STMicroelectronics DCPL-WB-00C2 Wide-band, dual-path directional coupler with iso port Datasheet

DCPL-WB-00C2
Wide-band, dual-path directional coupler with ISO port
Features
■
wide operating frequency range:
– 824 MHz-2170 MHz
■
low insertion loss (< 0.2 dB)
■
37 dB typical coupling factor
■
high directivity (> 20 dB)
■
high ESD ruggedness
■
lead-free CSP package
■
Flip-Chip package
■
small footprint: 1700 x 1850 µm
■
very low profile (< 670 µm thickness)
Lead-free Flip Chip (8 bumps)
Figure 1.
Pin configuration (bump view)
A3
high RF performance
■
RF module size reduction
A1
LB Path
B3
Benefits
■
A2
B1
CPL
50 Ω nominal input / output impedance
ISO
■
HB Path
C3
C2
C1
Complies with the following standards:
■
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Multi-band equipment such as:
■
power amplifier module
■
front end module
■
GSM/WCDMA mobile phone
Description
The DCPL-WB-00C2 is a wide-band, dual-path
directional coupler designed to measure cell
phone transmission output power in
GSM/WCDMA applications. This dual-path CPL
has been customized for wide-band operating
frequencies (EGSM and CELL, PCS, DCS,
WCDMA band I) with less than 0.2 dB insertion
losses in the transmission bandwidth (824 MHz 1980 MHz).
This device is built with two different RF couplers
(one dedicated to LB, the other dedicated to HB)
sharing the same coupled and isolated ports.The
DCPL-WB-00C2 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance.
The device is delivered 100% tested in tape and
reel.
October 2010
Doc ID 17994 Rev 1
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www.st.com
11
Characteristics
1
DCPL-WB-00C2
Characteristics
Table 1.
Device pin configuration
Bump
Name
A1
Lbin
LB coupler RF input
A2
GND
RF ground
A3
Lbout
LB coupler RF output
B1
CPLD
Coupler port
B3
ISO
Isolated port
C1
Hbin
HB coupler RF input
C2
GND
RF ground
C3
Hbout
HB coupler output
Table 2.
Description
Absolute maximum rating (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
VESD (IEC)
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
LBIN, LBOUT, HBIN, HBOUT, air discharge
LBIN, LBOUT, HBIN, HBOUT, contact discharge
Machine model, JESD22-A115-A, All I/O
VESD (CDM) Charge device model, JESD22-C101-C, All I/O
TOP
Table 3.
Max.
-
36
dBm
±15
±8
-
-
kV
2
-
-
kV
100
-
-
V
500
-
-
V
-30
-
+85
°C
Input Power RFIN (CW mode)
VESD (HBM) Human body model, JESD22-A114-B, All I/O
VESD (MM)
Typ.
Operating temperature
Electrical characteristics - impedances (Tamb = 25 °C)
Value
Symbol
Unit
Min.
Typ.
Max.
Nominal output impedance (LB and HB paths)
-
50
-
Ω
Nominal input impedance (LB and HB paths)
-
50
-
Ω
ZCPL
Nominal coupled port impedance
-
50
-
Ω
ZISO
Nominal isolated port impedance
-
50
-
Ω
ZOUT
ZIN
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Parameter
Doc ID 17994 Rev 1
DCPL-WB-00C2
Characteristics
Table 4.
Electrical characteristics - LB path RF performance (Tamb = 25 °C)
Value
Symbol
TOP
f
Parameter
Test condition
Unit
Min.
Typ.
Max.
Operating temperature
-30
-
+85
°C
Frequency range
(bandwidth)
824
-
960
MHz
ILLB
LB path insertion loss
From 824 MHz
to 960 MHz
-
0.1
0.2
dB
RLLB
LB path return loss
From 824 MHz
to 960 MHz
15
-
-
dB
CPLDLB LB coupling factor
From 824 MHz
to 915 MHz
32
-
37
dB
RippleLB Coupling ripple in LB
(824 to 849 MHz)
(880 to 915 MHz)
-
-
0.5
dB
22
-
-
dB
DIRLB
Table 5.
