operation
0.5
W
0.4
0.3
0.2
0.1
0
-50
0
50
70
100
125
°C
160
Ambient Temparature ϑ amb
Power Dissipation P
Derating - Standard Operation
0.5
W
0.4
0.3
0.2
0.1
0
-50
0
50
70
100
°C
155
Ambient Temparature ϑ amb
Derating - Power Operation
Revision: 09-Dec-15
Document Number: 20004
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Current Noise Voltage Ratio
Non-Linearity A3 in dB
FUNCTIONAL PERFORMANCE
120
110
100
90
80
1
µV/V
0.1
70
60
10
0.01
100
1K
10K
100K
1M
100 Ω
10M
1 kΩ
10 kΩ
100 kΩ
Resistance Value in Ω
Current Noise Voltage Ratio
60
SMM0204
40
10 Ω
20
|Z| - R0 in %
Phase Angle γ in °
Non-linearity
1 MΩ
10 MΩ
Resistance Value R
60
SMM0204
40
10 Ω
20
0
39 Ω
100 Ω
0
-20
470 Ω
1 kΩ
-20
39 Ω
100 Ω
470 Ω
1 kΩ
-40
-40
4.7 kΩ
4.7 kΩ
-60
-60
10 kΩ
-80
1
5
10
50
100
-80
500 1000
10 kΩ
1
5
10
50
Frequency f in MHz
Frequency f in MHz
3K
Test Voltage in V
Test Voltage in V
500 1000
HF - Performance
HF - Performance
1K
3K
1K
100
100
10
10R
100
100R
1K
10K
100K
Resistance Value in Ω
Single pulse high voltage overload capability
1.2/50 acc. EN 60115-1, 4.27
Revision: 09-Dec-15
10
10R
100R
1K
10K
100K
Resistance Value in Ω
Single pulse high voltage overload capability
10/700 acc. EN 60115-1, 4.27
Document Number: 20004
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Pulse Load Pmax. in W
FUNCTIONAL PERFORMANCE
1000
100
10
1
0.1
10μ
100μ
1m
10m
100m
1
10
Pulse Duration ti in s
Continuous Pulse Load Pmax.in W
Single Pulse
Maximum pulse load, single pulse; applicable if P 0 and n ≤ 1000 and U ≤ Umax.;
for permissible resistance change equivalent to 8000 h operation in power operation mode
1000
100
10
1
0.1
10μ
100μ
1m
10m
100m
1
10
Pulse Duration ti in s
Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑ amb) and U ≤ Umax.;
for permissible resistance change equivalent to 8000 h operation in power operation mode
Pulse Voltage Umax. in V
Continuous Pulse
1000
800
600
400
200
0
10μ
100μ
1m
10m
100m
1
10
Pulse Duration ti in s
Maximum pulse voltage, single and continuous pulses; applicable if P ≤ Pmax.;
for permissible resistance change equivalent to 8000 h operation in power operation mode
Pulse Voltage
Revision: 09-Dec-15
Document Number: 20004
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-803, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-803. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
IEC
EN
60068-2 (1)
60115-1
TEST
CLAUSE
METHOD
4.8
-
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
PROCEDURE
TEST
SMM0204
Temperature
coefficient
Endurance
at 70 °C:
precision
operation
mode
At (20 / -55 / 20) °C
and (20 / 125 / 20) °C
<1Ω
1 Ω to < 10 Ω
4.25.1
-
Endurance
at 70 °C:
power
operation
mode
4.25.3
4.24
4.37
-
-
Endurance at
upper category
temperature
> 1 MΩ
± 100 ppm/K, ± 50 ppm/K, ± 25 ppm/K, ± 15 ppm/K
U = P 70 x R
≤ Umax.;
1.5 h on; 0.5 h off;
± (0.05 % R
+ 0.005 Ω)
70 °C; 1000 h
-
± (0.1 % R
+ 0.005 Ω)
70 °C; 8000 h
Endurance
at 70 °C:
standard
operation
mode
10 Ω to ≤ 1 MΩ
-
U = P 70 x R
≤ Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (0.15 % R + 0.01 Ω)
± (0.1 % R
+ 0.005 Ω)
± (0.25 % R)
70 °C; 8000 h
± (0.3 % R + 0.01 Ω)
± (0.2 % R
+ 0.005 Ω)
± (0.5 % R)
U = P 70 x R
≤ Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (0.25 % R + 0.01 Ω)
70 °C; 8000 h
± (0.5 % R + 0.01 Ω)
125 °C; 1000 h
± (0.15 % R + 0.01 Ω)
± (0.1 % R
+ 0.005 Ω)
± (0.25 % R)
155 °C; 1000 h
± (0.3 % R + 0.01 Ω)
± (0.2 % R
+ 0.005 Ω)
± (0.5 % R)
Damp heat,
steady state
(40 ± 2) °C;
56 days;
(93 ± 3) % RH
± (0.15 % R + 0.01 Ω)
± (0.25 % R)
67 (Cy)
Damp heat,
steady state,
accelerated
(85 ± 2) °C
(85 ± 5) % RH
U = 0.3 x P 70 x R
≤ 100 V and
U = 0.3 x Umax.;
(the smaller
value is valid)
1000 h
± (0.25 % R + 0.01 Ω)
± (2 % R)
-
Cold
-55 °C; 2000 h
78 (Cab)
Revision: 09-Dec-15
± (0.1 % R + 0.01 Ω)
Document Number: 20004
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TEST PROCEDURES AND REQUIREMENTS
IEC
EN
60068-2 (1)
60115-1
TEST
CLAUSE
METHOD
