DCPL-WB-00C2 Wide-band, dual-path directional coupler with ISO port Features ■ wide operating frequency range: – 824 MHz-2170 MHz ■ low insertion loss (< 0.2 dB) ■ 37 dB typical coupling factor ■ high directivity (> 20 dB) ■ high ESD ruggedness ■ lead-free CSP package ■ Flip-Chip package ■ small footprint: 1700 x 1850 µm ■ very low profile (< 670 µm thickness) Lead-free Flip Chip (8 bumps) Figure 1. Pin configuration (bump view) A3 high RF performance ■ RF module size reduction A1 LB Path B3 Benefits ■ A2 B1 CPL 50 Ω nominal input / output impedance ISO ■ HB Path C3 C2 C1 Complies with the following standards: ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Applications Multi-band equipment such as: ■ power amplifier module ■ front end module ■ GSM/WCDMA mobile phone Description The DCPL-WB-00C2 is a wide-band, dual-path directional coupler designed to measure cell phone transmission output power in GSM/WCDMA applications. This dual-path CPL has been customized for wide-band operating frequencies (EGSM and CELL, PCS, DCS, WCDMA band I) with less than 0.2 dB insertion losses in the transmission bandwidth (824 MHz 1980 MHz). This device is built with two different RF couplers (one dedicated to LB, the other dedicated to HB) sharing the same coupled and isolated ports.The DCPL-WB-00C2 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. October 2010 Doc ID 17994 Rev 1 1/11 www.st.com 11 Characteristics 1 DCPL-WB-00C2 Characteristics Table 1. Device pin configuration Bump Name A1 Lbin LB coupler RF input A2 GND RF ground A3 Lbout LB coupler RF output B1 CPLD Coupler port B3 ISO Isolated port C1 Hbin HB coupler RF input C2 GND RF ground C3 Hbout HB coupler output Table 2. Description Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN VESD (IEC) ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω) LBIN, LBOUT, HBIN, HBOUT, air discharge LBIN, LBOUT, HBIN, HBOUT, contact discharge Machine model, JESD22-A115-A, All I/O VESD (CDM) Charge device model, JESD22-C101-C, All I/O TOP Table 3. Max. - 36 dBm ±15 ±8 - - kV 2 - - kV 100 - - V 500 - - V -30 - +85 °C Input Power RFIN (CW mode) VESD (HBM) Human body model, JESD22-A114-B, All I/O VESD (MM) Typ. Operating temperature Electrical characteristics - impedances (Tamb = 25 °C) Value Symbol Unit Min. Typ. Max. Nominal output impedance (LB and HB paths) - 50 - Ω Nominal input impedance (LB and HB paths) - 50 - Ω ZCPL Nominal coupled port impedance - 50 - Ω ZISO Nominal isolated port impedance - 50 - Ω ZOUT ZIN 2/11 Parameter Doc ID 17994 Rev 1 DCPL-WB-00C2 Characteristics Table 4. Electrical characteristics - LB path RF performance (Tamb = 25 °C) Value Symbol TOP f Parameter Test condition Unit Min. Typ. Max. Operating temperature -30 - +85 °C Frequency range (bandwidth) 824 - 960 MHz ILLB LB path insertion loss From 824 MHz to 960 MHz - 0.1 0.2 dB RLLB LB path return loss From 824 MHz to 960 MHz 15 - - dB CPLDLB LB coupling factor From 824 MHz to 915 MHz 32 - 37 dB RippleLB Coupling ripple in LB (824 to 849 MHz) (880 to 915 MHz) - - 0.5 dB 22 - - dB DIRLB Table 5. From 824 MHz to 915 MHz LB coupler directivity Electrical characteristics - HB path RF performance (Tamb = 25 °C) Value Symbol TOP f Parameter Test condition Operating temperature Frequency range (bandwidth) Unit Min. Typ. Max. -30 - +85 °C 1710 - 1980 MHz ILHB HB path insertion loss From 1710 MHz to 2170 MHz - 0.1 0.2 dB RLHB HB path return loss From 1710 MHz to 2170 MHz 15 - - dB CPLDHB HB coupling factor From 1710 MHz to 1980 MHz 29 - 34 dB RippleHB Coupling ripple in HB (1710 to 1785 MHz) (1850 to 1910 MHz) (1920 to 1980 MHz) - - 0.5 dB 22 - - dB DIRHB HB coupler directivity From 1710 MHz to 1980 MHz Doc ID 17994 Rev 1 3/11 Characteristics 1.1 DCPL-WB-00C2 RF measurement (on reference evaluation board) Measurements done on reference evaluation board under 50 Ω, de-embedding at DCPL-WB-00D3 bumps. Figure 2. Low band path insertion loss IL - LB (dB) 0.00 -0.05 -0.10 -0.15 F (MHz) -0.20 800 Figure 3. 820 840 860 880 900 920 940 960 980 1000 High band path insertion loss IL - HB (dB) 0.00 -0.05 -0.10 -0.15 F (MHz) -0.20 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 Figure 4. Low band path coupling factor -30 CPLD - LB (dB) -31 -32 -33 -34 -35 -36 -37 -38 -39 F (MHz) -40 800 4/11 820 840 860 880 900 Doc ID 17994 Rev 1 920 940 960 980 1000 DCPL-WB-00C2 Figure 5. Characteristics High band path coupling factor -28 CPLD - HB (dB) -29 -30 -31 -32 -33 -34 -35 -36 -37 F (MHz) -38 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 Figure 6. Low band path directivity DIR - LB (dB) 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 F (MHz) 800 Figure 7. 820 840 860 880 900 920 940 960 980 1000 High band path directivity DIR - LB (dB) 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 F (MHz) 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 Doc ID 17994 Rev 1 5/11 Characteristics Figure 8. DCPL-WB-00C2 Demo board description - layer 1 Copper pad diameter: 275 µm Figure 9. Solder mask 1 + layer 1 Solder mask diameter: 375 µm 6/11 Doc ID 17994 Rev 1 DCPL-WB-00C2 2 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme DCPL – WB – 00 – C2 Dual high directivity coupler Wide band Version Package C2 = Coated Flip Chip, bump size = 315 µm Doc ID 17994 Rev 1 7/11 Package information 3 DCPL-WB-00C2 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package dimensions 315 µm dia. A1 B1 685 µm B3 C3 C2 1.85 mm A2 685 µm A3 670 µm C1 600µm 600µm 1.7 mm Figure 12. Footprint Figure 13. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad diameter : 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter 8/11 Doc ID 17994 Rev 1 x x z y ww DCPL-WB-00C2 Package information Figure 14. Flip-Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.95 1.75 0.22 ST ST ST xxz yww xxz yww xxz yww 1.80 4.0 0.73 All dimensions are typical values in mm Note: User direction of unreeling More packing information is available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements” Doc ID 17994 Rev 1 9/11 Ordering information 4 Ordering information Table 6. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode DCPL-WB-00C2 RN Flip Chip 3.65 mg 5000 Tape and reel Revision history Table 7. 10/11 DCPL-WB-00C2 Document revision history Date Revision 07-Oct-2010 1 Changes Initial release. Doc ID 17994 Rev 1 DCPL-WB-00C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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