From 824 MHz
to 915 MHz
LB coupler directivity
Electrical characteristics - HB path RF performance (Tamb = 25 °C)
Value
Symbol
TOP
f
Parameter
Test condition
Operating temperature
Frequency range
(bandwidth)
Unit
Min.
Typ.
Max.
-30
-
+85
°C
1710
-
1980
MHz
ILHB
HB path insertion loss
From 1710 MHz
to 2170 MHz
-
0.1
0.2
dB
RLHB
HB path return loss
From 1710 MHz
to 2170 MHz
15
-
-
dB
CPLDHB HB coupling factor
From 1710 MHz
to 1980 MHz
29
-
34
dB
RippleHB Coupling ripple in HB
(1710 to 1785 MHz)
(1850 to 1910 MHz)
(1920 to 1980 MHz)
-
-
0.5
dB
22
-
-
dB
DIRHB
HB coupler directivity
From 1710 MHz
to 1980 MHz
Doc ID 17994 Rev 1
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Characteristics
1.1
DCPL-WB-00C2
RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω, de-embedding at
DCPL-WB-00D3 bumps.
Figure 2.
Low band path insertion loss
IL - LB (dB)
0.00
-0.05
-0.10
-0.15
F (MHz)
-0.20
800
Figure 3.
820
840
860
880
900
920
940
960
980 1000
High band path insertion loss
IL - HB (dB)
0.00
-0.05
-0.10
-0.15
F (MHz)
-0.20
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
Figure 4.
Low band path coupling factor
-30
CPLD - LB (dB)
-31
-32
-33
-34
-35
-36
-37
-38
-39
F (MHz)
-40
800
4/11
820
840
860
880
900
Doc ID 17994 Rev 1
920
940
960
980 1000
DCPL-WB-00C2
Figure 5.
Characteristics
High band path coupling factor
-28
CPLD - HB (dB)
-29
-30
-31
-32
-33
-34
-35
-36
-37
F (MHz)
-38
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
Figure 6.
Low band path directivity
DIR - LB (dB)
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
F (MHz)
800
Figure 7.
820
840
860
880
900
920
940
960
980
1000
High band path directivity
DIR - LB (dB)
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
F (MHz)
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
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Characteristics
Figure 8.
DCPL-WB-00C2
Demo board description - layer 1
Copper pad diameter:
275 µm
Figure 9.
Solder mask 1 + layer 1
Solder mask diameter:
375 µm
6/11
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DCPL-WB-00C2
2
Ordering information scheme
Ordering information scheme
Figure 10. Ordering information scheme
DCPL
–
WB
–
00
–
C2
Dual high directivity coupler
Wide band
Version
Package
C2 = Coated Flip Chip, bump size = 315 µm
Doc ID 17994 Rev 1
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Package information
3
DCPL-WB-00C2
Package information
●
Epoxy meets UL94, V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
315 µm dia.
A1
B1
685 µm
B3
C3
C2
1.85 mm
A2
685 µm
A3
670 µm
C1
600µm
600µm
1.7 mm
Figure 12. Footprint
Figure 13. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year ww = week)
Copper pad diameter :
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
8/11
Doc ID 17994 Rev 1
x x z
y ww
DCPL-WB-00C2
Package information
Figure 14. Flip-Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
4.0
8.0
3.5
1.95
1.75
0.22
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
1.80
4.0
0.73
All dimensions are typical values in mm
Note:
User direction of unreeling
More packing information is available in the application notes:
AN1235: "Flip-Chip: Package description and recommendations for use"
AN1751: "EMI Filters: Recommendations and measurements”
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Ordering information
4
Ordering information
Table 6.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
DCPL-WB-00C2
RN
Flip Chip
3.65 mg
5000
Tape and reel
Revision history
Table 7.
10/11
DCPL-WB-00C2
Document revision history
Date
Revision
07-Oct-2010
1
Changes
Initial release.
Doc ID 17994 Rev 1
DCPL-WB-00C2
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