4.19
14 (Na)
SMM0204
Rapid
change of
temperature
30 min at LCT and
30 min at UCT;
LCT = -55 °C;
UCT = 125 °C;
1000 cycles
LCT = -55 °C;
UCT = 155 °C;
1000 cycles
Short time
overload:
standard
operation
mode
4.13
Short time
overload:
power
operation
mode
Single pulse
high voltage
overload:
standard
operation
mode
4.27
Single pulse
high voltage
overload:
power
peration
mode
Periodic
electric
overload:
standard
operation
mode
4.39
Periodic
electric
overload:
power
operation
mode
4.22
4.38
<1Ω
1 Ω to < 10 Ω
10 Ω to ≤ 1 MΩ
± (0.15 % R + 0.01 Ω)
> 1 MΩ
± (0.25 % R)
± (0.5 % R + 0.01 Ω)
± (0.03 % R + 0.01 Ω)
± (0.1 % R)
± (0.05 % R + 0.01 Ω)
± (0.1 % R)
U = 2.5 x P 70 x R
≤ 2 x Umax.;
5s
± (0.15 % R + 0.01 Ω)
Severity no. 4:
U = 10 x P 70 x R
≤ 2 x Umax.;
10 pulses
10 μs/700 μs
± (0.15 % R + 0.01 Ω)
± (0.15 % R + 0.01 Ω)
U=
15 x P 70 x R
≤ 2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (0.3 % R + 0.01 Ω)
6 (Fc)
Vibration
Endurance
by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude
≤ 1.5 mm or
≤ 200 m/s2;
7.5 h
-
Electrostatic
discharge
(Human Body
Model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
discharges
SMM 0204: 2 kV
Revision: 09-Dec-15
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
PROCEDURE
TEST
± (0.05 % R + 0.01 Ω)
± (0.1 % R)
± (0.5 % R + 0.05 Ω)
Document Number: 20004
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TEST PROCEDURES AND REQUIREMENTS
IEC
EN
60068-2 (1)
60115-1
TEST
CLAUSE
METHOD
4.17
4.18
58 (Td)
58 (Td)
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
PROCEDURE
TEST
SMM0204
Solderability
Resistance to
soldering heat
<1Ω
1 Ω to < 10 Ω
10 Ω to ≤ 1 MΩ
Solder bath method;
SnPb40;
non-activated flux
(215 ± 3) °C;
(3 ± 0.3) s
Good tinning (≥ 95% covered); no visible damage
Solder bath method;
SnAg3Cu0.5
or SnAg3.5;
non-activated flux;
(235 ± 3) °C;
(2 ± 0.2) s
Good tinning (≥ 95% covered); no visible damage
> 1 MΩ
Solder bath method;
(260 ± 5) °C;
(10 ± 1) s
± (0.1 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
Reflow method 2
(IR/forced gas
convection);
(260 ± 5) °C;
(10 ± 1) s
± (0.05 % R + 0.01 Ω)
± (0.02 % R + 0.01 Ω)
45 (XA)
Component
solvent
resistance
Isopropyl alcohol;
50 °C;
method 2
No visible damage
4.30
45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C;
method 1,
toothbrush
Marking visible, no visible damage
4.32
21 (Ue3)
Shear
(adhesion)
45 N
No visible damage
4.33
21 (Ue1)
Substrate
bending
Depth 2 mm,
3 times
No visible damage, no open circuit in bent position
± (0.05 % + 0.005 Ω)
4.7
-
Voltage proof
URMS = Uins; 60 s
No flashover or breakdown
4.35
-
Flammability
IEC 60695-11-5 (1);
needle flame test;
10 s
No burning after 30s
4.29
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
Revision: 09-Dec-15
Document Number: 20004
10
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMM0204
www.vishay.com
Vishay Draloric
DIMENSIONS
L
K
L1
D
D1
DIMENSIONS AND MASS
TYPE / SIZE
SMM0204
OMM0204
L
(mm)
D
(mm)
L1 min.
(mm)
D1
(mm)
K
(mm)
MASS
(mg)
3.6 + 0/- 0.2
1.4 + 0/- 0.1
1.8
D + 0/- 0.15
0.8 ± 0.1
22
Notes
• Color code marking is applied according to IEC 60062 (1) in four bands (E24 series) for 5 % tolerance, or in five bands (E96 or E192 series).
Each color band appears as a single solid line, voids are permissible if at least 2/3 of the band is visible from each radial angle of view. The
last color band for tolerance is approximately 50 % wider than the other bands.
PATTERN STYLES FOR MELF RESISTORS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE / SIZE
SMM0204
OMM0204
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
1.5
1.5
1.8
4.5
1.7
1.2
1.6
4.1
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351.
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
Revision: 09-Dec-15
Document Number: 20004
11
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer

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Revision: 13-Jun-16
1
Document Number: 91000