Diodes DMT8012LPS 80v n-channel enhancement mode mosfet Datasheet

DMT8012LPS
Green
80V N-CHANNEL ENHANCEMENT MODE MOSFET
®
POWERDI
Product Summary
Features
BVDSS
RDS(ON)
80V
17mΩ @ VGS = 10V
21mΩ @ VGS = 4.5V
ID
TC = +25°C
65A
59A
Description and Applications
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
High Conversion Efficiency
Low RDS(ON) – Minimizes On State Losses






Low Input Capacitance
Fast Switching Speed
<1.1mm Package Profile – Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data


ideal for high-efficiency power management applications.






Synchronous Rectifier
Backlighting
Power Management Functions
DC-DC Converters



Case: POWERDI®5060-8
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Finish - Matte Tin Annealed over Copper Leadframe;
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
POWERDI®5060-8
Pin1
Top View
Bottom View
S
D
S
D
S
D
G
D
Top View
Pin Configuration
Internal Schematic
Ordering Information (Note 4)
Part Number
DMT8012LPS-13
Notes:
Case
POWERDI®5060-8
Packaging
2,500 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D
D
D
D
=Manufacturer’s Marking
T8012LS = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 14 = 2014)
WW = Week Code (01 to 53)
T8012LS
YY WW
S
S
S
G
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DMT8012LPS
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DMT8012LPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS = 10V (Note 5)
Continuous Drain Current, VGS = 10V (Note 6)
TA = +25°C
TA = +70°C
TC = +25°C
TC = +70°C
Value
80
±20
9
7.2
ID
A
65
51
80
80
11.6
10.2
A
A
A
mJ
Value
2.1
56
113
1.1
-55 to +150
Units
W
°C/W
W
°C/W
°C
ID
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, L=0.1mH
Avalanche Energy, L=0.1mH
Units
V
V
IS
IDM
IAS
EAS
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics
TA = +25°C
TC = +25°C
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
80
-
-
1
±100
V
μA
nA
VGS = 0V, ID = 1mA
VDS = 64V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
RDS(ON)
3
17
21
1.2
mΩ
VSD
1.3
14
16.5
0.9
V
Static Drain-Source On-Resistance
1
-
VDS = VGS, ID = 250μA
VGS = 10V, ID = 12A
VGS = 4.5V, ID = 6A
VGS = 0V, IS = 20A
Ciss
Coss
Crss
-
1,949
177
10
-
pF
VDS = 40V, VGS = 0V,
f = 1MHz
Gate Resistance
Rg
-
0.7
-
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Qg
Qg
Qgs
Qgd
-
15
34
6
4.5
4.9
3.8
16.5
3.5
30.2
34.6
-
nC
VDS = 40V, ID = 12A
ns
VDD = 40V, VGS = 10V,
ID = 12A, RG = 1.6Ω
ns
nC
IF = 12A, di/dt = 100A/μs
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes:
tD(ON)
tR
tD(OFF)
tF
tRR
Qrr
V
Test Condition
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
POWERDI is a registered trademark of Diodes Incorporated.
DMT8012LPS
Document number: DS37738 Rev. 3 - 2
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DMT8012LPS
30.0
30
25
VGS=6.0V
20.0
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS= 5.0V
VGS=10.0V
25.0
VGS=5.0V
VGS=4.5V
VGS=4.0V
15.0
10.0
20
15
10
5.0
5
-55℃
0.0
0
0
0.5
1
1.5
2
2.5
3
1
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
0.03
0.03
0.02
VGS=4.5V
0.02
0.01
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
25℃
125℃
VGS=3.5V
VGS=10.0V
0.01
0.03
0.025
0.02
0.015
0.00
ID=12A
ID=6A
0.01
0
5
10
15
20
25
30
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
0.03
VGS=10V
150℃
0.025
125℃
0.02
85℃
0.015
25℃
0.01
-55℃
4
6
8
10
12
14
16
18
20
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs Drain Current and
Gate Voltage
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
85℃
150℃
2.5
2.3
2.1
1.9
VGS=10V, ID=20A
1.7
1.5
1.3
1.1
VGS=4.5V, ID=20A
0.9
0.7
0.5
0.005
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs Drain Current and
Temperature
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
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3.5
0.04
VGS(TH), GATE THESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-ESISTANCE (Ω)
DMT8012LPS
0.03
VGS=4.5V, ID=20A
0.02
0.01
VGS=10V, ID=20A
3
ID=1mA
2.5
2
ID=250µA
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
-50
150
-25
0
25
50
75
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Theshold Variation vs Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
30
10000
VGS=0V
CT, JUNCTION CAPACITANCE (pF)
f=1MHz
25
IS, SOURCE CURRENT (A)
100
20
15
10
TA=85℃
TA=150℃
5
TA=25℃
TA=125℃
Ciss
1000
Coss
100
Crss
10
TA=-55℃
0
1
0
0.3
0.6
0.9
1.2
1.5
0
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs Current
5
10
15
25
30
35
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
100
10
RDS(ON)
Limited
9
ID, DRAIN CURRENT (A)
8
7
6
VGS (V)
20
5
4
VDS=40V, ID=12A
3
2
DC
PW =10s
PW =1s
PW =100ms
PW =10ms
PW =1ms
10
PW =100µs
1
TJ(Max)=150℃
TA=25℃
VGS=10V
Single Pulse
DUT on 1*MRP Board
1
0
0.1
0
5
10
15
20
25
30
35
0.1
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
Qg (nC)
Figure 11. Gate Charge
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DMT8012LPS
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DMT8012LPS
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.9
D=0.5
D=0.7
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC (t)=r(t) * RθJC
RθJC=1.05℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
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DMT8012LPS
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Package Outline
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
POWERDI®5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
G
Y(4x)
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
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DMT8012LPS
Document number: DS37738 Rev. 3 - 2
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IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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website, harmless against all damages.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2015, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMT8012LPS
Document number: DS37738 Rev. 3 - 2
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July 2015
© Diodes Incorporated
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